Infrared detector chipset film coating clamp and film coating method
The coating fixture, consisting of a base and a cover plate, utilizes vacuuming and gravity positioning to solve the problem of low efficiency in existing coating fixtures, achieving high-efficiency infrared detector chip coating, which is suitable for mass production.
CN121759908APending Publication Date: 2026-03-31KUNMING INST OF PHYSICS
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Patent Information
- Application Number
- CN202511875284.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-12
- Publication Date
- 2026-03-31
AI Technical Summary
Technical Problem
Existing infrared detector chip coating fixtures are inefficient in mass production, and the screw fixing method is not suitable, resulting in low processing efficiency.
Method used
The coating fixture, consisting of a base and a cover plate, fixes the chip by vacuuming and uses gravity to achieve screwless positioning. Combined with the diagonally arranged groove structure, it enables precise positioning and placement.
Benefits of technology
It improves coating efficiency, is suitable for mass industrial production, simplifies operation, and improves the quality and efficiency of chip surface coating.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention discloses an infrared detector chipset film coating clamp and a film coating method, the clamp comprises a base and cover plates, the base is provided with a plurality of fixing assemblies, each fixing assembly is provided with one cover plate, each fixing assembly comprises a first groove and a second groove, the first groove is used for placing a chipset, and the second groove is used for placing the chipset. The second grooves are symmetrically arranged at the two ends of the diagonal line of the first groove, and the second grooves and the first groove are partially overlapped, so that the two ends of the diagonal line of the chipset extend into the second grooves. The vacuum pumping mode is adopted to enable the interior of the coating cavity to be in a negative pressure state, then the chip is fixed to the clamp, screw positioning and other operations are not needed, the process efficiency is remarkably improved, and cost reduction is facilitated.
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