Preparation method of controllable thickness bismuth strontium calcium copper oxide high-temperature superconducting single crystal microwire
By employing in-situ gold evaporation, ion beam etching, and flip-over transfer techniques, the problems of uncontrollable thickness and structural fragility of BSCCO microwires were solved, enabling the fabrication of high-quality bismuth-strontium-calcium-copper-oxygen high-temperature superconducting single-crystal microwires, thereby improving the superconducting performance and reliability of the devices.
CN121941271BActive Publication Date: 2026-06-09NANJING UNIV
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Patent Information
- Application Number
- CN202610387167.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2026-03-27
- Publication Date
- 2026-06-09
- Estimated Expiration
- 2046-03-27
AI Technical Summary
Technical Problem
In existing BSCCO microwire fabrication technology, the thickness is uncontrollable, the structure is fragile and easily broken, and the electrode contact interface is damaged, leading to device performance degradation.
Method used
By employing in-situ gold evaporation, ion beam etching, and flip-over transfer techniques, and through Scotch tape cleavage, photolithography, wet etching, and ion beam etching, combined with epoxy adhesive support, controllable thickness and stable structure of micrometer lines can be achieved.
Benefits of technology
Precise control of micron-level wire thickness was achieved, structural stability was improved, ohmic contacts were optimized, and the superconducting performance and reliability of the device were enhanced.
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Abstract
The application discloses a preparation method of a controllable-thickness BiSrCaCuO high-temperature superconducting single-crystal microwire, and belongs to the technical field of superconducting micro-nano electronic device preparation. The application obtains a fresh surface by cleaving a BSCCO single crystal through a Scotch tape under a high-vacuum environment and evaporates a gold film in situ, and after gold electrodes are prepared through photolithography and wet etching, secondary photolithography and argon ion beam etching are combined to define a line channel with a width of micrometer level to a preset depth; then, the sample is bonded and solidified with a second substrate through an Epoxy glue, and the substrate is separated to realize a turn-over transfer, and finally, residual bulk BSCCO single crystals are cleaved and removed to obtain a finished product. The application combines in-situ gold electrode technology, dry and wet etching technology and turn-over transfer and cleaving technology, realizes a good ohmic contact, and is precise in microwire thickness control, stable and repeatable in process, and provides a new way for the preparation of high-performance high-temperature superconducting devices.
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