Backplane expansion module for an expansion card and server

Abstract

The application discloses a backboard expansion module and a server for expansion cards, the backboard expansion module comprising a first backboard and a plurality of second backboards, a first golden finger of the first backboard being used for plug-in cooperation with a mainboard of the server; each second backboard has a connector and a third golden finger; the first backboard is plug-in cooperated with an expansion card, and each second backboard is used for plug-in cooperation with one expansion card in the remaining expansion cards; the connector of the second backboard adjacent to the first backboard is plug-in cooperated with a second golden finger, and in the direction away from the first backboard, two adjacent second backboards are sequentially connected through the connectors and the third golden fingers on the corresponding sides. The application at least solves the problem in the prior art that only a small number of PCIe cards are needed in actual use, all the connectors and the corresponding circuits still need to be installed, resulting in waste of unused resources and unnecessary cost increase.

Description

Technical Field

[0001] This application relates to the field of computer hardware technology, and in particular to a backplane expansion module and server for expansion cards. Background Technology

[0002] Current PCIe (Peripheral Component Interconnect Express) expansion technology is often designed to meet the maximum configuration requirements of servers. This means that even if only a small number of PCIe cards are needed in actual use, all connectors and corresponding circuits still need to be installed, resulting in the waste of unused resources and increased unnecessary costs. Summary of the Invention

[0003] This application provides a backplane expansion module and server for expansion cards, which at least solves the problem in related technologies where only a small number of PCIe cards are needed in actual use, but all connectors and corresponding circuits still need to be installed, resulting in the waste of unused resources and increased unnecessary costs.

[0004] This application provides a backplane expansion module for expansion cards, including a first backplane and a plurality of second backplanes. The first backplane has a first gold finger and a second gold finger, the first gold finger being used to connect and cooperate with the motherboard of a server. Each second backplane has a connector and a third gold finger. The first backplane is used to connect and cooperate with one expansion card, and each second backplane is used to connect and cooperate with one of the remaining expansion cards. The number of second backplanes is equal to the number of the remaining expansion cards. The connector of the second backplane adjacent to the first backplane is connected and cooperates with the second gold finger. In the direction away from the first backplane, two adjacent second backplanes are connected sequentially through the connector and the third gold finger on the corresponding side.

[0005] In an exemplary embodiment, the first backplate includes a first backplate body, one end of the first backplate body in the length direction has a first gold finger and a second gold finger, and the first gold finger and the second gold finger are respectively located on a first side and a second side in the width direction of the first backplate body; wherein, the first gold finger is disposed protruding from the first side surface in the width direction of the first backplate body, and the second gold finger is flush with the second side surface in the width direction of the first backplate body.

[0006] In an exemplary embodiment, the first side surface of the first backplate body in the thickness direction has a first insertion groove structure, which is used to insert and cooperate with the insertion end of the corresponding expansion card.

[0007] In one exemplary embodiment, the second side surface of the first backplate body in the thickness direction has a first bonding area for soldering with a cable to transmit at least a high-speed signal to the corresponding expansion card.

[0008] In an exemplary embodiment, the second backplate includes a second backplate body, one end of which has a connector and a third gold finger, and the connector and the third gold finger are respectively located on a first side and a second side in the width direction of the second backplate body; wherein, the connector protrudes from the first side surface in the width direction of the first backplate body, and the third gold finger is flush with the second side surface in the width direction of the first backplate body.

[0009] In an exemplary embodiment, the first side surface of the second backplate body in the thickness direction has a second insertion groove structure, which is used to engage with the insertion end of the corresponding expansion card.

[0010] In one exemplary embodiment, the second side surface of the second backplate body in the thickness direction has a second bonding area for soldering with a cable to transmit at least a high-speed signal to the corresponding expansion card.

[0011] In an exemplary embodiment, the backplate expansion module further includes an expansion card bracket with a receiving groove. The groove wall is provided with a plurality of clearance holes in a vertical direction from bottom to top. The receiving groove is used to receive at least two expansion cards, and each clearance hole is used to avoid the insertion end of the corresponding expansion card. The first backplate and the second backplate are both disposed on the surface of the expansion card bracket on the side with the clearance holes, and the first backplate is located at the bottom. The plurality of second backplates are arranged in a direction away from the first backplate.

[0012] In one exemplary embodiment, the first backplate is detachably connected to the expansion card holder; and / or, the second backplate is detachably connected to the expansion card holder.

[0013] This application also provides a server, including a backplane expansion module, which is the backplane expansion module described above.

[0014] This application provides a backplane expansion module for expansion cards, including a first backplane and multiple second backplanes. The first backplane has a first gold finger and a second gold finger, the first gold finger being used to connect and cooperate with the motherboard of a server. Each second backplane has a connector and a third gold finger. The first backplane is used to connect and cooperate with one expansion card, and each second backplane is used to connect and cooperate with one of the remaining expansion cards. The number of second backplanes is equal to the number of the remaining expansion cards. The connector of the second backplane adjacent to the first backplane is connected and cooperates with the second gold finger. In the direction away from the first backplane, two adjacent second backplanes are sequentially connected through the connector and the third gold finger on the corresponding side.

[0015] By designing the backplane expansion module to include at least a first backplane and multiple second backplanes, the first gold finger of the first backplane is used to connect with the server motherboard, ensuring direct input of high-speed signals and reducing signal attenuation caused by multi-stage transmission, thus improving signal quality. The second gold finger is used to connect with the connector of the first second backplane. This design allows for flexible expansion by increasing the number of second backplanes, supporting different numbers of expansion cards as needed, greatly enhancing the server's expandability and flexibility. Simultaneously, the connection between second backplanes is achieved through a third gold finger and a connector, further simplifying low-speed signal and power supply connections between multiple backplanes and reducing costs. This connection method using the third gold finger and connector, and the connection between the connector and the second gold finger, not only reduces design and assembly complexity but also ensures stable power signal transmission, effectively solving the problem of high-speed PCIe signal transmission. Furthermore, the separate design of the first and second backplanes achieves cost savings and enhanced expandability, improving market competitiveness. Attached Figure Description

[0016] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of a backplane expansion module provided in an embodiment of this application;

[0018] Figure 2 for Figure 1 Exploded view of the backplane expansion module in the middle;

[0019] Figure 3This is a schematic diagram of the structure of the first backplate and multiple second backplates plugged into each other according to an embodiment of this application. The diagram shows a schematic diagram of one side of the first bonding wire area and the second bonding wire area.

[0020] Figure 4 This is a schematic diagram of the structure of the first backplate and multiple second backplates before they are plugged in and mated, as provided in the embodiments of this application. The diagram shows a schematic diagram of one side of the first plug-in groove structure and the second plug-in groove structure.

[0021] Figure 5 for Figure 4 A schematic diagram of the structure of the first backplate on one side of the first bonding wire area;

[0022] Figure 6 for Figure 4 A schematic diagram of the structure of the first backplate on one side of the first insertion slot structure;

[0023] Figure 7 for Figure 4 A schematic diagram of the structure of the second backplate on one side of the second bonding wire area;

[0024] Figure 8 for Figure 4 A schematic diagram of the structure of the second backplate on one side of the second bonding wire area.

[0025] The above figures include the following reference numerals:

[0026] 1. Expansion card;

[0027] 10. First backplate; 11. First gold finger; 12. Second gold finger; 13. First backplate body; 131. First insertion slot structure; 132. First soldering area; 133. First mounting hole;

[0028] 20. Second backplate; 21. Connector; 22. Third gold finger; 23. Second backplate body; 231. Second insertion slot structure; 232. Second soldering area; 233. Second mounting hole;

[0029] 30. Expansion card bracket; 31. Clearance hole; 32. Mounting stud;

[0030] 40. Fasteners. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0032] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0034] The embodiments of this application provide a backplane expansion module and server for expansion cards. The device is described in detail in conjunction with the structure and working principle of the backplane expansion module and server for expansion cards (the technical terms involved must be explained).

[0035] like Figures 1 to 8As shown, the backplane expansion module for expansion cards includes a first backplane 10 and multiple second backplanes 20. The first backplane 10 has a first gold finger 11 and a second gold finger 12. The first gold finger 11 is used to connect and cooperate with the motherboard of the server. Each second backplane 20 has a connector 21 and a third gold finger 22. The first backplane 10 is used to connect and cooperate with one expansion card 1, and each second backplane 20 is used to connect and cooperate with one of the remaining expansion cards 1. The number of second backplanes 20 is equal to the number of the remaining expansion cards 1. The connector 21 of the second backplane 20 adjacent to the first backplane 10 is connected and cooperates with the second gold finger 12. In the direction away from the first backplane 10, two adjacent second backplanes 20 are connected sequentially through the connector 21 and the third gold finger 22 on the corresponding side.

[0036] By applying the technical solution of this application, the backplane expansion module is designed to include at least a first backplane 10 and multiple second backplanes 20. The first gold finger 11 of the first backplane 10 is used to connect and cooperate with the server motherboard, ensuring direct input of high-speed signals, thereby reducing signal attenuation caused by multi-stage transmission and improving signal quality. The second gold finger 12 is used to connect and cooperate with the connector 21 of the first second backplane 20. This design allows for flexible expansion by increasing the number of second backplanes 20, supporting different numbers of expansion cards 1 according to actual needs, greatly enhancing the scalability and flexibility of the server. At the same time, the connector 21 of the second second backplane 20 connects and cooperates with the third gold finger 22 of the first second backplane 20, and so on, with each subsequent second backplane 20 connecting and cooperating with the previous second backplane 20. The connection between the second backplanes 20 is achieved through the third gold finger 22 and the connector 21, further simplifying the low-speed signal and power supply connections between multiple backplanes and reducing costs. This method of using the third gold finger 22 to cooperate with the connector 21, and the connector 21 to cooperate with the second gold finger 12, not only reduces the complexity of design and assembly, but also ensures the stable transmission of power supply signals, thereby effectively solving the problem of high-speed PCIe signal transmission. At the same time, the separate design of the first backplane 10 and the second backplane 20 achieves cost savings and enhanced expansion capabilities, thereby improving market competitiveness.

[0037] It should be noted that, in this application, the aforementioned expansion card refers to a PCIe expansion card.

[0038] like Figure 2 and Figure 3As shown, the first backplate 10 is connected to the expansion card bracket 30 through two first mounting holes 133 thereon, and the fastener 40 passes through the first mounting holes 133 and is connected to the mounting stud 32. The second backplate 20 is connected to the expansion card bracket 30 through two second mounting holes 233 thereon. Here, the fastener 40 also passes through the second mounting holes 233 and is connected to the corresponding mounting stud 32.

[0039] like Figure 5 and Figure 6 As shown, the first backplate 10 includes a first backplate body 13. One end of the first backplate body 13 along its length has a first gold finger 11 and a second gold finger 12, located on a first side and a second side along the width direction of the first backplate body 13, respectively. The first gold finger 11 protrudes from the first side surface along the width direction of the first backplate body 13, while the second gold finger 12 is flush with the second side surface along the width direction. This unique structural design of the first backplate 10, with its first gold finger 11 and second gold finger 12 along its length, protruding from the first side surface along the width direction, and the second gold finger 12 flush with the second side surface along the width direction, not only optimizes signal transmission and power supply between the first backplate 10 and the motherboard and other sub-backplates, but also achieves more rational space utilization and electrical connection strategies by distributing the gold fingers. The tight contact between the first gold finger 11 and the motherboard ensures stable data exchange and power transmission, while the flush design of the second gold finger 12 facilitates precise interlocking and stable connection between multiple sub-backplanes, reducing signal distortion and connection instability caused by mechanical tolerances. This technical solution provides a hardware foundation for flexible PCIe card expansion, reduces signal attenuation caused by multi-stage signal transmission, and improves system scalability and signal quality. In different application scenarios, users can adjust the carrying capacity of the PCIe card by increasing the number of sub-backplanes according to actual needs, without the need for large-scale redesign or replacement of the main backplane, greatly enhancing the system's adaptability and cost-effectiveness. In subsequent embodiments, the first backplane 10 can also be fine-tuned in size and shape of the first gold finger 11 and the second gold finger 12 to adapt to a wider range of standards and interface types, further expanding the application scope and compatibility of the technology.

[0040] like Figure 6As shown, the first side surface of the first backplane body 13 in the thickness direction has a first insertion slot structure 131, which is used to insert and mate with the corresponding expansion card 1's insertion end. This design, with the first insertion slot structure 131 on the first side surface of the first backplane body 13 in the thickness direction, aims to achieve precise mating with the insertion end of the expansion card 1. Through the first insertion slot structure 131, the expansion card 1 can be securely mounted on the first backplane body 13, ensuring stable transmission of high-speed signals. The contact surface design between the first insertion slot structure 131 and the insertion end of the expansion card 1 optimizes the reliability of the electrical connection and the effect of mechanical fixation, avoiding signal interference or transmission efficiency reduction due to poor insertion. This precise mating method not only simplifies the assembly process of the PCIe backplane and the expansion card 1 but also improves the overall system performance and stability. In other embodiments not shown, the shape and size of the first insertion slot structure 131 can be adjusted according to the needs of different expansion cards 1 to accommodate more types of expansion cards 1, enhancing the compatibility and expandability of the backplane system.

[0041] like Figure 7 As shown, the second side surface of the first backplane body 13 in the thickness direction has a first bonding area 132, which is used for soldering with cables to transmit at least high-speed signals to the corresponding expansion card 1. Thus, the second side surface of the first backplane body 13 in the thickness direction has a first bonding area 132 for soldering with cables to directly transmit high-speed signals to the corresponding expansion card 1. This design ensures the directness and efficiency of signal transmission, effectively reducing high-speed signal attenuation and improving signal quality by reducing the signal path. Simultaneously, the direct soldering of cables reduces reliance on signal transmission from connecting components such as gold fingers, thereby reducing the risk of signal interference and enhancing the stability and reliability of the entire PCIe backplane system. Furthermore, this design simplifies the connection between the sub-backplane and the main backplane. The gold fingers are mainly responsible for low-speed control signals and power supply, and have relatively low requirements for processing accuracy and connection reliability, which helps to ensure the feasibility and flexibility of multi-level interconnection schemes while controlling system-level material costs. In other embodiments not shown, the design of the bonding wire area can be adjusted according to actual signal transmission requirements to accommodate the number and speed of different PCIe cards, further enhancing the adaptability and market competitiveness of the backplane expansion solution.

[0042] like Figure 7 and Figure 8As shown, the second backplane 20 includes a second backplane body 23. One end of the second backplane body 23 in the longitudinal direction has a connector 21 and a third gold finger 22, with the connector 21 and the third gold finger 22 located on a first side and a second side in the width direction, respectively. The connector 21 protrudes from the first side surface of the first backplane body 23 in the width direction, while the third gold finger 22 is flush with the second side surface of the first backplane body 23 in the width direction. Thus, the second backplane body 23 is designed to have a connector 21 and a third gold finger 22 at one end in the longitudinal direction, located on opposite sides in the width direction. Specifically, the connector 21 protrudes from the first side surface of the second backplane body 23 in the width direction, while the third gold finger 22 remains flush with the second side surface of the second backplane body 23 in the width direction. This arrangement allows for spatial optimization of the connector 21 and the third gold finger 22, facilitating efficient docking with the first backplane or other second backplanes, and enabling flexible interconnection between the sub-PCIe backplane and the main backplane or similar sub-backplanes. This design not only supports the expansion of the number of PCIe cards but also ensures the stability of signal transmission and the continuity of power supply, thereby enhancing the adaptability and reliability of the entire PCIe expansion system. Furthermore, the relative positioning of connector 21 and the third gold finger 22 helps simplify the assembly process and improve production efficiency. In other embodiments not explicitly shown, similar structural innovations may further enhance the system's scalability and signal processing efficiency, ensuring optimal performance under different configuration requirements.

[0043] like Figure 8As shown, the first side surface of the second backplane body 23 in the thickness direction has a second insertion slot structure 231, which is used to insert and cooperate with the insertion end of the corresponding expansion card 1. Thus, the second insertion slot structure 231 on the first side surface of the second backplane body 23 in the thickness direction is designed to achieve a precise insertion and cooperation with the insertion end of the expansion card 1. Through the design of the second insertion slot structure 231, not only is a stable connection between the expansion card 1 and the second backplane body 23 achieved, but the accuracy and reliability of signal transmission are also ensured. This technical solution allows the insertion end of the expansion card 1 to be accurately aligned with the second insertion slot structure 231 when inserted, avoiding signal interference or unstable transmission caused by inaccurate insertion. At the same time, the design of the second insertion slot structure 231 takes into account the diverse needs of the expansion card 1, and can adapt to the insertion of expansion cards of different sizes and types, improving the system's compatibility and flexibility. In practical applications, through precise insertion and cooperation, the system can support a larger number of PCIe cards, optimize resource utilization, reduce costs, and enhance market competitiveness. Of course, in other embodiments not shown, the second insertion slot structure 231 can also be adjusted according to actual needs, for example, by changing the depth or width of the slot structure to support a wider range of PCIe card specifications, thereby further expanding the system's functionality and application scope.

[0044] like Figure 7 As shown, the second side surface of the second backplate body 23 in the thickness direction has a second bonding area 232. The second bonding area 232 is used for soldering with cables to transmit high-speed signals to the corresponding expansion card 1. Thus, the second side surface of the second backplate body 23 in the thickness direction has a second bonding area 232. The second bonding area 232 is used to achieve soldering with cables, and its main function is to transmit high-speed signals to the expansion card 1. This design ensures a direct signal transmission path, reduces signal attenuation and potential interference, thereby improving signal integrity. Furthermore, through direct soldering, the second bonding area 232 can effectively support high-speed data transmission requirements, providing a stable high-speed signal source for the expansion card 1. This modular bonding area design not only simplifies the assembly process during production but also enhances the scalability and flexibility of the system, allowing users to adjust the number of PCIe cards according to actual needs without affecting signal quality. In other embodiments not shown, the second bonding area 232 may have different layouts or forms, but its core function remains to optimize the transmission efficiency and quality of high-speed signals.

[0045] like Figure 1 and Figure 2As shown, the backplate expansion module also includes an expansion card holder 30. The expansion card holder 30 has a receiving groove, and the groove wall has a plurality of clearance holes 31 sequentially formed from bottom to top in the vertical direction. The receiving groove is used to accommodate at least two expansion cards 1, and each clearance hole 31 is used to avoid the insertion end of the corresponding expansion card 1. The first backplate 10 and the second backplate 20 are both disposed on the surface of the expansion card holder 30 on the side with the clearance holes 31, and the first backplate 10 is located at the bottom. The plurality of second backplates 20 are sequentially spaced apart in a direction away from the first backplate 10. In this way, the backplate expansion module integrates the expansion card holder 30, which has a receiving groove and a plurality of clearance holes 31 on the groove wall. These holes are distributed in the vertical direction to accommodate at least two expansion cards 1 and ensure that the insertion end of each expansion card is not obstructed. A first backplate 10 and multiple second backplates 20 are positioned on one side of the expansion card holder 30, following a specific layout: the first backplate 10 is at the bottom, while the multiple second backplates 20 are arranged sequentially at intervals away from the first backplate. This design aims to optimize space utilization and connection efficiency between the backplates and the expansion cards. By rationally arranging the backplates and holder, the installation process of the expansion cards is simplified, and efficient signal transmission is achieved. Precise alignment between each backplate and the expansion card, thanks to the structural support of the holder, ensures the stability of the signal connection and the quality of data transmission. Furthermore, this modular expansion method allows for flexible adjustment of the number of expansion cards according to system requirements, improving the adaptability and cost-effectiveness of the equipment.

[0046] It should be noted that in this application, the first backplate 10 is detachably connected to the expansion card holder 30; and / or, the second backplate 20 is detachably connected to the expansion card holder 30. This ensures the ease of installation and removal of the first backplate 10, and / or the ease of installation and removal of the second backplate 20.

[0047] It should be noted that this application also provides a server, which includes a backplane expansion module, which is the backplane expansion module described above and below. Thus, the server is equipped with the aforementioned backplane expansion module. Thanks to the innovative design of this backplane expansion module, the server can flexibly adapt to the installation requirements of different numbers of PCIe cards without sacrificing signal quality and bandwidth, significantly enhancing the server's scalability and customization options. The direct connection between the first backplane 10 and the server motherboard ensures the stability and efficiency of high-speed signal transmission; while the presence of multiple second backplanes 20 allows the server to dynamically adjust according to the actual PCIe card configuration, handling both small-scale deployments with a single PCIe card and easily expanding to high-performance environments with multiple cards, greatly improving the server's configuration flexibility and resource utilization. Simultaneously, by simplifying signal transmission between the gold fingers, system complexity and potential failure rates are reduced, thereby improving the server's overall reliability and market competitiveness, effectively balancing the relationship between performance, cost, and scalability.

[0048] In the implementation of this application, firstly, the first backplane 10 and the server's motherboard are connected via the first gold finger 11, ensuring stable transmission of high-speed signals, low-speed control signals, and power supply from the motherboard to the first backplane 10. Here, the protruding design of the first gold finger 11 precisely aligns with the motherboard slot, ensuring signal continuity and structural stability. Subsequently, when additional PCIe cards need to be added, the second gold finger 12 of the first backplane 10 is connected to the connector 21 of the first second backplane 20. This connection process not only transmits low-speed control signals and provides power but also determines the appropriate position of the second backplane 20. On the second backplane 20, the mating of the connector 21 with the second gold finger 12 of the first backplane 10 ensures efficient signal and power transmission. Simultaneously, the third gold finger 22 of the second backplane 20 continues this process with the connector 21 of the next second backplane 20, forming a multi-level interconnection. In this cascading process, each backplane is directly connected to the corresponding PCIe card via a bonding area. The bonding of the bonding area to the cable provides a direct path for the transmission of high-speed PCIe signals, reducing signal attenuation and ensuring high-quality signal transmission. Thus, by combining the first backplane 10 with multiple second backplanes 20, the number of PCIe cards can be flexibly adjusted according to actual needs, achieving effective control of system-level costs while ensuring the stability and efficiency of signal transmission.

[0049] Specifically, when a PCIe card is installed in a server, its connector engages with the first connector slot structure 131 of the first backplane 10 or the second connector slot structure 231 of the second backplane 20, ensuring mechanical fixation and electrical connection between the card and the backplane. Simultaneously, the soldering of the bonding area to the cable provides crucial high-speed signal transmission for the PCIe card. These signals are transmitted directly from the first backplane 10 or through multiple levels of second backplanes 20 to the PCIe card, reducing signal paths and improving signal quality. During this process, all second backplanes 20 are detachably connected to the expansion card bracket 30. Clearance holes 31 on the expansion card bracket 30 ensure unobstructed installation of the PCIe card connector. The use of fasteners 40 and mounting studs 32 makes the connection between the first backplane 10, the second backplane 20, and the expansion card bracket 30 secure and easy to install and remove, thus simplifying the installation and maintenance process of the PCIe card. Overall, the process descriptions in this application demonstrate the signal transmission and installation flow from the motherboard to the backplane and then to the PCIe card, highlighting the flexibility and cost-effectiveness achieved through the modular backplane design.

[0050] The foregoing has provided a detailed description of a backplane expansion module and server for expansion cards provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A backplate expansion module for expansion cards, characterized in that, include: A first backplane (10) has a first gold finger (11) and a second gold finger (12), wherein the first gold finger (11) is used to connect and cooperate with the motherboard of the server. Multiple second backplates (20), each of the second backplates (20) having a connector (21) and a third gold finger (22); The first backplate (10) is used to be plugged into one expansion card (1), and each of the second backplates (20) is used to be plugged into one of the remaining expansion cards (1). The number of the second backplates (20) is equal to the number of the remaining expansion cards (1). The connector (21) of the second back plate (20) adjacent to the first back plate (10) is engaged with the second gold finger (12). In the direction away from the first back plate (10), two adjacent second back plates (20) are connected in sequence through the connector (21) and the third gold finger (22) on the corresponding side.

2. The backplane expansion module according to claim 1, characterized in that, The first backplate (10) includes: The first backplate body (13) has a first gold finger (11) and a second gold finger (12) at one end of its length direction, and the first gold finger (11) and the second gold finger (12) are respectively located on the first side and the second side of the width direction of the first backplate body (13). The first gold finger (11) protrudes from the first side surface of the first back plate body (13) in the width direction, and the second gold finger (12) is flush with the second side surface of the first back plate body (13) in the width direction.

3. The backplane expansion module according to claim 2, characterized in that, The first side surface of the first backplate body (13) in the thickness direction has a first insertion groove structure (131), which is used to insert and cooperate with the corresponding insertion end of the expansion card (1).

4. The backplane expansion module according to claim 3, characterized in that, The second side surface of the first backplate body (13) in the thickness direction has a first bonding area (132) for bonding with a cable to transmit at least a high-speed signal to the corresponding expansion card (1).

5. The backplane expansion module according to claim 2, characterized in that, The second backplate (20) includes: The second backplate body (23) has the connector (21) and the third gold finger (22) at one end of its length direction, and the connector (21) and the third gold finger (22) are respectively located on the first side and the second side of the width direction of the second backplate body (23). The connector (21) protrudes from the first side surface of the first backplate body (13) in the width direction, and the third gold finger (22) is flush with the second side surface of the first backplate body (13) in the width direction.

6. The backplane expansion module according to claim 5, characterized in that, The first side surface of the second backplate body (23) in the thickness direction has a second insertion groove structure (231), which is used to insert and cooperate with the corresponding insertion end of the expansion card (1).

7. The backplane expansion module according to claim 5, characterized in that, The second side surface of the second backplate body (23) in the thickness direction has a second bonding area (232) for bonding with a cable to transmit at least a high-speed signal to the corresponding expansion card (1).

8. The backplate expansion module according to any one of claims 1 to 7, characterized in that, The backplane expansion module also includes: The expansion card holder (30) has a receiving groove. The groove wall is provided with a plurality of clearance holes (31) in sequence from bottom to top in the vertical direction. The receiving groove is used to accommodate at least two expansion cards (1). Each clearance hole (31) is used to avoid the insertion end of the corresponding expansion card (1). The first back plate (10) and the second back plate (20) are both disposed on the surface of the expansion card bracket (30) on the side having the clearance hole (31), and the first back plate (10) is located at the bottom, and a plurality of second back plates (20) are arranged sequentially at intervals in a direction away from the first back plate (10).

9. The backplane expansion module according to claim 8, characterized in that, The first backplate (10) is detachably connected to the expansion card holder (30); and / or, The second backplate (20) is detachably connected to the expansion card holder (30).

10. A server, characterized in that, Includes a backplane expansion module, wherein the backplane expansion module is the backplane expansion module according to any one of claims 1 to 9.

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