Laminated coil component

Abstract

A laminated coil component comprises a laminated body formed by stacking multiple insulating layers in a stacking direction and having a coil disposed therein, and external electrodes disposed on the surface of the laminated body and electrically connected to the coil. The laminated body has a first end face and a second end face opposite each other in the length direction, a first main face and a second main face opposite each other in the height direction orthogonal to the length direction, and a first side face and a second side face opposite each other in the width direction orthogonal to the length and height directions. The external electrodes include a first external electrode extending from at least a portion of the first end face of the laminated body to a portion of the first main face, and an external electrode extending from at least a portion of the second end face of the laminated body. The second external electrode extends to a portion of the first main surface, the stacking direction of the laminate and the coil axis of the coil are parallel to the first main surface, the insulating layer has a magnetic phase comprising at least Fe, Ni, Zn and Cu spinel structure and a non-magnetic phase comprising at least Si, if the grain size D50 and D90 of the grain constituting the magnetic phase are set as the cumulative area equivalent circle diameters of 50% and 90% respectively in the cumulative distribution of the area equivalent circle diameter of the grains according to the number basis, then the grain size D50 is 50 nm or more and 750 nm or less, and the grain size D90 is 200 nm or more and 1500 nm or less.

Description

[0001] This application is a divisional application of application number 202210663159.6, filed on June 13, 2022, entitled "Laminated Coil Component". Technical Field

[0002] This invention relates to laminated coil components. Background Technology

[0003] Patent Document 1 discloses a stacked coil component comprising a stacked body consisting of multiple insulating layers, a coil built inside the stack, and an external electrode.

[0004] The high-frequency characteristics of this laminated coil component are excellent, with the transmittance coefficient S21 at 40GHz and 50GHz exceeding specific values.

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-186255

[0006] Given the increasing speed and capacity of communication equipment in recent years, multilayer coil components require sufficient high-frequency characteristics at higher frequency bands (e.g., GHz bands above 60 GHz).

[0007] Patent Document 1 describes a laminated coil component that uses ferrite material as its insulating layer. Ferrite material has a high specific permittivity of approximately 15, resulting in significant losses in laminated coil components using ferrite material in the 60GHz frequency range. Further improvements in high-frequency characteristics are desired. Summary of the Invention

[0008] The present invention was made to solve the above-mentioned problems, and its purpose is to provide a stacked coil component with excellent high-frequency characteristics.

[0009] The laminated coil component of the present invention is characterized by having a laminated body formed by stacking multiple insulating layers in a stacking direction and having a coil disposed therein, and an external electrode disposed on the surface of the laminated body and electrically connected to the coil. The laminated body has a first end face and a second end face opposite in the length direction, a first main face and a second main face opposite in the height direction orthogonal to the length direction, and a first side face and a second side face opposite in the width direction orthogonal to the length direction and the height direction. The external electrode has a first external electrode extending from at least a portion of the first end face of the laminated body to a portion of the first main face, and an external electrode extending from the second end face of the laminated body. The second external electrode extends at least a portion of the surface to a portion of the first main surface. The stacking direction of the laminate and the coil axis of the coil are parallel to the first main surface. The insulating layer has a magnetic phase with a spinel structure containing at least Fe, Ni, Zn and Cu, and a non-magnetic phase containing at least Si. If the grain sizes D50 and D90 of the grains constituting the magnetic phase are set to be the cumulative area equivalent circle diameters of 50% and 90% respectively in the cumulative distribution of the area equivalent circle diameters of the grains, then the grain size D50 is 50 nm or more and 750 nm or less, and the grain size D90 is 200 nm or more and 1500 nm or less.

[0010] According to the present invention, it is possible to provide a stacked coil component with excellent high-frequency characteristics. Attached Figure Description

[0011] Figure 1 This is a perspective view schematically illustrating an example of a stacked coil component of the present invention.

[0012] Figure 2 This is a cross-sectional view schematically illustrating an example of a stacked coil component of the present invention.

[0013] Figure 3 It is a schematic representation of the composition. Figure 2 An exploded oblique view of the insulating layer of the stacked coil component shown.

[0014] Figure 4 It is a schematic representation of the composition. Figure 2 An exploded planar schematic diagram showing the appearance of the insulation layer of the stacked coil component.

[0015] Figure 5 The X-ray diffraction patterns of the samples prepared in Example 4 and Comparative Example 2 are shown.

[0016] Figure 6 This is a diagram schematically illustrating the method for measuring the transmittance coefficient S21.

[0017] Figure 7This is a graph showing the transmittance S21 of the samples prepared in Examples 1, 4, 6 and Comparative Example 2.

[0018] Figure 8 It is a graph showing the measured and theoretical values ​​of the specific permittivity of samples with different volume ratios of the magnetic phase relative to the total volume of the magnetic and non-magnetic phases. Detailed Implementation

[0019] The laminated coil component of the present invention will be described below.

[0020] However, the present invention is not limited to the following structures and methods, and can be appropriately modified and applied without changing the spirit of the invention. Furthermore, the present invention also includes combinations of two or more preferred structures and methods described below.

[0021] Figure 1 This is a perspective view schematically illustrating an example of a stacked coil component of the present invention.

[0022] Figure 1 The stacked coil component 1 shown includes a stacked body 10, a first external electrode 21, and a second external electrode 22. The stacked body 10 is a generally rectangular parallelepiped shape with six sides. Although the structure of the stacked body 10 will be described later, it is formed by stacking multiple insulating layers in the stacking direction and a coil is disposed inside it. The first external electrode 21 and the second external electrode 22 are electrically connected to the coil, respectively.

[0023] In the laminated coil components and laminates described in this specification, the length direction, height direction, and width direction are defined as... Figure 1 The x, y, and z directions are defined in the diagram. Here, the length (x-direction), height (y-direction), and width (z-direction) are orthogonal to each other.

[0024] The length direction (x-direction) is the direction parallel to the stacking direction.

[0025] like Figure 1 As shown, the laminate 10 has a first end face 11 and a second end face 12 opposite in the length direction (x direction), a first main face 13 and a second main face 14 opposite in the height direction (y direction) orthogonal to the length direction, and a first side face 15 and a second side face 16 opposite in the width direction (z direction) orthogonal to the length and height directions.

[0026] Although Figure 1 Not shown, but preferably the laminate 10 has rounded corners and edges. The corners are the parts where three faces of the laminate intersect, and the edges are the parts where two faces of the laminate intersect.

[0027] The first external electrode and the second external electrode are external electrodes that extend from at least a portion of the end face of the laminate to the main face of the laminate.

[0028] exist Figure 1 In the stacked coil component 1 shown, the first external electrode 21 is configured to cover a portion of the first end face 11 of the stack 10, and extends from the first end face 11 to cover a portion of the first main face 13.

[0029] The first external electrode 21 covers the area of ​​the first end face 11 that includes the ridge portion intersecting with the first main face 13.

[0030] In addition, Figure 1 In this process, although the height of the first external electrode 21 covering the portion of the first end face 11 of the laminate 10 is constant, the shape of the first external electrode 21 is not particularly limited as long as it covers a portion of the first end face 11 of the laminate 10. For example, on the first end face 11 of the laminate 10, the first external electrode 21 may also be a mountain shape that increases in height from the end towards the center. Furthermore, although the length of the first external electrode 21 covering the portion of the first main face 13 of the laminate 10 is constant, the shape of the first external electrode 21 is not particularly limited as long as it covers a portion of the first main face 13 of the laminate 10. For example, on the first main face 13 of the laminate 10, the first external electrode 21 may also be a mountain shape that increases in length from the end towards the center.

[0031] like Figure 1 As shown, the first external electrode 21 can also be configured to extend further from the first end face 11 and the first main face 13, covering a portion of the first side face 15 and a portion of the second side face 16. In this case, it is preferable that the first external electrode 21 covering the portions of the first side face 15 and the second side face 16 is formed to be inclined relative to the ridge portion intersecting with the first end face 11 and the ridge portion intersecting with the first main face 13. Alternatively, the first external electrode 21 may not be configured to cover a portion of the first side face 15 and a portion of the second side face 16.

[0032] exist Figure 1 In the stacked coil component 1 shown, the second external electrode 22 is configured to cover a portion of the second end face 12 of the stack 10, and extends from the second end face 12 to cover a portion of the first main face 13.

[0033] Similar to the first external electrode 21, the second external electrode 22 covers the area of ​​the second end face 12 that includes the ridge portion intersecting with the first main face 13.

[0034] Similar to the first external electrode 21, the shape of the second external electrode 22 is not particularly limited as long as it covers a portion of the second end face 12 of the laminate 10. For example, on the second end face 12 of the laminate 10, the second external electrode 22 may also be a mountain shape that rises from the end towards the center. Furthermore, the shape of the second external electrode 22 is not particularly limited as long as it covers a portion of the first main face 13 of the laminate 10. For example, on the first main face 13 of the laminate 10, the second external electrode 22 may also be a mountain shape that elongates from the end towards the center.

[0035] Similar to the first external electrode 21, the second external electrode 22 may also be configured to further extend from the second end face 12 and the first main face 13, covering a portion of the first side face 15 and a portion of the second side face 16. In this case, it is preferable that the second external electrode 22 covering the portions of the first side face 15 and the second side face 16 is formed to be inclined relative to the ridge portion intersecting with the second end face 12 and the ridge portion intersecting with the first main face 13. Alternatively, the second external electrode 22 may not be configured to cover a portion of the first side face 15 and a portion of the second side face 16.

[0036] Since the first external electrode 21 and the second external electrode 22 are configured as described above, when the stacked coil component 1 is mounted on the substrate, the first main surface 13 of the stack 10 becomes the mounting surface.

[0037] Alternatively, it can also be with Figure 1 The arrangement is different, with the first external electrode covering the entire first end face of the laminate, and extending from the first end face to cover a portion of the first main face, a portion of the second main face, a portion of the first side face, and a portion of the second side face.

[0038] Alternatively, the second external electrode may cover the entire second end face of the laminate, and extend from the second end face to cover a portion of the first main face, a portion of the second main face, a portion of the first side face, and a portion of the second side face.

[0039] In this case, any one of the first main surface, the second main surface, the first side surface, and the second side surface of the laminate becomes the mounting surface.

[0040] The size of the stacked coil component of the present invention is not particularly limited, but is preferably 0603, 0402 or 1005.

[0041] The insulating layer has a magnetic phase comprising at least Fe, Ni, Zn and Cu with a spinel structure, and a non-magnetic phase comprising at least Si.

[0042] By including a non-magnetic phase comprising at least Si in the insulating layer constituting the laminated coil component, the dielectric constant of the insulating layer can be reduced. Due to the reduced dielectric constant of the insulating layer, the losses in the laminated coil component caused by LC resonance are decreased. Specifically, the decrease in transmittance S21 caused by LC resonance can be shifted towards higher frequencies, for example, resulting in a good transmittance S21 in the region up to 60 GHz. Therefore, the laminated coil component of the present invention becomes a laminated coil component with excellent high-frequency characteristics.

[0043] Furthermore, by including a non-magnetic phase comprising at least Si in the insulating layer constituting the laminated coil component, the grain growth (necking) of the magnetic material is hindered by the non-magnetic material during the sintering stage of the laminate, resulting in a smaller grain size of the magnetic phase. Because the grain size of the magnetic phase is smaller, the specific permittivity of the insulating layer decreases compared to the theoretical specific permittivity calculated based on the volume ratio of the magnetic and non-magnetic phases. In other words, a smaller grain size of the magnetic phase also contributes to improved high-frequency characteristics of the laminated coil component.

[0044] More specifically, if the grain sizes D50 and D90 of the grains constituting the magnetic phase are set to be the cumulative 50% and 90% of the area equivalent circle diameters respectively in the cumulative distribution of the area equivalent circle diameters of the grains, then in the stacked coil component of the present invention, the grain size D50 is 50 nm or more and 750 nm or less, and the grain size D90 is 200 nm or more and 1500 nm or less.

[0045] When the grain sizes D50 and D90 of the crystals constituting the magnetic phase meet the above range, excellent high-frequency characteristics can be achieved, for example, the transmittance S21 in the region up to 60 GHz can be good.

[0046] If the grain size D50 of the crystals constituting the magnetic phase is less than 50 nm, the strength of the laminate will decrease.

[0047] Similarly, if the grain size D90 of the crystals constituting the magnetic phase is less than 200 nm, the strength of the laminate will decrease.

[0048] If the grain size D50 of the grains constituting the magnetic phase exceeds 750 nm, there may be cases where the transmittance S21 is insufficient, for example, in the region up to 60 GHz.

[0049] Similarly, if the grain size D90 of the grains constituting the magnetic phase exceeds 1500 nm, there may be cases where the transmittance S21 in the region up to 60 GHz is insufficient.

[0050] The preferred particle size D50 is above 80 nm and below 400 nm, more preferably above 150 nm and below 300 nm.

[0051] The preferred particle size D90 is above 250 nm and below 700 nm, more preferably above 350 nm and below 550 nm.

[0052] The difference between particle size D50 and particle size D90 (D90-D50) is not particularly limited, but it is preferably above 100 nm and below 800 nm, more preferably above 150 nm and below 300 nm, and even more preferably above 200 nm and below 250 nm.

[0053] The smaller the difference between the two, the more likely it is that the dielectric constant of the insulating layer can be further reduced.

[0054] The transmission coefficient S21 is determined by the ratio of the power of the transmitted signal to that of the input signal. The transmission coefficient S21 is essentially dimensionless and is usually expressed in dB as a common logarithm.

[0055] The transmittance S21 for each frequency is determined by measuring the power of the input signal and the transmitted signal to the laminated coil component using a network analyzer. The transmittance S21 for each frequency can be obtained by varying the frequency and calculating the transmittance S21.

[0056] In the embodiments, a specific example of a device for measuring transmittance S21 will be described.

[0057] As mentioned above, from the viewpoint of reducing the specific permittivity of the insulating layer compared to the theoretical specific permittivity, it is preferable that the grains constituting the magnetic phase also contain smaller crystallites.

[0058] Here, the size (crystal diameter) of the crystallite can be calculated based on Scherrer's formula according to the width of the diffraction peaks of X-ray diffraction. The wider the diffraction peak, the smaller the size (crystal diameter) of the crystallite that constitutes the grain.

[0059] Therefore, from the viewpoint of achieving excellent high-frequency characteristics by reducing the specific permittivity of the insulating layer, it is preferable that the diffraction peak of the magnetic phase has a larger half-width.

[0060] More specifically, it is preferable that the (642) plane, which is derived from the magnetic phase and obtained by X-ray diffraction of Cu-Kα1 lines, has a full width at half maximum (FWHM) of the diffraction peak of the (642) plane of the spinel structure described above, which is above 0.2° and below 0.5°.

[0061] If the full width at half maximum (FWHM) of the diffraction peaks originating from the (642) plane of the magnetic phase is greater than 0.2° and less than 0.5°, then compared with the case where the insulating layer is composed of a magnetic phase consisting only of spinel containing at least Fe, Ni, Zn and Cu, the microcrystals contained in the grains constituting the magnetic phase can be further reduced, and the specific permittivity of the insulating layer can be reduced compared with the theoretical specific permittivity.

[0062] If the half-width of the diffraction peak of the (642) plane caused by the magnetic phase is less than 0.2°, then for example, there is a case where the transmittance S21 in the region up to 60 GHz is insufficient.

[0063] If the half-width of the diffraction peak of the (642) plane of the magnetic phase exceeds 0.5°, the strength of the laminate will decrease or the permeability will decrease, resulting in insufficient transmission coefficient S21.

[0064] Preferably, the half-width at half-maximum (WHM) of the diffraction peak originating from the (642) plane of the magnetic phase is 0.3° or more and 0.45° or less, more preferably 0.35° or more and 0.40° or less.

[0065] A magnetic phase is a phase of magnetic material possessing a spinel structure, and a magnetic phase includes at least Fe, Ni, Zn, and Cu. A magnetic phase can also be a phase composed solely of magnetic materials possessing a spinel structure.

[0066] The magnetic phase may further include Co, Bi, Sn, Mn, etc.

[0067] The preferred magnetic material with a spinel structure is a Ni-Cu-Zn ferrite material, and the preferred magnetic phase is composed of a Ni-Cu-Zn ferrite material. By using a Ni-Cu-Zn ferrite material to form the magnetic phase, the inductance of the laminated coil component is improved.

[0068] Ni-Cu-Zn ferritic materials may further contain additives such as Co, Bi, Sn, and Mn, or unavoidable impurities.

[0069] Furthermore, a magnetic phase is a phase containing Fe, Ni, Zn, and Cu when elemental analysis is performed. Alternatively, a magnetic phase can also contain Co, Bi, Sn, Mn, etc., when elemental analysis is performed.

[0070] The preferred magnetic phase comprises Fe, which is more than 40 mol% and less than 49.5 mol% when converted to Fe2O3; Zn, which is more than 2 mol% and less than 35 mol% when converted to ZnO; Cu, which is more than 6 mol% and less than 13 mol% when converted to CuO; and Ni, which is more than 10 mol% and less than 45 mol% when converted to NiO.

[0071] A nonmagnetic phase is a phase containing nonmagnetic materials, at least Si. A nonmagnetic phase can also be a phase composed solely of nonmagnetic materials.

[0072] Examples of nonmagnetic materials constituting the nonmagnetic phase include glass materials, magnesium olivine (2MgO・SiO2), and zinc silicate [aZnO・SiO2 (a is 1.8 or higher and 2.2 or lower)].

[0073] Furthermore, in this specification, "a non-magnetic phase containing at least Si" can be composed of a phase containing only Si, or it can be composed of a phase containing Si and a phase not containing Si. Examples of phases not containing Si include crystalline phases that do not contain Si.

[0074] Preferably, the non-magnetic phase includes glass material. If the non-magnetic phase includes glass material, it can effectively hinder the grain growth (necking) of the magnetic material during the firing stage of the laminate, thereby reducing the grain size of the magnetic phase.

[0075] Borosilicate glass is preferred as the glass material.

[0076] The preferred borosilicate glass contains 70% to 85% by weight Si (converted to SiO2), 10% to 25% by weight B (converted to B2O3), 0.5% to 5% by weight alkali metal A (converted to A2O), and 0% to 5% by weight Al (converted to Al2O3). Examples of alkali metal A include K and Na.

[0077] The non-magnetic phase may further include forsterite (2MgO・SiO2), quartz (SiO2), etc., as fillers.

[0078] The magnetic and non-magnetic phases can be distinguished as follows: First, the laminated coil component is ground to expose a cross-section along the lamination direction. Then, elemental mapping is performed using scanning transmission electron microscopy-energy dispersive X-ray diffraction (STEM-EDX). Next, the regions containing Fe, Ni, Zn, and Cu elements are designated as the magnetic phase, while the regions not containing the magnetic phase are designated as the non-magnetic phase, thus distinguishing the two phases.

[0079] Furthermore, the cross-section along the stacking direction will be described later. Figure 2 The cross-section shown is shown.

[0080] The non-magnetic material constituting the non-magnetic phase preferably has a lower dielectric constant compared to the magnetic material constituting the magnetic phase.

[0081] The specific permittivity of magnetic materials can be, for example, above 14.0 and below 15.5.

[0082] Preferably, the specific permittivity of the non-magnetic material is lower than that of the magnetic material, for example, preferably below 7.0, more preferably below 5.0. The lower limit of the specific permittivity of the non-magnetic material is not particularly limited, but it can, for example, be above 3.5.

[0083] To determine the specific permittivity of magnetic materials and non-magnetic materials, the structural formulas of the magnetic materials constituting the magnetic phase and the non-magnetic materials constituting the non-magnetic phase are determined using the element mapping described above. Then, the specific permittivity of the compound corresponding to that structural formula is calculated using a known database. This sequence allows for the determination of the specific permittivity of both magnetic and non-magnetic materials.

[0084] Alternatively, a dielectric constant measuring specimen can be prepared by shaping a magnetic material into a specified shape, and the specific dielectric constant can be measured under specified conditions after forming electrodes on the specimen. Similarly, a dielectric constant measuring specimen can be prepared by shaping a non-magnetic material into a specified shape, and the specific dielectric constant of the non-magnetic material can be measured.

[0085] Preferably, the volume percentage of the non-magnetic phase relative to the total volume of the magnetic and non-magnetic phases is 50% or more and 90% or less, more preferably 60% or more and 90% or less, and even more preferably 70% or more and 90% or less.

[0086] The volume ratio of the non-magnetic phase relative to the total volume of the magnetic phase and the non-magnetic phase is determined as follows. First, the laminate constituting the laminated coil component is ground to the center in a direction orthogonal to the lamination direction, so that the cross-section along the lamination direction is exposed.

[0087] Next, by extracting 50 μm square regions at three locations near the center of the exposed profile, and then performing elemental mapping using scanning transmission electron microscopy-energy dispersive X-ray diffraction (STEM), the magnetic and non-magnetic phases were distinguished as described above. Then, for each of the three locations, based on the obtained elemental mapping images, the area ratio of the non-magnetic phase relative to the total area of ​​the magnetic and non-magnetic phases was determined using image analysis software. Subsequently, the average value of these area ratio measurements was calculated, and this average value was used as the volume ratio of the non-magnetic phase relative to the total volume of the magnetic and non-magnetic phases.

[0088] In addition, the volume ratio of the magnesium olivine to the total volume of the non-magnetic phase is preferably 2% or more and 8% or less.

[0089] The volume ratio of forsterite contained in the nonmagnetic phase can be determined by dividing the region where Mg, an element contained in forsterite, exists into the region where forsterite exists, and by measuring the area ratio of the region where forsterite exists relative to the area of ​​the nonmagnetic phase.

[0090] If the non-magnetic phase comprises more than 2% by volume and less than 8% by volume magnesium olivine, the strength of the laminate is increased.

[0091] The preferred insulating layer contains 2% to 11% by weight of B (converted to B2O3), 18% to 66% by weight of Si (converted to SiO2), 13% to 52% by weight of Fe (converted to Fe2O3), 1% to 7% by weight of Ni (converted to NiO), 4% to 16% by weight of Zn (converted to ZnO), and 1% to 5% by weight of Cu (converted to CuO).

[0092] The composition of the insulating layer was confirmed by inductively coupled plasma atomic emission spectrometry / mass spectrometry (ICP-AES / MS).

[0093] Next, an example of a coil built into a laminate that constitutes a laminated coil component will be described.

[0094] A coil is formed by electrically connecting multiple coil conductors stacked together in the stacking direction along with an insulating layer.

[0095] Figure 2 This is a cross-sectional view schematically illustrating an example of a stacked coil component of the present invention. Figure 3 It is a schematic representation of the composition. Figure 2 An exploded oblique view of the insulating layer of the stacked coil component shown. Figure 4 It is a schematic representation of the composition. Figure 2 An exploded planar schematic diagram showing the appearance of the insulation layer of the stacked coil component.

[0096] Figure 2 This schematically illustrates the stacking direction of the insulating layer, coil conductors, connecting conductors, and laminates, without strictly showing the actual shapes and connections. For example, the coil conductors are connected via through-hole conductors.

[0097] like Figure 2 As shown, the stacked coil component 1 includes a stacked body 10 with a built-in coil 30, and a first external electrode 21 and a second external electrode 22 electrically connected to the coil 30. The coil 30 is formed by electrically connecting a plurality of coil conductors 32 stacked together with an insulating layer.

[0098] The laminate 10 contains regions where coil conductors 32 are disposed and regions where first connecting conductors 41 or second connecting conductors 42 are disposed. The lamination direction of the laminate 10 and the axial direction of the coil 30 (in...) Figure 2 In the middle, it is indicated that the coil axis A) is parallel to the first main surface 13.

[0099] like Figure 3 as well as Figure 4 As shown, the laminate 10 has insulating layers 31a, 31b, 31c, and 31d, which serve as... Figure 2 The insulating layer 31 is present in the laminate 10. The laminate 10 has insulating layers 35a1, 35a2, 35a3, and 35a4, serving as... Figure 2 The insulating layer 35a is present in the laminate 10. The laminate 10 has insulating layers 35b1, 35b2, 35b3, and 35b4, serving as... Figure 2 The insulating layer 35b in the middle.

[0100] Coil 30 has coil conductors 32a, 32b, 32c, and 32d, as... Figure 2 The coil conductor 32 in the middle.

[0101] Coil conductors 32a, 32b, 32c, and 32d are respectively disposed on the main surfaces of insulating layers 31a, 31b, 31c, and 31d.

[0102] The lengths of coil conductors 32a, 32b, 32c, and 32d are each 3 / 4 the length of a turn of coil 30. In other words, the number of layers of coil conductors 32 used to form the three turns of coil 30 is 4. In the laminate 10, coil conductors 32a, 32b, 32c, and 32d are repeatedly laminated as a unit (three turns).

[0103] Coil conductor 32a has a wire portion 36a and a pad portion 37a disposed at the end of the wire portion 36a. Coil conductor 32b has a wire portion 36b and a pad portion 37b disposed at the end of the wire portion 36b. Coil conductor 32c has a wire portion 36c and a pad portion 37c disposed at the end of the wire portion 36c. Coil conductor 32d has a wire portion 36d and a pad portion 37d disposed at the end of the wire portion 36d.

[0104] In insulating layers 31a, 31b, 31c, and 31d, through-hole conductors 33a, 33b, 33c, and 33d are respectively configured to be through in the stacking direction.

[0105] The insulating layer 31a of the coil conductor 32a and the through-hole conductor 33a, the insulating layer 31b of the coil conductor 32b and the through-hole conductor 33b, the insulating layer 31c of the coil conductor 32c and the through-hole conductor 33c, and the insulating layer 31d of the coil conductor 32d and the through-hole conductor 33d are considered as a unit. Figure 3 as well as Figure 4 The portion enclosed by the dotted line in the image is repeatedly stacked. Thus, the pad portions 37a of coil conductor 32a, 37b of coil conductor 32b, 37c of coil conductor 32c, and 37d of coil conductor 32d are connected via via conductors 33a, 33b, 33c, and 33d. In other words, the pad portions of adjacent coil conductors in the stacking direction are interconnected via via conductors.

[0106] Through the above, a solenoid-shaped coil 30 is formed and built into the laminate 10.

[0107] When viewed from the stacking direction, the coil 30, composed of coil conductors 32a, 32b, 32c, and 32d, can be either circular or polygonal. When viewed from the stacking direction, if the coil 30 is polygonal, the area of ​​the polygon equivalent to the diameter of the circle is taken as the coil diameter of the coil 30, and the axis passing through the centroid of the polygon and extending in the stacking direction is taken as the coil axis of the coil 30.

[0108] The through-hole conductor 33p is configured to extend through the stacking direction in insulating layers 35a1, 35a2, 35a3, and 35a4. Alternatively, pad portions for connecting to the through-hole conductor 33p may be provided on the main surfaces of insulating layers 35a1, 35a2, 35a3, and 35a4.

[0109] Insulating layers 35a1, 35a2, 35a3, and 35a4 with through-hole conductors 33p are stacked to overlap with the insulating layer 31a containing coil conductors 32a and through-hole conductors 33a. Thus, the through-hole conductors 33p are interconnected to form a first connecting conductor 41, which is exposed at the first end face 11. Consequently, the first external electrode 21 is interconnected with the coil 30 (coil conductor 32a) via the first connecting conductor 41.

[0110] Preferably, the first connecting conductor 41 connects the first external electrode 21 and the coil 30 in a straight line. The first connecting conductor 41 connects the first external electrode 21 and the coil 30 in a straight line, which means that when viewed from the stacking direction, the through-hole conductors 33p constituting the first connecting conductor 41 overlap each other, and the through-hole conductors 33p do not need to be strictly arranged in a straight line.

[0111] The through-hole conductor 33q is configured to extend through the stacking direction in insulating layers 35b1, 35b2, 35b3, and 35b4. Alternatively, pad portions for connecting to the through-hole conductor 33q may be provided on the main surfaces of insulating layers 35b1, 35b2, 35b3, and 35b4.

[0112] Insulating layers 35b1, 35b2, 35b3, and 35b4 with through-hole conductors 33q are stacked to overlap with the insulating layer 31d of the coil conductor 32d and the through-hole conductor 33d. Thus, the through-hole conductors 33q are interconnected to form a second connecting conductor 42, which is exposed at the second end face 12. Consequently, the second external electrode 22 is interconnected with the coil 30 (coil conductor 32d) via the second connecting conductor 42.

[0113] Preferably, the second connecting conductor 42 connects the second external electrode 22 and the coil 30 in a straight line. The second connecting conductor 42 connects the second external electrode 22 and the coil 30 in a straight line, which means that when viewed from the stacking direction, the through-hole conductors 33q constituting the second connecting conductor 42 overlap each other, and the through-hole conductors 33q do not need to be strictly arranged in a straight line.

[0114] Furthermore, when the pad portion is connected to the through-hole conductor 33p constituting the first connecting conductor 41 and the through-hole conductor 33q constituting the second connecting conductor 42 respectively, the shape of the first connecting conductor 41 and the second connecting conductor 42 refers to the shape other than the pad portion.

[0115] exist Figure 3 as well as Figure 4 The example illustrates a case where the number of layers of the coil conductor 32 used to form the three turns of the coil 30 is 4, that is, a case where the repeating shape is a 3 / 4 turn shape. However, the number of layers of the coil conductor 32 used to form the one turn of the coil is not particularly limited.

[0116] For example, the number of layers of the coil conductor used to form one turn of the coil can be 2, that is, the repeating shape is a 1 / 2 turn shape.

[0117] Preferably, when viewed from the stacking direction, the coil conductors constituting the coil overlap each other. Furthermore, it is preferable that the coil shape is circular when viewed from the stacking direction. Additionally, if the coil includes a pad portion, the shape other than the pad portion (i.e., the shape of the wire portion) is used as the coil shape.

[0118] In addition, when the through-hole conductor constituting the connecting conductor is connected to the pad portion, the shape other than the pad portion (i.e., the shape of the through-hole conductor) is used as the shape of the connecting conductor.

[0119] also, Figure 3 The coil conductor shown is in the shape of a repeating circular pattern, but it can also be a coil conductor with a repeating polygonal pattern such as a quadrilateral.

[0120] Alternatively, the coil conductor can be shaped as a 1 / 2 turn instead of a 3 / 4 turn.

[0121] The first external electrode and the second external electrode can be either single-layer or multi-layer structures.

[0122] When the first external electrode and the second external electrode are both single-layer structures, the constituent materials of each external electrode can include, for example, silver, gold, copper, palladium, nickel, aluminum, and alloys containing at least one of these metals.

[0123] When the first external electrode and the second external electrode are both multilayer structures, each external electrode may also have, for example, a base electrode layer containing silver, a nickel coating, and a tin coating sequentially from the surface side of the laminate.

[0124] exist Figure 2 , Figure 3 as well as Figure 4 In the case of a stacked coil component with the structure shown, where the size of the stacked coil component is 0603, in order to further improve the high-frequency characteristics, it is preferable to design it as follows.

[0125] The preferred number of turns in the coil is 33 or more and 42 or less. If the number of turns is within this range, the total electrostatic capacitance between the coil conductors can be reduced, thus allowing the transmittance S21 to be within a good range.

[0126] In addition, the preferred coil length is 0.49 mm or more and 0.55 mm or less.

[0127] Preferably, the width of the coil conductor is greater than 45 μm and less than 75 μm. The width of the coil conductor is... Figure 2 The dimensions are indicated by the double arrow W.

[0128] Preferably, the thickness of the coil conductor is above 3.5 μm and below 6.0 μm. The thickness of the coil conductor is... Figure 2 The dimensions are indicated by the double arrow T.

[0129] Preferably, the distance between the coil conductors is greater than 3.0 μm and less than 5.0 μm. Figure 2 The dimensions are indicated by the double arrow D.

[0130] Preferably, the diameter of the pad portion of the coil conductor is 30 μm or more and 50 μm or less. The diameter of the pad portion of the coil conductor is... Figure 4 The dimensions are indicated by the double arrow R.

[0131] When the first main surface of the laminate is the mounting surface, it is preferable that the lengths of the first external electrode and the second external electrode covering the portion of the first main surface of the laminate are both 0.20 mm or less. Furthermore, it is preferable that they are 0.10 mm or more.

[0132] The lengths of the first external electrode and the second external electrode of the portion covering the first main surface of the laminate are: Figure 2 The dimension is indicated by the double arrow E1.

[0133] Furthermore, it is preferable that the specific permittivity of the insulating layer constituting the laminated coil component of the present invention is 4.0 or higher and 10.0 or lower, more preferably 4.0 or higher and 8.0 or lower, and even more preferably 4.0 or higher and 7.0 or lower.

[0134] The specific permittivity of the insulating layer constituting the laminated coil component can be determined as follows.

[0135] A dielectric constant determination sample is prepared by shaping the insulating layer into a specified shape (e.g., a circular plate). Electrodes are formed on both sides of the sample, and then the dielectric constant is determined at a frequency of 1 MHz using an impedance analyzer (e.g., Agilent Technologies E4991A).

[0136] In addition, the permeability of the insulating layer constituting the stacked coil component of the present invention is preferably 1.5 or more and 25.0 or less, more preferably 1.7 or more and 8.5 or less, and even more preferably 2.5 or more and 5.0 or less.

[0137] The permeability of the insulating layer constituting the laminated coil component can be measured as follows.

[0138] A permeability measurement specimen is prepared by shaping the insulating layer into a specified shape (e.g., a ring). The specimen is housed in a permeability measurement fixture, and the permeability is then measured at a frequency of 1 MHz using an impedance analyzer (e.g., Agilent Technologies E4991A).

[0139] For example, the laminated coil component of the present invention is manufactured using the following method.

[0140] <Magnetic Material Manufacturing Process>

[0141] Fe₂O₃, ZnO, CuO, and NiO are weighed in a specified ratio. Unavoidable impurities may be present in each oxide. Next, these weighed substances are wet-mixed and then pulverized to form a slurry. Additives such as Mn₃O₄, Bi₂O₃, Co₃O₄, SiO₂, and SnO₂ may be added at this time. The resulting slurry is then dried and temporarily calcined. The temporary calcination temperature is, for example, above 700°C and below 800°C. The temporary calcination time is, for example, above two hours and below five hours. This produces a powdered ferrite material, which can be used as a magnetic material.

[0142] The preferred ferritic material comprises 40 mol% or more and 49.5 mol% of Fe2O3, 2 mol% or more and 35 mol% of ZnO, 6 mol% or more and 13 mol% of CuO, and 10 mol% or more and 45 mol% of NiO.

[0143] <Non-magnetic material manufacturing process>

[0144] Weigh the non-magnetic material powder. Prepare a glass powder containing alkali metals such as potassium, boron, silicon, and aluminum in a specified ratio as borosilicate glass. Additionally, prepare magnesium olivine powder as a filler. Quartz powder may also be further prepared as a filler.

[0145] The preferred borosilicate glass contains Si converted to SiO2 at a ratio of 70% or more and 85% or less, B converted to B2O3 at a ratio of 10% or more and 25% or less, alkali metal A converted to A2O at a ratio of 0.5% or more and 5% or less, and Al converted to Al2O3 at a ratio of 0% or more and 5% or less.

[0146] <Processes for making raw slices>

[0147] Magnetic and non-magnetic materials are weighed to a predetermined ratio. Next, these weighed materials, along with organic binders such as polyvinyl butyral resin, organic solvents such as ethanol and toluene, and plasticizers, are mixed and then pulverized to form a slurry. The slurry is then shaped into sheets of a predetermined thickness using a scraping method or similar technique, and subsequently punched into a predetermined shape, such as a rectangle, to produce a green sheet.

[0148] The thickness of the preferred raw sheet is above 20 μm and below 30 μm.

[0149] Preferably, the volume ratio of magnetic materials to non-magnetic materials is adjusted such that the volume ratio of non-magnetic materials relative to the total volume of magnetic materials and non-magnetic materials is 50% or more and 90% or less, and then the materials are mixed. More preferably, the volume ratio of magnetic materials to non-magnetic materials is adjusted such that the volume ratio of non-magnetic materials is 60% or more and 90% or less, and then the materials are mixed. Even more preferably, the volume ratio of magnetic materials to non-magnetic materials is adjusted such that the volume ratio of non-magnetic materials is 70% or more and 90% or less, and then the materials are mixed.

[0150] <Conductor Pattern Forming Process>

[0151] First, through holes are formed by laser irradiation at designated locations on the green film.

[0152] Next, a conductive paste, such as silver paste, is filled into the through-holes and applied to the surface of the green sheet using methods such as screen printing. This forms a through-hole conductor pattern in the through-holes of the green sheet, and a coil conductor pattern connected to the through-hole conductor pattern is formed on the surface. In this way, a coil sheet with both coil conductor patterns and through-hole conductor patterns formed on the green sheet is produced. Multiple coil sheets are produced, and each coil sheet is formed with a pattern equivalent to... Figure 3 as well as Figure 4 The coil conductor shown uses a conductor pattern and is equivalent to... Figure 3 as well as Figure 4 The through-hole conductor shown uses a conductor pattern.

[0153] Furthermore, by using methods such as screen printing, conductive pastes such as silver paste are filled into the through-holes, and a through-hole sheet with a conductor pattern for the through-hole conductor is formed on the green sheet, separate from the coil sheet. Multiple through-hole sheets are made, and each through-hole sheet is formed with a pattern equivalent to... Figure 3 as well as Figure 4 The through-hole conductor shown uses a conductor pattern.

[0154] <Layered Module Manufacturing Process>

[0155] By following the equivalent Figure 3 as well as Figure 4 The coil sheets and through-hole sheets are stacked in the stacking direction, and then heat-pressed to form a stacked block.

[0156] <Laminated Body / Coil Manufacturing Process>

[0157] First, the stacked blocks are cut into specified sizes using a cutting machine or similar equipment to create monolithic chips.

[0158] Next, the monolithic chip is fired. The firing temperature is, for example, above 900°C and below 920°C. The firing time is, for example, above two hours and below four hours. The oxygen concentration at the highest temperature (above 900°C and below 920°C) is, for example, above 0.01 vol% and below 0.5 vol%. By maintaining the oxygen concentration at the highest temperature above 0.01 vol% and below 0.5 vol%, grain growth constituting the magnetic phase can be suppressed, and the grain size of the magnetic phase after firing can be reduced.

[0159] By burning a monolithic chip, the green sheets of coil plates and through-hole plates become insulating layers. As a result, a laminate is fabricated by stacking multiple insulating layers along the length direction. Magnetic and non-magnetic phases are formed within the laminate.

[0160] By burning a monolithic chip, the conductor patterns for the coil conductors and the conductor patterns for the via conductors of the coil sheet become the coil conductors and via conductors, respectively. As a result, a coil is fabricated by stacking multiple coil conductors in the stacking direction and electrically connecting them via via conductors.

[0161] Through the above, a laminate and a coil disposed inside the laminate are fabricated. The lamination direction of the insulating layer and the direction of the coil axis are parallel to the mounting surface of the laminate, i.e., the first main surface, which is parallel along the length direction.

[0162] By burning a monolithic chip, the through-hole conductors of the through-hole chip are patterned into through-hole conductors. As a result, a first connecting conductor and a second connecting conductor are fabricated by stacking multiple through-hole conductors along their length and electrically connecting them. The first connecting conductor protrudes from the first end face of the stack. The second connecting conductor protrudes from the second end face of the stack.

[0163] The corners and edges can also be rounded by performing roller grinding on the laminate, for example.

[0164] <External Electrode Forming Process>

[0165] First, a conductive paste containing silver and glass powder is coated onto the first and second end faces of the laminate. Next, a base electrode layer is formed on the surface of the laminate by sintering the resulting coatings. More specifically, a base electrode layer is formed extending from the first end face of the laminate to a portion of each of the first main surface, the first side surface, and the second side surface. Additionally, a base electrode layer is formed extending from the second end face of the laminate to a portion of each of the first main surface, the first side surface, and the second side surface. The sintering temperature of each coating is, for example, above 800°C and below 820°C.

[0166] Subsequently, nickel and tin coatings are sequentially formed on the surface of each substrate electrode layer through electroplating and other processes.

[0167] In this way, a first external electrode is formed that is electrically connected to the coil via a first connecting conductor, and a second external electrode is formed that is electrically connected to the coil via a second connecting conductor.

[0168] The above steps are used to manufacture stacked coil components.

[0169]

Example

[0170] The following describes embodiments of the stacked coil component of the present invention in more detail. However, the present invention is not limited to these embodiments.

[0171] [Examples 1-6 and Comparative Examples 1-2]

[0172] The laminates for the laminated coil components of Examples 1 to 6 and Comparative Examples 1 to 2 are manufactured using the following method.

[0173] <Magnetic Material Manufacturing Process>

[0174] The main components were weighed in the following proportions: Fe₂O₃ 48.0 mol%, ZnO 30.0 mol%, NiO 14.0 mol%, and CuO 8.0 mol%. Next, these weighed components, along with pure water, a dispersant, and PSZ media, were placed in a ball mill and mixed, followed by pulverization to prepare a slurry. The resulting slurry was then dried and temporarily calcined at 800°C for two hours. This process produced a powdered ferritic material, which can be used as a magnetic material.

[0175] <Non-magnetic material manufacturing process>

[0176] Borosilicate glass powder containing Si, B, K, and Al in a specified ratio, along with forsterite powder and quartz powder as fillers, are prepared. The borosilicate glass powder, forsterite powder, and quartz powder are weighed to a weight ratio of borosilicate glass:forsterite:quartz = 72:4:24. Next, these weighed materials, along with pure water, a dispersant, and PSZ media, are mixed in a ball mill and then pulverized to form a slurry. Finally, the slurry is dried to produce a powdered, non-magnetic material.

[0177] <Processes for making raw slices>

[0178] Magnetic and non-magnetic materials were weighed in the following volume ratios, as shown in Tables 1 and 2. Next, these weighed materials, along with polyvinyl butyral resin as an organic binder, ethanol and toluene as organic solvents, and PSZ media, were mixed in a ball mill and then pulverized to prepare a slurry. The slurry was then shaped into sheets of a specified thickness using a scraping method, and subsequently punched into a specified shape to produce green sheets.

[0179] <Conductor Pattern Forming Process>

[0180] Prepare a conductive paste containing silver powder and an organic carrier for use as an internal conductor.

[0181] Through holes are formed at designated locations on the raw sheet, and conductive paste is filled to form through-hole conductors. Then, the coil conductor pattern is printed to obtain the coil sheet.

[0182] Additionally, through-holes are formed by irradiating designated locations on the green sheet with a laser. A conductive paste is then filled into the through-holes to form a through-hole conductor, resulting in a through-hole sheet.

[0183] <Layered Module Manufacturing Process>

[0184] By following the equivalent Figure 3 as well as Figure 4 The coil sheets and through-hole sheets are stacked in the stacking direction in sequence, and then heat-pressed to form a stacked block.

[0185] <Laminated Body / Coil Manufacturing Process>

[0186] Monolithic chips are fabricated by cutting the laminated blocks into single wafers using a dicing machine. These single-wafer chips are then fired to form a laminate. The firing process involves maintaining a maximum temperature of 920°C for four hours, during which the oxygen concentration is kept at 0.1% by volume. The laminate is then cooled to an atmospheric environment. The laminate contains a ferrite phase (magnetic) and a non-magnetic phase.

[0187] <External Electrode Forming Process>

[0188] A conductive paste containing silver powder and glass powder for the external electrode is poured into a coating forming tank to form a coating of a specified thickness. The external electrode, which forms the laminate, is then immersed in this coating.

[0189] After impregnation, the base electrode layer of the external electrode is formed by sintering at a temperature of approximately 800°C. The thickness of the base electrode layer is approximately 5 μm.

[0190] Next, using electroplating, a nickel coating and a tin coating are sequentially formed on the base electrode layer to form an external electrode.

[0191] Through the above, the stacked coil components of Examples 1 to 6 and Comparative Examples 1 to 2 are manufactured.

[0192] The dimensions of the manufactured stacked coil component are 0.6 mm in the length direction, 0.3 mm in the height direction, and 0.3 mm in the width direction.

[0193] In addition, Examples 1 to 6 are compositions in which the mixing ratio of magnetic and non-magnetic materials is changed, Comparative Example 1 is a composition without magnetic materials, and Comparative Example 2 is a composition without non-magnetic materials.

[0194] In addition, from the prepared raw sheets, circular plate-shaped specimens with an outer diameter of approximately 10 mm and a thickness of approximately 0.5 mm after firing, and ring-shaped specimens with an outer diameter of 20 mm, an inner diameter of 12 mm, and a thickness of 1.5 mm after firing were prepared. Firing was carried out as described above at a maximum temperature of 920°C and maintained for four hours. During this period, the oxygen concentration was maintained at 0.1% by volume. Cooling was then carried out to an atmospheric environment.

[0195] <Determination of Composition>

[0196] The composition of the circular plate-shaped sample was confirmed by inductively coupled plasma atomic emission spectrometry / mass spectrometry (ICP-AES / MS). The results are shown in Table 1 below.

[0197] In addition, Table 1 shows the composition of each component when the total of K2O, B2O3, SiO2, Al2O3, MgO, Fe2O3, NiO, ZnO, and CuO is set to 100% by weight.

[0198]

[0199] <Determination of Specific Permittivity>

[0200] Electrodes were formed on both sides of a circular plate-shaped sample, and the specific permittivity ε was measured using an impedance analyzer (Agilent Technologies, E4991A) at a measurement frequency of 1 MHz. r The results are shown in Table 2 below.

[0201] <Determination of Magnetic Permeability>

[0202] The annular sample was housed in a permeability measuring fixture (Agilent Technologies, 16454A-s), and the permeability μ was measured at a measurement frequency of 1 MHz using an impedance analyzer (Agilent Technologies, E4991A). The results are shown in Table 2 below.

[0203] <Determination of particle size D50 and D90>

[0204] The fabricated stacked coil component was vertically erected with the second main surface exposed, and resin was used to fix the periphery of the stacked coil component. Subsequently, it was ground using a grinder to approximately the center of the stacked coil component in the height direction. Scanning electron microscopy (SEM) images of the resulting cross-section were taken at 10000x magnification, and the D50 and D90 of the grains constituting the magnetic phase were determined using image processing software. The results are shown in Table 2 below.

[0205] In addition, D50 and D90 are the cumulative 50% and 90% of the area equivalent circle diameters in the cumulative distribution of the area equivalent circle diameter of the grain, respectively, based on the number of individuals.

[0206] In addition, in SEM images, the magnetic phase is relatively dark and the non-magnetic phase is relatively bright. Therefore, by binarizing the SEM images with a specified threshold, only the grains constituting the magnetic phase are extracted, and their grain size (area equivalent circle diameter) is evaluated.

[0207] X-ray diffraction

[0208] The prepared circular plate-shaped sample was pulverized into powder and evaluated by X-ray diffraction. The full width at half maximum (FWHM) of the diffraction peaks originating from the (642) plane of the magnetic phase was measured. In addition, Cu-Kα1 lines were used as the X-ray source.

[0209] Figure 5 The X-ray diffraction patterns of the samples prepared in Example 4 and Comparative Example 2 are shown.

[0210] like Figure 5 As shown, the half-width at half-maximum (WHM) of the diffraction peak of the (642) plane, which is caused by the magnetic phase, was measured. The half-width at half-maximum (WHM) of the diffraction peak of the spinel structure (642) plane, which appears between 86 and 87°, was also measured.

[0211] The results are shown in Table 2 below.

[0212]

[0213] <Determination of the coefficient S21>

[0214] Figure 6 This is a diagram schematically illustrating the method for measuring the transmittance coefficient S21.

[0215] like Figure 6 As shown, the fabricated stacked coil component 1 is soldered to a measuring fixture 60 that has a signal path 61 and a grounding conductor 62. The first external electrode 21 of the stacked coil component 1 is connected to the signal path 61, and the second external electrode 22 is connected to the grounding conductor 62.

[0216] Using network analyzer 63, the power of the input signal and the transmitted signal to the sample is determined, and the transmittance coefficient S21 is measured by varying the frequency. One end of signal path 61 is connected to network analyzer 63.

[0217] Figure 7 This is a graph showing the transmittance S21 of the laminated coil components made in Examples 1, 4, and 6 and Comparative Example 2.

[0218] Furthermore, the closer the transmittance coefficient S21 is to 0dB, the less loss there is.

[0219] like Figure 7 As shown, compared with the laminated coil component manufactured in Comparative Example 2, the laminated coil components manufactured in Examples 1, 4 and 6 have a larger transmittance coefficient S21 in the 60GHz high-frequency band and have excellent high-frequency characteristics.

[0220] This is because the dielectric constant of the insulating layer, which contains at least a non-magnetic phase of Si, is reduced by including the insulating layer that constitutes the laminated coil component, thereby reducing the loss due to LC resonance of the laminated coil component.

[0221] <Evaluation of Measured vs. Theoretical Permittivity>

[0222] A circular plate-shaped sample was prepared by varying the volume ratio of the magnetic phase relative to the total volume of the magnetic and non-magnetic phases, as described above. The specific permittivity was then determined using the method described above. Furthermore, the theoretical value of the specific permittivity was calculated based on the mixing ratio of the magnetic and non-magnetic phases using the logarithmic mixing rule. The results are as follows... Figure 8 As shown.

[0223] Figure 8It is a graph showing the measured and theoretical values ​​of the specific permittivity of samples with different volume ratios of the magnetic phase relative to the total volume of the magnetic and non-magnetic phases.

[0224] like Figure 8 As shown, the measured value for the specific permittivity is 3–6% lower than the theoretical value. This is likely due to the mixing of the magnetic and non-magnetic phases, resulting in a smaller grain size in the magnetic phase.

[0225] Thus, the decrease in specific dielectric constant caused by the reduction in the grain size of the magnetic phase also contributes to the improvement of the high-frequency characteristics of the laminated coil component.

[0226] According to the present invention, a magnetic permeability μ of 1.5 to 25 and a specific permittivity ε can be obtained. r It has a transmittance coefficient of 4 to 10 and is a good multilayer coil component with a high transmission coefficient of S21 at high frequencies.

[0227] Explanation of reference numerals in the attached figures

[0228] 1…Layered coil component, 10…Layer body, 11…First end face, 12…Second end face, 13…First main face, 14…Second main face, 15…First side face, 16…Second side face, 21…First external electrode, 22…Second external electrode, 30…Coil, 31, 31a, 31b, 31c, 31d, 35a, 35a1, 35a2, 35a3, 35a4, 35b, 35b1, 35b2, 35b3, 3 5b4…Insulation layer; 32, 32a, 32b, 32c, 32d…Coil conductors; 33a, 33b, 33c, 33d, 33p, 33q…Through-hole conductors; 36a, 36b, 36c, 36d…Wire section; 37a, 37b, 37c, 37d…Pad section; 41…First connecting conductor; 42…Second connecting conductor; 60…Measurement fixture; 61…Signal path; 62…Ground conductor; 63…Network analyzer.

Claims

1. A stacked coil component, wherein, It has a laminated body, which is formed by stacking multiple insulating layers in the stacking direction and has a coil disposed inside. The aforementioned laminate has a first end face and a second end face opposite each other in the length direction, a first main face and a second main face opposite each other in the height direction orthogonal to the length direction, and a first side face and a second side face opposite each other in the width direction orthogonal to the length direction and the height direction. The laminate has an external electrode and a second external electrode, wherein the second external electrode extends from at least a portion of the second end face of the laminate and over a portion of the first main face. The stacking direction of the aforementioned laminate and the coil axis of the aforementioned coil are parallel to the aforementioned first main surface. The aforementioned insulating layer has a magnetic phase comprising at least Fe, Ni, Zn, and Cu with a spinel structure, and a non-magnetic phase comprising at least Si. The half-width of the diffraction peak caused by the (642) plane of the above magnetic phase obtained by X-ray diffraction of Cu-Kα1 line is greater than 0.2° and less than 0.5°.

2. The laminated coil component according to claim 1, wherein, The full width at half maximum (FWHM) of the aforementioned diffraction peaks is greater than 0.3° and less than 0.45°.

3. The laminated coil component according to claim 1, wherein, The full width at half maximum (FWHM) of the aforementioned diffraction peaks is greater than 0.35° and less than 0.4°.

4. The laminated coil component according to any one of claims 1 to 3, wherein, The aforementioned insulating layer contains at least one of Fe, Zn, Ni, Cu, K, B, Si, Al, and Mg.

5. The laminated coil component according to claim 4, wherein, The aforementioned insulating layer contains Fe, Zn, Ni, Cu, B, and Si.

6. The laminated coil component according to claim 5, wherein, Regarding the aforementioned insulating layer The B content, converted to B₂O₃, is between 2% and 11% by weight. The Si content, converted to SiO2, is between 18% and 66% by weight. The Fe content, converted to Fe₂O₃, is between 13% and 52% by weight. The Ni content, converted to NiO, is between 1% and 7% by weight. The Zn content, when converted to ZnO, is between 4% and 16% by weight. The Cu content is converted to CuO, which is more than 1% by weight and less than 5% by weight.

7. A stacked coil component, wherein, It has a laminated body, which is formed by stacking multiple insulating layers in the stacking direction and has a coil disposed inside. The aforementioned laminate has a first end face and a second end face opposite each other in the length direction, a first main face and a second main face opposite each other in the height direction orthogonal to the length direction, and a first side face and a second side face opposite each other in the width direction orthogonal to the length direction and the height direction. The laminate has an external electrode and a second external electrode, wherein the second external electrode extends from at least a portion of the second end face of the laminate and over a portion of the first main face. The stacking direction of the aforementioned laminate and the coil axis of the aforementioned coil are parallel to the aforementioned first main surface. The aforementioned insulating layer has a magnetic phase comprising at least Fe, Ni, Zn, and Cu with a spinel structure, and a non-magnetic phase comprising at least Si. Regarding the aforementioned insulating layer The B content, converted to B₂O₃, is between 2% and 11% by weight. The Si content, converted to SiO2, is between 18% and 66% by weight. The Fe content, converted to Fe₂O₃, is between 13% and 52% by weight. The Ni content, converted to NiO, is between 1% and 7% by weight. The Zn content, when converted to ZnO, is between 4% and 16% by weight. The Cu content is converted to CuO, which is more than 1% by weight and less than 5% by weight.

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