Three-dimensional snow mass flux measurement method and device and computer equipment

By using the collaborative detection of orthogonal dual-field telecentric optical imaging and visible light thermal infrared multi-angle imaging modules, the observation error problem in three-dimensional snow mass flux measurement was solved, realizing high-precision measurement and stable observation of snow particles, and providing detailed data support for the snow material transport process.

CN122329432APending Publication Date: 2026-07-03CHINESE ACAD OF METEOROLOGICAL SCI
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CHINESE ACAD OF METEOROLOGICAL SCI
Filing Date
2026-06-04
Publication Date
2026-07-03

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Abstract

This invention provides a method, apparatus, and computer device for measuring three-dimensional snow mass flux. The method includes: performing three-dimensional dynamic imaging of snow particles passing through the orthogonal dual-field-of-view measurement area using an orthogonal dual-field-of-view telecentric optical imaging module, and acquiring the morphological parameters, spatial position, and three-dimensional velocity vector of individual snow particles; measuring the mass of snow particles falling into the snow particle mass measurement area using a visible light thermal infrared multi-angle imaging module, and retrieving the mass and density of individual snow particles; performing spatiotemporal alignment and fusion processing on the data acquired by the orthogonal dual-field-of-view telecentric optical imaging module and the visible light thermal infrared multi-angle imaging module using a synchronous control and data fusion processing module to obtain comprehensive parameters of the snow particles; and calculating the three-dimensional snow mass flux of the corresponding area based on the comprehensive parameters. This method can directly and accurately acquire the mass and density of individual snow particles and significantly improve the accuracy of microphysical parameter measurement.
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