Forming platform and three-dimensional forming equipment
By using a circuit combining multiple heating parts and switch parts in a three-dimensional molding device, the impedance is adjusted according to the temperature, the problem of heating efficiency reduction caused by the increase in copper wire impedance is solved, and the heating speed and power supply optimization is achieved.
Patent Information
- Application Number
- CN202420684630.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-03
- Publication Date
- 2024-12-13
- Estimated Expiration
- 2034-04-03
AI Technical Summary
During the heating process of existing three-dimensional molding equipment, the copper wire impedance increases with the increase of temperature, resulting in a decrease in current, resulting in redundancy in switching power supply power, waste of costs and reduced heating efficiency, and the heating time cannot be effectively shortened.
By using a circuit composed of multiple heating parts and switches on the molding platform, the impedance of the circuit is adjusted according to the temperature, and a larger impedance is initially used to heat quickly, and switch to a smaller impedance as the temperature rises to maintain the current stability , avoid power redundancy.
The stability and speed of heating efficiency are achieved, and the current reduction and power waste caused by the increase in impedance are avoided, ensuring rapid heating and low-cost production of the platform.
Smart Images
Figure CN222156661U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of 3D printing, in particular to a molding platform and a three-dimensional molding device. Background Art
[0002] The 3D molding equipment feeds materials in filament form. The print head melts the filaments and sprays the molten materials on the molding platform according to the slice data of the model, and forms a 3D model by stacking. The printing platform needs to be heated before printing so that the first layer of the model can adhere to the printing platform and will not tilt, overturn or warp during the stacking process.
[0003] The printing platform is usually heated by the copper wire coiled on it. The time required for the printing platform to heat up is directly related to the current on the copper wire. If a low-voltage DC power supply is used to power the copper wire, the heating is relatively slow. In order to shorten the heating time, there is a method in the prior art to increase the current and increase the heating efficiency by reducing the impedance of the copper wire. This method requires the use of a high-power switching power supply to prevent the load of the switching power supply from exceeding the rated power. However, the resistance of the copper wire is related to the temperature. As the temperature of the printing platform increases, the impedance of the copper wire will increase, resulting in a decrease in current, causing power redundancy of the switching power supply, waste of cost, and reduced heating efficiency, and a longer heating time.
[0004] Therefore, how to prevent the impedance of the copper wire from increasing with increasing temperature, resulting in a decrease in heating efficiency, becomes a problem to be solved. Utility Model Content
[0005] In view of this, in order to solve at least one of the aforementioned technical problems, the utility model provides a forming platform and a three-dimensional forming device.
[0006] In order to achieve the above purpose, the utility model mainly provides the following technical solutions:
[0007] On the one hand, the utility model provides a molding platform, which is applied to a three-dimensional molding device, and the molding platform includes:
[0008] Platform body, which is used to connect the model;
[0009] A plurality of heating elements and a plurality of switch elements, wherein the heating elements are connected to the platform body and are used for heating when powered on, and the switch elements are electrically connected to the heating elements and are used for connecting to the controller of the forming platform;
[0010] The switch element is used to close or open under the control of the controller to change the impedance of the circuit composed of multiple heating elements.
[0011] On the other hand, the utility model also provides a three-dimensional molding device, including any of the aforementioned molding platforms.
[0012] The technical solution proposed by the utility model mainly reduces the fluctuation of heating efficiency caused by temperature rise by adjusting the impedance of the circuit composed of multiple heating elements according to the temperature of the platform body. In the prior art, the current is increased and the heating efficiency is increased by reducing the impedance of the copper wire. This method requires the use of a high-power switching power supply. However, the resistance of the copper wire is related to the temperature. As the temperature of the printing platform increases, the impedance of the copper wire will increase, resulting in a decrease in current, causing power redundancy of the switching power supply, a waste of cost, and a decrease in heating efficiency, and a longer heating time. Compared with the prior art, in the present application document, at the initial stage of heating the platform body, the circuit composed of multiple heating elements is switched to a larger impedance. As the temperature of the platform body increases, the actual value of the impedance of the heating element will increase. The circuit composed of multiple heating elements is switched to a smaller impedance, reducing the fluctuation of the size of the heating current, avoiding a significant reduction in the current caused by the increase in the actual value of the impedance, and then making reasonable use of the power of the switching power supply and ensuring the heating speed of the platform body. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 A schematic diagram of the circuit structure of the first combination of a heating element and a switch element provided in an embodiment of the utility model;
[0014] Figure 2 A schematic diagram of the circuit structure of a second combination of a heating element and a switch element provided in an embodiment of the utility model;
[0015] Figure 3 A schematic diagram of the circuit structure of a third combination of a heating element and a switch element provided in an embodiment of the utility model;
[0016] Figure 4 A schematic diagram of the circuit structure of a fourth combination of a heating element and a switch element provided in an embodiment of the utility model;
[0017] Figure 5 A schematic diagram of the circuit structure of a fifth combination of a heating element and a switch element provided in an embodiment of the utility model;
[0018] Figure 6 A schematic diagram of the connection relationship between a molding platform and a controller provided in an embodiment of the utility model. DETAILED DESCRIPTION
[0019] In order to further explain the technical means and effects adopted by the present invention to achieve the predetermined purpose of the present invention, the specific implementation method, structure, characteristics and effects of a forming platform proposed according to the present invention are described in detail below in combination with the accompanying drawings and preferred embodiments.
[0020] On the one hand, if Figure 1-6As shown, the utility model provides a molding platform, which is applied to a three-dimensional molding device, and the molding platform includes:
[0021] Platform body, which is used to connect the model;
[0022] A plurality of heating elements and a plurality of switch elements, wherein the heating elements are connected to the platform body and are used for heating when powered on, and the switch elements are electrically connected to the heating elements and are used for connecting to the controller of the forming platform;
[0023] The switch element is used to close or open under the control of the controller to change the impedance of the circuit composed of multiple heating elements.
[0024] The platform body is usually in a square plate-like structure, and the upper surface of the platform body is used to connect the model. The heating element is connected to the platform body by physical contact to transfer heat to the platform body. In some embodiments, the platform body may include an upper substrate and a lower substrate, at least the upper substrate has thermal conductivity, and multiple heating elements may be arranged between the upper substrate and the lower substrate. Alternatively, multiple heating elements may be directly laid on the bottom surface of the platform body. In some specific embodiments, the "multiple" may refer to two or more components, and the heating element may be in various forms, such as metal wires, heating plates, heating films, etc. In order to enable multiple heating elements to heat the platform body evenly when they are heated, multiple heating elements are arranged in parallel, such as when the heating element is a heating plate, it can be stacked; when the heating element is a metal wire, it can be arranged adjacent to each other and coiled on the platform body. The metal wire may be a copper wire. The impedance of the circuit composed of multiple heating elements refers to the impedance that can be presented when multiple heating elements are integrated in the same circuit. The switch component is electrically connected to the heating component. The switch component is used to connect to the controller of the forming platform. The switch component can be connected to the heating component one-to-one, or there can be no corresponding relationship. Instead, it is connected between multiple heating components. The switch component is used to close or open under the control of the controller to change the equivalent impedance of the combination of multiple heating components to change the impedance of the circuit composed of the heating components. For example, by closing or opening the switch component, the current is controlled to flow through the heating components with different impedances, thereby changing the impedance of the circuit composed of the heating components; or, by closing or opening the switch component, the connection relationship of the heating components is different, thereby changing the impedance of the circuit composed of the heating components. Among them, the switch component can be located in a variety of positions, such as being fixed on the platform body, or being integrated with the controller on the circuit substrate to shorten the distance between the controller and the switch component, so that the transmission distance of the control signal is short and not easily distorted.
[0025] The power supply uses a DC power supply with a constant rated power. It can be understood that the rated power should meet the demand for rapid heating of the platform body, that is, when the actual power of the power supply is near the rated power, the heating speed of the platform body can give users a better user experience. In the early stage of heating the platform body, the temperature of the platform body is low, close to room temperature, and the impedance of the heating element is close to the theoretical impedance. The switch is controlled to be closed or disconnected, so that the impedance of the circuit composed of multiple heating elements is a larger initial impedance value, and the actual power of the power supply is close to the rated power. After the platform body is heated for a period of time, the temperature of the platform body and the heating element rises, and the actual impedance of the heating element will increase and be greater than the theoretical impedance. At this time, the current decreases. By controlling the switch to be closed or disconnected, the circuit composed of multiple heating elements becomes a smaller impedance than the initial impedance value, and then overcomes the trend of current reduction, reduces the difference between the current and the current at the initial stage of heating of the platform body, so that the actual power of the power supply is still close to the rated power, and there will be no power redundancy. At the same time, ensuring that the heating power is always close to the rated power can ensure that the heating speed is the ideal speed and avoid the problem of slow heating speed due to increased impedance. During the entire process of heating the platform body, the impedance of the circuit composed of the heating elements can be adjusted only once, or can be progressively adjusted multiple times as the heating time goes by, so that the impedance of the circuit composed of the heating elements decreases successively according to the number of adjustments.
[0026] The molding platform proposed in the embodiment of the utility model mainly switches the impedance mode of the heating unit through the switch component, realizes adjusting the impedance of the heating unit according to the temperature of the platform body, and reduces the fluctuation of the heating efficiency caused by the temperature rise. In the prior art, the current is increased and the heating efficiency is increased by reducing the impedance of the copper wire. This method requires the use of a high-power switching power supply. However, the resistance of the copper wire is related to the temperature. As the temperature of the printing platform increases, the impedance of the copper wire will increase, resulting in a decrease in current, causing power redundancy of the switching power supply, a waste of cost, and a decrease in heating efficiency, and a longer heating time. Compared with the prior art, in the present application document, at the initial stage of heating the platform body, the circuit composed of multiple heating elements is switched to a larger impedance. As the temperature of the platform body increases, the actual value of the impedance of the heating element will increase. The circuit composed of multiple heating elements is switched to a smaller impedance, reducing the fluctuation of the size of the heating current, avoiding a significant reduction in the current caused by the increase in the actual value of the impedance, and then making reasonable use of the power of the switching power supply and ensuring the heating speed of the platform body.
[0027] There are many ways to change the impedance of the circuit composed of the heating elements. Hereinafter, several embodiments of changing the impedance of the circuit composed of the heating elements by controlling the heating elements of different impedances to be energized, and embodiments of changing the impedance of the circuit composed of the heating elements by different connection relationships of the heating elements will be exemplified. Figures 1 to 5In the figure, the heating element is equivalent to a resistor symbol, and it can be understood that the actual heating element can be in various forms.
[0028] First, if Figure 1 As shown, multiple heating elements are connected in series, one end of the series circuit is connected to the power supply, and the other end is grounded, and the switch element is connected in parallel with the heating element one by one. Different heating elements have different impedances, and the switch element is used to control whether the heating element is powered on or not, so as to change the impedance of the circuit composed of multiple heating elements.
[0029] The number of heating elements is N, which are represented by R1, R2...RN respectively, and N can be 2, 3, 4, etc. The impedance of R1, R2...RN can be reduced in sequence, and the switch elements of R1, R2...RN in parallel are S1, S2...SN respectively. In the initial stage of heating of the platform body, S2...SN is controlled to be closed and S1 is disconnected, so that the impedance of the circuit composed of multiple heating elements is equal to the impedance of R1. Since the impedance of R1 is large, the current between the circuit composed of multiple heating elements and the power supply is small. After the platform body is heated for a period of time, the actual impedance of R1 will increase, and S1, S3...SN are controlled to be closed and S2 is disconnected, so that the impedance of the circuit composed of multiple heating elements is equal to the impedance of R2, which is less than the initial impedance of R1, and then the trend of current reduction is overcome, so that the actual power of the power supply is still close to the rated power. After heating continues for a period of time, the actual impedance of R2 will increase, and S1, R2, S4...SN are controlled to be closed and S3 is disconnected, and this is done until the heating of the printing platform ends.
[0030] Since the heating time of the printing platform is usually not too long, in order to reduce production costs and control costs, in one embodiment, there may be only two heating elements. Figure 2 As shown, the two heating elements are the first heating element R1 and the second heating element R2, and the two switch elements are the first switch element S1 and the second switch element S2. The first heating element R1 and the second heating element R2 are connected in series and connected to a power supply, the first switch element S1 is connected in parallel with the first heating element R1, and the second switch element S2 is connected in parallel with the second heating element R2. The impedance of the first heating element R1 is greater than the impedance of the second heating element R2. In the initial stage of heating the printing platform, the first switch element S1 is disconnected, the second switch element S2 is closed, the first heating element R1 is energized, and the current of the second heating element R2 is very small and negligible, that is, the impedance of the circuit composed of multiple heating elements is approximately equal to the impedance of the first heating element R1, which is a larger impedance. After heating for a period of time, the first switch element S1 is closed, the second switch element S2 is disconnected, the second heating element R2 is energized, and the current of the first heating element R1 is very small and negligible, that is, the impedance of the circuit composed of multiple heating elements is approximately equal to the impedance of the second heating element R2, which is a smaller impedance.
[0031] Second, if Figure 3As shown, the switch elements correspond to the heating elements one by one and are connected in series to form multiple series circuits. Multiple switch elements are connected in parallel to the series circuits of the heating elements to form a parallel circuit. One end of the parallel circuit is connected to the power supply and the other end is grounded. Different heating elements have different impedances. The switch element is used to control whether the heating element is powered on or not, so as to change the impedance of the circuit composed of multiple heating elements.
[0032] The number of heating elements is N, which are represented by R1, R2...RN respectively, and N can be 2, 3, 4, etc. The impedance of R1, R2...RN can be reduced in sequence, and the switch elements connected in series with R1, R2...RN are S1, S2...SN respectively. In the initial stage of heating of the platform body, S2...SN is controlled to be disconnected and S1 is closed, so that the impedance of the circuit composed of multiple heating elements is equal to the impedance of R1. Since the impedance of R1 is large, the current between the circuit composed of multiple heating elements and the power supply is small. After the platform body is heated for a period of time, the actual impedance of R1 will increase, and S1, S3...SN are controlled to be disconnected and S2 is closed, so that the impedance of the circuit composed of multiple heating elements is equal to the impedance of R2, which is less than the initial impedance of R1, and then the trend of current reduction is overcome, so that the actual power of the power supply is still close to the rated power. After heating continues for a period of time, the actual impedance of R2 will increase, and S1, S2, S4...SN are controlled to be disconnected and S3 is closed, and this is done until the heating of the printing platform ends.
[0033] In order to reduce production costs and control costs, in one embodiment, there may be only two heating elements, specifically, Figure 4 As shown, the two heating elements are the first heating element R1 and the second heating element R2, and the two switch elements are the first switch element S1 and the second switch element S2. The first switch element S1 is connected in series with the first heating element R1 to form a first series circuit, and the second switch element S2 is connected in series with the second heating element R2 to form a second series circuit. The first series circuit is connected in parallel with the second series circuit, and the two ends are connected to the power supply and the ground respectively. The impedance of the first heating element R1 is greater than the impedance of the second heating element R2. In the initial stage of heating the printing platform, the first switch element S1 is closed, the second switch element S2 is disconnected, the first heating element R1 is energized, and the second heating element R2 is not energized. The impedance of the circuit composed of multiple heating elements is equal to the impedance of the first heating element R1, which is a larger impedance. After a period of heating, the first switch element S1 is disconnected, the second switch element S2 is closed, the second heating element R2 is energized, and the first heating element R1 is not energized. The impedance of the circuit composed of multiple heating elements is equal to the impedance of the second heating element R2, which is a smaller impedance.
[0034] Thirdly, the impedance of the circuit composed of multiple heating elements can be changed by changing the connection relationship of the multiple heating elements, such as multiple switch elements are used to coordinate and control the series-parallel relationship of the multiple heating elements to change the impedance of the circuit composed of the multiple heating elements.
[0035] More specifically, Figure 5 As shown, there are two heating elements, namely the first heating element R1 and the second heating element R2, and three switch elements, namely the first switch element S1, the second switch element S2 and the third switch element S3. The first end of the first switch element S1 is used to connect to a power source, the second end of the first switch element S1 is electrically connected to the first end of the second heating element R2, and the second end of the second heating element R2 is grounded. The first end of the first heating element R1 is used to connect to a power source, the second end of the first heating element R1 is electrically connected to the first end of the second switch element S2, and the second end of the second switch element S2 is grounded. The first end of the third switch element S3 is electrically connected to the second end of the first switch element S1, and the second end of the third switch element S3 is electrically connected to the first end of the second switch element S2.
[0036] At the beginning of the heating of the printing platform, the first switch S1 and the second switch S2 are both disconnected, the third switch S3 is closed, the first heating element R1 and the second heating element R2 are connected in series, and the impedance of the circuit composed of multiple heating elements is the sum of the impedance of the first heating element R1 and the impedance of the second heating element R2, which has a larger impedance. After heating for a period of time, the third switch S3 is disconnected, the first switch S1 and the second switch S2 are both closed, the first heating element R1 and the second heating element R2 are connected in parallel, and the impedance of the circuit composed of multiple heating elements will be less than the impedance of the first heating element R1 and the second heating element R2 in series. Among them, the impedance of the first heating element R1 and the second heating element R2 can be the same, such as the first heating element R1 and the second heating element R2 are exactly the same copper wire, or the impedance of the first heating element R1 and the second heating element R2 can also be different.
[0037] The switch element can be a variety of electronic devices that can be turned on or off, such as a transistor, a field effect tube or a chip. The following takes the insulated gate depletion type N-MOS as an example, and describes in detail the third embodiment, that is, the embodiment in which the switch element changes the connection mode of the first heating element R1 and the second heating element R2. When the insulated gate depletion type N-MOS is used as the switch element, other embodiments have similar principles and will not be described one by one.
[0038] The source electrode S of the first switch element S1 is used to connect to the power supply, the drain electrode D of the first switch element S1 is electrically connected to the first end of the second heating element R2, the second end of the second heating element R2 is grounded, and the gate electrode G of the first switch element S1, i.e., the control end, is used to connect to the controller of the stereoscopic forming device. The first end of the first heating element R1 is used to connect to the power supply, the second end of the first heating element R1 is electrically connected to the source electrode S of the second switch element S2, the drain electrode D of the second switch element S2 is grounded, and the gate electrode G of the second switch element S2, i.e., the control end, is used to connect to the controller of the stereoscopic forming device. The drain electrode D of the third switch element S3 is electrically connected to the drain electrode D of the first switch element S1, the source electrode S of the third switch element S3 is electrically connected to the source electrode S of the second switch element S2, and the gate electrode G of the third switch element S3, i.e., the control end, is used to connect to the controller of the stereoscopic forming device. By applying different control voltages to the gate electrodes G of the first switch element S1, the second switch element S2, and the third switch element S3, the on and off control of the first switch element S1, the second switch element S2, and the third switch element S3 is realized.
[0039] In one embodiment, the molding platform further includes at least one temperature sensing component, which is opposite to or connected to the platform body and is used to sense the temperature of the platform body.
[0040] The temperature sensing element can be a contact measurement, such as using a thermistor, a detection slot is set on the platform body, and the thermistor is inserted into the detection slot. Alternatively, the temperature sensing element can be non-contact, opposite to the printing platform, such as using an infrared temperature sensor. The number of temperature sensing elements can be a single one, or multiple, and multiple temperature sensing elements can be evenly distributed at various positions of the platform body, or can be arranged according to the setting position of the heating element. The temperature sensing element is electrically connected to the controller of the three-dimensional molding equipment, and is used to send the sensed temperature value to the controller. The controller determines whether to adjust the impedance of the circuit composed of multiple heating elements according to the temperature value. For example, by comparing the relationship between the temperature and the temperature threshold, if the temperature is higher than the temperature threshold, the impedance of the circuit composed of multiple heating elements can be adjusted to an impedance mode with a smaller impedance to adapt to the influence of temperature on impedance.
[0041] On the other hand, the utility model further provides a three-dimensional molding device, including any of the aforementioned molding platforms, including the advantages of any of the aforementioned molding platforms, which will not be repeated here.
[0042] The three-dimensional forming equipment also includes a controller and a power supply. The electrical connection between the multiple switch components and the controller can be achieved by plugging and unplugging the cable socket, and the heating component can also be electrically connected to the power supply through the plug-in port.
[0043] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.
Claims
1. A molding platform, used in stereo molding equipment, It is characterized in that The molding platform comprises: A platform body, the platform body is used to connect the model; A plurality of heating elements and a plurality of switch elements, wherein the heating elements are connected to the platform body and are used to generate heat when powered on, and the switch elements are electrically connected to the heating elements and are used to connect to a controller of the molding platform; The switch element is used to close or open under the control of the controller to change the impedance of the circuit composed of multiple heating elements.
2. The forming platform according to claim 1, It is characterized in that A plurality of the heating elements are connected in series, and the switch elements are connected in parallel with the heating elements one by one; The impedances of different heating elements are different, and the switch element is used to control whether the heating element is powered on or not, so as to change the impedance of the circuit formed by the combination of multiple heating elements.
3. The forming platform according to claim 1, It is characterized in that The number of the heating elements is two, namely a first heating element and a second heating element, and the number of the switch elements is two, namely a first switch element and a second switch element; The first heating element and the second heating element are connected in series, the first switch element and the first heating element are connected in parallel, and the second switch element and the second heating element are connected in parallel; The impedance of the first heating element is greater than the impedance of the second heating element, the first switch element is opened and the second switch element is closed, or the first switch element is closed and the second switch element is opened, so that the impedance of the circuit formed by the combination of the first heating element and the second heating element is different.
4. The forming platform according to claim 1, It is characterized in that The switch element and the heating element are connected in series to form a series circuit, and a plurality of the series circuits are connected in parallel; The switch element is used to control whether the heating element is powered on or not, so as to change the impedance of the circuit.
5. The forming platform according to claim 1, It is characterized in that The number of the heating elements is two, namely a first heating element and a second heating element, and the number of the switch elements is two, namely a first switch element and a second switch element; The first switch element is connected in series with the first heating element to form a first series circuit, the second switch element is connected in series with the second heating element to form a second series circuit, and the first series circuit is connected in parallel with the second series circuit; The impedance of the first heating element is greater than the impedance of the second heating element, the first switch element is closed and the second switch element is opened, or the first switch element is opened and the second switch element is closed, so that the impedance of the circuit formed by the combination of the first heating element and the second heating element is different.
6. The forming platform according to claim 1, It is characterized in that The plurality of switch elements are used to coordinately control the series-parallel relationship of the plurality of heating elements so as to change the impedance of the circuit formed by the plurality of heating elements.
7. The forming platform according to claim 6, It is characterized in that The number of the heating elements is two, namely a first heating element and a second heating element, and the number of the switch elements is three, namely a first switch element, a second switch element and a third switch element; The first end of the first switch element is used to connect to a power source, the second end of the first switch element is electrically connected to the first end of the second heating element, and the second end of the second heating element is grounded; The first end of the first heating element is used to connect to the power supply, the second end of the first heating element is electrically connected to the first end of the second switch element, and the second end of the second switch element is grounded; The first end of the third switch element is electrically connected to the second end of the first switch element, and the second end of the third switch element is electrically connected to the first end of the second switch element; The first switch element and the second switch element are both disconnected, the third switch element is closed, and the first heating element and the second heating element are connected in series; or, the third switch element is disconnected, the first switch element and the second switch element are both closed, and the first heating element and the second heating element are connected in parallel, so that the impedance of the circuit formed by the combination of the first heating element and the second heating element is different.
8. The forming platform according to claim 1, It is characterized in that A plurality of the heating elements are arranged in parallel on the platform body; And / or, the switch element includes at least one of a transistor, a field effect transistor or a chip.
9. The forming platform according to claim 1, It is characterized in that The molding platform also includes: At least one temperature sensing component, the temperature sensing component is opposite to the platform body or connected to the platform body, and the temperature sensing component is used to sense the temperature of the platform body.
10. A three-dimensional forming device, It is characterized in that The present invention comprises a forming platform as described in any one of claims 1 to 9.