Condensing device for volatile phenol flow path

Abstract

The utility model discloses a condensing device for a volatile phenol flow path, which relates to the technical field of medicament condensation and comprises an isothermal body, a pipeline is arranged on the isothermal body, semiconductor chilling plates for refrigerating the isothermal body are arranged at two ends of the isothermal body, and radiating fins are arranged on one side, far away from the isothermal body, of each semiconductor chilling plate. The beneficial effects of the utility model are that the cooling efficiency is ensured, the miniaturization of the whole volume is realized, the occupied space is reduced, and the response speed is fast.

Description

Technical Field

[0001] The utility model relates to the technical field of pharmaceutical condensation, in particular to a condensation device for a volatile phenol flow path. Background Art

[0002] In the volatile phenol flow injection test project, the phenol-containing vapor needs to be cooled and condensed into liquid, and then transported to the next reaction device through a pump tube.

[0003] Existing methods simply use liquid cooling heat exchange to achieve cooling. While this cooling method is highly efficient and can effectively remove the large amount of heat generated, it is relatively complex, requiring a liquid circulation system and heat dissipation devices, taking up a lot of space. It is not suitable for small, portable phenol flow condensing devices and has a slow response speed.

[0004] Therefore, it is necessary to propose a condensing device for the volatile phenol flow path, which can achieve miniaturization of the overall volume, reduce the occupied space, and have a fast response speed while ensuring the cooling efficiency. Utility Model Content

[0005] The purpose of the utility model is to overcome the deficiencies of the prior art and to propose a condensing device for a volatile phenol flow path, which, while ensuring cooling efficiency, achieves miniaturization of the overall volume, reduces occupied space, and has a fast response speed.

[0006] The purpose of the utility model is achieved through the following technical solutions: a condensing device for a volatile phenol flow path, comprising an isothermal body, a pipeline is provided on the isothermal body, semiconductor refrigeration plates for cooling the isothermal body are provided at both ends of the isothermal body, and heat dissipation fins are provided on the side of the semiconductor refrigeration plate away from the isothermal body.

[0007] The pipeline is wound around the outer wall of the isothermal body.

[0008] It also includes a mounting base plate, on which the isothermal body, semiconductor refrigeration sheet and heat dissipation fins are all arranged.

[0009] A support base is provided between the two heat dissipation fins.

[0010] A fan is provided on the heat dissipation fins.

[0011] It also includes a shell, and the isothermal body, semiconductor refrigeration sheet and heat dissipation fins are all arranged in the shell.

[0012] The shell is provided with a vent.

[0013] A circuit board is detachably arranged on the shell.

[0014] The isothermal in vivo temperature monitoring and control component.

[0015] The interior of the isothermal body is hollow and filled with liquid. A motor is provided inside the isothermal body, and a rotating rod is provided at the output end of the motor. A plurality of horizontal stirring shafts are fixedly sleeved on the rotating rod, and a fixed block matching the position and number of the horizontal stirring shafts is rotatably sleeved on the rotating rod. The fixed block abuts against the inner wall of the isothermal body, and a first gear is fixedly provided on the fixed block near one end of the horizontal stirring shaft. A plurality of protrusions are annularly provided on the axis of the horizontal stirring shaft, and a connecting rod is rotatably passed through the protrusion. A second gear and a vertical stirring rod are respectively provided at both ends of the connecting rod, and the second gear is meshed with the first gear.

[0016] The beneficial effects of the utility model are:

[0017] (1) The utility model provides cooling to the isothermal body simultaneously through the semiconductor refrigeration plates on both sides, reducing the time it takes for the isothermal body to reach a stable temperature, allowing the device to enter the working state more quickly and achieving better condensation effect. The cooling efficiency is not inferior to that of a liquid cooling heat exchange device.

[0018] (2) Since the present application adopts a semiconductor refrigeration plate, compared with the liquid cooling heat exchange device, the overall volume is greatly reduced, the occupied space is reduced, and the response speed is fast. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional diagram of the utility model;

[0020] Figure 2 This is the front view of the utility model;

[0021] Figure 3 Schematic diagram of the interior of the isothermal body;

[0022] In the figure, 1. isothermal body; 11. motor; 12. rotating rod; 13. horizontal stirring shaft; 14. fixed block; 15. first gear; 16. second gear; 17. connecting rod; 18. vertical stirring rod; 19. protrusion; 2. pipeline; 3. semiconductor cooling plate; 4. heat dissipation fin; 5. mounting base; 6. support base; 7. fan; 8. housing; 81. vent; 82. circuit board. DETAILED DESCRIPTION

[0023] The following will be combined with the embodiments to clearly and completely describe the technical solutions of the present invention. Obviously, the embodiments described are only some of the embodiments of the present invention, rather than all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work shall fall within the scope of protection of the present invention.

[0024] It is to be noted that the directions of "left", "right", "up", "down", "front", "back", "inside" and "outside" in the following schemes are all relative directions and are not listed here one by one.

[0025] A condensing device for volatile phenol flow path, reference Figure 1 and Figure 2 , including a mounting base 5. Two support seats 6 are provided on the mounting base 5. An isothermal body 1 is installed on the two support seats 6. Semiconductor refrigeration plates 3 are provided at the left and right ends of the isothermal body 1. The cooling surface of the semiconductor refrigeration plate 3 is in direct contact with the isothermal body 1. A pipe 2 is provided on the isothermal body 1 with a threaded winding. When the semiconductor refrigeration plate 3 is working, the temperature is transferred to the isothermal body 1, so that the phenol-containing vapor flowing through the isothermal body 1 is condensed into liquid and flows to the next reaction device. The semiconductor refrigeration plate 3 is provided with a heat dissipation fin 4 on the side away from the isothermal body 1. A fan 7 is provided on the heat dissipation fin 4, which takes out the heat from the other end of the semiconductor refrigeration plate 3 through the fan 7 and the heat dissipation fin 4 to ensure the cooling effect of the semiconductor refrigeration plate 3. A temperature monitoring and control component is installed in the isothermal body 1, which is connected to the semiconductor refrigeration plate 3 signal, so that the temperature of the isothermal body 1 can be maintained constant. A shell 8 is provided on the mounting base 5. Housing 8 completely encloses the isothermal element 1, semiconductor cooling fins 3, heat sink fins 4, and fan 7, preventing the isothermal element 1 from losing temperature too quickly. Housing 8 includes a vent 81, located at the outlet of fan 7. Ventilation 81 directs heat generated by fan 7 out of the condensing unit, ensuring a constant exchange of hot and cold air. Housing 8 also includes a removable circuit board 82.

[0026] Those skilled in the art will appreciate that the isothermal body 1 can be a metal cylinder, as long as it can achieve rapid temperature transfer. However, in this embodiment, since the semiconductor cooling fins 3 are located at both ends of the isothermal body 1, using a metal cylinder would cause the temperatures at both ends of the isothermal body 1 to be significantly lower than the middle temperature, making it impossible to maintain a uniform temperature across the isothermal body 1, resulting in poor condensation performance.

[0027] In this regard, the isothermal body 1 used in this embodiment is inconsistent with the conventional one. Figure 3The hollow interior of the isothermal body 1 is filled with condensed liquid, and a motor 11 is provided on the inner wall. The motor 11 is a waterproof motor. A rotating rod 12 is provided at the output end of the motor 11, and the rotating rod 12 is rotatably connected to the interior of the isothermal body 1. Two horizontal stirring shafts 13 are fixedly sleeved on the rotating rod 12, and two fixed blocks 14 are provided on the rotating sleeve. The fixed block 14 is connected to the interior of the isothermal body 1. The fixed blocks 14 correspond one-to-one with the horizontal stirring shafts 13 and are located directly above the horizontal stirring shaft 13. A first gear 15 is fixedly provided on the lower side of the fixed block 14. A plurality of protrusions 19 are annularly provided on the axis of the horizontal stirring shaft 13. A connecting rod 17 is rotatably passed through the protrusion 19. A second gear 16 and a vertical stirring rod 18 are provided at both ends of the connecting rod 17, and the second gear 16 and the first gear 15 are meshed.

[0028] When motor 11 is activated, rotating rod 12 rotates, driving horizontal stirring shaft 13 to rotate. This rotation also causes second gear 16 to orbit around first gear 15. Due to the meshing of first and second gears 15, second gear 16 rotates, which in turn drives vertical stirring rod 18 to rotate. This causes the condensed liquid within isothermal body 1 to flow, accelerating the transfer of temperature across the body and improving condensation efficiency.

[0029] The above description is merely a preferred embodiment of the present invention. It should be understood that the present invention is not limited to the form disclosed herein and should not be construed as excluding other embodiments. Instead, the present invention can be used in various other combinations, modifications, and environments and can be modified within the scope of the concept described herein through the above description or through techniques or knowledge in the relevant field. Modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention are intended to be protected by the claims appended hereto.

Claims

1. A condensing device for a volatile phenol flow path, characterized in that: The isothermal body (1) comprises an isothermal body (1) provided with a pipeline (2), semiconductor cooling plates (3) for cooling the isothermal body (1) are provided at both ends of the isothermal body (1), and heat dissipation fins (4) are provided on the side of the semiconductor cooling plate (3) away from the isothermal body (1); The interior of the isothermal body (1) is hollow and filled with liquid. A motor (11) is provided inside the isothermal body (1). A rotating rod (12) is provided at the output end of the motor (11). A plurality of horizontal stirring shafts (13) are fixedly sleeved on the rotating rod (12). A fixed block (14) matching the position and number of the horizontal stirring shafts (13) is rotatably sleeved on the rotating rod (12). The fixed block (14) abuts against the inner wall of the isothermal body (1). A first gear (15) is fixedly provided at one end of the fixed block (14) close to the horizontal stirring shaft (13). A plurality of protrusions (19) are annularly provided on the axis of the horizontal stirring shaft (13). A connecting rod (17) is rotatably passed through the protrusion (19). A second gear (16) and a vertical stirring rod (18) are provided at both ends of the connecting rod (17). The second gear (16) is meshed with the first gear (15).

2. A condensing device for a volatile phenol flow path according to claim 1, characterized in that: The pipeline (2) is wound around the outer wall of the isothermal body (1).

3. A condensing device for a volatile phenol flow path according to claim 1, characterized in that: It also includes a mounting base plate (5), on which the isothermal body (1), the semiconductor cooling sheet (3) and the heat dissipation fins (4) are all arranged.

4. A condensing device for a volatile phenol flow path according to claim 1, characterized in that: A support base (6) for supporting the isothermal body (1) is provided between the two heat dissipation fins (4).

5. A condensing device for a volatile phenol flow path according to claim 1, characterized in that: A fan (7) is provided on the heat dissipation fins (4).

6. A condensing device for a volatile phenol flow path according to claim 1, characterized in that: It also includes a shell (8), wherein the isothermal body (1), the semiconductor refrigeration plate (3) and the heat dissipation fins (4) are all arranged in the shell (8).

7. A condensing device for a volatile phenol flow path according to claim 6, characterized in that: A vent (81) is provided on the housing (8).

8. A condensing device for a volatile phenol flow path according to claim 6, characterized in that: A circuit board (82) is detachably provided on the housing (8).

9. A condensing device for a volatile phenol flow path according to claim 1, characterized in that: Temperature monitoring and control components within the isothermal body (1).

Images