Kick sensor circuit and smart quilt

Abstract

The application provides a kicking quilt sensor circuit and an intelligent quilt, and relates to the technical field of intelligent quilts.The kicking quilt sensor circuit comprises a temperature sensor array, a control circuit and a wireless circuit, the temperature sensor array is arranged on a plurality of preset positions of the intelligent quilt, the signal input end of the control circuit is connected with the output end of the temperature sensor array, the communication end of the wireless circuit is connected with the communication end of the control circuit, and the wireless circuit is used for accessing a user terminal.The application can accurately monitor the user's behavior of kicking the quilt, and only needs to arrange the temperature sensor array on the plurality of preset positions of the intelligent quilt, so that the installation process of the kicking monitoring device is greatly simplified.

Description

Technical Field

[0001] This application relates to the field of smart quilt technology, and in particular to a quilt kicking sensor circuit and a smart quilt. Background Technology

[0002] To facilitate monitoring of users kicking off their blankets while sleeping, especially for children, existing technologies typically employ image acquisition devices placed around the bed for behavioral monitoring. However, this approach suffers from technical issues such as privacy violations and low accuracy at night. Furthermore, existing monitoring devices often require complex installation and setup processes, increasing user costs and inconvenience. Utility Model Content

[0003] The main purpose of this invention is to provide a kick-and-cover sensor circuit, which aims to improve the accuracy of kick-and-cover monitoring, avoid privacy leaks, and simplify the installation process of the kick-and-cover monitoring device.

[0004] To achieve the above objectives, this utility model provides a blanket-kicking sensor circuit for use in smart blankets. The blanket-kicking sensor circuit includes:

[0005] A temperature sensor array, wherein the temperature sensor array is disposed at multiple preset positions on the smart quilt;

[0006] A control circuit, wherein the signal input terminal of the control circuit is connected to the output terminal of the temperature sensor array;

[0007] A wireless circuit, the communication terminal of which is connected to the communication terminal of the control circuit, is used to access a user terminal.

[0008] Optionally, the temperature sensor array includes multiple temperature sensor chips;

[0009] Each of the temperature sensor chips has a signal output terminal and two address setting terminals, which are selectively left floating, grounded, or connected to the input terminal of the control circuit.

[0010] Optionally, adjacent temperature sensor chips are connected in series in pairs.

[0011] Optionally, the wireless circuit includes:

[0012] The WiFi chip has a first resistor connected between its transmitting end and the receiving end of the control circuit, a second resistor connected between its receiving end and the transmitting end of the control circuit, and at least one capacitor connected in parallel between its power input terminal and ground. The WiFi chip has a frequency of 2.4 GHz.

[0013] Optionally, the kick sensor circuit further includes:

[0014] A reference temperature circuit, the output terminal of which is connected to the reference signal terminal of the control circuit;

[0015] The reference temperature circuit includes:

[0016] The third resistor has a fourth resistor connected in series between its first end and ground, and its second end is connected to the first reference signal terminal of the control circuit.

[0017] The fifth resistor has its first end connected to the second reference signal terminal of the control circuit, and its second end connected to the common node of the third and fourth resistors.

[0018] Optionally, the kick sensor circuit further includes:

[0019] Battery;

[0020] A charging management circuit, wherein the power input terminal of the charging management circuit is used to connect to an external power source, and the output terminal of the charging management circuit is used to connect to the battery;

[0021] The main power supply circuit has its power input terminal connected to the battery and its output terminal connected to the power input terminal of the control circuit.

[0022] Optionally, the charging management circuit includes:

[0023] A charging chip, wherein the power input terminal of the charging chip is used to connect to an external power source, the charging current output terminal of the charging chip is connected to the battery, and at least one capacitor is connected in parallel between the charging current output terminal of the charging chip and ground.

[0024] The sixth resistor has its first end connected to the management terminal of the charging chip and its second end grounded.

[0025] The charging indicator light has its negative terminal connected to the drain of the charging chip, and a seventh resistor is connected in series between the positive terminal of the charging indicator light and the power input terminal of the charging chip.

[0026] Optionally, the main power supply circuit includes:

[0027] The battery terminal has a first end grounded and a second end connected to the positive terminal of the battery.

[0028] The main power chip has an eighth resistor connected in series between its input terminal and the second terminal of the battery terminal, and the input terminal and the enable terminal of the main power chip are connected.

[0029] The ninth resistor has a tenth resistor connected in series between its first end and the input terminal of the main power chip, and its second end is grounded.

[0030] The eleventh resistor has its first end connected to the power control terminal of the control circuit, and its second end connected to the common node of the ninth and tenth resistors.

[0031] Optionally, the kick sensor circuit further includes:

[0032] A sleep switch circuit, wherein the controlled terminal of the sleep switch circuit is connected to the sleep control terminal of the control circuit, the first conducting terminal of the sleep switch circuit is connected to the output terminal of the main power supply circuit, and the second conducting terminal of the sleep switch circuit is connected to the power supply terminal of the wireless circuit.

[0033] The sleep switch circuit includes:

[0034] The first transistor has a twelfth resistor connected in series between its base and the sleep control terminal of the control circuit, and its emitter is grounded.

[0035] The first switching transistor has a thirteenth resistor connected in series between its gate and the collector of the first transistor, a fourteenth resistor connected in parallel between its gate and drain, its drain connected to the output terminal of the main power supply circuit, and its source connected to the power supply terminal of the wireless circuit.

[0036] In addition, to achieve the above objectives, this utility model also provides a smart quilt, comprising:

[0037] Comforter insert; and

[0038] The blanket kicking sensor circuit described above; the blanket kicking sensor circuit includes a temperature sensor array, which is arranged in a preset manner on the blanket core.

[0039] This invention applies a blanket-kicking sensor circuit to a smart blanket. The circuit incorporates a temperature sensor array, a control circuit, and a wireless circuit. The temperature sensor array is positioned at multiple preset locations on the smart blanket. The signal input of the control circuit is connected to the output of the temperature sensor array, transmitting the temperature signals collected by the array to the control circuit. The wireless circuit is then connected to the communication terminal of the control circuit and connected to a user terminal. This allows for real-time monitoring of blanket-kicking behavior during sleep, transmitting the monitoring data to the user terminal. This enables accurate monitoring of blanket-kicking behavior, and the installation process is greatly simplified by only requiring the temperature sensor array to be positioned at multiple preset locations on the smart blanket. Attached Figure Description

[0040] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0041] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is a circuit block diagram of a kick sensor circuit according to an embodiment of the present invention;

[0043] Figure 2 for Figure 1 A schematic diagram showing the location and structure of a temperature sensor array in a smart quilt;

[0044] Figure 3 This is a circuit block diagram of a kick sensor circuit according to another embodiment of the present invention;

[0045] Figure 4 for Figure 3 A schematic diagram of the connection structure of multiple temperature sensor chips in the diagram;

[0046] Figure 5 This is a circuit block diagram of a kick sensor circuit according to another embodiment of the present invention;

[0047] Figure 6 This is a circuit block diagram of a kick sensor circuit according to another embodiment of the present invention;

[0048] Figure 7 This is a circuit block diagram of a kick sensor circuit according to another embodiment of the present invention;

[0049] Figure 8 for Figure 7 The circuit diagram of the reference temperature circuit in the image;

[0050] Figure 9 This is a circuit block diagram of a kick sensor circuit according to another embodiment of the present invention;

[0051] Figure 10 This is a circuit block diagram of a kick sensor circuit according to another embodiment of the present invention;

[0052] Figure 11 This is a circuit block diagram of a kick sensor circuit according to another embodiment of the present invention;

[0053] Figure 12 This is a circuit block diagram of a kick sensor circuit according to another embodiment of the present invention;

[0054] Figure 13 for Figure 12 The circuit diagram of the sleep switch circuit in the middle;

[0055] Figure 14 This is a schematic diagram of the structure of a smart quilt according to an embodiment of the present invention.

[0056] Explanation of icon numbers:

[0057]

[0058] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0059] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Well-known modules, units, and their connections, links, communications, or operations are not shown or described in detail. Furthermore, the described features, architectures, or functions can be combined in any way in one or more embodiments. Those skilled in the art should understand that the various embodiments described below are only for illustration and not for limiting the scope of protection of the present utility model. It is also readily understood that the modules or units or processing methods in the various embodiments described herein and shown in the accompanying drawings can be combined and designed in various different configurations. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0060] The definitions of various terms or methods used in the following embodiments are, except where logically impossible, generally defined as broad concepts that can be implemented under the premise of the content disclosed in the embodiments. Under this understanding, all specific subordinate limitations of the terms or methods should be regarded as part of the utility model content of this utility model, and should not be narrowly interpreted or biased on the grounds that the specification does not disclose the specific limitation. Similarly, provided that it is logically feasible, the order of the steps in the method is flexible and variable, and all specific subordinate limitations in the broad concepts of various terms or methods fall within the scope of protection of this utility model.

[0061] To facilitate monitoring of users kicking off their blankets while sleeping, especially for children, current technologies typically employ image acquisition devices placed around the bed. However, this method has significant technical drawbacks. First, at night, insufficient light significantly reduces the accuracy of the image acquisition devices, making it difficult to accurately capture blanket-kicking behavior. Second, the use of image acquisition devices raises privacy concerns, particularly in home environments, potentially causing user anxieties about privacy breaches. Furthermore, existing monitoring devices often require complex installation and setup processes, increasing user costs and inconvenience.

[0062] The main solution of this application embodiment is: by applying the kick-off sensor circuit to a smart quilt, and by designing a temperature sensor array, a control circuit and a wireless circuit in the kick-off sensor circuit, wherein the temperature sensor array is set at multiple preset positions of the smart quilt, and then the signal input terminal of the control circuit is connected to the output terminal of the temperature sensor array to output the temperature signal collected by the temperature sensor array to the control circuit, and then the communication terminal of the wireless circuit is connected to the communication terminal of the control circuit, and the wireless circuit is connected to the user terminal.

[0063] This application provides a solution that can monitor in real time whether a user kicks off the covers during sleep and send the monitoring data to the user terminal in real time, thereby achieving accurate monitoring of the user's blanket-kicking behavior. Moreover, it only requires setting the temperature sensor array in multiple preset positions on the smart blanket. The overall structure is simple and easy to install and use, greatly simplifying the installation process of the blanket-kicking monitoring device.

[0064] In existing technologies, to facilitate monitoring of users kicking off their blankets while sleeping, especially for children, image acquisition devices are typically installed around the bed for behavioral monitoring. This approach poses privacy risks, and the monitoring accuracy of the image acquisition devices is significantly reduced at night when ambient light is insufficient, making it difficult to accurately identify changes in blanket coverage.

[0065] To address the aforementioned issues, considering that temperature changes directly reflect the contact state between the human body and bedding, the exploration of non-visual sensing technologies to replace image acquisition began. Analysis revealed that when a person leaves the area covered by bedding, the temperature difference between the body surface and the environment creates a detectable signal. Based on this, the concept of a distributed temperature monitoring network was gradually developed. This involves deploying temperature sensing nodes inside the bedding to construct a temperature field monitoring system whose coverage area is correlated with the human posture. Ultimately, a technical approach was established to determine blanket-kicking behavior through the fusion of multi-node temperature data, while simultaneously utilizing wireless transmission technology to achieve real-time feedback of the monitoring results.

[0066] It should be noted that the blanket-kicking sensor circuit in this embodiment is applied to a smart blanket.

[0067] Based on the above, referring to Figure 1 and Figure 2 In one embodiment of this utility model, the kick sensor circuit includes a temperature sensor array 10, a control circuit 20, and a wireless circuit 30, wherein:

[0068] The temperature sensor array 10 is located at multiple preset positions on the smart quilt; the signal input terminal of the control circuit 20 is connected to the output terminal of the temperature sensor array 10; the communication terminal of the wireless circuit 30 is connected to the communication terminal of the control circuit 20, and the wireless circuit 30 is used to access the user terminal.

[0069] The temperature sensor array 10 refers to a collection of temperature monitoring units distributed across different areas of the object. It can be implemented using surface-mount digital temperature sensors, with each sensor node covering a specific monitoring area. The control circuit 20 is a microcontroller module with signal acquisition and processing functions. Specifically, it can be implemented using a low-power MCU with an integrated analog-to-digital converter, such as an STM32 or HK32, to receive temperature data from each sensor node. The wireless circuit 30 is a communication module that enables remote data transmission. It can be implemented using a chipset supporting Bluetooth Low Energy or WiFi protocols to establish a network connection with the control terminal.

[0070] Multiple temperature sensors are embedded inside the blanket at predetermined intervals, forming a detection network covering the main torso area. When the blanket is kicked off, the sensors at the exposed areas will detect abnormal changes in the temperature gradient. The control circuit 20 collects temperature data from each node through polling to establish a temperature distribution model. When the temperature value in a specific area is continuously detected to be lower than a set threshold, it is determined that the blanket coverage is abnormal. The wireless communication module encodes the status information and sends it to the monitoring terminal, triggering an alarm signal.

[0071] Compared to existing technologies, traditional image monitoring solutions rely on optical imaging equipment, which poses risks of privacy breaches and is limited by ambient lighting conditions. This solution replaces visual monitoring with thermal radiation detection, achieving all-weather monitoring by utilizing temperature field changes while fully protecting user privacy. The distributed layout of the sensor array effectively improves detection sensitivity and avoids the misjudgment problems that may occur with a single sensor.

[0072] Through the aforementioned technical means, this embodiment significantly improves the reliability of nighttime monitoring while addressing privacy concerns. The temperature sensor network can accurately capture changes in bedding coverage, the data processing algorithm of the control circuit 20 effectively distinguishes between normal turning over and abnormal kicking of the blankets, and the wireless transmission module ensures that monitoring personnel can obtain accurate status information in a timely manner.

[0073] Optionally, refer to Figure 3 and Figure 4 Another embodiment of this utility model provides a kick sensor circuit, based on the above. Figure 1 and Figure 2 In the embodiment shown, the temperature sensor array 10 includes a plurality of temperature sensor chips 11, wherein:

[0074] Each of the temperature sensor chips 11 has a signal output terminal and two address setting terminals, which are selectively left floating, grounded, or connected to the input terminal of the control circuit 20.

[0075] The address setting terminal refers to the physical interface used to set the unique identifier of the sensor chip. It can be implemented using reserved pins of a dual in-line package chip, forming a binary address code through different level combinations. The selective floating, grounding, or connection control circuit 20 refers to directly changing the electrical state of the address setting terminal through circuit routing. This can be implemented using jumper connections or PCB routing design, completing address allocation without relying on software protocols. For example... Figure 3 As shown, the DIO terminal on the temperature sensor chip 11 is the signal output terminal, and AD0 and AD1 are the address setting terminals.

[0076] In this design, the two address setting terminals of the temperature sensor chip 11 form a three-bit binary combination state through a pre-designed hardware connection. For example, when both address setting terminals are floating, the corresponding address is 00; when one terminal is grounded and the other is floating, the corresponding address is 01; and when both terminals are grounded, the corresponding address is 11. The address code of each chip is directly fixed through physical circuitry. The control circuit 20 can locate the sensor position from which the temperature data originates by detecting the address identifier in the data packets transmitted from each signal output terminal. This hardware address allocation method avoids the risk of address conflicts in traditional bus communication and simplifies the computational resources required for the control circuit 20 to parse the data.

[0077] Compared to existing technologies, the temperature sensor array 10 using physical address encoding detects kicking behavior through a non-visual perception method, eliminating privacy concerns and improving monitoring accuracy through multi-point temperature data fusion. Compared to sensor networks requiring dedicated address encoders, this embodiment directly generates addresses using hardware pin states, reducing the number of external circuit components.

[0078] Through the aforementioned technical means, this embodiment achieves precise positioning of sensor nodes via a physical address encoding mechanism while avoiding privacy leaks, thus solving the problem of limited monitoring range of traditional single sensors. Multi-sensor collaborative operation can accurately identify sudden changes in local temperature within the blanket, improving the accuracy of nighttime blanket-kicking monitoring. The hardware-level address allocation method reduces the complexity of the communication protocol, enabling the control circuit 20 to quickly parse data from each node, meeting the real-time monitoring needs of the smart blanket.

[0079] Optionally, refer to Figure 5 Another embodiment of this utility model provides a kicking sensor circuit, based on the above. Figure 3 and Figure 4 In the embodiment shown, adjacent temperature sensor chips 11 are connected in series in pairs.

[0080] Adjacent temperature sensor chips 11 refer to two temperature sensor chips 11 that are physically adjacent to each other. This can be achieved by using adjacent mounting areas on the same printed circuit board or by continuous arrangement on the same flexible substrate, thus shortening the connection distance between the chips. Series connection refers to directly connecting the signal output terminal of one temperature sensor chip 11 to the input terminal of the next temperature sensor chip 11 via wires. This can be achieved by soldering or bonding with conductive adhesive. This connection method allows multiple chips to share the same signal transmission path, avoiding the need for separate circuits for each chip.

[0081] In the temperature sensor array 10, each temperature sensor chip 11 forms a series link with its adjacent temperature sensor chips 11 through only two signal nodes. The signal transmission channel extends from the input terminal of the first chip to the output terminal of the last chip, forming a single continuous path. The control circuit 20 sends unified commands to all chips through this path and receives temperature data transmitted via the series link. The length of the wires between adjacent chips is limited to a preset range, for example, no more than 5 cm, to reduce the impact of line impedance on signal integrity. When a chip fails, its adjacent chips before and after it can still maintain the continuity of the signal channel through bypass.

[0082] In the temperature sensor array 10, adjacent temperature sensor chips 11 can be connected in pairs to form a series closed loop, so that the system can still operate normally if any one of the temperature sensor chips 11 fails.

[0083] Compared to existing technologies, current temperature sensor arrays 10 mostly employ a star topology, requiring each chip to be individually connected to the control circuit 20, resulting in complex wiring and accumulated line impedance. This embodiment, however, constructs a chain topology through series connections, reducing the total signal transmission path length by approximately 60%–80% and lowering the line impedance to less than one-third of the original parallel structure. The electromagnetic interference problem caused by bridging lines in existing technologies is significantly improved in this embodiment due to the reduced number of lines.

[0084] Through the aforementioned technical means, this embodiment simplifies the wiring structure of the temperature sensor array 10, reduces the number of line connection points, and lowers signal attenuation caused by line impedance. The redundant paths formed by series connections enhance the fault tolerance of the sensor array, maintaining basic system functions even in the event of a single chip failure. Signal transmission efficiency is improved through optimized path topology, enabling the control circuit 20 to complete data acquisition with lower power consumption, which is a significant advantage for smart quilt devices powered by battery 50.

[0085] Optionally, refer to Figure 6 Another embodiment of this utility model provides a kicking sensor circuit, based on the above. Figure 1 In the embodiment shown, wireless circuit 30 includes WiFi chip U1, wherein:

[0086] A first resistor R1 is connected between the transmitting end of the WiFi chip U1 and the receiving end of the control circuit 20, and a second resistor R2 is connected between the receiving end of the WiFi chip U1 and the transmitting end of the control circuit 20. At least one capacitor is connected in parallel between the power input terminal of the WiFi chip U1 and ground. The frequency of the WiFi chip U1 is 2.4GHz.

[0087] The WiFi chip U1 is a wireless communication module supporting the IEEE 802.11 protocol. It can be implemented using a low-power chip with integrated RF transceiver functionality and is used to establish a data transmission channel with the control terminal. The first resistor R1 is a current-limiting element connected in series in the transmitting signal path; for example, a 1kΩ surface-mount resistor can be used to match the signal level between the control circuit 20 and the WiFi chip U1. The second resistor R2 is a matching element connected in series in the receiving signal path; for example, a 2kΩ precision resistor can be used to eliminate waveform distortion caused by signal reflection. The parallel capacitors are a combination of multiple decoupling capacitors with different capacitance values. Specifically, a 0.1μF ceramic capacitor and a 10μF electrolytic capacitor can be connected in parallel to filter out high-frequency noise and low-frequency ripple in the power supply line. The 2.4GHz frequency refers to the operating frequency of the ISM unlicensed band and can be implemented using a modulation method supporting a 20MHz channel bandwidth, ensuring transmission speed while maintaining compatibility with mainstream smart home devices.

[0088] Specifically, a first resistor R1 and a second resistor R2 are installed between the control circuit 20 and the WiFi chip U1 to ensure that the signal levels at the transmitting and receiving ends are matched, preventing signal overshoot or attenuation due to impedance mismatch. Multiple capacitors are connected in parallel at the power input terminal. Through combinations of capacitors with different capacitance values, low-impedance paths are formed in both the low-frequency and high-frequency bands, effectively suppressing the impact of power fluctuations on the RF circuit. When operating in the 2.4GHz band, the strong penetration of this band can be utilized to maintain a stable signal transmission distance in typical indoor environments. Simultaneously, the chip's built-in low-power mode automatically reduces transmission power during inactive periods.

[0089] Compared to existing technologies, traditional solutions using Bluetooth modules suffer from limited communication distance, while using ZigBee modules requires additional coordinator equipment. This embodiment directly utilizes the WiFi chip U1 with automatic networking capabilities, achieving stable communication without the need for additional repeater equipment through hardware optimization of resistor matching and capacitor filtering. Compared to designs using independent signal conditioning circuits, this embodiment integrates noise suppression functionality into the interface resistor and power supply filtering structure, reducing the number of discrete components.

[0090] Through the aforementioned technical means, this embodiment achieves interference suppression and power consumption optimization of the wireless transmission module. Resistor matching of the signal interface reduces the communication bit error rate, multiple capacitor filters ensure stable operation of the WiFi chip U1 in complex electromagnetic environments, and the selection of the 2.4GHz frequency band ensures transmission distance while avoiding the additional power consumption associated with higher frequencies. This solution, through simplified hardware design, simultaneously meets the requirements for anti-interference performance and low power consumption in a single-chip architecture, making it suitable for monitoring equipment requiring long-term continuous operation.

[0091] Optionally, refer to Figure 7 In another embodiment of this utility model, a kick sensor circuit is provided, based on the above. Figure 1 In the embodiment shown, the kick sensor circuit further includes a reference temperature circuit 40, wherein:

[0092] The output terminal of the reference temperature circuit 40 is connected to the reference signal terminal of the control circuit 20;

[0093] The reference temperature circuit 40 is a circuit module used to generate a stable reference voltage. It can be implemented using a voltage divider resistor network, and the reference voltage output is determined by the matching relationship of the resistor values. The third resistor R8NT1 and the fourth resistor NT1 are two voltage divider resistors connected in series. They can be implemented using surface-mount resistors, and the value of the reference voltage is adjusted by changing the ratio of the two resistor values. The fifth resistor R5 is a connection resistor connected between the voltage divider node and the second reference signal terminal. It can be implemented using a surface-mount resistor to ensure that the two reference signal terminals have the same reference potential.

[0094] Optionally, refer to Figure 8 The reference temperature circuit 40 includes a third resistor R8NT1 and a fifth resistor R5, wherein:

[0095] A fourth resistor NT1 is connected in series between the first end of the third resistor R8NT1 and ground. The second end of the third resistor R8NT1 is connected to the first reference signal terminal of the control circuit 20. The first end of the fifth resistor R5 is connected to the second reference signal terminal of the control circuit 20. The second end of the fifth resistor R5 is connected to the common node of the third resistor R8NT1 and the fourth resistor NT1.

[0096] In this system, the third resistor R8NT1 and the fourth resistor NT1 are connected in series to form a voltage divider network. A first reference voltage signal is generated at the second terminal of the third resistor R8NT1, and this voltage value depends on the resistance ratio of the two resistors. The fifth resistor R5 transfers the common node potential of the third resistor R8NT1 and the fourth resistor NT1 to the second reference signal terminal, ensuring that the two reference signal terminals have the same reference. When the power supply voltage fluctuates, the resistance ratio of the third resistor R8NT1 and the fourth resistor NT1 remains constant, and the voltage divider output remains stable. The bridging method of the fifth resistor R5 eliminates the potential difference between the two reference signal terminals, avoiding detection errors caused by inconsistent reference potentials during signal transmission.

[0097] Compared to existing technologies, which typically use a single voltage divider resistor or an independent reference source to generate the reference signal, reference drift is prone to occur when power supply fluctuates or temperature changes. This embodiment uses a dual-resistor voltage divider combined with a common node bridging method to ensure that the two reference signal terminals always follow the same voltage divider node potential, so that the two reference signals can remain synchronized and stable even in the presence of external interference.

[0098] Through the above technical means, this embodiment solves the problem of temperature detection reference signal drift caused by power fluctuations or circuit noise, ensuring that the temperature sensor array 10 has a unified reference benchmark when collecting data, thereby improving the accuracy of blanket kicking status monitoring.

[0099] Optionally, refer to Figure 9 Another embodiment of this utility model provides a kick sensor circuit, based on the above. Figure 1 The embodiment shown further includes a battery 50, a charging management circuit 60, and a main power supply circuit 70, wherein:

[0100] The power input terminal of the charging management circuit 60 is used to connect to an external power source, and the output terminal of the charging management circuit 60 is used to connect to the battery 50; the power input terminal of the main power circuit 70 is connected to the battery 50, and the output terminal of the main power circuit 70 is connected to the power input terminal of the control circuit 20.

[0101] Here, battery 50 refers to a rechargeable energy storage unit, which can be implemented using a lithium-ion battery 50 or a polymer battery 50. It provides basic power to the circuit, enabling the device to operate independently without an external power source, thus improving the device's portability. Charging management circuit 60 is an integrated circuit module that controls the charging and discharging process of battery 50. Specifically, it can be implemented using a charging chip U2 with overvoltage protection. Circuit isolation prevents external power fluctuations from damaging battery 50, achieving stable charging. Main power circuit 70 is a voltage conversion and distribution module, which can be implemented using a low-dropout linear regulator. It converts the battery 50 voltage into the operating voltage required by control circuit 20, ensuring the stability of the core module's power supply.

[0102] In this system, battery 50 serves as the basic energy storage unit, providing power reserves for the entire system. When an external power source is connected, the charging management circuit 60 automatically initiates the charging process, controlling the charging current and voltage through internal chip logic to prevent overcharging. The main power circuit 70 continuously converts the output voltage of battery 50 to the voltage range applicable to the control circuit 20, for example, converting the 3.7V lithium battery 50 output to a 3.3V logic level. When the external power source is disconnected, battery 50 maintains the normal operation of control circuit 20 and temperature sensor array 10 through the main power circuit 70, ensuring the continuous operation of the monitoring function. The charging management circuit 60 and the main power circuit 70 form a two-level power management system; the former ensures the safe charging of battery 50, while the latter achieves efficient power distribution.

[0103] Compared to existing technologies, traditional solutions typically employ direct connection to an external power source or use a non-rechargeable battery 50, which suffers from wiring limitations and frequent battery replacements. This embodiment, through a combination of a built-in rechargeable battery 50 and intelligent management circuitry, eliminates the constraints of power cords, improving ease of use, and extends the device's continuous operating time through automatic charging management. Compared to sensor circuits that rely solely on external power, this embodiment can maintain monitoring functionality for at least 48 hours even during power outages.

[0104] Through the aforementioned technical means, this embodiment achieves uninterrupted power supply to the quilt-kicking monitoring device, avoiding monitoring function failure due to power interruption. The charging management circuit 60 effectively extends the lifespan of the battery 50 and reduces maintenance frequency. The main power circuit 70 ensures that the control circuit 20 can still operate stably when the battery 50 voltage fluctuates, improving the reliability of monitoring data acquisition. The entire power system can complete charging and discharging cycles without user intervention, significantly improving the ease of use of the smart quilt.

[0105] Optionally, refer to Figure 10 Another embodiment of this utility model provides a kicking sensor circuit, based on the above. Figure 9 In the embodiment shown, the charging management circuit 60 includes a charging chip U2, a sixth resistor R18, and a charging indicator light D1, wherein:

[0106] The power input terminal of the charging chip U2 is used to connect to an external power source. The charging current output terminal of the charging chip U2 is connected to the battery 50. At least one capacitor is connected in parallel between the charging current output terminal of the charging chip U2 and ground. The first terminal of the sixth resistor R18 is connected to the management terminal of the charging chip U2, and the second terminal of the sixth resistor R18 is grounded. The negative terminal of the charging indicator D1 is connected to the drain terminal of the charging chip U2, and a seventh resistor R17 is connected in series between the positive terminal of the charging indicator D1 and the power input terminal of the charging chip U2.

[0107] The charging chip U2 is an integrated circuit that converts external electrical energy into a charging current suitable for battery 50. It can be implemented using a power management chip with constant current and constant voltage control functions. Its input terminal is connected to the external power supply, and its output terminal is directly connected to battery 50. The parallel capacitor is a filter element placed between the charging current output terminal and ground. It can be implemented using multilayer ceramic capacitors or aluminum electrolytic capacitors to absorb high-frequency ripple generated during charging. The sixth resistor R18 is a current setting element connected between the management terminal of the charging chip U2 and ground. It can be implemented using a 1% precision metal film resistor and is used to adjust the reference current parameter of the charging chip U2. The charging indicator D1 is a light-emitting device that reflects the charging status. It can be implemented using surface-mount LED beads. Its positive terminal is connected to the power input terminal through the seventh resistor R17, and its negative terminal is connected to the drain of the charging chip U2 to form a current loop.

[0108] When an external power source is connected to the input terminal of the charging chip U2, the charging chip U2 adjusts its output current characteristics according to the set value of the sixth resistor R18 connected to the management terminal, enabling the battery 50 to complete charging in a constant current and constant voltage mode. Multiple capacitors connected in parallel at the charging current output terminal filter high-frequency noise in the current, preventing voltage fluctuations from affecting the battery 50's lifespan. The seventh resistor R17 limits the current flowing through the charging indicator D1. When the charging chip U2 is in operation, changes in the drain voltage drive the indicator light to illuminate. The indicator light remains constantly lit during charging and turns off when fully charged, thus providing visual feedback on the charging status.

[0109] Compared to existing technologies, traditional charging circuits typically lack current noise suppression measures, resulting in insufficient charging stability, and they also lack an independent charging status indicator module. This embodiment suppresses high-frequency interference through a parallel capacitor, precisely adjusts charging parameters through a sixth resistor R18, and simultaneously constructs a feedback loop consisting of a seventh resistor R17 and an indicator light, achieving full-cycle monitoring of the charging process under the same power consumption.

[0110] Through the above technical means, this embodiment effectively solves the problem of current fluctuation during the charging process of the battery 50 in the smart quilt. It ensures charging stability through a dual mechanism of hardware filtering and parameter adjustment. At the same time, it uses a combination of resistor current limiting and drain voltage driving to build a low-power status indication system, which can intuitively display the charging process while avoiding the risk of overcharging.

[0111] Optionally, refer to Figure 11 Another embodiment of this utility model provides a kicking sensor circuit, based on the above. Figure 9 In the embodiment shown, the main power supply circuit 70 includes a battery terminal P2, a main power chip U3, a ninth resistor R21, and an eleventh resistor R19, wherein:

[0112] The first end of the battery terminal P2 is grounded, and the second end of the battery terminal P2 is connected to the positive terminal of the battery 50. An eighth resistor F2 is connected in series between the input terminal of the main power chip U3 and the second end of the battery terminal P2. The input terminal and the enable terminal of the main power chip U3 are connected. A tenth resistor R20 is connected in series between the first end of the ninth resistor R21 and the input terminal of the main power chip U3. The second end of the ninth resistor R21 is grounded. The first end of the eleventh resistor R19 is connected to the power control terminal of the control circuit 20. The second end of the eleventh resistor R19 is connected to the common node of the ninth resistor R21 and the tenth resistor R20.

[0113] Among them, battery terminal P2 is a metal contact used to establish the physical connection between battery 50 and main power chip U3. It can be implemented using a copper spring sheet or soldered terminals to ensure reliable conductivity between battery 50 and the circuit. The eighth resistor F2 is a current-limiting element connected in series between battery 50 and the input terminal of main power chip U3. It can be implemented using a surface-mount resistor to limit the inrush current when main power chip U3 starts up. The main power chip U3 is the core device for voltage conversion and regulation. It can be implemented using a DC-DC converter chip such as TPS63020. The direct connection between its input terminal and enable terminal allows it to automatically enter working state when powered on. The ninth resistor R21 and the tenth resistor R20 are series resistors forming the voltage divider network. They can be implemented using precision resistors to generate a reference voltage signal at the common node. The eleventh resistor R19 is a signal coupling element connecting the power control terminal of control circuit 20 to the voltage divider network. It can be implemented using a thin-film resistor to introduce external control signals into the voltage divider network to adjust the operating mode of main power chip U3.

[0114] In this circuit, battery terminal P2 connects the positive terminal of battery 50 to the input terminal of main power chip U3. The eighth resistor F2 limits the initial current surge, preventing damage to main power chip U3 due to instantaneous overcurrent. The enable terminal of main power chip U3 is directly connected to the input terminal, activating it immediately upon battery 50 connection and initiating voltage conversion without additional control signals. The ninth resistor R21 and the tenth resistor R20 are connected in series to form a voltage divider structure, generating a fixed-ratio voltage value at the common node, providing a stable reference for the internal feedback loop of main power chip U3. The eleventh resistor R19 couples the power management signal output from control circuit 20 to the voltage divider network node. When the sensor circuit enters low-power mode, the control signal dynamically adjusts the output voltage of main power chip U3 or shuts down unnecessary power supply modules by changing the voltage divider ratio, thereby reducing overall power consumption. The matching design of each resistor parameter balances power conversion efficiency and system response speed, ensuring an optimal balance between power supply stability and energy consumption optimization.

[0115] Compared to existing technologies, traditional main power supply circuits 70 typically employ fixed voltage divider resistors and independent enable control circuits, which cannot dynamically adjust power supply parameters according to system status, resulting in high static power consumption. This embodiment directly couples the control signal to the voltage divider network, enabling the main power chip U3 to switch its operating mode in real time according to system needs. For example, it reduces the output voltage in standby mode to reduce energy loss. Simultaneously, it omits the independent enable signal control circuit, simplifying the circuit structure and reducing the number of components.

[0116] Through the aforementioned technical means, this embodiment achieves efficient management of the main power supply system of the blanket-kicking sensor circuit in the smart blanket. By dynamically adjusting the voltage divider network parameters to optimize the working state of the main power chip U3, while ensuring stable power supply to the temperature sensor array 10 and the control circuit 20, the system's standby power consumption is significantly reduced, extending the battery life of 50. Furthermore, the coordinated design of the current-limiting resistor and the voltage divider network avoids interference from voltage fluctuations to sensitive electronic components, improving the reliability of circuit operation.

[0117] Optionally, refer to Figure 12 In another embodiment of this utility model, a kick sensor circuit is provided, based on the above. Figure 9 In the embodiment shown, the kick sensor circuit further includes a sleep switch circuit 80, wherein:

[0118] The controlled terminal of the sleep switch circuit 80 is connected to the sleep control terminal of the control circuit 20, the first conducting terminal of the sleep switch circuit 80 is connected to the output terminal of the main power supply circuit 70, and the second conducting terminal of the sleep switch circuit 80 is connected to the power supply terminal of the wireless circuit 30.

[0119] Among them, the sleep switch circuit 80 refers to the hardware circuit structure that cuts off the power supply path of the wireless module through a physical switching device. It can be implemented by a combination of transistors and field-effect transistors, and the physical isolation of the power channel is achieved by controlling the on and off of the control signal.

[0120] Optionally, refer to Figure 13 The sleep switch circuit 80 includes a first transistor Q2 and a first switching transistor Q1, wherein:

[0121] A twelfth resistor R26 is connected in series between the base of the first transistor Q2 and the sleep control terminal of the control circuit 20, and the emitter of the first transistor Q2 is grounded; a thirteenth resistor R25 is connected in series between the gate of the first switch Q1 and the collector of the first transistor Q2, a fourteenth resistor R24 ​​is connected in parallel between the gate and drain of the first switch Q1, the drain of the first switch Q1 is connected to the output terminal of the main power supply circuit 70, and the source of the first switch Q1 is connected to the power supply terminal of the wireless circuit 30.

[0122] The twelfth resistor, R26, is an electronic component used for current limiting and voltage adjustment. It can be implemented using a 4.7kΩ surface-mount resistor, and its function is to convert the control signal into a level suitable for driving the transistor's base. The thirteenth and fourteenth resistors, R25 and R24, are electronic components that form the gate drive network. They can be implemented using 10kΩ and 100kΩ surface-mount resistors, respectively. Their function is to provide a stable bias voltage for the MOSFET and establish a path for gate charge discharge.

[0123] When the control circuit 20 outputs a high level through the sleep control terminal, the twelfth resistor R26 transmits the level signal to the base of the first transistor Q2, turning it on. At this time, the collector voltage of the first transistor Q2 is pulled low, causing the bias network composed of the thirteenth resistor R25 and the fourteenth resistor R24 ​​to apply a low level to the gate of the first switch Q1, turning the first switch Q1 off and thus cutting off the power supply connection between the main power supply circuit 70 and the wireless circuit 30. When wireless communication needs to be activated, the control circuit 20 outputs a low level to turn off the first transistor Q2. At this time, the voltage output by the main power supply circuit 70 forms a voltage divider through the thirteenth resistor R25 and the fourteenth resistor R24, driving the first switch Q1 to turn on and restoring the power supply to the wireless circuit 30. This process directly controls the power supply through a hardware switch, resulting in lower standby power consumption compared to the software sleep mode.

[0124] Compared to existing technologies, traditional smart devices typically use software to control the wireless module to enter a low-power mode, but this cannot completely eliminate leakage current losses in standby mode. This embodiment completely cuts off the power supply circuit of the wireless module through a physical switching device, achieving zero current consumption in sleep mode. For example, in existing technologies, WiFi modules still have approximately 2mA of standby current when in software sleep mode, while this embodiment completely eliminates the sleep current of the wireless module.

[0125] Through the aforementioned technical means, this embodiment can automatically cut off the power supply to the wireless communication module when the user is not using the smart blanket, eliminating unnecessary power consumption in standby mode. This solution extends the battery life of 50 by approximately 30% in non-use scenarios, while maintaining the normal operation of the temperature sensor array 10 and ensuring that basic monitoring functions are not affected.

[0126] Please refer to Figure 14 As shown, this utility model also proposes a smart quilt, which includes a quilt core 90 and a kick-off sensor circuit as described in all the above embodiments. The kick-off sensor circuit includes a temperature sensor array 10, wherein:

[0127] The temperature sensor array 10 is arranged in a preset manner on the quilt core 90.

[0128] It is worth noting that since the smart quilt of this utility model is based on the above-mentioned kick-off sensor circuit, the embodiments of the smart quilt of this utility model include all the technical solutions of all the embodiments of the above-mentioned kick-off sensor circuit, and the technical effects achieved are exactly the same, so they will not be repeated here.

[0129] The quilt core 90 refers to the internal filling or main structural layer of the quilt, used to provide insulation and support the installation of the temperature sensor array 10. It can be made of cotton, down, or synthetic fiber materials. The temperature sensor array 10 is a collection of multiple temperature sensing elements used to collect temperature data from different areas of the quilt. It can be implemented using a digital temperature sensor chip 11. The preset arrangement refers to the sensor layout strategy pre-designed based on the distribution characteristics of human body heat sources. Specifically, it can be implemented using a "large" shaped, matrix, ring, or radial arrangement.

[0130] When a user is covered by the blanket, the temperature sensor array 10 inside the blanket core 90 monitors temperature changes in the covered area in real time. When the blanket is kicked off, the temperature of the exposed area drops rapidly, and the sensors in the uncovered areas detect this temperature drop, processing the data to determine if the kicking action occurred. The preset arrangement of the temperature sensor array 10 ensures that the sensors cover key monitoring areas such as the head, torso, and lower limbs, enabling behavior recognition through dynamic changes in multi-point temperature data. The sensors are directly embedded inside the blanket core 90, avoiding interference from external devices and eliminating privacy concerns that might arise from image acquisition.

[0131] Compared to existing technologies, traditional solutions rely on cameras or infrared imaging devices to monitor users' sleep postures. These methods are susceptible to reduced recognition rates due to insufficient light at night, and continuous recording may compromise user privacy. This embodiment replaces optical monitoring with temperature detection, eliminating reliance on external light conditions and effectively avoiding the problem of reduced monitoring accuracy at night. It also eliminates the privacy risks associated with image data collection.

[0132] Through the aforementioned technical means, this embodiment achieves non-invasive monitoring of blanket-kicking behavior, solving the problems of insufficient privacy protection and low nighttime recognition accuracy of traditional image acquisition devices. The temperature sensor array 10 is directly integrated inside the blanket core 90, realizing real-time detection of blanket-kicking actions through multi-point temperature changes, without relying on external light conditions or image data, ensuring the safety and reliability of the monitoring process.

[0133] The above are merely preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A blanket-kicking sensor circuit, applied to a smart blanket, characterized in that, The kick sensor circuit includes: A temperature sensor array, wherein the temperature sensor array is disposed at multiple preset positions on the smart quilt; A control circuit, wherein the signal input terminal of the control circuit is connected to the output terminal of the temperature sensor array; A wireless circuit, wherein the communication terminal of the wireless circuit is connected to the communication terminal of the control circuit, and the wireless circuit is used to access a user terminal; The temperature sensor array includes multiple temperature sensor chips; Each of the temperature sensor chips has one signal output terminal and two address setting terminals. The two address setting terminals are selectively left floating, grounded, or connected to the input terminal of the control circuit. The address setting terminals are used to set a unique identifier for the temperature sensor chip, and a binary address code is formed by different level combinations. The adjacent temperature sensor chips are connected in series in pairs; each temperature sensor chip forms a series link with the adjacent temperature sensor chip through two signal nodes, and the signal transmission channel extends from the input end of the first temperature sensor chip to the output end of the last temperature sensor chip, forming a single continuous path; the control circuit sends a unified command to all temperature sensor chips through the path and receives temperature data transmitted through the series link.

2. The kick sensor circuit as described in claim 1, characterized in that, The wireless circuit includes: The WiFi chip has a first resistor connected between its transmitting end and the receiving end of the control circuit, a second resistor connected between its receiving end and the transmitting end of the control circuit, and at least one capacitor connected in parallel between its power input terminal and ground. The WiFi chip has a frequency of 2.4 GHz.

3. The kick sensor circuit as described in claim 1, characterized in that, The kick sensor circuit also includes: A reference temperature circuit, the output terminal of which is connected to the reference signal terminal of the control circuit; The reference temperature circuit includes: The third resistor has a fourth resistor connected in series between its first end and ground, and its second end is connected to the first reference signal terminal of the control circuit. The fifth resistor has its first end connected to the second reference signal terminal of the control circuit, and its second end connected to the common node of the third and fourth resistors.

4. The kick sensor circuit as described in claim 1, characterized in that, The kick sensor circuit also includes: Battery; A charging management circuit, wherein the power input terminal of the charging management circuit is used to connect to an external power source, and the output terminal of the charging management circuit is used to connect to the battery; The main power supply circuit has its power input terminal connected to the battery and its output terminal connected to the power input terminal of the control circuit.

5. The kick sensor circuit as described in claim 4, characterized in that, The charging management circuit includes: A charging chip, wherein the power input terminal of the charging chip is used to connect to an external power source, the charging current output terminal of the charging chip is connected to the battery, and at least one capacitor is connected in parallel between the charging current output terminal of the charging chip and ground. The sixth resistor has its first end connected to the management terminal of the charging chip and its second end grounded. The charging indicator light has its negative terminal connected to the drain of the charging chip, and a seventh resistor is connected in series between the positive terminal of the charging indicator light and the power input terminal of the charging chip.

6. The kick sensor circuit as described in claim 4, characterized in that, The main power supply circuit includes: The battery terminal has a first end grounded and a second end connected to the positive terminal of the battery. The main power chip has an eighth resistor connected in series between its input terminal and the second terminal of the battery terminal, and the input terminal and the enable terminal of the main power chip are connected. The ninth resistor has a tenth resistor connected in series between its first end and the input terminal of the main power chip, and its second end is grounded. The eleventh resistor has its first end connected to the power control terminal of the control circuit, and its second end connected to the common node of the ninth and tenth resistors.

7. The kick sensor circuit as described in claim 4, characterized in that, The kick sensor circuit also includes: A sleep switch circuit, wherein the controlled terminal of the sleep switch circuit is connected to the sleep control terminal of the control circuit, the first conducting terminal of the sleep switch circuit is connected to the output terminal of the main power supply circuit, and the second conducting terminal of the sleep switch circuit is connected to the power supply terminal of the wireless circuit. The sleep switch circuit includes: The first transistor has a twelfth resistor connected in series between its base and the sleep control terminal of the control circuit, and its emitter is grounded. The first switching transistor has a thirteenth resistor connected in series between its gate and the collector of the first transistor, a fourteenth resistor connected in parallel between its gate and drain, its drain connected to the output terminal of the main power supply circuit, and its source connected to the power supply terminal of the wireless circuit.

8. A smart quilt, characterized in that, include: Comforter insert; as well as The kicking sensor circuit as described in any one of claims 1 to 7; The kick-off sensor circuit includes a temperature sensor array, which is arranged in a preset manner on the quilt core.

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