Pressing machine for circuit board

By setting up flexible pressing components and a vacuum adsorption platform on the pressing machine, the problem that traditional rigid pressing structures cannot adapt to flexible circuit boards is solved, achieving uniform and reliable pressing effect and improving the bonding quality of flexible circuit boards.

CN224356372UActive Publication Date: 2026-06-12SHENZHEN YUMINGHUI ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202521540532.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-07-22
Publication Date
2026-06-12
Estimated Expiration
2035-07-22

AI Technical Summary

Technical Problem

Traditional rigid lamination structures cannot effectively bond flexible circuit boards, resulting in uneven bonding, gaps, air bubbles, and even damage to the circuitry, which affects the reliability and yield of flexible circuit boards.

Method used

The flexible pressing component is made of elastic material. It wraps the flexible circuit board under the action of pressing force and fills the gap between the board and the placement groove. Combined with the vacuum adsorption platform to fix the position of the circuit board, flexible support and bonding are achieved.

Benefits of technology

It improves the uniformity and reliability of the lamination process, avoids problems such as uneven bonding, gaps and pressure damage, and improves the bonding quality and product yield of flexible circuit boards.

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Abstract

The utility model provides a pressing machine for a circuit board. The pressing machine comprises a body, a moving mechanism, a pressing mechanism and a placing assembly. The body is placed on the fixed surface. The moving mechanism is fixedly connected with the body. The pressing mechanism is connected with the moving mechanism in a sliding mode to generate pressing force. And the placing assembly is fixedly connected with the body and is arranged opposite to the pressing mechanism, and the pressing mechanism slides to be connected with the placing assembly in an attached mode. The press-fit assembly comprises a flexible press-fit piece arranged at the end close to the containing assembly. The placing assembly is provided with a placing groove, the opening end of the placing groove faces the flexible pressing piece, a flexible circuit board is placed in the placing groove, a gap is formed between the flexible circuit board and the placing groove, and under the action of pressing force, the flexible pressing piece wraps the flexible circuit board and fills the gap to be in a pressing state. Through the structure, the uniformity of the pressing process is improved.
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