A rapid cooling device

Abstract

The utility model discloses a quick cooling device, the quick cooling device is used for cooling the film after annealing treatment, the quick cooling device includes the support component for supporting the film and the cooling component for cooling the film, the cooling component includes a plurality of cooling fans, a plurality of cooling fans are used in common for producing cooling airflow to cool the film, and the cooling fans are evenly arranged to balance the cooling airflow acting on each part of the film, wherein the cooling component forms multistage cooling mode to make the wind speed of the cooling component blowing to the film adjustable. The quick cooling device of the utility model is used for improving the cooling speed of the film and ensuring the performance of the film after cooling.

Description

Technical Field

[0001] This utility model relates to the field of perovskite layer preparation technology, and in particular to a rapid cooling device. Background Technology

[0002] During the battery manufacturing process, at least one thin-film product is formed, and some of these products require annealing. For example, in perovskite solar cells, a perovskite thin film layer needs to be formed on a substrate, and this perovskite thin film requires annealing. The annealed film then needs interface passivation; however, due to the high temperature after annealing, direct interface passivation is difficult. Therefore, the annealed film needs to be cooled.

[0003] Current methods for cooling thin films primarily rely on natural cooling, which involves placing the film in the environment and allowing it to dissipate heat naturally, gradually lowering its temperature. Natural cooling is slow, typically requiring more than 30 minutes, which extends battery production cycles and reduces production efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a rapid cooling device to improve the cooling rate of the film and ensure the performance of the film after cooling.

[0005] The objective of this utility model is achieved through the following technical solution:

[0006] A rapid cooling device is disclosed for cooling a film after annealing. The rapid cooling device includes a support assembly for supporting the film and a cooling assembly for cooling the film. The cooling assembly includes multiple cooling fans that work together to generate a cooling airflow to cool the film. The multiple cooling fans are evenly arranged to evenly distribute the cooling airflow across the film. The cooling assembly forms a multi-stage cooling mode so that the airflow speed directed towards the film is adjustable.

[0007] Preferably, the multiple cooling fans are arranged in a rectangular array, with the row spacing between adjacent cooling fans in the same row being 1.8 to 2.5 times the diameter of the cooling fan, and the column spacing between adjacent cooling fans in the same column being 1.1 to 1.5 times the diameter of the cooling fan.

[0008] Preferably, the row spacing between adjacent cooling fans in the same row is 300-350mm, the column spacing between adjacent cooling fans in the same column is 180-220mm, and the diameter of the cooling fan is 140-160mm.

[0009] Preferably, the device further includes a base, on which the cooling fan and the support assembly are respectively mounted, with the cooling fan located below the support assembly and the airflow direction of the cooling fan perpendicular to the film.

[0010] Preferably, the support assembly includes a plurality of support columns disposed at the edge of the base, and the support columns are used to apply a supporting force to the edge of the film; the plurality of support columns are disposed around the outer periphery of the cooling assembly.

[0011] Preferably, the base includes an upper surface facing the film, the cooling fan is flush with or recessed within the upper surface, and the support column is mounted on the upper surface and extends from the upper surface toward the film.

[0012] Preferably, the distance between the cooling fan and the diaphragm is 45-55 mm.

[0013] Preferably, the cooling assembly includes a first cooling unit, a second cooling unit, and a third cooling unit. The first cooling unit, the second cooling unit, and the third cooling unit each include a plurality of cooling fans, and the blowing speeds of the cooling fans in the first cooling unit, the second cooling unit, and the third cooling unit are different. The film moves to the first cooling unit, the second cooling unit, or the third cooling unit to adjust the wind speed blown onto the film by the cooling assembly.

[0014] Preferably, the cooling assembly further includes a control module connected to the plurality of cooling fans, and the control module is used to control the blowing speed of the plurality of cooling fans to adjust the wind speed blown by the cooling assembly toward the film.

[0015] Preferably, the thin film is a perovskite thin film, the thin film is attached above the substrate, the support component abuts against the substrate to support the thin film located above the substrate; the cooling component generates a cooling airflow that blows toward the substrate.

[0016] Compared with the prior art, the beneficial effects of this utility model include at least the following:

[0017] By employing a multi-stage cooling mechanism, the airflow velocity directed towards the thin film can vary across different cooling modules within the cooling assembly. This allows the cooling assembly to adjust the airflow velocity towards the film by switching between different cooling modes. Initially, a lower airflow velocity can be used to cool the film, preventing cracking due to rapid cooling and ensuring film quality. Once the film temperature has decreased, a higher airflow velocity can be used for further cooling. At this point, the film is less prone to cracking due to rapid cooling, and faster cooling effectively reduces cooling time, thereby shortening the production cycle of batteries using this film and improving production efficiency. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the rapid cooling device according to an embodiment of the present invention;

[0019] Figure 2 This is a structural schematic diagram of the rapid cooling device according to another perspective of an embodiment of this utility model.

[0020] In the figure: 1. Support component; 11. Support column; 2. Cooling component; 21. Cooling fan; 3. Base; 31. Upper surface. Detailed Implementation

[0021] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore repeated descriptions of them will be omitted.

[0022] The terms used to describe position and direction in this utility model are illustrated with the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this utility model.

[0023] like Figure 1 and Figure 2 As shown, this utility model provides a rapid cooling device for cooling and reducing the temperature of annealed films, such as annealed perovskite films. The cooled perovskite film can then be easily passivated at the interface. The rapid cooling device includes a support component 1 and a cooling component 2, and may also include a base 3.

[0024] Cooling assembly 2 is used to cool the film. Cooling assembly 2 may include multiple cooling fans 21, which rotate when energized to generate cooling airflow. The cooling airflow generated by the multiple cooling fans 21 can be used together to cool a single film. The multiple cooling fans 21 are evenly distributed to improve the overall uniformity of the cooling airflow generated by the multiple cooling fans 21, thereby resulting in better uniformity of the cooling airflow blowing onto various parts of the film. The evenly distributed multiple cooling fans can evenly distribute the cooling airflow across the film, ensuring that the cooling rate is basically the same throughout the film, reducing the risk of damage to the film due to uneven temperature distribution and thermal stress.

[0025] Specifically, the multiple cooling fans 21 in the cooling assembly 2 can be arranged in a rectangular array. In this rectangular array, the row spacing between adjacent cooling fans 21 in the same row can be 1.8 to 2.5 times the diameter of the cooling fan 21, and the column spacing between adjacent cooling fans 21 in the same column can be 1.1 to 1.5 times the diameter of the cooling fan 21. Specifically, the row spacing between adjacent cooling fans 21 in the same row can be 300 to 350 mm, the column spacing between adjacent cooling fans 21 in the same column can be 180 to 220 mm, and the diameter of the cooling fan 21 can be 140 to 160 mm. In this embodiment, the row spacing between adjacent cooling fans 21 in the same row is preferably 320 mm, the column spacing between adjacent cooling fans 21 in the same column is preferably 200 mm, and the diameter of the cooling fan 21 is preferably 150 mm.

[0026] In the cooling assembly 2, the air outlet directions of the multiple cooling fans 21 are parallel to each other, and the air outlet direction of the cooling fans 21 in the cooling assembly 2 can be perpendicular to the thin film, that is, the air outlet direction of the cooling fans 21 is parallel to the thickness direction of the thin film. The cooling assembly 2 can be installed above the thin film, and the air outlet direction of the cooling fans 21 in the cooling assembly 2 is vertically downward, with the cooling airflow generated by the cooling fans 21 blowing directly onto the thin film; or, the cooling assembly 2 can be installed below the thin film, and the air outlet direction of the cooling fans 21 in the cooling assembly 2 is vertically upward, with the cooling airflow generated by the cooling fans 21 blowing onto the substrate located below the thin film, thereby cooling the thin film by cooling the substrate in contact with the thin film. In this embodiment, the cooling assembly 2 can specifically be disposed below the thin film. The distance between the cooling fan 21 and the thin film is 45-55 mm. Specifically, the distance between the upper end of the cooling fan 21 and the lower surface of the thin film is 45-55 mm.

[0027] If the cooling fan 21 generates a cooling airflow at a fixed speed with a constant power, the cooling component 2 requires a longer time to cool the film when the airflow speed is low. Although this is equivalent to allowing the film to cool naturally, reducing the cooling time, the time required to cool the film using a reduced airflow speed is still relatively long. When the cooling airflow speed is high, the cooling component 2 cools the film more quickly, and the film temperature is high at the beginning of the cooling process. This rapid cooling can cause the film to crack, leading to damage and reduced performance, and in severe cases, rendering the film unusable.

[0028] In this application, the cooling assembly 2 forms a multi-stage cooling mode. The airflow velocity of the cooling airflow blowing onto the film can vary in different cooling modules within the cooling assembly 2, allowing the cooling assembly 2 to adjust the airflow velocity towards the film by changing to different cooling modes. When initially cooling the film, a lower airflow velocity can be used to prevent cracking caused by rapid cooling. As the film temperature changes from the high-temperature zone to the medium-temperature zone, a higher airflow velocity can be used to cool the film. At this point, the film is essentially free from the direction of rapid cooling that could cause cracking. Cooling the film with a higher airflow velocity can effectively reduce the cooling time, thereby shortening the production cycle of batteries using this film and improving production efficiency. When the film cools to the low-temperature zone, a lower airflow velocity can be used to cool the film to eliminate micro-stress concentration and facilitate precise temperature control of the film. The cooling component 2 can include three cooling modes: when the film is in the high temperature zone, the first cooling mode is used to cool the film; when the film is in the medium temperature zone, the second cooling mode is used to cool the film; and when the film is in the low temperature zone, the third cooling mode is used to cool the film.

[0029] Specifically, the thin film is a perovskite film, and its initial temperature is 120°C. The high-temperature zone is the temperature range of 90–120°C. In this first-stage cooling mode, a relatively low airflow is applied to the film, with the airflow speed generated by the cooling fan 21 specifically ranging from 0.8 to 1.2 m / s. When the film temperature is in the high-temperature zone, the cooling rate is relatively fast. Applying a lower airflow speed to the film can prevent cracking due to the rapid temperature drop. The cooling rate of the film in the first-stage cooling mode can be 13.3°C / min, which is a slower cooling rate and can significantly reduce the risk of cracking due to a sudden drop in temperature at the beginning of cooling. Furthermore, the low airflow cooling in the first-stage cooling mode can effectively control the migration rate of cations in the perovskite lattice of the film, inhibiting lead iodide precipitation; at the same time, the residual solvent concentration at the grain boundaries of the film is <5%, which can prevent pinhole formation.

[0030] The intermediate temperature range is 50–90°C for the thin film. In this range, a higher airflow speed is used to cool the film in the second-stage cooling mode. Specifically, the airflow speed generated by the cooling fan 21 can be 5.5–6.5 m / s. As the film temperature decreases, the cooling rate achieved by using the same airflow speed is slower. Therefore, when the film temperature is in the intermediate temperature range, even if the airflow speed is increased, the film temperature will not drop drastically. The cooling rate of the film in the second-stage cooling mode can be 8°C / min. By increasing the airflow speed in the second-stage cooling mode, the cooling time of the film can be effectively reduced. Furthermore, under the cooling in the second-stage cooling mode, the desorption of the DMF / DMSO (N,N-dimethylformamide / dimethyl sulfoxide) co-solvent in the film can be accelerated, promoting grain densification and resulting in a film surface roughness Ra < 15 nm.

[0031] The low-temperature zone is the temperature range of 25–50°C for the thin film. In this zone, a lower airflow speed is used to blow air onto the thin film in the third-stage cooling mode, or the cooling fan 21 is stopped to allow the film to cool naturally. Specifically, the airflow speed generated by the cooling fan 21 in the third-stage cooling mode can be 0–2 m / s. Under the third-stage cooling mode, the Marangoni effect can balance the surface tension gradient of the thin film, eliminating micro-stress concentration, and the temperature difference between the film edge and center is <2°C. Furthermore, the cooling rate of the thin film in the second-stage cooling mode can be 3°C / min; this slower cooling rate also facilitates temperature control and prevents over-cooling.

[0032] By employing a three-stage cooling mode to cool the thin film, the cooling time for one film can be controlled within 10–18 minutes, effectively reducing the cooling time and thus shortening the production cycle of batteries using this film, improving production efficiency. Furthermore, thin film structures such as perovskite films, if exposed to the environment for extended periods through natural cooling, are prone to excessive grain growth or decomposition (e.g., increased lead iodide residue), reducing the stability of devices using this film. This application significantly reduces the cooling time of the film through a three-stage cooling mode, effectively mitigating the risk of excessive grain growth or decomposition caused by prolonged exposure to the environment, ensuring the stability of devices using this film. In addition, the three-stage cooling mode also ensures effective cooling of the film, improving film quality and resulting in a final film with better grain size uniformity. It also enhances the passivation effect during subsequent passivation treatment.

[0033] To enable the cooling assembly 2 to achieve a three-stage cooling mode, the cooling assembly 2 may include a first cooling unit, a second cooling unit, and a third cooling unit. The first, second, and third cooling units are arranged sequentially, and each of the three units includes multiple cooling fans 21. The airflow speeds of the cooling fans 21 in the first, second, and third cooling units are different. For example, the airflow speed of the fan in the first cooling unit is 0.8–1.2 m / s, and the first cooling unit is used to achieve the first-stage cooling mode; the airflow speed of the fan in the second cooling unit is 5.5–6.5 m / s, and the second cooling unit is used to achieve the second-stage cooling mode; the airflow speed of the fan in the third cooling unit is 0–2 m / s, and the third cooling unit is used to achieve the third-stage cooling mode. By setting up three independent cooling units, each forming a first-stage cooling mode, the cooling assembly 2 achieves a three-stage cooling mode. The thin film moves sequentially to the first, second, or third cooling unit to achieve three-stage cooling. In this unit, multiple cooling fans 21 in the first, second, and third cooling units are arranged in an array, and the area of ​​the overall outline formed by the multiple cooling fans 21 in each cooling unit is larger than the area of ​​the lower surface of the film, so that each cooling unit can generate a uniform cooling airflow to completely cover the film, ensuring the uniformity of cooling of the film at each cooling unit.

[0034] Or, refer to Figure 2Alternatively, the cooling assembly 2 may not have multiple cooling units. The cooling assembly 2 includes a control module connected to multiple cooling fans 21. The control module controls the airflow speed of the multiple cooling fans 21, adjusting the airflow speed to create a multi-level cooling mode. Specifically, the airflow speed of the cooling fans 21 is first controlled at 0.8–1.2 m / s to achieve the first-level cooling mode; then, the airflow speed is controlled at 5.5–6.5 m / s to achieve the second-level cooling mode; and finally, the airflow speed is controlled at 0–2 m / s to achieve the third-level cooling mode. The multiple cooling fans 21 in the cooling assembly 2 are arranged in an array, and the area of ​​the overall outline formed by the multiple cooling fans 21 is larger than the area of ​​the lower surface of the film, allowing the cooling assembly 2 to generate a uniform cooling airflow to completely cover the film. In this embodiment, with the control module, the number of cooling fans 21 in the cooling assembly 2 only needs to be the same as the number of cooling fans 21 in a single cooling unit, effectively simplifying the structure of the cooling assembly 2. The cooling fan 21 can be a common variable-speed fan. The control module controls the airflow speed of the cooling fan 21 using existing fan speed control methods. Specifically, the control module can be a PLC (Programmable Logic Controller) module. There can be 12 cooling fans 21, forming a rectangular array of 3 rows and 4 columns. The 12 cooling fans working together can cool a film with dimensions of 1.2m × 0.6m.

[0035] A cooling fan 21 and a support assembly 1 are mounted on a base 3. The base 3 may include an upper surface 31 facing the thin film. A mounting space for the cooling fan 21 is formed below the upper surface 31 of the base 3, such that the cooling fan 21, after being mounted on the base 3, is flush with or recessed into the upper surface 31 of the base 3, and the cooling fan 21 can be located below the support assembly 1. The upper surface 31 of the base 3 can be fixedly connected to the support assembly 1, so that the support assembly 1 is supported between the upper surface 31 of the base 3 and the thin film.

[0036] The support component 1 is used to support the thin film. The thin film needs to be attached to the substrate. To avoid direct contact between the support component 1 and the thin film, the support component 1 can be configured to abut against the substrate, thereby supporting the thin film attached to the substrate.

[0037] The support assembly 1 may specifically include a plurality of support pillars 11, which are mounted on the upper surface 31 and extend from the upper surface 31 toward the film. The support pillars 11 are located at the edge of the base 3 and are used to apply a supporting force to the edge of the film. The plurality of support pillars 11 are arranged around the outer periphery of the cooling assembly 2. By using support pillars 11 to support the substrate, the contact area between the support pillars 11 and the substrate is small, which can reduce the heat transfer between the support pillars 11 and the substrate, thereby making the temperature of the substrate approximately the same and improving the temperature uniformity of the film above the substrate.

[0038] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments within the scope of the present invention without departing from the principles and spirit of the present invention, and all such changes should fall within the protection scope of the claims of the present invention.

Claims

1. A rapid cooling device, characterized in that, The rapid cooling device is used to cool the annealed film. The rapid cooling device includes a support assembly (1) for supporting the film and a cooling assembly (2) for cooling the film. The cooling assembly (2) includes multiple cooling fans (21), which work together to generate cooling airflow to cool the film. The multiple cooling fans (21) are evenly arranged to evenly distribute the cooling airflow to all parts of the film. The cooling assembly (2) forms a multi-stage cooling mode so that the wind speed blown by the cooling assembly (2) onto the film is adjustable.

2. The rapid cooling device according to claim 1, characterized in that, Multiple cooling fans (21) are arranged in a rectangular array. The row spacing between adjacent cooling fans (21) in the same row is 1.8 to 2.5 times the diameter of the cooling fan (21), and the column spacing between adjacent cooling fans (21) in the same column is 1.1 to 1.5 times the diameter of the cooling fan (21).

3. The rapid cooling device according to claim 2, characterized in that, The row spacing between adjacent cooling fans (21) in the same row is 300-350mm, the column spacing between adjacent cooling fans (21) in the same column is 180-220mm, and the diameter of the cooling fan (21) is 140-160mm.

4. The rapid cooling device according to claim 1, characterized in that, It also includes a base (3), the cooling fan (21) and the support assembly (1) are respectively installed on the base (3), the cooling fan (21) is located below the support assembly (1), and the air blowing direction of the cooling fan (21) is perpendicular to the film.

5. The rapid cooling device according to claim 4, characterized in that, The support assembly (1) includes a plurality of support columns (11), which are disposed at the edge of the base (3) and are used to apply a supporting force to the edge of the film; the plurality of support columns (11) are disposed around the outer periphery of the cooling assembly (2).

6. The rapid cooling device according to claim 5, characterized in that, The base (3) includes an upper surface (31) facing the film, the cooling fan (21) is flush with or recessed within the upper surface (31), and the support column (11) is mounted on the upper surface (31) and extends from the upper surface (31) toward the film.

7. The rapid cooling device according to claim 1, characterized in that, The distance between the cooling fan (21) and the diaphragm is 45-55 mm.

8. The rapid cooling device according to claim 1, characterized in that, The cooling assembly (2) includes a first cooling unit, a second cooling unit, and a third cooling unit. The first cooling unit, the second cooling unit, and the third cooling unit each include a plurality of cooling fans (21). The blowing speeds of the cooling fans (21) in the first cooling unit, the second cooling unit, and the third cooling unit are different. The film moves to the first cooling unit, the second cooling unit, or the third cooling unit to adjust the wind speed blown by the cooling assembly (2) onto the film.

9. The rapid cooling device according to claim 1, characterized in that, The cooling assembly (2) also includes a control module connected to a plurality of cooling fans (21), and the control module is used to control the blowing speed of the plurality of cooling fans (21) to adjust the wind speed blown by the cooling assembly (2) toward the film.

10. The rapid cooling device according to claim 1, characterized in that, The thin film is a perovskite thin film, which is attached to the substrate. The support component abuts against the substrate to support the thin film located above the substrate. The cooling component (2) generates a cooling airflow that blows toward the substrate.

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