Vehicle-mounted chassis for L4-level autonomous vehicle
By adopting a modular design and an air-cooled heat dissipation system, the problem of insufficient hardware integration in the vehicle chassis is solved, improving system performance and space utilization, reducing costs, and ensuring the heat dissipation effect of the equipment under high load operation, which facilitates maintenance and upgrades.
Patent Information
- Application Number
- CN202521415924.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-08
- Publication Date
- 2026-06-26
- Estimated Expiration
- 2035-07-08
AI Technical Summary
The insufficient hardware integration of existing vehicle chassis results in loose connections and cooperation between components, limiting system performance, low space utilization, and increasing system complexity and cost.
The modular design allows for the independent packaging of battery modules, terminal modules, network converter modules, radar modules, boost modules, etc., and heat dissipation is achieved through an air-cooled heat dissipation system. Optimized component connections and layout improve hardware integration and reduce the number of cables and connectors.
It improves system flexibility and scalability, reduces chassis size and weight, reduces system complexity and cost, while ensuring good heat dissipation performance under high load operation, and facilitates maintenance and upgrades.