Headphone components
CN309763371SActive Publication Date: 2026-01-30IFLYTEK CO LTD
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Patent Information
- Application Number
- CN202530325253.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-06
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2040-06-06
Smart Images
Figure 000007_ABST
Abstract
1. Name of the product in this design: Headphone Assembly. 2. Purpose of this design: Primarily used for communication, real-time language translation, and audio transmission. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design points: Component 1 3D view 1. 5. Other situations requiring explanation: Component 1 of this design is the right earphone, and component 2 is the left earphone.
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