CONNECTION ARRANGEMENT

Abstract

The present invention relates to a connection arrangement (1) comprising a ribbon cable (10) comprising at least a first layer (L1) with a plurality of electrical conductors (12), wherein the ribbon cable (10) extends along a first direction (X), and the conductors (12) are exposed at at least one end (11) of the ribbon cable (10), a substrate (30) with a plurality of conductor pads (32), a connector (20) attached to a first surface (36) of the substrate (30), wherein the connector (20) has a plurality of individual openings (22) oriented in the first direction (X), and, in a connected state of the connector (20) and the ribbon cable (10), each exposed conductor (12) of the ribbon cable (10) is arranged in an opening (22) on the connector (20).and each conductor (12) in its opening (22) is electrically connected to a conductor pad (32) on the substrate (30) via a single connecting channel (24) and a contacting means (28) in the respective connecting channel (24).

Description

Technical field

[0001] The invention relates to a connection arrangement for, preferably automated, connecting a flat ribbon cable to a substrate. State of the art

[0002] In the automotive sector, several established connector systems are used for electrical data transmission within a vehicle. Data transmission typically occurs via a wiring harness constructed from round cables and / or individual wires. However, these state-of-the-art wiring harnesses have disadvantages, such as non-automated manufacturing, a high weight due to the bulk of the conductors, and / or the ever-increasing number and size of connectors required, which is undesirable.

[0003] For the future, as an alternative to a cable harness, a (multilayer) flat ribbon cable (flat flex cable) or a (multilayer) flat ribbon cable harness for data transmission is being considered. The established connector systems should continue to be used whenever possible. Currently, there is no or only insufficient automated manufacturing. In particular, when attempting to connect the smallest multi-core cables to a substrate, such as a PCB, in an automated process, cable assemblers repeatedly reach the limits of feasibility. As a result, the connection of the cable to the PCB is often carried out using conventional manual assembly. However, manual assembly is time-consuming and prone to errors. Description of the invention

[0004] It is therefore an object of the present invention to provide a connection arrangement with which (multilayer) flat ribbon cables can be electrically and robustly connected to new or existing connector systems, wherein the manufacturing process has a high degree of automation.

[0005] The aforementioned problem is solved by a connection arrangement according to claim 1. Further advantageous embodiments of the invention can be found in the dependent claims, the description, and the drawings.

[0006] In particular, the above-mentioned problem is solved by a connection arrangement for connecting a flat ribbon cable to a substrate, comprising a flat ribbon cable comprising at least a first layer with a plurality of electrical conductors, wherein the flat ribbon cable extends along a first direction and the conductors are exposed at at least one end of the flat ribbon cable, a substrate with a plurality of conductor pads for electrical contacting, and a connector attached to a first surface of the substrate, wherein the connector has a plurality of individual openings oriented in the first direction.In a connected state of connector and ribbon cable, each exposed conductor of the ribbon cable is arranged in a single opening on the connector, and each conductor in its respective opening is electrically connected to a conductor pad on the substrate via a single connecting channel and a contacting means in the respective connecting channel.

[0007] The present connection arrangement offers the advantage that all steps necessary for a connection can be automated. Specifically, the connector can be automatically positioned and attached to the substrate, the conductors of the ribbon cable can be automatically exposed, and the ribbon cable can be automatically inserted into the connector. Finally, the conductors and conductor pads can be automatically electrically connected using the contacting element. This connection arrangement enables a robust connection of single- or multi-layer ribbon cables with various connector systems. The resulting connection is designed to ensure signal integrity. The ribbon cable is securely contacted at its end via the connector, firmly bonded to the substrate, and protected from external environmental influences.

[0008] Preferably, the flat ribbon cable comprises a multilayer flat ribbon cable with several layers of conductors, and the openings on the connector are arranged layer by layer, so that each conductor of the multilayer flat ribbon cable can be arranged simultaneously in a single opening on the connector. Multilayer flat ribbon cables have the advantage that, in addition to unshielded cables or cables entirely enclosed by a common outer shield, they can also be used to implement shielded individual cables. The conductors of all layers can be connected, particularly simultaneously, using the present connection arrangement.

[0009] Preferably, the conductors of one layer in the ribbon cable are arranged offset from the conductors of an adjacent layer in the ribbon cable, and correspondingly, the openings of one layer at the connector are arranged offset from the openings of an adjacent layer at the connector. This offset arrangement enables space-saving contacting of multiple layers of a multilayer ribbon cable onto conductor pads arranged in one plane on the substrate.

[0010] Preferably, the conductor pads are connected via conductor tracks on the substrate to a connector system arranged on the substrate. The substrate preferably comprises a PCB. Any connector systems from the prior art can be arranged on the PCB. Thus, the present connection arrangement can be implemented between a ribbon cable and a variety of connector systems. Reliable signal transmission through the substrate is ensured via the conductor pads and conductor tracks.

[0011] Preferably, the contacting medium forms a metallurgical bond between the conductors and the conductor pads. This metallurgical bond ensures a reliable electrical connection. No mechanical damage occurs with this metallurgical bond.

[0012] Preferably, the contacting medium comprises a solder paste.

[0013] Preferably, the contacting element is pre-installed in the connector. Pre-installing the contacting element in the connector simplifies its installation in the present connection arrangement.

[0014] Preferably, the connector has a channel, separate from the connection channels, for electrically contacting the outer shield of the ribbon cable using contact elements. Electrical contact with the outer shield of the ribbon cable can be made via this channel. Thus, the connection arrangement ensures a shielded data line.

[0015] Preferably, the connector is attached to the first surface of the substrate using SMD or THM. The SMD (surface-mounted device) method offers several advantages. First, it provides a compact design. This compact design allows for smaller and denser circuits, as components are mounted in a space-saving manner. Second, the SMD method enables automation. It is ideally suited for mass production using automated placement machines. Third, it allows for faster manufacturing. Assembly and soldering can be performed more quickly. Fourth, it requires less space. Components can be mounted on both sides of a circuit board or substrate. And fifth, the method and the connection offer a weight advantage. The smaller size and lighter weight of the components make SMD ideal for portable and compact devices. The THM (through-hole mounted) method has at least the following advantages.Firstly, it offers mechanical stability. Because the components are inserted through the circuit board and soldered, they exhibit higher mechanical strength. Therefore, this method is better suited for components subjected to mechanical stress. Furthermore, the THM (Through-Hole) connection method offers better retention under thermal stress. THM components often withstand high temperatures or other stresses that require a stronger connection better. Finally, THM connections are repair-friendly. The plated-through holes make repairs and component replacement easier. In summary, SMD offers surface mounting and is well-suited for compact, lightweight, and highly automated manufacturing, while THM involves through-hole mounting and offers higher mechanical stability and greater robustness under stress.

[0016] The following description of embodiments is given with reference to the accompanying figures. These show: Fig. 1 a perspective view of an embodiment of a connection arrangement in the connected state; Fig. 2 a perspective view of an embodiment of a flat ribbon cable with conductors in one layer; Fig. 3 a perspective view of an embodiment of a substrate and a connector in the unconnected state; Fig. 4 a cross-sectional view of an embodiment of a connection arrangement in the connected state; Fig. 5 a perspective view of an embodiment of a flat ribbon cable with conductors in multiple layers; Fig. 6 a perspective view of a further embodiment of a substrate and a connector in the unconnected state; and Fig. 7 a cross-sectional view of another embodiment of a connection arrangement in the connected state.

[0017] Preferred embodiments are described in detail below with reference to the accompanying figures.

[0018] Fig. Figure 1 shows an embodiment of a connection arrangement 1 for connecting a flat ribbon cable 10 to a substrate 30. The illustrated connection arrangement 1 is in the connected state, so that (unshielded and / or shielded) electrical signal transmission is possible from the flat ribbon cable 10 via the substrate 30 to the connector system 40. The connector system 40 is, as shown in Fig. 1 shown, preferably arranged on one side 34 of the substrate 30 facing away from the flat ribbon cable 10.

[0019] Fig. Figure 2 shows a detailed view of a flat ribbon cable 10, which comprises at least a first layer L1 with a plurality of electrical conductors 12. A layer can be defined here as "arranged in a plane along the second direction Y". The conductors 12 are separated and protected from each other and from the outside by insulation 16. The flat ribbon cable 10 shown extends essentially along a first direction X. The conductors 12, either entirely or at least along one side of each conductor 12 in the first direction X, are exposed at at least one end 11 of the flat ribbon cable 10 (from the insulation 16). This exposure allows a conductor 12 to be contacted not only at the end face of the flat ribbon cable 10, but also from another side, i.e., perpendicular to the first direction X, which facilitates contacting the conductors 12 in the respective opening 22 or the respective connection channel 24. In the Fig. In the embodiment shown in Figure 2, the conductors 12 are exposed at their outermost tips (as a whole), while, somewhat spaced apart from the exposed conductors 12, the outer shielding 14 of the flat ribbon cable 10 is exposed. The conductors 12, as shown in Figure 2, are exposed at their outermost tips. Fig. The conductors 12 shown in Figure 2, which are fully exposed, offer a large contact surface, for example with the contacting medium 28. The exposure of the conductors 12 can be automated, for example with the aid of a laser.

[0020] Fig. Figure 3 shows a detailed view of a substrate 30 with a plurality of conductor pads 32 for electrical contacting. The conductor pads 32 are firmly connected to the substrate 30. In addition to the conductor pads 32 for contacting the conductors 12 of a ribbon cable 10, shielding pads 33 for contacting the outer shield 14 of the cable 10 can also be arranged on the substrate. The substrate 30 preferably comprises a PCB on which conductor tracks 38 are arranged within or along at least a first surface 36. The conductor pads 32, and optionally also the shielding pads 33, are connected via the conductor tracks 38 on the substrate 30 to a connector system 40 arranged on the substrate 30 (see Figure 3). Fig. 4) The connector system 40 preferably comprises prior art connector systems, for example, standard automotive connectors such as mini-coaxial connectors. For fastening, the connector 20 can be attached to the first surface 36 of the substrate 30 using SMD or THM. In the SMD process, components are mounted directly onto the surface of the circuit board or the substrate. These components do not have leads that pass through holes in the board, but are attached to the surface of the board by special solder pads. In the THM process, components with wire leads are inserted through holes in the circuit board and then soldered to the underside of the board.

[0021] Fig. Figure 3 further shows a connector 20 that can be attached to a first surface 36 of the substrate 30. The connector 20 has a plurality of individual openings 22 oriented in the first direction X and configured to receive exposed conductors 12 of the ribbon cable 10. In a connected state of the connector 20 and the ribbon cable 10, each exposed conductor 12 of the ribbon cable 10 is arranged in an individual opening 22 on the connector 20. The connector 20 shown further has individual connection channels 24. The connection channels 24 are preferably oriented obliquely to the openings 22 and form individual passages within the connector, with each connection channel 24 being configured to provide a passage from exactly one opening 22 to exactly one conductor pad 32 on the substrate 30. A contacting means 28 can be pre-installed in each connection channel 24 or added externally (see Figure 3). Fig. 4) The contacting means 28 is configured to form a metallurgical connection (28a) between the conductors 12 and the conductor pads 32. The contacting means 28 preferably comprises a solder paste. Each exposed conductor 12, when the ribbon cable 10 is joined with the connector 20, is electrically connected in its respective opening 22 to a conductor pad 32 on the substrate 30 via a single connection channel 24 and a contacting means 28 in the respective connection channel 24.

[0022] Fig. Figures 5-7 show a further embodiment of a connection arrangement 1, in which the ribbon cable comprises a multilayer ribbon cable 100 with several layers, at least a first and a second layer L1, L2, of conductors 102, 103. In this embodiment, the openings 202, 203 on the connector 200 are also arranged layer by layer, so that each conductor 102, 103 of the multilayer ribbon cable 100 can be arranged simultaneously in a single opening 202, 203 on the connector 200. As in Fig. 5 and Fig. As shown in Figure 6, the conductors 102 of a (first) layer L1 in the flat ribbon cable 100 are arranged offset from the conductors 103 of an adjacent (second) layer L2 in the flat ribbon cable 100, and correspondingly, the openings 202 of a (first) layer L1 at the connector 200 are arranged offset from the openings 203 of an adjacent (second) layer L2 at the connector 200. Each conductor 102, 103 is arranged in a single connecting channel 204. Fig. 7 The cross-section passes through the connecting channel 204 of conductor 103. Conductor 102 is located in a separate connecting channel 204, which is separate from the connecting channel 204 of conductor 103, which is why conductor 102 is in Fig. 7 is only shown as a dashed line. The connecting channel 204 for conductor 102 is along the second direction Y (in Fig. 7 into the image plane) arranged in front of or behind the connecting channel 204 for the conductor 103.

[0023] In both described embodiments (single-layer and multi-layer construction), the connector 20, 200 can have a channel 26, 206, separate from the connection channels 24, 204, for electrically contacting an outer shield 14, 104 of the ribbon cable 10, 100 by means of a contacting means 28. The contacting of the outer shield 14, 104 via the contacting means 28 can be effected via a single electrical contact, which preferably extends over an entire side length (along the second direction Y) of the outer shield 14, 104. Together with the shielding pads 33, 103, a reliable shielding around the outer shield 14, 104 is achieved in the connector 20, 200.

[0024] A preferred embodiment of a method for creating a connection between a flat ribbon cable 10, 100 and a substrate 20, 200 is described below. First, the (multilayer) flat ribbon cable 10, 100 is provided, and the conductors 12, 102, 103 are exposed at least at one end 11 of the flat ribbon cable 10, 100 so that they can be electrically contacted. Then, the flat ribbon cable 10, 100 is inserted into the connector 20, 200, such that each exposed conductor 12, 102, 103 is arranged in an opening 22, 202, 203 in the connector 20, 200. The connector 20, 200 can already be arranged and attached to the substrate 30, 300, or it can be connected to the substrate 30, 300 only afterward.Once the flat ribbon cable 10, 100 is inserted into the connector 20, 200 and the connector 20, 200 is connected to the substrate 30, 300, the contacting element 28 in the connection channels 24, 204 at the connector is heated, forming a metallurgical electrical connection 28a between the conductors 12, 102, 103 and the conductor pads 32, 302. All conductors 12, 102, 103 can be connected simultaneously to their respective conductor pads 32, 302 via the contacting element 28 if heat or energy is supplied across the entire connector 20, 200. Alternatively, for example, each contacting element 28 in a connection channel 24, 204 can be heated or melted sequentially by targeted laser radiation. After the connecting agent 28 has cooled or solidified, a fixed electrical connection 28a is established between the flat ribbon cable 10, 100 and the substrate 20, 200. REFERENCE MARK LIST 1 Connection arrangement 10 flat ribbon cable 11 End 12 ladders 14 External shielding 16 Insulation 20 connectors 22 Opening 24 connection channels 26 Channel 28 Contacting means 28a connection 30 substrate 32 ladder pad 33 Shielding pad 34 opposite side 36 first surface 38 conductor tracks 100 flat ribbon cable 102 leaders 103 leaders 104 External shielding 106 Insulation 200 connectors 202 Opening 203 Opening 204 Connection channel Channel 206 300 substrate 302 Ladder pad 303 Shielding pad 306 first surface L1 first layer L2 second layer X first direction Y second direction Z third direction

Claims

A connection arrangement (1) for connecting a ribbon cable (10) to a substrate (30) comprising: a) a ribbon cable (10) comprising at least a first layer (L1) with a plurality of electrical conductors (12), wherein the ribbon cable (10) extends along a first direction (X) and the conductors (12) are exposed at at least one end (11) of the ribbon cable (10); b) a substrate (30) with a plurality of conductor pads (32) for electrical contact; c) a connector (20) attached to a first surface (36) of the substrate (30); d) the connector (20) having a plurality of individual openings (22) oriented in the first direction (X); e) in a connected state of the connector (20) and the ribbon cable (10), each exposed conductor (12) of the ribbon cable (10) is arranged in a single opening (22) on the connector (20);and f) each conductor (12) in its respective opening (22) is electrically connected to a conductor pad (32) on the substrate (30) via a single connecting channel (24) and a contacting means (28) in the respective connecting channel (24). Connection arrangement according to claim 1, wherein the flat ribbon cable comprises a multilayer flat ribbon cable (100) with several layers (L1, L2) of conductors (102, 103), and the openings (202, 203) on the connector (200) are arranged layer by layer, so that each conductor (102, 103) of the multilayer flat ribbon cable (100) can be arranged simultaneously in a single opening (202, 203) on the connector (200). Connection arrangement according to claim 2, wherein the conductors (102) of a layer (L1) in the flat ribbon cable (100) are arranged offset from the conductors (103) of an adjacent layer (L2) in the flat ribbon cable (100), and accordingly the openings (202) of a layer (L1) on the connector (200) are arranged offset from the openings (203) of an adjacent layer (L2) on the connector (200). Connection arrangement according to one of claims 1 - 3, wherein the conductor pads (32) are connected via conductor tracks (38) on the substrate (30) to a connector system (40) arranged on the substrate (30). Connection arrangement according to one of claims 1 - 4, wherein the contacting means (28) forms a material-bonded connection (28a) between the conductors (12, 102, 103) and the conductor pads (32, 302). Connection arrangement according to claim 5, wherein the contacting means (28) comprises a solder paste. Connection arrangement according to claim 6, wherein the contacting means (28) is pre-installed in the connector (20, 200). Connection arrangement according to one of claims 1 - 7, wherein the connector (20, 200) has a channel (26, 206) separate from the connection channels (24, 204) for electrical contacting an outer shield (14, 104) of the ribbon cable (10, 100) by means of contacting means (28). Connection arrangement according to one of claims 1 - 8, wherein the connector (20, 200) is attached to the first surface (36, 306) of the substrate (30, 300) by means of SMD or THM.

Images