Component assembly management system, component assembly machine and process

Abstract

The component assembly management system comprises a component assembly machine and a management device configured to manage the component assembly machine. The component assembly machine includes: a component assembly section configured to perform an assembly process of mounting a component onto a plate; a memory section configured to store information related to the component assembly machine's performance in executing the assembly process; and a transmission section configured to transfer the information stored in the memory section to the management device.The management device includes: a receiving section configured to receive the information transmitted by the transmitting section; and a calculation section configured to calculate the assembly time required to perform the assembly process in the component assembly machine based on the information received from the receiving section.

Description

Technical area The present description refers to a technique for managing a component assembly machine. State of the art Patent literature 1 discloses a control device for a production plant which is capable of automatically replacing software to improve a function of the production plant. List of objections Patent literature Patent Literature 1: JP-A-H08-76818 Summary of the invention Technical problem The assembly time required to perform a process of mounting components onto a plate varies depending on the performance of the component assembly machine. If the machine's performance has changed (for example, due to component replacement), calculating the assembly time based on information relating to the performance before the change can result in a calculated assembly time that differs from the actual assembly time. This description discloses a technique capable of calculating an accurate assembly time based on information relating to the component assembly machine's performance. Solution to the problem A component assembly management system disclosed in the present description comprises: a component assembly machine and a management device configured to manage the component assembly machine. The component assembly machine comprises: a component assembly section configured to perform an assembly process of mounting a component onto a plate; a memory section configured to store information relating to the performance of the component assembly machine in executing the assembly process; and a transmission section configured to transmit the information stored in the memory section to the management device.The management device includes: a receiving section configured to receive the information transmitted by the transmitting section; and a calculation section configured to calculate the assembly time required to perform the assembly process in the component assembly machine based on the information received from the receiving section. In the component assembly management system described above, information relating to the performance of the component assembly machine is stored within the machine itself. The management device calculates the assembly time required for the assembly process based on this information transmitted by the machine. Therefore, even if the machine's performance changes, it is not necessary to update the management device to reflect these changes, and the precise assembly time can be calculated based on the information transmitted by the machine. A component assembly machine that forms the component assembly management system described above, and a method for managing the component assembly machine that is implemented by the component assembly management system, are also novel and useful. Brief description of the drawings Fig. 1 is a schematic diagram of a component assembly management system according to an example. Fig. 2 is a side view of a component assembly machine. Fig. 3 is a control configuration diagram of the component assembly management system. Fig. 4 is a sequence diagram of a processing operation performed in the component assembly management system. Description of embodiments The main features of an example described below are listed. The technical elements described below are independent technical elements, each possessing technical utility individually or in various combinations, and are not limited to the combinations described in the claims as originally filed. (Feature 1) In the component assembly management system described above, multiple component assembly machines can be managed, and each of the multiple component assembly machines can include the component assembly section, the storage section, and the transmission section. In this case, the receiving section can be configured to obtain the information transmitted by the transmission section of each of the multiple component assembly machines, and the calculation section can be configured to calculate the assembly time of each of the multiple component assembly machines based on the information received by the receiving section of each of the multiple component assembly machines. With such a configuration, it is possible to accurately calculate the assembly time based on information relating to the performance of each of the multiple component assembly machines. However, in another embodiment, the component assembly management system can manage a single component assembly machine. (Feature 2) In the component assembly management system described above, the component assembly machine may include an image acquisition section configured to capture an image of the component and an image processing device configured to analyze the image of the component captured by the image acquisition section. In this case, the information may be information relating to the performance of the image processing device. According to such a configuration, the assembly time can be accurately calculated based on information relating to the performance of the image processing device. However, in another embodiment, the information used to calculate the assembly time could, for example, be information relating to the performance of the component assembly section of the component assembly machine. (Feature 3) In the component assembly management system described above, the management device may further include a job (work order) determination section configured to determine a job (work order) to be executed in the assembly process on the component assembly machine based on information received from the receiving section. The job may specify at least one type and number of components to be assembled in the assembly process. According to such a configuration, it is possible to determine an efficient job based on information relating to the performance of the component assembly machine. (Feature 4) In the component assembly management system described above, the management device may further include a job transfer section configured to transfer the job determined by the job determination section to the component assembly machine. According to such a configuration, it is possible to ensure that the component assembly machine performs an efficient job, which is determined based on information relating to the performance of the component assembly machine. (Feature 5) In the component assembly management system described above, the management device may further include an information request transmission section configured to transmit an information request signal to the component assembly machine to request a transmission of the information to the management device. According to such a configuration, the management device can cause the component assembly machine to transmit information relating to the performance of the component assembly machine to the management device at a desired time. (Example) Figure 1 is a schematic diagram of the component assembly management system 100 according to the present example. The component assembly management system 100 comprises the management device 50 and the component assembly line 10. The component assembly management system 100 is a system for mounting an electronic component onto a printed circuit board (PCB) using the component assembly line 10. The component assembly line 10 comprises three component assembly machines 10A, 10B, and 10C. Although not shown, the component assembly line 10 also includes other PCB processing machines, such as a soldering press and a PCB inspection machine, in addition to the component assembly machines 10A through 10C. The PCB is conveyed to the component assembly machines 10A, 10B, and 10C in that order. Several electronic components are mounted onto the PCB in each of the component assembly machines 10A through 10C.The management device 50 is a computer that manages the component assembly machines 10A to 10C of component assembly line 10. The management device 50 can communicate with each of the component assembly machines 10A to 10C. In this example, the component assembly machines 10A to 10C of component assembly line 10 are all the same model and have the same configuration, except for the configuration of the control device 22, which is described later. Therefore, this description mainly focuses on the configuration of component assembly machine 10A. Hereafter, the electronic component is simply referred to as a "component," and the printed circuit board is simply referred to as a "board." A detailed structure of the component assembly machine 10A is described with reference to Fig. 2. The component assembly machine 10A performs an assembly process of mounting the component 4 at a mounting location on the plate 2. As shown in Fig. 2, the component assembly machine 10A comprises the component feeder unit 12, the contact area 13, the feeder holding section 14, the component assembly section 15, which includes the assembly head 16 and the head movement device 18, the image acquisition device 30, the plate conveyor 20, and the control device 22. The component feeder unit 12 comprises several feeders arranged in a +X direction (i.e., the depth direction of the paper surface in Fig. 2), and each feeder receives several components 4. Each feeder of the component feeder unit 12 is detachably attached to the feeder holding section 14 and delivers the components 4 to the assembly head 16. Touch panel 13 displays various information relating to component assembly machine 10A. Touch panel 13 also functions as an actuation section, receiving various instructions from a worker. The mounting head 16 includes the nozzle 6, which is detachably fixed. The nozzle 6 has a cylindrical shape that extends downwards towards the plate 2. When the interior of the nozzle 6 is held under negative pressure, the nozzle 6 picks up the component 4. The mounting head 16 moves the nozzle 6 along the z-axis (that is, in the vertical direction of the paper surface in Fig. 2). The mounting head 16 can pick up the component 4 from the feeder through the nozzle 6 and mount the component 4, picked up by the nozzle 6, onto the plate 2 at the mounting location. The mounting head 16 is not limited to a mounting head with a single nozzle 6, but can be a mounting head with multiple nozzles 6. Furthermore, the mounting head 16 can include a clamping device instead of the nozzle 6, which grips and holds the component 4. The head movement device 18 is a device that moves the mounting head 16 and the image acquisition device 30 along the XY plane. The head movement device 18 moves the mounting head 16 to the mounting position on the plate 2. The image acquisition device 30 comprises the camera 32 (an example of an image acquisition section), an illumination light source (not shown), and a prism (not shown). The camera 32 captures an image of the side surface of the component 4 picked up by the nozzle 6 from the side (that is, in the right direction of the paper surface in Fig. 2). For example, a CCD camera is used as the camera 32. The illumination light source comprises an LED and illuminates an imaging surface of the component 4. In a modification, the image acquisition device 30 can, for example, comprise a camera that captures an image of the bottom surface of the component 4 picked up by the nozzle 6 from below, instead of the camera 32 that captures an image of the side surface of the component 4 picked up by the nozzle 6 from the side. In this case, the camera can, for example, be arranged between the feeder holding section 14 and the plate conveyor 20 of the component assembly machine 10A.In the present modification, the camera is an example of the "image acquisition section". Alternatively, in another modification, the image acquisition device 30 can include both the camera 32, which captures an image of the side surface of component 4 from the side, and the camera, which captures an image of the bottom surface of component 4 from below. The plate conveyor 20 is a device that feeds the plate 2 in, positions it, and conveys it out. In one example, the plate conveyor 20 of the present example comprises a pair of belt conveyors and a support device (not shown) that supports the plate 2 from below. When the assembly of component 4 in component assembly machine 10A is complete, the plate conveyor 20 conveys the plate 2 out to the adjacent component assembly machine 10B. The control device 22 is a computer that controls each section of the component assembly machine 10A and is communicatively connected to the management device 50 (see Fig. 1). A control configuration of the respective devices 50 and 10A to 10C of the component assembly management system 100 is described with reference to Fig. 3. The management device 50 is, for example, an end-user device such as a laptop computer, and comprises the actuation section 52, the display section 54, the communication interface 56, and the management control panel 60. The management device 50 can be a desktop personal computer or an end-user device such as a smartphone or a PDA. The actuation section 52 receives various instructions from the user. The display section 54 shows various information relating to the component assembly line 10. The communication interface 56 is an interface for connecting to each of the component assembly machines 10A to 10C of the component assembly line 10.In the present example, the management device 50 and the component assembly machines 10A to 10C are connected via a wired LAN through the communication interface 56, but in a modification, each device of the component assembly management system 100 can be connected via a wireless LAN through the communication interface F 56 of the management device 50. The management control disk 60 is a control disk for controlling the management device 50. The management control disk 60 comprises the CPU 62 and the memory 64. The memory 64 comprises non-volatile and volatile memory and stores the program 66. The program 66 is a program for controlling the component assembly line 10 and includes, for example, a program for executing job determination processing, which will be described later. The program 66 is installed in the management device 50 from the moment the management device 50 is delivered. In a modification, the program 66 can subsequently be downloaded to the management device 50 from an external server or can be loaded into the management device 50 from a medium that is delivered together with the component assembly machine 10A, for example. The CPU 62 executes various processes according to the program 66 in the memory 64.CPU 62 transmits job information to component assembly machines 10A to 10C, for example, based on a production program received from a higher-level production management device (not shown). The job information is an instruction to cause each of the component assembly machines 10A to 10C to execute the assembly process. As shown in Fig. 3, the component assembly machine 10A further comprises the communication interface 11 in addition to the touch field 13, the component assembly section 15 and the camera 32, which are described with reference to Fig. 2. The communication interface 11 is connected to the communication interface 56 of the management device 50. The control device 22 comprises the assembly control plate 40 and the analysis control plate 41. The assembly control plate 40 is primarily used to control the component assembly section 15. The assembly control plate 40 includes the CPU 42 and the memory 46. The memory 46 comprises non-volatile and volatile memory and stores the program 48. The program 48 is a program related to the assembly process and is installed in the component assembly machine 10A from the moment of delivery of the component assembly machine 10A. In one modification, the program 48 can be loaded into the component assembly machine 10A from a medium supplied with the component assembly machine 10A. For example, the CPU 42 of the assembly control plate 40, through the component assembly section 15, mounts component 4 onto plate 2 at an assembly location according to the program 48. The analysis control plate 41 is a control plate for analyzing primarily an image of component 4 captured by the camera 32 and for determining whether component 4 is being fed normally through the nozzle 6. That is, the analysis control plate 41 analyzes the image of component 4 captured by the camera 32. The analysis control plate 41 comprises the CPU 43 and the memory 45. The memory 45 includes non-volatile and volatile memory and stores the program 47. The program 47 is a program related to image analysis and includes the calculation formula F1. The program 47 is installed in the component assembly machine 10A from the time of delivery of the component assembly machine 10A, but can be loaded into the component assembly machine 10A from a medium that is delivered together with the component assembly machine 10A.Formula F1 is used to calculate the analysis time required by the analysis control plate 41 to analyze the image of component 4. The analysis time varies depending on factors such as the size of component 4 and the number of electrodes provided in the analysis control plate 41. The larger the component 4, the longer the analysis time; conversely, the smaller the component 4, the shorter the analysis time. The electrodes of the analysis control plate 41 process signals during image analysis. Therefore, increasing the number of electrodes in the analysis control plate 41 improves the image resolution and increases the analysis time. Conversely, decreasing the number of electrodes in the analysis control plate 41 results in lower image resolution and a shorter analysis time.Therefore, the calculation formula F1 includes, for example, the size coefficient C1, with which the size value of component 4 contained in the image is multiplied, and the electrode coefficient C2, with which the number of electrodes of the analysis control plate 41 is multiplied. The size coefficient C1 is determined by the analysis time of the analysis control plate 41 for the size value of component 4 per unit. That is, the size coefficient C1 changes according to the analysis performance of the analysis control plate 41 (such as the processing capacity of the CPU 43). The electrode coefficient C2 is determined by the analysis time of the analysis control plate 41 per electrode. That is, the electrode coefficient C2 changes according to the performance of the electrode and the analysis performance of the analysis control plate 41. The calculation formula F1 includes a formula for summing a value obtained by multiplying the size value of component 4 contained in the image by the size coefficient C1, and a formula obtained by multiplying the number of electrodes of the analysis control plate 41 by the electrode coefficient C2. The control device 22 of the component assembly machine 10B, like the component assembly machine 10A, includes the analysis control plate 41. However, the control device 22 of the component assembly machine 10C includes the analysis control plate 41R instead of the analysis control plate 41. The analysis control plate 41R is an improved version of the analysis control plate 41. For example, the analysis control plate 41R is equipped with the CPU 43R, which has enhanced processing capacity, and the analysis processing capacity is improved. This means that, with regard to the CPU mounted on the analysis control plate, it may be difficult to obtain a component with the same performance, and the CPU can be upgraded to a high-performance CPU to handle a potential increase in processing load in the future. Therefore, even if the component assembly machines 10 are the same product, the analysis control plates do not necessarily have the same performance.Therefore, the improved analysis control plate 41R uses calculation formula F2 for the analysis control plate 41 instead of calculation formula F1. Unlike calculation formula F1, calculation formula F2 includes the size coefficient C3 and the electrode coefficient C4. In the present example, the size coefficient C3 of calculation formula F2 is smaller than the size coefficient C1 of calculation formula F1. The electrode coefficient C4 of calculation formula F2 is larger than the electrode coefficient C2 of calculation formula F1. As described above, component assembly machines 10A through 10C are the same model. However, component assembly machines 10A and 10B include the analysis control plate 41, while component assembly machine 10C includes the analysis control plate 41R. This means that although component assembly machine 10C is the same model as component assembly machines 10A and 10B, the performance of the image analysis device differs. For example, if the improved analysis control plate 41R is subsequently installed on component assembly machine 10C, the performance of the image analysis device on each of the component assembly machines 10A through 10C may differ, instead of the analysis control plate 41 that is installed on component assembly machine 10C when it is delivered. The processing performed between devices 50 and 10A to 10C of the component assembly management system 100 is described with reference to Fig. 4. The processing performed by the management control board 60 and the processing performed by the assembly control board 40 and the analysis control boards 41 and 41R are described below, primarily for the respective devices 50 and 10A to 10C, without describing the respective control boards 60, 40, 41, and 41R in detail. All communication between devices 50 and 10A to 10C in Fig. 4 is performed via the communication interfaces 56 and 11, but the description "via the communication interface" is omitted below. First, the management device 50 obtains a production program from a higher-level production management device (T10). In this case, the management device 50 transmits an information request signal to the component assembly machine 10A (T20). The information request signal is a signal that requests the component assembly machine 10A to transmit performance information indicating the current performance of the component assembly machine 10A. The management device 50 can cause the component assembly machine 10A to transmit the performance information by transmitting the information request signal to the component assembly machine 10A. After receiving the information request signal from the management device 50 (T20), the component assembly machine 10A transmits its performance information to the management device 50 (T22). This performance information includes the calculation formula F1, which is stored in memory 45 of the analysis control board 41 of the component assembly machine 10A. After receiving the power information from the component assembly machine 10A (T22), the management device 50 stores the received power information (T24). Similarly, the management device 50 transmits an information request signal to the component assembly machine 10B (T30) and receives power information containing the calculation formula F1 from the component assembly machine 10B (T32). Accordingly, the management device 50 stores the received power information (T34). Furthermore, the management device 50 transmits an information request signal to the component assembly machine 10C (T40) and receives performance information containing the calculation formula F2 from the component assembly machine 10C (T42). The management device 50 stores the received performance information (T44). The management device 50 performs job determination processing based on the received performance information (T50). Job determination processing is a process for determining the assembly process of each of the component assembly machines 10A to 10C. In job determination processing, the management device 50 optimizes the assembly process in each of the component assembly machines 10A to 10C, thus maximizing the assembly efficiency of component assembly line 10. Job determination processing is executed in response to the receipt of performance information from all component assembly machines 10A to 10C of component assembly line 10. In particular, the management device 50 first assigns the components contained in the production program to the component assembly machines 10A to 10C (S10). Specifically, based on the component quantity and component type information contained in the production program, the components contained in the production program are assigned to three groups of components to be assembled by the respective component assembly machines 10A to 10C. The component type information includes assembly location information, which specifies the assembly location of the component. Management device 50 calculates the assembly time required for the assembly process of the component groups allocated in S10 (S12). For example, management device 50 calculates the assembly time of component assembly machine 10A based on the performance information received in T22. That is, management device 50 calculates the analysis time included in the assembly time of component assembly machine 10A based on calculation formula F1. Similarly, management device 50 calculates the assembly time of component assembly machine 10B based on the performance information received in T32 and calculates the assembly time of component assembly machine 10C based on the performance information received in T42. That is, management device 50 calculates the analysis time included in the assembly time of component assembly machine 10C based on calculation formula F2. Management device 50 determines whether the assembly time calculated in S12 for each of the component assembly machines 10A to 10C is optimized (S20). Specifically, management device 50 determines whether the difference between the assembly times of component assembly machines 10A to 10C is within a predetermined threshold. That is, management device 50 determines whether the cycle time synchronization of each of the component assembly machines 10A to 10C is optimized. If the difference between the assembly times of component assembly machines 10A to 10C exceeds the predetermined threshold (NO in S20), management device 50 reallocates the components (S10). If the difference between the assembly times of component assembly machines 10A to 10C is within the predetermined threshold (YES in S20), management device 50 proceeds to S30.The management device 50 repeats the processes of S10 and S20 until the cycle time of each of the component assembly machines 10A to 10C is optimized. The management device 50 determines, as a job, the conditions identified as optimized in S20, namely the component type and the number of components of the component groups assigned to the respective component assembly machines 10A to 10C in S10 (S30). As described above, the management device 50 calculates the assembly time of each of the component assembly machines 10A to 10C based on the calculation formulas F1 and F2, which are contained in the performance information received from the component assembly machines 10A to 10C, and determines a job based on the calculated assembly time. Accordingly, the job can be optimized based on the precise assembly time derived from the latest calculation formulas for the analysis time. Next, the management device 50 transfers the job information specified in S30 for component assembly machine 10A to component assembly machine 10A (T60). Similarly, the management device 50 transfers the job information for component assembly machine 10B to component assembly machine 10B (T62) and the job information for component assembly machine 10C to component assembly machine 10C (T64). The job information includes the component type and the number of components in the assembly process in each of the component assembly machines 10A through 10C. After receiving the job information from the management device 50 (T60), the component assembly machine 10A performs the assembly process based on the component type and number of components included in the job information (T70). Similarly, after receiving job information from management device 50 (T62), component assembly machine 10B executes the assembly process based on the job information (T72), and after receiving job information from management device 50 (T64), component assembly machine 10C executes the assembly process based on the job information (T74). As described above, by transferring the job from management device 50 to any of the component assembly machines 10A to 10C, the job, optimized based on the latest calculation formulas for analysis time, can be executed by any of the component assembly machines 10A to 10C. (Effects of the present example) In a conventional component assembly management system, for example, the management device stores a calculation formula for the analysis time, associated with a model name of the component assembly machine. Even if the calculation formula for the analysis time is subsequently changed in the component assembly machine, the management device in the conventional component assembly management system will still calculate the assembly time based on the formula before the change. As a result, the actual analysis time in the component assembly machine may differ from the analysis time calculated by the management device, and conversely, the calculated assembly time may differ from the actual assembly time.In the component assembly management system 100 of this example, the assembly time of component assembly machine 10A is calculated based on the performance information contained in the calculation formula F2 for component assembly machine 10C (S12). Therefore, even if the image analysis performance of component assembly machine 10C is changed after installation, the exact assembly time can still be calculated based on the latest calculation formula F2. In this example, calculation formulas F1 and F2 are examples of "performance-related information." Although it is also possible to store (manage) the performance information of each of the component assembly machines 10A to 10C through the management device 50, the component assembly machines 10A to 10C are identical in the model, and managing them as separate machines in the management device 50 would complicate management.In the present example, the performance information of each of the component assembly machines 10A to 10C is stored in each of the component assembly machines (for example, the improved analysis control panel 41R). Therefore, it is possible to accurately calculate the assembly time taking into account various improvements implemented in the component assembly machines 10A to 10C, without complicating the management carried out by the management device 50. This document describes key aspects of the component assembly management system 100, as described in the example. The performance information can, for example, include identification information for determining the version of the analysis control panel of each of the component assembly machines 10A to 10C. In this case, the management device 50 can store the identification information of each of the component assembly machines 10A to 10C and the calculation formulas F1 and F2 for the analysis time in relation to each other. The management device 50 can specify the calculation formula based on the identification information received from each of the component assembly machines 10A to 10C and calculate the assembly time. In this modification, the identification information is an example of "performance-related information." Component assembly line 10 can include one component assembly machine 10A. Generally speaking, the component assembly management system 100 does not need to manage multiple component assembly machines 10A to 10C. The performance information can, for example, include a calculation formula for the assembly time of component assembly section 15 instead of the calculation formulas F1 and F2 for the analysis time. In the present modification, the calculation formula for assembly time is an example of "performance-related information". The management device 50 does not need to perform the job determination processing at T50 in Fig. 4. In this case, the management device 50 does not need to transfer the job to each of the component assembly machines 10A to 10C. In this modification, for example, the assembly time calculated based on the performance information can be displayed on the display section 54 of the management device 50. Accordingly, the administrator can know the exact assembly time calculated based on the performance information. The management device 50 does not need to transmit the information request signal to each of the component assembly machines 10A to 10C. In the present modification, for example, each of the component assembly machines 10A to 10C can transmit the performance information to the management device 50 at a predetermined time. The technical elements described in this description or the drawings are technically useful independently or in various combinations and are not limited to the combinations described in the claims as originally filed. Furthermore, the technology illustrated in this description or the drawings fulfills several purposes simultaneously, and the fulfillment of any one of these purposes is already technically useful. For example, the present description also discloses a technical concept in which, in claim 3, "the component assembly management system according to claim 1" is changed to "the component assembly management system according to claim 1 or 2". Similarly, a technical concept is disclosed in which, in claim 4, "the component assembly management system according to claim 1" is changed to "the component assembly management system according to any one of claims 1 to 3", and a technical concept in which, in claim 6, "the component assembly management system according to claim 1" is changed to "the component assembly management system according to any one of claims 1 to 5". QUOTES INCLUDED IN THE DESCRIPTION This list of documents cited by the applicant was automatically generated and is included solely for the reader's convenience. The list is not part of the German patent or utility model application. The DPMA accepts no liability for any errors or omissions. Cited patent literature JP-A-H08-76818

[0003]

Claims

A component assembly management system comprising: a component assembly machine; and a management device configured to manage the component assembly machine, wherein the component assembly machine comprises: a component assembly section configured to perform an assembly process of mounting a component onto a plate; a memory section configured to store information relating to the performance of the component assembly machine for performing the assembly process; and a transmission section configured to transmit the information stored in the memory section to the management device, and the management device comprises: a receiving section configured to receive the information transmitted by the transmission section;and a calculation section configured to calculate the assembly time required to perform the assembly process in the component assembly machine based on the information received from the receiving section. The component assembly management system according to claim 1, wherein the management device is configured to manage multiple component assembly machines, each of the multiple component assembly machines comprises the component assembly section, the storage section and the transmission section, the receiving section is configured to obtain the information transmitted by the transmission section of each of the multiple component assembly machines, and the calculation section is configured to calculate the assembly time of each of the multiple component assembly machines based on the information received by the receiving section of each of the multiple component assembly machines. The component assembly management system according to claim 1, wherein the component assembly machine comprises: an image acquisition section configured to acquire an image of the component, and an image processing device configured to analyze the image of the component acquired by the image acquisition section, and the information is information relating to a performance of the image processing device. The component assembly management system according to claim 1, wherein the component assembly management system further comprises a job determination section configured to determine a job to be performed in the assembly process in the component assembly machine based on the information obtained from the receiving section, and the job designates at least one type and number of components to be assembled in the assembly process. The component assembly management system according to claim 4, wherein the management device further comprises a job transfer section configured to transfer the job determined by the job determination section to the component assembly machine. The component assembly management system according to claim 1, wherein the management device further comprises an information request transmission section configured to transmit an information request signal to the component assembly machine to request a transmission of the information to the management device. A component assembly machine comprising: a component assembly section configured to perform an assembly process of mounting a component onto a plate; a memory section configured to store information relating to the performance of the component assembly machine for performing the assembly process; and a transmission section configured to transmit the information stored in the memory section to the management device, the management device comprising: a receiving section configured to receive the information transmitted by the transmission section; and a calculation section configured to calculate the assembly time required to perform the assembly process in the component assembly machine based on the information received by the receiving section. A method for managing a component assembly machine, the component assembly machine comprising: a component assembly section configured to perform an assembly process of mounting a component onto a plate, and a storage section configured to store information relating to the performance of the component assembly machine for performing the assembly process; the method comprising: a capture step for capturing the information transmitted by the component assembly machine; and a calculation step for calculating the assembly time required to perform the assembly process in the component assembly machine based on the information received in the reference step.

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