Substrate processing apparatus and substrate processing method

Abstract

This disclosure describes a substrate processing apparatus and a substrate processing method capable of detecting the position of a notch in a substrate with high precision. [Solution] The substrate processing apparatus comprises a rotating holding unit configured to hold and rotate a substrate having a notch, an imaging unit configured to image the substrate held by the rotating holding unit, and a control unit. The control unit is configured to perform a first process in which the imaging unit controls the imaging unit to acquire multiple images including the entire substrate by imaging the entire substrate multiple times from the same imaging position while the substrate held by the rotating holding unit is stationary, while changing the imaging conditions; a second process in which the imaging unit sets different processing areas for each of the multiple images according to the imaging conditions; and a third process in which it processes each processing area of ​​the multiple images to detect the position of the notch on the substrate.

Description

Technical Field

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method.

Background Art

[0002] Currently, in manufacturing semiconductor devices by microfabricating a substrate (e.g., a semiconductor wafer), there is known a substrate processing system that performs substrate processing by discharging various processing liquids onto the substrate while rotating the substrate held in a holding unit (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure describes a substrate processing apparatus and a substrate processing method capable of detecting the position of a notch of a substrate with high accuracy.

Means for Solving the Problems

[0005] An example of a substrate processing apparatus includes a rotation holding unit configured to rotate while holding a substrate provided with a notch, an imaging unit configured to image the substrate held by the rotation holding unit, and a control unit. The control unit controls the imaging unit to acquire a plurality of imaging images including the entire substrate by imaging the entire substrate a plurality of times while changing imaging conditions from the same imaging position during the stationary state of the substrate held by the rotation holding unit (first process), set processing regions in different regions for each of the plurality of imaging images according to the imaging conditions (second process), and perform image processing on the processing regions of each of the plurality of imaging images to detect the position of the notch of the substrate (third process).

Effects of the Invention

[0006] According to the substrate processing apparatus and substrate processing method described herein, it becomes possible to detect the position of a notch in a substrate with high precision. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a schematic plan view showing an example of a substrate processing system. [Figure 2] Figure 2 is a schematic diagram showing an example of a liquid processing unit, and is a cross-sectional view showing the state when the substrate is in the lowered position. [Figure 3] Figure 3 is a schematic diagram of an example of a liquid processing unit, showing a cross-sectional view of the unit when the substrate is in the raised position. [Figure 4] Figure 4 is a block diagram showing an example of the main components of a substrate processing system. [Figure 5] Figure 5 is a schematic diagram showing an example of the controller's hardware configuration. [Figure 6] Figure 6 is a flowchart illustrating an example of substrate processing. [Figure 7] Figure 7 is a flowchart illustrating an example of the process for detecting a notch. [Figure 8] Figure 8 is a flowchart illustrating an example of the positional displacement detection process. [Figure 9] Figure 9 shows an example of three captured images obtained when the imaging unit captured images of the entire substrate three times while changing the imaging conditions. [Figure 10] Figure 10(a) shows an example of a corrected image in which distortion aberration has been corrected, and Figure 10(b) shows an example of a corrected image in which the outer edge of the substrate has been corrected to be approximately a perfect circle. [Figure 11]Figure 11(a) shows an example of a corrected image after polar coordinate transformation, Figure 11(b) shows an example of an extracted image after edge extraction processing, Figure 11(c) shows an example of a binarized image after binarization processing, Figure 11(d) shows an example of a interpolated image after edge interpolation processing, and Figure 11(e) shows an example of how substrate contour lines, virtual line segments, and notch contour lines are drawn in the interpolated image. [Figure 12] Figure 12 shows an example of a composite image obtained by combining the processing areas of multiple captured images into a single image. [Modes for carrying out the invention]

[0008] In the following descriptions, the same reference numeral will be used for identical elements or elements with the same function, and redundant explanations will be omitted. Furthermore, in this specification, when referring to the top, bottom, right, and left of a figure, the direction of the reference numeral in the figure will be used as the reference.

[0009] [Circuit board processing system] First, with reference to Figure 1, a substrate processing system 1 (substrate processing apparatus) configured to process a substrate W will be described. The substrate processing system 1 comprises an input / output station 2, a processing station 3, and a controller Ctr (control unit). The input / output station 2 and the processing station 3 may be arranged in a single line horizontally, for example.

[0010] The substrate W may be disc-shaped or plate-shaped in a non-circular shape, such as a polygon. The substrate W has a notch N in which a portion is cut out. The notch N may be, for example, a notch (groove such as U-shaped or V-shaped) or a straight section extending in a straight line (a so-called orientation flat). The substrate W may be, for example, a semiconductor substrate (silicon wafer), a glass substrate, a mask substrate, an FPD (Flat Panel Display) substrate, or various other types of substrates. The diameter of the substrate W may be, for example, about 200 mm to 450 mm.

[0011] The loading / unloading station 2 includes a placement unit 4, a loading / unloading unit 5, and a shelf unit 6. The placement unit 4 includes a plurality of placement tables (not shown) arranged in the width direction (the vertical direction in FIG. 1). Each placement table is configured to be able to place a carrier 7. The carrier 7 is configured to accommodate at least one substrate W in a sealed state. The carrier 7 includes an opening / closing door (not shown) for taking in and out the substrate W.

[0012] The loading / unloading unit 5 is arranged adjacent to the placement unit 4 in the direction in which the loading / unloading station 2 and the processing station 3 are arranged (the left - right direction in FIG. 1). The loading / unloading unit 5 includes an opening / closing door (not shown) provided for the placement unit 4. When the carrier 7 is placed on the placement unit 4, the opening / closing door of the carrier 7 and the opening / closing door of the loading / unloading unit 5 are both opened, so that the inside of the loading / unloading unit 5 and the inside of the carrier 7 communicate with each other.

[0013] The loading / unloading unit 5 incorporates a transfer arm A1 and a shelf unit 6. The transfer arm A1 is configured to be able to perform horizontal movement in the width direction of the loading / unloading unit 5, vertical movement in the vertical direction, and pivoting movement around the vertical axis. The transfer arm A1 is configured to take out the substrate W from the carrier 7 and deliver it to the shelf unit 6, and also to receive the substrate W from the shelf unit 6 and return it into the carrier 7. The shelf unit 6 is located near the processing station 3 and is configured to accommodate the substrate W.

[0014] The processing station 3 includes a transfer unit 8 and a plurality of liquid - processing units U. The transfer unit 8 extends horizontally, for example, in the direction in which the loading / unloading station 2 and the processing station 3 are arranged (the left - right direction in FIG. 1). The transfer unit 8 incorporates a transfer arm A2. The transfer arm A2 is configured to be able to perform horizontal movement in the longitudinal direction of the transfer unit 8, vertical movement in the vertical direction, and pivoting movement around the vertical axis. The transfer arm A2 is configured to take out the substrate W from the shelf unit 6 and deliver it to the liquid - processing unit U, and also to receive the substrate W from the liquid - processing unit U and return it into the shelf unit 6.

[0015] A plurality of liquid processing units U are arranged in a line along the longitudinal direction (left - right direction in FIG. 1) of the transfer unit 8 on each of both sides of the transfer unit 8. The configuration of the liquid processing unit U will be described later.

[0016] The controller Ctr, which will be described in detail later, is configured to control the substrate processing system 1 partially or entirely.

[0017] [Liquid Processing Unit] Next, referring to FIGS. 2 and 3, the liquid processing unit U will be described. The liquid processing unit U includes a housing 10, a drive unit 20 (rotation holding unit, lifting unit), a cup unit 30, a supply unit 40, an imaging unit 50, at least one illumination unit 60, and a blower unit 70.

[0018] The housing 10 is a housing configured to be able to carry in and out the substrate W therein. An inlet / outlet (not shown) is formed in the side wall of the housing 10. The substrate W is carried into the housing 10 through the inlet / outlet by the transfer arm A2 and is also carried out from the housing 10 to the outside.

[0019] The drive unit 20 includes a drive source 21, a shaft 22, and a holding unit 23. The drive source 21 operates based on an operation signal from the controller Ctr and is configured to rotate the shaft 22 and lift the shaft 22. The drive source 21 is a power source such as an electric motor or an electric actuator.

[0020] The holding unit 23, for example, has a disk - like shape and is provided at the tip of the shaft 22. Therefore, the holding unit 23 rotates via the shaft 22 and moves up and down via the shaft 22 due to the operation of the drive source 21.

[0021] The upper surface of the holding portion 23 is provided with a plurality of holding members 23a that protrude upward. The plurality of holding members 23a are configured to hold the outer edge of the substrate W by moving in the radial direction of the holding portion 23. That is, the substrate W is held by the plurality of holding members 23a in a substantially horizontal position above the upper surface of the holding portion 23.

[0022] As described above, the drive unit 20 is configured to hold the substrate W in a substantially horizontal position and rotate the substrate W around a central axis (rotation axis) perpendicular to the upper surface Wa of the substrate W. The drive unit 20 is configured to move the holding unit 23 up and down between a lowered position (see Figure 2) and an raised position (see Figure 3) by raising and lowering the shaft 22 using the drive source 21. As illustrated in Figure 2, in the lowered position, the substrate W held by the multiple holding members 23a is located inside the cup portion 30. On the other hand, as illustrated in Figure 3, in the raised position, the substrate W held by the multiple holding members 23a is located above the cup portion 30.

[0023] As illustrated in Figure 2, the cup portion 30 is provided so as to surround the holding portion 23 from the outside. The cup portion 30 is configured to collect the processing liquid (for example, the chemical solution L1 and cleaning solution L2 described later) that is scattered from the outer edge of the substrate W as the substrate W is held and rotated by the drive unit 20. A drain port 31 and an exhaust port 32 are provided at the bottom of the cup portion 30.

[0024] The drain port 31 is configured to discharge the processed liquid collected by the cup portion 30 to the outside of the liquid processing unit U. The exhaust port 32 is configured to discharge the downward flow formed around the substrate W by the blower portion 70 to the outside of the liquid processing unit U. This downward flow is accompanied by gas generated around the substrate W as the substrate W is processed by the processing liquid.

[0025] The supply unit 40 is configured to supply processing liquid (chemical solution L1, cleaning solution L2) to the upper surface Wa of the substrate W. The supply unit 40 includes supply mechanisms 41A, 41B, a nozzle unit 42, and a drive source 43.

[0026] The supply mechanism 41A operates based on an operating signal from the controller Ctr and is configured to deliver the chemical solution L1 stored in a container (not shown) by a liquid delivery mechanism (not shown), such as a pump. The chemical solution L1 may contain, for example, an alkaline or acidic chemical solution for processing (e.g., removal of dirt and foreign matter, etching, etc.). The alkaline chemical solution may include, for example, SC-1 solution (a mixture of ammonia, hydrogen peroxide, and pure water). The acidic chemical solution may include, for example, SC-2 solution (a mixture of hydrochloric acid, hydrogen peroxide, and pure water), SPM (a mixture of sulfuric acid and hydrogen peroxide), HF / HNO3 solution (a mixture of hydrofluoric acid and nitric acid), etc.

[0027] The supply mechanism 41B operates based on an operation signal from the controller Ctr and is configured to deliver the cleaning liquid L2 stored in a container (not shown) by a liquid delivery mechanism (not shown), such as a pump. The cleaning liquid L2 may contain, for example, pure water (DIW), ozonated water, carbonated water (CO2 water), ammonia water, etc.

[0028] The nozzle unit 42 is configured to discharge the chemical solution L1 and cleaning solution L2 supplied from the supply mechanisms 41A and 41B onto the upper surface Wa of the substrate W, respectively. The nozzle unit 42 includes nozzles 42A and 42B and an arm 42C. Nozzle 42A is connected to a container for storing the chemical solution L1 via piping (not shown). Nozzle 42B is connected to a container for storing the cleaning solution L2 via piping (not shown). The arm 42C holds the nozzles 42A and 42B.

[0029] The drive source 43 is configured to move the arm 42C in the height and horizontal directions based on signals from the controller Ctr.

[0030] The imaging unit 50 operates based on an operation signal from the controller Ctr and is configured to image the entire upper surface Wa of the substrate W held by the plurality of holding members 23a. When viewed from above, the imaging unit 50 is positioned within the housing 10 in a location that does not overlap with the substrate W held by the plurality of holding members 23a. The imaging unit 50 may be directly attached to the wall surface of the housing 10, or it may be indirectly attached to the housing 10 via a support member or the like.

[0031] At least one illumination unit 60 operates based on an operation signal from the controller Ctr and is configured to illuminate the substrate W when imaging is performed by the imaging unit 50. At least one illumination unit 60 may be mounted on the inner wall surface of the housing 10 (e.g., the side wall, the ceiling, etc.). The liquid processing unit U may include a plurality of illumination units 60. An illumination unit 60 is composed of a collection of a plurality of light sources 61. An illumination unit 60 may be, for example, an LED module in which a plurality of LEDs are arranged.

[0032] The air blower 70 is located on the ceiling of the housing 10 and above the drive unit 20 and the cup unit 30. When viewed from above, the air blower 70 covers the entire substrate W held by the multiple holding members 23a. The air blower 70 operates based on an operation signal from the controller Ctr and is configured to form a downward flow toward the upper surface Wa of the substrate W held by the multiple holding members 23a.

[0033] [controller] As shown in Figure 4, the controller Ctr has a reading unit M1, a storage unit M2, a processing unit M3, and an instruction unit M4 as functional modules. These functional modules are merely a convenient division of the controller Ctr's functions into multiple modules, and do not necessarily mean that the hardware constituting the controller Ctr is divided into such modules. Each functional module is not limited to being implemented by program execution, but may also be implemented by a dedicated electrical circuit (e.g., a logic circuit) or an integrated circuit (ASIC: Application Specific Integrated Circuit) that integrates these.

[0034] The reading unit M1 is configured to read a program from a computer-readable recording medium RM. The recording medium RM stores a program for operating each part of the substrate processing system 1 (drive sources 21, 43, supply mechanisms 41A, 41B, imaging unit 50, illumination unit 60, blower unit 70, etc.). The recording medium RM may be, for example, a semiconductor memory, an optical recording disk, a magnetic recording disk, or a magneto-optical recording disk. The recording medium RM may be built into the substrate processing system 1 or may be a separate unit from the substrate processing system 1.

[0035] The storage unit M2 is configured to store various types of data. For example, the storage unit M2 may store programs read from the recording medium RM by the reading unit M1, setting data input from the operator via an external input device (not shown), and so on.

[0036] The processing unit M3 is configured to process various types of data. For example, the processing unit M3 may be configured to generate operation signals for operating each part of the substrate processing system 1 based on various types of data stored in the storage unit M2.

[0037] The instruction unit M4 is configured to transmit the operation signals generated in the processing unit M3 to each part of the substrate processing system 1.

[0038] The hardware of the controller Ctr may consist of, for example, one or more control computers. The controller Ctr may include, for example, the circuit C1 shown in Figure 5 as a hardware configuration. Circuit C1 may consist of electrical circuit elements. Circuit C1 may include, for example, a processor C2, a memory C3 (storage unit), a storage C4 (storage unit), a driver C5, and an input / output port C6. The processor C2 executes a program in cooperation with at least one of the memory C3 and storage C4, and performs signal input and output via the input / output port C6, thereby configuring each of the above-mentioned functional modules. The memory C3 and storage C4 function as storage unit M2. The driver C5 is a circuit that drives each part of the board processing system 1. The input / output port C6 performs signal input and output between the driver C5 and each part of the board processing system 1.

[0039] The substrate processing system 1 may have one controller Ctr, or it may have a controller group (control unit) composed of multiple controllers Ctr. In the latter case, each of the above functional modules may be implemented by one controller Ctr, or by a combination of two or more controllers Ctr. If the controller Ctr is composed of multiple computers (circuit C1), each of the above functional modules may be implemented by one computer (circuit C1), or by a combination of two or more computers (circuit C1). The controller Ctr may include multiple processors C2. In this case, each of the above functional modules may be implemented by one processor C2, or by a combination of two or more processors C2.

[0040] [Substrate Processing Method] Next, the processing of the substrate W will be explained with reference to Figures 6 to 11. First, the controller Ctr instructs the transport arms A1 and A2 to take one substrate W from the carrier 7 and transport it toward the liquid processing unit U. Next, in the liquid processing unit U, the controller Ctr instructs the drive source 21 to raise the holding unit 23 to the raised position (see Figure 3). Next, the controller Ctr instructs the transport arm A2 to load the substrate W into the housing 10 and have the substrate W held by the multiple holding members 23a (see step S1 in Figure 6).

[0041] Next, the controller Ctr performs a detection process for the notch N of the substrate W (see step S2 in Figure 6). The detection process for the notch N will be explained below with reference to Figure 7.

[0042] First, with the holding unit 23 in the raised position, the controller Ctr instructs the imaging unit 50 and the illumination unit 60 to take multiple images of the entire stationary substrate W while changing the imaging conditions (see step S11 in Figure 7). As a result, multiple images I1 including the entire substrate W are acquired by the imaging unit 50, and these multiple images are transmitted from the imaging unit 50 to the controller Ctr. At this time, since the imaging unit 50 is attached to the housing 10, the imaging position of the substrate W by the imaging unit 50 does not change. Also, since the imaging unit 50 is positioned so as not to overlap with the substrate W held by the multiple holding members 23a when viewed from above, the outer circumference of the substrate W in each image is approximately elliptical in shape.

[0043] Here, the imaging conditions may include, for example, the brightness of the illumination unit 60, the illumination time of the illumination unit 60, the focal position of the imaging unit 50, the ISO sensitivity of the imaging unit 50, and the exposure of the imaging unit 50. If the liquid processing unit U includes multiple illumination units 60, the imaging conditions may include, for example, the brightness of each illumination unit 60, the illumination time of each illumination unit 60, the position of the illumination unit 60 that performs illumination among the multiple illumination units 60, the focal position of the imaging unit 50, the ISO sensitivity of the imaging unit 50, and the exposure of the imaging unit 50. If the illumination unit 60 is composed of a collection of multiple light sources 61, the imaging conditions may include, for example, the brightness of the illumination unit 60, the illumination time of the illumination unit 60, the position of the light source 61 that performs illumination among the multiple light sources 61, the focal position of the imaging unit 50, the ISO sensitivity of the imaging unit 50, and the exposure of the imaging unit 50. By applying such imaging conditions, a clearer image can be obtained in each processing area R of the multiple captured images I1.

[0044] Next, for each captured image I1, different processing regions R are set according to the imaging conditions (see step S12 in Figure 7). For example, different processing regions R may be set for relatively clear areas in each captured image I1.

[0045] Each processing region R may be determined in advance by imaging the test substrate W multiple times while changing the imaging conditions. Alternatively, each processing region R may be determined each time an image I1 is captured by the controller Ctr detecting a relatively clear region in each image I1. Furthermore, the setting of the processing regions R may be performed after step S11 and before step S15 in Figure 7. That is, different processing regions R may be set for each correction image I2 described later, and different processing regions R may be set for each correction image I3 described later.

[0046] Figure 9 shows examples of three captured images I1A to I1C obtained when the imaging unit 50 captures the entire substrate W three times while changing the imaging conditions. The imaging conditions for captured image I1A may be set to have a shorter illumination time by the illumination unit 60 compared to the imaging conditions for the other captured images I1B and I1C. In this case, for example, the area at the back of captured image I1A is captured relatively clearly. Therefore, a processing area R1 is set in the area at the back of captured image I1A. The processing area R1 may be in the range of 100° to 260°, for example, when the frontmost part of the substrate W in captured image I1A is set to 0°.

[0047] The imaging conditions for captured image I1B may be set such that, for example, the illumination time by the illumination unit 60 is longer compared to the imaging conditions for captured image I1A, and shorter compared to the imaging conditions for captured image I1C. In this case, for example, the central area of ​​captured image I1B is captured relatively clearly. Therefore, a processing area R2 is set in the central area of ​​captured image I1B. The processing area R2 may be in the range of 50° to 100° and 260° to 310°, for example, when the frontmost point of the substrate W in captured image I1B is set to 0°.

[0048] The imaging conditions for captured image I1B may be set to have a longer illumination time by the illumination unit 60 compared to the imaging conditions for other captured images I1B and I1C. In this case, for example, the area closer to the viewer will be captured relatively clearly in captured image I1C. Therefore, a processing area R3 is set in the area closer to the viewer in captured image I1C. The processing area R3 may be in the range of 0° to 50° and 310° to 360°, for example, when the frontmost point of the substrate W in captured image I1C is set to 0°.

[0049] Next, the controller Ctr corrects the distortion (aberration) caused by the lens of the imaging unit 50 (for example, a wide-angle lens) for the multiple captured images I1 (see step S13 in Figure 7). The controller Ctr can correct the aberration by performing calculations using known methods based on, for example, the optical characteristics of the lens of the imaging unit 50, the imaging distance, etc. As a result, multiple corrected images I2 are obtained, each corrected from the multiple captured images I1. Figure 10(a) shows an example of a corrected image I2 in which the aberration has been corrected.

[0050] Here, if the notch N is located on the far side of the outer periphery of the substrate W in the corrected image I2, the notch N will appear relatively small, and if the notch N is located on the near side of the outer periphery of the substrate W in the corrected image I2, the notch N will appear relatively large. Therefore, the controller Ctr corrects each corrected image I2 using a known method so that the outer periphery of the substrate W in the corrected image I2 becomes approximately a perfect circle (see step S14 in Figure 7). As a result, multiple corrected images I3 are obtained, each corrected from multiple corrected images I2. Consequently, regardless of the position of the notch N on the outer periphery of the substrate W in the corrected image I2, the size of the notch N is made approximately uniform. Figure 10(b) shows an example of a corrected image I3 corrected so that the outer periphery of the substrate W becomes approximately a perfect circle.

[0051] Next, the controller Ctr performs a polar coordinate transformation on the processing region R set for each corrected image I3 (see step S15 in Figure 7). That is, the controller Ctr corrects each corrected image I3 using a known method so that the contour of the substrate W in the processing region R set for the corrected image I3 becomes a straight line. As a result, multiple corrected images I4 are obtained, each corrected from multiple corrected images I3. Figure 11(a) shows an example of a corrected image I4 that has undergone polar coordinate transformation. As illustrated in Figure 11(a), each corrected image I4 may only extract the vicinity of the contour of the substrate W. In this case, the central part of the substrate W is not processed, so reflective objects reflected on the upper surface Wa of the substrate W are excluded from image processing, making it possible to save computational resources.

[0052] Next, the controller Ctr performs edge extraction on each corrected image I4 (see step S16 in Figure 7). For example, based on the luminance value of each corrected image I4, the controller Ctr detects areas within each corrected image I4 where the brightness changes sharply, using a known method. This results in multiple extracted images I5, each of which has undergone edge extraction processing. Figure 11(b) shows an example of an extracted image I5 that has undergone edge extraction processing. Note that before performing edge extraction processing on each corrected image I4, noise reduction processing may be performed on each corrected image I4 using a known method.

[0053] Next, the controller Ctr binarizes each extracted image I5 using a known method (see step S17 in Figure 7). This results in multiple binarized images I6, each containing multiple extracted images I5 that have been binarized. Figure 11(c) shows an example of a binarized image I6.

[0054] Next, the controller Ctr interpolates the edges in each binarized image I6 using a known method (e.g., morphological operation) (see step S18 in Figure 7). This smooths the boundaries between the white and black regions in multiple binarized images I6. Figure 11(d) shows an example of the interpolated image I7 after edge interpolation.

[0055] Next, the controller Ctr extracts the contour lines corresponding to the outer edge of the substrate W in each interpolated image I7. Specifically, since the outer edge of the substrate W in each interpolated image I7 is straight, the controller Ctr extracts the areas in each interpolated image I7 where the boundary between the white area and the black area is straight as the substrate contour line PL. Figure 11(e) shows an example of how the straight substrate contour line PL (solid line in Figure 11(e)) is drawn in the interpolated image I7.

[0056] Next, the controller Ctr detects candidate notches N from each interpolated image I7. Specifically, the controller Ctr detects locations in the interpolated image I7 where the substrate contour line PL is interrupted as candidate notches N. Figure 11(e) shows an example of how virtual line segments x (dashed lines in Figure 11(e)) are drawn at locations where the substrate contour line PL is interrupted in the interpolated image I7.

[0057] Next, the controller Ctr extracts an arc-shaped curve that fits the contour of the mountain-shaped portion protruding from the virtual line segment x in each interpolated image I7 as the notch contour line y. Figure 11(e) shows an example of how the notch contour line y (dotted line in Figure 11(e)) is drawn in the interpolated image I7.

[0058] Next, the controller Ctr calculates the length of the virtual line segment x, the length of the notch contour line y, the ratio of the length of the notch contour line y to the length of the virtual line segment x (the contour line ratio), and the area of ​​the region enclosed by the virtual line segment x and the notch contour line y (the area of ​​the candidate notch N). Next, the controller Ctr detects the notch N by determining whether the candidate notch N is notch N based on at least one of the length of the virtual line segment x, the contour line ratio, and the area of ​​the candidate notch N (see step S19 in Figure 7). The controller Ctr may also determine whether the candidate notch N is not notch N by comparing, for example, the length of the virtual line segment x, the contour line ratio, and the area of ​​the candidate notch N with the parameters of the notch N of the substrate W measured in advance.

[0059] By performing the above-described detection process for the notch N, it is possible to detect where the notch N is located on the outer edge of the substrate W held by the multiple holding members 23a before processing with the processing liquid.

[0060] Next, returning to Figure 6, the substrate W is treated with the processing liquid (chemical solution L1 and cleaning solution L2) (see step S3 in Figure 6). Specifically, the controller Ctr instructs the drive source 21 to lower the holding unit 23 to the lowered position (see Figure 2). Next, the controller Ctr instructs the drive source 21 to rotate the holding unit 23 at a predetermined rotational speed. Next, the controller Ctr instructs the drive source 43 to operate the arm 42C so that the nozzles 42A and 42B are positioned above the center of the substrate W.

[0061] Next, the controller Ctr instructs the supply mechanisms 41A and 41B to supply the chemical solution L1 to the upper surface Wa of the rotating substrate W via supply mechanism 41A, and then to supply the cleaning solution L2 to the upper surface Wa of the rotating substrate W via supply mechanism 41B. This allows the substrate W to be treated with the treatment solutions.

[0062] Next, in the liquid processing unit U, the controller Ctr instructs the drive source 21 to raise the holding portion 23 to the raised position (see Figure 3). Next, the controller Ctr again performs the detection process for the notch portion N of the substrate W (see step S4 in Figure 6). This detection process for the notch portion N is the same as steps S11 to S19 in Figure 7, so the explanation is omitted. This makes it possible to detect where the notch portion N is located on the outer edge of the substrate W held by the multiple holding members 23a after processing with the processing liquid.

[0063] Next, the controller Ctr performs a process to detect the misalignment of the notch N in the circumferential direction of the substrate W (see step S5 in Figure 6). The process for detecting the notch N will be explained below with reference to Figure 8.

[0064] First, the controller Ctr compares the position of the notch N on the substrate W before and after processing with the processing solution (see step S21 in Figure 8). Specifically, the controller Ctr calculates the positional displacement angle between the position of the notch N on the substrate W before processing and the position of the notch N on the substrate W after processing.

[0065] Next, the controller Ctr determines whether the misalignment angle is within a predetermined range (see step S22 in Figure 8). If the result of the determination in step S22 in Figure 8 is that the misalignment angle is within the predetermined range (YES in step S22 in Figure 8), the controller Ctr determines that there is no misalignment of the notch N before and after processing the substrate W, and terminates the misalignment detection process.

[0066] On the other hand, if the result of the determination in step S22 of Figure 8 is that the misalignment angle is not within a predetermined range ("NO" in step S22 of Figure 8), the controller Ctr notifies the operator that a misalignment has occurred in the notch N through a notification unit (not shown) (see step S23 of Figure 8). The notification by the notification unit may be, for example, by sound, by light, or by displaying an image, video, text, etc. on a display.

[0067] The processing of the substrate W is completed when the misalignment detection process for the notch N is finished.

[0068] [Effect] In the above example, the entire substrate W is imaged multiple times from the same imaging position while changing the imaging conditions, and a different processing area R is set for each of the multiple imaged images I1 according to the imaging conditions. As a result, relatively clear images are obtained in each processing area R of the multiple imaged images I1. Then, in the above example, the position of the notch N of the substrate W is detected by image processing of each processing area R of the multiple imaged images I1. In other words, the position of the notch N is detected within the range of each processing area R captured under appropriate imaging conditions. Therefore, it is possible to detect the position of the notch N of the substrate W with high accuracy, regardless of its position in the circumferential direction of the substrate W.

[0069] In the above example, the air blower 70 covers the entire substrate W held by the holding unit 23 when viewed from above, and the imaging unit 50 is positioned so as not to overlap with the substrate W held by the holding unit 23 when viewed from above. Therefore, the downward airflow onto the substrate W by the air blower 70 is not obstructed by the imaging unit 50. Consequently, the air blown onto the substrate W by the air blower 70 makes it easier to keep the substrate W cleaner.

[0070] In the above example, imaging is performed when the substrate W is in the raised position. Therefore, the entire substrate W can be imaged more reliably without being hidden in the shadow of the cup portion 30.

[0071] In the above example, the positional displacement of the substrate W in the circumferential direction after processing is detected based on the position of the notch N before processing the substrate W and the position of the notch N after processing the substrate W. Therefore, it is possible to detect how much the position of the notch N has shifted before and after processing the substrate W.

[0072] [Differentiation] The disclosures herein should be considered in all respects to be illustrative and not restrictive. Various omissions, substitutions, and modifications may be made to the above examples without departing from the claims and the gist thereof.

[0073] In the above example, the position of the notch N in the substrate W was detected by individually processing the processing area R of each of the multiple captured images I1. However, as illustrated in Figure 12, the position of the notch N in the substrate W may also be detected by processing a composite image I8, which is obtained by combining the processing areas R of each of the multiple captured images I1 into one. Note that the generation of the composite image I8 may be performed after step S11 and before step S15 in Figure 7.

[0074] [Other examples] Example 1. An example of a substrate processing apparatus comprises a rotating holding unit configured to hold and rotate a substrate having a notch, an imaging unit configured to image the substrate held by the rotating holding unit, and a control unit. The control unit is configured to perform a first process in which the imaging unit controls the imaging unit to acquire multiple images including the entire substrate by imaging the entire substrate multiple times from the same imaging position while the substrate held by the rotating holding unit is stationary, while changing the imaging conditions; a second process in which the imaging unit sets different processing areas for each of the multiple images according to the imaging conditions; and a third process in which it processes each processing area of ​​the multiple images to detect the position of the notch on the substrate.

[0075] Incidentally, the rotating holder that holds the substrate may lose its ability to hold the substrate due to aging or other factors. In this case, when the substrate rotates during processing, the substrate may slip relative to the rotating holder in the rotational direction. Therefore, if the rotating holder is functioning correctly, the position of the notch on the substrate will be the same before and after processing. However, if the rotating holder is deteriorated, the position of the notch on the substrate may shift in the rotational direction (circumferential direction) before and after processing. If such a shift occurs, there is a concern that the processing solution may splash during processing of the substrate, resulting in improper substrate processing. For this reason, detecting the position of the notch on the substrate is important.

[0076] In the method of detecting a notch in a substrate by imaging the substrate with an imaging unit, the distance between the imaging unit and the substrate is usually relatively short. Therefore, when the imaging unit images the entire substrate, it is possible to obtain an image in which part of the substrate is clearly visible and another part is blurry. In this case, if a notch in the substrate is located in the blurry area of ​​the image, detection of the notch can be difficult, especially since the notch is very small relative to the substrate. Therefore, the apparatus in Example 1 images the entire substrate multiple times from the same imaging position while changing the imaging conditions, and sets different processing areas for each of the multiple images according to the imaging conditions. As a result, relatively clear images are obtained in each processing area of ​​the multiple images. Then, the apparatus in Example 1 processes each processing area of ​​the multiple images to detect the position of the notch in the substrate. That is, the position of the notch is detected within the range of each processing area imaged under appropriate imaging conditions. As a result, it is possible to detect the position of the notch in the substrate with high accuracy, regardless of its location in the circumferential direction of the substrate.

[0077] Example 2. The apparatus of Example 1 further comprises at least one illumination unit configured to illuminate the substrate when imaging is performed by the imaging unit, and the imaging conditions may include at least one of the brightness of at least one illumination unit, the illumination time of at least one illumination unit, the focal position of the imaging unit, the ISO sensitivity of the imaging unit, and the exposure of the imaging unit. In this case, a clearer image can be obtained in each processing area of ​​the multiple captured images.

[0078] Example 3. The apparatus of Example 2 further comprises a plurality of illumination units configured to illuminate the substrate from different positions when imaging is performed by the imaging unit, and the imaging conditions may further include the brightness of the plurality of illumination units, the illumination time of the plurality of illumination units, and the position of the illumination unit performing the illumination. In this case, an even clearer image can be obtained in each processing area of ​​the plurality of captured images.

[0079] Example 4. In the apparatus of Example 2 or Example 3, at least one illumination unit is composed of a collection of multiple light sources, and the imaging conditions may further include the brightness of at least one illumination unit, the illumination time of at least one illumination unit, and the position of the light source that provides illumination among the multiple light sources in at least one illumination unit. In this case, an even clearer image can be obtained in each processing area of ​​the multiple captured images.

[0080] Example 5. In any of the devices in Examples 1 to 4, the third process may include individually processing each processing area of ​​a plurality of captured images to detect the position of the notch in the substrate.

[0081] Example 6. In any of the devices in Examples 1 to 4, the third process may include image processing of a composite image obtained by combining the processing areas of multiple captured images into one, in order to detect the position of the notch in the substrate.

[0082] Example 7. Any of the devices in Examples 1 to 6 further includes a blower positioned above the substrate held by the rotating holder and configured to form a downward flow toward the upper surface of the substrate, wherein the blower covers the entire substrate held by the rotating holder when viewed from above, and the imaging unit may be positioned so as not to overlap the substrate held by the rotating holder when viewed from above. In this case, the downward flow toward the substrate by the blower is not obstructed by the imaging unit. Therefore, the blower makes it easier to keep the substrate cleaner.

[0083] Example 8. Any of the devices in Examples 1 to 7 further comprises a cup portion arranged to surround a substrate held by a rotating holding portion from the outside, and a lifting / lowering portion configured to raise and lower the substrate between an elevated position where the substrate is above the cup portion and a lowered position where the substrate is inside the cup portion. The first process may include acquiring multiple images by an imaging unit while the lifting / lowering portion is positioned with the substrate in the elevated position. In this case, images are taken when the substrate is in the elevated position. Therefore, it becomes possible to more reliably image the entire substrate without the substrate being hidden in the shadow of the cup portion.

[0084] Example 9. Any apparatus of Examples 1 to 8 may further include a supply unit configured to supply processing liquid to a substrate held by a rotating holding unit, and the control unit may further perform a fourth process after the first process, controlling the rotating holding unit and the supply unit to rotate the substrate and supply processing liquid to the substrate; a fifth process after the fourth process, controlling the imaging unit to acquire multiple separate images including the entire substrate by imaging the entire substrate multiple times from the same imaging position while the substrate held by the rotating holding unit is stationary, while changing the imaging conditions; a sixth process to set processing regions in different areas for each of the multiple separate images according to the imaging conditions; a seventh process to image the processing regions of each of the multiple separate images to detect the position of the notch on the substrate; and an eighth process to detect the circumferential positional displacement of the substrate after processing in the fourth process, based on the position of the notch on the substrate detected in the third process and the position of the notch on the substrate detected in the seventh process. In this case, it becomes possible to detect how much the position of the notch has shifted before and after processing the substrate.

[0085] Example 10. An example of a substrate processing method includes: a first step of acquiring multiple images including the entire substrate by an imaging unit by imaging the entire substrate multiple times from the same imaging position while the substrate is stationary and held by a rotating holding unit, while changing the imaging conditions; a second step of setting different processing areas for each of the multiple images according to the imaging conditions; and a third step of detecting the position of a notch provided on the substrate by image processing each processing area of ​​the multiple images. In this case, the same effects and advantages as the apparatus in Example 1 can be obtained.

[0086] Example 11. In the method of Example 10, the imaging conditions may include at least one of the following: the brightness of at least one illumination unit configured to illuminate the substrate when imaging is performed by the imaging unit; the illumination time of at least one illumination unit; the focal position of the imaging unit; the ISO sensitivity of the imaging unit; and the exposure of the imaging unit. In this case, the same effects as those of the apparatus in Example 2 can be obtained.

[0087] Example 12. In the method of Example 11, the imaging conditions may further include the brightness of multiple illumination units configured to illuminate the substrate from different positions when imaging is performed by the imaging unit, the illumination time of the multiple illumination units, and the position of the illumination unit performing the illumination. In this case, the same effects as the apparatus of Example 3 can be obtained.

[0088] Example 13. In the method of Example 11 or Example 12, at least one illumination unit is composed of a collection of multiple light sources, and the imaging conditions may further include the brightness of at least one illumination unit, the illumination time of at least one illumination unit, and the position of the light source that provides illumination among the multiple light sources in at least one illumination unit. In this case, the same effects as the apparatus of Example 4 can be obtained.

[0089] Example 14. In any of the methods in Examples 10 to 13, the third step may include individually processing each processing area of ​​a plurality of captured images to detect the position of the notch in the substrate.

[0090] Example 15. In any of the methods in Examples 10 to 13, the third step may include image processing of a composite image obtained by combining the processing areas of multiple captured images into one, in order to detect the position of the notch in the substrate.

[0091] Example 16. In any of the methods in Examples 10 to 15, the entire substrate held by the rotating holding unit is covered by a blower configured to be positioned above the substrate and to form a downward flow toward the upper surface of the substrate when viewed from above, and the imaging unit may be positioned so as not to overlap the substrate held by the rotating holding unit when viewed from above. In this case, the same effects and advantages as in the apparatus of Example 7 can be obtained.

[0092] Example 17. In any of the methods in Examples 10 to 16, the first step may include acquiring multiple images by the imaging unit while the substrate is in an elevated position, above the cup portion that surrounds the substrate held by the rotating holding unit from the outside. In this case, the same effects as the apparatus in Example 8 can be obtained.

[0093] Example 18. Any method from Examples 10 to 17 may further include: a fourth step of supplying processing liquid to the substrate while rotating the substrate after the first step; a fifth step of acquiring multiple separate images including the entire substrate by an imaging unit by imaging the entire substrate multiple times from the same imaging position while changing the imaging conditions while the substrate is stationary and held by the rotating holding unit after the fourth step; a sixth step of setting processing areas in different regions for each of the multiple separate images according to the imaging conditions; a seventh step of detecting the position of the notch in the substrate by image processing each of the processing areas of the multiple separate images; and an eighth step of detecting the circumferential displacement of the substrate after processing in the fourth step based on the position of the notch in the substrate detected in the third step and the position of the notch in the substrate detected in the seventh step. In this case, the same effects and advantages as the apparatus in Example 9 can be obtained. [Explanation of symbols]

[0094] 1...Substrate processing system (substrate processing device), 20...Drive unit (rotation holding unit, lifting unit), 30...Cup unit, 40...Supply unit, 50...Imaging unit, 60...Illumination unit, 61...Light source, 70...Air blowing unit, Ctr...Controller (control unit), I1, I1A~I1C...Imagine captured image, I8...Composite image, N...Notch, R1~R3...Processing area, U...Liquid processing unit, W...Substrate.

Claims

1. A rotating holding part configured to hold and rotate a substrate with a notched portion, An imaging unit configured to image the substrate held by the rotating holding unit, It includes a control unit, The control unit, A first process involves controlling the imaging unit to capture multiple images of the entire substrate, including the entire substrate, by changing the imaging conditions from the same imaging position while the substrate is stationary, while it is held by the rotating holding unit. A second process in which processing regions are set in different areas for each of the multiple captured images according to the imaging conditions, A substrate processing apparatus configured to perform a third process of image processing each of the processing areas of the plurality of captured images to detect the position of the notch on the substrate.

2. The imaging unit further comprises at least one illumination unit configured to illuminate the substrate when imaging is performed by the imaging unit, The apparatus according to claim 1, wherein the imaging conditions include at least one of the brightness of the at least one illumination unit, the illumination time of the at least one illumination unit, the focal position of the imaging unit, the ISO sensitivity of the imaging unit, and the exposure of the imaging unit.

3. The imaging unit further comprises a plurality of illumination units configured to illuminate the substrate from different positions when imaging is performed by the imaging unit, The apparatus according to claim 2, wherein the imaging conditions further include the brightness of the plurality of illumination units, the illumination time of the plurality of illumination units, and the position of the illumination unit that performs illumination among the plurality of illumination units.

4. The aforementioned at least one lighting unit is composed of a collection of multiple light sources, The apparatus according to claim 2, wherein the imaging conditions further include the brightness of the at least one illumination unit, the illumination time of the at least one illumination unit, and the position of the light source that performs illumination among the plurality of light sources in the at least one illumination unit.

5. The apparatus according to claim 1, wherein the third process includes individually image processing each of the processing regions of the plurality of captured images to detect the position of the notch of the substrate.

6. The apparatus according to claim 1, wherein the third process includes image processing of a composite image obtained by combining the processing regions of each of the plurality of captured images into one, in order to detect the position of the notch of the substrate.

7. The system further comprises an air blower positioned above the substrate held by the rotating holding unit, configured to form a downward flow toward the upper surface of the substrate, When viewed from above, the air blowing section covers the entire substrate held by the rotating holding section. The apparatus according to claim 1, wherein the imaging unit is positioned so as not to overlap with the substrate held by the rotating holding unit when viewed from above.

8. A cup portion is arranged to surround the substrate held by the rotating holding portion from the outside, The system further comprises a lifting mechanism configured to raise and lower the substrate between a raised position in which the substrate is located above the cup portion and a lowered position in which the substrate is located inside the cup portion. The apparatus according to any one of claims 1 to 7, wherein the first process includes acquiring the plurality of captured images by the imaging unit while the lifting unit is positioning the substrate in the raised position.

9. The system further comprises a supply unit configured to supply processing liquid to the substrate held by the rotating holding unit, The control unit, After the first process, a fourth process is performed in which the rotation holding unit and the supply unit are controlled to rotate the substrate while supplying the processing liquid to the substrate, A fifth process is performed in which, after the fourth process, the imaging unit is controlled to capture multiple images of the entire substrate, including the entire substrate, by changing the imaging conditions from the same imaging position while the substrate held by the rotating holding unit is stationary, thereby obtaining multiple separate images of the entire substrate by the imaging unit. A sixth process in which, for each of the aforementioned multiple separate captured images, processing regions are set in different areas according to the imaging conditions, A seventh process involves image processing each of the processing regions of the plurality of separate captured images to detect the position of the notch on the substrate, The apparatus according to any one of claims 1 to 7, further configured to perform an eighth process in which a displacement in the circumferential direction of the substrate after processing in the fourth process is detected, based on the position of the notch of the substrate detected in the third process and the position of the notch of the substrate detected in the seventh process.

10. The first step involves acquiring multiple images including the entire substrate by the imaging unit by taking multiple images of the entire substrate from the same imaging position while the substrate is stationary, with the imaging unit changing the imaging conditions, while the substrate is held stationary by the rotating holding unit. A second step involves setting different processing regions for each of the aforementioned multiple captured images according to the imaging conditions, A substrate processing method comprising a third step of image processing each of the processing regions of the plurality of captured images to detect the position of a notch provided on the substrate.

11. The method according to claim 10, wherein the imaging conditions include at least one of the brightness of at least one illumination unit configured to illuminate the substrate when imaging is performed by the imaging unit, the illumination time of the at least one illumination unit, the focal position of the imaging unit, the ISO sensitivity of the imaging unit, and the exposure of the imaging unit.

12. The method according to claim 11, wherein the imaging conditions further include the brightness of a plurality of illumination units configured to illuminate the substrate from different positions when imaging is performed by the imaging unit, the illumination time of the plurality of illumination units, and the position of the illumination unit that performs the illumination among the plurality of illumination units.

13. The aforementioned at least one lighting unit is composed of a collection of multiple light sources, The method according to claim 11, wherein the imaging conditions further include the brightness of the at least one illumination unit, the illumination time of the at least one illumination unit, and the position of the light source that performs illumination among the plurality of light sources in the at least one illumination unit.

14. The method according to claim 10, wherein the third step includes individually image processing each of the processing regions of the plurality of captured images to detect the position of the notch of the substrate.

15. The method according to claim 10, wherein the third step includes image processing a composite image obtained by combining the processing regions of each of the plurality of captured images into one, to detect the position of the notch of the substrate.

16. The entire substrate held by the rotating holding unit is covered by a blower unit that, when viewed from above, is positioned above the substrate and configured to form a downward flow toward the upper surface of the substrate. The method according to claim 10, wherein the imaging unit is positioned so as not to overlap with the substrate held by the rotating holding unit when viewed from above.

17. The method according to any one of claims 10 to 16, wherein the first step is to acquire the plurality of captured images by the imaging unit while the substrate is in an elevated position, where the substrate is positioned above a cup portion arranged to surround the substrate held by the rotating holding portion from the outside.

18. A fourth step is to supply a processing liquid to the substrate while rotating the substrate, after the first step described above. A fifth step is to acquire multiple separate images including the entire substrate by the imaging unit, while the substrate is stationary and held by the rotating holding unit, by imaging the entire substrate multiple times from the same imaging position while changing the imaging conditions. A sixth step involves setting different processing regions for each of the aforementioned multiple separate captured images, according to the imaging conditions. A seventh step involves image processing each of the processing regions of the plurality of separate captured images to detect the position of the notch on the substrate, The method according to any one of claims 10 to 16, further comprising an eighth step of detecting a circumferential displacement of the substrate after processing in the fourth step, based on the position of the notch of the substrate detected in the third step and the position of the notch of the substrate detected in the seventh step.

Images