Ultrasonic excitation device
The PCB-based energy transmission assembly addresses thermal management challenges by integrating thermal conduction and insulation regions to efficiently cool ultrasonic transmitters while preserving sensor responsiveness.
Patent Information
- Authority / Receiving Office
- JP ยท JP
- Patent Type
- Patents
- Current Assignee / Owner
- SOFWAVE MEDICAL LTD
- Filing Date
- 2021-12-30
- Publication Date
- 2026-05-25
AI Technical Summary
Existing energy transmission assemblies, particularly those involving ultrasonic energy, face challenges in efficiently cooling energy transmitters on printed circuit boards (PCBs) while maintaining precise thermal control to prevent excessive cooling of adjacent components and ensure effective thermal response.
The assembly incorporates thermal conduction and insulation regions within the PCB to manage heat transfer, using heat-conducting materials and channels, and includes cooling elements on the PCB surface or within it to efficiently cool energy transmitters while isolating sensitive components like temperature sensors.
This approach enhances thermal management, allowing for effective cooling of energy transmitters while preventing excessive cooling of adjacent areas, thereby maintaining optimal thermal performance and responsiveness of temperature sensors.
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Abstract
Citation Information
Patent Citations
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