Chip pickup device, chip mounting device, and chip pickup method

JP7877590B2Active Publication Date: 2026-06-22YAMAHA MOTOR CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
YAMAHA MOTOR CO LTD
Filing Date
2023-06-13
Publication Date
2026-06-22

AI Technical Summary

Technical Problem

The stretching of the sheet holding the chip and the off-center position of the chip relative to the camera's field of view cause distortion in imaging, making it difficult to accurately pick up chips from the supply position.

Method used

A chip pickup device with a wafer transport mechanism, push-up unit, head, wafer camera, and imaging control unit that adjusts the camera's field of view and recognition target range based on the presence of the pickup unit and chip size to optimize the positional relationship between the chip and camera.

Benefits of technology

Enables accurate imaging and recognition of chips while suppressing the effects of sheet stretching and distortion, allowing efficient and precise chip pickup.

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Abstract

According to the present invention, the position of a camera visual field V71 of a recognition camera 71 for imaging a chip C is adjusted in an X direction in accordance with: a blind spot R52 (existence range) of a suction plate 52 of a pickup head 51 when suctioning the chip C held by an adhesive sheet H; and the width Xc (size) of the chip C in the X direction (fig. 3B, steps S107, S108). Accordingly, the chip C near a chip supply position Ls is kept in the camera visual field V71 while avoiding the blind spot R52 of the suction plate 52, and the positional relationship between the chip C and the camera visual field V71 can be made appropriate in accordance with the width Xc of the chip C. As a result, a chip recognition image Ir of the chip C can be acquired while suppressing the influence of: the elongation of the adhesive sheet H that holds the chip C; and the distortion due to the deviation of the chip C with respect to the camera visual field V71.
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Citation Information

Patent Citations

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  • JP2005277271A

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  • JP2021141270A

  • JP4800076B2