Liquid resin supply device

Abstract

To provide a liquid resin supply device that can prevent air bubbles from being included in a supplied liquid resin.SOLUTION: A liquid resin supply device (30) includes an upper nozzle (31) and a lower nozzle (32) for applying liquid resin (M), a tank (34) containing liquid resin, and a pump (33) that sends the liquid resin in the tank to the upper and lower nozzles, and supplies the liquid resin. The upper nozzle and the lower nozzle respectively include an upper reservoir (311) and a lower reservoir (321) for temporarily storing the liquid resin, an upper plate (312) and a lower plate (322) that serve as forming surfaces for the upper reservoir and the lower reservoir, an upper discharge port (313) and a lower discharge port (323) formed on the upper plate and the lower plate to discharge the liquid resin, and a ring-shaped upper ultrasonic diaphragm (314) and a lower ultrasonic diaphragm (324) that surround the upper and lower discharge ports and vibrate the upper plate and the lower plate at high frequency in the vertical direction.SELECTED DRAWING: Figure 2

Description

Technical Field

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[0001] The present invention relates to a liquid resin supply device.

Background Art

[0002] When manufacturing a wafer by grinding both sides of a wafer sliced from an ingot, after forming a resin layer on one side of the sliced wafer and grinding the other side, the resin layer is peeled off and then one side of the wafer is ground. Such a resin layer is formed, for example, as disclosed in Patent Document 1.

[0003] In Patent Document 1, for the formation of the resin layer, first, a sheet is placed on a table, and the upper surface of the liquid resin supplied onto the sheet is pressed with the wafer to spread the liquid resin over the entire lower surface of the wafer. Then, the resin layer is formed on the lower surface of the wafer by curing the liquid resin spread by the wafer.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The liquid resin supplied onto the sheet as in Patent Document 1 may contain air bubbles in the previous stage of supply, and such air bubbles are formed as cavity portions in the resin layer after curing the liquid resin. Therefore, when grinding the upper surface of the wafer, if a force is applied to the cavity portion by the grinding wheel, the wafer is not sufficiently supported by the resin layer and is partially deflected and deformed so as to sink, and there is a problem that only the deformed portion has an increased thickness.

[0006] The present invention has been made in view of this point, and an object thereof is to provide a liquid resin supply device capable of preventing the liquid resin to be supplied from containing air bubbles. [Means for solving the problem]

[0007] A liquid resin supply device according to one aspect of the present invention is a liquid resin supply device for supplying liquid resin, comprising a nozzle for applying liquid resin, a tank containing liquid resin, and a pump for sending liquid resin from the tank to the nozzle, wherein the nozzle comprises a reservoir for temporarily storing liquid resin, a plate which forms the surface of the reservoir, a discharge port formed on the plate for discharging liquid resin from the reservoir, and a ring-shaped ultrasonic vibrating plate which surrounds the discharge port of the plate and is positioned on the plate to cause the plate to vibrate vertically at a high frequency, wherein when liquid resin is discharged from the discharge port, the plate is vibrated vertically at a high frequency to burst air bubbles in the discharged liquid resin and release them into the atmosphere, thereby degassing while supplying.

[0008] With this configuration, a ring-shaped ultrasonic vibrator is vibrated at a high frequency around the nozzle's discharge port, which degasss the liquid resin when it is discharged from the port and suppresses the generation of air bubbles in the supplied liquid resin. As a result, for example, when curing the liquid resin to form a resin layer that supports the wafer, it is possible to avoid the formation of voids in the resin layer, and when grinding the wafer, deformation in the void area is prevented, allowing the wafer to be ground to a uniform thickness.

[0009] In one aspect of the present invention, the plate may be provided with multiple discharge ports. [Effects of the Invention]

[0010] According to the present invention, since the liquid resin being discharged from the discharge port is degassed by high-frequency vibration, it is possible to prevent air bubbles from being included in the supplied liquid resin. [Brief explanation of the drawing]

[0011] [Figure 1] This is a schematic perspective view of a protective member forming apparatus to which the liquid resin supply device according to the embodiment is applied. [Figure 2]This is a schematic cross-sectional view showing a part of the liquid resin supply device in the embodiment. [Figure 3] This is a magnified view of a portion of Figure 2. [Figure 4] This is an explanatory diagram of the process of supplying liquid resin in the embodiment. [Figure 5] This is an explanatory diagram showing the state after the liquid resin has been supplied in the embodiment. [Figure 6] This is an explanatory diagram of the process of spreading the liquid resin in the embodiment. [Figure 7] This is an explanatory diagram of the process for forming the protective member in the embodiment. [Modes for carrying out the invention]

[0012] The protective member forming apparatus to which the liquid resin supply device according to the embodiment is applied will be described below with reference to the attached drawings. Figure 1 is a schematic perspective view of the protective member forming apparatus to which the liquid resin supply device according to the embodiment is applied.

[0013] The X, Y, and Z axes shown in each figure are perpendicular to each other. The X and Y axes are approximately horizontal, while the Z axis is vertical. In each figure, of the two arrows indicating the X axis, the side with the letter X is the left side of the device (rear of the page), and the side without the letter X is the right side of the device (front of the page). Of the two arrows indicating the Y axis, the side with the letter Y is the front of the device (left side of the page), and the side without the letter Y is the rear of the device (right side of the page). Of the two arrows indicating the Z axis, the side with the letter Z is the top, and the side without the letter Z is the bottom.

[0014] The protective member forming apparatus 1 shown in FIG. 1 is an example of an apparatus that forms a protective member H (see FIG. 7) which becomes a resin layer by applying an external stimulus to a liquid resin spread over the entire surface of one side of a wafer W and curing it. In FIG. 1, the external housing 10 of the protective member forming apparatus 1 is shown by a broken line, and the components inside the external housing 10 are shown in a perspective view. Of the wafer W, the surface facing upward during the process in the protective member forming apparatus 1 is defined as the upper surface Wa, and the surface facing downward is defined as the lower surface Wb.

[0015] The wafer W is, for example, a disk-shaped as-cut wafer cut out from an ingot such as a cylindrical silicon. Note that the wafer W is not limited to an as-cut wafer before device formation, and may also be a device wafer or the like after device formation.

[0016] The protective member forming apparatus 1 includes a cassette storage unit 11 at one end side (front end side) in the Y-axis direction of the external housing 10. Inside the cassette storage unit 11, a cassette C capable of storing a plurality of wafers W is placed.

[0017] A sheet cutting table 14 is provided at a position on the rear side in the Y-axis direction of the cassette storage unit 11. The sheet cutting table 14 is provided with a sheet cutter 141 that cuts a sheet S, which will be described later, adhered to the wafer W along the outer shape of the wafer W.

[0018] A first transfer mechanism 12 for loading and unloading the wafer W with respect to the cassette C is provided on the left side in the X-axis direction with respect to the sheet cutting table 14. The first transfer mechanism 12 includes a robot hand 122 supported on a pedestal 121, and transfers the wafer W between the cassette storage unit 11 and the temporary placement table 13, and between the cassette storage unit 11 and the sheet cutting table 14 by moving the pedestal 121 in the X-axis direction and operating the robot hand 122.

[0019] The protection member forming device 1 includes a base 15 on the rear side in the Y-axis direction with respect to the sheet cutting table 14. A protection member forming table 16 is provided on the base 15. The protection member forming table 16 is made of a light-transmissive material such as quartz glass and is formed in a disc shape. The upper surface of the protection member forming table 16 is a flat sheet support surface 161 for placing the sheet S.

[0020] A sheet conveyance mechanism 17 for conveying and placing the sheet S on the sheet support surface 161 of the protection member forming table 16 is provided. The sheet conveyance mechanism 17 includes a sheet supply unit 171 that supports the sheet S wound in a roll shape, an arm 172 that is movable in the Y-axis direction, and a clamp unit 173 attached to the side surface of the arm 172. In the sheet conveyance mechanism 17, the roll-shaped sheet S supported by the sheet supply unit 171 is held by the clamp unit 173, and the arm 172 is moved in the Y-axis direction to pull the sheet S, thereby placing the sheet S on the sheet support surface 161 of the protection member forming table 16.

[0021] The sheet S is made of a light-transmissive material. As the sheet S, for example, a film formed of polyethylene terephthalate or the like can be used. Note that a sheet S made of other materials may also be used.

[0022] A plurality of suction holes (all not shown in the figure) connected to a suction source are formed in the sheet support surface 161 of the protection member forming table 16. By applying a suction force to the suction holes by the operation of the suction source, the sheet S placed on the sheet support surface 161 is suction-held to the sheet support surface 161.

[0023] In the vicinity of the protection member forming table 16, a liquid resin supply device (resin supply mechanism) 30 for supplying a predetermined amount of liquid resin M (see FIG. 2) to the upper surface of the sheet S on the sheet support surface 161 is provided. The detailed configuration of the liquid resin supply device 30 will be described later.

[0024] The protective member forming apparatus 1 includes a wafer holding section 20 positioned above the protective member forming table 16. The wafer holding section 20 is supported by a column 19, which is provided projecting upward from the base 15 at a position in front of the protective member forming table 16 in the Y-axis direction. The column 19 is provided with a lifting mechanism 21 that moves the wafer holding section 20 in the Z-axis direction to move it closer to and further away from the protective member forming table 16.

[0025] The lifting mechanism 21 includes a pair of guide rails 211 and a ball screw 212 extending in the Z-axis direction, and a lifting table 213 supported so as to be movable in the Z-axis direction relative to the pair of guide rails 211. When the ball screw 212 is rotated by the driving force of the motor 214, the lifting mechanism 211 moves the lifting table 213 along the pair of guide rails 211 in the Z-axis direction.

[0026] The wafer holder 20 is supported by a lifting table 213, and the wafer holder 20 moves in the Z-axis direction in conjunction with the lifting table 213. The wafer holder 20 includes a disc-shaped holding table 201. A disc-shaped porous member 202 (see Figure 4) is provided on the lower surface of the holding table 201. The lower surface of the porous member 202 is the wafer holding surface 203 located above the protective member forming table 16. The wafer holding surface 203 is a surface that is substantially parallel to the sheet support surface 161 of the protective member forming table 16.

[0027] The porous member 202 is connected to a suction source (not shown) via a suction passage. The operation of the suction source applies a suction force to the porous member 202, and the upper surface Wa of the wafer W is held in place by the wafer holding surface 203.

[0028] The wafer holding unit 20 is equipped with a load detection unit 22. The load detection unit 22 can detect a vertical load (in the Z-axis direction) applied to the lower surface Wb of the wafer W.

[0029] A curing mechanism 23 is provided at the bottom of the protective member forming table 16 to cure the liquid resin M (see Figure 2) dropped onto the sheet S on the sheet support surface 161 by applying external stimuli. The curing mechanism 23 is equipped with a plurality of ultraviolet irradiation units 231 (all see Figure 7) capable of emitting ultraviolet UV light, and cures the liquid resin M by irradiating it with ultraviolet UV light through the light-transmitting protective member forming table 16 and sheet S. An LED may be used as the light source for the ultraviolet irradiation unit 231.

[0030] A second transport mechanism 25 is provided to the left of the base 15 in the X-axis direction. The second transport mechanism 25 includes a robot hand 252 supported on a pedestal 251, and transports wafers W between the protective member forming table 16 and the sheet cutting table 14, and between the temporary storage table 13 and the protective member forming table 16, through the movement of the pedestal 251 in the Y-axis direction and the operation of the robot hand 252.

[0031] The protective member forming apparatus 1 is centrally controlled by the control unit 40. The control unit 40 consists of a processor that performs various processes and a memory that stores various parameters and programs. The memory of the control unit 40 stores, as part of the control program, a program for controlling the high frequency (ultrasound) of each plate 312, 322 that vibrates each ultrasonic vibrating plate 314, 324 (described later) based on various conditions.

[0032] Next, the liquid resin supply device 30 for supplying the liquid resin M will be described. Figure 2 is a schematic cross-sectional view showing a part of the liquid resin supply device in the embodiment, and Figure 3 is a partially enlarged view of Figure 2. As shown in Figures 2 and 3, the liquid resin supply device 30 is equipped with an upper nozzle 31 and a lower nozzle 32 provided on the portion of the arm 172 of the sheet transport mechanism 17 (see Figure 1) that extends parallel to the X-axis direction. The liquid resin supply device 30 also further includes a tank 34 provided in the base 15 for containing the liquid resin M, and a pump 33 for sending the liquid resin M from the tank 34 to the upper nozzle 31 and the lower nozzle 32.

[0033] The upper nozzle 31 and lower nozzle 32 are movable in accordance with the Y-axis movement of the arm 172 by the sheet transport mechanism 17. This movement allows the nozzles 31 and 32 to be positioned between the protective member forming table 16 and the holding table 201 (see Figure 1), and to be retracted from between them.

[0034] Pump 33 is connected to the upper nozzle 31 and the lower nozzle 32 via a branch connection pipe 35. Pump 33 comprises an upper pump 331 that communicates with an upper supply passage 361 formed inside the arm 172, and a lower pump 332 that communicates with a lower supply passage 362 formed inside the arm 172. In other words, the pump 33 of this embodiment comprises an upper pump 331 and a lower pump 332, which are two independent liquid discharge devices that deliver liquid resin M.

[0035] The upper nozzle 31 includes an upper reservoir (reservoir) 311 formed by recessing the upper surface of the arm 172 and communicating with the upper supply passage 361, and an upper plate (plate) 312 which forms the upper surface of the upper reservoir 311. The lower nozzle 32 includes a lower reservoir (reservoir) 321 formed by recessing the lower surface of the arm 172 and communicating with the lower supply passage 362, and a lower plate (plate) 322 which forms the lower surface of the lower reservoir 321. The upper reservoir 311 and the lower reservoir 321 can temporarily store the liquid resin M supplied via the tank 34, branch connection pipe 35, pump 33, and each supply passage 361, 362.

[0036] The upper plate 312 is supported on the upper surface of the arm 172 via a cylindrical upper connecting member 315 with a smaller vertical width on its outer circumference, and the upper connecting member 315 forms part of the side surface of the upper reservoir 311. The lower plate 322 is supported on the lower surface of the arm 172 via a cylindrical lower connecting member 325 with a smaller vertical width on its outer circumference, and the lower connecting member 325 forms part of the side surface of the lower reservoir 321.

[0037] The upper nozzle 31 further comprises an upper discharge port 313 formed in the center of the upper plate 312 for discharging the liquid resin M from the upper reservoir 311, and a ring-shaped upper ultrasonic vibrating plate 314 positioned on the lower surface of the upper plate 312 and surrounding the upper discharge port 313. The upper discharge port 313 may be single or multiple, but in this embodiment, it is single. The region of the upper plate 312 within a predetermined range centered on the upper discharge port 313 is formed to be thinner in thickness than the region outside of that region. The upper nozzle 31 discharges the liquid resin M upward from the upper discharge port 313, for example, so that the liquid resin M rests in a dome shape on the thinner region of the upper plate 312.

[0038] The lower nozzle 32 further comprises a lower discharge port 323 formed in the center of the lower plate 322 for discharging the liquid resin M from the lower reservoir 321, and a ring-shaped lower ultrasonic vibrating plate 324 positioned on the lower surface of the lower plate 322 and surrounding the lower discharge port 323. The lower discharge port 323 may be single or multiple, but in this embodiment, it is single. The area of ​​the lower plate 322 within a predetermined range centered on the lower discharge port 323 is formed to be thinner in thickness than the area outside of that area.

[0039] The upper ultrasonic vibrator 314 and the lower ultrasonic vibrator 324 generate vertical expansion and contraction motion by supplying high-frequency power at a predetermined ultrasonic frequency. This expansion and contraction motion causes the upper and lower ultrasonic vibrators 314 and 324 to vibrate the upper plate 312 and lower plate 322 in the vertical direction (thickness direction) at high frequency. As the liquid resin M is discharged from the upper and lower discharge ports 313 and 323, this high-frequency vibration causes the liquid resin M passing through the upper and lower discharge ports 313 and 323 to vibrate at high frequency, causing the air bubbles in the liquid resin M to burst. Therefore, the air (gas) contained in the air bubbles in the liquid resin M can be released into the atmosphere, and the liquid resin M can be supplied while degassing at the upper nozzle 31 and lower nozzle 32.

[0040] The ultrasonic frequency of the high-frequency vibrations produced by the upper ultrasonic vibrator 314 and the lower ultrasonic vibrator 324 varies depending on the liquid resin M and various dispensing conditions. For example, under the conditions described below, the ultrasonic frequency is set to 30 kHz. Viscosity of liquid resin: 350 ± 150 Pa·s Liquid resin flow rate: 0.5~3 ml / min Thickness of upper and lower plates: 3mm Number of upper and lower discharge ports: 2~20 Diameter of upper and lower discharge ports: φ0.3~φ1.0mm

[0041] The liquid resin M has the property of hardening in response to external stimuli. In this embodiment, an ultraviolet-curing resin that hardens upon irradiation with ultraviolet light is used.

[0042] Next, the formation of the protective member (resin layer) by the protective member forming apparatus 1 of this embodiment will be described. Figure 4 is an explanatory diagram of the process of supplying liquid resin in this embodiment. Here, as shown in Figure 4, the cut sheet S is held by suction on the protective member forming table 16, and the wafer W is held by suction on the wafer holding surface 203 of the holding table 201.

[0043] In the state shown in Figure 4, the upper nozzle 31 and lower nozzle 32 of the liquid resin supply device 30 are positioned between the sheet S on the opposing protective member forming table 16 and the wafer W held on the holding table 201. In other words, the upper nozzle 31 and lower nozzle 32 are positioned above the sheet S on the protective member forming table 16 and below the wafer W held on the holding table 201. This positioning is performed by a sheet transport mechanism 17 (see Figure 1) that moves the arm 172 in the Y-axis direction.

[0044] After the positioning described above, liquid resin M is sent from the tank 34 to the lower nozzle 32 under the control of the lower pump 332, and the liquid resin M is discharged from the lower nozzle 32 and dripped onto the sheet S (hereinafter, the liquid resin after discharge from the lower nozzle 32 will be denoted as "M2"). The dripped liquid resin M2 accumulates near the center of the upper surface of the sheet S in an area smaller than the area of ​​the wafer W. A recess M21 is formed in the center of the liquid resin M2 accumulated on the sheet S. The amount of liquid resin M discharged from the lower nozzle 32 is determined by the thickness of the portion where the liquid resin M2 later hardens to become the protective member H (see Figure 7) and the area of ​​the wafer W.

[0045] Simultaneously with, or before or after, the discharge of liquid resin M from the lower nozzle 32, liquid resin M is sent from the tank 34 to the upper nozzle 31 by the control of the upper pump 331, and a predetermined amount of liquid resin M is discharged from the upper nozzle 31 (hereinafter, the liquid resin after discharge from the upper nozzle 31 will be denoted as "M1"). The discharged liquid resin M1 accumulates on the upper plate 312 of the upper nozzle 31 in an upwardly bulging shape. In this state, the lifting mechanism 21 lowers the holding table 201 and the wafer W, pressing the lower surface Wb of the wafer W against the liquid resin M1 on the upper plate 312 and causing it to adhere (see Figure 5).

[0046] Alternatively, the liquid resin M1 may be applied to the lower surface Wb of the wafer W by lowering the holding table 201 and the wafer W to bring the wafer W and the upper plate 312 closer together, after which the liquid resin M may be discharged from the upper nozzle 31. In this case, the liquid resin M1 will be applied to the lower surface Wb of the wafer W immediately after it is discharged from the upper nozzle 31.

[0047] Here, during the discharge of the liquid resin M described above, the lower plate 322 is vibrated at a high frequency in the thickness direction by the lower ultrasonic vibrator 324, and the upper plate 312 is vibrated at a high frequency in the thickness direction by the upper ultrasonic vibrator 314. This high-frequency vibration causes air bubbles in the liquid resin M passing through the lower discharge port 323 and the upper discharge port 313 to burst, allowing the air contained in the bubbles to be released into the atmosphere. This makes it possible to degas the liquid resin M just before supplying it to the sheet S and wafer W by dropping or adhering it. Therefore, even if air bubbles are mixed into the liquid resin M at a stage before it reaches the lower discharge port 323 and the upper discharge port 313 (for example, in the delivery path from the tank 34 to each of the reservoirs 311 and 321), the supplied liquid resin M can be well maintained in a degassed state.

[0048] Figure 5 is an explanatory diagram showing the state after the liquid resin is supplied in the embodiment. After the liquid resin M is attached to the lower surface Wb of the wafer W, as shown in Figure 5, the holding table 201 and the wafer W are raised by the lifting mechanism 21, and the upper nozzle 31 and lower nozzle 32 are retracted from between the sheet S and the wafer W. At this time, the liquid resin M1 attached to the lower surface Wb of the wafer W remains attached to the lower surface Wb without falling.

[0049] Figure 6 is an explanatory diagram of the process of spreading the liquid resin in the embodiment, and Figure 7 is an explanatory diagram of the process of forming the protective member in the embodiment. When the holding table 201 by the lifting mechanism 21 descends from the state shown in Figure 5, as shown in Figure 6, the liquid resin M1 adhering to the lower surface Wb of the wafer W comes into contact with the recess M21 of the liquid resin M2 on the sheet S before the lower surface Wb of the wafer W. As the holding table 201 descends further, the liquid resin M1 of the wafer W that has come into contact with the recess M21 is pushed into the liquid resin M2 on the sheet S. Due to this pushing, both liquid resins M1 and M2 are mixed, and the recess M21 disappears (hereinafter, only the symbol "M2" will be used for the liquid resin in this state). Then, as shown in Figure 7, by further descending and pressing the holding table 201, the liquid resin M2 is expanded radially on the wafer W and spread over the entire lower surface Wb of the wafer W.

[0050] After the entire lower surface Wb of the wafer W is covered with liquid resin M2, ultraviolet (UV) light with an intensity (wavelength) sufficient to cure the liquid resin M2 is irradiated from the UV irradiation unit 231 toward the sheet support surface 161. The UV light emitted from the UV irradiation unit 231 passes through the light-transmitting protective member forming table 16 and sheet S to reach the liquid resin M2, and the UV-curable liquid resin M2 is cured. When it is determined that the liquid resin M2 has sufficiently cured, the irradiation of UV light by the UV irradiation unit 231 is terminated. This curing of the liquid resin M2 forms a protective member H that covers the entire lower surface Wb of the wafer W.

[0051] According to the above embodiment, since the liquid resin M is degassed when it is discharged from each discharge port 313, 323, it is possible to avoid the formation of cavities in the protective member H after the liquid resin M has hardened. As a result, even when grinding is performed while pressing a grinding wheel against the upper surface Wa of the wafer W in the state shown in Figure 7, no cavities are formed in the protective member H, so the protective member H can adequately support the wafer W and prevent partial bending deformation of the wafer W. As a result, it is possible to avoid the wafer W becoming thicker only in the areas corresponding to the cavities after grinding, and the wafer W can be ground to a uniform thickness.

[0052] Furthermore, in the above embodiment, by increasing the number of discharge ports 313 and 323 formed on each plate 312 and 322, the discharge speed of the liquid resin M can be increased, and by reducing the opening area of ​​each discharge port 313 and 323, smaller air bubbles can be burst and degassed.

[0053] In the above embodiment, the nozzles 31 and 32 of the liquid resin supply device 30 are provided on the arm 172 of the sheet transport mechanism 17, but the configuration is not limited to this. For example, the nozzles 31 and 32 may be provided on an arm or the like that is used only for discharging and supplying the liquid resin M. Furthermore, the configuration may be made in which the nozzles 31 are omitted.

[0054] Furthermore, in each nozzle 31 and 32, a predetermined area centered on each discharge port 313 and 323 was formed thinly on each plate 312 and 322, but this area may be formed with the same thickness as the other areas. Note that by making the thickness thinner, it is possible to make each discharge port 313 and 323 more easily vibrated.

[0055] Furthermore, the formation positions of the reservoir portions 311 and 321 of each nozzle 31 and 32 may be changed, as long as the forming portions of each discharge port 313 and 323 are formed by the plates 312 and 322. For example, the reservoir portions 311 and 321 may be formed by extending the vertical width of the connecting members 315 and 325 without recessing the arm 172.

[0056] Furthermore, the liquid resin M supplied by the liquid resin supply device 30 is not limited to forming the protective member H that supports the wafer W, but can be used to form various resin layers and resin structures.

[0057] Furthermore, the embodiments of the present invention are not limited to the embodiments and modifications described above, and may be modified, substituted, or altered in various ways without departing from the spirit of the technical idea of ​​the present invention. Moreover, if the technical idea of ​​the present invention can be realized in a different way by advances in the art or by other derived arts, it may be implemented by that method. Accordingly, the claims cover all embodiments that may fall within the scope of the technical idea of ​​the present invention. [Industrial applicability]

[0058] As described above, the liquid resin supply device of the present invention can prevent air bubbles from being included in the supplied liquid resin. [Explanation of symbols]

[0059] 1: Protective member forming apparatus 30: Liquid resin supply device 31: Upper nozzle (nozzle) 311: Upper charging section (charging section) 312: Upper plate (plate) 313: Upper discharge port (discharge port) 314: Upper ultrasonic vibrator (ultrasonic vibrator) 32: Lower nozzle (nozzle) 321: Lower charging section (charging section) 322: Lower plate (plate) 323: Lower discharge port (discharge port) 324: Lower ultrasonic vibrator (ultrasonic vibrator) 33: Pump 34: Tank M: Liquid resin M1: Liquid resin M2: Liquid resin

Claims

1. A liquid resin supply device for supplying liquid resin, It comprises a nozzle for applying liquid resin, a tank containing liquid resin, and a pump for supplying the liquid resin from the tank to the nozzle. The nozzle comprises a reservoir for temporarily holding liquid resin, a plate that forms the surface of the reservoir, a discharge port formed on the plate for discharging the liquid resin from the reservoir, and a ring-shaped ultrasonic vibrating plate that surrounds the discharge port on the plate and is positioned on the plate to cause the plate to vibrate vertically at a high frequency. A liquid resin supply device that, when liquid resin is discharged from the discharge port, vibrates the plate vertically at a high frequency to burst air bubbles in the discharged liquid resin and release them into the atmosphere, thereby degassing the resin during supply.

2. The liquid resin supply device according to claim 1, wherein the plate is arranged in a plurality of outlets.

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