Air curtain device

The air knife device addresses chaotic airflow issues by using adjustable air knives and gas diffusers to provide uniform, directional airflow, effectively blocking contaminants and improving semiconductor component preservation and yield.

TW202629947APending Publication Date: 2026-07-16GUDENG EQUIP CO LTD
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Patent Information

Application Number
TW114117153
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-08
Filing Date
2025-05-07
Publication Date
2026-07-16

AI Technical Summary

Technical Problem

Conventional air knife devices in semiconductor manufacturing create chaotic airflow, leading to dust and moisture contamination, and are inefficient in preventing external pollutants from entering semiconductor carriers.

Method used

An air knife device with adjustable air knives and gas diffusers provides uniform, directional, and concentrated linear airflow to protect semiconductor components by blocking dust and moisture, utilizing multiple air distribution chambers and adjustable air knives to ensure airflow uniformity and directionality.

Benefits of technology

The device effectively prevents dust and moisture contamination by providing a continuous, laminar airflow that enhances the preservation quality of semiconductor components and improves process yield while reducing energy loss and turbulence.

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Abstract

An air knife device is disclosed, suitable for loading equipment of semiconductor carriers. The air knife device mainly includes a housing and an air knife assembly. The housing contains multiple air distribution chambers divided by various gas diffusers. The air knife assembly is adjacent to one of the air distribution chambers of the housing and is defined as an air outlet. The air knife assembly includes at least two adjustable air knives at different horizontal planes and a defined narrow gap between them. The air knife assembly receives gas passing through the air distribution chambers. After the gas is adjusted by the narrow gap and the two adjustable air knives, it presents a directional linear airflow suitable for blowing towards the opening of the semiconductor carrier. This prevents dust and moisture from entering the semiconductor carrier during semiconductor device handling, thereby improving the preservation quality of the semiconductor devices and increasing process yield.
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