Additive manufacturing method on a perforated support

Abstract

The present invention relates to a method for powder-bed fusion additive manufacturing of a radiofrequency device, comprising a depowdering step, during which the powder residue is discharged through a through-hole (10, 20) made in the manufacturing support (S) and / or in a wall of the radiofrequency device (1) adjacent to the manufacturing support (S) without the manufactured radiofrequency device (1) having to be separated from the manufacturing support (S) during the step of discharging the powder residue. The invention also relates to a manufacturing support comprising at least one through-hole (10) allowing a powder residue to be discharged during a depowdering step. (Fig. 2)

Description

Additive manufacturing process on a perforated substrate technical field

[0001] The present invention relates to an additive manufacturing method for a radio frequency device on a perforated manufacturing substrate. State of the art

[0002] Additive manufacturing by powder bed fusion, usually metallic, comprises three main steps: the deposition of a bed of powder to be fused onto a manufacturing support, the melting of this powder bed by selective application of an energy source, and finally the depowdering, i.e. the removal of the powder after the powder has been melted.

[0003] The depowdering stage involves several difficulties of different kinds such as the risks of explosion, the risks to the health of the operators, the high cost due to the manual nature of the work, the recovery of excess powder, the quality of the surface finishes of the manufactured parts, the industrial reproducibility of the processes or the management of the different powders used which sometimes cannot be mixed.

[0004] The difficulty of the depowdering stage also depends on the topology of the manufactured parts. Generally speaking, parts with complex geometries, including cavities or curved tubular elements, tend to trap some of the excess powder inside and therefore require more handling to remove it.

[0005] Existing dust removal techniques include, but are not limited to: {ST012}-{ 154}-{PCT} The vibration and / or shock of the manufacturing support on which the manufactured part is fixed. • The rotation of the manufacturing support on which the manufactured part is fixed, along one or more axes of rotation. • High-pressure cleaning by injection of air, liquid or gas.

[0006] These depowdering techniques are typically performed using dedicated machines separate from the additive manufacturing machine itself, although integrated solutions also exist. It is therefore generally necessary to move the manufactured part, fixed to its build platform, from the 3D printing device to the depowdering machine.

[0007] In the aerospace sector, and particularly in the field of passive antennas, the use of additive manufacturing via powder bed fusion has seen significant growth in recent years. Components for passive antennas, such as satellite antennas, often have complex geometries, including waveguide arrays, frequently curved due to the need to reduce size imposed by satellite payload limitations. Furthermore, such parts often require a very smooth surface finish because of their function of propagating waves. A conductive coating typically covers the internal portions of these components, thus determining their surface finish.

[0008] Thus, de-powdering such parts is often a delicate operation requiring a lot of attention and is therefore relatively expensive.

[0009] Furthermore, components such as radio frequency (RF) devices typically require heat treatment after manufacturing. {ST012}-{ 154}-{PCT} Additive. This heat treatment must be performed after the depowdering step to prevent powder residue from fusing with the RF device. Therefore, to remove powder residue from inside the device, for example, inside a waveguide, it is common practice to separate the printed RF device from its build platform. This allows the powder residue to escape through any openings in the device that may be positioned against the build platform.

[0010] This process, however, has the disadvantage of separating the manufacturing support from the RF device, which can be detrimental to heat treatment. Indeed, heat treatment is advantageously performed on the bonded assembly formed by the manufacturing support and the RF device fabricated on it, so that the support can, for example, be used to limit deformations of the RF device and thus obtain increased reproducibility of the parts, since deformations, which vary from part to part, are limited.

[0011] US2024001447A1 discloses a powder removal device based on the induction of ultrasonic vibrations in a device fabricated by powder bed fusion. The vibrations are induced in the fabrication support to which the device is attached. Brief summary of the invention

[0012] One object of the present invention is to propose an additive manufacturing process for a radio frequency component free from the limitations present in prior art processes.

[0013] Another objective of the invention is to propose an additive manufacturing process for a radio frequency component in which the depowdering step is faster and more efficient. {ST012}-{ 154}-{PCT}

[0014] According to the invention, these goals are achieved in particular by means of an additive manufacturing process by powder bed fusion of a radio frequency device comprising a plurality of waveguide apertures arranged in a lattice, the process comprising the steps of: depositing on a manufacturing support a bed of powder intended to be fused to form the radio frequency device, forming by fusion of the powder bed the radio frequency device so that the plurality of apertures of the device are arranged on the manufacturing support during manufacturing, evacuating a powder residue from the manufacturing of the radio frequency device from the inside of an assembly formed at least by the manufacturing support and the radio frequency device to its outside.characterized in that the powder residue is evacuated through a plurality of through holes provided in the manufacturing support and / or in a wall of the radio frequency device adjacent to the manufacturing support, without the manufactured radio frequency device having to be separated from the manufacturing support during the powder residue evacuation step and in that a diameter of each through hole of the plurality of through holes is less than 1.5X, where X is the operating wavelength of the waveguides.

[0015] Advantageously, the evacuation of powder residue via the through holes 10, 20 not only makes it easier and faster to depowder the step, but also avoids having to separate the manufactured device from the manufacturing support S.

[0016] Furthermore, a hole diameter less than 1.5X maximizes the surface area through which the powder can be evacuated without compromising the support formed by the printing support S. With a diameter greater than 1.5X, it has been observed that some areas (i.e. portions of walls) are insufficiently supported and thus increase the risk of sagging of the unsupported portions. {ST012}-{ 154}-{PCT}

[0017] According to a preferred embodiment, the radio frequency device is an antenna array comprising a plurality of elementary antennas arranged contiguously on the manufacturing support, each opening of the plurality of openings being an opening of a radiating element of an elementary antenna.

[0018] According to one embodiment, each through hole is provided in the manufacturing support, so that each opening of the device is aligned with a through hole of the plurality of through holes during manufacturing.

[0019] According to one embodiment, the step of forming the radio frequency device by powder bed fusion includes, for each elementary antenna, the formation of a waveguide wall arranged around a through hole of the plurality of through holes.

[0020] In this way, each waveguide wall forming the elementary antenna is fully supported by the fabrication support while the internal channel delimited by the waveguide wall is aligned with a through hole to maximize the evacuation of powder located in the internal channel.

[0021] According to one embodiment, the powder bed is arranged on the manufacturing support so as to at least partially fill the plurality of through holes.

[0022] Thus, internal elements within the openings of the radio frequency device (e.g. septa, impedance matching elements, etc.) can be additively manufactured using the powder bed arranged in the through hole.

[0023] According to one embodiment, each through hole is aligned with an opening of a radiating element of an elementary antenna, of {ST012}-{ 154}-{PCT} so that the plurality of through holes is arranged in a regular array of through holes aligned with the antenna array.

[0024] This correspondence between the antenna array and the through-hole array allows for the optimization of the support areas (i.e., the solid areas) of the manufacturing support and the hole areas (i.e., the empty areas) of the manufacturing support in order to maximize powder evacuation without compromising support during printing.

[0025] In one embodiment, each through-hole is aligned with an opening in a radiating element of an elementary antenna, such that the plurality of through-holes are arranged in an irregular array of through-holes aligned with the antenna array. Depending on the antenna geometry and the support requirements for 3D printing, it may be advantageous to arrange the through-holes irregularly, for example, to mitigate the physical stresses in the print support caused by the holes and the weight of the printed device.

[0026] In one embodiment, a cross-section of each through hole measured in a plane parallel to the manufacturing support is circular, or polygonal with at least three sides. Advantageously, the cross-section of each through hole may be similar to that of the opening cross-section, but with a smaller diameter.

[0027] According to one embodiment, each through hole is provided in a wall of the radio frequency device adjacent to the manufacturing support when the radio frequency device is manufactured on the manufacturing support such that each through hole is at least partially delimited by the manufacturing support and at least partially delimited by the wall of the device.

[0028] Advantageously, the 20 through holes allow for easier and faster removal of powder residue. This embodiment can also be combined with through holes provided {ST012}-{ 154}-{PCT} in the manufacturing support to increase the channels for removing powder residue.

[0029] According to one embodiment, each elementary antenna comprises at least one through hole out of the plurality of through holes.

[0030] According to one embodiment, at least one through hole of the plurality of through holes has an arched cross-section.

[0031] According to one embodiment, a profile of the arch includes a rounded portion and / or a polygonal portion formed of at least two straight segments.

[0032] According to one embodiment, the process includes a step of ablation of a portion of the wall of the device adjacent to the manufacturing support in which the plurality of through holes are provided so that the final radio frequency device no longer has through holes.

[0033] According to one embodiment, the process includes a step of modifying the geometry of each through hole after additive manufacturing of the device so as to modify the impedance of the device.

[0034] According to one embodiment, the diameter of each through hole is less than the wavelength X, preferably less than 0.8 X.

[0035] These goals are also achieved by means of a manufacturing support S for powder bed additive manufacturing of a radio frequency device 1, the support S comprising a through hole 10 intended to allow the evacuation of residue from the powder bed from inside the manufactured device to outside the device 1 without the device having to be separated from the manufacturing support S. {ST012}-{ 154}-{PCT}

[0036] According to one embodiment, the manufacturing support S comprises a plurality of through holes 10 arranged in a network corresponding to an opening network of a radio frequency device intended to be manufactured on the support. Brief description of the figures

[0037] Examples of implementation of the invention are given in the description illustrated by the accompanying figures, in which:

[0038] Figure 1 illustrates a radio frequency component additively manufactured on a fabrication support.

[0039] Figure 2 illustrates a cross-section of a radio frequency component fabricated on a perforated fabrication substrate.

[0040] Figure 3 illustrates a cross-section of a radio frequency component fabricated on a perforated fabrication substrate.

[0041] Figure 4 illustrates a cross-section of a radio frequency component fabricated on a perforated fabrication substrate.

[0042] Figure 5 illustrates a transparent view of a radio frequency component fabricated on a perforated fabrication substrate.

[0043] Figure 6 illustrates a view of a radio frequency component with powder evacuation holes. Example(s) of an embodiment of the invention

[0044] The term "radio frequency device" used in this text can refer to any type of radio frequency component {ST012}-{ 154}-{PCT} (abbreviated RF) passive of an antenna. In particular, this expression covers all types of waveguides, polarizers (e.g. septum), frequency and / or polarization multiplexers, filters (e.g. cavity, comb, evanescent mode, coaxial, etc.), radiating elements, antenna horns, as well as any combination of these elements (e.g. feed chain, antenna arrays, etc.).

[0045] A distinctive feature of these radio frequency devices is that they include a plurality of apertures 30, typically input ports or radiating elements designed to propagate an electromagnetic wave into or out of the device. Each of these apertures 30 coincides with an internal channel of the device extending along a longitudinal axis. Due to the constraints associated with the sagging of cantilevered portions during additive manufacturing, it is generally advantageous to manufacture the device so that the angle between its longitudinal axis and the manufacturing direction (i.e., the direction perpendicular to the laser-fused layers) does not exceed 45°. Preferably, the longitudinal axis of the device is even substantially parallel to the manufacturing direction, i.e., essentially perpendicular to the build platform S (also called the printing support).

[0046] Figure 1 illustrates by way of example a radio frequency device 1, for example an antenna array, additively manufactured by a powder bed fusion process on a fabrication support S. The portion of the device in contact with the fabrication support S has a plurality of parallel longitudinal axes, essentially perpendicular to the fabrication support S.

[0047] The term "powder bed fusion" used here refers to all additive manufacturing processes in which the manufactured part is produced by melting a powder, typically metallic or partially metallic, using an energy source. In particular, this includes laser beam fusion (sometimes abbreviated LPBF). {ST012}-{ 154}-{PCT} for "Laser Powder Bed Fusion") and / or electron beam(s) (sometimes abbreviated EPBF for "Electron-beam Powder Bed Fusion").

[0048] According to one aspect of the invention, the depowdering step advantageously takes advantage of the manufacturing orientation of the RF device 1 relative to the manufacturing support S. Indeed, the invention proposes to facilitate the depowdering step of an RF device manufactured additively by powder bed fusion by means of the introduction of holes (or perforations) allowing the evacuation of powder residues contained inside the RF device after its manufacture without having to detach the device 1 from the support S.

[0049] As illustrated in Figure 2, the RF device 1 comprises a plurality of openings 30 arranged on the build platform S during manufacturing. The openings 30 can correspond, for example, to radiating elements or to input / output ports of the RF device 1. Generally, the term "opening" refers to a portion of the RF device 1 that establishes electromagnetic communication between the interior and exterior of the RF device 1. Due to the constraints associated with additive manufacturing, particularly those related to the sagging of cantilevered portions (i.e., those forming too large an angle relative to the manufacturing direction), it is natural to arrange the openings 30 on the build platform S, given that they generally correspond to a longitudinal end of the RF device or a portion thereof.

[0050] The manufacturing process according to the invention includes a first step of depositing a bed of powder onto the manufacturing support S. This step is typically carried out using a scraper.

[0051] In a second step, the powder bed is fused using an energy source to additively form the RF 1 device so that the openings 30 are arranged on the manufacturing support S, i.e. in contact with the manufacturing support S. {ST012}-{ 154}-{PCT}

[0052] During this step, the melting of the powder bed upon contact with the fabrication support S generally causes the RF device to fuse to the support itself. As mentioned above, the bonding of these two elements is particularly advantageous for the heat treatment of the RF device. It is also advantageous for powder removal, as it allows the device to be handled, vibrated, and even subjected to shocks without damage from direct contact.

[0053] The third step of the process involves removing powder residue after the formation of the RF device 1, specifically from the inside to the outside of the RF device. As mentioned above, the RF device typically includes internal channels, e.g., waveguides, from which it is complex to remove powder residue without detaching the fabrication support S from the RF device 1.

[0054] Surprisingly and advantageously, the present invention proposes to remove this powder residue through a plurality of through-holes 10, 20 arranged in the fabrication support S and / or in a wall of the RF device 1 adjacent to the fabrication support S, without the fabricated RF device 1 needing to be separated from the fabrication support S during the powder residue removal step. The diameter of each through-hole in the plurality of through-holes 10, 20 is less than 1.5X, where X is the operating wavelength of the waveguides, so that the structural integrity of the fabrication support and / or the wall of the RF device adjacent to the fabrication support S is not affected by the holes, while maximizing the surface area for removing the powder residue.

[0055] As illustrated in Figure 1, the present method is particularly suited to the fabrication of RF devices of the "antenna array" type, that is, a plurality of elementary antennas arranged contiguously to form an array of elementary antennas. In such an antenna array, the elementary antennas can be combined with each other by means of a beamforming array. From this {ST012}-{ 154}-{PCT} In this way, each elementary antenna can be connected by one or more waveguides to an adjacent elementary antenna.

[0056] Thus, in such an antenna array, the multiplication of elementary antennas coupled with the complex geometry of the beamforming array makes dust removal particularly complex. The introduction of through holes 10, 20 allows for easier and faster removal of powder residue from inside the array.

[0057] According to a first embodiment illustrated in figures 2 to 5, the through hole 10 is provided in the manufacturing support S. This through hole 10 can be provided between an upper face of the support S allowing to support the RF device 1 and an lower face of the support S opposite to the upper face.

[0058] Alternatively or additionally, the through hole can be provided between the upper face of the support and a lateral face of the support S adjacent to the upper face.

[0059] The RF 1 device can be manufactured so that each opening of the plurality of openings 30 of the device is aligned with a through hole 10. In this way, powder residues inside the device can be evacuated via the openings 30 and the through holes 10 to the outside of the device during depowdering.

[0060] One such embodiment is illustrated in Figure 3, in which the RF device 1 comprises a plurality of apertures 30 aligned with through holes 10. Alternatively, each aperture 30 can be aligned with several through holes. Alternatively, a plurality of apertures 30 can be aligned with a single through hole 10. {ST012}-{ 154}-{PCT}

[0061] According to a preferred embodiment, the step of forming the radio frequency device 1 by powder bed fusion comprises, for each elementary antenna, the formation of a waveguide wall arranged around one of the plurality of through holes 10. This configuration is particularly suitable for fabricating antenna arrays comprising several elementary antennas arranged in parallel. Each elementary antenna includes such a waveguide whose wall is fully supported by the fabrication support (i.e., each portion of the wall is in contact with the fabrication support), while the internal channel of the waveguide faces a through hole. In this way, the support of the waveguide walls is ensured and powder evacuation is maximized.

[0062] According to one embodiment, the step of depositing the powder bed onto the fabrication support S is carried out by at least partially filling the through hole 10. This operation is typically carried out by means of a scraper allowing the through hole to be filled from the upper surface of the fabrication support S. In this way, it becomes possible in particular to fabricate elements of the RF device arranged inside at least one opening 30.

[0063] Depending on the requirements, the through hole 10 can be partially filled with powder, for example in order to manufacture internal elements extending outside the opening 30 (e.g. impedance matching protrusions such as striations in the case of a radiating element of an antenna).

[0064] Alternatively, the through hole 10 can be fully filled with powder for the purpose of fabricating internal elements at the aperture 30 such as, for example, striations, septa or other impedance matching elements in the internal channel of a waveguide. {ST012}-{ 154}-{PCT}

[0065] According to one embodiment, the through hole 10 can be temporarily obstructed on the lower surface of the manufacturing support S so as to keep the powder bed inside the through hole 10. At the end of the powder bed melting step, the through hole 10 is released so as to allow depowdering via the through hole 10.

[0066] This obstruction is achieved, for example, by means of a removable plate fixed to the underside of the manufacturing support S. It can be fixed using adhesive, screws, clamps, clips, or any other means suitable for reversible fastening. Alternatively, each through hole 10 can be blocked individually, for example, by inserting an obstruction element into each through hole 10.

[0067] According to one embodiment, the diameter of the through hole 10 is less than the diameter of the opening 30. In this context, the term "diameter" refers to the greatest straight-line distance between two points on the periphery of the opening 30. Thus, this term is suitable regardless of the geometry of the cross-section of the opening 30.

[0068] In this way, the perimeter of the opening 30 is supported by the manufacturing support S, while ensuring that the through hole 10 is aligned with the opening 30.

[0069] As illustrated in Figure 5, the cross-section of the through hole 10 can be circular, polygonal with three, four, five, six, or more sides, curved, or any combination of these geometries. It can have a geometry adapted to that of the cross-section of the opening 30, e.g., the same cross-section geometry but with a smaller or larger diameter. The diameter of the through hole can vary depending on the printing direction or another direction. The through hole can have internal protrusions such as flats, teeth, or indentations, for example, for attaching auxiliary elements (e.g., through-hole blocking elements). {ST012}-{ 154}-{PCT}

[0070] In an advantageous embodiment, the build platform includes at least one through-hole 10 for each opening 30. As illustrated in Figure 4, the build platform S can thus comprise an array (or matrix) of through-holes 10. This array can be one-dimensional, i.e., consisting of a column (or row) of through-holes 10, or two-dimensional, i.e., extending in two directions. This array can be regular (typically when the RF device is an antenna array) or irregular, for example, to distribute the mechanical stresses in the build platform created by the through-holes and the weight of the printed device. It is also possible that the RF device has an irregular geometry requiring an irregular array distribution of the through-holes 10 to maximize the removal of powder residue.

[0071] The network of through holes 10 of the manufacturing support S can therefore be adapted to the geometry of the manufactured RF 1 device, in particular to the number, geometry and arrangement of the openings 30 of the RF 1 device.

[0072] According to a complementary or alternative embodiment, the plurality of through holes 20 is provided in a wall of the radio frequency device 1 adjacent to the manufacturing support S when the radio frequency device is manufactured on the manufacturing support such that each through hole 20 is at least partially delimited by the manufacturing support S and at least partially delimited by the wall of the device.

[0073] As illustrated in Figure 6, the through holes 20 are advantageously provided in the portion of the RF device 1 that lies directly against the manufacturing support S. The through holes 20 are thus arranged at the level of the openings 30 of the RF device 1.

[0074] This arrangement allows for the removal of powder residue from the inside to the outside of the device during the depowdering stage. {ST012}-{ 154}-{PCT} In effect, these through holes 20 create a passage from the inside to the outside of the device. As mentioned above, the powder residue(s) can thus be removed from inside the RF 1 device via the through holes 20, for example by successive rotations around one or more axes of the device fixed to the manufacturing support, and / or by vibration / shock, and / or by high-pressure cleaning.

[0075] When the RF device is on the fabrication support S after being additively manufactured, the through holes 20 are delimited partly by the wall of the RF device and partly by the fabrication support S. Thus, at least one side of the cross-section of each through hole 20 is formed by the fabrication support S.

[0076] According to a preferred embodiment, the through holes 20 are made directly by additive manufacturing, i.e. the RF device 1 is manufactured additively so that the through holes 20 are included during additive manufacturing.

[0077] Advantageously, the geometry of the through holes 20 can be adapted for additive manufacturing so that no external or fabricated support structure is required to support the through holes 20 when the RF device 1 is manufactured. These adaptations include, for example, the absence of cantilevered portions exceeding an angle of 45° with the vertical axis (the manufacturing direction), the creation of circular arc contours for the through holes, or at least curved portions to form one or more arches. Thus, an arch profile can typically include a rounded portion and / or a polygonal portion formed from at least two straight segments.

[0078] Alternatively or additionally, one or more through holes 20 are drilled after the manufacture of the RF device 1.

[0079] According to an embodiment in which through holes 20 are formed in the wall of the RF device 1, the method may include {ST012}-{ 154}-{PCT} A step involves removing a portion of the device wall adjacent to the fabrication support, in which the through holes 20 are formed, so that the final RF device 1 no longer has through holes 20. Indeed, the profile variations of the RF device caused by the through holes 20 can have an undesirable effect on the propagation of electromagnetic waves within the device. In particular, these variations can alter the device's impedance.

[0080] However, these variations can also be used to the advantage of the device. Indeed, some RF devices require the use of mechanical impedance matching elements such as raised features (poles, steps, depressions, etc.). Thus, according to one embodiment, the through holes 20 are adapted to serve as impedance matching elements for the device. This implementation is particularly relevant when the RF device 1 is an antenna whose radiating elements are located on the side of the fabrication support S. In fact, the impedance matching elements are advantageously positioned at this end of the antenna.

[0081] In order to optimize the effect of the through holes 20 on the radio frequency characteristics of the RF device 1, the present method may include a step of modifying the geometry (i.e. the cross-section) of the through holes 20. Their profile may, for example, be cut or ground so as to obtain a geometry having determined and desired RF characteristics for the application of the RF device 1 in question.

[0082] According to one embodiment, the through holes 10 in the manufacturing support S and the through holes 20 in the wall of the RF 1 device can be combined to optimize the removal of powder residues.

[0083] According to one embodiment, the diameter of each hole passing through 10, 20 is less than the wavelength X, preferably less than 0.8 X, or even less than 0.5 X. These dimensions are {ST012}-{ 154}-{PCT} particularly advantageous when the device includes waveguides whose diameter is less than or equal to X. In this way, the diameter of each through hole is less than or equal to the diameter of the corresponding aperture 30 aligned with the hole.

[0084] This application also relates to a manufacturing support S for powder bed additive manufacturing of an RF device 1. The support S includes at least one through hole 10 intended to allow the evacuation of residue from the powder bed from the inside of the device 1 to the outside of the device 1 without the device having to be separated from the manufacturing support S.

[0085] The manufacturing support may include one or more of the features presented above in the context of the manufacturing process description.

[0086] In particular, the manufacturing support S may include a plurality of through holes 10 between a top face of the support S for supporting the RF device 1 and a bottom face of the support S opposite the top face.

[0087] Alternatively or complementarily, the through hole 10 can be provided between the upper face of the support and a lateral face of the support S adjacent to the upper face.

[0088] The arrangement of the through-holes 10 on the support is typically adapted to the topology of the RF device to be manufactured. In particular, the manufacturing support S can advantageously comprise a plurality of through-holes 10 arranged in a lattice to correspond to a plurality of radiating element apertures in an antenna array. The through-holes 10 can thus be arranged at regular intervals to form a row and column pattern. {ST012}-{ 154}-{PCT} Reference numbers used in the figures Radio frequency device Through hole Through hole Device opening Manufacturing support {ST012}-{ 154}-{PCT}

Claims

Demands 1. A powder bed fusion additive manufacturing process for a radio frequency device (1) comprising a plurality of waveguide apertures (30) arranged in an array, the process comprising the steps of: depositing a powder bed intended to be melted to form the radio frequency device (1) onto a manufacturing support (S), forming the radio frequency device by melting the powder bed so that the plurality of apertures (30) of the device are arranged on the manufacturing support (S) during manufacturing, and removing a powder residue from the manufacturing of the radio frequency device from the inside of an assembly formed at least by the manufacturing support (S) and the radio frequency device (1) to its outside.characterized in that the powder residue is evacuated through a plurality of through holes (10, 20) provided in the manufacturing support (S) and / or in a wall of the radio frequency device (1) adjacent to the manufacturing support (S), without the manufactured radio frequency device (1) having to be separated from the manufacturing support (S) during the powder residue evacuation step and in that a diameter of each through hole of the plurality of through holes (10, 20) is less than 1.5X, where A is the operating wavelength of the waveguides.

2. Method according to claim 1, wherein the radio frequency device (1) is an antenna array comprising a plurality of elementary antennas arranged contiguously on the manufacturing support (S), each opening (30) of the plurality of openings being an opening of a radiating element of an elementary antenna.

3. Method according to any one of claims 1 to 2, each through hole (10) being provided in the manufacturing support (S), the radio frequency device (1) being manufactured so that each opening (30) is aligned with a through hole (10) of the plurality of through holes. {ST012}-{ 154}-{PCT} 4. Method according to claim 3, wherein the step of forming the radio frequency device by powder bed fusion comprises, for each elementary antenna, the formation of a waveguide wall arranged around a through hole of the plurality of through holes (10).

5. A method according to any one of claims 3 to 4, wherein the powder bed is arranged on the manufacturing support (S) so as to at least partially fill the plurality of through holes (10).

6. A method according to any one of claims 4 to 5, wherein each through hole (10) is aligned with an opening of a radiating element of an elementary antenna, so that the plurality of through holes (10) is arranged in a regular array of through holes aligned with the antenna array.

7. A method according to any one of claims 4 to 5, wherein each through hole (10) is aligned with an opening of a radiating element of an elementary antenna, so that the plurality of through holes (10) is arranged in an irregular array of through holes aligned with the antenna array.

8. A method according to any one of claims 3 to 7, wherein a section of each through hole (10) measured in a plane parallel to the manufacturing support (S) is circular, or polygonal with at least three sides.

9. Method according to any one of claims 1 to 2, each through hole (20) being provided in a wall of the radio frequency device (1) adjacent to the manufacturing support (S) when the radio frequency device is manufactured on the manufacturing support such that each through hole (20) is at least partially delimited by the manufacturing support (S) and at least partially delimited by the wall of the device (1). {ST012}-{ 154}-{PCT} 10. Method according to claims 2 and 9, each elementary antenna comprising at least one through hole (20) of the plurality of through holes.

11. A method according to any one of claims 9 to 10, wherein at least one through hole (20) of the plurality of through holes has an arch-shaped cross-section.

12. Method according to claim 11, wherein a profile of the arch comprises a rounded portion and / or a polygonal portion formed of at least two straight segments.

13. A method according to any one of claims 9 to 12, comprising a step of ablation of a portion of the wall of the device adjacent to the manufacturing support in which the plurality of through holes (20) are provided so that the final radio frequency device (1) no longer has through holes (20).

14. A method according to any one of claims 9 to 12, comprising a step modifying the geometry of each through hole (20) after additive manufacturing of the device (1) so as to modify the impedance of the device.

15. A method according to any one of claims 1 to 14, wherein the diameter of each through hole (10, 20) is less than the wavelength X, preferably less than 0.8 X.

16. Manufacturing support (S) for powder bed additive manufacturing of a radio frequency device (1), the support (S) comprising a through hole (10) intended to allow the evacuation of residue from the powder bed from inside the manufactured device to outside the device (1) without the device having to be separated from the manufacturing support (S). {ST012}-{ 154}-{PCT} 17. Manufacturing support according to claim 15, comprising a plurality of through holes (10) arranged in a network corresponding to a network of openings (30) of a radio frequency device (1) intended to be manufactured on the support (S). {ST012}-{ 154}-{PCT}

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