Complexing agent used for chemical copper plating solution and preparation method of complexing agent
A technology of electroless copper plating and complexing agent, which is applied in the field of complexing agent for electroless copper plating solution and its preparation, which can solve the problems of affecting the bonding strength of the plating layer and the substrate, affecting the thickness of the activated copper layer of the bath, and achieving brittleness. Small, avoiding the effect of bonding strength and improving stability
CN107299336AInactive Publication Date: 2017-10-27南通赛可特电子有限公司
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Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- Publication Date
- 2017-10-27
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
The invention discloses a complexing agent used for chemical copper plating solution. The complexing agent comprises the following raw materials in parts by weight: 150-160 kg of seignette salt, 180-200kg of sodium hydroxide, 20-30L of an additive (nickel sulfate) and 1,000L of water. A preparation method of the complexing agent specifically comprises the following steps: 1) adding seignette salt into water, stirring and dissolving until the mixed solution is clear and controlling the temperature at 20-30 DEG C; 2) adding sodium hydroxide, stirring and dissolving until the mixed solution is clear and controlling the temperature at below 70 DEG C; 3) adding an additive M and controlling the temperature at 40-50 DEG C. The complexing agent has the advantages of being low in operation temperature and convenient in use, being capable of improving the stability of the copper plating solution and enabling the thickness of a prepared copper-plated layer to be moderate and stable.
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