High speed board-to-board connector

Abstract

The application discloses a high-speed board-to-board connector, which comprises an insulating base and a plurality of plug terminals. The plug terminal has a vertical part and a horizontal part perpendicular to the vertical part; the vertical part is located in a corresponding terminal receiving groove, and the horizontal part extends out of the bottom surface of the insulating base and is exposed outside; the vertical part of each plug terminal comprises a mating section at the top end of the vertical part, a width adjusting section below the mating section and a fixing section at the bottom end of the vertical part; the mating section is located in the corresponding terminal receiving groove and exposed in the mating cavity; and the width adjusting section and the fixing section are both embedded in the insulating base. The high-speed board-to-board connector can provide satisfactory high-speed performance under high-frequency signals of 12.5 GHz by improving the structure of the plug terminal and setting the width adjusting section for adjusting the impedance of the plug terminal.

Description

Technical Field

[0001] This invention relates to the field of connector technology, and in particular to a high-speed board-to-board connector with excellent high-speed signal transmission performance. Background Technology

[0002] With the continuous development of communication technology, 5G technology is advancing rapidly, and the requirements for data transmission rates are becoming increasingly stringent. High-speed board-to-board connectors, acting as a bridge for signal transmission between the motherboard and daughterboards, play a crucial role in communication between boards. Currently, the maximum transmission rate of high-speed board-to-board connectors can reach 28G / s, thus ensuring high-speed transmission.

[0003] Therefore, it is necessary to increase research on high-speed board-to-board connectors to meet the high-speed requirements of high-speed communication systems. Summary of the Invention

[0004] The main objective of this invention is to provide a high-speed board-to-board connector that improves impedance continuity and further enhances high-speed performance by adjusting the width of the plug terminals.

[0005] Other objects and advantages of the present invention can be further understood from the technical features disclosed herein.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A high-speed board-to-board connector includes an insulating base and a plurality of plug terminals fixed to the insulating base. The insulating base has a plurality of parallel vertical terminal receiving slots penetrating the upper and lower bottom surfaces of the insulating base, and a mating cavity. Each plug terminal is L-shaped, having a vertical portion and a horizontal portion perpendicular to the vertical portion. The vertical portion is located in a corresponding terminal receiving slot, while the horizontal portion extends out of the bottom surface of the insulating base and is exposed. The vertical portion of each plug terminal includes a mating section at the top of the vertical portion, a width adjustment section below the mating section, and a fixing section at the bottom of the vertical portion. The mating section is located in a corresponding terminal receiving slot and exposed in the mating cavity. The width adjustment section and the fixing section are both embedded in the insulating base.

[0008] In one embodiment, the width adjustment segment is located at 1 / 4 wavelength of the 12.5 GHz signal moving upward along the direction of the horizontal portion.

[0009] In one embodiment, the insulating base is elongated and has a bottom wall, two parallel longitudinal side walls, and two parallel transverse side walls; the mating cavity is formed by the bottom wall, the longitudinal side walls, and the transverse side walls.

[0010] In one embodiment, the terminal receiving groove is formed on the inner surface of the two longitudinal sidewalls.

[0011] Compared to existing technologies, the high-speed board-to-board connector of the present invention improves the structure of the plug terminals by setting a width adjustment section to adjust the impedance of the plug terminals, thereby improving the impedance continuity of the plug terminals and reducing reflections during signal transmission. Especially under high-frequency signals of 12.5GHz, it can provide satisfactory high-speed performance. Attached Figure Description

[0012] Figure 1 This is a three-dimensional structural diagram of the high-speed board-to-board connector of the present invention.

[0013] Figure 2 This is a three-dimensional structural diagram of the high-speed board-to-board connector of the present invention along another direction.

[0014] Figure 3 This is an exploded structural diagram of the high-speed board-to-board connector of the present invention.

[0015] Figure 4 This is an exploded structural diagram of the high-speed board-to-board connector of the present invention along another direction.

[0016] Figure 5 This is a schematic diagram of the conductive terminal structure of the high-speed board-to-board connector of the present invention.

[0017] Figure 6 This is a schematic diagram simulating the reflection coefficient and signal frequency of the high-speed board-to-board connector of the present invention when transmitting high-speed signals.

[0018] The reference numerals in the above figures are explained as follows:

[0019] High-speed board-to-board connector 1 Insulating base 10

[0020] Bottom wall 11, longitudinal side wall 12

[0021] 13 transverse sidewalls, 14 docking cavity

[0022] Terminal receiving slot 15 Plug terminal 20

[0023] Vertical section 21, connecting section 210

[0024] Width adjustment section 212 Fixed section 214

[0025] Horizontal section 22. Detailed Implementation

[0026] The following description of embodiments is with reference to the accompanying drawings, which illustrate specific embodiments in which the invention can be implemented. Directional terms used in this invention, such as "up," "down," "front," "back," "left," "right," "top," and "bottom," are merely for reference to the accompanying drawings. Therefore, the directional terms used are for illustrating and understanding the invention, and not for limiting the invention.

[0027] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, the high-speed board-to-board connector 1 of the present invention is a plug connector that can be coupled with a socket connector (not shown) to form a board-to-board assembly, thereby connecting the motherboard and the daughterboard to transmit signals at a high speed.

[0028] like Figures 1 to 4 As shown, the high-speed board-to-board connector 1 includes an insulating base 10 and a plurality of plug terminals 20 fixed to the insulating base 10.

[0029] like Figure 3 , Figure 4 As shown, the insulating base 10 is longitudinally elongated and has a bottom wall 11, two parallel longitudinal side walls 12, two parallel transverse side walls 13, and a mating cavity 14 formed by the bottom wall 11 and the side walls 12 and 13.

[0030] Several parallel vertical terminal receiving grooves 15 are formed on the inner surfaces of the two longitudinal sidewalls 12. Each terminal receiving groove 15 extends downward from the top of the corresponding longitudinal sidewall 12 through the bottom wall 11 of the insulating base 10 in a vertical direction to receive and fix the plug terminal 20.

[0031] like Figure 3 , Figure 4 , Figure 5 As shown, each plug terminal 20 is L-shaped, having a vertical portion 21 and a horizontal portion 22 perpendicular to the vertical portion 21.

[0032] like Figure 5 As shown, the vertical portion 21 is upright and located within the corresponding terminal receiving groove 15. The vertical portion 21 is divided into three sections: a mating section 210 at the top of the vertical portion 21, a width adjustment section 212 below the mating section 210, and a fixing section 214 at the bottom of the vertical portion 21. The mating section 210 is exposed within the mating cavity 14, as shown... Figure 1As shown, this is used to prepare for mating with the socket terminals of the socket connector (not shown) to form an electrical connection. The width adjustment section 212 is not exposed within the mating cavity 14, but is embedded in the insulating base 10. It is used to adjust the impedance of the plug terminal 20, reduce signal reflection during transmission, and further improve the high-speed transmission performance of the high-speed board-to-board connector 1. The fixing section 214 is also not exposed within the mating cavity 14, but is also embedded in the insulating base 10, and can form a fixed relationship with the corresponding terminal receiving groove 15, thereby stably fixing the plug terminal 20 in the terminal receiving groove 15.

[0033] The horizontal portion 22 extends beyond the bottom surface of the insulating base 10 and is exposed to the outside for use as a welding foot, such as... Figure 1 As shown.

[0034] For more details, please refer to Figure 5 As shown, for the plug terminal 20, the distance between the width adjustment section 212 and the horizontal portion 22 is equal to 1 / 4 wavelength of the signal frequency of interest. In this embodiment, the position (i.e., the center position) of the width adjustment section 212 is exactly at 1 / 4 wavelength of the 12.5 GHz signal moving upwards along the solder pin direction. The width adjustment section 212 allows for variations in the capacitive and inductive properties of the plug terminal 20, resulting in better impedance continuity than when the entire plug terminal 20 is of uniform width, thus significantly improving high-speed performance.

[0035] like Figure 6 As shown, curve A is a graph showing the relationship between the reflection coefficient of the plug terminal 20 when the width is not uniform and the signal frequency, while curve B is a graph showing the relationship between the reflection coefficient of the plug terminal 20 when the width is uniform and the signal frequency.

[0036] As shown in the figure, when the frequency of the signal of interest reaches 12.5 GHz, the energy value of the high-speed signal reflection coefficient corresponding to curve A is S1,1: -25.856784, while the energy value of the reflection coefficient corresponding to curve B is S1,1_Same: -11.540043. A lower reflection coefficient (a larger negative value indicates a lower coefficient) indicates smoother signal flow within the product and fewer obstacles.

[0037] In this embodiment, at the signal frequency of interest up to 12.5 GHz, the reflection coefficient can be improved by approximately -14 dB.

[0038] In summary, the high-speed board-to-board connector 1 of the present invention improves the structure of the plug terminal 20 by setting a width adjustment section 212 to adjust the impedance of the plug terminal 20, thereby improving the impedance continuity of the plug terminal 20 and reducing reflections during signal transmission. Especially under high-frequency signals of 12.5GHz, it can provide satisfactory high-speed performance.

Claims

1. A high-speed board-to-board connector, characterized in that: It includes an insulating base and several plug terminals fixed to the insulating base; The insulating base has several parallel vertical terminal receiving slots that penetrate the upper and lower bottom surfaces of the insulating base, as well as a mating cavity; Each plug terminal is L-shaped, having a vertical portion and a horizontal portion perpendicular to the vertical portion; wherein the vertical portion is located in the corresponding terminal receiving groove, while the horizontal portion extends out of the bottom surface of the insulating base and is exposed to the outside; Each plug terminal includes a mating section at the top of the vertical portion, a width adjustment section below the mating section, and a fixing section at the bottom of the vertical portion; the mating section is located in the corresponding terminal receiving groove and exposed in the mating cavity; the width adjustment section and the fixing section are both embedded in the insulating base; Each plug terminal has an unequal width, and the distance between the width adjustment section and the horizontal section is equal to 1 / 4 wavelength of the signal frequency transmitted by the high-speed board-to-board connector.

2. The high-speed board-to-board connector as described in claim 1, characterized in that: The signal frequency is 12.5 GHz.

3. The high-speed board-to-board connector as described in claim 1, characterized in that: The insulating base is longitudinally elongated and has a bottom wall, two parallel longitudinal side walls, and two parallel transverse side walls; the mating cavity is formed by the bottom wall, the longitudinal side walls, and the transverse side walls.

4. The high-speed board-to-board connector as described in claim 3, characterized in that: The terminal receiving groove is formed on the inner surface of the two longitudinal sidewalls.

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