Microstrip array antenna

Abstract

The present invention provides a microstrip array antenna, which includes: a radiation element structure, the number and position of the radiation element structure can be configured according to specific requirements, and the specific requirements include at least one or more of cost requirements, performance requirements, and structural requirements. Among them, the radiation element structure is composed of a patch radiation element and a radiation element on a PCB board, and then multiple radiation element structures are arrayed to form a microstrip array antenna with series feeding and parallel feeding. Moreover, the number and position of the radiation element structure can be configured according to cost requirements, performance requirements, and structural requirements, etc., so as to facilitate reducing the area of the microstrip array antenna and increasing the isolation degree.

Description

Technical Field

[0001] The present invention relates to the technical field of array antennas, and particularly to a microstrip array antenna. Background Art

[0002] A microstrip antenna is an antenna formed on a thin dielectric substrate, with a metal thin layer attached to one side as a ground plane, and a metal patch of a certain shape made on the other side by photolithography etching or printing method, and fed by a microstrip line or a coaxial probe to the patch. Microstrip antennas are generally divided into two types: one is that the patch shape is a slender strip, called a microstrip dipole antenna. The other is that the patch shape is an area unit, called a microstrip antenna. If a slit is cut in the ground plane and a microstrip line is printed on the other side of the dielectric substrate, and fed by the slit, a microstrip slot antenna is formed.

[0003] A microstrip antenna forms an array in a two-dimensional plane, called a microstrip planar array antenna. According to different feeding methods, it can be divided into series feeding and parallel feeding. A series-fed microstrip array antenna is a linear array composed of microstrip patches as basic array elements and fed by microstrip line in series. Series feeding can significantly reduce the complexity of the feeding network, shorten the length of the microstrip transmission line in the network, reduce the loss caused by the feeding network, and is widely used in fixed-beam and frequency-scanning antennas. Especially widely used in automotive millimeter-wave radars. Generally, in order to achieve high gain, an array is formed again along the X direction, and a planar array (series-parallel combination) based on the series-fed microstrip array antenna is formed.

[0004] Due to the characteristics of easy fabrication, compact area, convenient layout, low cost, etc., and in terms of performance, easy to achieve a wider horizontal angle, higher gain, etc., series-fed microstrip array antennas are currently widely used in automotive millimeter-wave anti-collision radars. Therefore, there are currently many related technologies regarding microstrip array antennas.

[0005] The existing technologies regarding series-fed microstrip array antennas mainly have the following defects and deficiencies: In terms of performance, series-fed microstrip array antennas need to reduce the area and increase the isolation between antennas. Taking automotive millimeter-wave anti-collision radar as an example, the current mainstream solution is to use the 76 - 81 GHz frequency band as the working frequency band for automotive millimeter-wave anti-collision radar.

[0006] In current millimeter-wave radar systems, two or more antennas are often used for half-wavelength equidistant arrangement to form the receiving antennas of the radar, so as to measure the angle of surrounding objects relative to the vehicle and depict the movement direction of surrounding objects. Similarly, generally, after using series-fed microstrip array antennas for half-wavelength equidistant arrangement, the isolation between antennas is generally less than 15 dB, which also limits the performance of the radar.

[0007] In a MIMO (Multiple-Input Multiple-Output) radar, it is often necessary to arrange multiple transmitting antennas and multiple receiving antennas. Even though the series-fed array antenna has the characteristic of being compact, when multiple antennas are required, the radar has a large area. There is also an urgent need to reduce the antenna area.

[0008] Compared with the series-fed array antenna, the parallel-fed array antenna is characterized in that the array elements are fed in parallel. Parallel feeding can form a linear array or a planar array. Each unit can be set to be independently fed, or a multi-stage power divider or other matrices can be used to form a feeding network for feeding. Similarly, the parallel-fed array antenna also needs to improve the isolation between the array elements through technical means, which is beneficial for suppressing side lobes and other advantages. The parallel-fed array antenna also needs to reduce the antenna area through certain technical means. These problems are all topics that the industry has been researching, and they are also the difficulties and bottlenecks in applications. Summary of the Invention

[0009] The present invention aims to solve at least one of the above technical problems.

[0010] For this reason, the object of the present invention is to provide a microstrip array antenna, which has the advantages of small area and high isolation.

[0011] To achieve the above object, an embodiment of the present invention provides a microstrip array antenna, including: a radiation unit structure, the number and position of the radiation unit structure can be configured according to specific requirements, and the specific requirements include at least one or more of cost requirements, performance requirements, and structural requirements.

[0012] The microstrip array antenna according to the embodiment of the present invention includes a radiation unit structure, which is composed of a patch radiation unit and a radiation unit on a PCB board. Then, multiple radiation unit structures are grouped to form a series-fed and parallel-fed microstrip array antenna, and the number and position of the radiation unit structures can be configured according to cost requirements, performance requirements, and structural requirements, etc., so as to facilitate reducing the area of the microstrip array antenna and increasing the isolation.

[0013] In addition, the microstrip array antenna according to the above embodiment of the present invention may also have the following additional technical features:

[0014] In some examples, it further includes: a patch radiation unit structure connected in series or parallel with the radiation unit structure, and the number of the patch radiation unit structures can be configured.

[0015] In some examples, the radiation unit structure includes: a substrate; a radiation patch disposed on the substrate; a feeding structure connected to the radiation patch; and a radiation unit disposed on the radiation patch, wherein the radiation unit has a dielectric material structure body, and a first metal surface and a second metal surface opposite to each other disposed on the dielectric material structure body, and the radiation unit is connected to the radiation patch through the first metal surface.

[0016] In some examples, the radiation unit and the radiation patch are connected by welding.

[0017] In some examples, the dielectric constant of the dielectric material structure body is greater than the dielectric constant of the substrate.

[0018] In some examples, the feeding structure is a feeding probe or a feeding microstrip line.

[0019] In some examples, the dielectric material structure body is composed of a ceramic material, an organic material or a composite material.

[0020] In some examples, the number of the radiation unit structures is multiple.

[0021] In some examples, the sizes of the dielectric material structure bodies among the multiple radiation unit structures are different.

[0022] In some examples, the radiation unit structure is a three-dimensional structure or a planar structure.

[0023] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0025] Figure 1 is a schematic diagram of a microstrip array antenna structure according to an embodiment of the present invention;

[0026] Figure 2 is a schematic diagram of a microstrip array antenna composed of two patch radiation unit structures according to a specific embodiment of the present invention;

[0027] Figure 3 is a schematic diagram of an array antenna composed of three patch radiation unit structures according to a specific embodiment of the present invention;

[0028] Figure 4 is a schematic diagram of a parallel-fed array antenna composed of multiple patch radiation unit structures according to a specific embodiment of the present invention;

[0029] Figure 5 is a schematic diagram of the radiation unit structure according to an embodiment of the present invention;

[0030] Figure 6 is a schematic diagram of the radiation unit structure according to another embodiment of the present invention;

[0031] Figure 7 is a schematic diagram of the radiation unit according to an embodiment of the present invention;

[0032] Figure 8 is a schematic diagram of an array antenna with only one patch radiation unit according to a specific embodiment of the present invention;

[0033] Figure 9 is a schematic diagram of a common series-fed array antenna;

[0034] Figure 10 is in a specific embodiment of the present invention Figure 8 is a schematic diagram of the parameters of the array antenna shown;

[0035] Figure 11 is in a specific embodiment of the present invention Figure 9 is a schematic diagram of the parameters of the array antenna shown;

[0036] Figure 12 is a schematic diagram of the spacing between two series-fed array antennas set at a spacing of half the wavelength of 77 GHz according to a specific embodiment of the present invention;

[0037] Figure 13 is in a specific embodiment of the present invention Figure 12 is a schematic diagram of the parameters of the structure shown;

[0038] Figure 14 is a schematic diagram of the spacing between two series-fed array antennas with an isolation degree ≥ 18 dB between 76 GHz and 77 GHz according to a specific embodiment of the present invention;

[0039] Figure 15 is in a specific embodiment of the present invention Figure 14 is a schematic diagram of the parameters of the structure shown. Description of the Drawings:

[0041] 100 - Radiation unit structure; Patch radiation unit structure; 1 - Substrate; 2 - Radiation patch; 3 - Feeding structure; 4 - Radiation unit; 41 - Dielectric material structure body; 42 - First metal surface; 43 - Second metal surface. Detailed Description of the Invention

[0042] Embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present invention and should not be construed as limiting the present invention.

[0043] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance.

[0044] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "mounted", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0045] The microstrip array antenna according to an embodiment of the present invention will be described below with reference to the accompanying drawings.

[0046] Figure 1 is a schematic structural diagram of a microstrip array antenna according to an embodiment of the present invention.

[0047] As Figure 1 shown, the microstrip array antenna includes a radiation unit structure 100. Among them, the number and position of the radiation unit structure 100 can be configured according to specific requirements, and the specific requirements include at least one or more of cost requirements, performance requirements, and structural requirements.

[0048] That is to say, the number of the radiation unit structures 100 can be one or more, and can be flexibly configured specifically according to cost requirements, performance requirements, structural requirements, and other requirements, so as to be beneficial to reducing the volume and increasing the isolation degree.

[0049] In an embodiment of the present invention, as Figure 1 or Figure 2As shown, the microstrip array antenna further includes: a patch radiation unit structure 200 connected in series or in parallel with the radiation unit structure 100, where the number of the patch radiation unit structures 200 is configurable.

[0050] As a specific embodiment, for example Figure 2 FIG. shows a schematic diagram of a microstrip array antenna composed of two radiation unit structures 100. That is to say, the microstrip array antenna may include two radiation unit structures 100.

[0051] Figure 3 FIG. shows a schematic diagram of a microstrip array antenna composed of three radiation unit structures 100. That is to say, the microstrip array antenna may include three radiation unit structures 100.

[0052] In a specific embodiment, multiple radiation unit structures 100 may form a series-fed and parallel-fed array antenna, that is, a microstrip array antenna with a series structure and a microstrip array antenna with a parallel structure can be formed.

[0053] Figure 4 FIG. shows a schematic diagram of a parallel-fed array antenna composed of multiple radiation unit structures 100. Figures 2 - 3 FIG. shows a schematic diagram of a series-fed array antenna composed of multiple radiation unit structures 100. Figure 1 FIG. shows a schematic diagram of a series-parallel combined array antenna composed of multiple radiation unit structures 100, that is, a hybrid-fed array antenna.

[0054] Figure 5 FIG. is a schematic diagram of the radiation unit structure 100 according to an embodiment of the present invention. Figure 6 FIG. is a schematic diagram of the radiation unit structure 100 according to another embodiment of the present invention. Combining Figure 5 and Figure 6 as shown, the radiation unit structure 100 includes: a substrate 1, a radiation patch 2 (as Figure 6 shown), a feeding structure 3, and a radiation unit 4.

[0055] Specifically, the substrate 1 is made of, for example, PCB (Printed Circuit Board) material. The radiation patch 2 is disposed on the substrate 1; the feeding structure 3 is connected to the radiation patch 2; as Figure 6 shown, the radiation unit 4 is disposed on the radiation patch 2. Wherein, as Figure 7 shown, the radiation unit 4 has a dielectric material structure body 41, and opposite first and second metal surfaces 42 and 43 disposed on the dielectric material structure body 41, and the radiation unit 4 is connected to the radiation patch 2 through the first metal surface 42. That is to say, the radiation unit 4 is configured as a double-sided metallized radiation unit.

[0056] In one embodiment of the present invention, both the first metal surface 42 and the second metal surface 43 are smooth high-conductivity metallized surface layers.

[0057] In one embodiment of the present invention, the radiation unit 4 and the radiation patch 2 are connected by welding. Specifically, they can be welded by the SMT process.

[0058] In one embodiment of the present invention, the dielectric constant of the dielectric material structure body 41 is greater than that of the substrate 1. More specifically, the dielectric material structure body 41 is composed of a ceramic material, an organic material, or a composite material.

[0059] In one embodiment of the present invention, the dielectric material structure body 41 is rectangular, square, or circular. Figures 5 - 7 The examples shown are all rectangular.

[0060] In one embodiment of the present invention, the feeding structure 3 is a feeding probe or a feeding microstrip line.

[0061] Specifically, the main part of the radiation unit structure 100 includes: a radiation patch 2 on the surface of the PCB substrate 1; a double-sided metallized radiation unit 4 welded to the radiation patch 2 on the surface of the PCB substrate 1 by surface mounting; the radiation unit 4 has a certain thickness, and the dielectric constant is larger than that of the PCB substrate 1 material. The radiation unit 4 is a patch radiation unit and can be welded to the surface of the radiation patch 2 on the PCB substrate 1 by the SMT process. Among them, both the upper surface and the bottom surface of the radiation unit 4 are smooth high-conductivity metallized surface layers, that is, the upper and lower surfaces of the dielectric material structure body 41 are smooth metal thin layers formed by a metal material with high conductivity. Thus, the radiation unit 4 in the embodiment of the present invention is a patch-type radiation unit, which is different from a general dielectric antenna radiation unit and needs to be regarded as a whole after being welded to the radiation unit 4 on the PCB substrate 1. Further, a new radiation unit composed of such a patch radiation unit and the original radiation unit on the PCB surface is used to form a series-fed or parallel-fed array antenna, thereby solving two current difficulties, namely, reducing the area of the array antenna and increasing the isolation between array elements.

[0062] In summary, according to the radiation unit structure 100 of the embodiment of the present invention, a radiation patch 2 is provided on the substrate 1, a radiation unit 4 is provided on the radiation patch 2, the radiation unit 4 has a dielectric material structure body 41, opposite first metal surface 42 and second metal surface 43 are provided on the dielectric material structure body 41, and the radiation unit 4 is connected to the radiation patch 2 through the first metal surface 41, that is, the radiation patch 2 and the PCB radiation unit 4 are combined to form a new radiation unit structure 100, which is beneficial to reducing the area of the array antenna and increasing the isolation.

[0063] In one embodiment of the present invention, the number of radiation unit structures 100 is, for example, multiple.

[0064] In one embodiment of the present invention, the sizes of the dielectric material structure bodies 41 among the multiple radiation unit structures 100 are different. That is, the thicknesses of the dielectric material structure bodies 41 in different radiation unit structures 100 are different.

[0065] In one embodiment of the present invention, the radiation unit structure 100 is a three-dimensional structure or a planar structure. Specifically, generally, the radiation units of an array antenna are on the plane of a PCB and belong to planar radiation units. The structure of the embodiment of the present invention makes the PCB planar radiation unit become a three-dimensional structure, providing at least two or more additional degrees of freedom in the antenna design process, such as: the dielectric constant of the dielectric block, the height of the dielectric block, the metallization pattern of the dielectric block, and the distribution of the dielectric block in the array antenna, etc.

[0066] In a specific embodiment, in the embodiment of the present invention, the patch radiation unit structure 200 and the radiation unit structure 100 on the PCB substrate are grouped to form a series-fed and parallel-fed array antenna, which has new features. The feature is that the number and position of the radiation unit structures 100 can be flexibly configured according to cost requirements, performance requirements, structural requirements, and other requirements. For example Figure 2 As shown in [reference], in the design of an eight-element series-fed array antenna, only two of the units are welded with the radiation unit structure 100 to form a microstrip array antenna with certain functions. Further, 1 to 8 radiation unit structures 100 can be used. When the number is less than 8, the position distribution of the radiation unit structures 100 can also be flexibly selected. This flexible method allows the designer to well achieve the purpose of reducing cost, reducing area, and improving isolation while reducing cost.

[0067] As Figure 2 shown, a schematic diagram of a microstrip array antenna composed of two radiation unit structures 100 is shown. As Figure 3 shown, a schematic diagram of an array antenna composed of three radiation unit structures 100 is shown.

[0068] Taking a series-fed array antenna using three radiation unit structures 100 as an example, without loss of generality, in this example, since there are eight radiation patches on the PCB substrate, 1 to 8 radiation unit structures 100 can be used if necessary. The number and the position arrangement method of using the radiation unit structures 100 are within the scope of the present invention. It should be noted that the same method can be implemented in a parallel-fed or hybrid-fed microstrip array antenna, such as Figure 1 and Figure 4 shown. As mentioned above, without loss of generality, Figure 1 and Figure 4All PCB radiation patches have a radiation unit structure 100, and in practical applications, the radiation unit structure 100 can be flexibly configured.

[0069] It should be noted that in the above examples, microstrip line feeding is used. Without loss of generality, other feeding methods can also be used, such as probe feeding, and these feeding methods will not affect the implementation of the solution of the present invention.

[0070] For ease of understanding, the principle of reducing the area of the array antenna and increasing the isolation degree in the embodiments of the present invention will be described below.

[0071] Specifically, as described above, generally, a microstrip planar array antenna is usually made of a single PCB material or a ceramic material substrate. The characteristic of a single PCB material is that the dielectric constant can be very low. Usually, the dielectric constant of the PCB material used is between 3 and 5. When using a PCB material with a low dielectric constant to make an array antenna, due to the low dielectric constant, at the same frequency point, the size of the radiation unit made in a planar manner is relatively large; however, due to the low dielectric constant and the use of a PCB board with a relatively thin thickness, the transmission of surface waves can be suppressed to a certain extent. Compared with materials with a high dielectric constant, the isolation degree between the antenna radiation units can be relatively high.

[0072] If a ceramic material (such as a low-temperature co-fired ceramic material) is used to make a general microstrip planar array antenna, due to the high dielectric constant of the ceramic material (generally > 5), at the same frequency point, the area of the antenna radiation unit can be relatively small, but the isolation degree is poor.

[0073] The principle that the embodiments of the present invention can improve the isolation degree while reducing the area lies in that: since the radiation unit structure 110 of the embodiments of the present invention is composed of a radiation patch 2 on a PCB substrate 1 and an additional patch radiation unit 4, the following two advantages will be brought:

[0074] First, the dielectric constant of the PCB material is low, but the patch radiation unit 4 can be made of a material with a high dielectric constant. Since the final patch radiation unit 4 will be welded on the PCB radiation patch 2, overall, for the new radiation unit, the lower layer is a material with a low dielectric constant and the upper layer is a material with a high dielectric constant. Therefore, the equivalent dielectric constant will be higher than the dielectric constant of the original pure PCB material, so the surface area of the entire radiation unit can be reduced. In addition, since the main material is still a PCB material with a low dielectric constant, the isolation degree between the radiation units also retains the characteristics of the low dielectric constant material, and is higher than the isolation degree between units made of a pure high dielectric constant material.

[0075] Second, a general microstrip planar array antenna is a planar structure and is difficult to be designed into a three-dimensional structure. If it is stacked in a planar form in a PCB substrate or a ceramic substrate to form a three-dimensional structure, it will not only cause a significant increase in cost, but also make the process manufacturing complex and is not conducive to improving the product yield. Therefore, in the form of patch radiation units, they are welded on the surface of the planar array units, and this method provides a way to manufacture a low-cost three-dimensional structure antenna. Since the radiation units therein become three-dimensional structures, the resonant modes of the radiation units are changed. Due to the presence of the patch radiation units with a high dielectric constant above, on the one hand, the current path of the radiation units becomes longer, and thus the area of the entire radiation unit is reduced; on the other hand, the electric field in the patch radiation units with a high dielectric constant is relatively concentrated, and the result shown is also that the isolation degree between the radiation units becomes larger.

[0076] In a specific embodiment, the embodiment of the present invention uses a patch radiation unit 4 and a PCB radiation patch 2 for combination, and the new radiation unit formed can achieve the purpose of reducing the area and increasing the isolation degree. At the same time, it is pointed out that the number and position layout of the patch radiation units can be flexibly configured. Therefore, without loss of generality, a series-fed array antenna with one patch radiation unit is used as a specific application embodiment. In this embodiment, the antenna is a series-fed array antenna applied to a 76 GHz automotive millimeter-wave anti-collision radar, where the dielectric constant of the PCB board is 3.1 and the loss tangent angle is 0.01. As Figure 9 shown, before adding the patch radiation unit, the antenna operates near 76.4 GHz, and its parameter results are as Figure 11 shown. As Figure 8 shown, after adding the patch radiation unit to one of the units, the antenna operates near 75.4 GHz, and its parameter results are as Figure 10 shown.

[0077] Specifically, in Figure 8 , the series-fed array antenna of the embodiment of the present invention is shown, and only one patch radiation unit is set, while Figure 9 shows a common series-fed array antenna. In this embodiment, the patch radiation unit uses a rectangular substrate (the loss tangent angle is 0.002) made of a ceramic material with a dielectric constant of 7.1, and the upper and lower surfaces have smooth highly conductive metallization layers, and are welded on the PCB radiation patch therein.

[0078] In order to reflect the effect that the embodiment of the present invention can reduce the volume, in this embodiment, the units on the PCB substrate are kept unchanged, and the S11 parameters before and after welding the radiation patch units are compared. The comparison results are as Figure 10 and Figure 11 shown, where New antenna refers to Figure 10The S11 parameter of an array antenna with a patch radiation element set as shown; while Normalantenna refers to Figure 11 The S11 parameter of a common series-fed array antenna as shown. Among them, before and after adding the patch radiation element, the lowest point of the S11 parameter moves about 1 GHz to the low frequency. Therefore, if it is necessary to maintain the same resonance point as before, the area of the radiation patch can be reduced.

[0079] In order to prove that the embodiments of the present invention can increase the isolation between antennas, two series-fed array antennas are set at a distance of half the wavelength of 77 GHz (about 1.95 mm). Similarly, by comparing the two cases, it can be seen that the isolation between ordinary antennas is ≤ 15 dB, and after adding the patch radiation element, the isolation is ≥ 18 dB, with an increase of at least 3 dB in isolation. Specifically, as Figure 12 shown, it shows a schematic diagram of setting two series-fed array antennas at a distance of half the wavelength of 77 GHz, and the corresponding parameter results are schematically shown as Figure 13 shown.

[0080] Furthermore, Figure 14 it shows a schematic diagram of the isolation ≥ 18 dB between two series-fed array antennas in the range of 76 GHz to 77 GHz, and the corresponding parameter results are schematically shown as Figure 15 shown. However, the isolation between the corresponding ordinary antennas is ≤ 15 dB in the range of 76 GHz to 77 GHz.

[0081] It should be noted that in the above embodiments of the present invention, the microstrip series-fed array antenna is taken as an example for illustration. Without loss of generality, the embodiments of the present invention are equally effective for the microstrip array antenna with parallel feeding.

[0082] In summary, the microstrip array antenna according to the embodiments of the present invention includes a radiation element structure, which is composed of a patch radiation element and a radiation element on the PCB board. Furthermore, multiple radiation element structures are grouped to form a series-fed and parallel-fed microstrip array antenna, and the number and position of the radiation element structures can be configured according to cost requirements, performance requirements, and structural requirements, etc., so as to facilitate reducing the area of the microstrip array antenna and increasing the isolation.

[0083] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0084] Although embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A microstrip array antenna, characterized in that, comprising: A radiation element structure, the number and position of the radiation element structure can be configured according to specific requirements, and the specific requirements include at least one or more of cost requirements, performance requirements, and structural requirements; the radiation element structure includes: a substrate; a radiation patch disposed on the substrate; a feeding structure connected to the radiation patch; a radiation unit disposed on the radiation patch, wherein the radiation unit has a dielectric material structure body, and opposite first and second metal surfaces disposed on the dielectric material structure body, and the radiation unit is connected to the radiation patch through the first metal surface; the dielectric constant of the dielectric material structure body is greater than the dielectric constant of the substrate.

2. The microstrip array antenna according to claim 1, characterized in that, further comprising: A patch radiation element structure connected in series or parallel with the radiation element structure, and the number of the patch radiation element structures can be configured.

3. The microstrip array antenna according to claim 1, characterized in that, The radiation unit and the radiation patch are connected by welding.

4. The microstrip array antenna according to claim 1, characterized in that, The feeding structure is a feeding probe or a feeding microstrip line.

5. The microstrip array antenna according to claim 1, characterized in that, The dielectric material structure body is composed of a ceramic material, an organic material or a composite material.

6. The microstrip array antenna according to claim 1, characterized in that, The number of the radiation element structures is multiple.

7. The microstrip array antenna according to claim 1, characterized in that, The sizes of the dielectric material structure bodies among the multiple radiation element structures are different.

8. The microstrip array antenna according to any one of claims 1-7, characterized in that, The radiation element structure is a three-dimensional structure or a planar structure.

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