DDR test equipment and press-fit components

Abstract

The present invention discloses a pressing component of a DDR test device, which includes a mounting seat and a plurality of pressure heads arranged on the mounting seat at intervals, the pressure head includes a groove, a plurality of elastic members arranged in the groove, and a protrusion arranged at the open end of the groove, one end of the elastic member is arranged at the bottom of the groove, and the other end of the elastic member is arranged on the inner end surface of the protrusion, and the protrusion can move toward the inside of the groove and compress the elastic member under the action of external pressure. The pressing component of the DDR test device of the present invention presses the DDR chip to be tested by a plurality of flexible pressure heads, which can reduce the damage to the mobile phone motherboard during the pressing process, avoid excessive device loss, and thus achieve the purpose of reducing the test cost. In addition, the present invention also discloses a DDR test device.

Description

Technical Field

[0001] The present invention relates to the technical field of DDR testing, and in particular to a DDR testing device and a pressing component. Background Art

[0002] Double Data Rate (DDR) is a synchronous dynamic random access memory (SDRAM) with double data transfer rate. Its data transfer speed is twice the system clock frequency, and its transmission performance is better than traditional SDRAM.

[0003] As we all know, after mass production, DDR needs to be functionally tested to ensure the quality of DDR products before they leave the factory. Existing DDR testing equipment usually includes a machine table, several test sockets set on the machine table, a baffle plate located above the test socket, a spring set between the test socket and the baffle plate, and a pressure head located above the test socket. When it is necessary to test the DDR chip, the pressure head is driven by a cylinder to press down on one side of the baffle plate, and the opposite side of the baffle plate is lifted up to open the test socket, and then the DDR chip is placed in; after the DDR chip is placed in, the pressure head is withdrawn from the baffle plate surface, and the baffle plate is reset to cover the top of the test socket.

[0004] However, when the pressure head presses the baffle surface to open the test seat, the spring will be subjected to a large pressure, resulting in the spring being easily damaged and requiring frequent replacement, which will increase its testing cost. In addition, since the bottom end of the spring is in direct contact with the mobile phone motherboard in the test seat, when the spring is subjected to a large pressure, it is easy to cause damage to the mobile phone motherboard, which will also increase its testing cost. Summary of the invention

[0005] The main purpose of the present invention is to provide a pressing component of a DDR test device to solve the technical problem that the test cost of the existing DDR test device is relatively high.

[0006] In order to solve the above technical problems, the present invention proposes a pressing component of a DDR test device, which includes a mounting seat and a plurality of pressing heads arranged at intervals on the mounting seat, the pressing head includes a groove, a plurality of elastic parts arranged in the groove and a protrusion arranged at the open end of the groove, one end of the elastic part is arranged at the bottom of the groove, and the other end of the elastic part is arranged on the inner end surface of the protrusion, and the protrusion can move toward the inside of the groove and compress the elastic part under the action of external pressure.

[0007] Preferably, the mounting seat comprises two mounting blocks arranged at intervals and a mounting plate arranged between the two mounting blocks, the mounting blocks are provided with a plurality of mounting holes, and the pressure head is arranged on the mounting plate.

[0008] Preferably, a plurality of horizontal bosses are arranged at intervals on the left side and / or the right side of the mounting plate, and the grooves are arranged on the horizontal bosses.

[0009] Preferably, a plurality of positioning holes are arranged at intervals on the mounting plate.

[0010] Preferably, the pressure head further comprises a cover plate arranged at the open end of the groove, and a first through hole for the protrusion to pass through is arranged in the middle of the cover plate.

[0011] Preferably, the pressing head further comprises a first buffering pad arranged on the bump, and the first buffering pad can be pressed on the surface of the DDR chip.

[0012] The present invention further provides a DDR test device, which includes a machine platform, a plurality of test sockets arranged on the machine platform, a manipulator arranged above the test sockets, a plurality of cylinders and a pressing component, wherein the plurality of test sockets are arranged side by side on the machine platform and spaced apart at a preset distance, the manipulator is used to transfer a DDR chip to be tested to the test sockets or to transfer a tested DDR chip from the test sockets, the plurality of cylinders are arranged on opposite sides of the machine platform, the output execution ends of the two oppositely arranged cylinders are respectively connected to the two ends of the pressing component to drive the pressing component to move toward the test sockets, and the plurality of pressure heads on the pressing component correspond one-to-one to the plurality of test sockets;

[0013] The pressing component includes a mounting seat and a plurality of pressing heads arranged at intervals on the mounting seat, the pressing head includes a groove, a plurality of elastic parts arranged in the groove and a protrusion arranged at the open end of the groove, one end of the elastic part is arranged at the bottom of the groove, and the other end of the elastic part is arranged on the inner end surface of the protrusion, and the protrusion can move toward the inside of the groove and compress the elastic part under the action of external pressure.

[0014] Preferably, the test seat includes a base, a bottom plate arranged below the base and probes arranged on the bottom plate, the middle of the base is hollowed out to form a test slot for accommodating the DDR chip, and the bottom plate is provided with a plurality of second through holes for the probes to pass through.

[0015] Preferably, the test seat further comprises a second buffer pad arranged under the base plate, one end of the probe is connected to the second buffer pad, and the other end passes through the second through hole, and the second buffer pad is provided with a third through hole corresponding to the second through hole.

[0016] Preferably, the DDR test device further comprises a plurality of infrared sensors arranged on the test seat, and a fourth through hole is arranged on the peripheral wall of the test slot for infrared rays emitted by the infrared sensors to pass through.

[0017] The beneficial effect of the embodiment of the present invention is that the DDR chip to be tested placed in the test seat is pressed by a plurality of flexible pressure heads arranged on the mounting seat to test the DDR chip. Specifically, the pressing component is arranged above the test seat, and it can be close to or away from the test seat under the action of the driving mechanism. When the DDR chip to be tested is placed on the test seat, the pressing component is pressed down to press the test seat through the flexible pressure head; after the test is completed, the pressing component moves up to open the test seat to take out the tested DDR chip. Since the pressure head proposed by the present invention is a flexible pressure head, when it is pressed on the DDR chip, the pressure on the chip can be reduced to avoid the chip from being broken due to the pressure, thereby improving the stability of the DDR test. At the same time, since the DDR chip is in direct contact with the mobile phone motherboard, the damage to the mobile phone motherboard caused by the pressing process can be reduced, and excessive device loss can be avoided, thereby achieving the purpose of reducing the test cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of an embodiment of a pressing component of a DDR test device of the present invention;

[0019] Figure 2 It is an orthographic projection view of the press-fit components of the DDR test equipment of the present invention;

[0020] Figure 3 Another orthographic projection view of the press-fit components of the DDR test device of the present invention;

[0021] Figure 4 for Figure 2 A local enlarged schematic diagram of the middle A;

[0022] Figure 5 It is a structural schematic diagram of the press-fit components and the test socket of the DDR test equipment of the present invention;

[0023] Figure 6 It is a structural schematic diagram of a test socket of a DDR test device of the present invention. DETAILED DESCRIPTION

[0024] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but are not to be construed as limiting the present invention. All other embodiments obtained by ordinary technicians in the field without creative work based on the embodiments of the present invention are within the scope of protection of the present invention.

[0025] The present invention provides a press-fit component of a DDR test device. In one embodiment, see Figure 1 The pressing component of the DDR test equipment includes a mounting seat 10 and a plurality of pressing heads 20 arranged on the mounting seat 10 at intervals. The pressing head 20 includes a groove, a plurality of elastic members arranged in the groove and a protrusion 21 arranged at the open end of the groove. One end of the elastic member is arranged at the bottom of the groove, and the other end of the elastic member is arranged on the inner end surface of the protrusion 21. The protrusion 21 can move toward the inside of the groove and compress the elastic member under the action of external pressure.

[0026] It is understandable that after the DDR chip is placed in the test socket, downward pressure needs to be applied to the DDR chip, and the probe under the DDR chip will shrink under the pressure to connect the circuit between the DDR chip and the mobile phone motherboard, and then start the functional test of the DDR chip. During the test, pressure is always applied to the DDR chip to avoid poor contact, thereby ensuring stable testing of the DDR chip.

[0027] In this embodiment, the mounting seat 10 can move in a direction close to or away from the test seat under the action of the driving mechanism to press or open the test seat. Specifically, after the DDR chip to be tested is placed on the test seat, the mounting seat 10 is pressed down to press the test seat through the pressing head 20; after the test is completed, the mounting seat 10 moves up to open the test seat to take out the tested DDR chip.

[0028] The pressure head 20 mainly presses the DDR chip through the bump 21 at its front end. The elastic member contracts under the pressure of the bump 21, which plays a flexible pressing role for the DDR chip. When the test is completed, the pressure head 20 moves up and resets under the action of the elastic member. The bump 21 includes a bottom that is flush with the opening end of the groove when reset, and a raised portion arranged on the bottom, and the shape and size of the raised portion match the DDR chip. In a specific embodiment of the present invention, the raised portion is four rectangular blocks arranged on the bottom, so that the DDR chip is pressed by the four rectangular blocks, thereby ensuring that the circuit between the DDR chip and the mobile phone motherboard is always turned on, thereby improving the stability of the DDR chip test.

[0029] In addition, the elastic member is a compression spring disposed in the groove, and the compression spring is preferably four, and the four compression springs are respectively against the bottom of the bump 21 and the bottom of the groove, so that when the pressure head 20 presses the DDR chip, it is in flexible contact with the DDR chip, which plays a role in reducing the pressure on the chip, avoiding chip breakage caused by pressure, and further improving the stability of DDR testing. Of course, the elastic member can be not only a compression spring, but also other components with elastic restoring force, including but not limited to these, and the compression spring and the number of settings are only exemplary, not restrictive, and those skilled in the art can choose according to actual conditions.

[0030] In a preferred embodiment, see Figure 2 The mounting seat 10 includes two mounting blocks 11 arranged at intervals and a mounting plate 12 arranged between the two mounting blocks 11. The mounting block 11 is provided with a plurality of mounting holes 30, and the pressure head 20 is arranged on the mounting plate 12. In this embodiment, a plurality of mounting holes 30, such as threaded holes and through holes, are arranged on the mounting block 11. The mounting seat 10 is connected to the output execution end of the driving mechanism through the mounting holes 30. The mounting seat 10 can move along a set direction under the action of the driving mechanism to press or open the test seat. At the same time, the plurality of pressure heads 20 arranged on the mounting plate 12 are respectively pressed on the DDR chip placed in the test seat, so that the circuit between the DDR chip and the mobile phone motherboard is conductive.

[0031] In the above preferred embodiment, see Figure 3 , a plurality of horizontal bosses 40 are arranged at intervals on the left and / or right sides of the mounting plate 12, and the grooves are arranged on the horizontal bosses 40. In this embodiment, the left and right sides of the mounting plate 12 are referenced to the state of the pressing component when it is actually used. In actual use, the pressing head 20 is facing downward, and the direction of the pressing head 20 is used as a reference to determine the left and right directions of the mounting plate 12. It should be noted that when the horizontal bosses 40 are arranged at intervals on the left or right side of the mounting plate 12, that is, the pressing head 20 is located on the left or right side of the mounting plate 12, the structure can be referred to Figure 2 When the horizontal bosses 40 are spaced apart on the left and right sides of the mounting plate 12, two rows of test sockets can be pressed simultaneously by a single pressing component, which is equivalent to increasing the number of pressing heads 20 of a single pressing component, thereby achieving the purpose of improving test efficiency.

[0032] In the above preferred embodiment, a plurality of positioning holes 50 are arranged at intervals on the mounting plate 12. In this embodiment, the positioning holes 50 cooperate with the infrared sensor to position the pressing component. Specifically, when the infrared light emitted by the infrared sensor passes through the positioning hole 50, it indicates that the pressing component is directly above the test seat, and each pressure head 20 of the pressing component is aligned with each test seat below; when the infrared light emitted by the infrared sensor is blocked by the mounting plate 12, it indicates that each pressure head 20 on the pressing component is not aligned with each test seat below it. When the infrared light emitted by the infrared sensor passes through the positioning hole 50, the pressing component can be pressed down and pressed on the test seat. When the infrared light emitted by the infrared sensor does not pass through the positioning hole 50, the position of the pressing component needs to be adjusted until the infrared light emitted by the infrared sensor passes through the positioning hole 50, and the pressing component can be pressed down. In a specific embodiment of the present invention, the positioning holes 50 are arranged at intervals on the mounting plate 12 and are located between two adjacent horizontal bosses 40.

[0033] In another preferred embodiment, the pressure head 20 further includes a cover plate 60 disposed at the open end of the groove, and a first through hole is disposed in the middle of the cover plate 60 for the projection 21 to pass through. In this embodiment, the cover plate 60 is disposed at the open end of the groove, the cover plate 60 is fixed by screws, and a first through hole is disposed in the middle of the cover plate 60 for the projection 21 to pass through. Preferably, the first through hole is rectangular, and the rectangular through hole is connected to the inside of the groove.

[0034] In another preferred embodiment, see Figure 4 The pressure head 20 further includes a first buffer pad 70 disposed on the bump 21, and the first buffer pad 70 can be pressed on the surface of the DDR chip. In this embodiment, during the pressing process of the pressure head 20, the first buffer pad 70 is in direct contact with the DDR chip, which can reduce the pressure on the DDR chip and play a buffering role for the DDR chip, thereby ensuring the integrity of the DDR chip and the mobile phone motherboard.

[0035] The present invention further proposes a DDR testing device including a machine platform, a plurality of test sockets arranged on the machine platform, a manipulator arranged above the test sockets, a plurality of cylinders and a pressing component. The specific structure of the pressing component refers to the above embodiment. Since the present DDR testing device adopts all the technical solutions of all the above embodiments, it has at least all the technical effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0036] Among them, multiple test sockets are arranged side by side on the machine platform and spaced apart at a preset distance. The manipulator is used to transfer the DDR chip to be tested to the test socket or to transfer the tested DDR chip from the test socket. Multiple cylinders are arranged on opposite sides of the machine platform. The output execution ends of the two oppositely arranged cylinders are respectively connected to the two ends of the pressing component to drive the pressing component to move toward the test socket. The multiple pressure heads on the pressing component correspond to the multiple test sockets one by one. For details, please refer to Figure 5 .

[0037] In a preferred embodiment, see Figure 6 The test seat includes a base 1, a bottom plate 2 arranged below the base 1, and a probe 3 arranged on the bottom plate 2. The middle of the base 1 is hollowed out to form a test slot 4 for accommodating a DDR chip, and the bottom plate 2 is provided with a plurality of second through holes 5 through which the probe 3 can pass. In this embodiment, the main function of the test seat is to place the DDR chip and connect the DDR chip with the mobile phone motherboard, so as to realize the functional test of the DDR chip. The test seat includes a base 1 with a hollow middle portion, and the hollow space of the base 1 forms a test slot 4 for accommodating a DDR chip. That is to say, when the DDR chip needs to be tested, the DDR chip is first placed in the test slot 4. A bottom plate 2 is provided at the bottom of the base 1, and fixing screw holes are correspondingly provided on the bottom plate 2 and the base 1 to fix the bottom plate 2 and the base 1 by screws. In order to connect the DDR chip with the mobile phone motherboard, a probe 3 is provided on the bottom plate 2, and the bottom end of the probe 3 is electrically connected to the mobile phone motherboard, and the top end of the probe 3 can be electrically connected to the DDR chip placed in the test slot 4.

[0038] In another preferred embodiment, the test socket further includes a second buffer pad 6 disposed below the bottom plate 2, one end of the probe is connected to the second buffer pad 6, and the other end passes through the second through hole 5, and the second buffer pad 6 is provided with a third through hole 7 corresponding to the second through hole 5. In this embodiment, the second buffer pad 6 is disposed below the bottom plate 2, that is, the second buffer pad 6 is disposed between the mobile phone mainboard and the bottom plate 2, so that the pressure of the pressing component on the mobile phone mainboard is reduced through the second buffer pad 6, and a force buffering effect is played on the mobile phone mainboard, thereby avoiding damage to the mobile phone mainboard caused by the pressure of the pressing component.

[0039] In another preferred embodiment, the DDR test device proposed by the present invention further includes a plurality of infrared sensors disposed on the test socket, and a fourth through hole 8 for the infrared light emitted by the infrared sensor to pass through is disposed on the peripheral wall of the test slot 4. In this embodiment, if two DDR chips are placed in one test socket, the infrared light emitted by the infrared sensor will be blocked by the DDR chip and cannot pass through the fourth through hole 8, so that it can be determined that there is a test abnormality and the test needs to be stopped.

[0040] The above description is only a partial or preferred embodiment of the present invention. Neither the text nor the drawings can limit the scope of protection of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the overall concept of the present invention, or direct / indirect application in other related technical fields are included in the scope of protection of the present invention.

Claims

1. A pressing component of a DDR test device, characterized in that: The invention comprises a mounting seat and a plurality of pressure heads arranged at intervals on the mounting seat, wherein the pressure head comprises a groove, a plurality of elastic members arranged in the groove and a convex block arranged at the open end of the groove, one end of the elastic member is arranged at the bottom of the groove, and the other end of the elastic member is arranged on the inner end surface of the convex block, and the convex block can move toward the inside of the groove and compress the elastic member under the action of external pressure; The mounting seat comprises two mounting blocks arranged at intervals and a mounting plate arranged between the two mounting blocks, the mounting blocks are provided with a plurality of mounting holes, and the pressure head is arranged on the mounting plate; A plurality of horizontal bosses are arranged at intervals on the left side and / or the right side of the mounting plate, the grooves are arranged on the horizontal bosses, and a plurality of positioning holes are arranged at intervals on the mounting plate; The pressure head also includes a cover plate arranged at the open end of the groove, and a first through hole for the projection to pass through is arranged in the middle of the cover plate.

2. The press-fit component according to claim 1, characterized in that: The pressure head further comprises a first buffer pad arranged on the bump, and the first buffer pad can be pressed on the surface of the DDR chip.

3. A DDR test device, characterized in that: It comprises a machine platform, a plurality of test sockets arranged on the machine platform, a manipulator arranged above the test sockets, a plurality of cylinders and a pressing component according to any one of claims 1 to 2, wherein the plurality of test sockets are arranged side by side on the machine platform and spaced apart at a preset distance, the manipulator is used to transfer a DDR chip to be tested to the test sockets or to transfer a tested DDR chip from the test sockets, the plurality of cylinders are arranged on opposite sides of the machine platform, the output execution ends of the two oppositely arranged cylinders are respectively connected to the two ends of the pressing component to drive the pressing component to move toward the test sockets, and the plurality of pressing heads on the pressing component correspond one-to-one to the plurality of test sockets.

4. The DDR test device according to claim 3, characterized in that: The test seat includes a base, a bottom plate arranged below the base and probes arranged on the bottom plate. The middle of the base is hollowed out to form a test slot for accommodating the DDR chip. The bottom plate is provided with a plurality of second through holes for the probes to pass through.

5. The DDR test device according to claim 4, characterized in that: The test seat also includes a second buffer pad arranged below the bottom plate, one end of the probe is connected to the second buffer pad, and the other end passes through the second through hole, and the second buffer pad is provided with a third through hole corresponding to the second through hole.

6. The DDR test device according to claim 4, characterized in that: It also includes a plurality of infrared sensors arranged on the test seat, and a fourth through hole is arranged on the peripheral wall of the test slot for the infrared rays emitted by the infrared sensors to pass through.

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