Display device

Abstract

The present disclosure relates to a display device. The display device includes a first substrate including a display area and a non-display area surrounding the display area; a light emitting element on the first substrate and in the display area; a display signal line on the first substrate and in the display area, extending along a first direction, and transmitting a signal to the light emitting element; a common voltage supply line on the first substrate and in the non-display area; a pad on the first substrate and in the non-display area, electrically connected to the display signal line; and an indentation pad on the first substrate and in the non-display area, electrically connected to the common voltage supply line, along a second direction crossing the first direction, the indentation pad being located relatively closer to an edge of the substrate than the pad.

Description

Technical Field

[0001] This disclosure relates to a display device. Background Technology

[0002] Display devices are devices that visually display data. Representative examples of such display devices include liquid crystal displays (LCDs) and organic light-emitting diode (OLEDs). OLEDs, compared to LCDs, offer advantages such as superior brightness and viewing angle characteristics, and do not require a backlight, thus enabling ultra-thin designs.

[0003] Display devices typically include a display area for displaying images and a non-display area surrounding the display area, where wiring may be provided. Summary of the Invention

[0004] The non-display area adjacent to the edge of the display device is vulnerable to static electricity. Therefore, if a strong static charge flows into the display device from the outside, the wiring may be damaged by the static charge.

[0005] The technical problem to be solved by this disclosure is to provide a display device with improved reliability.

[0006] The technical problems to be solved by this disclosure are not limited to those mentioned above. Those skilled in the art can clearly understand other technical problems not mentioned through the following description.

[0007] A display device according to an embodiment of the present disclosure for solving the above-mentioned technical problems includes: a first substrate, including a display area and a non-display area surrounding the display area; a light-emitting element located on the first substrate and in the display area; a display signal line located on the first substrate and in the display area, extending along a first direction and transmitting a signal to the light-emitting element; a common voltage supply line located on the first substrate and in the non-display area; a pad located on the first substrate and in the non-display area, electrically connected to the display signal line; and an indentation pad located on the first substrate and in the non-display area, electrically connected to the common voltage supply line, and along a second direction intersecting the first direction, the indentation pad is located relatively closer to the edge of the substrate than the pad.

[0008] In several embodiments, the indentation pad may include a light-transmitting portion.

[0009] In several embodiments, the display device may further include an alignment pad located on the first substrate, the alignment pad being located relatively closer to the edge of the substrate than the indentation pad along the second direction, the alignment pad including a first portion extending along the second direction and a second portion directly connected to the first portion and extending along the first direction.

[0010] In several embodiments, the first portion of the alignment pad may be directly connected to the indentation pad.

[0011] In several embodiments, the display device may further include a dummy pad located on the first substrate and in the non-display area, positioned along the second direction between the pad and the indentation pad, the dummy pad being electrically connected only to the common voltage supply line.

[0012] In several embodiments, the display device may further include a flexible circuit board bonded to the first substrate, the flexible circuit board including terminals electrically connected to the pads and indentation terminals electrically connected to the indentation pads.

[0013] In several embodiments, the display device may further include a driving portion mounted on a flexible circuit board, wherein the terminals may be electrically connected to each other with the driving portion, and the indentation terminals may not be electrically connected to the driving portion.

[0014] In several embodiments, the display device may further include an alignment pad located on the first substrate and positioned relatively closer to the edge of the first substrate than the indentation pad along the second direction. The flexible circuit board further includes an alignment terminal connected to the alignment pad. The alignment terminal includes a first terminal portion extending along the second direction and directly connected to the indentation pad, and a second terminal portion directly connected to the first terminal portion and extending along the first direction. The first terminal portion may overlap with the alignment pad, and the second terminal portion may not overlap with the alignment pad.

[0015] In several embodiments, a portion of the flexible circuit board may be arranged to face the underside of the first substrate, and the portion of the flexible circuit board may be bonded to the underside of the first substrate via a bonding member comprising a conductive material.

[0016] In several embodiments, the display device may further include a driving unit disposed on the flexible circuit substrate and located on the lower side of the first substrate, the driving unit overlapping the display area.

[0017] In several embodiments, the display device may further include: a second substrate located on the first substrate and including a sensing area and a peripheral area surrounding the sensing area; and a touch sensing layer located on the second substrate, the touch sensing layer including: a touch electrode portion located in the sensing area, a touch signal line located in the peripheral area and connected to the touch electrode portion, and an electrostatic blocking portion located in the peripheral area and spaced apart from the touch signal line.

[0018] In several embodiments, the touch signal line may be located between the sensing area and the electrostatic blocking portion.

[0019] In several embodiments, the electrostatic blocking portion may include a plurality of conductive patterns spaced apart from each other.

[0020] In several embodiments, the touch signal line and the electrostatic blocking part may be made of the same material and located directly above the same layer.

[0021] In several embodiments, the touch electrode portion may include: a first touch electrode arranged along the first direction and electrically connected to each other along the first direction; and a second touch electrode arranged along the second direction and electrically connected to each other along the second direction, wherein the first touch electrode and the second touch electrode may be located in the same layer, and the electrostatic blocking portion may be located in a different layer from the first touch electrode and the second touch electrode.

[0022] In several embodiments, the touch sensing layer may further include an insulating layer located on the electrostatic blocking portion, and the first touch electrode and the second touch electrode may be located on the insulating layer.

[0023] In several embodiments, the touch electrode portion may further include: a first connecting portion for connecting two adjacent first touch electrodes along the first direction to each other; and a second connecting portion for connecting two adjacent second touch electrodes along the second direction to each other, wherein the first connecting portion may be located in a different layer than the electrostatic blocking portion, and the second connecting portion may be located in the same layer as the electrostatic blocking portion.

[0024] A display device according to another embodiment of the present disclosure for solving the above-mentioned technical problems may include: a substrate, including a display area and a non-display area surrounding the display area; a light-emitting element, located on the substrate and in the display area; a display signal line, located on the substrate and in the display area, extending along a first direction and transmitting a signal to the light-emitting element; a common voltage supply line, located on the substrate and in the non-display area; a first pad, located on the substrate and in the non-display area, electrically connected to the display signal line; and an alignment pad, located on the substrate and in the non-display area, electrically connected to the common voltage supply line, the alignment pad including a first portion extending along a second direction intersecting the first direction and a second portion directly connected to the first portion and extending along the first direction.

[0025] In several embodiments, the alignment pad may be located closer to the edge of the substrate than the first pad along the second direction.

[0026] In several embodiments, the display device may further include: a driving circuit located on the substrate and in the non-display area, situated along the second direction between the common voltage supply line and the display area; and a second pad located on the substrate and in the non-display area, situated along the second direction between the first pad and the alignment pad, the second pad being electrically connected to the driving circuit.

[0027] The details of other embodiments are included in the specific implementation and accompanying drawings.

[0028] Invention Effects

[0029] According to embodiments of this disclosure, a display device with improved reliability can be provided.

[0030] The effects of this disclosure are not limited to those shown in the examples above; many more effects are included in this specification. Attached Figure Description

[0031] Figure 1 This is a schematic perspective view of a display device according to one embodiment.

[0032] Figure 2 For along Figure 1 The cross-sectional view taken from X1-X1′.

[0033] Figure 3 For along Figure 1 The cross-sectional view taken from X3-X3′.

[0034] Figure 4This is a schematic plan view of a display panel included in a display device according to an embodiment, and a plan view of a portion of a flexible circuit board coupled to the display panel.

[0035] Figure 5 for Figure 4 An exemplary equivalent circuit diagram of the pixels shown.

[0036] Figure 6 for Figure 4 A schematic cross-sectional view of the pixels is shown.

[0037] Figure 7 For along Figure 4 A rough cross-sectional view taken from X5-X5′.

[0038] Figure 8 To enlarge Figure 4 Plan view of section Q1.

[0039] Figure 9 For along Figure 8 The cross-sectional view taken from X7-X7′.

[0040] Figure 10 For along Figure 8 The cross-sectional view taken from X9-X9′.

[0041] Figure 11 For along Figure 8 The cross-sectional view taken from X11-X11′.

[0042] Figure 12 To show Figure 4 The diagram shows the alignment between the seventh pad and the seventh terminal.

[0043] Figure 13 To show in Figure 8 A diagram showing the approximate movement path of static electricity flowing in from the outside in the structure shown.

[0044] Figure 14 This is a schematic plan view of a touch sensing layer included in a display device according to an embodiment.

[0045] Figure 15 To enlarge Figure 14 The floor plan of section Q3.

[0046] Figure 16 For along Figure 15 A cross-sectional view of the touch-sensing layer taken from X13-X13′.

[0047] Figure 17 For along Figure 15 A cross-sectional view of the touch-sensing layer taken from X15 to X15′.

[0048] Figure 18 To enlarge Figure 14 The Q5 section of the plan view is a diagram that shows the approximate movement path of static electricity flowing in from the outside.

[0049] Figure 19 For along Figure 18 A cross-sectional view of the touch-sensing layer taken from X17-X17′.

[0050] Figure 20 To show Figure 18 A plan view of a variant example.

[0051] Figure 21 To show Figure 18 Another variation of the plan view. Detailed Implementation

[0052] The benefits and features of this disclosure, as well as the methods for implementing them, are described in reference to the appendix. Figure 1 The details of the embodiments described below will make this clear. However, this disclosure is not limited to the embodiments disclosed below and may be implemented in different forms. That is, this disclosure is defined by the scope of the claims.

[0053] Describing an element or layer as "on" or "above" other elements or layers includes not only cases where it is directly above other elements or layers, but also cases where there are other layers or elements in between. Conversely, describing an element as "directly above" or "directly above" indicates that there are no other elements or layers in between.

[0054] Although terms such as "first," "second," etc., are used to describe various constituent elements, these constituent elements are not limited to these terms. These terms are used only to distinguish one constituent element from other constituent elements. Therefore, the first constituent element mentioned below can also be a second constituent element within the scope of this disclosure.

[0055] Except where the context explicitly indicates otherwise, singular expressions include plural expressions. Furthermore, unless specifically stated otherwise, terms such as "including" or "having" do not exclude other constituent elements, but rather indicate that other constituent elements are also included.

[0056] The embodiments described in this specification will be illustrated with reference to the plan and cross-sectional views of this disclosure, which are intended as ideal schematic diagrams. Therefore, the form of the example drawings may vary depending on manufacturing techniques and / or tolerance ranges. Consequently, the embodiments of this disclosure are not limited to the specific forms illustrated, but also include variations in form resulting from manufacturing processes. Therefore, the areas shown in the drawings are of a general nature, and the appearance of the areas illustrated is for the purpose of illustrating the specific form of the area of ​​the element, and is not intended to limit the scope of the disclosure.

[0057] Throughout the specification, the same reference numerals are used for the same or similar parts.

[0058] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0059] Figure 1 This is a schematic perspective view of a display device according to one embodiment. Figure 2 For along Figure 1 The cross-sectional view taken from X1-X1′. Figure 3 For along Figure 1 The cross-sectional view taken from X3-X3′.

[0060] Reference Figures 1 to 3 The display device 1 according to this embodiment may include a display panel DP, a touch sensing layer 300 located on the display panel DP, and a flexible circuit board 500 connected to the display panel DP. Furthermore, the display device 1 may also include a touch flexible circuit board 700 connected to the touch sensing layer 300.

[0061] In several embodiments, the display panel DP can be configured as a square shape on a plane. The display panel DP may include two long sides extending in a first direction x, and two short sides extending in a second direction y intersecting the first direction x. The corners where the long and short sides of the display panel DP meet can be right angles, but are not limited to this; they can also be curved surfaces. Alternatively, to reduce the risk of damage, the corners of the display panel DP can be chamfered. Furthermore, the planar shape of the display panel DP is not limited to the examples; it can also be circular or other shapes.

[0062] From a planar structural perspective, the display panel DP includes a display area DA and a non-display area NDA. The display area DA is the area where images are displayed, and the non-display area NDA is the area where images are not displayed. In several embodiments, the non-display area NDA may be located around the display area DA, or may surround the display area DA.

[0063] Unless otherwise defined, “upper,” “upper side,” “above,” “top,” “above,” and “above” in this specification refer to the side pointed to by the arrow pointing to the third direction z, which intersects the first direction x and the second direction y with reference to the figure. “lower,” “lower side,” “below,” “bottom,” and “below” refer to the side in the opposite direction to the direction pointed to by the arrow pointing to the third direction z with reference to the figure.

[0064] In several embodiments, the display panel DP can be a rigid display panel or a flexible display panel.

[0065] In several embodiments, the display panel DP may be a display panel including a self-emissive element. In an exemplary embodiment, the self-emissive element includes at least one of an organic light-emitting diode (OLED), a quantum dot light-emitting diode (QD), an inorganic-based microlight-emitting diode (e.g., a microlight-emitting diode), and an inorganic-based nanolight-emitting diode (e.g., a nanolight-emitting diode). Hereinafter, for ease of explanation, the case where the self-emissive element is an organic light-emitting element will be described as an example.

[0066] When the display panel DP is considered as a stacked structure, it includes a first substrate 110, a second substrate 210 located on the first substrate 110, a component layer located between the first substrate 110 and the second substrate 210, and a pad portion PAD located on the first substrate 110. Furthermore, the display panel DP may also include a sealing member S located between the first substrate 110 and the second substrate 210, at the edge of the first substrate 110 and the second substrate 210, and connecting the first substrate 110 and the second substrate 210.

[0067] The first substrate 110 is a substrate that supports the component layer and the pad portion PAD. In several embodiments, the first substrate 110 may be an insulating substrate made of materials such as glass, quartz, ceramic, or plastic.

[0068] The component layer is located on the first substrate 110. In several embodiments, the component layer may include a plurality of pixels and a plurality of display signal lines located on the first substrate 110 and within the display area DA. Each pixel may include a thin film transistor (TFT), a capacitor, and a light-emitting element, as described later. The plurality of display signal lines may include scan lines for transmitting scan signals to the respective pixels and data lines for transmitting data signals.

[0069] Furthermore, the component layer may also include components and wiring located on the first substrate 110 and within the non-display area NDA. The components and wiring may also generate various signals applied to pixels located in the display area DA, or transmit corresponding signals to the pixels.

[0070] The pad portion PAD can be located on the first substrate 110 and within the non-display area NDA. The pad portion PAD can be located at one end of the display device 1, but is not limited thereto. The pad portion PAD can be connected to a flexible circuit board 500 capable of transmitting signals and voltages from the outside.

[0071] The second substrate 210 may be an encapsulation substrate that prevents moisture and / or oxygen from penetrating into the display portion from the outside. The second substrate 210 may be formed from a polymer film such as glass or plastic. The second substrate 210 may be formed to a size smaller than the first substrate 110, and may cover the first substrate 110 and the pixels located within the display area DA. In several embodiments, the second substrate 210 may not overlap with the pad portion PAD. That is, in the first direction x, the length of the second substrate 210 may be less than the length of the first substrate 110.

[0072] The seal S may be located between the first substrate 110 and the second substrate 210. The seal S may be located within the non-display area NDA and arranged to completely surround the display area DA in a plane. The seal S bonds the first substrate 110 and the second substrate 210 and prevents impurities such as moisture and oxygen from penetrating between the first substrate 110 and the second substrate 210 from the outside. In several embodiments, the seal S may be formed by distributing a sealing material such as glass solder between the first substrate 110 and the second substrate 210 and melting the sealing material by irradiation with a laser.

[0073] The touch sensing layer 300 may be located on the display panel DP. In several embodiments, the touch sensing layer 300 may obtain the coordinates of the touch input point via capacitance. This capacitance method can obtain the coordinate information of the touch point touched via self-capacitance or mutual capacitance. For ease of explanation, the following description uses a case where the touch sensing layer 300 is configured with mutual capacitance as an example, but it is not limited to this.

[0074] In several embodiments, the touch sensing layer 300 may be located on the second substrate 210 in the display panel DP.

[0075] In several embodiments, the portion of the touch sensing layer 300 located within the display area DA may include touch electrodes (not shown), and the portion of the touch sensing layer 300 located within the non-display area NDA may include touch signal lines (not shown) that transmit and / or receive signals to the touch electrodes and touch pad portions TPAD connected to the touch signal lines.

[0076] In several embodiments, the touch electrodes, touch signal lines, and touch pads (TPADs) of the touch sensing layer 300 may be located on the second substrate 210. In other words, additional bonding layers (e.g., adhesive layers) may not be located between the touch sensing layer 300 and the second substrate 210. For example, at least one of the touch electrodes, touch signal lines, and touch pads (TPADs) of the touch sensing layer 300 may be located directly above the second substrate 210. Alternatively, when an additional insulating film is located between the touch sensing layer 300 and the second substrate 210, at least one of the touch electrodes, touch signal lines, and touch pads (TPADs) of the touch sensing layer 300 may also be located directly above the insulating film.

[0077] The flexible circuit board 500 can be connected to the display panel DP. In several embodiments, the flexible circuit board 500 may include a terminal portion CD corresponding to the pad portion PAD, and the terminal portion CD of the flexible circuit board 500 can be electrically connected to the pad portion PAD.

[0078] The flexible circuit board 500 can be bent to face the bottom of the display panel DP or the bottom of the first substrate 110. The portion of the flexible circuit board 500 facing the bottom of the display panel DP can be fixed to the bottom of the display panel DP or the bottom of the first substrate 110.

[0079] In several embodiments, the portion of the flexible circuit board 500 facing the underside of the display panel DP can be fixed to the underside of the display panel DP or the underside of the first substrate 110 using a bonding member 900 as a medium. The bonding member 900 may include a conductive material. For example, the bonding member 900 may be made of double-sided adhesive including a copper layer. When the bonding member 900 includes a conductive material, static electricity flowing into the flexible circuit board 500 from the outside can be dispersed towards the bonding member 900. This can block or reduce the amount of static electricity flowing into the display panel DP.

[0080] In several embodiments, the portion of the flexible circuit board 500 that faces the underside of the display panel DP may partially overlap with the display area DA. As the flexible circuit board 500 bends towards the underside of the display panel DP, the bezel size of the display device 1 can be reduced.

[0081] In several embodiments, a driver unit D-IC may be mounted in the flexible circuit board 500 in the form of an integrated circuit chip. The driver unit D-IC is capable of outputting driving power and driving signals, and the driving signals are provided to the pixels of the display panel DP through the terminal portion CD of the flexible circuit board 500 and the pad portion PAD of the display panel DP. In several embodiments, the driver unit D-IC may be a data driving circuit that provides data signals to the pixels of the display area DA. In several embodiments, the driver unit D-IC may overlap with the display area DA, but is not limited thereto.

[0082] In several embodiments, the anisotropic conductive film AD1 may be located between the pad portion PAD and the terminal portion CD of the flexible circuit board 500, and the pad portion PAD and the terminal portion CD may be physically / electrically bonded to each other using the anisotropic conductive film AD1 as a medium. The anisotropic conductive film AD1 is an adhesive film for circuit connection, having anisotropy of being conductive in one direction (e.g., the thickness direction) and insulating in another direction (e.g., the planar direction). The anisotropic conductive film AD1 includes an insulating layer with adhesive properties (e.g., a thermosetting insulating layer) and a plurality of conductive balls located therein.

[0083] In several embodiments, the connection portion CT may also be located on the flexible circuit board 500. The connection portion CT may be a portion connected to the touch flexible circuit board 700 described later. In several embodiments, the connection portion CT may be configured in the form of a connector or the like.

[0084] The touch flexible circuit board 700 can be connected to the touch sensing layer 300. In several embodiments, the touch flexible circuit board 700 may include a touch terminal portion TCD corresponding to the touch pad portion TPAD, and the touch terminal portion TCD may be electrically connected to the touch pad portion TPAD.

[0085] In several embodiments, the anisotropic conductive film AD2 may be located between the touch terminal portion TCD of the touch flexible circuit board 700 and the touch pad portion TPAD of the touch sensing layer 300, and the touch terminal portion TCD and the touch pad portion TPAD may be physically / electrically connected to each other through the anisotropic conductive film AD2 as a medium.

[0086] In several embodiments, the touch flexible circuit board 700 can be bent toward the underside of the display panel DP or the underside of the first substrate 110. On the underside of the display panel DP, the touch flexible circuit board 700 can be connected to the connection portion CT provided on the flexible circuit board 500.

[0087] In several embodiments, the portion of the touch flexible circuit board 700 located below the display panel DP may also partially overlap with the display area DA.

[0088] In several embodiments, a touch driver unit (T-IC) may be mounted in the flexible touch circuit board 700 as an integrated circuit chip. The touch driver unit (T-IC) can output touch drive signals, which are provided to the touch electrodes of the touch sensing layer 300 via the touch terminal portion (TCD) and the touch pad portion (TPAD) of the flexible touch circuit board 700. Furthermore, the touch driver unit (T-IC) can also receive touch sensing signals from the touch sensing layer 300 and process these signals to generate touch information such as whether a touch has occurred and the touch position. In several embodiments, the touch driver unit (T-IC) may overlap with the display area (DA), but this is not a limitation.

[0089] The following also refers to questions 4 to 5. Figure 13 This section provides a more detailed explanation of the Display Panel (DP).

[0090] Figure 4 This is a schematic plan view of a display panel included in a display device according to an embodiment, and a plan view of a portion of a flexible circuit board coupled to the display panel. Figure 5 for Figure 4 An exemplary equivalent circuit diagram of the pixels shown. Figure 6 for Figure 4 The image shown is a schematic cross-sectional view of the pixels. Figure 7 For along Figure 4 A rough cross-sectional view taken from X5-X5′. Figure 8 To enlarge Figure 4 The floor plan of section Q1, Figure 9 For along Figure 8 A cross-sectional view taken from X7-X7′. Figure 10 For along Figure 8 The cross-sectional view taken from X9-X9′. Figure 11 For along Figure 8 The cross-sectional view taken from X11-X11′. Figure 12 To show Figure 4 The diagram shows the alignment between the seventh pad and the seventh terminal. Figure 13 To show in Figure 8 A diagram showing the approximate movement path of static electricity flowing in from the outside in the structure shown.

[0091] Reference Figures 4 to 13 As mentioned above, the display panel DP includes the display area DA and the non-display area NDA surrounding the display area DA.

[0092] like Figure 4 As shown, in the display area DA, multiple scan lines GL, data lines DL, power lines PL, and multiple pixels PX can be located on the first substrate 110.

[0093] Furthermore, in the non-display area NDA, the pad portion PAD, the drive circuit GDC, the common voltage supply line ESL, the drive voltage supply line EDL, the connecting lines 11, 12, 13, 14, 15, 16, and the seal S surrounding the display area DA can be located on the first substrate 110.

[0094] The scan line GL is connected to the corresponding pixel PX among multiple pixels PX, thereby transmitting scan signals to the pixel PX.

[0095] Data lines DL are connected to corresponding pixels PX among multiple pixels PX, thereby transmitting data signals to the pixels PX.

[0096] The power line PL is connected to multiple pixels PX, thereby transmitting drive voltage to the pixels PX.

[0097] In several embodiments, the scan lines GL may extend along a second direction y, and the data lines DL may extend along a first direction x. In several embodiments, the power line PL may extend along the same first direction x as the data line DL, but is not limited thereto.

[0098] Figure 5 The diagram shows a scan line (GL), a data line (DL), a power line (PL), and pixels (PX) connected to these. The structure of the pixel PX is not limited to... Figure 5 It can be adapted and implemented.

[0099] An organic light-emitting diode (OLED) can be a front-emitting diode or a back-emitting diode. A pixel PX is a pixel driving circuit used to drive the OLED, including a first transistor T1 (or a switching transistor), a second transistor T2 (or a driving transistor), and a capacitor Cst. A first power supply voltage ELVDD is provided to the second transistor T2, and a second power supply voltage ELVSS is provided to the OLED. The second power supply voltage ELVSS can be a voltage lower than the first power supply voltage ELVDD.

[0100] The first transistor T1, in response to a scan signal applied to scan line GL, outputs a data signal applied to data line DL. The capacitor Cst is charged to a voltage corresponding to the data signal received from the first transistor T1. The second transistor T2 is connected to the organic light-emitting element (OLED). The second transistor T2 controls the driving current flowing through the OLED based on the amount of charge stored in capacitor Cst.

[0101] The equivalent circuit is only one embodiment, and this disclosure is not limited thereto. Pixel PX may further include multiple transistors and may also include a greater number of capacitors. The organic light-emitting element (OLED) may be connected between the power line PL and the second transistor T2.

[0102] Figure 6 It shows the corresponding Figure 5 A partial cross-section of the display panel DP of the equivalent circuit shown.

[0103] A buffer film BFL may be disposed on the first substrate 110.

[0104] A semiconductor pattern OSP1 (hereinafter referred to as the first semiconductor pattern) of a first transistor T1 and a semiconductor pattern OSP2 (hereinafter referred to as the second semiconductor pattern) of a second transistor T2 can be disposed on the buffer film BFL. The first semiconductor pattern OSP1 and the second semiconductor pattern OSP2 can be selected from amorphous silicon, polycrystalline silicon, and metal-oxide-semiconductor (MODS). In several embodiments, one of the first semiconductor pattern OSP1 and the second semiconductor pattern OSP2 can be made of polycrystalline silicon, and the other of the first semiconductor pattern OSP1 and the second semiconductor pattern OSP2 can also be made of MODS.

[0105] A first intermediate inorganic film 111 is disposed on the first semiconductor pattern OSP1 and the second semiconductor pattern OSP2. A control electrode GE1 (hereinafter referred to as the first control electrode) of the first transistor T1 and a control electrode GE2 (hereinafter referred to as the second control electrode) of the second transistor T2 are disposed on the first intermediate inorganic film 111. When the first control electrode GE1 and the second control electrode GE2 are located in the same layer, the first control electrode GE1 and the second control electrode GE2 can be connected to the scan line GL (refer to the reference layer). Figure 4 It can be manufactured using the same photolithography process. However, it is not limited to this; the first control electrode GE1 and the second control electrode GE2 can also be located on different layers. In this case, only one of the first control electrode GE1 and the second control electrode GE2 can also be manufactured using the same photolithography process as the scan line GL (see reference). Figure 4 It is manufactured using the same photolithography process.

[0106] A second intermediate inorganic film 112 is disposed on the first intermediate inorganic film 111 to cover the first control electrode GE1 and the second control electrode GE2. The input electrode DE1 (hereinafter referred to as the first input electrode) and the output electrode SE1 (first output electrode) of the first transistor T1, and the input electrode DE2 (hereinafter referred to as the second input electrode) and the output electrode SE2 (hereinafter referred to as the second output electrode) of the second transistor T2 are disposed on the second intermediate inorganic film 112.

[0107] The first input electrode DE1 and the first output electrode SE1 are respectively connected to the first semiconductor pattern OSP1 through a first through-hole CH1 and a second through-hole CH2 penetrating the first intermediate inorganic film 111 and the second intermediate inorganic film 112. The second input electrode DE2 and the second output electrode SE2 are respectively connected to the second semiconductor pattern OSP2 through a third through-hole CH3 and a fourth through-hole CH4 penetrating the first intermediate inorganic film 111 and the second intermediate inorganic film 112. On the other hand, in another embodiment of this disclosure, a portion of the first transistor T1 and the second transistor T2 can be implemented as a bottom-gate structure.

[0108] An intermediate organic film 113 is disposed on the second intermediate inorganic film 112 to cover the first input electrode DE1, the second input electrode DE2, the first output electrode SE1, and the second output electrode SE2. The intermediate organic film 113 can be provided with a flat surface.

[0109] The pixel definition film (PDL) and the organic light-emitting element (OLED) can be located on the intermediate organic film 113. The PDL may include organic material. A first electrode AE ​​is disposed on the intermediate organic film 113. The first electrode AE ​​is connected to the second output electrode SE2 through a fifth through-hole CH5 penetrating the intermediate organic film 113. An opening OPN is defined in the PDL. The opening OPN of the PDL exposes at least a portion of the first electrode AE. In one embodiment of this disclosure, the PDL may be omitted.

[0110] Pixels PX can be arranged in the display area DA. The display area DA includes a light-emitting area PXA and a non-light-emitting area NPXA adjacent to the light-emitting area PXA. The non-light-emitting area NPXA may surround the light-emitting area PXA. In this embodiment, the light-emitting area PXA is defined as a portion of the area corresponding to the first electrode AE ​​exposed by the opening OPN.

[0111] In one embodiment of this disclosure, the light-emitting region PXA may overlap with at least one of the first transistor T1 and the second transistor T2. The opening OPN may be wider, and the first electrode AE ​​and the light-emitting layer EML (described later) may also be wider.

[0112] Hole control layers (HCLs) can be arranged together in the luminescent region PXA and the non-luminescent region NPXA. Although not illustrated separately, the common layers of the hole control layers (HCLs) can be formed together in pixel PX (see reference). Figure 3 ).

[0113] An emissive layer (EML) is disposed on the hole control layer (HCL). The EML can be disposed in the region corresponding to the opening (OPN). That is, the EML can be formed separately in each pixel (PX). The EML can include organic and / or inorganic materials. The EML can generate a predetermined colored light.

[0114] This embodiment illustratively illustrates a patterned emissive layer EML, but emissive layers EML can be arranged together on pixel PX. In this case, the emissive layer EML can also generate white light. Furthermore, the emissive layer EML can also have a multi-layer structure called tandem.

[0115] An electronic control layer (ECL) is disposed on the emissive layer (EML). Although not illustrated separately, the ECL can be formed together with the pixel PX (see reference). Figure 4 A second electrode CE is arranged on the electronic control layer ECL. The second electrode CE is also arranged on the pixel PX.

[0116] The second substrate 210 may be located on the second electrode CE, and the second electrode CE and the second substrate 210 may be spaced apart from each other. The touch sensing layer 300 described above may be located on the second substrate 210.

[0117] like Figure 4 As shown, with Figure 4 For reference, the drive circuit GDC can be located on the left or right side of the display area DA. The accompanying drawings show the drive circuit GDC positioned on both the left and right sides of the display area DA, but this is only one embodiment. In other embodiments, the drive circuit GDC can be located only on one side of the display area DA.

[0118] The driving circuit GDC may include a scan driving circuit. The driving circuit GDC may be connected to a scan line GL. The driving circuit GDC may generate multiple scan signals and sequentially output the multiple scan signals to multiple scan lines GL. In several embodiments, the driving circuit GDC may include multiple thin-film transistors formed using the same process as the driving circuit of the pixel PX, such as a low-temperature polycrystalline silicon (LTPS) process or a low-temperature polycrystalline oxide (LTPO) process.

[0119] In the display area DA, the driving circuit GDC can be located on the first substrate 110. In several embodiments, with Figure 4For this purpose, the drive circuit GDC can be located on the left or right side of the display area DA. The accompanying drawings show the drive circuit GDC positioned on both the left and right sides of the display area DA, but this is only one embodiment. In other embodiments, the drive circuit GDC can be located only on one side of the display area DA.

[0120] The drive voltage supply line EDL can be located in the non-display area NDA, and can also be located between the pad area PAD and the display area DA. The drive voltage supply line EDL can be connected to the power supply line PL, and the drive voltage supplied from the outside is provided to each pixel PX through the drive voltage supply line EDL and the power supply line PL.

[0121] A common voltage supply line ESL is disposed in the non-display area NDA to provide a common voltage to the second electrode CE of the organic light-emitting element OLED of pixel PX. In several embodiments, the common voltage supply line ESL is a loop shape open on one side, extending along the edge Ed of the first substrate 110 except for the pad portion PAD.

[0122] In several embodiments, at least a portion of the common voltage supply line ESL may overlap with the seal S. Figure 4 The diagram shows the common voltage supply line ESL completely overlapping with the seal S, but this is only one embodiment. At least a portion of the common voltage supply line ESL may not overlap with the seal S.

[0123] In several embodiments, the common voltage supply line ESL and the drive voltage supply line EDL may be located on the same layer and made of the same material. In several embodiments, the common voltage supply line ESL and the drive voltage supply line EDL may be made of the same material as the first input electrode DE1 and the first output electrode SE1, and may be located on the same layer.

[0124] The pad portion PAD can be arranged in the non-display area NDA, and can be located on the opposite side of the display area DA across the drive voltage supply line EDL.

[0125] The pad portion PAD may include a first pad PD1, a second pad PD2, a third pad PD3, a fourth pad PD4, a fifth pad PD5, a sixth pad PD6, and a seventh pad PD7.

[0126] The first pad PD1 is electrically connected to the data line DL. The data signal provided from the driver unit D-IC is provided to the pixel PX via the first pad PD1 and the data line DL. In several embodiments, multiple first pads PD1 may be arranged along the second direction y.

[0127] Along the second direction y, the second pad PD2, the third pad PD3, the fourth pad PD4, the fifth pad PD5, the sixth pad PD6, and the seventh pad PD7 can be located on one side of the first pad PD1 (e.g., to the left of the first pad, as shown in the attached figure). The attached figure shows the second pad PD2, the third pad PD3, the fourth pad PD4, the fifth pad PD5, the sixth pad PD6, and the seventh pad PD7 arranged sequentially along the second direction y, but is not limited to this arrangement. Furthermore, the arrangement order of the second pad PD2, the third pad PD3, the fourth pad PD4, the fifth pad PD5, the sixth pad PD6, and the seventh pad PD7 can vary in various ways.

[0128] In several embodiments, as shown in the figure, the second pad PD2, the third pad PD3, the fourth pad PD4, the fifth pad PD5, the sixth pad PD6, and the seventh pad PD7 may also be arranged on the other side of the first pad PD1 (e.g., on the right side as shown in the figure).

[0129] The second pad PD2 is electrically connected to the drive voltage supply line EDL. The drive voltage provided from the outside is supplied to the pixel PX via the flexible circuit board 500, the second pad PD2, the drive voltage supply line EDL, and the power line PL.

[0130] The third pad PD3 is electrically connected to the drive circuit GDC. Control signals (e.g., vertical synchronization signals, horizontal synchronization signals, and clock signals) generated by external circuits connected to the flexible circuit board 500 are provided to the drive circuit GDC via the flexible circuit board 500 and the third pad PD3.

[0131] The fourth pad PD4 is electrically connected to the common voltage supply line ESL. An externally supplied driving voltage is provided to the pixel PX via the flexible circuit board 500, the fourth pad PD4, and the common voltage supply line ESL. In several embodiments, the fourth pad PD4 may be located on one side of the second pad PD2 along the second direction y, but is not limited thereto.

[0132] The fifth pad PD5 can be a dummy pad. The fifth pad PD5 can be combined with the fifth terminal CD5 of the flexible circuit board 500 described later, which can improve the bonding force between the flexible circuit board 500 and the display panel DP.

[0133] In the second direction y, the fifth pad PD5 is located relatively adjacent to the edge Ed of the display panel DP compared to the first pad PD1, the second pad PD2, the third pad PD3 and the fourth pad PD4.

[0134] In several embodiments, the fifth pad PD5 can be electrically connected to the common voltage supply line ESL.

[0135] The sixth pad, PD6, can be an indentation pad used for indentation inspection.

[0136] In several embodiments, the sixth pad PD6 may include a light-transmitting portion OP. That is, the sixth pad PD6 may be composed of the light-transmitting portion OP and a metal surrounding the light-transmitting portion OP.

[0137] like Figure 7 As shown, the anisotropic conductive film AD1, which integrates the flexible circuit board 500 with the display panel DP, includes an insulating layer BR and a plurality of conductive balls CB located within the insulating layer BR. The conductive balls CB serve as dielectrics for the pad portion PAD and the terminal portion CD to be electrically connected. Therefore, the number of conductive balls CB located between each pad of the pad portion PAD and each terminal of the terminal portion CD is highly correlated with the reliability of the connection between the pad portion PAD and the terminal portion CD.

[0138] The sixth pad PD6 includes a light-transmitting portion OP. When the flexible circuit board 500 and the display panel DP are combined, and viewed from below the first substrate 110 towards the top, the number of conductive balls CB arranged between the sixth pad PD6 and the sixth terminal CD6 (described later) can be determined. Therefore, the number of conductive balls CB between each pad of the pad portion PAD and each terminal portion of the terminal portion CD can be estimated, and the reliability of the connection between the flexible circuit board 500 and the display panel DP can be confirmed.

[0139] In several embodiments, the sixth pad PD6 can also be electrically connected to the common voltage supply line ESL, just like the fifth pad PD5. Furthermore, the sixth pad PD6 can be located relatively adjacent to the edge of the display panel (e.g., the left edge as shown in the figures) compared to the fifth pad PD5.

[0140] The seventh pad PD7 can be a pad used for accurate alignment between the display panel DP and other structures, i.e., an alignment pad. For example, the seventh pad PD7 can be a pad used for alignment between the flexible circuit board 500 and the display panel DP, and the seventh pad PD7 can be aligned with the seventh terminal CD7 of the flexible circuit board 500.

[0141] In several embodiments, the seventh pad PD7 may be electrically connected to the common voltage supply line ESL. Furthermore, the seventh pad PD7 is located relatively adjacent to the edge of the display panel (e.g., the left edge as shown in the figures) compared to the sixth pad PD6.

[0142] In several embodiments, the seventh pad PD7 may include a first portion PD7a extending along the second direction y and a second portion PD7b connected to the first portion PD7a and extending along the first direction x. The first portion PD7a may be directly connected to the sixth pad PD6, and the seventh pad PD7 may be electrically connected to the common voltage supply line ESL via the sixth pad PD6.

[0143] In several embodiments, the first pad PD1, the second pad PD2, the third pad PD3, the fourth pad PD4, the fifth pad PD5, the sixth pad PD6, and the seventh pad PD7 may be made of the same material as the first input electrode DE1 and the first output electrode SE1, and may be located in the same layer.

[0144] The connecting lines 11, 12, 13, 14, 15, and 16 can be located in the non-display area NDA and include the first connecting line 11, the second connecting line 12, the third connecting line 13, the fourth connecting line 14, the fifth connecting line 15, and the sixth connecting line 16.

[0145] The first connecting line 11 can be connected to the data line DL and the first pad PD1, and the data line DL and the first pad PD1 can be electrically connected through the first connecting line 11.

[0146] The second connection line 12 can be connected to the drive voltage supply line EDL and the second pad PD2. The drive voltage supply line EDL and the second pad PD2 can be electrically connected with the second connection line 12 as the dielectric.

[0147] The third connection line 13 can be connected to the drive circuit GDC and the third pad PD3. The drive circuit GDC and the third pad PD3 can be electrically connected through the third connection line 13.

[0148] The fourth connection line 14 can be connected to the common voltage supply line ESL and the fourth pad PD4. The common voltage supply line ESL and the fourth pad PD4 can be electrically connected with the fourth connection line 14 as the dielectric.

[0149] The fifth connection line 15 can be connected to the common voltage supply line ESL and the fifth pad PD5. The common voltage supply line ESL and the fifth pad PD5 can be electrically connected with the fifth connection line 15 as the dielectric.

[0150] The sixth connection line 16 can be connected to the common voltage supply line ESL and the sixth pad PD6. The common voltage supply line ESL and the sixth pad PD6 can be electrically connected with the sixth connection line 16 as the dielectric.

[0151] In several embodiments, at least a portion of the connecting lines 11, 12, 13, 14, 15, and 16 may be made of the same material as the first input electrode DE1 and the first output electrode SE1, and may be located in the same layer. For example, the fourth connecting line 14, the fifth connecting line 15, and the sixth connecting line 16 may be made of the same material as the first input electrode DE1 and the first output electrode SE1, and may be located in the same layer as the first input electrode DE1 and the first output electrode SE1. Furthermore, the first connecting line 11, the second connecting line 12, and the third connecting line 13 may be located in the same layer as the scan line GL, and may be made of the same material as the scan line GL.

[0152] The flexible circuit board 500 includes a terminal portion CD that is bonded to the pad portion PAD of the display panel DP. The terminal portion CD may include a first terminal CD1, a second terminal CD2, a third terminal CD3, a fourth terminal CD4, a fifth terminal CD5, a sixth terminal CD6, and a seventh terminal CD7.

[0153] The first terminal CD1 can be connected to the first pad PD1 via an anisotropic conductive film AD1. The first terminal CD1 can also be connected to the driving unit (using the first terminal line 51 as a medium). Figure 2 It can be connected to the D-IC and can receive data signals from the D-IC of the driver unit.

[0154] The second terminal CD2 can be connected to the second pad PD2 via the anisotropic conductive film AD1. The second terminal CD2 can also be electrically connected to an external circuit via the second terminal line 52 to receive control signals.

[0155] The third terminal CD3 can be connected to the third pad PD3 via the anisotropic conductive film AD1. The third terminal CD3 can also be connected to an external circuit or external power supply via the third terminal line 53 to receive the driving voltage.

[0156] The fourth terminal CD4 can be connected to the fourth pad PD4 via the anisotropic conductive film AD1. The fourth terminal CD4 can also be connected to an external circuit or external power supply via the fourth terminal line 54 to receive a common voltage.

[0157] The fifth terminal CD5 can be connected to the fifth pad PD5 using an anisotropic conductive film AD1 as the dielectric. The fifth terminal CD5 can be connected to an external circuit or drive unit. Figure 2 The D-IC and other terminals are not connected. That is, the fifth terminal CD5 can be a dummy terminal. In order to improve the bonding strength, it can be bonded to the fifth pad PD5 and can be left unconnected to other terminal lines.

[0158] The sixth terminal CD6 can be connected to the sixth pad PD6 via the anisotropic conductive film AD1. Similar to the sixth pad PD6, the sixth terminal CD6 can be an indentation terminal for observing indentations or conductive balls. The sixth terminal CD6 may not be connected to any other terminal lines.

[0159] The seventh terminal CD7 can be connected to the seventh pad PD7 via an anisotropic conductive film AD1. The seventh terminal CD7 can also be an alignment terminal aligned with the seventh pad PD7.

[0160] The seventh terminal CD7 may include a first terminal portion CD7a extending along the second direction y, and a second terminal portion CD7b connected to the first terminal portion CD7a and extending along the first direction x but in the opposite direction to the second portion PD7b of the seventh pad PD7. The first terminal portion CD7a may be directly connected to the sixth terminal CD6. When the seventh terminal CD7 is aligned with the seventh pad PD7, as shown... Figure 12 As shown, the first terminal portion CD7a may overlap with the first portion PD7a, while the second terminal portion CD7b may not overlap with either the first portion PD7a or the second portion PD7b. In several embodiments, the shape formed when the seventh terminal CD7 is aligned with the seventh pad PD7 may be a cross shape.

[0161] In several embodiments, the seventh terminal CD7 may not be connected to any other terminal line.

[0162] Reference Figure 13 Compared to other signal pads that provide the voltage or signals required to drive the display panel, such as the fourth pad PD4, the fifth pad PD5 (as a dummy pad), the sixth pad PD6 (as an indentation pad), and the seventh pad PD7 (as an alignment pad) are located relatively adjacent to the edge side of the display panel. Therefore, compared to the fourth pad PD4, the fifth pad PD5, the sixth pad PD6, and the seventh pad PD7 are more likely to experience external static electricity (ES).

[0163] When static electricity (ES) flows into pads PD5, PD6, and PD7 from the outside, the incoming ES can move to surrounding signal pads, such as pad PD4, which may result in damage (or breakage) to signal lines such as the fourth connection line 14.

[0164] In this embodiment, when the fifth pad PD5, the sixth pad PD6, and the seventh pad PD7 are electrically connected to the common voltage supply line ESL, static electricity (ES) flowing into the fifth pad PD5, the sixth pad PD6, and the seventh pad PD7 from the outside can be dispersed to the common voltage supply line ESL. That is, the common voltage supply line ESL functions as an static electricity dispersion line to disperse static electricity (ES) flowing into the fifth pad PD5, the sixth pad PD6, and the seventh pad PD7. Therefore, damage to the signal pads or signal lines caused by static electricity (ES) flowing in from the outside can be prevented, and the reliability of the display device can be improved.

[0165] Figure 14 This is a schematic plan view of a touch-sensing layer included in a display device according to an embodiment. Figure 15 To enlarge Figure 14 The floor plan of section Q3. Figure 16 For along Figure 15 A cross-sectional view of the touch-sensing layer taken from X13-X13′. Figure 17 For along Figure 15 A cross-sectional view of the touch-sensing layer taken from X15-X15′. Figure 18 To enlarge Figure 14 The plan view of section Q5 also shows the approximate movement path of static electricity flowing in from the outside. Figure 19 For along Figure 18 A cross-sectional view of the touch-sensing layer taken from X17-X17′. Figure 20 To show Figure 18 A plan view of a modified example. Figure 21 To show Figure 18 Another variation of the plan view.

[0166] Reference Figures 14 to 21 As described above, the touch sensing layer 300 is located on the second substrate 210.

[0167] The touch sensing layer 300 defines a sensing area SA and a surrounding area NSA. The sensing area SA is the area that senses touch input within the touch sensing layer 300, while the surrounding area NSA is the area that cannot sense touch input.

[0168] The sensing area SA and the surrounding area NSA can respectively correspond to Figures 1 to 4 The display device 1 shown has a display area DA and a non-display area NDA. In several embodiments, the sensing area SA and the display area DA may be substantially the same.

[0169] In the sensing area SA, the first electrode portion 310 and the second electrode portion 330 may be located on the second substrate 210.

[0170] In addition, in the surrounding NSA area, the touch pad TPAD, touch signal lines 351, 353, 355 and electrostatic discharge blocking part 370 can be located on the second substrate 210.

[0171] The sensing area SA will be described in more detail below.

[0172] The first electrode portion 310 and the second electrode portion 330, which are insulated from the first electrode portion 310, can be located on the second substrate 210.

[0173] The first electrode portion 310 may extend along a first direction x. Multiple first electrode portions 310 may be arranged and may be spaced apart from each other along a second direction y.

[0174] The first electrode portion 310 may include a plurality of first touch electrodes 311 arranged along a first direction x and a first connection portion 313 electrically connecting the first touch electrodes 311 that are adjacent to each other along the first direction x. Hereinafter, in describing the embodiments, "connection" may be used to generally mean "connection" at the physical and / or electrical level.

[0175] In several embodiments, the planar shape of the first touch electrode 311 can be as follows: Figure 14 and Figure 15 The shape shown is a rhombus, but it is not limited to this shape. It can also be transformed into various shapes such as triangles, quadrilaterals, pentagons, circles, and bars.

[0176] The first touch electrode 311 may include a transparent conductive material. For example, the transparent conductive material may be a conductive polymer such as silver nanowires (AgNW), indium tin oxide (ITO), indium zinc oxide (IZO), antimony zinc oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin dioxide (SnO2), carbon nanotubes, graphene, or PEDOT. Alternatively, if light transmittance can be ensured, the first touch electrode 311 may include a conductive material such as a metal or an alloy of these metals. Examples of metals include gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), and platinum (Pt). In several embodiments, when the first touch electrode 311 is made of metal or an alloy of such metals, it may also employ a mesh structure to prevent user identification. When the first touch electrode 311 is constructed of a mesh structure, it can be arranged in a manner similar to... Figure 6 The luminescent regions of PXA do not overlap.

[0177] The first connection portion 313 can electrically connect adjacent first touch electrodes 311 along the first direction x to each other, and can contact the first touch electrodes 311. In several embodiments, the first connection portion 313 can be configured as a bridge-shaped connection pattern. In several embodiments, the first connection portion 313 can be located on a different layer than the layer where the first touch electrodes 311 are located.

[0178] The first connection portion 313 may include a conductive material. In several embodiments, the first connection portion 313 may include a metal or an alloy of these metals, such as gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or platinum (Pt). In several embodiments, the first connection portion 313 may be configured as a single-layer structure or as a multi-layer structure. For example, the first connection portion 313 may also have a three-layer structure of titanium / aluminum / titanium.

[0179] The accompanying drawings show a first connection portion 313 arranged between adjacent first touch electrodes 311 along the first direction x, but the number of first connection portions 313 can vary. For example, unlike that shown in the drawings, there may be more than two first connection portions 313 arranged between adjacent first touch electrodes 311 along the first direction x.

[0180] In several embodiments, the insulating layer 320 may be located between the first touch electrode 311 and the first connection portion 313. That is, the first connection portion 313 may be located on the second substrate 210, the insulating layer 320 may be located on the first connection portion 313, and the first touch electrode 311 may be located on the insulating layer 320. The first connection portion 313 and the first touch electrode 311 may be connected to each other through a first contact hole CNT1 formed on the insulating layer 320.

[0181] The insulating layer 320 may include an insulating material. In several embodiments, the insulating material may be an inorganic or organic insulating material. The inorganic insulating material may include at least one selected from alumina, titanium dioxide, silicon dioxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic insulating material may include at least one selected from acrylic resins, methacrylic resins, polyisoprene, ethylene resins, epoxy resins, polyurethane resins, cellulose resins, siloxane resins, polyimide resins, polyamide resins, and dinaphthalene-containing resins.

[0182] As described above, the second electrode portion 330 can extend along the second direction y. Multiple second electrode portions 330 can be arranged and can be spaced apart from each other along the first direction x.

[0183] The second electrode portion 330 may include a plurality of second touch electrodes 331 arranged along the second direction y and a second connection portion 333 electrically connecting the second touch electrodes 331 that are adjacent to each other along the second direction y.

[0184] In several embodiments, the second touch electrode 331 may be located on the same layer as the first touch electrode 311. For example, the second touch electrode 331 may be located on the insulating layer 320. The second touch electrode 331 may be rhomboid, but is not limited to this, and may also be deformed into various shapes such as triangle, quadrilateral, pentagon, circle, bar, etc.

[0185] The second touch electrode 331 may include a conductive material, and in several embodiments, it may include the same material as the first touch electrode 311.

[0186] The second connection portion 333 can electrically connect adjacent second touch electrodes 331 along the second direction y to each other, and can contact the second touch electrodes 331. In several embodiments, the second connection portion 333 can be located on the same layer as the first touch electrode 311 and the second touch electrode 331. For example, the second connection portion 333 can be located on the insulating layer 320 in the same way as the first touch electrode 311 and the second touch electrode 331.

[0187] In several embodiments, the second connection portion 333 may be insulated from the first connection portion 313 or the first touch electrode 311 by means of an insulating layer 320. The accompanying drawings show the second connection portion 333 overlapping with the first connection portion 313, but this is only one embodiment. In another embodiment, the second connection portion 333 may not overlap with the first connection portion 313 but may overlap with the first touch electrode 311.

[0188] The second connection portion 333 may include the same material as the first touch electrode 311 and the second touch electrode 331.

[0189] In several embodiments, the first electrode portion 310 may be a driving electrode portion that receives a driving signal for detecting a touch position, and the second electrode portion 330 may be a sensing electrode portion that outputs a sensing signal in response to the driving signal.

[0190] The following is an explanation of the NSA in the surrounding area.

[0191] Touch signal lines 351, 353, 355 and touch pad portion TPAD can be located on the peripheral area (NSA) of the second substrate 210.

[0192] For example, touch signal lines 351, 353, and 355 may include a first touch signal line 351 electrically connected to each of the first electrode portions 310, a second touch signal line 353 electrically connected to each of the second electrode portions 330, and a third touch signal line 355 electrically connected to each of the second electrode portions 330.

[0193] In several embodiments, such as Figure 14 As shown, one end of the first touch signal line 351 may be connected to one end of the first electrode portion 310, and the other end of the first touch signal line 351 may be connected to the touch pad portion TPAD. Alternatively, one end of the second touch signal line 353 may be connected to the other end of the first electrode portion 310, and the other end of the second touch signal line 353 may be connected to the touch pad portion TPAD.

[0194] That is, the touch signal line connected to the first electrode portion 310 can also be configured as a dual-path structure, thereby improving the RC delay caused by the resistance of the first electrode portion 310, etc. In several embodiments, one end of the first electrode portion 310 may pass through the insulating layer 320 and be connected to the first touch signal line 351, and the other end of the first electrode portion 310 may pass through the insulating layer 320 and be connected to the second touch signal line 353.

[0195] Alternatively, one end of the third touch signal line 355 may be electrically connected to the second electrode portion 330, and the other end of the third touch signal line 355 may be electrically connected to the touch pad portion TPAD. In several embodiments, one end of the second electrode portion 330 may penetrate the insulating layer 320 and be connected to the third touch signal line 355. For example, the second electrode portion 330 may be connected to the third touch signal line 355 through a second contact hole CNT2 formed in the insulating layer 320.

[0196] In several embodiments, the first touch signal line 351, the second touch signal line 353, and the third touch signal line 355 may be made of the same material as the first connection portion 313 and located in the same layer as the first connection portion 313. For example, the first touch signal line 351, the second touch signal line 353, and the third touch signal line 355 may be located between the second substrate 210 and the insulating layer 320.

[0197] The touch pad section TPAD can be arranged on the second substrate 210 in the peripheral area NSA and connected to touch signal lines 351, 353, and 355. The touch pad section TPAD may include touch pads (not shown in the figure) connected to each touch signal line 351, 353, and 355.

[0198] As described above, the touch pad portion TPAD can be connected to the touch terminal portion TCD of the touch flexible circuit board 700 using an anisotropic conductive film AD2 or the like as a medium.

[0199] In the surrounding NSA region, the electrostatic discharge blocking portion 370 may be located on the second substrate 210. The electrostatic discharge blocking portion 370 may be spaced apart from the touch signal lines 351, 353, and 355 and located relatively adjacent to the edge of the second substrate 210 compared to the touch signal lines 351, 353, and 355. In other words, the touch signal lines 351, 353, and 355 may be located between the sensing area SA and the electrostatic discharge blocking portion 370.

[0200] In several embodiments, the electrostatic discharge barrier 370 can generally be configured as a loop shape with one side open, which can extend along the edge of the second substrate 210 other than the touch pad portion TPAD and surround the outside of the touch signal lines 351, 353, 355.

[0201] Since the electrostatic discharge blocking part 370 is located outside the touch signal lines 351, 353, and 355, it can block the flow of electrostatic discharge (ES) from the outside into the touch signal lines 351, 353, and 355, thereby preventing damage to the touch signal lines 351, 353, and 355 caused by electrostatic discharge (ES).

[0202] The electrostatic discharge blocking portion 370 includes a conductive material. In several embodiments, the electrostatic discharge blocking portion 370 may be made of the same material as the first connecting portion 313, and located on the same layer as the first connecting portion 313, similar to the first touch signal line 351, the second touch signal line 353, and the third touch signal line 355. Furthermore, in several embodiments, the electrostatic discharge blocking portion 370 may not overlap with the first touch signal line 351, the second touch signal line 353, and the third touch signal line 355 on a plane.

[0203] In several embodiments, the electrostatic blocking part 370 may be in a state where no additional signal or voltage is applied, i.e., a floating state.

[0204] The electrostatic discharge blocking portion 370 may include a plurality of conductive patterns 371 spaced apart from each other. In several embodiments, the conductive patterns 371 may be arranged spaced apart from each other along a first direction x and a second direction y.

[0205] In several embodiments, the width W1 of the conductive pattern 371 in the first direction x and the width W2 in the second direction y can be 25 μm to 35 μm, respectively, and the spacing D between the conductive patterns 371 can be 3 μm to 5 μm.

[0206] Since the electrostatic discharge blocking part 370 includes a plurality of conductive patterns 371 spaced apart from each other, even if static electricity ES flows in from the outside, the possibility that the static electricity ES will be discharged or explode in one of the plurality of conductive patterns 371 before flowing into the touch signal lines 351, 353, 355 is increased. As a result, damage to the touch signal lines 351, 353, 355 caused by static electricity ES can be prevented.

[0207] In several embodiments, the planar shape of each conductive pattern 371 can be as follows: Figure 18 The quadrilateral shown is not limited to this; it can also be transformed into polygonal shapes such as triangles, pentagons, and hexagons.

[0208] In addition, the shape of the conductive pattern 371 can be varied.

[0209] like Figure 20 As shown, the conductive pattern 371a can also be deformed into a circle or an ellipse. Alternatively, as... Figure 21 As shown, the conductive pattern 371b can also be configured as a strip shape.

[0210] While the foregoing description has focused on embodiments of the present disclosure, it is merely illustrative and not intended to limit the scope of the disclosure. Those skilled in the art to which this disclosure pertains will understand that various modifications and applications not illustrated above can be made without departing from the essential characteristics of the embodiments of the present disclosure. For example, the various constituent elements specifically shown in the embodiments of the present disclosure can be implemented in variations. Moreover, distinctions relating to such modifications and applications should be interpreted as being included within the scope of this disclosure.

Claims

1. A display device, wherein, include: The first substrate includes a display area and a non-display area surrounding the display area; A light-emitting element is located on the first substrate and in the display area; The display signal line is located on the first substrate and in the display area, extends along the first direction, and transmits signals to the light-emitting element; A common voltage supply line is located on the first substrate and in the non-display area, and provides a common voltage to the light-emitting element; The first pad is located on the first substrate and in the non-display area, and is electrically connected to the display signal line; An indentation pad is located on the first substrate and in the non-display area, and is electrically connected to the common voltage supply line; A driving voltage pad is located on the first substrate, in the non-display area, and electrically connected to the common voltage supply line; and A flexible circuit board is attached to the first substrate. The externally supplied driving voltage is provided to the light-emitting element via the flexible circuit board, the driving voltage pads, and the common voltage supply line. Along a second direction intersecting the first direction, the indentation pad is located relatively closer to the edge of the first substrate than the first pad and the drive voltage pad.

2. The display device according to claim 1, wherein, The indentation pad includes a light-transmitting portion and metal surrounding the light-transmitting portion.

3. The display device according to claim 1, wherein, The display device further includes alignment pads located on the first substrate and positioned relatively closer to the edge of the substrate than the indentation pads along the second direction. The alignment pad includes a first portion extending along the second direction and a second portion directly connected to the first portion and extending along the first direction.

4. The display device according to claim 3, wherein, The first portion of the alignment pad is directly connected to the indentation pad.

5. The display device according to claim 1, wherein, The display device further includes a dummy pad located on the first substrate and in the non-display area, the dummy pad being positioned between the first pad and the indentation pad along the second direction. The dummy pad is only electrically connected to the common voltage supply line.

6. The display device according to claim 1, wherein, The flexible circuit board includes terminals electrically connected to the first pad and indentation terminals electrically connected to the indentation pad.

7. The display device according to claim 6, wherein, The display device further includes a driving unit mounted on the flexible circuit board. The terminal is electrically connected to the drive unit. The indentation terminal and the drive unit are not electrically connected to each other.

8. The display device according to claim 7, wherein, The display device further includes alignment pads located on the first substrate, positioned relatively closer to the edge of the first substrate than the indentation pads along the second direction. The flexible circuit board also includes alignment terminals connected to the alignment pads. The alignment terminal includes a first terminal portion extending along the second direction and directly connected to the indentation pad, and a second terminal portion directly connected to the first terminal portion and extending along the first direction. The first terminal portion overlaps with the alignment pad. The second terminal portion does not overlap with the alignment pad.

9. The display device according to claim 6, wherein, A portion of the flexible circuit board is arranged to face the underside of the first board. The portion of the flexible circuit board is bonded to the underside of the first substrate using a bonding component comprising a conductive material as a medium.

10. The display device according to claim 9, wherein, The display device further includes a driving unit, which is mounted on the flexible circuit board and located on the lower side of the first board. The driving unit overlaps with the display area.

11. The display device according to claim 1, wherein, The display device further includes: A second substrate, located on the first substrate, includes a sensing area and a peripheral area surrounding the sensing area; and The touch sensing layer is located on the second substrate. The touch sensing layer includes: a touch electrode portion located in the sensing area, a touch signal line located in the peripheral area and connected to the touch electrode portion, and an electrostatic blocking portion located in the peripheral area and spaced apart from the touch signal line.

12. The display device according to claim 11, wherein, The touch signal line is located between the sensing area and the electrostatic blocking part.

13. The display device according to claim 12, wherein, The electrostatic blocking section includes multiple conductive patterns spaced apart from each other.

14. The display device according to claim 11, wherein, The touch signal line and the electrostatic blocking part are made of the same material and are located directly above the same layer.

15. The display device according to claim 11, wherein, The touch electrode portion includes: a first touch electrode arranged along the first direction and electrically connected to each other along the first direction; and a second touch electrode arranged along the second direction and electrically connected to each other along the second direction. The first touch electrode and the second touch electrode are located on the same layer. The electrostatic blocking portion is located in a different layer than the first touch electrode and the second touch electrode.

16. The display device according to claim 15, wherein, The touch-sensing layer also includes an insulating layer located on the electrostatic blocking portion. The first touch electrode and the second touch electrode are located on the insulating layer.

17. The display device according to claim 15, wherein, The touch electrode portion further includes: a first connecting portion for connecting two adjacent first touch electrodes along the first direction to each other; and a second connecting portion for connecting two adjacent second touch electrodes along the second direction to each other. The first connection portion is located on a different layer than the electrostatic blocking portion. The second connection portion is located on the same layer as the electrostatic blocking portion.

18. A display device, wherein, include: A substrate, including a display area and a non-display area surrounding the display area; A light-emitting element is located on the substrate and in the display area; The display signal line is located on the substrate and in the display area, extends along a first direction, and transmits signals to the light-emitting element; A common voltage supply line is located on the substrate and in the non-display area, and provides a common voltage to the light-emitting element; The first pad is located on the substrate and in the non-display area, and is electrically connected to the display signal line; Alignment pads are located on the substrate and in the non-display area, and are electrically connected to the common voltage supply line; A driving voltage pad is located on the substrate, in the non-display area, and electrically connected to the common voltage supply line; and Flexible circuit board, combined with the substrate, The externally supplied driving voltage is provided to the light-emitting element via the flexible circuit board, the driving voltage pads, and the common voltage supply line. The alignment pad includes a first portion extending along a second direction intersecting the first direction and a second portion directly connected to the first portion and extending along the first direction. The alignment pad is located closer to the edge of the substrate than the first pad and the driving voltage pad along the second direction.

19. The display device according to claim 18, wherein, The display device further includes: A driving circuit, located on the substrate and in the non-display area, lies along the second direction between the common voltage supply line and the display area; and The second pad is located on the substrate, in the non-display area, and lies between the first pad and the alignment pad along the second direction. The second pad is electrically connected to the drive circuit.

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