A 1553B open potting and curing device and potting and curing method

Abstract

The present invention discloses a 1553B open potting and curing device, which is used for potting and curing the coupler of a 1553B data bus product. The invention solves the problem in the prior art that the closed integral heating potting and curing shrinks the logo, and the non-heating potting and curing causes the glue separation. The open potting and curing device includes a base, the lower surface of the base is provided with a plurality of grooves arranged in parallel along the longitudinal direction, the upper surface of the base is provided with a plurality of screw holes, a stud is installed in each screw hole and fixed with a hexagonal nut, a pressure plate is sleeved outside the stud, and a quick-tightening nut is installed on the top of the stud for locking and fixing the pressure plate. The present invention also provides a potting and curing method. The potting and curing device and potting and curing method of the present invention can effectively combine the heating method of the curing furnace to locally heat the coupler in the 1553B data bus, avoid heating of the wires, logos, etc., and ensure that the 1553B data bus products whose logos do not require shrinkage can be efficiently processed and assembled.

Description

Technical Field

[0001] The invention belongs to the technical field of 1553B potting and curing, and in particular provides a 1553B open potting and curing device and a potting and curing method. Background Art

[0002] In order to achieve local heating, potting and curing of the couplers between the 1553B data buses and solve the glue-liquid separation phenomenon during the potting and curing of the 1553B data bus (natural curing for 24 hours at room temperature), after fully considering the above characteristics, in the prior art, the 1553B data bus products generally adopt a closed overall heating potting and curing method during assembly and processing, and there will be the following defects during potting and curing: the logo that does not require shrinkage of the 1553B data bus product cannot be guaranteed, and the logo will be tightened on the cable as the 1553B data bus product is heated as a whole, which cannot meet the actual production requirements; if natural curing is adopted at room temperature for 24 hours, the potting glue will produce glue-liquid separation, and part of the liquid after separation is not solidified, and the reliability of the product cannot be guaranteed. Summary of the invention

[0003] In order to solve the above technical problems, the purpose of the present invention is to provide an open potting and curing device and a curing potting method that can realize local heating and open potting and curing on the 1553B data bus, which can be effectively combined with the heating of the curing furnace, can ensure that the labels on the product that do not require shrinkage are intact, and ensure that the glue potted in the 1553B data bus coupler can be efficiently cured.

[0004] In order to achieve the above-mentioned purpose, the present invention adopts the following technical scheme: a 1553B open potting and curing device, which includes a base, the lower surface of the base is provided with a plurality of grooves arranged in parallel along the longitudinal direction, the upper surface of the base is provided with a plurality of screw holes, a stud is installed in each screw hole and fixed with a hexagonal nut, a pressure plate is sleeved outside the stud, the coupler to be heated is placed under the pressure plate, and a quick-tightening nut is installed at the top of the stud for locking and fixing the pressure plate.

[0005] Furthermore, the base is a rectangular plate and is made of aluminum alloy material.

[0006] Furthermore, the groove is in the shape of an elongated strip.

[0007] Furthermore, the stud is made of 45 steel material.

[0008] Furthermore, the pressing plate and the quick-tightening nut are made of H62 material.

[0009] Furthermore, the pressing plate has a central hole for the stud to pass through, and the diameter of the central hole is larger than the outer diameter of the stud.

[0010] Furthermore, a circular through hole inclined 5° along the axial direction is vertically penetrated through the threaded hole inside the quick-tightening nut.

[0011] The present invention further provides a potting and curing method using the above-mentioned 1553B open potting and curing device, which specifically comprises the following steps:

[0012] Step 1: Assembling the potting and curing device: screw the bottom end of the stud into the screw hole on the upper surface of the base and fix it with a hexagonal nut, then insert the pressure plate from the upper end of the stud, place the coupler to be heated between the pressure plate and the upper surface of the base, and finally tighten the quick-tightening nut at the top of the stud to fix it. At this time, the installation and fixing steps of the coupler are completed;

[0013] Step 2: Potting glue: Start to evenly inject potting glue into the coupler and wait for heating treatment;

[0014] Step 3: Potting and curing: Turn on the curing oven switch and set the temperature to 70°C. After the temperature rises to 70°C, connect the base to the curing oven through the groove. The upper surface of the curing oven has a groove structure that matches the groove. After connection, set the curing oven to a timer of 1 hour. After heating for 1 hour, the equipment will sound an alarm and automatically turn off the power. At this time, the curing of the 1553B data bus coupler potting glue is completed.

[0015] Compared with the prior art, the present invention has the following beneficial effects: the potting and curing device of the present invention can effectively combine the curing furnace heating method to locally heat the coupler in the 1553B data bus to prevent the wires, labels, etc. from being heated. The open potting and curing device and potting and curing method of the present invention solve the problem of shrinking the label by closed overall heating, ensure that the 1553B data bus product that does not require shrinking of the label can be efficiently processed and assembled, and solve the problem of glue separation caused by non-heating potting and curing methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic structural diagram of the potting and curing device of the present invention;

[0017] Figure 2 It is a schematic diagram of the structure of the base;

[0018] Figure 3 It is a schematic diagram of the structure of the stud;

[0019] Figure 4 It is a schematic diagram of the structure of a hexagonal nut;

[0020] Figure 5 It is a structural schematic diagram of the pressure plate;

[0021] Figure 6 It is a structural diagram of a quick-tightening nut;

[0022] Figure 7 It is a cross-sectional view of the quick-tightening nut;

[0023] Figure 8 is a schematic diagram of the curing furnace structure;

[0024] Fig. 9 It is a schematic diagram of the installation of the potting and curing device and the curing furnace of the present invention;

[0025] Fig.10 It is a schematic diagram of the installation structure of the coupler and the potting and curing device of the present invention;

[0026] Fig.11 It is an enlarged structural diagram of the coupler installation part;

[0027] In the figure: 1-base; 1-1-groove; 1-2-screw hole; 2-stud; 3-hexagonal nut; 4-pressing plate; 4-1-center hole; 5-quick-tightening nut; 5-1-threaded hole; 5-2-circular through hole; 6-coupler; 6-1-potting hole; 6-2-exhaust hole. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] Reference Figures 1 to 9 As shown, a 1553B open potting and curing device includes a base 1 for tightly fitting with a curing furnace, a lower surface of the base 1 is provided with a plurality of grooves 1-1 arranged in parallel along the longitudinal direction, an upper surface of the base 1 is provided with a plurality of screw holes 1-2, a stud 2 is installed in each screw hole 1-2 and is fixed with a hexagonal nut 3, a pressing plate 4 is sleeved outside the stud 2, a coupler to be heated is placed under the pressing plate 4, a quick-tightening nut 5 is installed at the top of the stud 2 for locking and fixing the pressing plate 4.

[0030] A circular through hole 5-2 with an axial inclination of 5° is vertically penetrated in the threaded hole 5-1 inside the quick-tightening nut 5. The threaded hole 5-1 is an M6 threaded hole and matches the stud 2. The diameter of the circular through hole 5-2 is Φ6 mm. The design of the circular through hole 5-2 can reduce the rotation time in the stud 2, facilitate installation, and improve installation efficiency.

[0031] The base 1 is a rectangular plate made of aluminum alloy.

[0032] The groove 1-1 is in the shape of a long strip.

[0033] The stud 2 is made of 45 steel material. The stud 2 is a cylinder with external threads, and the external threads are matched with the screw holes 1-2 on the upper end of the base 1.

[0034] The pressing plate 4 and the quick-tightening nut 5 are made of H62 material.

[0035] The pressing plate 4 is a rectangular thin sheet structure, and has a central hole 4 - 1 on the pressing plate 4 for the stud 2 to pass through, and the diameter of the central hole 4 - 1 is larger than the outer diameter of the stud 2 .

[0036] Reference Figure 10-11 The present invention further provides a potting and curing method using the above-mentioned 1553B open potting and curing device, which specifically comprises the following steps:

[0037] Step 1, assembly of the potting and curing device: screw the bottom end of the stud 2 into the screw hole 1-2 on the upper surface of the base 1, and fix it with the hexagonal nut 3, then insert the pressing plate 4 from the upper end of the stud 2, place the coupler to be heated between the pressing plate 4 and the upper surface of the base 1, two couplers can be placed under each pressing plate 4, and the coupler is placed horizontally on the upper surface of the base 1, and finally tighten the quick-tightening nut 5 at the top of the stud 2 to fix it. At this time, the installation and fixing steps of the coupler are completed;

[0038] Step 2, potting glue: Start to evenly inject potting glue into the coupler and wait for heating treatment; specifically, evenly pour the potting glue into the potting hole 6-1, and exhaust gas from the exhaust hole 6-2 to make the potting uniform;

[0039] Step 3: Potting and curing: Turn on the curing oven switch and set the temperature to 70°C. After the temperature rises to 70°C, connect the base 1 to the curing oven through the groove 1-1. The upper surface of the curing oven has a groove structure that matches the groove 1-1, and the two can fit closely together. After connection, set the curing oven to a timer of 1 hour. After heating for 1 hour, the equipment will sound an alarm and automatically turn off the power. At this time, the curing task of the 1553B data bus coupler potting glue is completed.

[0040] The 1553B data bus coupler uses the 1553B open potting and curing device, which can effectively combine with the curing oven to pot and cure the coupler, accelerating the curing of the potting glue. It not only solves the problem of closed heating to cure the logo, but also solves the problem of glue separation caused by non-heating curing, thereby improving the production efficiency of the 1553B data bus and ensuring the reliability of product performance.

[0041] The principles and implementation methods of the present invention are described in this article using specific examples. The description of the above embodiments is only used to help understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. A potting and curing method for a 1553B open potting and curing device, the 1553B open potting and curing device comprising a base, a lower surface of the base is provided with a plurality of grooves arranged in parallel in the longitudinal direction, an upper surface of the base is provided with a plurality of screw holes, a stud is installed in each screw hole and fixed with a hexagonal nut, a pressing plate is sleeved outside the stud, a coupler to be heated is placed below the pressing plate, a quick-tightening nut is installed at the top of the stud to lock and fix the pressing plate; The potting and curing method of the 1553B open potting and curing device specifically comprises the following steps: Step 1: Assembling the potting and curing device: screw the bottom end of the stud into the screw hole on the upper surface of the base and fix it with a hexagonal nut, then insert the pressure plate from the upper end of the stud, place the coupler to be heated between the pressure plate and the upper surface of the base, and finally tighten the quick-tightening nut at the top of the stud to fix it. At this time, the installation and fixing steps of the coupler are completed; Step 2: Potting glue: Start to evenly inject potting glue into the coupler and wait for heating treatment; Step 3: Potting and curing: Turn on the curing oven switch and set the temperature to 70°C. After the temperature rises to 70°C, connect the base to the curing oven through the groove. The upper surface of the curing oven has a groove structure that matches the groove. After connection, set the curing oven to a timer of 1 hour. After heating for 1 hour, the equipment will sound an alarm and automatically turn off the power. At this time, the curing of the 1553B data bus coupler potting glue is completed.

2. A potting and curing method for a 1553B open potting and curing device as claimed in claim 1, characterized in that: The base is a rectangular plate and is made of aluminum alloy material.

3. The potting and curing method of a 1553B open potting and curing device as claimed in claim 1, characterized in that: The groove is in the shape of a long strip.

4. The potting and curing method of a 1553B open potting and curing device as claimed in claim 1, characterized in that: The stud is made of 45 steel material.

5. The potting and curing method of a 1553B open potting and curing device as claimed in claim 1, characterized in that: The pressing plate and the quick-tightening nut are made of H62 material.

6. A potting and curing method for a 1553B open potting and curing device as claimed in claim 1, characterized in that: The pressing plate is provided with a central hole for the stud to pass through, and the diameter of the central hole is larger than the outer diameter of the stud.

7. A potting and curing method for a 1553B open potting and curing device as claimed in claim 1, characterized in that: A circular through hole inclined 5° along the axial direction is vertically penetrated in the threaded hole inside the quick-tightening nut.

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