Chip testing equipment

Abstract

The present invention provides a chip detection device, which relates to the field of chip detection technology. The chip detection device includes: a slide rail structure, an extraction device, a transportation device and an image acquisition and detection device; the extraction device is used to extract a chip carrier in a clip and place it on the slide rail structure; the transportation device is used to transport the chip carrier on the slide rail structure to a detection position, or to move the chip carrier at the detection position out of the detection position; the image acquisition and detection device is located above the detection position, and is used to capture an image of a chip on the chip carrier, and compare the image with a standard image, so as to obtain defects of the chip on the chip carrier.

Description

Technical Field

[0001] The present invention relates to the technical field of chip detection, and in particular to a chip detection device. Background Art

[0002] During chip processing, a series of inspections are performed to detect defects. Addressing these defects can avoid wasting materials and producing scrap.

[0003] The existing chip inspection method uses manual screening. The operator removes the chip carrier from the magazine, observes each chip with a microscope, checks for defects one by one, keeps the products that meet the requirements, and returns the products that do not meet the requirements to the corresponding workstation for reprocessing.

[0004] Due to the randomness and uncertainty of manual inspection, there is no way to ensure that all defects are detected. In addition, manual inspection cannot ensure that all chips are inspected with quality and quantity, and it is easy for missed inspections or non-inspections to occur. In addition, manual inspection requires operators to manually load and unload materials. This process is very likely to cause contamination to the chips, resulting in low inspection quality and efficiency. Summary of the Invention

[0005] The purpose of the present invention is to provide a chip detection device to alleviate the problem that manual inspection cannot ensure that all defects are detected, and manual inspection cannot ensure that all chips are inspected with quality and quantity, which may easily lead to missed inspections or non-inspections. In addition, manual inspection requires operators to manually load and unload materials, and this process is very likely to cause contamination to the chips, resulting in low inspection quality and efficiency.

[0006] An embodiment of the present invention provides a chip detection device, which includes: a slide rail structure, an extraction device, a transportation device, and an image acquisition and detection device;

[0007] The extraction device is used to extract the chip carrier from the clip and place it on the slide rail structure;

[0008] The transport device is used to transport the chip carrier on the slide rail structure to the detection position, or to move the chip carrier at the detection position out of the detection position;

[0009] The image acquisition and detection device is located above the detection position and is used to acquire an image of the chip on the chip carrier and compare the image with a standard image to obtain defects of the chip on the chip carrier.

[0010] Furthermore, the image acquisition and detection device includes a mobile platform, an image acquisition mechanism and a ring light source;

[0011] The mobile platform is capable of driving the image acquisition mechanism to move along a first direction and a second direction, wherein a plane formed by the first direction and the second direction is perpendicular to the length direction of the slide rail structure;

[0012] The annular light source is connected to the lowermost end of the image acquisition mechanism, and the center of the annular light source is coaxial with the optical axis of the image acquisition mechanism.

[0013] Furthermore, the extraction device includes left and right conveying mechanisms and a first clamping mechanism;

[0014] The left and right conveying mechanisms include a transport base and a linear drive module, wherein the linear drive module is used to drive the transport base to move along the length direction of the slide rail structure; the first clamping mechanism is located on the transport base, and the first clamping mechanism is used to clamp the chip carrier in the clip.

[0015] Furthermore, the slide rail structure includes two parallel and spaced guide rails, and the first clamping mechanism is located below the slide rail structure;

[0016] The first clamping mechanism is movably connected to the transport base, and the extraction device includes a first vertical driving mechanism, which is used to drive the first clamping mechanism to move vertically.

[0017] Furthermore, the transport base is connected to the first clamping mechanism via a connecting piece, one end of the connecting piece is hinged to the transport base, and the other end of the connecting piece is hinged to the first clamping mechanism;

[0018] The first vertical driving mechanism includes a compression spring, one end of the compression spring is connected to the connecting member, and the other end of the compression spring is connected to the transport base, and the compression spring is used to make the first clamping mechanism have an upward movement tendency;

[0019] A stop block is provided on the connecting member, and the stop block abuts against the bottom surface of the guide rail; a guide boss is provided on the bottom surface of the guide rail, and the surface of the guide boss facing the head end of the guide rail is a slope, and the slope is inclined downward from the head end to the tail end of the guide rail. The slope is used to guide the stop block to move upward or downward to make the first clamping mechanism rise or fall.

[0020] Furthermore, the linear drive module includes a first left and right telescopic module and a second left and right telescopic module; a slider is slidably connected to the transport base, the sliding direction of the slider is the same as the length direction of the slide rail structure, and the first clamping mechanism and the second left and right telescopic module are fixed to the slider;

[0021] The first left and right telescopic modules are connected to the transport base and are used to drive the transport base, the slider and the first clamping mechanism to move laterally. The second left and right telescopic modules are connected to the slider and are used to drive the slider and the first clamping mechanism to move laterally.

[0022] Furthermore, the first clamping mechanism includes an upper clamping claw, a lower clamping claw, and a first vertical driving mechanism, wherein a movable end of the first vertical driving mechanism is connected to the upper clamping claw for driving the upper clamping claw to move toward or away from the lower clamping claw;

[0023] The first vertical driving mechanism includes a connecting rod, a magnet, and an electromagnet. The magnet and the electromagnet are fixed on the lower clamping claw. The magnet can move toward or away from the electromagnet along the opening and closing direction of the upper clamping claw and the lower clamping claw; one end of the connecting rod is connected to the magnet, and the other end is hinged to the upper clamping claw.

[0024] Furthermore, the slide rail structure includes two parallel and spaced guide rails, and the transport device further includes a second clamping mechanism and a left and right driving mechanism, wherein the left and right driving mechanism is used to drive the second clamping mechanism to move in a direction parallel to the guide rails;

[0025] A second clamping mechanism is provided on the side of at least one of the guide rails, and the second clamping mechanism includes a first clamping jaw and a second clamping jaw that can be opened and closed, and a second vertical driving mechanism; the second clamping jaw includes a second clamping edge located between the two guide rails; the first clamping jaw includes a slide groove, the slide groove is buckled on the guide rail, and the slide groove includes two groove walls arranged at intervals, and the groove wall located between the two guide rails is aligned with the second clamping edge to form a first clamping edge; the second vertical driving mechanism is used to drive the first clamping jaw and the second clamping jaw to open and close.

[0026] Furthermore, the second vertical driving mechanism includes a telescopic cylinder, a first mounting seat, a sliding block, a connecting arm, a second mounting seat, and a linkage gear;

[0027] Along the opening and closing direction of the first clamping jaw and the second clamping jaw, the sliding block is slidably connected to the first mounting seat, the first clamping jaw is connected to the sliding block, one end of the connecting arm is connected to the sliding block, and the other end of the connecting arm is provided with a first rack portion, and the first rack portion is engaged with the linkage gear;

[0028] The linkage gear is rotatably connected to the second mounting seat. A second rack portion is provided on the side wall of the second clamping jaw, the second rack portion is engaged with the linkage gear, and the first rack portion and the second rack portion are respectively located on opposite sides of the linkage gear; along the opening and closing direction of the first clamping jaw and the second clamping jaw, the second clamping jaw is slidably connected to the second mounting seat;

[0029] The telescopic cylinder is fixed on the first mounting seat, and the movable end of the telescopic cylinder is connected to the connecting arm, so as to drive the connecting arm to move along the opening and closing direction of the first clamping jaw and the second clamping jaw.

[0030] Furthermore, the slide rail structure also has an initial position and a discharge position. A first proximity switch is provided at the end of the initial position, a second proximity switch is provided at the end of the detection position, and a third proximity switch is provided at the discharge position. The first proximity switch, the second proximity switch and the third proximity switch are all electrically connected to the left and right drive mechanisms.

[0031] The chip inspection device provided in an embodiment of the present invention includes: a slide rail structure, an extraction device, a transport device, and an image acquisition and inspection device. The extraction device is used to extract a chip carrier from a magazine and place it on the slide rail structure. The transport device is used to transport the chip carrier on the slide rail structure to a testing position, or to remove the chip carrier from the testing position. The image acquisition and inspection device is located above the testing position and is used to capture an image of the chip on the chip carrier and compare the image with a standard image to detect defects in the chip on the chip carrier. The magazine can be aligned with the front end of the slide rail structure, and then the extraction device is used to extract the chip carrier from the magazine and place it on the slide rail structure. The transport device is then used to move the chip carrier forward to the testing position below the image acquisition and inspection device. The image acquisition and monitoring device is used to capture an image of the chip, and the captured image is compared with a standard image pre-stored in the system to determine the location of the defect in the tested chip. The inspected chip is then transported forward by the transport device, leaving the testing position. The transport device then transports the next chip carrier to the testing position for inspection. There is no human involvement in the extraction, transportation and testing processes, which reduces the risk of human contamination of the chip. Using machinery instead of manual labor can improve the efficiency and quality of testing. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0033] Figure 1 A schematic diagram of a chip detection device provided by an embodiment of the present invention;

[0034] Figure 2 A schematic diagram of a chip detection device provided in an embodiment of the present invention (without the housing);

[0035] Figure 3 A schematic diagram of an extraction device for a chip detection device according to an embodiment of the present invention;

[0036] Figure 4 A front view of an extraction device of a chip detection device provided by an embodiment of the present invention;

[0037] Figure 5 A top view of an extraction device of a chip detection device provided in an embodiment of the present invention;

[0038] Figure 6 for Figure 5 Cross-sectional view in the AA direction;

[0039] Figure 7 for Figure 6 A partial enlarged view of position B in the middle;

[0040] Figure 8 A schematic diagram of a clamping mechanism of a chip detection device provided in an embodiment of the present invention;

[0041] Figure 9 A top view of a chip carrier transfer device of a chip testing device provided in an embodiment of the present invention;

[0042] Figure 10 A schematic diagram of a second clamping mechanism of a chip detection device provided in an embodiment of the present invention;

[0043] Figure 11 A front view of a second clamping mechanism of a chip detection device provided by an embodiment of the present invention;

[0044] Figure 12 A side view of the second clamping mechanism of the chip detection device provided by an embodiment of the present invention.

[0045] Icons: 100 - slide rail structure; 110 - guide rail; 210 - transport base; 220 - clip; 230 - first clamping mechanism; 240 - connector; 250 - compression spring; 261 - guide boss; 262 - stop block; 271 - first left and right telescopic module; 272 - second left and right telescopic module; 273 - slider; 281 - upper clamping claw; 282 - lower clamping claw; 283 - connecting rod; 284 - magnet Iron; 285-electromagnet; 320-left and right driving mechanism; 330-second clamping mechanism; 331-first clamping jaw; 3311-first clamping edge; 332-second clamping jaw; 3321-second clamping edge; 333-telescopic cylinder; 334-first mounting seat; 335-sliding block; 336-connecting arm; 337-second mounting seat; 338-linking gear; 400-image acquisition and detection device; 500-housing. DETAILED DESCRIPTION

[0046] The following will clearly and completely describe the technical solutions of the present invention in conjunction with the embodiments. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0047] like Figures 1-12 As shown, the chip detection equipment provided by the embodiment of the present invention includes: a slide rail structure 100, an extraction device, a transportation device and an image acquisition and detection device 400; the extraction device is used to extract the chip carrier in the clip 220 and place it on the slide rail structure 100; the transportation device is used to transport the chip carrier on the slide rail structure 100 to the detection position, or move the chip carrier at the detection position out of the detection position; the image acquisition and detection device 400 is located above the detection position, and is used to capture the image of the chip on the chip carrier, and compare the image with the standard image, so as to obtain defects of the chip on the chip carrier.

[0048] like Figure 2As shown, the clip 220 can be aligned with the front end of the slide structure 100 first, and then the chip carrier can be extracted from the clip 220 using the extraction device and placed on the slide structure 100; then, the chip carrier can be moved forward by the transport device, so that the chip carrier moves to the detection position below the image acquisition and detection device 400, and the image acquisition and monitoring device is used to capture the image of the chip. The captured image is compared with the standard image pre-stored in the system, so that the location of the defect in the detected chip can be obtained. The detected chip will be transported forward by the transport device and leave the detection position. The transport device then transports the next chip carrier to the detection position for detection. There is no human intervention in the extraction, transportation and detection process, which reduces the risk of human contamination of the chip. Using machinery instead of manual labor can improve the efficiency and quality of detection.

[0049] The chip detection equipment also includes a shell 500 that completely covers the slide rail structure 100, the extraction device, the transportation device and the image acquisition and detection device 400. The shell 500 is provided with an inlet and an outlet connected to the head end and the tail end of the slide rail structure 100. The inlet is provided with a bracket, which is used to support the magazine 220.

[0050] The image acquisition and detection device 400 includes a mobile platform, an image acquisition mechanism and an annular light source; the mobile platform can drive the image acquisition mechanism to move along a first direction and a second direction, and the plane formed by the first direction and the second direction is perpendicular to the length direction of the slide rail structure 100; the annular light source is connected to the lowermost end of the image acquisition mechanism, and the center of the annular light source is coaxial with the optical axis of the image acquisition mechanism.

[0051] The image acquisition mechanism can be an industrial camera, and the mobile platform can be a two-dimensional or three-dimensional motion platform. In this embodiment, the mobile platform can move in two dimensions, driving the image acquisition mechanism to move forward and backward and up and down. The chip carrier has multiple chips. By moving the image acquisition mechanism forward and backward, the image acquisition mechanism can capture complete images of the chips in the forward and backward directions. Adjusting the image acquisition mechanism up and down facilitates focusing. Because the transport device can drive the chip carrier to move in the left and right directions, the image acquisition mechanism can capture complete images of the chips on the chip carrier in both directions. In addition, a ring-shaped light source is fixed at the bottom end of the image acquisition mechanism to provide fill light, thereby enhancing the clarity of the captured image.

[0052] like Figure 3-Figure 8As shown, the extraction device includes left and right conveying mechanisms and a first clamping mechanism 230; the left and right conveying mechanisms include a transport base 210 and a linear drive module, and the linear drive module is used to drive the transport base 210 to move along the length direction of the slide rail structure 100; the first clamping mechanism 230 is located on the transport base 210, and the first clamping mechanism 230 is used to clamp the chip carrier in the clip 220.

[0053] Align the head end of the slide rail structure 100 with the outlet of the clip 220, and then use the left and right conveying mechanisms to move the first clamping mechanism 230 on the transport base 210 to the outlet position of the clip 220 and simultaneously open the first clamping mechanism 230, use the first clamping mechanism 230 to clamp the chip carrier, and then use the left and right conveying mechanisms to drive the transport base 210 in reverse, so that the chip carrier can be pulled out of the clip 220 and slide on the slide rail structure 100, and then be transported to the inspection station.

[0054] The slide rail structure 100 includes two parallel and spaced guide rails 110, and the first clamping mechanism 230 is located below the slide rail structure 100; the first clamping mechanism 230 is movably connected to the transport base 210, and the extraction device includes a first vertical driving mechanism, which is used to drive the first clamping mechanism 230 to move vertically.

[0055] In order to reduce the width of the extraction device, the first clamping mechanism 230 can be set below the slide rail structure 100, and after the first clamping mechanism 230 removes the chip carrier from the clip 220, in order not to affect the subsequent movement of the chip carrier along the slide rail structure 100, the first clamping mechanism 230 can be lowered to the bottom of the slide rail structure 100. When the first clamping mechanism 230 is needed, the first vertical driving mechanism is used to lift the first clamping mechanism 230 so that the clamping mouth of the first clamping mechanism 230 is flush with the outlet of the clip 220.

[0056] The transport base 210 is connected to the first clamping mechanism 230 via a connecting piece 240, one end of the connecting piece 240 is hinged to the transport base 210, and the other end of the connecting piece 240 is hinged to the first clamping mechanism 230; the first vertical driving mechanism includes a compression spring 250, one end of the compression spring 250 is connected to the connecting piece 240, and the other end of the compression spring 250 is connected to the transport base 210, and the compression spring 250 is used to make the first clamping mechanism 230 has a tendency to move upward; a stop block 262 is provided on the connecting member 240, and the stop block 262 abuts against the bottom surface of the guide rail 110; a guide boss 261 is provided on the bottom surface of the guide rail 110, and the surface of the guide boss 261 facing the head end of the guide rail 110 is a slope, and the slope is inclined downward from the head end to the tail end of the guide rail 110, and the slope is used to guide the stop block 262 to move upward or downward, so that the first clamping mechanism 230 rises or falls.

[0057] In this embodiment, the transport base 210 and the first clamping mechanism 230 are connected by a connector 240, thereby forming a parallelogram connector 240 structure. A compression spring 250 is compressed between the connector 240 and the transport base 210. The compression spring 250 ensures that the stop block 262 on the connector 240 always contacts the bottom surface of the guide rail 110. A guide boss 261 is provided at a position approximately one chip carrier length away from the front end of the guide rail 110. The inclined surface of the guide boss 261 faces the front end of the guide rail 110 and is inclined downward. In this embodiment, the guide boss 261 may be trapezoidal. Initially, the first clamping mechanism 230 is positioned below the guide rail 110, with the stopper 262 abutting the bottom surface of the guide boss 261. As the transport base 210 moves toward the front end of the guide rail 110, the stopper 262 moves upward along the inclined surface, simultaneously moving the first clamping mechanism 230 upward, thereby aligning the clamping jaws of the first clamping mechanism 230 with the outlet of the clip 220. Conversely, when the first clamping mechanism 230 clamps the chip carrier and fully extracts it, the second clamping mechanism 330 can open its jaws, causing the stopper 262 to move back onto the inclined surface. As the transport base 210 continues to move away from the front end of the guide rail 110, the stopper 262 moves downward along the inclined surface, driving the first clamping mechanism 230 downward, ultimately moving it below the slide rail structure 100. The released chip carrier can then continue to move along the slide rail structure 100 without being affected by the first clamping mechanism 230.

[0058] The linear drive module includes a first left and right telescopic module 271 and a second left and right telescopic module 272; a slider 273 is slidably connected to the transport base 210, and the sliding direction of the slider 273 is the same as the length direction of the slide rail structure 100, and the first clamping mechanism 230 and the second left and right telescopic module 272 are fixed on the slider 273; the first left and right telescopic module 271 is connected to the transport base 210, and is used to drive the transport base 210, the slider 273 and the first clamping mechanism 230 to move laterally, and the second left and right telescopic module 272 is connected to the slider 273, and is used to drive the slider 273 and the first clamping mechanism 230 to move laterally.

[0059] In order to enable the first clamping mechanism 230 to smoothly clamp and release the chip carrier, in this embodiment, initially, the first left and right telescopic modules 271 can be used to push the transport base 210, and the slider 273, the first clamping mechanism 230 and the second left and right telescopic modules 272 on the transport base 210 are all pushed toward the head end of the guide rail 110. By setting the extension length of the first left and right telescopic modules 271, the first clamping mechanism 230 can be stopped at a position close to the outlet of the clip 220, and then the first clamping mechanism 230 is controlled to open the clamping mouth, and then the first left and right telescopic modules 271 are used to continue to push the slider 273 toward the front end of the guide rail 110, so that the clamping mouth of the first clamping mechanism 230 moves just to the edge of the chip carrier, and the first clamping mechanism 230 closes the clamping mouth to clamp the edge of the chip carrier. Then the first left and right telescopic modules 271 pull the transport base 210 in the opposite direction to completely pull out the chip carrier. At this time, the stop block 262 is located at the front end of the inclined surface of the guide boss 261. Then, the first clamping mechanism 230 opens the clamping mouth, and the second left and right telescopic modules 272 continue to drive the slider 273 to move backward. The first clamping mechanism 230 moves downward due to the interaction between the stop block 262 and the guide boss 261.

[0060] The first clamping mechanism 230 includes an upper clamping claw 281, a lower clamping claw 282 and a first vertical driving mechanism, the movable end of the first vertical driving mechanism is connected to the upper clamping claw 281, and is used to drive the upper clamping claw 281 to move toward or away from the lower clamping claw 282; the first vertical driving mechanism includes a connecting rod 283, a magnet 284, and an electromagnet 285, the magnet 284 and the electromagnet 285 are fixed on the lower clamping claw 282, and the magnet 284 can move toward or away from the electromagnet 285 along the opening and closing direction of the upper clamping claw 281 and the lower clamping claw 282; one end of the connecting rod 283 is connected to the magnet 284, and the other end is hinged to the upper clamping claw 281.

[0061] The polarity of the electromagnet 285 can be changed to repel or attract the magnet 284. When the electromagnet 285 and the magnet 284 repel each other, the magnet 284 pushes the upper clamping claw 281 upward through the connecting rod 283, thereby expanding the upper clamping claw 281 and the lower clamping claw 282; and when the electromagnet 285 and the magnet 284 attract each other, the connecting rod 283 pulls the upper clamping claw 281 downward, thereby closing the upper clamping claw 281 and the lower clamping claw 282 to clamp the chip carrier.

[0062] The slide rail structure 100 includes two parallel and spaced guide rails 110, and the transport device also includes a second clamping mechanism 330 and a left and right driving mechanism 320, the left and right driving mechanism 320 is used to drive the second clamping mechanism 330 to move in a direction parallel to the guide rails 110; a second clamping mechanism 330 is provided on the side of at least one of the guide rails 110, the second clamping mechanism 330 includes a first clamping jaw 331 and a second clamping jaw 332 that can be opened and closed, and a second vertical driving mechanism; the second clamping jaw 332 includes a second clamping edge 3321 located between the two guide rails 110; the first clamping jaw 331 includes a slide groove, the slide groove is buckled on the guide rail 110, and the slide groove includes two slot walls arranged at intervals, the slot wall located between the two guide rails 110 is aligned with the second clamping edge 3321 to form a first clamping edge 3311; the second vertical driving mechanism is used to drive the first clamping jaw 331 and the second clamping jaw 332 to open and close.

[0063] The left and right driving mechanism 320 can be a screw motor module, which uses the motor as a power source to drive the screw to rotate, so that the slider on the screw moves along the length direction of the screw. The second clamping mechanism 330 is fixed on the slider 273.

[0064] The second clamping jaw 332 includes a second clamping edge 3321 positioned between the two guide rails 110. The first clamping jaw 331 includes a slide groove that latches onto the guide rails 110 and partially wraps around them. The slide groove includes two spaced-apart walls, with the wall between the two guide rails 110 aligned with the second clamping edge 3321 to form a first clamping edge 3311. After the chip carrier is removed and placed on the guide rails 110, the second clamping mechanism 330 on the guide rails 110 clamps the chip carrier. The left and right drive mechanisms 320 then move the chip carrier along the length of the guide rails 110, either to the inspection position or to the discharge position after inspection. During the transfer process, the chip carrier no longer requires manual handling, preventing contamination of the chips and improving inspection quality and efficiency. In addition, the structure formed by the first clamping edge 3311 and the second clamping edge 3321 of the second clamping mechanism 330 is wrapped around the outside of the guide rail 110, reducing the space occupied by the second clamping mechanism 330. Through reasonable structural design, the product structure is compact and occupies little space.

[0065] The second vertical drive mechanism includes a telescopic cylinder 333, a first mounting seat 334, a sliding block 335, a connecting arm 336, a second mounting seat 337, and a linkage gear 338; along the opening and closing direction of the first clamping jaw 331 and the second clamping jaw 332, the sliding block 335 is slidably connected to the first mounting seat 334, the first clamping jaw 331 is connected to the sliding block 335, one end of the connecting arm 336 is connected to the sliding block 335, and the other end of the connecting arm 336 is provided with a first rack portion, which is meshed with the linkage gear 338; the linkage gear 338 is rotatably connected to the second mounting seat On 337, a second rack portion is provided on the side wall of the second clamping jaw 332, the second rack portion is engaged with the linkage gear 338, and the first rack portion and the second rack portion are respectively located on opposite sides of the linkage gear 338; along the opening and closing direction of the first clamping jaw 331 and the second clamping jaw 332, the second clamping jaw 332 is slidingly connected to the second mounting seat 337; the telescopic cylinder 333 is fixed on the first mounting seat 334, and the movable end of the telescopic cylinder 333 is connected to the connecting arm 336, which is used to drive the connecting arm 336 to move along the opening and closing direction of the first clamping jaw 331 and the second clamping jaw 332.

[0066] In this embodiment, the second vertical drive mechanism is connected to the first and second clamping jaws 331, 332, respectively, to drive relative movement of the first and second clamping jaws 331, 332. By enabling relative and counter-reverse movement of the first and second clamping jaws 331, 332 to open and close the second clamping mechanism 330, it can accommodate chip carriers of varying thicknesses and avoid the problem of blocking the chip carrier when one of the first and second clamping jaws 331, 332 is immobilized. The telescopic cylinder 333 drives the connecting arm 336 up and down. When the connecting arm 336 moves downward, the slider 273, which is directly connected to the connecting arm 336, drives the first clamping jaw 331 downward. Simultaneously, the connecting arm 336 drives the linkage gear 338 to rotate forward, which drives the second clamping jaw 332 downward, thereby expanding the second clamping mechanism 330. Conversely, when the telescopic cylinder 333 drives the connecting arm 336 downward, the second clamping mechanism 330 closes, clamping the chip carrier.

[0067] The slide rail structure 100 also has an initial position and a discharge position. A first proximity switch is provided at the end of the initial position, a second proximity switch is provided at the end of the detection position, and a third proximity switch is provided at the discharge position. The first proximity switch, the second proximity switch and the third proximity switch are all electrically connected to the left and right drive mechanisms 320.

[0068] When the chip carrier is at the initial position, the first proximity switch is triggered. Assuming that the second proximity switch is not triggered at this time, the left and right driving mechanisms 320 can drive the second clamping mechanism 330 to move to the initial position, and transport the chip carrier at the initial position to the detection position. The first proximity switch, the second proximity switch, and the third proximity switch can be used to detect whether the chip carrier exists at each position. If the proximity switch at a certain position does not detect the chip carrier, the second clamping mechanism 330 can move the chip carrier at the previous position to the next position, so that the transportation continues.

[0069] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A chip detection device, characterized in that: The chip detection device comprises: a slide rail structure (100), an extraction device, a transportation device and an image acquisition and detection device (400); The extraction device is used to extract the chip carrier from the clip (220) and place it on the slide rail structure (100); The transport device is used to transport the chip carrier on the slide rail structure (100) to a detection position, or to move the chip carrier at the detection position out of the detection position; The image acquisition and detection device (400) is located above the detection position and is used to acquire an image of the chip on the chip carrier and compare the image with a standard image, thereby obtaining defects of the chip on the chip carrier; The image acquisition and detection device (400) comprises a mobile platform, an image acquisition mechanism and an annular light source; The mobile platform can drive the image acquisition mechanism to move along a first direction and a second direction, and the plane formed by the first direction and the second direction is perpendicular to the length direction of the slide rail structure (100); The annular light source is connected to the lowermost end of the image acquisition mechanism, and the center of the annular light source is coaxial with the optical axis of the image acquisition mechanism; The extraction device includes left and right conveying mechanisms and a first clamping mechanism (230); The left and right conveying mechanisms include a transport base (210) and a linear drive module, wherein the linear drive module is used to drive the transport base (210) to move along the length direction of the slide rail structure (100); the first clamping mechanism (230) is located on the transport base (210), and the first clamping mechanism (230) is used to clamp the chip carrier in the clip (220); The slide rail structure (100) comprises two parallel and spaced guide rails (110), and the first clamping mechanism (230) is located below the slide rail structure (100); The first clamping mechanism (230) is movably connected to the transport base (210), and the extraction device includes a first vertical driving mechanism, which is used to drive the first clamping mechanism (230) to move vertically; The transport base (210) is connected to the first clamping mechanism (230) via a connecting member (240), one end of the connecting member (240) is hinged to the transport base (210), and the other end of the connecting member (240) is hinged to the first clamping mechanism (230); The first vertical driving mechanism comprises a compression spring (250), one end of the compression spring (250) is connected to the connecting member (240), and the other end of the compression spring (250) is connected to the transport base (210), and the compression spring (250) is used to make the first clamping mechanism (230) have a tendency to move upward; A stop block (262) is provided on the connecting member (240), and the stop block (262) abuts against the bottom surface of the guide rail (110); a guide boss (261) is provided on the bottom surface of the guide rail (110), and the surface of the guide boss (261) facing the head end of the guide rail (110) is an inclined surface, and the inclined surface is inclined downward from the head end to the tail end of the guide rail (110), and the inclined surface is used to guide the stop block (262) to move upward or downward, so as to make the first clamping mechanism (230) rise or fall.

2. The chip detection device according to claim 1, characterized in that: The linear drive module comprises a first left and right telescopic module (271) and a second left and right telescopic module (272); a slider (273) is slidably connected to the transport base (210); the sliding direction of the slider (273) is the same as the length direction of the slide rail structure (100); the first clamping mechanism (230) and the second left and right telescopic module (272) are fixed on the slider (273); The first left and right telescopic modules (271) are connected to the transport base (210) and are used to drive the transport base (210), the slider (273) and the first clamping mechanism (230) to move in a lateral direction. The second left and right telescopic modules (272) are connected to the slider (273) and are used to drive the slider (273) and the first clamping mechanism (230) to move in a lateral direction.

3. The chip detection device according to claim 2, characterized in that: The first clamping mechanism (230) comprises an upper clamping claw (281), a lower clamping claw (282) and a first vertical driving mechanism, wherein a movable end of the first vertical driving mechanism is connected to the upper clamping claw (281) and is used to drive the upper clamping claw (281) to move toward or away from the lower clamping claw (282); The first vertical driving mechanism comprises a connecting rod (283), a magnet (284), and an electromagnet (285); the magnet (284) and the electromagnet (285) are fixed to the lower clamping claw (282); the magnet (284) can move toward or away from the electromagnet (285) along the opening and closing direction of the upper clamping claw (281) and the lower clamping claw (282); one end of the connecting rod (283) is connected to the magnet (284), and the other end is hinged to the upper clamping claw (281).

4. The chip detection device according to claim 1, characterized in that: The slide rail structure (100) includes two parallel and spaced guide rails (110), and the transport device further includes a second clamping mechanism (330) and a left-right driving mechanism (320), wherein the left-right driving mechanism (320) is used to drive the second clamping mechanism (330) to move in a direction parallel to the guide rails (110); A second clamping mechanism (330) is provided on the side of at least one of the guide rails (110), and the second clamping mechanism (330) includes a first clamping jaw (331) and a second clamping jaw (332) that can be opened and closed, and a second vertical driving mechanism; the second clamping jaw (332) includes a second clamping edge (3321) located between the two guide rails (110); the first clamping jaw (331) includes a slide groove, the slide groove is buckled on the guide rail (110), and the slide groove includes two groove walls arranged at intervals, and the groove wall located between the two guide rails (110) is aligned with the second clamping edge (3321) to form a first clamping edge (3311); the second vertical driving mechanism is used to drive the first clamping jaw (331) and the second clamping jaw (332) to open and close.

5. The chip detection device according to claim 4, characterized in that: The second vertical driving mechanism includes a telescopic cylinder (333), a first mounting seat (334), a sliding block (335), a connecting arm (336), a second mounting seat (337), and a linkage gear (338); Along the opening and closing direction of the first clamping jaw (331) and the second clamping jaw (332), the sliding block (335) is slidably connected to the first mounting seat (334), the first clamping jaw (331) is connected to the sliding block (335), one end of the connecting arm (336) is connected to the sliding block (335), and the other end of the connecting arm (336) is provided with a first rack portion, and the first rack portion is engaged with the linkage gear (338); The linkage gear (338) is rotatably connected to the second mounting seat (337); a second rack portion is provided on the side wall of the second clamping jaw (332); the second rack portion is engaged with the linkage gear (338), and the first rack portion and the second rack portion are respectively located on opposite sides of the linkage gear (338); along the opening and closing direction of the first clamping jaw (331) and the second clamping jaw (332), the second clamping jaw (332) is slidably connected to the second mounting seat (337); The telescopic cylinder (333) is fixed on the first mounting seat (334), and the movable end of the telescopic cylinder (333) is connected to the connecting arm (336) for driving the connecting arm (336) to move along the opening and closing direction of the first clamping jaw (331) and the second clamping jaw (332).

6. The chip detection device according to claim 4, characterized in that: The slide rail structure (100) also has an initial position and a discharge position, a first proximity switch is provided at the end of the initial position, a second proximity switch is provided at the end of the detection position, and a third proximity switch is provided at the discharge position, and the first proximity switch, the second proximity switch and the third proximity switch are all electrically connected to the left and right drive mechanisms (320).

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