Manufacturing apparatus of display device and manufacturing method of display device

Abstract

A manufacturing apparatus of a display device and a manufacturing method of a display device are provided. The manufacturing apparatus of the display device includes a base, a peeling module, a driving portion, and a control portion. The base supports a work substrate covered with a work protective film. The peeling module includes a peeling structure and a pressure sensor that measures a pressure applied to the peeling structure. The driving portion controls a position of the peeling module. The control portion controls the peeling module and the driving portion.

Description

Technical Field

[0001] The present invention relates to a manufacturing apparatus for a display device and a manufacturing method for a display device, and more specifically, to a manufacturing apparatus for a display device used in removing a protective film and a manufacturing method for a display device using the same apparatus. Background Technology

[0002] Various display devices are under development for use in multimedia devices such as televisions, mobile phones, desktop computers, navigation devices, and game consoles. These display devices include various functional components such as display modules, input sensors, windows, and optical films.

[0003] The various functional components, having undergone manufacturing or processing steps, are combined together. A multi-step combination process is used to create a stacked display device. Summary of the Invention

[0004] The purpose of this invention is to provide a manufacturing apparatus for display devices that reduces the defect rate in the manufacturing process.

[0005] The purpose of this invention is to provide a method for manufacturing a display device using the above-described manufacturing equipment.

[0006] An embodiment of the present invention relates to a manufacturing apparatus for a display device, comprising a base, a stripping module, a driving unit, and a control unit. The base supports a working substrate covered by a working protective film. The stripping module includes a stripping structure and a pressure sensor for measuring the pressure applied to the stripping structure. The driving unit controls the position of the stripping module. The control unit controls both the stripping module and the driving unit.

[0007] The operating substrate may include multiple unit areas and peripheral areas adjacent to the multiple unit areas.

[0008] The multiple unit regions may respectively include a base layer, a circuit element layer, a display element layer, and a packaging layer.

[0009] An adhesive layer may be disposed between the protective film and the substrate.

[0010] Cutting lines can be defined on the protective film used in the operation.

[0011] The cutting line can extend to the adhesive layer.

[0012] The protective film for the work can be divided into multiple areas by the cutting lines.

[0013] The pressure sensor may include a piezoelectric element.

[0014] The control unit can receive a sensing signal representing the pressure from the pressure sensor, and control the position of the drive unit in the vertical direction based on the sensing signal.

[0015] When the pressure is within a predetermined range, the control unit can move the drive unit in the horizontal direction.

[0016] An embodiment of the present invention relates to a method for manufacturing a display device, comprising: providing a working substrate covered by a working protective film; moving a peeling module, including a peeling structure and a pressure sensor for measuring the pressure applied to the peeling structure, in a vertical direction; measuring the pressure; interrupting the vertical movement of the peeling module when the pressure is above a reference value; and moving the peeling module in a horizontal direction.

[0017] The working substrate may include multiple unit areas and peripheral areas adjacent to the multiple unit areas. The working protective film includes multiple component areas corresponding to the multiple unit areas distinguished by the cutting lines and boundary areas corresponding to the peripheral areas. The boundary areas of the working protective film are removed by the movement of the peeling module in the horizontal direction.

[0018] The boundary region may include multiple regions.

[0019] The manufacturing method of the display device may further include the step of cutting the working substrate to divide it into multiple unit regions.

[0020] An embodiment of the present invention relates to a manufacturing apparatus for a display device, comprising a base, a pressurizing module, a peeling structure, a first driving unit, a second driving unit, and a control unit. The base supports a work substrate covered by a work protective film. The pressurizing module includes a pressurizing component and a pressure sensor that measures the pressure applied to the pressurizing component. The first driving unit controls the position of the pressurizing module. The second driving unit controls the position of the peeling structure. The control unit controls the pressure sensor, the first driving unit, and the second driving unit.

[0021] The working substrate may include multiple unit regions and peripheral regions adjacent to the multiple unit regions, and multiple pressurization modules are provided to correspond to a portion of the multiple unit regions.

[0022] The protective film can be divided into multiple areas by cutting lines.

[0023] The pressure sensor may include a piezoelectric element.

[0024] The control unit can receive a sensing signal representing the pressure from the pressure sensor, and control the position of the first drive unit in the vertical direction based on the sensing signal.

[0025] The control unit can move the second drive unit when the first drive unit is fixed in the vertical direction.

[0026] (Invention Effects)

[0027] As described above, the pressure applied to the peeling structure can be measured after it comes into contact with the working substrate. Even if the base is uneven, the peeling structure can be accurately positioned at the desired location at each peeling point. The desired position is set in the vertical direction. The peeling structure prevents overpressure from being applied to the working substrate. The peeling structure can be positioned in the vertical direction at a location sufficient to peel off the protective film.

[0028] Pressurization modules are configured in multiple areas of the protective film. Each area of ​​the pressurization module (each component area) with the protective film overlaps with the unit area. When removing the boundary areas of the protective film, the component areas do not lift up. This is because the pressurization modules apply pressure to each component area. The pressure applied to the work substrate can be continuously monitored to prevent overpressure from being applied to the work substrate through the pressurization modules. Attached Figure Description

[0029] Figure 1 This is a perspective view of a manufacturing apparatus for a display device according to an embodiment of the present invention.

[0030] Figure 2a This is a plan view of a working substrate according to an embodiment of the present invention.

[0031] Figure 2b Is with Figure 2a The sectional view corresponding to I-I'.

[0032] Figure 2c It's enlarged. Figure 2b The diagram of region AA.

[0033] Figure 3a as well as Figure 3b This is a side view illustrating the operation of a manufacturing apparatus for a display device according to an embodiment of the present invention.

[0034] Figure 3c It is a plan view showing the flatness of the working substrate.

[0035] Figure 4a This is a plan view illustrating one step of a method for manufacturing a display device according to an embodiment of the present invention.

[0036] Figure 4bIt's enlarged. Figure 4a A floor plan of an area.

[0037] Figure 4c Is with Figure 4b The sectional view corresponding to II-II'.

[0038] Figure 5 This is a perspective view of a manufacturing apparatus for a display device according to an embodiment of the present invention.

[0039] Figure 6a This is a side view illustrating the operation of a manufacturing apparatus for a display device according to an embodiment of the present invention.

[0040] Figure 6b This is a plan view illustrating one step of a method for manufacturing a display device according to an embodiment of the present invention.

[0041] (Symbol Explanation)

[0042] 100: Peeling module; 1000, 1000-1: Manufacturing equipment; 11: Pressure plate; 110: Peeling structure; 12: Connecting rod; 120: Pressure sensor; 20: Pressure sensor; 200: Control unit; 30: Pressure module; 300: Base; ADL: Temporary adhesive layer; BA: Peripheral area; BL: Base layer; CA: Unit area; CL-PF: Cutting line; CL: Cutting line; DP: Display panel; PF-BA: Boundary area; PF-C: Unit protective film; PF-CA: Component area; PF-W: Working protective film; SP: Drive unit; SS: Support substrate; SP1: First drive unit; SP2: Second drive unit; WS: Working substrate. Detailed Implementation

[0043] In this specification, when it is mentioned that a certain constituent element (or region, layer, part, etc.) is located on other constituent elements, connected or combined with other constituent elements, it means that it is directly disposed on other constituent elements or directly connected / combined with other constituent elements, or a third constituent element may be disposed therein.

[0044] The same symbol refers to the same constituent element. Furthermore, in the figures, the thickness, proportions, and dimensions of each constituent element are exaggerated for the purpose of illustrating the technical content. "And / or" includes more than one combination of all relevant constituent elements.

[0045] The terms "first," "second," etc., can be used to describe various constituent elements, but the constituent elements are not limited to these terms. These terms are used only to distinguish one constituent element from others. For example, without departing from the scope of this invention, a first constituent element can be named a second constituent element, and similarly, a second constituent element can be named a first constituent element. Singular expressions include multiple expressions unless explicitly stated otherwise in the text.

[0046] Additionally, terms such as "below," "on the lower side," "above," and "on the upper side" are used to explain the connection relationships between the constituent elements in the illustration. These terms are relative concepts and are explained based on the directions shown in the illustration.

[0047] Terms such as “including” or “having” refer to the presence of features, figures, steps, actions, constituent elements, components, or combinations thereof described in the instruction manual, and should not be construed as excluding the existence or additional possibilities of one or more other features, figures, steps, actions, constituent elements, components, or combinations thereof.

[0048] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) shall have the same meaning as commonly understood by those skilled in the art. Furthermore, terms identical to those defined in commonly used dictionaries shall be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and shall be expressly defined in this specification, provided they are not interpreted as having an ideal or overly formal meaning.

[0049] Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings.

[0050] Figure 1 This is a perspective view of a manufacturing apparatus 1000 for a display device according to an embodiment of the present invention. Figure 2a This is a plan view of the working substrate WS according to an embodiment of the present invention. Figure 2b Is with Figure 2a The sectional view corresponding to I-I'. Figure 2c It's enlarged. Figure 2b The diagram of region AA.

[0051] The manufacturing equipment 1000 involved in this embodiment includes a stripping module 100, a drive unit SP, a control unit 200, and a base 300. The connection relationship between the control unit 200, the stripping module 100, and the drive unit SP is briefly shown in this embodiment. The stripping module 100 and the drive unit SP can be connected to the control unit 200 via cables or wireless communication modules for receiving and transmitting signals.

[0052] The peeling module 100 includes a peeling structure 110 and a pressure sensor 120 that measures the pressure (or force intensity) applied to the peeling structure 110. The peeling structure 110 is a structure that can pierce or rub against a synthetic resin film. The peeling structure 110 can be a plastic pin, a plastic sheet, a metal pin, or a metal sheet. The peeling structure 110 is combined with the pressure sensor 120.

[0053] Pressure sensor 120 receives pressure applied to the stripping structure 110. Pressure sensor 120 may include a piezoelectric element that generates an electrical signal corresponding to the applied pressure. Furthermore, pressure sensor 120 may include a material whose resistance changes in response to the applied pressure. For example, it may include carbon powder, QTC (Quantum Tunnelling Composite), silver nanoparticles, single-crystal or polycrystalline silicon, electroactive polymers, etc. Carbon nanotubes, graphene, or metal nanowires are not only flexible but also materials whose resistance changes with applied pressure, and therefore can also be used to construct pressure sensor 120.

[0054] The peeling module 100 is combined with the drive unit SP. The drive unit SP controls the position of the peeling module 100. The drive unit SP is a mechanical structure that can adjust the position of the peeling module 100 in the vertical direction and in the horizontal direction. The drive unit SP can be, for example, a mechanical structure such as a robotic arm.

[0055] The control unit 200 controls the drive unit SP and the pressure sensor 120. The control unit 200 controls the operation of the drive unit SP and receives a sensing signal representing pressure from the pressure sensor 120. The control unit 200 may include a conventional computer system. It can control the drive unit SP according to user input and provide the sensing signal to the user in a predetermined manner.

[0056] The base 300 supports the working substrate WS, which is covered by the working protective film PF-W. Figure 1 The diagram shows that the working protective film PF-W has an area larger than the working substrate WS, but it is not limited to this. The working protective film PF-W only needs to have an area sufficient to protect the working substrate WS; in fact, the working protective film PF-W can have the same area as the working substrate WS. The working protective film PF-W can include plastic films such as polyethylene terephthalate (PET), but there are no particular limitations.

[0057] Reference Figure 2a The working substrate WS includes multiple cell regions CA. Figure 2a Examples of cell regions CA are shown, arranged in 3×3 rows and columns.

[0058] Multiple unit regions (CA) are separated to form a display module or a display panel. The display module may include a display panel, and in addition to the display panel, may include at least one of an input sensor and an optical film. Figure 2a In the diagram, the display panel DP is represented within the unit area CA (see reference). Figure 4c The display area DP-DA is the region where the pixels of the display panel are configured.

[0059] The working substrate WS is in a state where each unit area CA is manufactured into a display module or display panel, and the working protective film PF-W is bonded to the working substrate WS to protect the unit area CA.

[0060] like Figure 2b As shown, an adhesive layer ADL (hereinafter referred to as a temporary adhesive layer) is disposed between the working protective film PF-W and the working substrate WS. To minimize the amount of residual adhesive material remaining on the working substrate WS when removing the working protective film PF-W from the working substrate WS, the temporary adhesive layer ADL has relatively low adhesive strength and relatively high viscoelasticity. The temporary adhesive layer ADL may include silicone-based or urethane-based adhesive materials.

[0061] The working substrate WS includes a peripheral region BA adjacent to the cell region CA. The peripheral region BA is the area between each cell region CA. For the working protective film PF-W, a component region PF-CA corresponding to the cell region CA of the working substrate WS and a boundary region PF-BA corresponding to the peripheral region BA of the working substrate WS can be set.

[0062] A cutting line CL-PF is formed on the protective film PF-W (refer to...). Figure 2c The cutting line CL-PF can be formed by laser while the working protective film PF-W and the working substrate WS are disposed on the base 300, or the working protective film PF-W and the working substrate WS can be disposed on the base 300 while the cutting line CL-PF is formed.

[0063] The protective film PF-W can be divided into multiple areas by the cutting line CL-PF. (See reference) Figure 2a The protective film PF-W is divided into four distinct boundary regions PF-BA and nine component regions PF-CA. The outer boundary of the cutting line CL-PF can be aligned with the unit region CA.

[0064] like Figure 2c As shown, the cutting line CL-PF can extend to the temporary adhesive layer ADL. Since the temporary adhesive layer ADL has been partially cut, it can be more easily removed along with the boundary region PF-BA when removing the boundary region PF-BA.

[0065] Figure 3a as well as Figure 3b This is a side view illustrating the operation of a manufacturing apparatus 1000 for a display device according to an embodiment of the present invention. Figure 3c This is a plan view showing the flatness of the substrate. The following section discusses the flatness of the substrate. Figure 1 The descriptions of the same components are omitted.

[0066] The control unit 200 controls the drive unit SP to lower the stripping module 100. The control unit 200 monitors the sensing signal received from the pressure sensor 120. The drive unit SP is controlled to lower the stripping module 100 until the sensing signal equals the reference signal.

[0067] The control unit 200 controls the position of the drive unit SP in the vertical direction based on the sensing signal. For example... Figure 3a As shown, if the peeling structure 110 comes into contact with the working protective film PF-W, a different sensing signal is received than before contact. If the peeling structure 110 is in a position where appropriate pressure (suitable for peeling) is applied to the working protective film PF-W, the control unit 200 terminates the descent of the peeling module 100. When the pressure is above a reference value, the vertical movement of the peeling module 100 is interrupted.

[0068] Then, when the pressure detected by the pressure sensor 120 is within a predetermined range, the control unit 200, such as Figure 3b As shown, the drive unit SP is moved horizontally. This horizontal movement allows the protective film PF-W to be peeled off.

[0069] Table 1 below is based on... Figure 3a as well as Figure 3b The results pertain to an embodiment of the manufacturing equipment 1000 for the display device shown, which involves peeling off the boundary region PF-BA of the working protective film PF-W. The first location is closer to the cell region CA compared to the second location. The base 300 may not be perfectly flat. For example, there may be a height difference of ±500 μm depending on the region. This height difference can be measured from the ground. Because the first and second locations have a height difference, peeling may or may not be possible under the same load.

[0070] When the pressure detected by pressure sensor 120 is above 2.6 kgf, the boundary region PF-BA of the working protective film PF-W can be peeled off at two locations using the peeling structure 110. When the pressure detected by pressure sensor 120 is 4 kgf, damage to the working substrate WS was found.

[0071] [Table 1]

[0072] Load (kgf) First location Second Location 0.5 Non-removable Non-removable 0.8 Non-removable Non-removable 1.5 Non-removable Non-removable 1.9 Non-removable Peelable 2 Non-removable Peelable 2.2 Non-removable Peelable 2.6 Peelable Peelable 3 Peelable Peelable 3.5 Peelable Peelable 4 Damaged Damaged

[0073] Reference Figure 3c On a working substrate WS, at 40 locations, the peeling module 100 applied pressure to the working protective film PF-W with a load of 2.6 kgf. The height difference at various locations around the cell region CA-R under the same load was represented using the locations around the reference cell region CA-R as a reference. A maximum height difference of 500 μm was measured. According to this embodiment, instead of lowering the peeling module 100 by the same displacement, the peeling module 100 is lowered until the same pressure is measured, thus enabling the peeling of the boundary region PF-BA of the working protective film PF-W in the same manner even when peeling is performed at 40 locations with height differences.

[0074] Figure 4a This is a plan view illustrating one step of a method for manufacturing a display device according to an embodiment of the present invention. Figure 4b It's enlarged. Figure 4a A floor plan of an area. Figure 4c Is with Figure 4b The section view corresponding to II-II'. The unspecified symbol DP-NDA may be a non-display area.

[0075] If multiple references are implemented Figures 3a to 3c The operation of the manufacturing equipment 1000 for the display device described herein is as follows: Figure 4a As shown, the boundary area PF-BA of the protective film PF-W will be completely removed. Figures 2a to 2c As shown, in order to remove all four boundary regions PF-BA, four reference operations can be performed. Figures 3a to 3c The operation of the manufacturing equipment 1000 for the display device is described.

[0076] According to this embodiment, during the four aforementioned operations performed in the display device manufacturing equipment 1000, the pressure applied to the peeling structure 110 at four locations can be measured. Even if the base 300 is not flat, the peeling structure 110 can be appropriately positioned at a desired location at each descent point. The desired location is set in the vertical direction. Overpressure applied to the working substrate WS by the peeling structure 110 can be prevented. The peeling structure 110 can be positioned in the vertical direction at a location sufficient to peel off the working protective film PF-W.

[0077] Then, cut Figure 4a The working substrate WS is shown. A cutting line CL is set in the peripheral area BA, and the working substrate WS is cut along the cutting line CL using a cutting wheel CHE. In this way, multiple display panels with unit protective films PF-C bonded together can be formed.

[0078] exist Figure 4b as well as Figure 4cThis represents a display module DM. The display module DM has more than Figure 2a The unit region CA shown has a large area. A portion of the display module DM is exposed from the unit protective film PF-C. The display module DM may include a display panel DP, which may include a substrate layer BL, a circuit element layer DP-CL, a display element layer DP-OLED, and an encapsulation layer DP-TFE.

[0079] The substrate layer BL may include at least one synthetic resin film. The substrate layer BL may include a glass substrate, a metal substrate, or an organic / inorganic composite material substrate, etc. The circuit element layer DP-CL includes at least one insulating layer and circuit elements. The insulating layer includes at least one inorganic layer and at least one organic layer. The circuit elements include signal lines and pixel driving circuits, etc. The display element layer DP-OLED is a light-emitting element, including at least an organic light-emitting diode. The display element layer DP-OLED may also include an organic layer such as a pixel definition film. The encapsulation layer DP-TFE may include multiple inorganic layers. The encapsulation layer DP-TFE may also include an organic layer.

[0080] Further processing can be performed on the separated display panel (DP). The substrate layer (BL) can be bonded to the support substrate (SS) via a temporary adhesive layer (ADL). The support substrate (SS) and the temporary adhesive layer (ADL) can be removed after the display panel manufacturing process is completed.

[0081] Figure 5 This is a perspective view of a manufacturing apparatus 1000-1 for a display device according to an embodiment of the present invention. Figure 6a This is a side view of a manufacturing apparatus 1000-1 for a display device according to an embodiment of the present invention. Figure 6b This is a plan view illustrating one step of a method for manufacturing a display device according to an embodiment of the present invention. Hereinafter, references to the diagram are omitted. Figures 1 to 4c The description is the same as the detailed description of the structure.

[0082] The manufacturing equipment 1000-1 for the display device includes a pressure module 30, a first drive unit SP1, a peeling structure 110, a second drive unit SP2, a base 300, and a control unit 200. In this embodiment, the peeling structure 110 is shown as being directly coupled to the first drive unit SP1; however, the peeling structure 110 can also be coupled to a pressure sensor 120 (see reference 120). Figure 1 (Combined)

[0083] The pressurization module 30 includes a pressurization component 10 and a pressure sensor 20 that measures the pressure applied to the pressurization component 10. The pressurization component 10 is disposed on a portion of the working protective film PF-W. The pressurization component 10 can pressurize the working protective film PF-W with a pressure that does not damage the working substrate WS. The pressurization component 10 may include a pressurization plate 11 and a connecting rod 12. This is only one embodiment, and the configuration of the pressurization component 10 is not particularly limited. The pressure sensor 20 is compared with a reference... Figure 1 The pressure sensor 120 described is essentially the same.

[0084] Reference Figure 5 as well as Figure 6a Example 1000-1 illustrates a manufacturing apparatus 1000 for a display device, which includes three pressurization modules 30 coupled to a first drive unit SP1. The three pressurization modules 30 can be configured to correspond to a portion of a plurality of unit regions CA.

[0085] The control unit 200 controls the first drive unit SP1 to lower the pressurization module 30. The control unit 200 monitors the sensing signal received from the pressure sensor 20. The first drive unit SP1 is controlled to lower the pressurization module 30 until the sensing signal equals the reference signal.

[0086] The control unit 200 controls the position of the first drive unit SP1 in the vertical direction based on the sensing signals. For example... Figure 6a As shown, if the pressurizing module 30 comes into contact with the protective membrane PF-W, it receives a sensing signal different from that before contact. If the pressurizing module 30 is in a position that applies appropriate pressure to the protective membrane PF-W, the control unit 200 stops the descent of the pressurizing module 30. When the pressure is above the reference value, the vertical movement of the pressurizing module 30 is interrupted.

[0087] Then, the control unit 200 controls the second drive unit SP2 to lower the peeling structure 110. After lowering the peeling structure 110 by a set amount, the peeling structure 110 can be moved horizontally. Through this horizontal movement of the peeling structure 110, a portion of the protective film PF-W can be peeled off. Figure 6b This indicates the situation.

[0088] Reference Figure 6b The three pressurizing modules 30 can be configured to correspond to each unit region CA in the first column CA-C1 of each unit region CA arranged in a 3×3 row and column configuration. A boundary region PF-BA adjacent to each unit region CA in the first column CA-C1 is stripped. Since the pressurizing module 30 fixes the component region PF-CA, only the boundary region PF-BA can be separated. Horizontal pressure on the component region PF-CA can be prevented during the separation process.

[0089] Three pressurization modules 30 can be moved to pressurize each cell region CA in the second column CA-C2 and each cell region CA in the third column CA-C3. During the movement, the boundary region PF-BA is stripped.

[0090] The base 300 may not be perfectly flat. According to this embodiment, the pressure applied to the pressurizing member 10 can be measured three times during the descent of the three-stage pressurization module 30. Even if the base 300 is not flat, the pressurizing member 10 can be appropriately positioned at a desired location at each descent point. The desired location is set in the vertical direction. Overpressure applied to the working board WS can be prevented by the pressurization module 30.

[0091] The above description refers to preferred embodiments of the present invention. However, those skilled in the art or those of ordinary skill in the art should understand that various modifications and alterations can be made to the present invention without departing from the spirit and technical scope of the invention as described in the claims.

[0092] Therefore, the technical scope of this invention should not be limited by the detailed description in the specification, but should be defined by the claims.

Claims

1. A manufacturing apparatus for a display device, comprising: The base supports the work substrate covered by the work protective film; A stripping module includes a stripping structure and a pressure sensor for measuring the pressure applied to the stripping structure. The drive unit controls the position of the stripping module; as well as The control unit controls the peeling module and the drive unit. When the pressure is within a predetermined range, the control unit moves the drive unit horizontally, causing the peeling module to move horizontally and peel off the protective film. When the pressure exceeds a reference value, the vertical movement of the peeling module is interrupted. An adhesive layer is disposed between the protective film and the substrate. The cutting lines are defined on the protective film used in the work. The cutting line extends to the adhesive layer. The predetermined range is above 2.6 kgf and less than 4 kgf, and The width of the cutting line gradually increases as the cutting line gets closer to the upper surface of the working substrate.

2. The manufacturing equipment for the display device according to claim 1, wherein, The working substrate includes multiple unit areas and peripheral areas adjacent to the multiple unit areas.

3. The manufacturing equipment for the display device according to claim 2, wherein, The multiple unit regions respectively include a base layer, a circuit element layer, a display element layer, and a packaging layer.

4. The manufacturing equipment for the display device according to claim 1, wherein, The protective film is divided into multiple areas by the cutting lines.

5. The manufacturing equipment for the display device according to claim 1, wherein, The pressure sensor includes a piezoelectric element.

6. The manufacturing equipment for the display device according to claim 1, wherein, The control unit receives a sensing signal representing the pressure from the pressure sensor and controls the position of the drive unit in the vertical direction based on the sensing signal.

7. A method for manufacturing a display device, comprising: Steps for providing a work substrate covered with a work protective film; The step of moving a peeling module, which includes a peeling structure and a pressure sensor that measures the pressure applied to the peeling structure, in the vertical direction; The steps for measuring the pressure; The step of interrupting the vertical movement of the stripping module when the pressure is above the reference value; as well as The step of moving the peeling module horizontally and peeling off the protective film when the pressure is within a predetermined range, wherein... An adhesive layer is disposed between the protective film and the substrate. The cutting lines are defined on the protective film used in the work. The cutting line extends to the adhesive layer. The predetermined range is above 2.6 kgf and less than 4 kgf, and The width of the cutting line gradually increases as the cutting line gets closer to the upper surface of the working substrate.

8. The method for manufacturing a display device according to claim 7, wherein, The working substrate includes multiple unit regions and a peripheral region adjacent to the multiple unit regions. The protective film for the work includes multiple component areas corresponding to the multiple unit areas distinguished by the cutting lines, and boundary areas corresponding to the surrounding areas. The boundary area of ​​the protective film is removed by the horizontal movement of the peeling module.

9. The method for manufacturing a display device according to claim 8, wherein, The boundary region includes multiple areas.

10. The method for manufacturing a display device according to claim 7, further comprising: The step of cutting the working substrate to divide it into multiple unit regions.

11. A manufacturing apparatus for a display device, comprising: The base supports the work substrate covered by the work protective film; A pressurization module, including a pressurization component and a pressure sensor for measuring the pressure applied to the pressurization component; The first drive unit controls the position of the pressurization module; Stripping the structure; The second drive unit controls the position of the stripped structure; as well as The control unit controls the pressure sensor, the first drive unit, and the second drive unit. When the pressure applied to the peeling structure is within a predetermined range, the control unit moves the second drive unit horizontally, causing the peeling structure to move horizontally and peel off the protective film. When the pressure exceeds a reference value, the vertical movement of the peeling structure is interrupted. An adhesive layer is disposed between the protective film and the substrate. The cutting lines are defined on the protective film used in the work. The cutting line extends to the adhesive layer. The predetermined range is above 2.6 kgf and less than 4 kgf, and The width of the cutting line gradually increases as the cutting line gets closer to the upper surface of the working substrate.

12. The manufacturing equipment for the display device according to claim 11, wherein, The working substrate includes multiple unit regions and a peripheral region adjacent to the multiple unit regions. Multiple pressurization modules are provided to correspond to a portion of the multiple unit regions.

13. The manufacturing apparatus for the display device according to claim 11, wherein, The protective film is divided into multiple areas by cutting lines.

14. The manufacturing apparatus for the display device according to claim 11, wherein, The pressure sensor includes a piezoelectric element.

15. The manufacturing apparatus for the display device according to claim 11, wherein, The control unit receives a sensing signal representing the pressure from the pressure sensor and controls the position of the first drive unit in the vertical direction based on the sensing signal.

16. The manufacturing apparatus for the display device according to claim 15, wherein, The control unit moves the second drive unit when the first drive unit is fixed in the vertical direction.

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