Dicing tape and dicing die bonding film

Abstract

The present invention relates to a dicing tape and a dicing die bonding film. The present invention provides a dicing tape that suppresses floating and has excellent pick-up properties. The present invention provides a dicing tape, etc., comprising: a base layer and an adhesive layer laminated on the base layer, the adhesive layer containing an ultraviolet curable polymer having a polymerizable unsaturated bond, and the calorific value per unit mass in differential scanning calorimetry of ultraviolet curing of the adhesive layer is 19 mJ / mg or more.

Description

Technical Field

[0001] The present invention relates to a dicing tape and a dicing die-bonding film. Background Art

[0002] Conventionally, dicing tapes and dicing die-bonding films have been used in the manufacture of semiconductor integrated circuits.

[0003] The dicing tape includes a base layer and an adhesive layer laminated on the base layer.

[0004] The dicing tape is used to fix the semiconductor wafer so that the individual semiconductor chips do not scatter when the semiconductor wafer is placed on the adhesive layer and then cut in the production of semiconductor integrated circuits.

[0005] The dicing die-bonding film includes a dicing tape and a die-bonding layer (die-bonding film) laminated on the adhesive layer of the dicing tape.

[0006] The dicing die-bonding film is used to obtain a semiconductor chip with a die-bonding layer attached thereto from a semiconductor wafer in the manufacture of a semiconductor integrated circuit.

[0007] In a method for obtaining a semiconductor chip with a chip bonding layer attached thereto by using a cutting chip bonding film, a semiconductor wafer in a state of being divisible into semiconductor chips (or in a divided state) is attached to the center of the chip bonding layer of the cutting chip bonding film, and the base material layer of the cutting chip bonding film is expanded at a low temperature (e.g., -20°C to 5°C) (also called a "cold expansion process"), thereby cutting the semiconductor wafer and the chip bonding layer (chip bonding film) together (when using a semiconductor wafer in a divided state, only the chip bonding layer is cut), and a semiconductor chip with a chip bonding film is obtained on the cutting tape.

[0008] Next, expansion is performed at a temperature of, for example, 10° C. or higher (also referred to as a “thermal expansion step” or a “room temperature expansion step”), thereby increasing the distance between adjacent semiconductor chips with die-bonding films.

[0009] Then, the outer peripheral portion of the dicing tape is thermally shrunk to maintain the state in which the interval between the semiconductor chips with the die-bonding film is enlarged (also referred to as a “heat shrinking step”).

[0010] This makes it easy to pick up the semiconductor chip with the die-bonding film from the dicing tape (also referred to as a “pick-up step”).

[0011] Furthermore, after the heat shrinking step and before picking up the semiconductor chip with the die-bonding film from the dicing tape, the semiconductor chip with the die-bonding film on the dicing tape is sometimes cleaned with a cleaning liquid such as water (also referred to as a "cleaning step").

[0012] Prior art literature

[0013] Patent Literature

[0014] Patent Document 1: Japanese Patent Application Publication No. 2015-185591

[0015] Patent Document 2: Japanese Patent Application Publication No. 2018-195746 Summary of the invention

[0016] Problem that the invention aims to solve

[0017] However, before the pickup step, the end of the semiconductor chip with the die-bonding film may float from the adhesive layer of the dicing tape.

[0018] Such floating may cause undesired separation of the semiconductor chip with the die-bonding film from the dicing tape in a cleaning step or the like.

[0019] In particular, as the wiring structure preformed on the surface of the semiconductor wafer becomes more multilayered, the difference in thermal expansion coefficient between the resin in the wiring structure and the semiconductor material of the semiconductor chip body becomes a major factor, making the above-mentioned floating more likely to occur.

[0020] Furthermore, the above-mentioned floating is likely to occur particularly during the room temperature expansion process.

[0021] Here, in order to suppress the occurrence of the above-mentioned floating, it is conceivable to increase the adhesive force of the above-mentioned pressure-sensitive adhesive layer.

[0022] However, it is difficult to pick up the semiconductor chip with the die-bonding film from the dicing tape simply by increasing the adhesive force of the adhesive layer.

[0023] Therefore, a dicing die-bonding film which can suppress floating and has excellent pickup properties is desired.

[0024] Furthermore, a dicing tape which can suppress floating even when a semiconductor chip is obtained from a semiconductor wafer using the dicing tape and has excellent pickup properties is desired.

[0025] Therefore, the present invention has been made in view of the above-mentioned desired point, and an object of the present invention is to obtain a dicing tape and a dicing die-bonding film which can suppress floating and have excellent pickup properties.

[0026] Solutions for solving problems

[0027] The dicing tape of the present invention comprises: a base layer and an adhesive layer laminated on the base layer.

[0028] The adhesive layer contains an ultraviolet curable polymer having a polymerizable unsaturated bond.

[0029] The pressure-sensitive adhesive layer has a calorific value per unit mass in differential scanning calorimetry of ultraviolet curing of 19 mJ / mg or more.

[0030] According to the cutting tape, by providing the aforementioned adhesive layer with the aforementioned UV-curable polymer, the adhesive strength of the aforementioned adhesive layer can be increased to suppress floating. By irradiating the adhesive layer with ultraviolet rays before the picking-up process, the UV-curable polymerizable polymers of the aforementioned adhesive layer can be free radically polymerized with each other. As a result, the adhesive strength of the adhesive layer can be reduced to improve the picking-up property.

[0031] Furthermore, according to the dicing tape, by setting the calorific value per unit time to 19 mJ / mg or more, it is possible to greatly differ the adhesive force of the adhesive layer before and after the ultraviolet irradiation.

[0032] Therefore, the dicing tape can suppress floating and has excellent pickup properties.

[0033] Moreover, the dicing die-bonding film of the present invention comprises the dicing tape and a die-bonding layer laminated on the pressure-sensitive adhesive layer of the dicing tape.

[0034] As described above, according to the present invention, it is possible to provide a dicing tape and a dicing die-bonding film which suppress floating and have excellent pickup properties. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 This is a cross-sectional view obtained by cutting the dicing die-bonding film of the present embodiment in the thickness direction.

[0036] Figure 2 A is a cross-sectional view schematically showing a half-cut process in a method for manufacturing a semiconductor integrated circuit.

[0037] Figure 2 B is a cross-sectional view schematically showing a half-cutting process in the method for manufacturing a semiconductor integrated circuit.

[0038] Figure 2 C is a cross-sectional view schematically showing a half-cutting process in the method for manufacturing a semiconductor integrated circuit.

[0039] Figure 2 D is a cross-sectional view schematically showing a half-cutting process in the method for manufacturing a semiconductor integrated circuit.

[0040] Figure 3 A is a cross-sectional view schematically showing a mounting step in a method for manufacturing a semiconductor integrated circuit.

[0041] Figure 3B is a cross-sectional view schematically showing a mounting step in the method for manufacturing a semiconductor integrated circuit.

[0042] Figure 4 A is a cross-sectional view schematically showing a cold expansion step in a method for manufacturing a semiconductor integrated circuit.

[0043] Figure 4 B is a cross-sectional view schematically showing a cold expansion step in the method for manufacturing a semiconductor integrated circuit.

[0044] Figure 4 C is a cross-sectional view schematically showing a cold expansion step in the method for manufacturing a semiconductor integrated circuit.

[0045] Figure 5 A is a cross-sectional view schematically showing a thermal expansion step in a method for manufacturing a semiconductor integrated circuit.

[0046] Figure 5 B is a cross-sectional view schematically showing a thermal expansion step in the method for manufacturing a semiconductor integrated circuit.

[0047] Figure 6 This is a cross-sectional view schematically showing a pickup step in a method of manufacturing a semiconductor integrated circuit.

[0048] Description of Reference Numerals

[0049] 1: Cutting die bonding film,

[0050] 10: Chip bonding layer,

[0051] 20: cutting belt,

[0052] 21: base material layer,

[0053] 22: Adhesive layer. DETAILED DESCRIPTION

[0054] Hereinafter, one embodiment of a dicing die-bonding film and a dicing tape according to the present invention will be described with reference to the drawings.

[0055] like Figure 1 As shown, the dicing die-bonding film 1 of the present embodiment includes: a dicing tape 20 having a base layer 21 and an adhesive layer 22 laminated on the base layer 21 ; and a die-bonding layer 10 laminated on the adhesive layer 22 and bonded to a semiconductor wafer.

[0056] The dicing tape 20 of this embodiment is usually a long sheet and is stored in a rolled state until use. The dicing die-bonding film 1 of this embodiment is attached to an annular frame having an inner diameter slightly larger than that of a silicon wafer subjected to dicing and is cut for use.

[0057] The adhesive layer 22 of the dicing tape 20 of the present embodiment contains an ultraviolet curable polymer having a polymerizable unsaturated bond.

[0058] It is important that the calorific value per unit mass of the pressure-sensitive adhesive layer 22 measured by differential scanning calorimetry during ultraviolet curing is 19 mJ / mg or more, preferably 19 to 60 mJ / mg, and more preferably 22 to 40 mJ / mg.

[0059] The cutting tape 20 of the present embodiment provides the aforementioned adhesive layer with the aforementioned UV-curable polymer, thereby improving the adhesive strength of the adhesive layer to suppress floating. By irradiating the adhesive layer with ultraviolet rays before the picking-up process, the UV-curable polymerizable polymers in the aforementioned adhesive layer can undergo free radical polymerization with each other. As a result, the adhesive strength of the adhesive layer can be reduced, thereby improving the picking-up property.

[0060] In addition, the dicing tape 20 of the present embodiment can make a large difference in the adhesive force of the adhesive layer before and after the ultraviolet irradiation by setting the calorific value per unit mass to 19 mJ / mg or more.

[0061] The value of the peak top per unit mass of the exothermic peak in the differential scanning calorimetry is preferably more than 0.7 mW / mg, more preferably 1.0 to 2.6 mW / mg.

[0062] The dicing tape 20 of the present embodiment has a peak top value of the exothermic peak per unit mass measured by the differential scanning calorimetry exceeding 0.7 mW / mg, so that ultraviolet curing is accelerated, and as a result, the pick-up property can be excellent at an early stage after ultraviolet irradiation.

[0063] The time from the start of ultraviolet irradiation to reaching the peak top in the differential scanning calorimetry is preferably 1.0 minute or less, more preferably 0.05 to 0.3 minutes.

[0064] The dicing tape 20 of the present embodiment has a time from the start of ultraviolet irradiation to the peak top in the differential scanning calorimetry of 1.0 minute or less, so that ultraviolet curing is accelerated, and as a result, the pickup property can be excellent at an early stage after ultraviolet irradiation.

[0065] It should be noted that the "heat value per unit mass in the differential scanning calorimetry of the ultraviolet curing of the aforementioned adhesive layer 22", "the value of the peak per unit mass of the heat generation peak in the aforementioned differential scanning calorimetry", and "the time from the start of ultraviolet irradiation to the aforementioned peak in the aforementioned differential scanning calorimetry" can be calculated by the method described in the embodiments described later.

[0066] In the differential scanning calorimetry, ultraviolet rays are irradiated until the adhesive layer 22 is sufficiently cured.

[0067] When a SUS plate is bonded to the adhesive layer 22 , the 180° peel strength between the adhesive layer 22 and the SUS plate is preferably 0.30 N / 20 mm or more, more preferably 0.8 to 3.0 N / 20 mm.

[0068] It should be noted that the 180° peel strength between the adhesive layer 22 and the SUS plate when the SUS plate is bonded to the adhesive layer 22 refers to the 180° peel strength before ultraviolet irradiation.

[0069] The dicing tape 20 of the present embodiment has a 180° peel strength of 0.30 N / 20 mm or more before ultraviolet irradiation, thereby increasing the adhesive force of the adhesive layer, and as a result, it becomes easier to suppress floating. In addition, the dicing tape 20 of the present embodiment suppresses floating, thereby making it easier to maintain a state where oxygen does not contact the surface of the adhesive layer 22, and as a result, it is possible to suppress the ultraviolet curing from being hindered.

[0070] The 180° peel strength between the adhesive layer and the SUS plate after bonding the SUS plate to the adhesive layer and irradiating the adhesive layer with ultraviolet rays (hereinafter also referred to as "180° peel strength after ultraviolet irradiation") is preferably less than 0.20 N / 20 mm, more preferably 0.02 to 0.10 N / 20 mm.

[0071] The dicing tape 20 of the present embodiment has the 180° peel strength after ultraviolet irradiation less than 0.20 N / 20 mm, so that the adhesive force of the pressure-sensitive adhesive layer after ultraviolet irradiation is reduced, and as a result, the pickup property can be improved.

[0072] When a SUS plate is bonded to the adhesive layer, the 180° peel strength between the adhesive layer and the SUS plate preferably satisfies the following formula (1), and more preferably satisfies the following formula (2).

[0073] The aforementioned 180° peel strength after ultraviolet irradiation / the aforementioned 180° peel strength before ultraviolet irradiation < 0.28··· (1)

[0074] 0.02≤180° peel strength after ultraviolet irradiation / 180° peel strength before ultraviolet irradiation≤0.25···(2)

[0075] The dicing tape 20 of the present embodiment can further suppress floating and further improve the pickup property by satisfying the above-mentioned formula (1).

[0076] In addition, "the said 180 degree peel strength after ultraviolet irradiation" and "the said 180 degree peel strength before ultraviolet irradiation" can be calculated|required by the method described in the Example mentioned later.

[0077] The 180° peel strength after ultraviolet irradiation refers to the 180° peel strength after ultraviolet irradiation until the pressure-sensitive adhesive layer 22 is sufficiently cured.

[0078] The adhesive layer 22 contains a polymer component having adhesiveness. Examples of the polymer component include acrylic polymers, olefin polymers, and silicone polymers. Among them, acrylic polymers are preferred.

[0079] It should be noted that the acrylic polymer is a polymer containing a (meth)acrylate monomer as a constituent unit. (Meth)acrylate is a concept including methacrylate and acrylate. The acrylic polymer may contain a monomer other than the (meth)acrylate monomer as a constituent unit.

[0080] The adhesive layer 22 contains an ultraviolet curable polymer having a polymerizable unsaturated bond as the adhesive polymer.

[0081] Examples of the polymerizable polymer include polymers containing a polymerizable vinyl group (H2C=CH-) or an ethynyl group (HC≡C-) at the end of the main chain or the side chain.

[0082] In the present embodiment, the pressure-sensitive adhesive layer 22 contains an ultraviolet-curable polymerizable acrylic polymer having a polymerizable unsaturated bond as the polymerizable polymer.

[0083] In addition, in the present embodiment, the pressure-sensitive adhesive layer 22 contains, for example, the above-mentioned polymerizable acrylic polymer, an isocyanate compound, and a polymerization initiator.

[0084] The adhesive layer 22 has a thickness of, for example, 3 μm or more and 20 μm or less. The shape and size of the adhesive layer 22 are usually the same as those of the base layer 21 .

[0085] In the acrylic polymer contained in the adhesive layer 22, the above-mentioned constituent units can be 1 H-NMR, 13The molar ratio of the above-mentioned structural units in the acrylic polymer can be generally calculated from the blending amount (charging amount) when the acrylic polymer is polymerized.

[0086] In this embodiment, the acrylic polymer is composed of constituent units of alkyl (meth)acrylate, constituent units of hydroxyl (meth)acrylate, and constituent units of (meth)acrylate containing a polymerizable group. It should be noted that the constituent units are units constituting the main chain of the acrylic polymer. Each side chain in the acrylic polymer is included in each constituent unit constituting the main chain.

[0087] The constituent unit of the alkyl (meth)acrylate is derived from the alkyl (meth)acrylate monomer. In other words, the molecular structure after the alkyl (meth)acrylate monomer is polymerized is the constituent unit of the alkyl (meth)acrylate. Specifically, the bond generated by the polymerization reaction of the alkyl (meth)acrylate monomer constitutes a part of the main chain of the acrylic polymer.

[0088] The hydrocarbon part of the alkyl group may be a saturated hydrocarbon or an unsaturated hydrocarbon. For example, the hydrocarbon part of the alkyl group may be a straight-chain saturated hydrocarbon, a branched-chain saturated hydrocarbon, an alicyclic hydrocarbon, or an aromatic hydrocarbon. The hydrocarbon part may be a straight-chain saturated hydrocarbon or a branched-chain saturated hydrocarbon, and more preferably a branched-chain saturated hydrocarbon.

[0089] It should be noted that the hydrocarbon portion of the alkyl group may contain a polar group having oxygen (O), nitrogen (N), or the like, but preferably does not contain such a polar group.

[0090] Examples of the constituent units of the alkyl (meth)acrylate include ethyl (meth)acrylate, butyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, n-octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, n-nonyl (meth)acrylate, iso(secondary)nonyl (meth)acrylate, tert-nonyl (meth)acrylate, isobornyl (meth)acrylate, n-decyl (meth)acrylate, iso(secondary)decyl (meth)acrylate, tert-decyl (meth)acrylate, n-undecyl (meth)acrylate, iso(secondary)undecyl (meth)acrylate, tert-undecyl (meth)acrylate, and lauryl (meth)acrylate.

[0091] The acrylic polymer has a structural unit of a hydroxyl group-containing (meth)acrylate, and the hydroxyl group of the structural unit is easily reactive with an isocyanate group.

[0092] By allowing the acrylic polymer having a structural unit containing a hydroxyl (meth)acrylate and an isocyanate compound to coexist in the pressure-sensitive adhesive layer 22 in advance, the pressure-sensitive adhesive layer can be appropriately cured.

[0093] The constituent unit of the hydroxyl (meth)acrylate is derived from the hydroxyl (meth)acrylate monomer. In other words, the molecular structure after the polymerization reaction of the hydroxyl (meth)acrylate monomer is the constituent unit of the hydroxyl (meth)acrylate. In detail, the bond generated by the polymerization reaction of the hydroxyl (meth)acrylate monomer constitutes a part of the main chain of the acrylic polymer.

[0094] The constituent unit of the hydroxyl group-containing (meth)acrylate is preferably a constituent unit of a hydroxyl group-containing C2 to C4 alkyl (meth)acrylate.

[0095] The hydrocarbon part of the alkyl group is usually a saturated hydrocarbon. For example, the hydrocarbon part of the alkyl group is a straight-chain saturated hydrocarbon or a branched saturated hydrocarbon. The hydrocarbon part of the alkyl group preferably does not contain a polar group having oxygen (O), nitrogen (N), etc.

[0096] In the structural unit of the hydroxyl group-containing (meth)acrylate, the hydroxyl group (—OH group) may be bonded to any carbon (C) of the hydrocarbon part. The hydroxyl group (—OH group) is preferably bonded to the carbon (C) at the terminal of the hydrocarbon part.

[0097] As the constituent unit of the hydroxyl group-containing alkyl (meth)acrylate, for example, constituent units of hydroxybutyl (meth)acrylate such as hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxyn-butyl (meth)acrylate, or hydroxyisobutyl (meth)acrylate can be cited. It should be noted that in the constituent unit of hydroxybutyl (meth)acrylate, the hydroxyl group (-OH group) may be bonded to the carbon (C) at the terminal of the hydrocarbon part, or may be bonded to the carbon (C) other than the terminal of the hydrocarbon part.

[0098] As the structural unit of the hydroxyl group-containing alkyl (meth)acrylate, the structural unit of hydroxyethyl (meth)acrylate is preferred, and the structural unit of 2-hydroxyethyl (meth)acrylate is more preferred.

[0099] This has the advantage of further suppressing the floating of the semiconductor chip.

[0100] In this embodiment, the acrylic polymer further contains a constituent unit of a polymerizable group-containing (meth)acrylate as described above. In other words, the acrylic polymer contains a constituent unit of a polymerizable group-containing (meth)acrylate having a polymerizable unsaturated double bond in a side chain.

[0101] By making the acrylic polymer contain a constituent unit of (meth)acrylate containing a polymerizable group, the adhesive layer 22 can be cured by ultraviolet irradiation before the pickup process. In detail, by irradiation with active energy rays of ultraviolet rays, free radicals are generated by the photopolymerization initiator, and by the action of the free radicals, the acrylic polymers can undergo cross-linking reactions with each other. Thus, the adhesive force of the adhesive layer 22 before irradiation can be reduced by irradiation. In addition, there is the advantage that the chip bonding layer 10 can be well peeled off from the adhesive layer 22, and better pickup performance can be achieved.

[0102] The constituent unit of the (meth)acrylate containing a polymerizable group can be formed by bonding a monomer having a functional group capable of bonding to a hydroxyl group and a polymerizable group in the molecule to the constituent unit of the hydroxyl-containing (meth)acrylate. The above-mentioned functional group can be an isocyanate group having high reactivity with a hydroxyl group. In other words, the above-mentioned monomer can be a monomer having an isocyanate group and a vinyl group at both ends of the molecule, respectively. The vinyl group can be, for example, a part of a (meth)acryloyl group.

[0103] Specifically, the constituent unit of the polymerizable group-containing (meth)acrylate may have a molecular structure in which the hydroxyl group in the constituent unit of the hydroxyl group-containing (meth)acrylate and the isocyanate group of the isocyanate group-containing (meth)acrylate monomer are urethane-bonded. In other words, the constituent unit of the polymerizable group-containing (meth)acrylate may have a molecular structure in which a polymerizable group ((meth)acryloyl group) is bonded via a urethane bond derived from the hydroxyl group as a molecular structure derived from the constituent unit of the hydroxyl group-containing (meth)acrylate.

[0104] The constituent unit of the polymerizable group-containing (meth)acrylate having a polymerizable group can be prepared after polymerization of an acrylic polymer intermediate. For example, after copolymerization of an alkyl (meth)acrylate monomer and a hydroxyl group-containing (meth)acrylate monomer, a part of the hydroxyl group of the constituent unit of the hydroxyl group-containing (meth)acrylate can be subjected to urethanization reaction with the isocyanate group of the polymerizable monomer containing an isocyanate group, thereby obtaining the constituent unit of the polymerizable group-containing (meth)acrylate.

[0105] The isocyanate group-containing (meth)acrylate monomer preferably has one isocyanate group and one (meth)acryloyl group in the molecule. Examples of the monomer include 2-isocyanatoethyl (meth)acrylate.

[0106] The pressure-sensitive adhesive layer 22 further contains an isocyanate compound. A part of the isocyanate compound may be in a state of reacting by a urethanization reaction or the like.

[0107] The isocyanate compound has a plurality of isocyanate groups in the molecule. By making the isocyanate compound have a plurality of isocyanate groups in the molecule, a cross-linking reaction between acrylic polymers in the adhesive layer 22 can be performed. Specifically, by making one isocyanate group of the isocyanate compound react with a hydroxyl group of an acrylic polymer, and making the other isocyanate groups react with hydroxyl groups of other acrylic polymers, a cross-linking reaction with the help of the isocyanate compound can be performed.

[0108] Examples of the isocyanate compound include diisocyanates such as aliphatic diisocyanates, alicyclic diisocyanates, and aromatic aliphatic diisocyanates.

[0109] Examples of the aliphatic diisocyanate include ethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, 2,4,4- or 2,2,4-trimethylhexamethylene diisocyanate, and methyl 2,6-diisocyanatohexanoate.

[0110] Examples of the alicyclic diisocyanate include 3-isocyanatomethyl-3,5,5-trimethylcyclohexane, 1,3- or 1,4-bis(isocyanatomethyl)cyclohexane, methylcyclohexane-2,4- or 2,6-diisocyanate, dicyclohexylmethane-4,4′-diisocyanate, and 1,3- or 1,4-diisocyanatocyclohexane.

[0111] Examples of the aromatic diisocyanate include m-phenylene diisocyanate, p-phenylene diisocyanate, diphenylmethane-4,4′-diisocyanate, 2,4- or 2,6-toluene diisocyanate, 1,3′- or 1,4-bis(isocyanatomethyl)benzene, and 1,3- or 1,4-bis(α-isocyanatoisopropyl)benzene.

[0112] In addition, as the isocyanate compound, triisocyanates can be cited. As the triisocyanates, for example, triphenylmethane-4,4',4"-triisocyanate, 1,3,5-triisocyanatobenzene, 1,3,5-tris(isocyanatomethyl)cyclohexane, 1,3,5-tris(isocyanatomethyl)benzene, 2,6-diisocyanatohexanoic acid-2-isocyanatoethyl ester, etc. can be cited.

[0113] Furthermore, examples of the isocyanate compound include polymeric polyisocyanates such as dimers and trimers of diisocyanates, and polymethylene polyphenylene polyisocyanates.

[0114] Examples of the isocyanate compound include polyisocyanates obtained by reacting an excess of the above isocyanate compound with an active hydrogen-containing compound. Examples of the active hydrogen-containing compound include active hydrogen-containing low molecular weight compounds and active hydrogen-containing high molecular weight compounds.

[0115] Examples of the active hydrogen-containing low-molecular-weight compound include ethylene glycol, propylene glycol, dipropylene glycol, diethylene glycol, triethylene glycol, 2,2,4-trimethyl-1,3-pentanediol, neopentyl glycol, hexylene glycol, cyclohexanedimethanol, cyclohexanediol, hydrogenated bisphenol A, xylylene glycol, glycerin, trimethylolethane, trimethylolpropane, hexanetriol, pentaerythritol, sorbitol, sorbitol, sucrose, castor oil, ethylenediamine, hexamethylenediamine, diethanolamine, triethanolamine, water, amines, urea, and the like. Examples of the active hydrogen-containing high-molecular-weight compound include various polyether polyols, polyester polyols, polyurethane polyols, acrylic polyols, epoxy polyols, and the like.

[0116] Furthermore, as the isocyanate compound, allophanate polyisocyanate, biuret polyisocyanate, etc. can also be used.

[0117] The above-mentioned isocyanate compounds can be used alone or in combination of two or more.

[0118] As the above-mentioned isocyanate compound, the reaction product of an aromatic diisocyanate and an active hydrogen-containing low molecular weight compound is preferred. The reaction product obtained by reacting an aromatic diisocyanate has a relatively slow reaction rate of an isocyanate group, so the adhesive layer 22 containing the reaction product can be inhibited from being excessively cured. As the above-mentioned isocyanate compound, an isocyanate compound having three or more isocyanate groups in the molecule is preferred.

[0119] The polymerization initiator contained in the adhesive layer 22 is a compound that can initiate a polymerization reaction by applying heat or light energy. By including the polymerization initiator in the adhesive layer 22, a cross-linking reaction between acrylic polymers can be carried out when heat or light energy is applied to the adhesive layer 22. Specifically, a polymerization reaction between polymerizable groups can be initiated between acrylic polymers having constituent units of (meth)acrylate containing polymerizable groups, thereby curing the adhesive layer 22. As a result, as described above, better pickup properties can be exhibited.

[0120] As the polymerization initiator, for example, a photopolymerization initiator or a thermal polymerization initiator can be used. As the polymerization initiator, a general commercially available product can be used.

[0121] The adhesive layer 22 may also contain other components in addition to the above components. As other components, for example, plasticizers, fillers, antioxidants, antioxidants, ultraviolet absorbers, light stabilizers, heat stabilizers, antistatic agents, surfactants, light peeling agents, etc. can be listed. The types and amounts of other components can be appropriately selected according to the purpose.

[0122] The dicing tape 20 of this embodiment includes a base layer 21 bonded to the above-mentioned adhesive layer 22. The base layer 21 is, for example, a fiber sheet such as metal foil, paper, cloth, a rubber sheet, a resin film, etc. The base layer 21 may have a laminated structure.

[0123] Examples of the fiber sheet constituting the base layer 21 include paper, woven fabric, and nonwoven fabric.

[0124] As the material of the resin film, for example, polyolefins such as polyethylene (PE), polypropylene (PP), and ethylene-propylene copolymers; copolymers of ethylene such as ethylene-vinyl acetate copolymers (EVA), ionomer resins, ethylene-(meth)acrylic acid copolymers, and ethylene-(meth)acrylate (random, alternating) copolymers; polyesters such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT); polyacrylates; polyvinyl chloride (PVC); polyurethane; polycarbonate; polyphenylene sulfide (PPS); polyamides such as aliphatic polyamides and wholly aromatic polyamides (aramid); polyetheretherketone (PEEK); polyimide; polyetherimide; polyvinylidene chloride; ABS (acrylonitrile-butadiene-styrene copolymer); cellulose or cellulose derivatives; silicone-containing polymers; fluorine-containing polymers, etc. These can be used alone or in combination of two or more.

[0125] When the base material layer 21 includes a resin film, the resin film may be subjected to a stretching treatment or the like to control deformability such as elongation.

[0126] The surface of the base material layer 21 may be subjected to a surface treatment in order to improve the adhesion with the adhesive layer 22. As the surface treatment, for example, an oxidation treatment based on a chemical method or a physical method such as chromic acid treatment, ozone exposure, flame exposure, high voltage electric shock exposure, ionizing radiation treatment, etc. may be adopted. In addition, a coating treatment using a coating agent such as an anchor coating agent, a primer, or an adhesive may also be performed.

[0127] The back side of the base layer 21 (the side not overlapping with the adhesive layer 22 ) may be coated with a release agent (release agent) such as silicone resin or fluororesin to impart releasability.

[0128] The base material layer 21 is preferably a light-transmitting (ultraviolet-transmitting) resin film or the like, from the viewpoint of being able to apply active energy rays such as ultraviolet rays to the pressure-sensitive adhesive layer 22 from the back side.

[0129] The dicing tape 20 of this embodiment may also have a release sheet covering one surface of the adhesive layer 22 (the surface of the adhesive layer 22 that does not overlap with the base layer 21) before use. When the die bonding layer 10, which is smaller in area than the adhesive layer 22, is arranged so as to be accommodated in the adhesive layer 22, the release sheet is arranged so as to cover both the adhesive layer 22 and the die bonding layer 10. The release sheet is used to protect the adhesive layer 22 and is peeled off before the die bonding layer 10 is attached to the adhesive layer 22.

[0130] As the release sheet, for example, a plastic film or paper that has been surface-treated with a release agent such as a silicone-based, long-chain alkyl-based, fluorine-based, or molybdenum sulfide release agent can be used.

[0131] In addition, as a peeling sheet, for example, films made of fluorine-based polymers such as polytetrafluoroethylene, polychlorotrifluoroethylene, polyethylene fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, and chlorofluoroethylene-vinylidene fluoride copolymer; films made of polyolefins such as polyethylene and polypropylene; films made of polyesters such as polyethylene terephthalate (PET), etc. can be used.

[0132] As the release sheet, for example, a plastic film or paper whose surface is coated with a release agent such as a fluorine-based release agent or a long-chain alkyl acrylate-based release agent can be used.

[0133] It should be noted that the release sheet can be used as a supporting material for supporting the adhesive layer 22. The release sheet is particularly suitable for use when the adhesive layer 22 is overlapped on the base layer 21. Specifically, the adhesive layer 22 can be overlapped on the base layer 21 in a state where the release sheet and the adhesive layer 22 are stacked, and the release sheet can be peeled off (transferred) after the overlap, thereby overlapping the adhesive layer 22 on the base layer 21.

[0134] Next, the dicing die-bonding film 1 according to the present embodiment will be described in detail.

[0135] The dicing die-bonding film 1 of the present embodiment includes the above-mentioned dicing tape 20 and a die-bonding layer 10 laminated on the adhesive layer 22 of the dicing tape 20. The die-bonding layer 10 is bonded to a semiconductor wafer in the manufacture of a semiconductor integrated circuit.

[0136] The die bonding layer 10 may include at least one of a thermosetting resin and a thermoplastic resin. The die bonding layer 10 preferably includes a thermosetting resin and a thermoplastic resin.

[0137] As the thermosetting resin, for example, epoxy resin, phenolic resin, amino resin, unsaturated polyester resin, polyurethane resin, silicone resin, thermosetting polyimide resin, etc. can be listed. As the above-mentioned thermosetting resin, only one kind or two or more kinds can be used. From the aspect of containing less ionic impurities that may cause corrosion of the semiconductor chip as the chip bonding object, the above-mentioned thermosetting resin is preferably epoxy resin. As a curing agent for epoxy resin, phenolic resin is preferably used.

[0138] Examples of the epoxy resin include bisphenol A type, bisphenol F type, bisphenol S type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol AF type, biphenyl type, naphthalene type, fluorene type, phenol novolac type, o-cresol novolac type, trihydroxyphenylmethane type, tetrahydroxyphenylethane type, hydantoin type, triglycidyl isocyanurate type, and glycidylamine type epoxy resins.

[0139] As the epoxy resin, a naphthalene type epoxy resin is preferred.

[0140] The phenolic resin can function as a curing agent for the epoxy resin. Examples of the phenolic resin include novolac-type phenolic resins, resol-type phenolic resins, and polyoxystyrene such as polyoxystyrene.

[0141] Examples of the novolac-type phenolic resin include phenol novolac resin, phenol aralkyl resin, cresol novolac resin, tert-butylphenol novolac resin, and nonylphenol novolac resin.

[0142] As the phenolic resin, a phenol novolac resin is preferred. When these phenolic resins function as a curing agent for epoxy resin (die-bonding adhesive), the adhesiveness of the epoxy resin as an adhesive can be further improved.

[0143] As the phenol resin, only one type may be used or two or more types may be used.

[0144] In the die bonding layer 10 , the hydroxyl group of the phenol resin is preferably 0.5 to 2.0 equivalents, more preferably 0.7 to 1.5 equivalents per 1 equivalent of the epoxy group of the epoxy resin. This allows sufficient curing reaction between the epoxy resin and the phenol resin.

[0145] When the die bonding layer 10 includes a thermosetting resin, the content ratio of the thermosetting resin in the die bonding layer 10 is preferably 5% by mass or more and 60% by mass or less, and more preferably 10% by mass or more and 50% by mass or less relative to the total mass of the die bonding layer 10. Thus, the die bonding layer 10 can appropriately function as a thermosetting adhesive.

[0146] As thermoplastic resins that can be included in the chip bonding layer 10, for example, natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylate copolymer, polybutadiene resin, polycarbonate resin, thermoplastic polyimide resin, polyamide 6 (6-nylon), polyamide 66 (6,6-nylon) and other polyamide resins, phenoxy resins, acrylic resins, saturated polyester resins such as PET and PBT, polyamide-imide resins, fluororesins, etc.

[0147] As the thermoplastic resin, an acrylic resin is preferred because it contains less ionic impurities and has high heat resistance, and thus can further ensure the adhesiveness of the die-bonding layer 10 .

[0148] As the above-mentioned thermoplastic resin, only one kind may be used or two or more kinds may be used.

[0149] The acrylic resin is preferably a polymer in which the constituent unit of the (meth)acrylic acid alkyl ester is the largest in terms of mass ratio among the constituent units in the molecule. Examples of the (meth)acrylic acid alkyl ester include C2 to C4 alkyl (meth)acrylates.

[0150] The acrylic resin may further include a structural unit derived from other monomer components copolymerizable with the alkyl (meth)acrylate monomer.

[0151] Examples of the other monomer components include carboxyl group-containing monomers, acid anhydride monomers, hydroxyl group-containing monomers, glycidyl group-containing monomers, sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, functional group-containing monomers such as acrylamide and acrylonitrile, and other various polyfunctional monomers.

[0152] For the above-mentioned acrylic resin, from the perspective of enabling the chip bonding layer 10 to exert a higher cohesive force, a copolymer of an alkyl (meth)acrylate (especially an alkyl (meth)acrylate having an alkyl part with a carbon number of 4 or less) and a carboxyl group-containing monomer and a nitrogen atom-containing monomer and a polyfunctional monomer (especially a polyglycidyl-based polyfunctional monomer) is preferred, and a copolymer of ethyl acrylate, butyl acrylate, acrylic acid, acrylonitrile and polyglycidyl (meth)acrylate is more preferred.

[0153] The glass transition temperature (Tg) of the acrylic resin is preferably 5° C. or higher and 35° C. or lower, and more preferably 10° C. or higher and 30° C. or lower, from the viewpoint of easily setting the elasticity and viscosity of the die-bonding layer 10 within a desired range.

[0154] When the chip bonding layer 10 includes a thermosetting resin and a thermoplastic resin, the content ratio of the above-mentioned thermoplastic resin in the chip bonding layer 10 is preferably 20% by mass or more and 60% by mass or less, more preferably 30% by mass or more and 50% by mass or less, and further preferably 35% by mass or more and 45% by mass or less, relative to the total mass of the organic components other than the filler (such as thermosetting resin, thermoplastic resin, curing catalyst, silane coupling agent, dye). It should be noted that by changing the content ratio of the thermosetting resin, the elasticity and viscosity of the chip bonding layer 10 can be adjusted.

[0155] When the thermoplastic resin of the chip bonding layer 10 has a thermosetting functional group, as the thermoplastic resin, for example, an acrylic resin containing a thermosetting functional group can be used. The acrylic resin containing a thermosetting functional group preferably contains the largest mass ratio of constituent units derived from (meth) alkyl acrylate in the molecule. As the (meth) alkyl acrylate, for example, the (meth) alkyl acrylates exemplified above can be cited.

[0156] On the other hand, as the thermosetting functional group in the thermosetting functional group-containing acrylic resin, for example, a glycidyl group, a carboxyl group, a hydroxyl group, an isocyanate group, etc. can be listed. Among them, a glycidyl group, a hydroxyl group, and a carboxyl group are preferred. In other words, as the thermosetting functional group-containing acrylic resin, an acrylic resin containing a hydroxyl group and a carboxyl group is preferred.

[0157] The chip bonding layer 10 preferably contains an acrylic resin containing a thermosetting functional group and a curing agent. As the curing agent, the substances exemplified as curing agents that can be contained in the adhesive layer 22 can be cited. When the thermosetting functional group in the acrylic resin containing a thermosetting functional group is a glycidyl group, it is preferred to use a compound having a plurality of phenol structures as the curing agent. For example, the various phenolic resins mentioned above can be used as the curing agent.

[0158] The die bond layer 10 preferably contains a filler. By changing the amount of the filler in the die bond layer 10, the elasticity and viscosity of the die bond layer 10 can be more easily adjusted. Furthermore, the physical properties of the die bond layer 10, such as electrical conductivity, thermal conductivity, and elastic modulus, can be adjusted.

[0159] Examples of the filler include inorganic fillers and organic fillers. As the filler, an inorganic filler is preferred.

[0160] As the inorganic filler, for example, fillers containing silicon dioxide such as aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, boron nitride, crystalline silicon dioxide, amorphous silicon dioxide, etc. can be listed. In addition, as the material of the inorganic filler, metal single substances, alloys, etc. such as aluminum, gold, silver, copper, and nickel can be listed. Fillers such as boric acid aluminum whiskers, amorphous carbon black, and graphite can be used. The shape of the filler can be various shapes such as spherical, needle-shaped, and flaky. As the filler, only one of the above-mentioned or more than two can be used.

[0161] The average particle size of the filler is preferably 0.005 μm or more and 10 μm or less, more preferably 0.005 μm or more and 1 μm or less. By making the average particle size 0.005 μm or more, the wettability and adhesion to adherends such as semiconductor wafers are further improved. By making the average particle size 10 μm or less, the characteristics brought by the added filler can be more fully utilized, and the heat resistance of the chip bonding layer 10 can be further utilized. The average particle size of the filler can be obtained, for example, using a photometric particle size distribution meter (for example, product name "LA-910", made by HORIBA, Ltd.).

[0162] When the die bonding layer 10 contains fillers, the content ratio of the above fillers relative to the total mass of the die bonding layer 10 is preferably 30 mass % to 70 mass %, more preferably 40 mass % to 60 mass %, and further preferably 42 mass % to 55 mass %.

[0163] The die bonding layer 10 may contain other components as necessary. Examples of the other components include a curing catalyst, a flame retardant, a silane coupling agent, an ion scavenger, and a dye.

[0164] Examples of the flame retardant include antimony trioxide, antimony pentoxide, and brominated epoxy resins.

[0165] Examples of the silane coupling agent include β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, and γ-glycidoxypropylmethyldiethoxysilane.

[0166] Examples of the ion scavenger include hydrotalcites, bismuth hydroxide, and benzotriazole.

[0167] As the other additives, only one kind may be used or two or more kinds may be used.

[0168] The die-bonding layer 10 preferably contains a thermoplastic resin (particularly an acrylic resin), a thermosetting resin, and a filler from the viewpoint of facilitating adjustment of elasticity and viscosity.

[0169] In the die bonding layer 10 , the content ratio of thermoplastic resin such as acrylic resin to the total mass of organic components excluding fillers is preferably 30 mass % to 70 mass %, more preferably 40 mass % to 60 mass %, and further preferably 45 mass % to 55 mass %.

[0170] The content of the filler relative to the total mass of the die bond layer 10 is preferably 30 mass % to 70 mass %, more preferably 40 mass % to 60 mass %, further preferably 42 mass % to 55 mass %.

[0171] The thickness of the chip bonding layer 10 is not particularly limited, for example, it is greater than 1 μm and less than 200 μm. The upper limit of the thickness is preferably 100 μm, more preferably 80 μm. The lower limit of the thickness is preferably 3 μm, more preferably 5 μm. It should be noted that when the chip bonding layer 10 is a laminate, the above thickness is the total thickness of the laminate.

[0172] The glass transition temperature (Tg) of the die bond layer 10 is preferably 0° C. or higher, more preferably 10° C. or higher. By setting the glass transition temperature to 0° C. or higher, the die bond layer 10 can be easily cut by cold expansion. The upper limit of the glass transition temperature of the die bond layer 10 is, for example, 100° C.

[0173] The chip bonding layer 10 is, for example, Figure 1 As shown, it may have a single-layer structure. In this specification, a single layer means a layer consisting of only one composition. A structure in which multiple layers consisting of the same composition are stacked is also a single layer.

[0174] On the other hand, the die-bonding layer 10 may have a multilayer structure in which layers formed of two or more different compositions are stacked, for example.

[0175] When the dicing die bonding film 1 of the present embodiment is used, the adhesive layer 22 is cured by irradiating ultraviolet rays. Specifically, in a state where the die bonding layer 10 on one side of the semiconductor wafer is bonded and the adhesive layer 22 on the other side of the die bonding layer 10 is stacked, at least the adhesive layer 22 is irradiated with ultraviolet rays. For example, ultraviolet rays are irradiated from the side where the base material layer 21 is arranged, and the ultraviolet rays that pass through the base material layer 21 reach the adhesive layer 22. The adhesive layer 22 is cured by the irradiation of ultraviolet rays.

[0176] Since the adhesive layer 22 is cured after irradiation, the adhesive force of the adhesive layer 22 can be reduced, so that the die bonding layer 10 (with the semiconductor wafer bonded thereto) can be relatively easily peeled off from the adhesive layer 22 after irradiation. This can provide good pickup properties.

[0177] The irradiation energy of ultraviolet rays is, for example, 50 mJ / cm 2 Above, preferably 50 mJ / cm 2 Above and 500mJ / cm 2 Less than, more preferably 100 mJ / cm 2 Above and 300mJ / cm 2 Below. Usually, ultraviolet rays are irradiated except for the edge of the area where the adhesive layer 22 and the chip bonding layer 10 are bonded. In the case of local irradiation, irradiation is performed through a mask having a pattern, thereby providing an unirradiated area. In addition, point irradiation can be performed to form an irradiated area.

[0178] The device for irradiating ultraviolet rays is not particularly limited, and for example, a device with a product name of "UM810" manufactured by Nitto Seiki Co., Ltd. can be used.

[0179] The dicing die bonding film 1 of the present embodiment may have a release sheet covering one surface of the die bonding layer 10 (the surface of the die bonding layer 10 that does not overlap with the adhesive layer 22) before use. The release sheet is used to protect the die bonding layer 10 and is peeled off before attaching an adherend (e.g., a semiconductor wafer) to the die bonding layer 10.

[0180] As the release sheet, the same release sheet as the above-mentioned release sheet can be used. The release sheet can be used as a supporting material for supporting the chip bonding layer 10. The release sheet is suitable for use when the chip bonding layer 10 is overlapped on the adhesive layer 22. In detail, the chip bonding layer 10 and the adhesive layer 22 can be overlapped in a state where the release sheet and the chip bonding layer 10 are stacked, and the release sheet is peeled off (transferred) after overlapping, thereby overlapping the chip bonding layer 10 on the adhesive layer 22.

[0181] Since the dicing die-bonding film 1 of the present embodiment is configured as described above, it is possible to suppress the floating of the semiconductor chip and to exhibit a good pickup property.

[0182] Next, a method for manufacturing the dicing tape 20 and the dicing die-bonding film 1 according to the present embodiment will be described.

[0183] The method for manufacturing the dicing die-bonding film 1 according to the present embodiment includes:

[0184] A step of manufacturing the dicing tape 20 (a method of manufacturing the dicing tape), and a step of stacking the die bond layer 10 on the manufactured dicing tape 20 to manufacture the dicing die bond film 1 .

[0185] A method for manufacturing a cutting tape (a process for manufacturing a cutting tape) comprises:

[0186] A synthetic process for synthesizing acrylic polymers in the presence of a solvent;

[0187] an adhesive layer preparation step of preparing the adhesive layer 22 by volatilizing the solvent from an adhesive composition comprising the acrylic polymer, the isocyanate compound, the polymerization initiator, and other components appropriately added according to the purpose; and

[0188] In the lamination step, the adhesive layer 22 and the base layer 21 are bonded together to laminate the base layer 21 and the adhesive layer 22 .

[0189] In the synthesis step, for example, an alkyl (meth)acrylate monomer and a hydroxyl group-containing (meth)acrylate monomer are radically polymerized to synthesize an acrylic polymer intermediate.

[0190] Free radical polymerization can be carried out by a common method. For example, each of the above monomers can be dissolved in a solvent and stirred while heating, and a polymerization initiator can be added to synthesize an acrylic polymer intermediate. In order to adjust the molecular weight of the acrylic polymer, polymerization can also be carried out in the presence of a chain transfer agent.

[0191] Next, a part of the hydroxyl groups of the constituent units of the hydroxyl group-containing (meth)acrylate contained in the acrylic polymer intermediate is bonded to the isocyanate groups of the isocyanate group-containing polymerizable monomer by urethanization reaction. Thus, a part of the constituent units of the hydroxyl group-containing (meth)acrylate is converted into constituent units of the polymerizable group-containing (meth)acrylate.

[0192] The urethanization reaction can be carried out by a common method. For example, the acrylic polymer intermediate and the isocyanate group-containing polymerizable monomer are stirred while heating in the presence of a solvent and a urethanization catalyst. In this way, a part of the hydroxyl group of the acrylic polymer intermediate can be urethanized with the isocyanate group of the isocyanate group-containing polymerizable monomer.

[0193] In order to efficiently carry out the urethanization reaction, the urethanization reaction may be carried out in the presence of a Sn catalyst or the like.

[0194] In the adhesive layer preparation process, for example, a liquid containing an acrylic polymer and a solvent, an isocyanate compound, and a polymerization initiator are mixed to prepare an adhesive composition. By changing the amount of the solvent, the viscosity of the composition can be adjusted. Then, the adhesive composition is applied to a release sheet. As a coating method, for example, a common coating method such as roller coating, screen coating, gravure coating, etc. is adopted. The applied composition is subjected to desolventizing treatment, curing treatment, etc., so that the applied adhesive composition is cured to make an adhesive layer 22.

[0195] The desolvation treatment can be performed under the conditions of, for example, 80° C. to 150° C. and 0.5 minute to 5 minutes.

[0196] In the lamination step, the adhesive layer 22 in a state of being overlapped with the release sheet is overlapped with the base layer 21. In addition, the release sheet may be in a state of being overlapped with the adhesive layer 22 until use.

[0197] In order to promote the reaction between the crosslinking agent and the acrylic polymer and also to promote the reaction between the crosslinking agent and the surface of the base layer 21 , an aging treatment step may be performed at 50° C. for 48 hours after the lamination step.

[0198] It should be noted that the substrate layer 21 can use commercially available films, etc., or can be made by film-forming by a common method. As a method for film-forming, for example, a calendering film-forming method, a casting method in an organic solvent, an inflation extrusion method in a closed system, a T-die extrusion method, a coextrusion method, a dry lamination method, etc. can be listed.

[0199] Through these steps, the dicing tape 20 can be manufactured.

[0200] The method for manufacturing a dicing die-bonding film (a process for manufacturing a dicing die-bonding film) includes the following steps:

[0201] a die bonding composition preparation step of preparing a die bonding composition for forming the die bonding layer 10;

[0202] a die bonding layer manufacturing step of manufacturing a die bonding layer 10 from a die bonding composition; and

[0203] In the attaching step, the die bond layer 10 is attached to the adhesive layer 22 of the dicing tape 20 manufactured as described above.

[0204] In the die-bonding composition preparation step, the die-bonding composition is prepared by mixing, for example, a resin, a filler, a curing catalyst, and a solvent, etc. The viscosity of the composition can be adjusted by changing the amount of the solvent.

[0205] In the chip bonding layer production process, for example, the resin composition prepared as described above is applied to a release sheet. There is no particular limitation on the coating method, and for example, a common coating method such as roller coating, screen coating, gravure coating, etc. can be used. Then, as needed, the coated composition is cured by desolventizing treatment, curing treatment, etc. to produce the chip bonding layer 10.

[0206] The desolvation treatment can be performed under the conditions of, for example, 70° C. to 160° C. and 1 minute to 5 minutes.

[0207] In the pasting process, the peeling sheet is peeled off from the adhesive layer 22 of the dicing tape 20 and the chip bonding layer 10, respectively, and the chip bonding layer 10 is directly contacted with the adhesive layer 22. For example, the pasting can be performed by crimping. The temperature during pasting is not particularly limited, for example, it is 30°C or more and 50°C or less, preferably 35°C or more and 45°C or less. The linear pressure during pasting is not particularly limited, preferably 0.1kgf / cm or more and 20kgf / cm or less, more preferably 1kgf / cm or more and 10kgf / cm or less.

[0208] Through these steps, the dicing die-bonding film 1 can be manufactured.

[0209] The dicing die-bonding film 1 manufactured as described above is used as an auxiliary tool for manufacturing a semiconductor integrated circuit, for example. A specific example of its use will be described below.

[0210] The method of manufacturing a semiconductor integrated circuit generally includes a step of cutting chips from a semiconductor wafer having a circuit surface formed thereon and assembling the chips.

[0211] This process includes, for example, the following processes: a half-cutting process, in which a groove is formed on the semiconductor wafer with a diamond blade in order to process the semiconductor wafer into a chip (die) by cutting, and then the semiconductor wafer is ground to reduce the thickness; a mounting process, in which one side (for example, the side opposite to the circuit side) of the semiconductor wafer (semiconductor wafer in a cuttable state) that has been half-cut is attached to the die bonding layer 10, and the semiconductor wafer is fixed to the dicing tape 20; an expansion process, in which the semiconductor wafer and the die bonding layer 10 in a cuttable state are cut, and then the interval between the semiconductor chips obtained by cutting is expanded; a picking process, in which the die bonding layer 10 is peeled off from the adhesive layer 22 and the semiconductor die is taken out in a state in which the die bonding layer 10 is attached; and a die bonding process, in which the semiconductor die in a state in which the die bonding layer 10 is attached is bonded to the adherend. When performing these processes, the dicing tape (dicing die bonding film) of this embodiment is used as a manufacturing auxiliary tool.

[0212] In the half-cutting process, Figure 2 A~ Figure 2 As shown in D, a half-cutting process for cutting a semiconductor integrated circuit into small pieces (die) is performed. Specifically, a wafer processing tape T is attached to the surface of the semiconductor wafer W that is opposite to the circuit surface. In addition, a cutting ring R is mounted on the wafer processing tape T. A groove for dividing is formed with the wafer processing tape T attached. A back grinding tape G is attached to the surface with the groove formed, and the wafer processing tape T that is initially attached is peeled off. A grinding process is performed with the back grinding tape G attached until the semiconductor wafer W reaches a specified thickness.

[0213] During the installation process, Figure 3 A~ Figure 3 As shown in FIG. 1B , after the dicing ring R is attached to the adhesive layer 22 of the dicing tape 20 , the semiconductor wafer W in a cuttable state is attached to the exposed surface of the die bonding layer 10 . Then, the back grinding tape G is peeled off from the semiconductor wafer W.

[0214] In the expansion process, Figure 4 A~ Figure 4 As shown in C, the cutting ring R is fixed to the retaining member H of the expansion device. The lifting member U of the expansion device is lifted from the lower side of the cut chip bonding film 1, thereby stretching the cut chip bonding film 1 at a low temperature so that it is expanded in the surface direction (cold expansion process). In this way, the semiconductor wafer W and the chip bonding layer 10 in a state that can be cut are cut. The temperature conditions of the cold expansion process are, for example, -20 to 5°C, preferably -15 to 0°C, and more preferably -10 to -5°C. The lifting member U is lowered to release the expanded state. Furthermore, in the expansion process, as Figure 5 A~ Figure 5 As shown in B, the dicing tape 20 is stretched under a higher temperature condition (e.g., 10°C or higher) than the cold expansion process to expand the area (thermal expansion process). As a result, the adjacent semiconductor chips C are separated in the film surface direction and the interval is further expanded.

[0215] During the picking process, Figure 6 As shown, the semiconductor chip C with the die bonding layer 10 attached thereto is peeled off from the adhesive layer of the dicing tape 20. Specifically, the pin member P is raised to lift up the semiconductor chip to be picked up through the dicing tape 20. The lifted semiconductor chip is held by a suction jig J.

[0216] In the die bonding step, the semiconductor chip with the die bonding layer 10 attached thereto is bonded to an adherend.

[0217] The matters disclosed in this specification include the following matters. (1)

[0219] A dicing tape comprising: a base layer, and an adhesive layer laminated on the base layer.

[0220] The adhesive layer contains an ultraviolet curable polymer having a polymerizable unsaturated bond.

[0221] The pressure-sensitive adhesive layer has a calorific value per unit mass in differential scanning calorimetry of ultraviolet curing of 19 mJ / mg or more. (2)

[0223] The dicing tape according to (1) above, wherein the value of the peak top per unit mass of the exothermic peak in the differential scanning calorimetry exceeds 0.7 mW / mg,

[0224] The time from the start of ultraviolet irradiation to reaching the peak top in the differential scanning calorimetry is 1.0 minute or less. (3)

[0226] The dicing tape according to (1) or (2), wherein a 180° peel strength between the adhesive layer and the SUS plate when the SUS plate is bonded to the adhesive layer is 0.30 N / 20 mm or more. (4)

[0228] The dicing tape according to any one of (1) to (3) above, wherein a 180° peel strength between the adhesive layer and the SUS plate after a SUS plate is bonded to the adhesive layer and the adhesive layer is irradiated with ultraviolet rays is less than 0.20 N / 20 mm. (5)

[0230] The dicing tape according to any one of (1) to (4) above, wherein a 180° peel strength between the adhesive layer and the SUS plate when the SUS plate is bonded to the adhesive layer satisfies the following formula (1).

[0231] The aforementioned 180° peel strength after ultraviolet irradiation / the aforementioned 180° peel strength before ultraviolet irradiation < 0.28··· (1) (6)

[0233] The dicing tape according to any one of (1) to (5) above, wherein the polymerizable polymer includes a polymerizable acrylic polymer. (7)

[0235] A dicing die-bonding film comprising: the dicing tape according to any one of (1) to (6) above; and a die-bonding layer laminated on the adhesive layer of the dicing tape.

[0236] It should be noted that the dicing tape and dicing die bonding film of the present invention are not limited to the above-mentioned embodiments. In addition, the dicing tape and dicing die bonding film of the present invention are not limited by the above-mentioned effects. Furthermore, the dicing tape and dicing die bonding film of the present invention can be variously modified within the scope of the present invention.

[0237] For example, in this embodiment, a semiconductor wafer in a cuttable state is used as a semiconductor wafer attached to the chip bonding layer, and in the cold expansion process, the semiconductor wafer in a cuttable state and the chip bonding layer are cut. However, in the present invention, a cut semiconductor wafer can also be used as a semiconductor wafer attached to the chip bonding layer, and only the chip bonding layer is cut in the cold expansion process.

[0238] It should be noted that in the case where the semiconductor wafer and the chip bonding layer are cut together in the cold expansion process, the cutting tape must be stretched more in the expansion process (cold expansion process and hot expansion process) compared to the case where only the chip bonding layer is cut, so it is easy to exert the effect of the present invention.

[0239] In addition, in the present invention, by irradiating the pre-slicing lines in the semiconductor wafer with laser light, a modified region (fragile region) is formed in the semiconductor wafer, thereby obtaining the semiconductor wafer in the above-mentioned divisible state.

[0240] Example

[0241] Next, the present invention will be described in more detail with reference to Examples and Comparative Examples.

[0242] The dicing tape was produced as follows. Also, a dicing die-bonding film was produced using the dicing tape.

[0243] <(Meth)acrylic monomer>

[0244] "1st Synthesis Stage"

[0245] Hydroxyl-containing acrylate monomer: 2-hydroxyethyl acrylate (HEA)

[0246] Alkyl acrylate monomer: ethyl acrylate (EA)

[0247] Alkyl acrylate monomer: Butyl acrylate (BA)

[0248] Alkyl acrylate monomer: 2-ethylhexyl acrylate (2EHA)

[0249] Alkyl acrylate monomer: isononyl acrylate (INA)

[0250] Alkyl acrylate monomer: lauryl acrylate (LA)

[0251] Acrylate monomer: 4-acryloyl moropholine (product name "ACMO")

[0252] "Second Synthesis Stage"

[0253] Polymerizable acrylic ester monomer: 2-isocyanatoethylmethacrylate (product name "MOI")

[0254] <Raw materials for cutting tape>

[0255] Adhesive layer

[0256] The aforementioned (meth)acrylic monomer

[0257] Thermal polymerization initiator: azobisisobutyronitrile (AIBN)

[0258] Organic solvent: ethyl acetate

[0259] Organic solvent: Toluene

[0260] Isocyanate compounds:

[0261] Toluene diisocyanate trimethylolpropane adduct in ethyl acetate

[0262] (Product name: "CORONATE L", manufactured by Tosoh Corporation)

[0263] Photopolymerization initiator (product name: "Omnirad 127" manufactured by IGM Resins)

[0264] Photopolymerization initiator (product name: "Omnirad 2959" manufactured by IGM Resins)

[0265] (Example 1)

[0266] After synthesizing an acrylic polymer intermediate as follows, an acrylic polymer is synthesized from the acrylic polymer intermediate. The synthesized acrylic polymer is used to prepare a pressure-sensitive adhesive layer to produce a dicing tape.

[0267] <First Synthesis Stage: Synthesis of Acrylic Polymer Intermediate>

[0268] A polymerization experimental apparatus was prepared in which a 1 L round-bottom separable flask (hereinafter also referred to as "flask") was equipped with a separable lid, a separatory funnel, a thermometer, a nitrogen inlet tube, a Liebig condenser, a vacuum seal, a stirring rod, and a stirring blade.

[0269] Next, the (meth)acrylic monomers in Table 1 below were added to the flask at the formulation ratios in Table 1 below, and a thermal polymerization initiator (0.2 parts by mass relative to 100 parts by mass of the polymerizable (meth)acrylic monomers used in the first synthesis stage) and ethyl acetate were added to obtain a mixture (the content ratio of ethyl acetate relative to the total (100% by mass) of the (meth)acrylic monomers and ethyl acetate used in the first synthesis stage: 38% by mass), and the mixture was stirred at 62° C. for 6 hours in a nitrogen gas stream (polymerization treatment) to obtain a solution containing an acrylic polymer intermediate.

[0270] <Second Synthesis Stage: Synthesis of Acrylic Polymer>

[0271] The (meth)acrylic monomers listed in Table 1 below were added to a solution containing an acrylic polymer intermediate at the formulation ratios listed in Table 1 below, and dibutyltin dilaurate (0.07 parts by mass relative to 100 parts by mass of the (meth)acrylic monomers used in the first synthesis stage) was added to obtain a mixture, and the mixture was stirred at 50° C. for 12 hours in a stream of air (addition reaction treatment) to prepare a solution containing an acrylic polymer.

[0272] <Preparation of Adhesive Layer Composition>

[0273] A crosslinking agent and a photopolymerization initiator in amounts shown in Table 2 below were mixed with a solution containing an acrylic polymer in an amount of 100 parts by mass of the acrylic polymer (solid content of the adhesive layer composition) to prepare an adhesive layer composition.

[0274] <Preparation of Adhesive Layer>

[0275] A PET film was prepared as a release sheet. One side of the film was subjected to a release treatment with silicone. The adhesive layer composition prepared as described above was applied to the release sheet. The applied composition was heated (dried) at 120° C. for 2 minutes on the release sheet to prepare an adhesive layer with a thickness of 10 μm.

[0276] <Production of cutting tape>

[0277] The adhesive layer was laminated with the release sheet and attached to the corona-treated surface of the substrate layer (polyolefin film (product name: "FUNCRARE NED#125" manufactured by Gunze Limited), thickness: 125 μm) without introducing air bubbles, and heated (dried) at 50° C. for 24 hours to prepare a dicing tape.

[0278] <Production of Die-Bond Film>

[0279] Using the following raw materials, a die-bonding film was produced as follows.

[0280] Acrylic resin: 100 parts by mass

[0281] (Product name: "TEISAN RESIN SG-P3", manufactured by Nagase ChemteX Corporation, glass transition temperature: 12°C, contains epoxy groups)

[0282] Phenolic resin: 12 parts by mass

[0283] (Product name: "MEH-7851ss", manufactured by Meiwa Chemicals Co., Ltd., biphenyl novolac resin)

[0284] Spherical silica: 100 parts by mass

[0285] (Product name: "SO-25R", manufactured by ADMATECHS CO., LTD., average particle size: 500 μm)

[0286] The above raw materials and methyl ethyl ketone were mixed to prepare a resin composition having a solid content concentration of 20% by mass.

[0287] A PET film was prepared as a release sheet. One side of the film was subjected to a silicone release treatment. The resin composition was applied to the release-treated surface of the release sheet, and the solvent was evaporated by heating at 130° C. for 2 minutes to prepare a 10 μm thick die bonding film on the release sheet.

[0288] <Production of Dicing Die Bonding Film>

[0289] The die-bonding film is laminated on the pressure-sensitive adhesive layer of the dicing tape to prepare a dicing die-bonding film having a die-bonding layer.

[0290] (Examples 2 and 3)

[0291] A dicing tape and a dicing die-bonding film were prepared in the same manner as in Example 1 except that the (meth)acrylic monomer was used as the formulation shown in Table 1 below.

[0292] (Example 4)

[0293] A dicing tape and a dicing die-bonding film were prepared in the same manner as in Example 1 except that the (meth)acrylic monomer had the formulation shown in Table 1 below and the amount of dibutyltin dilaurate was 0.13 parts by mass based on 100 parts by mass of the (meth)acrylic monomer used in the first synthesis stage.

[0294] (Example 5)

[0295] A dicing tape and a dicing die-bonding film were prepared in the same manner as in Example 1 except that the (meth)acrylic monomer was set to the formulation shown in Table 1 below, the stirring time at 62° C. in the first synthesis stage was set to 8 hours, and the crosslinking agent was set to the formulation ratio shown in Table 2 below.

[0296] (Example 6)

[0297] A dicing tape and a dicing die-bonding film were prepared in the same manner as in Example 1, except that the (meth)acrylic monomer was made into the formulation of Table 1 below and the photopolymerization initiator of Table 2 below was used.

[0298] (Comparative Example 1)

[0299] A dicing tape and a dicing die-bonding film were prepared in the same manner as in Example 1 except that the (meth)acrylic monomer had the formulation shown in Table 1 below and the amount of dibutyltin dilaurate was 0.04 parts by mass based on 100 parts by mass of the (meth)acrylic monomer used in the first synthesis stage.

[0300] (Comparative Example 2)

[0301] A dicing tape and a dicing die-bonding film were prepared in the same manner as in Example 1 except that the (meth)acrylic monomer had the formulation shown in Table 1 below and the amount of dibutyltin dilaurate was 0.02 parts by mass based on 100 parts by mass of the (meth)acrylic monomer used in the first synthesis stage.

[0302] [Table 1]

[0303]

[0304] [Table 2]

[0305]

[0306] (DSC curve)

[0307] Only the adhesive layer of the dicing tape was taken out, and the adhesive layer was cured by ultraviolet rays using the following ultraviolet irradiation device and the following measuring device, and the heat of reaction was measured.

[0308] <Ultraviolet irradiation device>

[0309] Ultraviolet irradiation light source device PDC-121 (manufactured by Yamashita Denso Co., Ltd.)

[0310] Lamp: Mercury xenon lamp (Hg-Xe200W)

[0311] Interference filter: Not used

[0312] Emission wavelength: 250nm~500nm

[0313] <Measurement Device>

[0314] EXSTAR6000 (manufactured by SII NanoTechnology Inc.)

[0315] <Measurement method>

[0316] A pan containing a sample (adhesive layer) and an empty reference pan are placed in a measuring device, and isothermal setting is performed to achieve a set atmospheric temperature (25° C.). After the temperature and heat are stabilized, measurement of the sample is started.

[0317] The sample measurement was performed according to the following procedure.

[0318] Step 1: Set the atmosphere temperature to 25°C and 0.2 minutes

[0319] Step 2: Set the ambient temperature to 25°C and irradiate with ultraviolet light (ultraviolet light intensity: 70 mW / cm 2 ), 10 minutes

[0320] Step 3: Set the atmosphere temperature to 25°C and 0.2 minutes

[0321] After the sample is measured, isothermal setting is performed directly without taking out the sample, and reference measurement is started after the temperature and heat are stabilized.

[0322] The reference measurement was performed according to the following steps.

[0323] Step 1: Set the atmosphere temperature to 25°C and 0.2 minutes

[0324] Step 2: Set the ambient temperature to 25°C and irradiate with ultraviolet light (ultraviolet light intensity: 70 mW / cm 2 ), 10 minutes

[0325] Step 3: Set the atmosphere temperature to 25°C and 0.2 minutes

[0326] In addition, the measurement of a sample and the measurement of a reference were performed in a nitrogen atmosphere while supplying nitrogen gas.

[0327] In addition, the ultraviolet rays were irradiated in a manner that the ultraviolet rays were approximately perpendicular to the surface of the adhesive layer. That is, the ultraviolet rays were irradiated at an intensity of 70 mW / cm 2 Exposure to ultraviolet light.

[0328] <Analysis method>

[0329] The parameters in Table 3 were obtained using the above measurement results.

[0330] Specifically, first, on the software DSC SUB of EXSTAR6000, the reference measurement data is subtracted from the sample measurement data to obtain the calorific value data (DSC curve (horizontal axis: time, vertical axis: calorific value per unit time)) of the sample only.

[0331] Then, the subtracted DSC curve was analyzed using the Muse Jobs software to determine the calorific value per unit mass (mJ / mg) in the differential scanning calorimetry of the ultraviolet curing of the aforementioned adhesive layer, the value of the peak top per unit mass of the exothermic peak in the differential scanning calorimetry (mW / mg), and the time (minutes) from the start of ultraviolet irradiation to the aforementioned peak top in the differential scanning calorimetry.

[0332] The parameters are shown in Table 3 below.

[0333] It should be noted that the calorific value adopts the integral value of the heat generation per unit time from the start of the curing reaction to the end of the curing reaction in the DSC curve. In addition, the curing reaction start is set as the rising part of the peak after the ultraviolet irradiation in the DSC curve, and the curing reaction ends as the part where the reaction heat almost disappears. And then, the value of the peak top per unit mass of the heat peak refers to the value of the peak top of the heat generation per unit mass and unit time of the DSC curve.

[0334] (180° peel strength between adhesive layer and SUS plate before UV curing)

[0335] Use a cutting knife to cut the cutting tape into strips with a length of 100 mm and a width of 20 mm.

[0336] In addition, the SUS304BA plate having a larger size than the cut band was ultrasonically cleaned with toluene and naturally dried.

[0337] Next, the adhesive layer side of the cut diced tape was bonded to the naturally dried SUS304BA plate using a hand roller (2 kg) to obtain a laminated body. It should be noted that bubbles were not allowed to mix between the adhesive layer and the SUS304BA plate at this time.

[0338] Then, the laminate was stored at room temperature for 30 minutes.

[0339] Next, the 180° peel strength between the adhesive layer and the SUS plate (hereinafter also referred to as “peel strength before ultraviolet curing”) was measured using the laminate and a tensile tester (AUTOGRAPH AG-IS manufactured by SHIMADZU CORPORATION).

[0340] The measurement conditions were as follows: the temperature was 23° C., the speed was 300 mm / min, and the measurement was performed until the stroke reached 50 mm to 80 mm.

[0341] The measured values ​​are shown in Table 3 below.

[0342] (180° peel strength between UV-cured adhesive layer and SUS plate)

[0343] After 30 minutes of storage at room temperature and before the measurement of peel strength, the samples were irradiated with ultraviolet light using an ultraviolet irradiation device (UM-810 manufactured by Nitto Seiki Co., Ltd., light source: high pressure mercury lamp, ultraviolet irradiation intensity: 65 mW / cm 2 ) The laminate was irradiated with ultraviolet rays from the cutting tape side, and the 180° peel strength between the adhesive layer and the SUS plate was measured by the same method as the method described in the above-mentioned “(180° peel strength between the adhesive layer and the SUS plate before ultraviolet curing)” (hereinafter also referred to as “peel strength after ultraviolet curing”).

[0344] It should be noted that the ultraviolet irradiation was performed until the adhesive layer was sufficiently cured (irradiation dose: 300 mJ / cm 2 ).

[0345] The measured values ​​are shown in Table 3 below.

[0346] (Retention evaluation test)

[0347] A back grinding tape was attached to a semiconductor wafer (300 mmφ) pre-processed by laser so as to expand the size to 10 mm×10 mm, and the semiconductor wafer was ground to obtain a semiconductor wafer with a thickness of 30 μm.

[0348] Next, a semiconductor wafer having a thickness of 30 μm and the die bonding layer of the dicing die bonding film were stacked and bonded together by heating at 50 to 80° C., thereby obtaining a dicing die bonding film with a semiconductor wafer.

[0349] The semiconductor wafer and the die-bonding layer were cut using a die separation apparatus DDS2300 manufactured by DISCO Corporation with the dicing die-bonding film attached to the semiconductor wafer, and the dicing tape was thermally shrunk.

[0350] Specifically, first, a dicing die-bonding film with a semiconductor wafer is held on a dicing ring.

[0351] Then, cold expansion was performed by a cold expansion unit at an expansion temperature of -15°C, an expansion speed of 200 mm / sec, and an expansion distance of 11 mm to cut the semiconductor wafer and the die bonding layer to obtain a semiconductor chip with a die bonding film.

[0352] Next, the thermal expansion unit was used to expand the semiconductor chip at room temperature at an expansion speed of 1 mm / sec and an expansion distance of 7 mm. Then, the dicing tape at the periphery of the semiconductor chip was thermally shrunk while maintaining the expansion state at a heating temperature of 200°C, an air volume of 40 L / min, a heating distance of 20 mm and a rotation speed of 3° / sec.

[0353] The semiconductor chip with the die-bonding film was observed from the dicing tape side in a state where the dicing die-bonding film was held on the dicing ring, and the holding property was evaluated based on the following evaluation criteria.

[0354] ○: No semiconductor chip with die-bonding film was observed to float significantly from the dicing tape.

[0355] ×: Case where the semiconductor chip with a die-bonding film was observed to have been significantly lifted off from the dicing tape. The results are shown in Table 3 below.

[0356] (Pickup evaluation test)

[0357] After the heat shrinkage in the above-mentioned "(Retention Evaluation Test)", the dicing tape was irradiated with ultraviolet light (irradiation dose: 300 mJ / cm 2 ) to allow the adhesive layer to fully cure, and then leave it at room temperature for 1 day.

[0358] Then, the samples were picked up using a die bonder SPA-300 (manufactured by Shinkawa Corporation) under the following conditions, and the pickup properties were evaluated according to the following evaluation criteria.

[0359] Pickup Condition

[0360] Number of pins: 5

[0361] Lifting speed: 1mm / sec

[0362] Pickup height: 350μm

[0363] Number of semiconductor chips with die-bonding films to be picked up and evaluated: 50

[0364] “Evaluation Benchmarks”

[0365] ◎: When the pickup success rate is 100%

[0366] ○: When the pickup success rate is 90% or more but less than 100%

[0367] ×: When the pickup success rate is less than 90%

[0368] The results are shown in Table 3 below.

[0369] [Table 3]

[0370]

[0371] As shown in Table 3, Examples 1 to 6 were superior in holding properties and pickup properties compared to Comparative Examples 1 and 2 in which the calorific value per unit mass was 18 mJ / mg or less.

[0372] Therefore, it is understood that according to the present invention, a dicing tape and a dicing die-bonding film which can suppress floating and have excellent pickup properties can be provided.

Claims

1. A dicing tape comprising: a base layer, and an adhesive layer laminated on the base layer, The adhesive layer contains an ultraviolet curable polymer having a polymerizable unsaturated bond, wherein the polymerizable polymer is a polymerizable acrylic polymer composed of a constituent unit of an alkyl (meth)acrylate, a constituent unit of a hydroxyl group-containing (meth)acrylate, and a constituent unit of a (meth)acrylate containing a polymerizable group. The structural unit of the alkyl (meth)acrylate contains the structural unit of isononyl (meth)acrylate or the polymerizable polymer contains the structural unit of 4-acryloylmorpholine, The calorific value per unit mass in differential scanning calorimetry of ultraviolet curing of the adhesive layer is 19 mJ / mg or more, The peak top value per unit mass of the exothermic peak in the differential scanning calorimetry exceeds 0.7 mW / mg, The time from the start of ultraviolet irradiation to reaching the peak top in the differential scanning calorimetry is 1.0 minute or less.

2. The cutting tape according to claim 1, wherein: When a SUS plate is bonded to the adhesive layer, a 180° peel strength between the adhesive layer and the SUS plate is 0.30 N / 20 mm or more.

3. The cutting tape according to claim 1 or 2, wherein: After a SUS plate was attached to the adhesive layer and the adhesive layer was irradiated with ultraviolet rays, the 180° peel strength between the adhesive layer and the SUS plate was less than 0.20 N / 20 mm.

4. The cutting tape according to claim 1 or 2, wherein: When a SUS plate is bonded to the adhesive layer, the 180° peel strength between the adhesive layer and the SUS plate satisfies the following formula (1): The 180° peel strength after ultraviolet irradiation / the 180° peel strength before ultraviolet irradiation<0.28···(1). 5 . A dicing die-bonding film comprising: the dicing tape according to claim 1 ; and a die-bonding layer laminated on the adhesive layer of the dicing tape.

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