A dual-loop tower-type radio frequency connection spring with variable design height

Abstract

The present invention belongs to the field of wireless communication technology, and relates to a dual-loop tower-type RF connection spring with a variable design height, the dual-loop tower-type RF connection spring with a variable design height comprises a support portion, a first buffer portion, a second buffer portion, a first connection portion, and a second connection portion, the first buffer portion and the second buffer portion are respectively arranged at two opposite ends of the support portion, the first buffer portion and the second buffer portion are elastic portions; the first connection portion is arranged at one end of the first buffer portion away from the support portion, and the first connection portion is provided with a first connection hole; the second connection portion is arranged at one end of the second buffer portion away from the support portion, and the second connection portion is provided with a second connection hole. The present invention adopts a double buffer portion structure, which can make the connection between the PCB board and the antenna carrier more stable, and ensure the stability of the electrical performance of the RF connection of the RF antenna.

Description

Technical Field

[0001] The invention relates to the technical field of wireless communication, and more particularly to a double-loop tower-shaped radio frequency connection spring with a variable design height. Background Art

[0002] With the continuous update and development of wireless communication terminal equipment, the appearance of communication terminal equipment is becoming more and more fashionable, and the size is becoming smaller and smaller, resulting in a complex and narrow internal structure space of the equipment. At present, in the field of RF antennas, there are phenomena such as unstable RF performance of RF antennas and difficult structure selection. The traditional POGO PIN (POGO PIN is a precision connector used in electronic products such as mobile phones. It is widely used in semiconductor equipment and plays a connecting role) RF antenna ejector pin has an internal spring structure, and the RF model changes greatly after compression, affecting the stability of RF performance; the traditional O-type spring clip is limited by the structure and cannot meet the connection requirements of a larger height. At the same time, the spring clip structure is complex and the mold punching and forming process is complex, resulting in a high defect rate and other comprehensive cost increases.

[0003] Therefore, the current RF antenna still has technical problems such as low compatibility with wireless communication terminal equipment due to the lack of higher connection spring selection and unstable RF connection electrical performance. Summary of the invention

[0004] One object of the present invention is to provide a radio frequency connecting spring, which solves the technical problem that the existing radio frequency connecting springs have low compatibility with wireless communication terminal equipment due to the lack of higher connecting spring selection.

[0005] The technical solution of the present invention is achieved in this way:

[0006] A double-loop tower-shaped RF connection spring with a variable design height comprises a support portion, a first buffer portion, a second buffer portion, a first connection portion and a second connection portion, wherein the first buffer portion and the second buffer portion are respectively arranged at opposite ends of the support portion, and the first buffer portion and the second buffer portion are elastic portions; the first connection portion is arranged at an end of the first buffer portion away from the support portion, and the first connection portion is provided with a first connection hole; the second connection portion is arranged at an end of the second buffer portion away from the support portion, and the second connection portion is provided with a second connection hole.

[0007] As a preferred embodiment, the first buffer portion and the second buffer portion are both corrugated, and the first buffer portion and the second buffer portion are axially symmetrically arranged with respect to the central axis of the support portion.

[0008] As a preferred implementation, the distance between the first buffer portion and the second buffer portion gradually increases from the supporting portion toward the first connecting portion.

[0009] As a preferred embodiment, the wave pitch of the first buffer portion gradually increases from the supporting portion toward the first connecting portion, and the wave pitch of the second buffer portion gradually increases from the supporting portion toward the second connecting portion.

[0010] As a preferred embodiment, one end of the first connection portion away from the first buffer portion is arranged opposite to one end of the second connection portion away from the second buffer portion.

[0011] As a preferred embodiment, the support portion is provided with a support protrusion.

[0012] As a preferred embodiment, the dual-loop tower-shaped RF connection spring with variable design height includes a metal integrally formed part.

[0013] As a preferred embodiment, the dual-loop tower-type RF connection spring with variable design height includes a stainless steel elastic plate, a phosphor bronze elastic plate, a beryllium copper elastic plate or a nickel silver elastic plate.

[0014] As a preferred embodiment, a coating layer is provided on the surface of the dual-loop tower-shaped RF connection spring with variable design height.

[0015] The technical solution of the present invention is achieved in this way:

[0016] After adopting the above technical solution, the beneficial effects of the present invention are:

[0017] First, the first buffer portion and the second buffer portion can undergo elastic deformation and be compressed, so that the RF antenna can be installed on wireless communication terminals of different models with high compatibility. The present invention adopts a double buffer portion structure, which can make the connection between the PCB board and the antenna carrier more stable, ensuring the stability of the electrical performance of the RF connection of the RF antenna. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the scheme of the present invention, the following is a brief introduction to the drawings required for the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. Among them:

[0019] Figure 1 is a schematic diagram of the use status of an embodiment of the present invention;

[0020] Figure 2 yes Figure 1 Schematic diagram of the structure of the RF connection spring with variable design height in the medium double-loop tower type.

[0021] In the figure, 10, a dual-loop tower-type RF connection spring with a variable design height; 11, a supporting portion; 12, a first buffer portion; 13, a second buffer portion; 14, a first connecting portion; 15, a second connecting portion; 16, a first connecting hole; 17, a second connecting hole; 18, a supporting protrusion; 20, a PCB board; 30, an antenna carrier. DETAILED DESCRIPTION

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field of the present invention; the terms used in this specification are only for the purpose of describing specific embodiments and are not intended to limit the present invention. For example, the directions or positions indicated by the terms "length", "width", "up", "down", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the directions or positions shown in the drawings, which are only for the convenience of description and should not be understood as limitations on the present technical solution.

[0023] The terms "including" and "having" and any variations thereof in the specification and claims of the present invention and the above-mentioned drawings are intended to cover non-exclusive inclusions; the terms "first", "second", etc. in the specification and claims of the present invention or the above-mentioned drawings are used to distinguish different objects rather than to describe a specific order. "Multiple" means two or more, unless otherwise clearly and specifically defined.

[0024] In the specification and claims of the present invention and the above-mentioned drawings, when an element is referred to as being "fixed to" or "mounted on" or "disposed on" or "connected to" another element, it may be directly or indirectly located on the other element. For example, when an element is referred to as being "connected to" another element, it may be directly or indirectly connected to the other element.

[0025] In addition, reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0026] Example:

[0027] like Figure 1 As shown, a radio frequency connecting spring piece 10 is used to connect a PCB board 20, an antenna carrier 30 and the PCB board 20.

[0028] like Figure 1 and Figure 2As shown, the double-loop tower-type RF connection spring piece 10 with variable design height includes a support portion 11, a first buffer portion 12, a second buffer portion 13, a first connection portion 14 and a second connection portion 15. The first buffer portion 12 and the second buffer portion 13 are respectively arranged at two opposite ends of the support portion 11, and the first buffer portion 12 and the second buffer portion 13 are elastic portions; the first connection portion 14 is arranged at one end of the first buffer portion 12 away from the support portion 11, and the first connection portion 14 is provided with a first connection hole 16; the second connection portion 15 is arranged at one end of the second buffer portion 13 away from the support portion 11, and the second connection portion 15 is provided with a second connection hole 17. Specifically, the first connection portion 14 and the second connection portion 15 are connected to the PCB board 20, and the antenna carrier 30 is connected to the support portion 11. The first buffer portion 12 and the second buffer portion 13 can be elastically deformed and compressed, so that the RF antenna can be installed on wireless communication terminals of different models, and the compatibility is high. The present invention adopts a double buffer structure, which can make the connection between the PCB board 20 and the antenna carrier 30 more stable, and ensure the stability of the radio frequency connection electrical performance of the radio frequency antenna.

[0029] In this embodiment, the first buffer portion 12 and the second buffer portion 13 are both corrugated, and the first buffer portion 12 and the second buffer portion 13 are arranged axially symmetrically with the central axis of the support portion 11. Specifically, the distance between the first buffer portion 12 and the second buffer portion 13 gradually increases from the support portion 11 to the first connection portion 14. The wave pitch of the first buffer portion 12 gradually increases from the support portion 11 to the first connection portion 14, and the wave pitch of the second buffer portion 13 gradually increases from the support portion 11 to the second connection portion 15. Compared with the O-type spring piece limited by the structure, the dual-loop tower-type variable-design-height RF connection spring piece 10 has a simple structure, is convenient for mold punching and forming, can ensure production yield, reduce comprehensive costs, can meet the connection requirements of a larger height, can perfectly solve the low impedance, high elasticity, and high stability of RF performance, can freely adjust the design height to meet different structural space requirements, and has a relatively simple structure. At the same time, the dual-loop tower-type variable-design-height RF connection spring piece 10 can increase or decrease the number of buffer steps according to the design to achieve more choices of RF connection spring piece height.

[0030] like Figure 2 As shown, one end of the first connection portion 14 away from the first buffer portion 12 is arranged opposite to one end of the second connection portion 15 away from the second buffer portion 13. Specifically, the first connection portion 14 and the second connection portion 15 are located inside the first buffer portion 12 and the second buffer portion 13, which can reduce the space occupied by the double-loop tower-type variable-height RF connection spring 10 and facilitate installation.

[0031] Preferably, the support portion 11 is provided with a support protrusion 18 , which can facilitate the installation of the antenna carrier 30 .

[0032] In this embodiment, the dual-circuit tower-type variable-design-height RF connection spring 10 includes a metal integrally formed part. Specifically, a stainless steel elastic plate is used for stamping, which has high structural strength, simple production process, and low cost. In other embodiments, the dual-circuit tower-type variable-design-height RF connection spring 10 can be made of a phosphor bronze elastic plate, a beryllium copper elastic plate, or a nickel silver elastic plate.

[0033] Preferably, in order to improve the service life of the dual-loop tower type variable design height RF connection spring clip 10, a coating layer is provided on the surface of the dual-loop tower type variable design height RF connection spring clip 10. Specifically, the surface of the dual-loop tower type variable design height RF connection spring clip 10 can be surface treated by gold plating, nickel plating or the like.

[0034] To sum up, the first connecting part 14 and the second connecting part 15 are connected to the PCB board 20, the antenna carrier 30 is connected to the supporting part 11, and the first buffer part 12 and the second buffer part 13 can be elastically deformed and compressed, so that the RF antenna can be installed on wireless communication terminals of different models, and the compatibility is relatively high; the present invention adopts a double buffer structure, which can make the connection between the PCB board 20 and the antenna carrier 30 more stable, and ensure the stability of the RF connection electrical performance of the RF antenna; compared with the O-type spring clip which is limited by the structure, the double-loop tower-shaped RF connection spring clip 10 with variable design height has a simple structure, is convenient for mold punching and forming, can ensure production yield, reduce comprehensive costs, can meet the connection requirements of higher height, can perfectly solve the low impedance, high elasticity and high stability of RF performance, can freely adjust the design height to meet different structural space requirements, and has a relatively simple structure.

[0035] The first connecting portion and the second connecting portion are connected to the PCB board, and the antenna carrier is connected to the supporting portion.

[0036] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A dual-loop tower-type RF connection spring with variable design height, characterized in that: The invention comprises a supporting part, a first buffer part, a second buffer part, a first connecting part and a second connecting part, wherein the first buffer part and the second buffer part are respectively arranged at two opposite ends of the supporting part, and the first buffer part and the second buffer part are elastic parts; the first connecting part is arranged at one end of the first buffer part away from the supporting part, and the first connecting part is provided with a first connecting hole; the second connecting part is arranged at one end of the second buffer part away from the supporting part, and the second connecting part is provided with a second connecting hole; the first connecting part and the second connecting part are used to connect a PCB board; Wherein, the first buffer portion and the second buffer portion are both in a corrugated shape, and the first buffer portion and the second buffer portion are axially symmetrically arranged with respect to the central axis of the support portion; The distance between the first buffer portion and the second buffer portion gradually increases from the supporting portion toward the first connecting portion; One end of the first connection portion away from the first buffer portion is arranged opposite to one end of the second connection portion away from the second buffer portion.

2. The double-loop tower-shaped RF connection spring with variable design height according to claim 1, characterized in that: The wave pitch of the first buffer portion gradually increases from the supporting portion toward the first connecting portion, and the wave pitch of the second buffer portion gradually increases from the supporting portion toward the second connecting portion.

3. The double-loop tower-shaped RF connection spring with variable design height according to claim 1, characterized in that: The supporting portion is provided with a supporting protrusion.

4. A dual-circuit tower-shaped RF connection spring with variable design height according to any one of claims 1 to 3, characterized in that: The dual-loop tower-shaped radio frequency connection spring with variable design height comprises a metal integrally formed part.

5. The double-loop tower-shaped RF connection spring with variable design height according to claim 4, characterized in that: The double-loop tower-shaped radio frequency connection spring with variable design height comprises a stainless steel elastic plate, a phosphor bronze elastic plate, a beryllium copper elastic plate or a nickel silver elastic plate.

6. The double-loop tower-shaped RF connection spring with variable design height according to claim 5, characterized in that: The surface of the double-loop tower-shaped radio frequency connection spring with variable design height is provided with a coating layer.

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