Display device and method of manufacturing the same

Abstract

The present application relates to a display device comprising a display member comprising a first zone, a second zone and a third zone defined between the first zone and the second zone; a first coating disposed on a first surface of the first zone of the display member; and a second coating disposed on a first surface of the second zone of the display member, wherein a first modulus of the first coating is less than a second modulus of the second coating.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2019-0082192, filed on July 8, 2019, and all benefits derived from said patent application, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] This disclosure relates to a display device and a method of manufacturing the display device. Background Technology

[0003] Electronic devices that provide images to users (such as smartphones, tablet PCs, digital cameras, laptops, navigation systems, and smart TVs) may include display devices for displaying images. Display devices may include display panels that generate and display images, as well as various input devices.

[0004] Furthermore, flexible display devices, including display units, signal wiring, etc., on flexible substrates (such as plastic) made of flexible materials, and thus capable of displaying images even when bent like paper, are attracting attention as the next generation of display devices.

[0005] Such flexible display devices are being used in a variety of devices (from computer monitors and televisions to personal portable devices), and research is underway on flexible display devices with wide display areas and reduced size and weight. Summary of the Invention

[0006] A flexible display device may include a flat portion and a curved portion disposed between the flat portions. In the flat portion, a compensating member supporting a display component including pixels may be disposed on the lower surface of the display component. Depending on the strength and physical properties of the compensating member, poor bonding may occur during the attachment of a driver chip to the upper surface of the display component.

[0007] The embodiments of this disclosure provide a display device with improved driver chip bonding.

[0008] According to an embodiment of this disclosure, a display device includes: a display member including a first region, a second region, and a third region defined between the first region and the second region; a first coating disposed on a first surface of the first region of the display member; and a second coating disposed on the first surface of the second region of the display member, wherein the first coating has a first modulus, and the second coating has a second modulus greater than the first modulus.

[0009] In an implementation, each of the first coating and the second coating may contain a cured resin, and the second coating may further contain a first material.

[0010] In an embodiment, the first material may comprise at least one material selected from acrylic organic materials and polycarbonate (“PC”).

[0011] In the implementation scheme, the first material may include inorganic materials.

[0012] In the implementation scheme, the inorganic material may include metal oxides or non-metal oxides.

[0013] In one embodiment, the second region of the display component may include a first pad region and a second pad region, the first pad region may be disposed between the third region and the second pad region, a driver chip is attached to a second surface of the first pad region, and a circuit board is attached to a second surface of the second pad region.

[0014] In an implementation, the display device may further include a first pad disposed on the second surface of the first pad area and a second pad disposed on the second surface of the second pad area, wherein the driver chip is coupled to the first pad and the circuit board is coupled to the second pad.

[0015] In an implementation scheme, the display device may further include a first anisotropic conductive film disposed between the first pad and the driver chip, and a second anisotropic conductive film disposed between the second pad and the circuit board.

[0016] In one embodiment, each of the first coating and the second coating may be directly applied to the first surface of the display component.

[0017] In one implementation, the thickness of the first coating may be greater than the thickness of the second coating.

[0018] In an embodiment, the display device may further include a third coating disposed between the second coating and the first surface of the display member, wherein the third coating has a third modulus smaller than the second modulus of the second coating.

[0019] In an implementation, the third coating and the first coating may comprise the same material as each other.

[0020] In an embodiment, the display device may further include a third coating disposed on a first surface of the third region of the display member, wherein the third coating has a third modulus smaller than the second modulus of the second coating.

[0021] In the implementation, the first modulus can be from about 20 megapascals (MPa) to about 400 MPa, and the second modulus can be from about 500 MPa to about 2 gigapascals (GPa).

[0022] In one implementation, the first and second regions may be flat, the third region may be curved in the thickness direction, and the first and second regions may overlap each other in the thickness direction.

[0023] In one embodiment, the inner surface of the first coating may be aligned with the boundary between the first region and the third region, the inner surface of the second coating may be aligned with the boundary between the second region and the third region, and the inner surfaces of the first coating and the second coating may be circular.

[0024] According to an embodiment of this disclosure, a method of manufacturing a display device includes: preparing a display component, the display component including a first region, a second region, and a third region defined between the first region and the second region; and providing a first coating on the first region of the display component, and providing a second coating on the second region of the display component; wherein the first coating has a first modulus, and the second coating has a second modulus greater than the first modulus.

[0025] In an implementation, providing the first coating and the second coating may include coating the first and second regions of the display member with a photosensitive resin and curing the coated photosensitive resin with ultraviolet light.

[0026] In an embodiment, providing the first coating and the second coating may further include coating the second region of the display component with at least one material selected from acrylic organic materials, PC, and metal oxides and non-metal oxides.

[0027] In one embodiment, the method may further include attaching a driver chip to a first surface of the display component after providing the first coating on the first region of the display component and the second coating on the second region of the display component. Attached Figure Description

[0028] These and / or other features will become apparent and more readily understood from the following description of the embodiments in conjunction with the accompanying drawings, wherein:

[0029] Figure 1 This is a plan view of the display device according to the implementation scheme;

[0030] Figure 2 This is a schematic cross-sectional view of the display device according to the implementation scheme;

[0031] Figure 3A It is a schematic cross-sectional view showing the components;

[0032] Figure 3B yes Figure 3A A schematic enlarged view of the surrounding portion;

[0033] Figure 4 yes Figure 2 Detailed cross-sectional view;

[0034] Figure 5 yes Figure 4 An enlarged cross-sectional view of part A;

[0035] Figure 6 yes Figure 5 An enlarged cross-sectional view of part B;

[0036] Figure 7 This is a flowchart illustrating a method for manufacturing a display device according to an embodiment;

[0037] Figures 8 to 12 This is a cross-sectional view illustrating the operations during the manufacturing process of a display device;

[0038] Figure 13 This is a cross-sectional view of the display device according to an alternative embodiment;

[0039] Figure 14 This is a cross-sectional view of a display device according to another alternative embodiment; and

[0040] Figure 15 This is a cross-sectional view of a display device according to another alternative embodiment. Detailed Implementation

[0041] The invention will now be described more fully below with reference to the accompanying drawings, in which preferred embodiments of the invention are illustrated. However, the invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. The same reference numerals denote the same components throughout the specification. In the drawings, the thicknesses of layers and regions are enlarged for clarity.

[0042] It should be understood that when an element or layer is referred to as being "on" another element or layer, the element or layer may be directly on the other element or layer, or there may be an intermediate element or layer. Conversely, when an element is referred to as being "directly" on another element, there is no intermediate element.

[0043] It should be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, areas, layers, and / or parts, these elements, components, areas, layers, and / or parts should not be limited by these terms. These terms are used only to distinguish one element, component, area, layer, or part from another. Therefore, without departing from the teachings of this document, the first “element,” “component,” “area,” “layer,” or “part” discussed below may be referred to as the second element, component, area, layer, or part.

[0044] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms (including “at least one”) unless the context explicitly indicates otherwise. “Or” means “and / or.” “At least one of A and B” means “A and / or B.” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. It should also be understood that the terms “comprises” and / or “comprising,” or “includes” and / or “including,” when used in this specification, specify the presence of the specified features, areas, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, areas, integers, steps, operations, elements, components, and / or groups thereof.

[0045] As used herein, “about” or “approximately” includes specified values ​​and means within an acceptable range of deviation from a particular value as determined by a person skilled in the art considering the relevant measurements and the errors associated with the measurement of the particular quantity (i.e., the limits of the measurement system).

[0046] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It should also be understood that terms, such as those defined in commonly used dictionaries, shall be interpreted as having a meaning consistent with their meaning in the relevant field and in the context of this disclosure, and shall not be interpreted in an idealized or overly formal sense, unless expressly defined herein.

[0047] Exemplary embodiments are described herein with reference to cross-sectional views as schematic representations of idealized embodiments. Thus, variations in the shape of the illustrated areas will be anticipated due to factors such as manufacturing techniques and / or tolerances. Therefore, the embodiments described herein should not be construed as being limited to the specific shapes of the areas illustrated herein, but should include deviations in shape resulting from factors such as manufacturing processes. For example, an illustrated or described flat area may generally have rough and / or non-linear characteristics. Furthermore, illustrated sharp corners may be rounded. Therefore, the areas illustrated in the figures are schematic in nature, and their shapes are not intended to illustrate the precise shapes of the areas, nor are they intended to limit the scope of the claims.

[0048] Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0049] Figure 1 This is a plan view of the display device 1 according to the implementation scheme. Figure 2 This is a schematic partial cross-sectional view of the display device 1 according to the implementation scheme. Figure 3A This is a schematic cross-sectional view showing component 20. Figure 3B yes Figure 3A A schematic enlarged view of the surrounding portion.

[0050] In the implementation scheme, the first direction DR1 and the second direction DR2 intersect each other in different directions, such as Figure 1 As shown in the diagram. In an embodiment, for example, the first direction DR1 may be the length direction of the display device 1, and the second direction DR2 may be the width direction of the display device 1. Figure 1 In the plan view, for ease of description, the first direction DR1 is defined as the vertical direction, and the second direction DR2 is defined as the horizontal direction. In the embodiments described herein, one side of the first direction DR1 refers to the upper direction in the plan view, and the opposite side of the first direction DR1 refers to the lower direction in the plan view; one side of the second direction DR2 refers to the right direction in the plan view, and the opposite side of the second direction DR2 refers to the left direction in the plan view. However, the directions in the embodiments should be understood as relative directions, and the embodiments are not limited to the directions mentioned.

[0051] refer to Figures 1 to 3B The implementation of display device 1 can be any electronic device including a display screen. In the implementation, for example, display device 1 can be a portable electronic device including a display screen, such as a mobile phone, smartphone, tablet PC (“PC”), electronic watch, smartwatch, watch phone, mobile communication terminal, electronic notebook, e-book, portable multimedia player (“PMP”), navigation device, game console and digital camera, as well as television, laptop computer, monitor, billboard and Internet of Things device.

[0052] In an embodiment, the display device 1 includes an active area DA and an active area NA. In an embodiment of the display device 1, an area for displaying an image can be defined as a display area, an area for not displaying an image can be defined as a non-display area, and an area for sensing touch input can be defined as a touch area. In such embodiments, the display area and the touch area can be included within the active area DA. The display area and the touch area can overlap each other. In an embodiment, the active area DA can be an area for displaying an image and sensing touch input. The active area DA can have a rectangular or rounded-corner rectangular shape. The active area DA illustrated in the figures can have a rounded-corner rectangular shape and be longer in the first direction DR1 than in the second direction DR2. However, the shape of the active area DA is not limited to this shape, and the shape of the active area DA can be modified to be another shape, such as a rectangle, square, other polygons, circles, and ellipses that are longer in the second direction DR2 than in the first direction DR1.

[0053] The non-active region NA is positioned around the active region DA. The non-active region NA can be a masking region. The non-active region NA can surround all sides of the active region DA (the four sides in the attached figure). However, the implementation is not limited to this. In an alternative implementation, for example, the non-active region NA may not be positioned around the upper, left, or right side of the active region DA.

[0054] Display device 1 includes a display panel 10 that provides a display screen. In embodiments, the display panel 10 may be an organic light-emitting display panel, a micro light-emitting diode (“LED”) display panel, a nano LED display panel, a quantum dot light-emitting display panel, a liquid crystal display panel, a plasma display panel, a field emission display panel, an electrophoretic display panel, or an electrowetting display panel. Hereinafter, for ease of description, embodiments in which the display panel 10 is an organic light-emitting display panel will be described in detail, but the embodiments are not limited thereto, and the display panel 10 may be another type of display panel, provided that the same technical spirit is applicable.

[0055] In one embodiment, the display panel 10 may include a flexible substrate, which comprises a flexible polymer material, such as polyimide. Therefore, in such embodiments, the display panel 10 can be bent, curved, folded, or rolled up.

[0056] The display panel 10 may include a curved area BR in which the display panel 10 is bent. The display panel 10 may be divided into a main area MR located on or extending from one side of the curved area BR and a sub-area SR located on or extending from the opposite side of the curved area BR.

[0057] The display area of ​​the display panel 10 is defined in the main area MR. In one embodiment, the edge portion surrounding the display area in the main area MR, the entire portion of the curved area BR, and the entire portion of the sub-area SR may collectively define a non-display area. In an alternative embodiment, at least a portion of the curved area BR and / or the sub-area SR may include the display area.

[0058] The main area MR can have a shape substantially similar to the planar shape of the display device 1. The main area MR can be a flat area located on a plane. However, the embodiments are not limited to this case, and at least one of the edges of the main area MR, except for the edge (side) connected to the curved area BR, can also be curved or can be vertically curved.

[0059] In one embodiment, if at least one of the edges of the main region MR, excluding the edge (side) connected to the curved region BR, is bent or curved, the display area may also be located at the bent or curved edge. However, the embodiment is not limited to this case, and the bent or curved edge may also be a non-display area in which no image is displayed, or may include a combination of display area and non-display area.

[0060] The curved region BR connects to one side of the main region MR in the first direction DR1. In one embodiment, for example, the curved region BR may connect to the lower short side of the main region MR. The width of the curved region BR (e.g., its length in the second direction DR2) may be smaller than the width of the main region MR (the short side of the main region MR). A portion of the main region MR connected to the curved region BR may protrude from the lower short side of the main region MR and may have a width substantially the same as the width of the curved region BR.

[0061] In the bending zone BR, the display panel 10 can be bent downwards in curvature in the thickness direction or downwards in a direction opposite to the display surface. The bending zone BR can have a constant radius of curvature. However, the implementation is not limited to this, and the bending zone BR can also have different radii of curvature in each section. When the display panel 10 is bent in the bending zone BR, the surface of the display panel 10 can be inverted. That is, the first surface of the display panel 10 facing upwards can be changed to facing outwards by the bending zone BR, and then changed to facing downwards.

[0062] Sub-region SR extends from curved region BR. In the curved state, sub-region SR can extend parallel to main region MR. Sub-region SR can overlap with main region MR in the thickness direction of display panel 10. The width of sub-region SR (in the second direction DR2) can be equal to, but is not limited to, the width of curved region BR.

[0063] In such Figure 1In the illustrated plan view, sub-region SR may include a first pad area PA1 and a second pad area PA2 located further from the bend area BR than the first pad area PA1. Multiple signal routing pads may be disposed in the first pad area PA1 of sub-region SR. The signal routing pads may be disposed on a first surface of the first pad area PA1 of sub-region SR. A driver chip 70 may be disposed on the first surface of the first pad area PA1. The driver chip 70 may be coupled to the signal routing pads. The driver chip 70 may include an integrated circuit for driving the display panel 10. The integrated circuit may include an integrated circuit for the display and / or an integrated circuit for the touch unit. The integrated circuit for the display and the integrated circuit for the touch unit may be provided as separate chips or may be integrated into a single chip.

[0064] Multiple display signal wiring pads can be disposed on the second surface of the second pad area PA2 of the sub-region SR of the display panel 10. A circuit board 90 can be connected to the second pad area PA2 of the sub-region SR of the display panel 10. The circuit board 90 can be connected to the signal wiring pads. The circuit board 90 can be a flexible printed circuit board or a film.

[0065] In the implementation plan, such as Figure 3A As shown, the display panel 10 may include a display member 20 and a polarizing member 40 disposed on the display member 20. The display member 20 may be disposed in a main region MR, a curved region BR, and a sub-region SR. In an embodiment, as... Figure 3B As shown, the display component 20 includes a substrate, a circuit layer disposed on the substrate, a light-emitting layer disposed on the circuit layer, and an encapsulation layer disposed on the light-emitting layer. The display panel 10 may further include a first electrode disposed under the light-emitting layer and a second electrode disposed on the light-emitting layer. The first electrode, the light-emitting layer, and the second electrode may constitute a light-emitting element. A light-emitting element may be disposed in each pixel. The first electrode may be an anode, and the second electrode may be a cathode.

[0066] The substrate may comprise a flexible material. The flexible material may include at least one material selected from polystyrene, polyvinyl alcohol, polymethyl methacrylate, polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyaryl compounds, polyimide, polycarbonate, cellulose triacetate, and cellulose acetate propionate.

[0067] The circuit layer may include display wiring, display electrodes, and transistors. The circuit layer may include a first pad 25 (see...). Figure 5 ) and second pad 27 (see Figure 5 This will be described later.

[0068] The light-emitting layer may contain organic light-emitting materials. The light-emitting layer may be sealed by an encapsulation layer. The encapsulation layer can seal the light-emitting layer to prevent moisture from being introduced from the outside. The encapsulation layer may consist of a single inorganic layer or multiple inorganic layers, or it may consist of alternating stacked inorganic and organic layers.

[0069] In one embodiment, the planar shape of the display member 20 may be substantially the same as the planar shape of the display panel 10 described above. In such an embodiment, the display member 20 may have a planar shape substantially the same as the main area MR, the curved area BR, and the sub-area SR.

[0070] The polarizing member 40 may typically overlap with the main region MR in the thickness direction and may not be located in the bending region BR. Although not illustrated, a bonding member may be provided between the polarizing member 40 and the display member 20. The bonding member allows the polarizing member 40 and the display member 20 to bond together. The bonding member may contain a pressure-sensitive adhesive (“PSA”).

[0071] The polarization member 40 may include multiple stacked films. In an embodiment, the polarization member 40 may include a first optical protective film disposed on the encapsulation layer, a retardation film disposed on the first optical protective film, a polarizing film disposed on the retardation film, and a second optical protective film disposed on the polarizing film.

[0072] The optical protective film of the polarizing component 40 can protect the polarizing film and retardation film of the polarizing component 40 from the influence of external moisture, foreign substances, etc. The optical protective film may contain organic insulating materials.

[0073] A retardation film can switch the phase of light. In one embodiment, for example, the retardation film can be a λ / 4 retardation film. The retardation film can be a birefringent film comprising a polymer, an alignment film of a liquid crystal polymer, a film comprising an alignment layer of a liquid crystal polymer, etc.

[0074] A polarizing film can selectively transmit light. In one embodiment, for example, the polarizing film can be a linear polarizing film. The polarizing film can be a polyvinyl alcohol (“PVA”) film. A polarizing film can be prepared by stretching a PVA film in one direction and then adsorbing iodine (I) or a dichroic dye onto the PVA film. The polarizing film has an absorption axis in the stretching direction and a transmission axis perpendicular to the absorption axis. In such embodiments, only light that is linearly polarized in a direction parallel to the transmission axis is output from the light incident on the polarizing film.

[0075] In the implementation plan, such as Figure 2As illustrated, a first coating 110 may be disposed on the second surface of the main region MR of the display panel 10, and a second coating 130 may be disposed on the second surface of the sub-region SR of the display panel 10. The first coating 110 and the second coating 130 may contain different materials from each other. Each of the first coating 110 and the second coating 130 may contain a photosensitive resin. Each of the first coating 110 and the second coating 130 may be formed by directly coating the photosensitive resin onto the second surface of the display panel 10.

[0076] The inner surface of the first coating 110 can be aligned with the boundary between the main region MR and the curved region BR, and the inner surface of the second coating 130 can be aligned with the boundary between the sub-region SR and the curved region BR. The first coating 110 and the second coating 130 can expose the second surface of the curved region BR of the display panel 10. The first coating 110 and the second coating 130 will be described in detail later.

[0077] Figure 4 yes Figure 2 A detailed cross-sectional view. Figure 5 yes Figure 4 An enlarged cross-sectional view of part A. Figure 6 yes Figure 5 An enlarged cross-sectional view of part B.

[0078] refer to Figures 4 to 6 In one embodiment, the first coating 110 may have a first thickness t1, and the second coating 130 may have a second thickness t2. The first thickness t1 and the second thickness t2 may be within the same range. In another embodiment, the first thickness t1 may be from about 5 micrometers (μm) to about 80 μm, and the second thickness t2 may be from about 5 μm to about 80 μm.

[0079] Each of the first coating 110 and the second coating 130 can be provided or formed by coating a photosensitive resin onto the second surface of the display member 20. The coated photosensitive resin can be transformed into the first coating 110 and the second coating 130 by a curing process (e.g., UV curing). In an embodiment, the inner surface of each of the first coating 110 and the second coating 130 can have a bent or circular shape. In an embodiment, each of the inner surface of the first coating 110 aligned with the boundary between the main region MR and the curved region BR and the inner surface of the second coating 130 aligned with the boundary between the sub-region SR and the curved region BR can have a circular shape. In such an embodiment, physical damage at the boundary between the main region MR and the curved region BR and at the boundary between the sub-region SR and the curved region BR can be effectively prevented when the display panel 10 is bent in the curved region BR.

[0080] According to the embodiments, the first coating 110 may have a first modulus, and the second coating 130 may have a second modulus. In some embodiments, the second modulus may be greater than the first modulus. In other embodiments, the first modulus may be less than the second modulus. That is, the stiffness or strength of the second coating 130 may be greater than the stiffness or strength of the first coating 110. The first modulus may be from about 20 megapascals (MPa) to about 400 MPa, and the second modulus may be from about 500 MPa to about 2 gigapascals (GPa).

[0081] In one embodiment, where the second modulus of the second coating 130 is greater than the first modulus of the first coating 110, the second coating 130 may contain a first material other than the photosensitive resin. The first material can make the second modulus of the second coating 130 greater than the first modulus of the first coating 110.

[0082] In the implementation scheme, the first material may include an organic material. The organic material may be at least one material selected from acrylic organic materials and polycarbonate (“PC”).

[0083] In this embodiment, the first material may include an inorganic material. The inorganic material may be a metal oxide or a non-metal oxide. The metal oxide may be, for example, aluminum oxide (Al2O3) or zirconium oxide (ZrO2), and the non-metal oxide may be, for example, silicon oxide (SiO2).

[0084] In the implementation scheme, the first material may include both organic and inorganic materials.

[0085] In the implementation plan, such as Figure 4 As illustrated, the driver chip 70 may be disposed on the first pad area PA1 of the display component 20, and the circuit board 90 may be disposed on the second pad area PA2 of the display component 20.

[0086] refer to Figure 5 Multiple first pads 25 can be disposed in the first pad area PA1 of the substrate 21 of the display component 20, and second pads 27 can be disposed in the second pad area PA2 of the substrate 21 of the display component 20.

[0087] Although not illustrated, the second pad 27 may be electrically connected to the first pad 25, and the first pad 25 may be electrically connected to the data line of the display component 20.

[0088] The driver chip 70 may include a chip portion 71 and a plurality of bumps 75 for electrically connecting the chip portion 71 and the first pad 25 to each other. The bumps 75 may correspond to the first pad 25.

[0089] The circuit board 90 may include a circuit board portion 91 and a lead 95 disposed between the circuit board portion 91 and the second pad 27.

[0090] The first bonding member 200 may be disposed between the bump 75 and the first pad 25, and the second bonding member ACF2 may be disposed between the lead 95 and the second pad 27. In an embodiment, the first bonding member 200 and the second bonding member ACF2 may be anisotropic conductive films. In such an embodiment, the first bonding member 200 may be a first anisotropic conductive film, and the second bonding member ACF2 may be a second anisotropic conductive film.

[0091] In the implementation plan, such as Figure 6 As illustrated, each of the first bonding members 200 may include a resin film 210 and a plurality of conductive balls 230 dispersed in the resin film 210. The conductive balls 230 may have a structure in which the surface of the polymer particles is coated with a metal (e.g., nickel (Ni), gold (Au), etc.). The resin film 210 may contain a thermosetting resin or a thermoplastic resin. Furthermore, the resin film 210 of each of the first bonding members 200 may further contain a material with adhesive properties.

[0092] Each of the first bonding members 200 can not only make the first pads 25 and bumps 75 that overlap each other in the thickness direction conductive through the conductive ball 230, but also make adjacent first pads 25 and bumps 75 bond to each other.

[0093] In an alternative embodiment, the first pad 25 and the bump 75 may be directly connected to each other, and the second pad 27 and the lead 95 may be directly connected to each other. In one embodiment, for example, the first pad 25 and the bump 75 may be ultrasonically bonded to each other, and the second pad 27 and the lead 95 may be ultrasonically bonded to each other.

[0094] In an embodiment of the display device 1, the second coating 130 may overlap with the first pad area PA1 and the second pad area PA2 in the thickness direction.

[0095] When the bump 75 of the driver chip 70 is bonded to the first pad 25, and when the lead 95 of the circuit board 90 is bonded to the second pad 27, with the first bonding member 200 and the second bonding member ACF2 respectively inserted between the bump 75 and the first pad 25 and between the lead 95 and the second pad 27, heat and pressure can be applied to the first bonding member 200 and the second bonding member ACF2 by the driver chip 70 and the circuit board 90. Here, if the stiffness or hardness of the second coating 130 is low, the second coating 130 may have difficulty supporting the bump 75 and the first pad 25, as well as the lead 95 and the second pad 27, when the bump 75 and the first pad 25 are bonded together and when the lead 95 and the second pad 27 are bonded together. Specifically, if the second modulus of the second coating 130 is low, the second coating 130 may not securely support the bump 75 and the first pad 25, as well as the lead 95 and the second pad 27, when the bump 75 is bonded to the first pad 25 and when the lead 95 is bonded to the second pad 27. It may also move along with the display component 20, including the flexible substrate, in the direction in which pressure is applied by the driver chip 70 and the circuit board 90. In this case, the bump 75 and the first pad 25 may not be properly bonded, and the lead 95 and the second pad 27 may not be properly bonded, resulting in poor bonding.

[0096] In embodiments of the invention, as described above, the second modulus of the second coating is greater than the first modulus of the first coating. In such embodiments, the stiffness or strength of the second coating 130 is greater than the stiffness or strength of the first coating 110. Therefore, when the bump 75 is bonded to the first pad 25 and when the lead 95 is bonded to the second pad 27, the second coating 130 can firmly support the bump 75 and the first pad 25, as well as the lead 95 and the second pad 27, thereby effectively preventing poor bonding between the bump 75 and the first pad 25 and between the lead 95 and the second pad 27.

[0097] A method for manufacturing a display device according to an embodiment will now be described in detail. In the following embodiments, elements that are the same as or similar to those in the embodiments described above will be indicated by the same reference numerals, and any repeated detailed descriptions will be omitted or simplified.

[0098] Figure 7 This is a flowchart illustrating a method for manufacturing a display device according to an embodiment. Figures 8 to 12 This is a cross-sectional view illustrating the operations during the manufacturing process of a display device.

[0099] First, refer to Figure 7 and Figure 8A target panel 20a comprising a first region, a second region, and a third region defined between the first and second regions is prepared (S10).

[0100] The first zone can be with Figure 2 The primary region MR is the same, and the secondary region can be the same as... Figure 2 The sub-region SR is the same, and the third region can be the same as... Figure 2 The bending region BR is the same.

[0101] In the implementation scheme, the target panel 20a can be with Figure 3A and Figure 3B The display component 20 is substantially the same. In such embodiments, the target panel 20a may be a display component 20 on which the polarizing component 40 is not disposed.

[0102] The preparation of the target panel 20a, including the first region, the second region, and the third region defined between the first region and the second region (operation S10), may further include forming a release film 300 on the first surface of the target panel 20a. When the first coating 110 and the second coating 130, which will be described later, are formed, the release film 300 may support the first surface of the target panel 20a.

[0103] Release film 300 may include or be made of any material, as long as it allows release film 300 to support target panel 20a.

[0104] Next, refer to Figure 7 and Figure 9 A first coating 110 and a second coating 130 are provided or formed on a second surface opposite to the first surface of the target panel 20a (S20). The second coating 130 and the first coating 110 may contain different materials from each other or be made of different materials from each other.

[0105] A first coating 110 may be provided or formed on the second surface of the first region (main region MR) of the target panel 20a, and a second coating 130 may be provided or formed on the second surface of the second region (sub-region SR) of the target panel 20a.

[0106] The provisioning or formation of the first coating 110 and the second coating 130 may include providing or forming a first coating material on a second surface of a first region of the target panel 20a, and providing or forming a second coating material on a second surface of a second region of the target panel 20a. Each of the first coating material and the second coating material may include a photosensitive resin.

[0107] The provision or formation of the first coating material on the second surface of the first region of the target panel 20a and the provision or formation of the second coating material on the second surface of the second region of the target panel 20a may further include directly coating the first coating material and the second coating material on the second surface of the target panel 20a.

[0108] The provision or formation of the first coating material on the second surface of the first region of the target panel 20a and the provision or formation of the second coating material on the second surface of the second region of the target panel 20a may further include aligning the inner surface of the first coating material with the boundary between the first region and the third region, and aligning the inner surface of the second coating material with the boundary between the second region and the third region.

[0109] The second coating material may further include the first material. In one embodiment, the first material may include an organic material. The organic material may be at least one material selected from organic acrylic materials and PC. In another embodiment, the first material may include an inorganic material. The inorganic material may be a metal oxide or a non-metal oxide. The metal oxide may be, for example, aluminum oxide (Al₂O₃) or zirconium oxide (ZrO₂), and the non-metal oxide may be, for example, silicon oxide (SiO₂). In yet another embodiment, the first material may include both organic and inorganic materials.

[0110] refer to Figure 7 and Figure 9 The method may further include, after the first coating material is provided or formed on the second surface of the first region of the target panel 20a and the second coating material is provided or formed on the second surface of the second region of the target panel 20a, curing the first coating material and the second coating material (S30). The curing of the first coating material and the second coating material may be achieved by an ultraviolet curing process.

[0111] Through ultraviolet curing, the first and second coating materials can be transformed into the above-mentioned references. Figure 2 The first coating 110 and the second coating 130 are described.

[0112] The first coating 110 may have a first modulus, and the second coating 130 may have a second modulus. In one embodiment, the second modulus may be greater than the first modulus. In another embodiment, the first modulus may be less than the second modulus. In yet another embodiment, the stiffness or strength of the second coating 130 may be greater than that of the first coating 110. The first modulus may be from about 20 MPa to about 400 MPa, and the second modulus may be from about 500 MPa to about 2 GPa.

[0113] Next, refer to Figure 10The release film 300 is peeled off from the first surface of the target panel 20a. Therefore, the first surface of the target panel 20a can be exposed.

[0114] Next, refer to Figure 7 and Figure 11 The driver chip 70 and circuit board 90 are attached to the first surface of the target panel 20a exposed by the peeled release film 300 (S40).

[0115] Next, refer to Figure 12 A polarizing member 40 is provided or disposed on the first surface of the first region (main region MR) of the target panel 20a.

[0116] In providing the polarizing member 40, a bonding member may be provided or formed between the polarizing member 40 and the target panel 20a to bond the polarizing member 40 and the target panel 20a together.

[0117] Figure 13 This is a cross-sectional view of the display device 2 according to the alternative implementation scheme.

[0118] refer to Figure 13 Except that the second coating 130_1 is thinner than the first coating 110, the display device 2 and Figure 4 The display device 1 is basically the same.

[0119] In such embodiments, the second coating 130_1 of the display device 2 may have a third thickness t3. The third thickness t3 may be less than the first thickness t1. The third thickness t3 may be about 5 μm to about 50 μm.

[0120] Since the third thickness t3 of the second coating 130_1 of the display device 2 is less than the first thickness t1 of the first coating 110, the sub-region SR of the display member 20 can be more effectively protected by the second release film to be disposed on the second surface of the display member 20.

[0121] In such embodiments, when the bump 75 of the driver chip 70 is bonded to the first pad 25, and when the lead 95 of the circuit board 90 is bonded to the second pad 27, with the first bonding member 200 and the second bonding member ACF2 respectively inserted between the bump 75 and the first pad 25 and between the lead 95 and the second pad 27, heat and pressure can be applied to the first bonding member 200 and the second bonding member ACF2 by the driver chip 70 and the circuit board 90. Here, if the stiffness or hardness of the second coating 130_1 is low, the second coating 130_1 may have difficulty supporting the bump 75 and the first pad 25, as well as the lead 95 and the second pad 27, when the bump 75 and the first pad 25 are bonded together and when the lead 95 and the second pad 27 are bonded together. Specifically, if the second modulus of the second coating 130_1 is low, when the bump 75 is bonded to the first pad 25 and when the lead 95 is bonded to the second pad 27, the second coating 130_1 may not securely support the bump 75 and the first pad 25, as well as the lead 95 and the second pad 27, and may move along with the display component 20 including the flexible substrate in the direction in which pressure is applied by the driver chip 70 and the circuit board 90. In this case, the bump 75 and the first pad 25 may not be properly bonded, and the lead 95 and the second pad 27 may not be properly bonded, resulting in poor bonding.

[0122] In this embodiment, as described above, the second modulus of the second coating 130_1 is greater than the first modulus of the first coating 110. In this embodiment, the stiffness or strength of the second coating 130_1 is greater than the stiffness or strength of the first coating 110. Therefore, when the bump 75 is bonded to the first pad 25 and when the lead 95 is bonded to the second pad 27, the second coating 130_1 can firmly support the bump 75 and the first pad 25, as well as the lead 95 and the second pad 27, effectively preventing poor bonding between the bump 75 and the first pad 25 and between the lead 95 and the second pad 27.

[0123] Figure 14 This is a cross-sectional view of display device 3 according to another alternative embodiment.

[0124] refer to Figure 14 In addition to the third coating 131 being further disposed between the second surface of the sub-region SR of the display member 20 and the second coating 133, the display device 3 and Figure 4 The display device 1 is basically the same.

[0125] exist Figure 14In the embodiment of the display device 3 shown, the heterogeneous coating 130_2 can be disposed on the second surface of the sub-region SR of the display member 20. The heterogeneous coating 130_2 can be directly disposed on the second surface of the sub-region SR.

[0126] The heterogeneous coating 130_2 may include a third coating 131 disposed on the second surface of the sub-region SR and a second coating 133 disposed on the third coating 131. The second coating 133 may include the components referenced above. Figure 4 The second coating 130 described is made of essentially the same material.

[0127] The second coating 133 may have a third thickness t3, and the third coating 131 may have a fourth thickness t4. The sum of the third thickness t3 of the second coating 133 and the fourth thickness t4 of the third coating 131 may be equal to the sum of the thicknesses of the coatings 133 and 131. Figure 13 The second coating 130_1 has a third thickness t3 that is basically the same.

[0128] The third thickness t3 of the second coating 133 can be about 5 μm to about 20 μm, and the fourth thickness t4 of the third coating 131 can be about 5 μm to about 30 μm.

[0129] Each of the second coating 133 and the third coating 131 can be formed by coating a photosensitive resin onto the second surface of the display component 20. The coated photosensitive resin can be transformed into the second coating 133 and the third coating 131 by a curing process (e.g., UV curing).

[0130] The inner surface of the third coating 131 may be aligned with the inner surface of the second coating 133 in the thickness direction. The inner surface of the third coating 131 may also be aligned with the boundary between the curved region BR and the sub-region SR. However, the implementation is not limited to this. Alternatively, the inner surface of the third coating 131 may be further recessed inward or further protruding outward compared to the inner surface of the second coating 133. In an implementation where the inner surface of the third coating 131 further protrudes outward, the third coating 131 may partially cover the inner surface of the second coating 133.

[0131] In such embodiments, the inner surface of each of the second coating 133 and the third coating 131 can have a circular shape. That is, each of the inner surfaces of the second coating 133, which is aligned with the boundary between the sub-region SR and the curved region BR, and the inner surface of the third coating 131, which is aligned with the boundary between the sub-region SR and the curved region BR, can have a circular shape. Therefore, when the display panel 10 is bent in the curved region BR, physical damage at the boundary between the curved region BR and the sub-region SR can be effectively prevented.

[0132] In such embodiments, the second coating 133 may have a third modulus. The third modulus may be substantially the same as the first modulus of the first coating 110. In such embodiments, the third modulus may be equal to the first modulus.

[0133] In such embodiments, the second coating 133 and the first coating 110 may contain the same material and may be formed on the second surface of the display member 20 by the same process.

[0134] In such embodiments, when the bump 75 of the driver chip 70 is bonded to the first pad 25, and when the lead 95 of the circuit board 90 is bonded to the second pad 27, with the first bonding member 200 and the second bonding member ACF2 respectively inserted between the bump 75 and the first pad 25 and between the lead 95 and the second pad 27, heat and pressure can be applied to the first bonding member 200 and the second bonding member ACF2 by the driver chip 70 and the circuit board 90. Here, if the stiffness or hardness of the heteropolymer coating 130_2 is low, the heteropolymer coating 130_2 may have difficulty supporting the bump 75 and the first pad 25, as well as the lead 95 and the second pad 27, when the bump 75 and the first pad 25 are bonded together and when the lead 95 and the second pad 27 are bonded together. Specifically, if the modulus of the heterojunction coating 130_2 is low, when the bump 75 is bonded to the first pad 25 and when the lead 95 is bonded to the second pad 27, the heterojunction coating 130_2 may not securely support the bump 75 and the first pad 25, as well as the lead 95 and the second pad 27, and may move along with the display component 20 including the flexible substrate in the direction in which pressure is applied by the driver chip 70 and the circuit board 90. In this case, the bump 75 and the first pad 25 may not be properly bonded, and the lead 95 and the second pad 27 may not be properly bonded, resulting in poor bonding.

[0135] In the implementation plan, such as Figure 14 As shown, the heterojunction coating 130_2 further includes a third coating 131 having a second modulus that is larger than, for example, the first modulus and the third modulus described above. Therefore, when the bump 75 is bonded to the first pad 25 and when the lead 95 is bonded to the second pad 27, the heterojunction coating 130_2 can firmly support the bump 75 and the first pad 25, as well as the lead 95 and the second pad 27, effectively preventing poor bonding between the bump 75 and the first pad 25 and between the lead 95 and the second pad 27.

[0136] Figure 15 This is a cross-sectional view of a display device according to another alternative embodiment.

[0137] refer to Figure 15In addition to the fourth coating 150 being further disposed on the second surface of the display member 20 in the bending region BR, the display device and Figure 14 The display device 3 is basically the same.

[0138] In such embodiments, the first side surface of the fourth coating 150 may be aligned with the boundary between the main region MR and the curved region BR, and the second side surface of the fourth coating 150 may be aligned with the boundary between the sub-region SR and the curved region BR.

[0139] The fourth coating 150 can contact the first coating 110 and the third coating 131 of the heterogeneous coating 130_2. That is, the first side surface of the fourth coating 150 can contact the first coating 110, and the second side surface of the fourth coating 150 can contact the third coating 131.

[0140] In one embodiment, the fourth coating 150 may be spaced at a predetermined distance from the inner surface of the first coating 110 without contacting the inner surface of the first coating 110.

[0141] In an embodiment, the fourth coating 150 may be spaced at a predetermined distance from the inner surface of the third coating 131 of the heterogeneous coating 130_2, without contacting the inner surface of the third coating 131.

[0142] In an embodiment, the fourth coating 150 may be spaced apart from each of the inner surface of the first coating 110 and the inner surface of the third coating 131 of the heterogeneous coating 130_2 by a predetermined distance, without contacting each of the inner surfaces of the first coating 110 and the third coating 131 of the heterogeneous coating 130_2.

[0143] The fourth coating 150 may have a fifth thickness t5. The fifth thickness t5 may be less than each of the first thickness t1 of the first coating 110, the third thickness t3 of the second coating 133, and the fourth thickness t4 of the third coating 131.

[0144] The fifth thickness t5 of the fourth coating 150 can be about 2 μm to about 10 μm.

[0145] In such embodiments, the display device further includes a fourth coating 150 disposed on a second surface of the bending region BR of the display member 20, such that the wiring of the display member 20 disposed in the bending region BR can be prevented from cracking or breaking due to bending.

[0146] In such embodiments, when the bump 75 of the driver chip 70 is bonded to the first pad 25, and when the lead 95 of the circuit board 90 is bonded to the second pad 27, with the first bonding member 200 and the second bonding member ACF2 respectively inserted between the bump 75 and the first pad 25 and between the lead 95 and the second pad 27, heat and pressure can be applied to the first bonding member 200 and the second bonding member ACF2 by the driver chip 70 and the circuit board 90. Here, if the stiffness or hardness of the heteropolymer coating 130_2 is low, the heteropolymer coating 130_2 may have difficulty supporting the bump 75 and the first pad 25, as well as the lead 95 and the second pad 27, when the bump 75 and the first pad 25 are bonded together and when the lead 95 and the second pad 27 are bonded together. Specifically, if the modulus of the heterojunction coating 130_2 is low, when the bump 75 is bonded to the first pad 25 and when the lead 95 is bonded to the second pad 27, the heterojunction coating 130_2 may not securely support the bump 75 and the first pad 25, as well as the lead 95 and the second pad 27, and may move along with the display component 20 including the flexible substrate in the direction in which pressure is applied by the driver chip 70 and the circuit board 90. In this case, the bump 75 and the first pad 25 may not be properly bonded, and the lead 95 and the second pad 27 may not be properly bonded, resulting in poor bonding.

[0147] In the implementation plan, such as Figure 15 As shown, the heterojunction coating 130_2 further includes a fourth coating 150 having a second modulus that is larger than, for example, the first modulus and the third modulus described above. Therefore, when the bump 75 is bonded to the first pad 25 and when the lead 95 is bonded to the second pad 27, the heterojunction coating 130_2 can firmly support the bump 75 and the first pad 25, as well as the lead 95 and the second pad 27, effectively preventing poor bonding between the bump 75 and the first pad 25 and between the lead 95 and the second pad 27.

[0148] According to the implementation plan, the number of masks used in manufacturing display devices can be reduced.

[0149] This invention should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the inventive concept to those skilled in the art.

[0150] Although the invention has been particularly shown and described with reference to embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made herein without departing from the spirit and scope of the invention as defined by the claims.

Claims

1. A display device, comprising: The display component includes a first area, a second area, and a third area defined between the first area and the second area; A first coating is disposed on a first surface of the first region of the display component; as well as A heterogeneous coating is disposed on the first surface of the second region of the display component. The first coating has a first stiffness or strength, and The heterogeneous coating includes a third coating disposed on the first surface of the second region and a second coating disposed on the third coating. The second coating has a second stiffness or strength that is the same as the first stiffness or strength, and the third coating has a third stiffness or strength that is greater than both the first stiffness or strength and the second stiffness or strength. The thickness of the first coating is greater than the thickness of the second coating.

2. The display device as claimed in claim 1, wherein Each of the first coating and the second coating contains a cured resin. The second coating further comprises the first material, and The side surface of the second coating includes a portion with a circular shape.

3. The display device of claim 2, wherein the first material comprises at least one material selected from acrylic organic materials and polycarbonate.

4. The display device of claim 2, wherein the first material comprises an inorganic material.

5. The display device of claim 4, wherein the inorganic material comprises a metal oxide or a non-metal oxide.

6. The display device as claimed in claim 2, wherein The second area of ​​the display component includes a first pad area and a second pad area. The first pad area is located between the third area and the second pad area. The driver chip is attached to the second surface of the first pad area, and The circuit board is attached to the second surface of the second pad area.

7. The display device of claim 6, further comprising: A first pad disposed on the second surface of the first pad area; and The second pad is disposed on the second surface of the second pad area. The driver chip is connected to the first pad, and The circuit board is connected to the second pad.

8. The display device of claim 7, further comprising: A first anisotropic conductive film is disposed between the first pad and the driver chip; as well as A second anisotropic conductive film is disposed between the second pad and the circuit board.

9. A method for manufacturing a display device, the method comprising: A display component is fabricated, the display component comprising a first region, a second region, and a third region defined between the first region and the second region; as well as A first coating is provided on a first surface of the first region of the display member, and a heterogeneous coating is provided on a first surface of the second region of the display member; The first coating has a first stiffness or strength, and The heterogeneous coating includes a third coating disposed on the first surface of the second region and a second coating disposed on the third coating. The second coating has a second stiffness or strength that is the same as the first stiffness or strength, and the third coating has a third stiffness or strength that is greater than both the first stiffness or strength and the second stiffness or strength. The thickness of the first coating is greater than the thickness of the second coating.

10. The method of claim 9, wherein providing the first coating and the second coating comprises coating a photosensitive resin onto the first and second regions of the display member, and curing the coated photosensitive resin with ultraviolet light, and in, The side surface of the second coating includes a portion with a circular shape.

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