Display device

Abstract

A display device is provided. The display device can include a substrate, a display element disposed above the substrate, an encapsulation layer disposed above the display element and including an inorganic encapsulation layer and an organic encapsulation layer, and a touch sensing layer disposed above the encapsulation layer. The touch sensing layer can include a first insulating layer including a side surface inclined with respect to a top surface of the encapsulation layer and including an organic material. The touch sensing layer can further include a conductive layer including a sensing electrode, and a second insulating layer covering the conductive layer and including a refractive index that can be different from a refractive index of the first insulating layer.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0084055, filed on July 11, 2019, in the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0002] One or more embodiments relate to a display apparatus having a structure capable of improving light emission. BACKGROUND

[0003] Display apparatuses have been used for various purposes. As display apparatuses become thinner and lighter, display apparatuses tend to be widely used. As display apparatuses are used in various fields, the demand for display apparatuses capable of providing high-quality images is growing.

[0004] It will be appreciated that the Background section is intended to provide a context for the technology. However, the Background section, like other sections of this document, is in no way meant to limit or define the scope of the subject matter disclosed herein. SUMMARY

[0005] To provide images, a display apparatus can include display elements that can emit color light. Elements or layers can be disposed on the display elements, thereby protecting the display elements or adding functions to the display apparatus. The efficiency of light emitted from each display element can be deteriorated due to the elements or layers on the display elements.

[0006] Disclosed is an effort to solve various problems including the above-described problems, and to provide a display apparatus capable of providing high-quality images. However, these problems are merely examples, and the scope of the disclosure is not limited thereto.

[0007] Additional aspects will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following description, or can be learned by practice of the disclosed presented embodiments.

[0008] According to one or more embodiments, a display apparatus can include a substrate, a display element disposed above the substrate, an encapsulation layer disposed above the display element and including an inorganic encapsulation layer and an organic encapsulation layer, and a touch sensing layer disposed above the encapsulation layer. The touch sensing layer can include a first insulating layer including a side surface inclined with respect to a top surface of the encapsulation layer and including an organic material. The touch sensing layer can further include a conductive layer including a sensing electrode, and a second insulating layer covering the conductive layer and including a refractive index that can be different from a refractive index of the first insulating layer.

[0009] At least a portion of the first insulating layer can contact the top surface of the encapsulation layer.

[0010] The encapsulation layer can include a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer. The first inorganic encapsulation layer, the organic encapsulation layer, and the second inorganic encapsulation layer can be stacked with each other. A portion of the first insulating layer can contact the second inorganic encapsulation layer.

[0011] The first insulating layer can include a photoresist.

[0012] The first insulating layer can include a first opening defined by a side surface of the first insulating layer and overlapping an emission area of the display element. The second insulating layer can at least partially fill the first opening of the first insulating layer.

[0013] A refractive index of the second insulating layer can be greater than a refractive index of the first insulating layer.

[0014] The display element can include a pixel electrode, a pixel definition layer that can cover edges of the pixel electrode and include a second opening that can overlap the pixel electrode, an emission layer that can be disposed at the second opening, and a counter electrode that can cover the emission layer. A main portion of the first insulating layer can overlap the pixel definition layer.

[0015] A width of the first opening of the first insulating layer can be greater than a width of the second opening of the pixel definition layer.

[0016] The first insulating layer can overlap the emission area of the display element and can have a width greater than a width of the emission area.

[0017] A side surface of the first insulating layer can include an inclined surface that is inversely tapered in a direction away from the encapsulation layer.

[0018] The display element can include a pixel electrode, a pixel definition layer that can cover edges of the pixel electrode and include a second opening that can overlap the pixel electrode, an emission layer that can overlap the second opening, and a counter electrode that can cover the emission layer. A central portion of the first insulating layer can overlap the second opening of the pixel definition layer, and a peripheral portion of the first insulating layer overlaps the pixel definition layer.

[0019] A refractive index of the first insulating layer can be greater than a refractive index of the second insulating layer.

[0020] According to one or more embodiments, a display apparatus can include a substrate, a pixel electrode, which can be disposed above the substrate, and a pixel defining layer, which can include an opening superposed with the pixel electrode and defining an emission area. The display apparatus can further include an emission layer, which can be disposed in the opening, a counter electrode, which can be disposed above the emission layer, an encapsulation layer, which can be disposed above the counter electrode and include an inorganic encapsulation layer and an organic encapsulation layer, a conductive layer, which can be disposed above the encapsulation layer and include a sensing electrode, a first organic insulating layer, which can include a side surface inclined with respect to a top surface of the encapsulation layer, and a second organic insulating layer, which can cover the first organic insulating layer and the conductive layer and include a refractive index different from a refractive index of the first organic insulating layer.

[0021] The first organic insulating layer can include a photoresist.

[0022] The encapsulation layer can include a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer. The first inorganic encapsulation layer, the organic encapsulation layer, and the second inorganic encapsulation layer can be stacked with each other. A portion of the first organic insulating layer can contact the second inorganic encapsulation layer.

[0023] The first organic insulating layer can include a first opening superposed with the opening of the pixel defining layer and a main body portion superposed with a main body portion of the pixel defining layer.

[0024] A width of the first opening of the first organic insulating layer can be greater than a width of the opening of the pixel defining layer.

[0025] The second organic insulating layer can at least partially fill the first opening, and a refractive index of the second organic insulating layer can be greater than a refractive index of the first organic insulating layer.

[0026] The first organic insulating layer can include a main body portion which can be superposed with the opening of the pixel defining layer, a side surface of the first organic insulating layer can include an inclined surface which is inversely tapered in a direction away from the encapsulation layer, and a refractive index of the second organic insulating layer can be less than a refractive index of the first organic insulating layer.

[0027] A peripheral portion of the first organic insulating layer can be superposed with a portion of the main body portion of the pixel defining layer. BRIEF DESCRIPTION OF DRAWINGS

[0028] The above and other aspects, features, and advantages of certain embodiments of the disclosure will be more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0029] Figure 1 is a plan view schematically illustrating a display apparatus according to an embodiment;

[0030] Figure 2 shows a cross-sectional view taken along line A-A' of FIG. 1A according to an embodiment; Figure 1a circuit diagram of a display element in a pixel of a display device and a pixel circuit connected thereto;

[0031] Figure 3 is a cross-sectional view schematically showing a display device according to an embodiment;

[0032] Figure 4 is a plan view of a functional layer according to an embodiment, Figure 4 schematically shows a touch electrode included in the functional layer;

[0033] Figure 5A and Figure 5B is a functional layer according to an embodiment Figure 4 is a plan view of a functional layer, Figure 5A and Figure 5B shows Figure 4 is an enlarged plan view of a portion V of

[0034] Figure 6 is a plan view showing a pixel of a display device according to an embodiment;

[0035] Figure 7 is a schematic cross-sectional view showing a pixel of a display device according to an embodiment;

[0036] Figure 8 is a schematic cross-sectional view of a display device according to an embodiment;

[0037] Figure 9 is a schematic cross-sectional view of a display device according to an embodiment;

[0038] Figure 10 is a schematic cross-sectional view of a display device according to an embodiment;

[0039] Figure 11 is a schematic cross-sectional view of a display device according to an embodiment;

[0040] Figure 12 is Figure 11 is a plan view of a display device,

[0041] Figure 13 is a schematic cross-sectional view schematically showing a display device according to an embodiment; and

[0042] Figure 14 is a schematic cross-sectional view schematically showing a display device according to an embodiment. DETAILED DESCRIPTION

[0043] Reference will now be made to embodiments illustrated in the drawings, where like numerals refer to like components throughout the drawings. Embodiments can be used in various forms and should not be construed as limited to the description set forth herein. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. The terms "and," "or," and "and / or" as used herein can be used in conjunction with "conjunction" or "disjunction," and can be understood to be equivalent to "and / or." Expressions such as "at least one of...," when preceding a list of two or more members, modify the entire list of members and do not modify the members of the list individually.

[0044] In the following embodiments, it will be understood that the terms "first," "second," etc. are used only to differentiate one component from another, and are not used in a limiting sense.

[0045] In the following embodiments, unless the context clearly indicates otherwise, the singular forms "a," "an," and "the" can also be intended to include the plural forms.

[0046] In the following embodiments, it will also be understood that the terms "comprise," "comprising," and "having" when used herein, specify the presence of stated elements but do not preclude the presence or addition of other elements, unless otherwise defined.

[0047] In the following embodiments, it will be understood that when a film, region, or component is described as "formed on," "covering," or the like another layer, region, or component, the film, region, or component can be formed on, covering, or the like the other layer, region, or component directly or indirectly. For example, there can be an intervening film, region, or component.

[0048] The sizes of components in the drawings can be exaggerated for the purpose of illustrating embodiments. For example, because the sizes of components in the drawings can be arbitrarily shown for the purpose of illustration, the following embodiments are not limited thereto.

[0049] When an embodiment can be implemented differently, a specific process sequence can be performed differently from the described order. For example, two processes described in succession can be performed substantially simultaneously or in the reverse order from the described order.

[0050] In the following embodiments, it will be understood that when a film, layer, region, element, or component is referred to as being "connected" or "coupled" to another film, layer, region, element, or component, it can be directly or indirectly connected or coupled to the other film, layer, region, element, or component. That is, for example, there can be intervening films, layers, regions, elements, or components. In the following embodiments, it will be understood that when a film, layer, region, element, or component is referred to as being "electrically connected" or "electrically coupled" to another film, layer, region, element, or component, it can be directly or indirectly electrically connected or coupled to the other film, layer, region, element, or component. That is, for example, there can be intervening films, layers, regions, elements, or components.

[0051] In the following examples, the x-axis, y-axis and z-axis do not limit to three axes of a rectangular coordinate system, but can be interpreted in a broader sense. For example, the x-axis, y-axis and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0052] In this specification, "A and / or B" means A, B, or A and B. The term "superimposed" can include laminated, stacked, faced or faced, extended over, covered or partially covered, or any other suitable term as will be appreciated and understood by one of ordinary skill in the art.

[0053] For ease of description, spatially relative terms, such as "below", "beneath", "lower", "above", "upper", "on", or the like, can be used herein to describe a relationship of one element or component to another element or component as illustrated in the drawings. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. For example, in the case of the device shown in the drawings being turned over, an element or component that is positioned "below" or "beneath" another element or component can be placed "above" or "on" the other element or component. Thus, the illustrative term "below" can include both a lower position and an upper position. The device can also be oriented in other directions, and the spatially relative terms can be interpreted differently depending on the orientation.

[0054] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined in the description.

[0055] Figure 1is a plan view schematically showing a display apparatus according to an embodiment.

[0056] Referring to Figure 1 , the display apparatus 10 can include a display area DA and a non-display area NDA adjacent to the display area DA. The non-display area NDA can surround the display area DA.

[0057] The display apparatus 10 can include pixels P disposed in the display area DA. Each of the pixels P can include a display element capable of emitting a color light. The display element can be electrically connected to a scan line SL and a data line DL. Figure 1 A substrate 100 having one possible configuration in the display apparatus 10 is shown. For example, the substrate 100 can include a display area DA and a non-display area NDA. As another example, the substrate 100 can include a first area corresponding to the display area DA and a second area corresponding to the non-display area NDA.

[0058] A scan driver 1100, a data driver 1200, and first and second main power lines (not shown in Figure 1 ) can be disposed in the non-display area NDA. The scan driver 1100 can be configured to provide a scan signal to each of the pixels P through a corresponding scan line SL. The data driver 1200 can be configured to provide a data signal to a display element included in each of the pixels P through a corresponding data line DL. The first and second main power lines can be configured to provide first and second power supply voltages.

[0059] Figure 1 An example in which the data driver 1200 can be disposed above the substrate 100 is shown, but as another embodiment, the data driver 1200 can be disposed above a flexible printed circuit board (FPCB) electrically connected to a pad (or referred to as a "land" or "solder pad") disposed at one side of the display apparatus 10.

[0060] Examples of the display apparatus 10 according to an embodiment can include an organic light emitting display, an inorganic electroluminescence (EL) display (inorganic light emitting display), a quantum dot display, and / or a liquid crystal display. Hereinafter, an organic light emitting display apparatus will be described as an example of the display apparatus 10 according to an embodiment, but the display apparatus 10 is not limited thereto. The features described below can be applied to various types of display apparatuses as described above.

[0061] Figure 2 A circuit diagram of a display element that can be included in one pixel of a display apparatus according to an embodiment and a pixel circuit that can be electrically connected to the display element is shown.

[0062] Referring toFigure 2 An organic light emitting diode (OLED) OLED, which is a display element, can be electrically connected to the pixel circuit PC. The pixel circuit PC can include a first thin film transistor (TFT) T1, a second TFT T2, and a storage capacitor Cst. The OLED OLED can emit, for example, red light, green light, or blue light. In other embodiments, the OLED OLED can emit red light, green light, blue light, or white light.

[0063] The second TFT T2 can be a switching TFT. The second TFT T2 can be electrically connected to the scan line SL and the data line DL, and can transmit a data voltage, which can be applied from the data line DL, to the first TFT T1 in response to a switching voltage applied from the scan line SL. The storage capacitor Cst can be electrically connected to the second TFT T2 and the driving voltage line PL, and can store a voltage corresponding to a difference between the voltage transmitted from the second TFT T2 and a first power voltage ELVDD supplied to the driving voltage line PL.

[0064] The first TFT T1 can be a driving TFT. The first TFT T1 can be electrically connected to the storage capacitor Cst, and can control a driving current flowing from the driving voltage line PL to the OLED OLED in response to a voltage value stored in the storage capacitor Cst. The OLED OLED can emit light having a certain brightness by the driving current. An opposite electrode (e.g., a cathode) of the OLED OLED can receive a second power voltage ELVSS.

[0065] Figure 2 An example in which the pixel circuit PC can include two TFTs and one storage capacitor is shown, but in another embodiment, various changes can be made to the number of TFTs or the number of storage capacitors according to the design of the pixel circuit PC.

[0066] Figure 3 is a cross-sectional view schematically illustrating a display apparatus Figure 1 , and corresponds to a cross-section taken along line III-III' of Figure 1 .

[0067] Referring to Figure 3 , a display layer 200 can be disposed above the substrate 100, and an encapsulation layer 300 and a functional layer 400 can be disposed above the display layer 200.

[0068] The base 100 can include a polymer resin or a glass material. In the case where the base 100 includes a polymer resin, the base 100 can have a flexible, rollable, or bendable characteristic. The display layer 200 can include a display element layer 220 including display elements and a pixel circuit layer 210 including pixel circuits. The pixel circuits can be electrically connected to the display elements. Each of the display elements included in the display element layer 220 can define a pixel, and the pixel circuit layer 210 can include transistors and storage capacitors.

[0069] The encapsulation layer 300 can be disposed above the display layer 200. The encapsulation layer 300 can prevent the display elements from being damaged by external foreign substances such as moisture. The encapsulation layer 300 can include at least one inorganic encapsulation layer and at least one organic encapsulation layer.

[0070] The functional layer 400 can be disposed above the encapsulation layer 300. The functional layer 400 can be a touch sensing layer that senses a touch input, and an insulating layer included in the functional layer 400 can include a structure that improves light emission efficiency of light emitted from the display elements. The touch input can be performed by a finger, a stylus, or the like. For example, the functional layer 400 can be a touch sensing layer capable of sensing a touch input and an optical layer capable of improving optical performance. The functional layer 400 can include a sensing electrode to sense a touch input, and can include two layers having different refractive indices to improve optical performance.

[0071] Figure 4 is a plan view of a functional layer according to an embodiment. Figure 4 A touch electrode included in a functional layer is schematically illustrated. Figure 5A and Figure 5B are plan views of a functional layer according to an embodiment, and are Figure 4 are plan views of a functional layer according to an embodiment, and are

[0072] Referring to Figure 4 , the functional layer 400 can include first sensing electrodes SP1 arranged in a first direction (e.g., an x direction) and second sensing electrodes SP2 arranged in a second direction (e.g., a y direction). The first direction and the second direction can intersect each other (e.g., perpendicularly intersect). Adjacent first sensing electrodes SP1 can be electrically connected to each other by first connection electrodes CP1, and adjacent second sensing electrodes SP2 can be electrically connected to each other by second connection electrodes CP2.

[0073] The first and second sensing electrodes SP1 and SP2 can each include a conductive layer. The conductive layer can include a metal layer or a transparent conductive layer. The metal layer can include molybdenum (Mo), molybdenum (Md), silver (Ag), titanium (Ti), copper (Cu), aluminum (Al), and any alloy thereof. The transparent conductive layer can include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), or a combination thereof. The transparent conductive layer can include a conductive polymer such as poly(3,4-ethylenedioxythiophene) (PEDOT), a metal nanowire, a carbon nanotube, graphene, or a combination thereof. The first and second connection electrodes CP1 and CP2 can each include a conductive layer such as a metal layer or a transparent conductive layer as described above.

[0074] The sensing electrodes SP1 and SP2 and the connection electrodes CP1 and CP2 can each have a mesh structure including openings. For example, as shown in FIGS. 1A and 1B, each of the first sensing electrodes SP1 can be formed in a conductive layer CTL. The conductive layer CTL can include openings CTL-OP and a body portion. The body portion can at least partially surround the openings CTL-OP and define the openings CTL-OP. The body portion can be connected to each other to form a mesh structure. Similarly, each of the second sensing electrodes SP2, each of the first connection electrodes CP1, and each of the second connection electrodes CP2 can also have a mesh structure. Figure 5A Figure 5B As shown in FIGS. 1A and 1B, each of the first sensing electrodes SP1 can be formed in a conductive layer CTL. The conductive layer CTL can include openings CTL-OP and a body portion. The body portion can at least partially surround the openings CTL-OP and define the openings CTL-OP. The body portion can be connected to each other to form a mesh structure. Similarly, each of the second sensing electrodes SP2, each of the first connection electrodes CP1, and each of the second connection electrodes CP2 can also have a mesh structure.

[0075] Each of the openings CTL-OP of the conductive layer CTL can overlap with an emission area of a pixel. For example, each of the openings CTL-OP can be disposed to overlap with an emission area EA-R from which red light can be emitted, an emission area EA-G from which green light can be emitted, or an emission area EA-B from which blue light can be emitted. For example, the emission areas EA-R, EA-G, EA-B can emit light due to the openings CTL-OP.

[0076] As shown in FIGS. 1A and 1B, each of the first sensing electrodes SP1 can be formed in a conductive layer CTL. The conductive layer CTL can include openings CTL-OP and a body portion. The body portion can at least partially surround the openings CTL-OP and define the openings CTL-OP. The body portion can be connected to each other to form a mesh structure. Similarly, each of the second sensing electrodes SP2, each of the first connection electrodes CP1, and each of the second connection electrodes CP2 can also have a mesh structure. Figure 5A Figure 5B As shown in FIGS. 1A and 1B, each of the first sensing electrodes SP1 can be formed in a conductive layer CTL. The conductive layer CTL can include openings CTL-OP and a body portion. The body portion can at least partially surround the openings CTL-OP and define the openings CTL-OP. The body portion can be connected to each other to form a mesh structure. Similarly, each of the second sensing electrodes SP2, each of the first connection electrodes CP1, and each of the second connection electrodes CP2 can also have a mesh structure.

[0077] The functional layer 400 can include a first insulating layer 420 disposed above and / or below the conductive layer CTL, and Figure 5A Figure 5B ​​​A first insulating layer 420 is shown superposed with the conductive layer CTL. The first insulating layer 420 can include first openings 420OP corresponding to the emission areas EA-R, EA-G, and EA-B. The first openings 420OP of the first insulating layer 420 can be formed by removing portions of the first insulating layer 420 via an exposure process and a development process. The first openings 420OP can pass through a top surface and a bottom surface of the first insulating layer 420. Viewed in plan view, the first openings 420OP can have shapes that can be the same as or similar to shapes of the respective emission areas EA-R, EA-G, and EA-B. For example, the red emission areas EA-R and the blue emission areas EA-B and the first openings 420OP corresponding thereto can have rectangular (e.g., generally rectangular) shapes. The green emission areas EA-G and the first openings 420OP corresponding thereto can have shapes that are similar to each other (such as hexagonal shapes or octagonal shapes). The term “corresponding” as used herein can mean “superposed.” In another embodiment, viewed in plan view, the first openings 420OP can have different shapes from the respective emission areas EA-R, EA-G, and EA-B. For example, when the red emission areas EA-R, the blue emission areas EA-B, and the green emission areas EA-G have polygonal shapes, the first openings 420OP can have different shapes such as circular shapes.

[0078] Figure 6 is a plan view showing one pixel of a display device according to an embodiment, Figure 7 is a schematic cross-sectional view showing one pixel of a display device according to an embodiment, and corresponds to a cross-section taken along the line VII-VII’ of Figure 6 .

[0079] Referring to Figure 6 , the opening CTL-OP of the conductive layer CTL, the first openings 420OP of the first insulating layer 420, and the emission areas EA can be superposed with each other. The size of the opening CTL-OP of the conductive layer CTL can be greater than the size of the first openings 420OP of the first insulating layer 420. The size of the first openings 420OP of the first insulating layer 420 can be greater than the size of the emission areas EA. For example, a first width W1 of the emission areas EA can be less than a second width W2 of the first openings 420OP of the first insulating layer 420, and the second width W2 of the first openings 420OP can be less than a third width W3 of the opening CTL-OP of the conductive layer CTL.

[0080] The main portion of the conductive layer CTL can be superposed with the first insulating layer 420. For example, the main portion of the conductive layer CTL can be superposed with a main portion of the first insulating layer 420. The conductive layer CTL can include sub-layers. As one embodiment, Figure 7An example in which the conductive layer CTL can include a first sub-conductive layer CTL1 and a second sub-conductive layer CTL2 is shown.

[0081] The first sub-conductive layer CTL1 can be disposed below the first insulating layer 420. The second sub-conductive layer CTL2 can be disposed above the first insulating layer 420. The first insulating layer 420 can be interposed between the first sub-conductive layer CTL1 and the second sub-conductive layer CTL2. The substrate 100, a display layer including the OLED OLED, and the encapsulation layer 300 can be disposed below the first sub-conductive layer CTL1 and the second sub-conductive layer CTL2.

[0082] Referring to Figure 7 The substrate 100 can be a single layer of a glass material. As another example, the substrate 100 can include a polymer resin. In the case in which the substrate 100 includes a polymer resin, the substrate 100 can have a structure in which an inorganic layer and a layer including a polymer resin can be stacked. Examples of the polymer resin can include polyether sulfone (PES), polyacrylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate (PAR), polyimide (PI), polycarbonate (PC), cellulose acetate propionate (CAP), or the like, or a combination thereof.

[0083] The TFT TFT can include a semiconductor layer ACT, a gate electrode GE, a source electrode SE, and a drain electrode DE. The semiconductor layer ACT can include amorphous silicon, polysilicon, or an organic semiconductor material. To secure electrical insulation between the semiconductor layer ACT and the gate electrode GE, a gate insulating film 203 can be disposed between the semiconductor layer ACT and the gate electrode GE. The gate insulating film 203 can include an inorganic material such as silicon oxide, silicon nitride, and / or silicon oxynitride. Further, an interlayer insulating layer 205 can be disposed above the gate electrode GE. The interlayer insulating layer 205 can include an inorganic material such as silicon oxide, silicon nitride, and / or silicon oxynitride. The source electrode SE and the drain electrode DE can be disposed above the interlayer insulating layer 205. The gate insulating film 203 or the interlayer insulating layer 205, which can include an inorganic material, can be formed by chemical vapor deposition (CVD) or atomic layer deposition (ALD).

[0084] The gate electrode GE, the source electrode SE, and the drain electrode DE can include a conductive material. The gate electrode GE can include molybdenum or aluminum, and can have a multi-layer structure if necessary. For example, the gate electrode GE can be a single molybdenum layer, or can have a three-layer structure including a molybdenum layer, an aluminum layer, and a molybdenum layer. The source electrode SE and the drain electrode DE can include titanium or aluminum, and can have a multi-layer structure if necessary. For example, the source electrode SE and the drain electrode DE can have a three-layer structure including a titanium layer, an aluminum layer, and a titanium layer.

[0085] A buffer layer 201 can be provided between the TFT TFT and the substrate 100. The buffer layer 201 can include an inorganic material such as silicon oxide, silicon nitride, and / or silicon oxynitride. The buffer layer 201 can increase the flatness of the top surface of the substrate 100, and / or can prevent or reduce impurities from permeating into the semiconductor layer ACT of the TFT TFT from the substrate 100, etc.

[0086] A planarization insulating layer 207 can be provided over the TFT TFT. The planarization insulating layer 207 can include, for example, an organic material such as acrylic, benzocyclobutene (BCB), hexamethyldisiloxane (HMDSO), or a combination thereof. In some embodiments, the planarization insulating layer 207 can include an inorganic material such as silicon oxide, silicon nitride, and / or silicon oxynitride. Figure 7 In the illustrated embodiment, the planarization insulating layer 207 is shown as a single layer, but in other embodiments, the planarization insulating layer 207 can have a multi-layer structure.

[0087] A pixel electrode 221 can be provided over the planarization insulating layer 207. The pixel electrode 221 can be provided for each pixel. The pixel electrodes 221 corresponding to adjacent pixels can be separated from each other.

[0088] The pixel electrode 221 can be a reflective electrode. In some embodiments, the pixel electrode 221 can include a reflective film and a transparent or semi-transparent electrode layer provided over the reflective film. The reflective film can include Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or any mixture thereof. The transparent or semi-transparent electrode layer can include at least one selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), and aluminum zinc oxide (AZO). In some embodiments, the pixel electrode 221 can have a three-layer structure including an ITO layer, an Ag layer, and an ITO layer.

[0089] A pixel-defining layer 209 can be provided over the pixel electrode 221. The pixel-defining layer 209 can include a second opening 209OP that can expose a central portion of the pixel electrode 221. The pixel-defining layer 209 can cover edges of the pixel electrode 221 and can increase a distance between the edges of the pixel electrode 221 and the counter electrode 223, thereby preventing arcing at the edges of the pixel electrode 221. The pixel-defining layer 209 can include an organic insulating material such as PI, polyamide, acrylic resin, BCB, HMDSO, phenol resin, or a combination thereof. The pixel-defining layer 209 can be formed by spin coating, etc. As another example, the pixel-defining layer 209 can include an inorganic insulating material. As another example, the pixel-defining layer 209 can have a multi-layer structure including an inorganic insulating layer including an inorganic insulating material and an organic insulating layer.

[0090] A spacer 211 can be disposed over the pixel-defining layer 209. The spacer 211 can prevent a layer between the substrate 100 and the spacer 211 from being damaged by a mask used in a process of forming an emission layer 222b, which is described further below. The spacer 211 can include the same material as the material of the pixel-defining layer 209.

[0091] The emission layer 222b can be disposed in the second openings 209OP of the pixel-defining layer 209. The emission layer 222b can be an organic material including a fluorescent material or a phosphorescent material capable of emitting light (e.g., red light, green light, or blue light). The organic material can be a low molecular weight organic material or a high molecular weight organic material.

[0092] A first functional layer 222a can be disposed. The first functional layer 222a can be disposed under the emission layer 222b. The first functional layer 222a can include, for example, a hole transport layer (HTL), or can include a hole transport layer and a hole injection layer (HIL). A second functional layer 222c can be disposed. The second functional layer 222c can be disposed over the emission layer 222b, and can include an electron transport layer (ETL) and / or an electron injection layer (EIL). In some embodiments, the second functional layer 222c can not be disposed. In an embodiment, the first functional layer 222a, the emission layer 222b, and the second functional layer 222c constitute an intermediate layer 222.

[0093] The emission layer 222b can be disposed for each pixel, corresponding to the second openings 209OP of the pixel-defining layer 209. The first functional layer 222a and the second functional layer 222c can be integrally formed as a common layer that substantially or completely covers the substrate 100. For example, the first functional layer 222a and the second functional layer 222c can substantially or completely cover the display area of the substrate 100. An opposite electrode 223 can be disposed. The opposite electrode 223 can substantially or completely cover the substrate 100.

[0094] The opposite electrode 223 can include a semi-transparent layer including silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or any alloy thereof. As another example, the opposite electrode 223 can further include a layer including ITO, IZO, ZnO, In2O3, or a combination thereof, positioned over the semi-transparent layer including the above-described materials. In one embodiment, the opposite electrode 223 can include silver (Ag), magnesium (Mg), or an alloy of silver (Ag) and magnesium (Mg).

[0095] The encapsulation layer 300 can include at least one inorganic encapsulation layer and at least one organic encapsulation layer. For example, as Figure 7As illustrated in FIG. 3, the encapsulation layer 300 can include a first inorganic encapsulation layer 310, an organic encapsulation layer 320, and a second inorganic encapsulation layer 330.

[0096] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 can include at least one inorganic insulating material selected from among aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 can have a single-layer or multi-layer structure including the above-described inorganic insulating material.

[0097] The organic encapsulation layer 320 can relieve internal stress of the first inorganic encapsulation layer 310 and / or the second inorganic encapsulation layer 330. The organic encapsulation layer 320 can include a polymer-based material. The polymer-based material can include polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyvinyl sulfonate, polyformaldehyde, polyarylate, hexamethyldisiloxane, an acrylic resin (e.g., polymethyl methacrylate, polyacrylic acid, etc.), or any combination thereof.

[0098] The organic encapsulation layer 320 can be formed by applying a monomer having fluidity and curing the monomer layer using heat or light such as ultraviolet light. As another example, the organic encapsulation layer 320 can be formed by applying the above-described polymer-based material.

[0099] The functional layer 400 can be disposed above the encapsulation layer 300. The functional layer 400 can include first and second sub-conductive layers CTL1 and CTL2, a first insulating layer 420, and a second insulating layer 440. The first sub-conductive layer CTL1 can be disposed below the first insulating layer 420. The second sub-conductive layer CTL2 can be disposed above the first insulating layer 420. The first and second sub-conductive layers CTL1 and CTL2 can be connected through a contact hole 420ct formed in the first insulating layer 420. The above-described first and second sub-conductive layers CTL1 and CTL2 can be formed of the same material as the first and second conductive layers 110 and 120 of the conductive layer 100. Figure 4 to Figure 5B The described first and second sensing electrodes SP1 and SP2 can each have a two-layer structure of the first and second sub-conductive layers CTL1 and CTL2 connected through the contact hole 420ct as illustrated in FIG. 4. Figure 7 The described first and second sensing electrodes SP1 and SP2 can each have a two-layer structure of the first and second sub-conductive layers CTL1 and CTL2 connected through the contact hole 420ct as illustrated in FIG. 4.

[0100] The first sub-conductive layer CTL1 and the second sub-conductive layer CTL2 can each include a metal layer or a transparent conductive layer. The metal layer can include molybdenum (Mo), silver (Ag), titanium (Ti), copper (Cu), aluminum (Al), and any alloy thereof. The transparent conductive layer can include a transparent conductive oxide such as ITO, IZO, ZnO, or ITZO. The transparent conductive layer can include a conductive polymer such as PEDOT, metal nanowires, carbon nanotubes, or graphene. In one embodiment, the first sub-conductive layer CTL1 and the second sub-conductive layer CTL2 can each have a three-layer structure of a titanium layer, an aluminum layer, and a titanium layer.

[0101] The first insulating layer 420 can include a first opening 420OP overlapping the emission area EA. The emission area EA can be defined by the second opening 209OP of the pixel-defining layer 209. For example, a width of the second opening 209OP of the pixel-defining layer 209 can be a width (first width, W1) of the emission area EA. The first opening 420OP of the first insulating layer 420 can overlap the second opening 209OP of the pixel-defining layer 209, and a second width W2 of the first opening 420OP can be greater than the width (first width, W1) of the second opening 209OP of the pixel-defining layer 209. A main portion of the first insulating layer 420 defining the first opening 420OP can overlap a main portion of the pixel-defining layer 209. For example, the main portion of the first insulating layer 420 can overlap only the main portion of the pixel-defining layer 209. The main portion of the first insulating layer 420 can be a portion different from the first opening 420OP of the first insulating layer 420. The main portion of the first insulating layer 420 can be a portion having a certain volume (e.g., a predetermined volume). Similarly, the main portion of the pixel-defining layer 209 can be a portion different from the second opening 209OP of the pixel-defining layer 209, and can be a portion having a certain volume (e.g., a predetermined volume).

[0102] The first insulating layer 420 can include a photoresist. The first insulating layer 420 can be formed by applying a photoresist over the entire encapsulation layer 300 and exposing and developing the photoresist.

[0103] A second insulating layer 440 can be disposed over the first insulating layer 420. A portion of the second insulating layer 440 can be disposed in (or within) the first opening 420OP of the first insulating layer 420. The second insulating layer 440 can at least partially fill the first opening 420OP of the first insulating layer 420. For example, the second insulating layer 440 can fill the entire first opening 420OP. The second insulating layer 440 can include a planar (e.g., substantially planar) upper surface, and a thickness of a portion of the second insulating layer 440 that overlaps the first opening 420OP can be greater than a thickness of another portion of the second insulating layer 440 (e.g., a portion that overlaps the top surface of the first insulating layer 420).

[0104] The second insulating layer 440 can be in contact (e.g., direct contact) with the side surface 420S and the top surface of the first insulating layer 420 that define the first opening 420OP. In addition, the second insulating layer 440 can be in contact with the encapsulation layer 300 through the first opening 420OP. As one embodiment, Figure 7 An example in which the second insulating layer 440 can be in contact (e.g., direct contact) with the second inorganic encapsulation layer 330 through the first opening 420OP is illustrated.

[0105] The side surface 420S of the first insulating layer 420 can include an inclined surface. A smaller angle θ (hereinafter, referred to as an inclination angle) between the top surface of the encapsulation layer 300 (e.g., the top surface of the second inorganic encapsulation layer 330) and the side surface 420S of the first insulating layer 420 can be at least 70 degrees. For example, the inclination angle θ can be 70° ≤ θ < 90°. As another example, the inclination angle θ can be 70° ≤ θ ≤ 87°, 70° ≤ θ ≤ 85°, 70° ≤ θ ≤ 83°, or 70° ≤ θ ≤ 80°.

[0106] Because the side surface 420S of the first insulating layer 420 can include an inclined surface that is tapered forward with respect to the top surface of the encapsulation layer 300, the width of the first opening 420OP can gradually increase as the distance from the substrate 100 in a direction perpendicular to the top surface of the substrate 100 (z direction) increases. The width of the upper portion of the first opening 420OP can be greater than the width of the lower portion of the first opening 420OP, and the second width W2 of the first opening 420OP can correspond to the width of the lower portion of the first opening 420OP.

[0107] The second insulating layer 440 can protect the conductive layers included in the functional layer 400 by covering the conductive layers. For example, the second insulating layer 440 can cover and protect the first and second sub-conductive layers CTL1 and CTL2.

[0108] The second insulating layer 440 can include a material having a refractive index greater than that of the first insulating layer 420. For example, the second insulating layer 440 can include an organic material having a high refractive index. The second insulating layer 440 can include a material that can be cured by ultraviolet (UV) light. Light "L" emitted from the OLED OLED can be reflected from the side surface 420S of the first insulating layer 420 to improve light emission efficiency. For example, light "L" can be emitted from the OLED OLED and travel in a direction inclined with respect to a direction (z direction) perpendicular to the top surface of the substrate 100. Light "L" can be reflected from the side surface 420S of the first insulating layer 420 and travel outside the display apparatus, thereby improving light emission efficiency of the OLED OLED and increasing brightness of the OLED OLED.

[0109] In Figure 7 , an example in which the conductive layer included in the functional layer 400 includes a two-layer structure of the first sub-conductive layer CTL1 and the second sub-conductive layer CTL2 and the first sensing electrode SP1 and the second sensing electrode SP2 each include the conductive layer of the above-described two-layer structure has been described, but the disclosure is not limited thereto. The functional layer 400 can include a conductive layer that can be integral (single-layer structure) and can be disposed below or above the first insulating layer 420, and the first sensing electrode SP1 and the second sensing electrode SP2 can each include the integral conductive layer.

[0110] Figure 8 to Figure 10 is a schematic cross-sectional view of a display apparatus according to another embodiment. Referring to Figure 8 to Figure 10 the display apparatus of FIG. 1, because the structure from the substrate 100 to the encapsulation layer 300 can be the same as that described above with reference to Figure 7 , the following description will focus on the structure of the functional layer 400.

[0111] Referring to Figure 8 to Figure 10 , the functional layer 400 can include an integral conductive layer CTL. The conductive layer CTL can be disposed above the first insulating layer 420, for example, between the first insulating layer 420 and the second insulating layer 440 Figure 8 . As another example, the conductive layer CTL can be disposed below the first insulating layer 420. For example, as shown in Figure 9 , the conductive layer CTL can be disposed between the encapsulation layer 300 and the first insulating layer 420, thereby being covered by the first insulating layer 420. As another example, as shown in Figure 10 , the conductive layer CTL can be disposed above the encapsulation layer 300, but can not be covered by the first insulating layer 420. Other features in the functional layer 400 except for the position of the conductive layer CTL can be the same as those described above with reference to Figure 7 .

[0112] Figure 11 is a schematic cross-sectional view of a display device according to another embodiment, Figure 12 is Figure 11 a plan view of the display device of

[0113] Because the structure from the base 100 to the encapsulation layer 300 in the display device of Figure 11 may be the same as the structure described above with reference to Figure 7 , the following description will focus on the functional layer 400'.

[0114] The functional layer 400' can include a conductive layer CTL, a first insulating layer 420', and a second insulating layer 440'. The first insulating layer 420' can be in contact with a top surface of the encapsulation layer 300 (e.g., a top surface of the second inorganic encapsulation layer 330).

[0115] As shown in Figure 11 and Figure 12 , the first insulating layer 420' can overlap and / or cover the emission area EA. The first insulating layer 420' can be disposed to correspond to the emission area EA of each pixel. For example, the first insulating layers 420' disposed in adjacent emission areas EA can be separated from each other. In other words, a main portion of the first insulating layer 420' can be positioned to overlap the emission area EA of each pixel, and a removal portion (or an opening portion) formed by removing a portion of the first insulating layer 420' can be located between the main portions disposed in adjacent pixels. A central portion of the first insulating layer 420' can overlap the emission area EA or the second opening 209OP of the pixel-defining layer 209. A peripheral portion of the first insulating layer 420' can overlap the pixel-defining layer 209.

[0116] Although the first insulating layer 420 described above with reference to Figure 7 may be disposed to overlap the pixel-defining layer 209 and have a trapezoidal cross-section with a side surface 420S that is tapered forward, the first insulating layer 420' shown in Figure 11 may be disposed to overlap the emission area EA and can have an inverted trapezoidal cross-section with a side surface 420'S that is tapered in reverse.

[0117] A side surface 420'S of the first insulating layer 420' can include an inclined surface which can be inversely tapered along the inclined surface (e.g., in a direction away from the encapsulation layer 300). A smaller angle θ (hereinafter, referred to as an inclination angle) between a top surface of the encapsulation layer 300 (e.g., a top surface of the second inorganic encapsulation layer 330) and the side surface 420'S of the first insulating layer 420' can be at least 70 degrees. For example, the inclination angle θ can be 70° ≤ θ < 90°. As another example, the inclination angle θ can be 70° ≤ θ ≤ 87°, 70° ≤ θ ≤ 85°, 70° ≤ θ ≤ 83°, or 70° ≤ θ ≤ 80°.

[0118] A width W2' of the first insulating layer 420' can be greater than a first width W1' of the emission area EA. As described above, the first width W1' of the emission area EA can correspond to a width of the second opening 209OP of the pixel definition layer 209. Because the side surface 420'S of the first insulating layer 420' can include an inclined surface which is inversely tapered, a width of the first insulating layer 420' (e.g., a main portion of the first insulating layer 420') can gradually increase as a distance from the substrate 100 in a direction (z direction) perpendicular to the top surface of the substrate 100 increases. The width W2' of the first insulating layer 420' can correspond to a width of a lower portion of the first insulating layer 420'. As described above with reference to FIGS. 4A and 4B, the width W2' of the first insulating layer 420' can be greater than the first width W1' of the emission area EA. Figure 5A and Figure 5B The conductive layer CTL can include an opening CTL-OP, and a third width W3 of the opening CTL-OP can be greater than the width W2' of the first insulating layer 420'.

[0119] The first insulating layer 420' can be formed through an exposure and development process, and can include a photoresist. The first insulating layer 420' can be covered by the second insulating layer 440', and the second insulating layer 440' can be in contact with the side surface 420'S and the top surface of the first insulating layer 420'.

[0120] The second insulating layer 440' can include a material having a lower refractive index than a refractive index of the first insulating layer 420', for example, an organic material having a low refractive index. Light which can be emitted from the OLED OLED and travel in a direction which is inclined with respect to a direction (z direction) perpendicular to the top surface of the substrate 100 can be reflected from the side surface 420'S of the first insulating layer 420' and travel to the outside of the display apparatus, thereby improving the light emission efficiency of the OLED OLED and increasing the brightness of the OLED OLED.

[0121] Figure 13 FIG. 4B is a cross-sectional view schematically illustrating a display apparatus according to an embodiment.

[0122] In the display area DA, a display element can be provided for each pixel. For example, as described above with reference to FIG. 3, the display element can include a first insulating layer 420', a conductive layer 430', and a second insulating layer 440'.Figure 13 As shown in FIG. 1, the display layer 200 on the substrate 100 can include a first OLED OLED1 and a second OLED OLED2. The first OLED OLED1 and the second OLED OLED2 can be electrically connected to the TFT TFT, respectively. The structure of the display layer 200 can be the same as the structure described above with reference to FIG. 1. Figure 7

[0123] The first OLED OLED1 can emit first color light, and the second OLED OLED2 can emit second color light. The first color light Lc1 can be emitted from a first emission area EA1, and the second color light Lc2 can be emitted from a second emission area EA2. The first color light Lc1 and the second color light Lc2 can be reflected from a side surface 420S of the first insulating layer 420 and travel outside the display device. The first color and the second color can be different colors.

[0124] Figure 13 Examples in which the functional layer 400 can have the structure described with reference to FIG. 1 are shown, but the disclosure is not limited thereto. In another embodiment, the functional layer 400 can have a structure according to one of the embodiments described with reference to FIG. 1, the embodiments described with reference to FIG. 2, the embodiments described with reference to FIG. 3, and embodiments derived from the above-described embodiments. Figure 7 Figure 8 to Figure 10 Figure 11

[0125] Figure 14 is a cross-sectional view schematically showing a display device according to an embodiment.

[0126] With reference to FIG. 1, Figure 14 The display area DA can include a transmissive area TA and an emission area EA that can emit color light. As described above, the light emission efficiency of light Lc emitted from an OLED OLED disposed corresponding to the emission area EA can be improved by the structure of the first insulating layer 420 and the second insulating layer 440 that can be disposed in the functional layer 400.

[0127] The transmissive area TA can be an area in which external light Le that can not be generated in the display device travels in a direction from a rear surface of the substrate 100 toward the functional layer 400 (or in the opposite direction) while passing through the display device. In order to improve the transmittance of the transmissive area TA, a portion corresponding to the transmissive area TA can be removed from at least one layer included in the display layer 200. For example, the counter electrode 223 can include an opening 223OP disposed in the transmissive area TA, thereby improving the transmittance of the transmissive area TA.

[0128] ​​​​Because the display element such as the OLED OLED is not disposed in the transmissive area TA, a structure for improving the light emission efficiency of light emitted from the OLED OLED (for example, a structure of the first insulating layer 420 having an inclined side surface 420S) can not be disposed in the transmissive area TA.

[0129] Figure 14 Examples of structures in which the functional layer 400 can have are shown, but the disclosure is not limited thereto. In another embodiment, the functional layer 400 can have a structure according to one of the embodiments described with reference to Figure 7 Figure 8 to Figure 10 Figure 11 described embodiments, and embodiments derived from the above-described embodiments.

[0130] Embodiments can be advantageous. According to one or more embodiments, because the first insulating layer and the second insulating layer of the functional layer are disposed above the encapsulation layer, the number of layers can be reduced, thereby simplifying the process of manufacturing. The reduction in the number of layers can enable improvement in optical performance, thereby increasing light emitted from the display element that is visible to an external user. For example, embodiments can improve the transmittance of the display device itself. Furthermore, because the functional layer can be disposed to have a function of sensing a touch input and a function of improving optical performance, manufacturing efficiency can be improved and costs can be reduced.

[0131] It is to be understood that the embodiments described herein are to be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each embodiment should typically be considered as being applicable to other similar features or aspects in other embodiments. While one or more embodiments have been described with reference to the figures, it will be understood by those of ordinary skill in the art that various changes in form and details can be made therein without departing from the spirit and scope as defined by the following claims.​​

Claims

1. A display device, the display device comprising: Base; A display element is disposed above the substrate; An encapsulation layer is disposed above the display element and includes an inorganic encapsulation layer and an organic encapsulation layer; as well as A touch sensing layer is disposed above the encapsulation layer. The touch sensing layer comprises: a first insulating layer, including a side surface inclined relative to the top surface of the encapsulation layer and comprising an organic material; a conductive layer including sensing electrodes; and a second insulating layer covering the conductive layer and the first insulating layer, and in contact with the side surface of the first insulating layer. The first insulating layer overlaps with the emitting region of the display element and has a width larger than the width of the emitting region. The refractive index of the first insulating layer is greater than that of the second insulating layer.

2. The display device according to claim 1, wherein, The side surface of the first insulating layer includes an inclined surface that is inverted conical in the direction away from the encapsulation layer.

3. The display device according to claim 1, wherein, The display element includes: Pixel electrode; A pixel defining layer covers the edge of the pixel electrode and includes a second opening superimposed on the pixel electrode; The emission layer is superimposed on the second opening; and For the electrodes, cover the emitting layer. Wherein, the central portion of the first insulating layer overlaps with the second opening of the pixel defining layer, and The outer portion of the first insulating layer is superimposed on the pixel defining layer.

4. The display device according to claim 1, wherein, At least a portion of the first insulating layer contacts the top surface of the encapsulation layer.

5. The display device according to claim 4, wherein, The encapsulation layer includes: First inorganic encapsulation layer; The organic encapsulation layer; and Second inorganic encapsulation layer, The first inorganic encapsulation layer, the organic encapsulation layer, and the second inorganic encapsulation layer are stacked on top of each other, and A portion of the first insulating layer contacts the second inorganic encapsulation layer.

6. The display device according to claim 1, wherein, The first insulating layer includes a photoresist.

7. A display device, the display device comprising: Base; Pixel electrodes are disposed above the substrate; A pixel defining layer includes an opening that is stacked with the pixel electrode and defines an emission region; An emission layer is disposed in the opening; The counter electrode is disposed above the emission layer; An encapsulation layer is disposed above the counter electrode and includes an inorganic encapsulation layer and an organic encapsulation layer; A conductive layer is disposed above the encapsulation layer and includes sensing electrodes; The first organic insulating layer includes a side surface that is inclined relative to the top surface of the encapsulation layer; as well as A second organic insulating layer covers the first organic insulating layer and the conductive layer, and is in contact with the side surface of the first organic insulating layer. Wherein, the first organic insulating layer includes a main portion overlapping the opening of the pixel defining layer, and The refractive index of the second organic insulating layer is less than that of the first organic insulating layer.

8. The display device according to claim 7, wherein, The side surface of the first organic insulating layer includes an inclined surface that is inverted conical in the direction away from the encapsulation layer.

9. The display device according to claim 7, wherein, The outer portion of the first organic insulating layer is superimposed on a portion of the main body portion of the pixel defining layer.

10. The display device according to claim 7, wherein, The first organic insulating layer includes a photoresist.

11. The display device according to claim 7, wherein, The encapsulation layer includes: First inorganic encapsulation layer; The organic encapsulation layer; and Second inorganic encapsulation layer, The first inorganic encapsulation layer, the organic encapsulation layer, and the second inorganic encapsulation layer are stacked on top of each other, and A portion of the first organic insulating layer contacts the second inorganic encapsulation layer.

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