Display device and thin film encapsulation layer for display device

Abstract

A display device and a thin film encapsulation layer for the display device are provided. The display device includes a substrate including a display area and a non-display area. A light-emitting device is located on the display area. The thin film encapsulation layer is located on the light-emitting device. The thin film encapsulation layer includes at least one inorganic encapsulation layer and at least one organic encapsulation layer. The organic encapsulation layer includes a plurality of organic particles having a core-shell structure, wherein the core-shell structure includes a hollow core and a shell surrounding the hollow core. A touch unit is located on the thin film encapsulation layer.

Description

[0001] This application claims the priority benefit of Korean Patent Application No. 10-2019-0088521 filed on Jul. 22, 2019, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] One or more embodiments relate to a display device, and more particularly, to a display device having a reduced thickness and improved touch sensitivity. Background Art

[0003] Various display devices are being developed for use in multimedia devices such as televisions, mobile phones, tablet computers, navigation devices, and video game devices. The display device may include various input devices such as a keyboard, a mouse, a touch unit, etc. However, in a display device having a touch unit directly disposed on a display unit, the sensitivity of the touch unit may be reduced due to parasitic capacitance between the display unit and the touch unit. Summary of the invention

[0004] A display device is provided that has a reduced thickness and also provides improved touch sensitivity. However, one or more embodiments are merely examples, and the scope of the disclosure is not limited thereto.

[0005] Additional aspects will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the presented embodiments disclosed.

[0006] According to one or more exemplary embodiments, a display device includes a substrate including a display area and a non-display area. A light emitting device is located on the display area. A thin film encapsulation layer is located on the light emitting device. The thin film encapsulation layer includes at least one inorganic encapsulation layer and at least one organic encapsulation layer. The organic encapsulation layer includes a plurality of organic particles having a core-shell structure, wherein the core-shell structure includes a hollow core and a shell surrounding the hollow core. A touch unit is located on the thin film encapsulation layer.

[0007] The organic encapsulation layer may have a dielectric constant of 2.6 or less.

[0008] The organic encapsulation layer may have a refractive index of 1.4 or less.

[0009] The shell may comprise a high molecular weight material.

[0010] The shell may include at least one selected from acrylic polymer, polyimide, urethane polymer, styrene-based polymer, siloxane-based polymer, epoxy-based polymer, and combinations thereof.

[0011] The surface of the shell may be electrically neutral.

[0012] Charged particles can be omitted from the surface of the shell.

[0013] The thickness of the shell may be from about 5 nm to about 50 nm.

[0014] The diameter of the organic particles may be about 10 nm to about 200 nm.

[0015] The organic encapsulating layer may further include an organic encapsulating material including a monomer-based organic material or a polymer-based material, and the organic particles may be included in the organic encapsulating layer at a percentage of about 10% to about 80% by volume of the organic encapsulating material.

[0016] The touch unit may be directly disposed on the thin film encapsulation layer, and the touch unit may include a detection electrode disposed on the display area and a signal line disposed on the non-display area and connected to the detection electrode.

[0017] The detection electrodes may have a grid shape.

[0018] The detection electrode may include a first detection electrode and a second detection electrode, and the signal line may include a first signal line connected to the first detection electrode and a second signal line connected to the second detection electrode.

[0019] The touch unit may include: a first conductive layer; a second conductive layer located on the first conductive layer; a first insulating layer located between the first conductive layer and the second conductive layer; and a second insulating layer located on the second conductive layer.

[0020] The first conductive layer and the second conductive layer may be electrically connected to each other via a contact hole defined in the first insulating layer.

[0021] The light emitting device may include a pixel electrode, an opposing electrode on the pixel electrode, and an intermediate layer between the pixel electrode and the opposing electrode, the intermediate layer including an emission layer. A distance between the first conductive layer and the opposing electrode may be about 5 μm to about 20 μm.

[0022] According to one or more exemplary embodiments, a display device includes a substrate. A pixel electrode is located on the substrate. An intermediate layer is arranged on the pixel electrode and includes an emission layer. A counter electrode is located on the intermediate layer. A thin film encapsulation layer is located on the counter electrode and includes an inorganic encapsulation layer and an organic encapsulation layer located on the inorganic encapsulation layer. The organic encapsulation layer has a dielectric constant of about 2.6 or less. A touch unit is directly located on the thin film encapsulation layer and includes a conductive layer configured to detect an external input.

[0023] The organic encapsulation layer may include organic particles having a core-shell structure including a hollow core and a shell around the hollow core.

[0024] The organic particles may include at least one selected from acrylic polymers, polyimides, urethane polymers, styrene-based polymers, siloxane-based polymers, epoxy-based polymers, and combinations thereof.

[0025] The organic encapsulation layer may have a refractive index of 1.4 or less.

[0026] According to one or more exemplary embodiments, a thin film encapsulation layer for a display device includes at least one inorganic encapsulation layer and at least one organic encapsulation layer. The at least one organic encapsulation layer includes an organic encapsulation material including a monomeric organic material or a polymeric material. The at least one organic encapsulation layer also includes a plurality of organic particles having a core-shell structure, the core-shell structure including a hollow core and a shell surrounding the hollow core. The organic particles are included in the organic encapsulation layer at a percentage of about 10% to about 80% of the volume of the organic encapsulation material.

[0027] These and / or other aspects will become apparent and more readily understood through a description of exemplary embodiments, claims and accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other aspects, features and advantages of certain exemplary embodiments disclosed will become more apparent through the following description in conjunction with the accompanying drawings, in which:

[0029] Figure 1 is a perspective view of a display device according to an exemplary embodiment of the inventive concept;

[0030] Figure 2 is a display device according to an exemplary embodiment of the inventive concept Figure 1 A cross-sectional view taken along line AA';

[0031] Figure 3 is a top plan view of a portion of a display device according to an exemplary embodiment of the inventive concept;

[0032] Figure 4 is an equivalent circuit diagram of a pixel that may be included in a display device according to an exemplary embodiment of the inventive concept;

[0033] Figure 5 is a cross-sectional view of a portion of a display device according to an exemplary embodiment of the inventive concept;

[0034] Figure 6 is a top plan view of a touch unit of a display device according to an exemplary embodiment of the inventive concept;

[0035] Figure 7 According to an exemplary embodiment of the present inventive concept Figure 6 An enlarged view of area BB;

[0036] Figure 8 A portion of a display device according to an exemplary embodiment of the inventive concept is provided along Figure 7 A cross-sectional view taken along line CC';

[0037] Fig. 9 According to an exemplary embodiment of the present inventive concept Figure 8 A magnified image of organic particles; and

[0038] Fig.10 is a cross-sectional view of a portion of a display device according to an exemplary embodiment of the inventive concept. DETAILED DESCRIPTION

[0039] Since the disclosure allows various changes and many embodiments, specific exemplary embodiments will be described in detail in the accompanying drawings and in text description. Hereinafter, the effects and features of the present disclosure and methods for implementing them will be more fully described with reference to the accompanying drawings, in which exemplary embodiments of the inventive concept are shown. However, the inventive concept can be implemented in many different forms and should not be construed as being limited to the exemplary embodiments set forth herein.

[0040] One or more exemplary embodiments of the inventive concept will be described in more detail below with reference to the accompanying drawings. Regardless of the figure numbers, those components that are the same or corresponding are given the same reference numerals, and redundant descriptions are omitted.

[0041] It will be understood that although the terms "first", "second", etc. may be used herein to describe various components, these components should not be limited by these terms. These terms are only used to distinguish one component from another component.

[0042] As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0043] It will also be understood that the terms “comprises” and / or “comprising” used herein specify the presence of stated features or components, but do not preclude the presence or addition of one or more other features or components.

[0044] It will be understood that when a layer, region or component is referred to as being "formed on" another layer, region or component, the layer, region or component may be directly or indirectly formed on the other layer, region or component. For example, there may be intervening layers, regions or components.

[0045] For the convenience of explanation, the size of the elements in the drawings may be exaggerated. In other words, since the size and thickness of the components in the drawings are arbitrarily shown for the convenience of explanation, the following exemplary embodiments are not limited thereto.

[0046] Certain exemplary embodiments may be implemented differently. For example, a particular process sequence may be performed in a different order than described. For example, two consecutively described processes may be performed substantially simultaneously, or two consecutively described processes may be performed in an order opposite to the order described.

[0047] In the present specification, "A and / or B" means A or B or A and B. The expression "at least one of A and B" means only A, only B, both A and B, or variations thereof.

[0048] It will also be understood that when a layer, region, or component is referred to as being "connected" or "coupled" to another layer, region, or component, the layer, region, or component may be directly connected or coupled to the other layer, region, or component, or there may be intervening layers, regions, or components. For example, when a layer, region, or component is referred to as being "electrically connected" or "electrically coupled" to another layer, region, or component, the layer, region, or component may be directly electrically connected or coupled to the other layer, region, or component, or there may be intervening layers, regions, or components.

[0049] In the following examples, the x-axis, y-axis, and z-axis (or x-direction, y-direction, and z-direction) are not limited to the three axes of the rectangular coordinate system, but can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.

[0050] Figure 1 is a perspective view of a display apparatus 1 according to an exemplary embodiment of the inventive concept.

[0051] Reference Figure 1 , the display device 1 includes a display area DA for displaying an image and a non-display area NDA in which no image is displayed. The non-display area NDA may be disposed around the periphery of the display area DA (eg, in the x-direction and / or the y-direction). Figure 1 In the exemplary embodiment shown in FIG. 1 , the non-display area NDA surrounds four sides of the display area DA. However, in other exemplary embodiments, the non-display area NDA may surround three or fewer sides of the display area DA. The display device 1 may provide an image by using light emitted by a plurality of pixels P arranged in the display area DA.

[0052] Although an organic light-emitting display device will now be shown and described as the display device 1, exemplary embodiments of the inventive concept are not limited thereto. For example, in another exemplary embodiment, the display device 1 may be an inorganic light-emitting display, a quantum dot light-emitting display, etc. For example, an emission layer of a display element included in the display device 1 may include an organic material, an inorganic material, a quantum dot, an organic material and a quantum dot, an inorganic material and a quantum dot, etc.

[0053] although Figure 1 The exemplary embodiment of the present invention shows a display device 1 having a flat display surface, but the exemplary embodiments of the present inventive concept are not limited thereto. For example, in another exemplary embodiment of the present inventive concept, the display device 1 may include a three-dimensional display surface or a curved display surface.

[0054] In an exemplary embodiment in which the display device 1 includes a three-dimensional display surface, the display device 1 may include a plurality of display areas oriented in different directions. For example, the display device 1 may include a display surface in the form of a multi-prism. In an exemplary embodiment in which the display device 1 includes a curved display surface, the display device 1 may be implemented in various forms including a flexible display device, a foldable display device, and a rollable display device.

[0055] like Figure 1 As shown in the exemplary embodiment of the present invention, the display device 1 may be a mobile phone. The mobile phone may include an electronic module, a camera module, a power module, etc. mounted on a mainboard and arranged in a bracket / housing, etc. together with the display device 1. However, in other exemplary embodiments of the present inventive concept, the display device 1 may be a large electronic device (such as a television and a monitor) or other small and medium-sized electronic devices (such as a tablet computer, a car navigation device, a game console, a smart watch, etc.).

[0056] exist Figure 1 In the exemplary embodiment shown in FIG. 1 , the display area DA of the display device 1 is rectangular. However, in other exemplary embodiments, the shape of the display area DA may be circular, elliptical, a polygon such as a triangle or a pentagon, or the like.

[0057] Figure 2 is a display device 1 according to an exemplary embodiment of the inventive concept. Figure 1 A cross-sectional view taken along line AA'. Figure 2 1 is a simplified cross-sectional view for explaining a stacking relationship between functional panels and / or functional units constituting the display device 1 .

[0058] like Figure 2As shown in the exemplary embodiment of , the display device 1 may include a display unit DU (e.g., a display layer), a touch unit TU, a polarization unit PU, and a window unit WU. At least some of the display unit DU, the touch unit TU, the polarization unit PU, and the window unit WU may be formed by a continuous process or may be combined with each other via an adhesive member. Figure 2 An optically transparent adhesive member OCA is shown as an adhesive member. The adhesive member to be described below may include any adhesive known in the related art. In some exemplary embodiments, the polarization unit PU and the window unit WU may be replaced by other components, or may be omitted altogether.

[0059] In an exemplary embodiment of the present inventive concept, the touch unit TU is directly disposed on the display unit DU. In this specification, the statement that "component B is directly disposed on component A" means that no adhesive layer / adhesive member is disposed between component A and component B. For example, component B may be formed on the base surface of component A through a continuous process after component A is formed.

[0060] The display unit DU and the touch unit TU directly disposed on the display unit DU may both be defined as a display panel DP. Figure 2 As shown in the exemplary embodiment of , the optically transparent adhesive member OCA may be arranged between the display panel DP and the polarization unit PU and between the polarization unit PU and the window unit WU, respectively (eg, in the z direction).

[0061] The display unit DU generates an image, and the touch unit TU obtains coordinate information of an external input (e.g., a touch event, etc.). In an exemplary embodiment, the display panel DP may further include a protective member disposed on a lower surface of the display unit DU. The protective member and the display unit DU may be bonded to each other via an adhesive member.

[0062] The display unit DU according to the exemplary embodiment may be a light-emitting display panel, but is not particularly limited. For example, in the exemplary embodiment, the display unit DU may be an organic light-emitting display panel or a quantum dot light-emitting display panel. The emission layer of the organic light-emitting display panel may include an organic light-emitting material. The emission layer of the quantum dot light-emitting display panel may include quantum dots, quantum rods, etc. For ease of description, the display unit DU as an organic light-emitting display panel will be described here.

[0063] The polarization unit PU reduces the reflectivity of external light incident on the window unit WU from the top thereof. In an exemplary embodiment of the present inventive concept, the polarization unit PU may include a phase retarder and a polarizer. The phase retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may also be a film type or a liquid crystal coating type. The film type polarizer / phase retarder may include a stretched synthetic resin film, and the liquid crystal coating type polarizer / phase retarder may include liquid crystals arranged in a predetermined arrangement. The phase retarder and the polarizer may also include protective films, respectively. The phase retarder and the polarizer or the protective film may be defined as the base layer of the polarization unit PU.

[0064] The structures of the display unit DU and the touch unit TU will now be described in detail.

[0065] Figure 3 is a top plan view of a portion of a display apparatus 1 according to an exemplary embodiment of the inventive concept.

[0066] Reference Figure 3 , the display panel DP includes a plurality of pixels P arranged in a display area DA. However, Figure 3 The simplified diagram of FIG. 1 shows a single pixel P. Each of the plurality of pixels P may include an organic light emitting diode OLED (see FIG. Figure 5 ) display element. Each of the plurality of pixels P may emit, for example, red light, green light, blue light, or white light from an organic light emitting diode OLED. However, in other exemplary embodiments, the pixels P may emit light of other colors. The pixel P used herein may be understood as a pixel that emits one of red light, green light, blue light, and white light as described above. The display area DA may be covered with a thin film encapsulation layer TFE (see Figure 5 ) to protect the display area DA from pollutants such as ambient air, moisture, etc.

[0067] Each of the plurality of pixels P may be electrically connected to an external circuit disposed in the non-display area NDA. Figure 3 In the exemplary embodiment shown in , the non-display area NDA may include a first scan driving circuit 110, a second scan driving circuit 120, a pad (or referred to as a "pad") unit 140, a data driving circuit 150, a first power line 160 and a second power line 170.

[0068] The first scan driving circuit 110 may provide a scan signal to each of the plurality of pixels P via the scan lines SL. Figure 3As shown in the exemplary embodiment of , the scan line SL may extend in the x-direction. However, the exemplary embodiments of the present invention are not limited thereto. The first scan drive circuit 110 may provide a light emitting control signal to each of the plurality of pixels P via the light emitting control line EL. In an exemplary embodiment, the light emitting control line EL may extend in the x-direction and may be spaced apart from the scan line SL in the y-direction. However, the exemplary embodiments of the present invention are not limited thereto. The second scan drive circuit 120 may be arranged side by side with the first scan drive circuit 110, and the display area DA is located between the second scan drive circuit 120 and the first scan drive circuit 110. For example, as Figure 3 As shown in the exemplary embodiment of the present invention, the first scan driving circuit 110 and the second scan driving circuit 120 may be arranged on the left and right sides of the non-display area NDA, respectively, and spaced apart in the x direction. However, the exemplary embodiments of the present invention are not limited thereto. In an exemplary embodiment, some of the plurality of pixels P arranged in the display area DA may be electrically connected to the first scan driving circuit 110, and the remaining pixels P of the pixels P may be connected to the second scan driving circuit 120. However, in other exemplary embodiments, the second scan driving circuit 120 may be omitted.

[0069] The pad unit 140 may be disposed on one side of the substrate 100. For example, Figure 3 As shown in the exemplary embodiment of , the pad unit 140 may be arranged on the lower side (e.g., in the y direction) of the display panel DP. In an exemplary embodiment, the pad unit 140 may be exposed by not being covered by the insulating layer and may be electrically connected to the printed circuit board PCB. The pad unit PCB-P of the printed circuit board PCB may be electrically connected to the pad unit 140 of the display device 1. The printed circuit board PCB transmits a signal or power of the controller to the display device 1.

[0070] The control signal generated by the controller may be transmitted to each of the first scan driving circuit 110 and the second scan driving circuit 120 via the printed circuit board PCB. The controller may transmit the first power (such as, Figure 4 A first power supply voltage ELVDD and a second power (such as Figure 4 The first power supply voltage ELVDD may be supplied to each of the plurality of pixels P via the driving voltage line PL connected to the first power supply line 160, and the second power supply voltage ELVSS may be supplied to the counter electrode of each of the plurality of pixels P connected to the second power supply line 170.

[0071] The data driving circuit 150 is electrically connected to the data line DL. Figure 3As shown in the exemplary embodiment shown in , the data line DL may extend in the y direction. However, exemplary embodiments of the inventive concept are not limited thereto. The data signal of the data driving circuit 150 may be provided to each of the plurality of pixels P via the connection line 151 connected to the pad unit 140 and the data line DL connected to the connection line 151. Figure 3 An arrangement is shown in which the data driving circuit 150 is disposed on the printed circuit board PCB. However, in another exemplary embodiment, the data driving circuit 150 may be disposed on the substrate 100. For example, the data driving circuit 150 may be disposed between the pad unit 140 and the first power line 160 (e.g., in the y direction).

[0072] The first power line 160 may include a first sub-wiring 162 and a second sub-wiring 163, each of which extends in the x-direction, is parallel to each other and is spaced apart in the y-direction, and the display area DA is located between the first sub-wiring 162 and the second sub-wiring 163. For example, the first sub-wiring 162 may be disposed on the bottom of the non-display area NDA (e.g., in the y-direction), and the second sub-wiring 163 may be disposed on the top of the non-display area NDA (e.g., in the y-direction). However, exemplary embodiments of the inventive concept are not limited thereto. The second power line 170 may partially surround the display area DA by having a ring shape with one side thereof open.

[0073] Figure 4 is an equivalent circuit diagram of a pixel P that may be included in the display device 1 according to an exemplary embodiment of the inventive concept.

[0074] Reference Figure 4 , each pixel P includes a pixel circuit PC connected to a scan line SL and a data line DL and an organic light emitting diode OLED connected to the pixel circuit PC.

[0075] The pixel circuit PC includes a driving thin film transistor (TFT) Td, a switching TFT Ts and a storage capacitor Cst. The switching TFT Ts is connected to the scan line SL and the data line DL and transmits a data signal Dm received via the data line DL to the driving TFT Td according to a scan signal Sn received via the scan line SL.

[0076] The storage capacitor Cst is connected to the switching TFT Ts and the driving voltage line PL, and stores a voltage corresponding to a difference between a voltage received from the switching TFT Ts and a first power source voltage ELVDD (or driving voltage) supplied to the driving voltage line PL.

[0077] The driving TFT Td is connected to the driving voltage line PL and the storage capacitor Cst, and can control the driving current flowing from the driving voltage line PL to the organic light emitting diode OLED according to the voltage value stored in the storage capacitor Cst. The organic light emitting diode OLED can emit light with a certain brightness according to the driving current.

[0078] although Figure 4 The exemplary embodiment of the embodiment shows an embodiment in which the pixel circuit PC includes two TFTs and one storage capacitor, but the exemplary embodiments of the present invention are not limited thereto. For example, in other exemplary embodiments, the pixel circuit PC may include seven TFTs and one storage capacitor. However, the exemplary embodiments of the present invention are not limited thereto. For example, in another exemplary embodiment, the pixel circuit PC may include two or more storage capacitors. In addition, although Figure 4 The exemplary embodiment of the present invention illustrates the TFT as having a single gate structure, but in other exemplary embodiments, at least one of the TFTs may have a double gate structure, etc.

[0079] Figure 5 is a cross-sectional view of a portion of a display apparatus 1 according to an exemplary embodiment of the inventive concept.

[0080] Reference Figure 5 The display panel DP includes a display unit DU and a touch unit TU. In order to illustrate the stacking structure of the touch unit TU, the display unit DU is simply shown. For example, in an exemplary embodiment, a touch unit TU may also be arranged Figure 2 The polarization unit PU and Figure 2 Window unit WU.

[0081] The display unit DU may be obtained by sequentially arranging a circuit layer CL, an organic light emitting diode OLED, and a thin film encapsulation layer TFE on the substrate 100 (eg, in the z direction). The touch unit TU may be directly arranged on the thin film encapsulation layer TFE. Figure 5 As shown in the exemplary embodiment of FIG. 1 , the bottom surface of the touch unit TU may be disposed directly on the top surface of the thin film encapsulation layer TFE (eg, in the z direction). Figure 8 As shown in FIG, the thin film encapsulation layer TFE includes at least one organic encapsulation layer 320 that can provide a relatively flat base surface. Therefore, even in an embodiment in which components of a touch unit TU to be described later are directly formed on the display unit DU through a continuous process, the defect rate can be reduced.

[0082] The touch unit TU may have a multi-layer structure. The touch unit TU includes a detection electrode, a signal line connected to the detection electrode, and at least one insulating layer. In an exemplary embodiment, the touch unit TU may detect an external input according to an electrostatic capacitance method. However, the exemplary embodiments of the inventive concept are not limited thereto. For example, in another exemplary embodiment, the operation method of the touch unit TU may include sensing an external input according to an electromagnetic induction method, a pressure detection method, and the like.

[0083] like Figure 5 As shown in the exemplary embodiment of , the touch unit TU may include a first conductive layer CL1, a first insulating layer IL1, a second conductive layer CL2, and a second insulating layer IL2. Each of the first conductive layer CL1 and the second conductive layer CL2 may have a single-layer structure or a stacked multilayer structure. The conductive layer having a single-layer structure may include a metal layer or a transparent conductive layer. In an exemplary embodiment, the metal layer may include molybdenum, silver, titanium, copper, aluminum, and alloys thereof. In an exemplary embodiment, the transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO). Optionally, the transparent conductive layer may include a conductive polymer (e.g., PEDOT), a metal nanowire, graphene, etc.

[0084] The conductive layer having a multi-layer structure may include a plurality of metal layers. In an exemplary embodiment, the plurality of metal layers may have a three-layer structure of Ti / Al / Ti. The conductive layer having a multi-layer structure may include at least one metal layer and at least one transparent conductive layer.

[0085] Each of the first conductive layer CL1 and the second conductive layer CL2 includes a plurality of patterns. It will be understood that the first conductive layer CL1 includes a first conductive pattern and the second conductive layer CL2 includes a second conductive pattern. Each of the first conductive pattern and the second conductive pattern may include a plurality of patterns. Figure 6 The detection electrodes and signal lines are shown in the exemplary embodiment.

[0086] The stacking structure and material of the detection electrode can be determined by considering the sensing sensitivity. RC delay affects the sensing sensitivity. Because the detection electrode including the metal layer has a smaller resistance than the detection electrode including the transparent conductive layer, the RC value is reduced. Therefore, the charging time period of the capacitor defined between the detection electrodes is reduced. Compared with the detection electrode including the metal layer, the detection electrode including the transparent conductive layer is not visually recognized by the user, and the input area is increased, thereby increasing the capacitance.

[0087] As will be referred to later Figure 6 As described, the sensing electrode including the metal layer may have a mesh shape to prevent the sensing electrode from being visually recognized by a user.

[0088] Each of the first insulating layer IL1 and the second insulating layer IL2 may have a single layer or multi-layer structure. Each of the first insulating layer IL1 and the second insulating layer IL2 may include an inorganic material, an organic material, or a combination thereof.

[0089] According to another exemplary embodiment, at least one of the first insulating layer IL1 and the second insulating layer IL2 may include an inorganic layer. In an exemplary embodiment, the inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0090] According to an exemplary embodiment, at least one of the first insulating layer IL1 and the second insulating layer IL2 may include an organic layer. For example, the organic layer may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin. However, exemplary embodiments of the inventive concept are not limited thereto.

[0091] According to an exemplary embodiment, the distance d between the touch unit TU and the organic light emitting diode OLED (for example, in the z direction) may be about 5 μm to about 20 μm, and may be, for example, about 10 μm. The distance d is the thickness of the thin film encapsulation layer TFE disposed between the touch unit TU and the organic light emitting diode OLED. Figure 8 As shown in the exemplary embodiment of FIG. 1 , the distance d between the touch unit TU and the organic light emitting diode OLED may be the distance d between the first conductive layer 410 of the touch unit TU and the opposing electrode 230 .

[0092] Figure 6 is a top plan view of a touch unit TU of a display device 1 according to an exemplary embodiment of the inventive concept, Figure 7 According to an exemplary embodiment of the present inventive concept Figure 6 An enlarged view of area BB.

[0093] Reference Figure 6 , the touch unit TU may include first detection electrodes IE1-1 to IE1-5, first signal lines SL1-1 to SL1-5 respectively connected to the first detection electrodes IE1-1 to IE1-5, second detection electrodes IE2-1 to IE2-4, and second signal lines SL2-1 to SL2-4 respectively connected to the second detection electrodes IE2-1 to IE2-4.

[0094] In an exemplary embodiment, the touch unit TU is composed of Figure 5 The first conductive layer CL1 is formed into the first detection electrodes IE1-1 to IE1-5, and the Figure 5The second conductive layer CL2 forms the second detection electrodes IE2 - 1 to IE2 - 4 . Figure 6 The first detection electrodes IE1-1 to IE1-5 and the second detection electrodes IE2-1 to IE2-4 each having a mesh shape are shown. In an exemplary embodiment, the first detection electrodes IE1-1 to IE1-5 and the second detection electrodes IE2-1 to IE2-4 may have a three-layer structure of titanium / aluminum / titanium. However, exemplary embodiments of the inventive concept are not limited thereto.

[0095] The touch unit TU may further include an optical dummy electrode disposed in a boundary region between the first detection electrodes IE1-1 to IE1-5 and the second detection electrodes IE2-1 to IE2-4. For example, the touch unit TU may include a first dummy electrode formed of the first conductive layer CL1 and a second dummy electrode formed of the second conductive layer CL2.

[0096] The first dummy electrode is connected to the second sensor unit SP2 of the second detection electrodes IE2-1 to IE2-4 via a contact hole. The second dummy electrode is connected to the first sensor unit SP1 of the first detection electrodes IE1-1 to IE1-5 via a contact hole. The first dummy electrode and the second dummy electrode can reduce the resistance of the first detection electrodes IE1-1 to IE1-5 and the second detection electrodes IE2-1 to IE2-4.

[0097] The first detection electrodes IE1-1 to IE1-5 include first sensor units SP1, respectively, and first connection units CP1, respectively. The second detection electrodes IE2-1 to IE2-4 include second sensor units SP2, respectively, and second connection units CP2, respectively. Two first sensor units SP1 located at both ends (e.g., the left and right edges of the first sensor units SP1 in the x direction) from among the first sensor units SP1 may have a smaller size than the first sensor unit SP1 located at the center of the first detection electrodes IE1-1 to IE1-5 (e.g., in the x direction). For example, the size of the two first sensor units SP1 located at both ends may be about half the size of the other first sensor units SP1 of the first detection electrodes IE1-1 to IE1-5. Two second sensor units SP2 located at both ends (e.g., the top and bottom edges of the second sensor units SP2 in the y direction) from among the second sensor units SP2 may have a smaller size than the second sensor unit SP2 located at the center of the second detection electrodes IE2-1 to IE2-4 (e.g., in the y direction). For example, the size of the two second sensor units SP2 located at both ends may be approximately half the size of the other second sensor units SP2 of the second detection electrodes IE2 - 1 to IE2 - 4 .

[0098] although Figure 6The exemplary embodiment of the present invention shows the first detection electrodes IE1-1 to IE1-5 and the second detection electrodes IE2-1 to IE2-4 each having a pattern of a specific shape (such as a diamond shape), but the exemplary embodiments of the present invention are not limited thereto. For example, the first detection electrodes IE1-1 to IE1-5 and the second detection electrodes IE2-1 to IE2-4 may have a variety of shapes (such as any polygonal shape), and each of the first detection electrodes IE1-1 to IE1-5 and the second detection electrodes IE2-1 to IE2-4 may have a shape different from each other. In an exemplary embodiment, each of the first detection electrodes IE1-1 to IE1-5 and the second detection electrodes IE2-1 to IE2-4 may have a shape in which the sensor unit and the connection unit are not distinguished from each other (for example, a stripe shape).

[0099] The first sensor unit SP1 in one first detection electrode IE1-1, IE1-2, IE1-3, IE1-4 or IE1-5 is arranged along the x direction, and the second sensor unit SP2 in one second detection electrode IE2-1, IE2-2, IE2-3 or IE2-4 is arranged along the y direction. However, exemplary embodiments of the inventive concept are not limited thereto. Each first connection unit CP1 connects adjacent first sensor units SP1 to each other, and each second connection unit CP2 connects adjacent second sensor units SP2 to each other.

[0100] The first signal lines SL1-1 to SL1-5 are connected to the corresponding first ends of the first detection electrodes IE1-1 to IE1-5, respectively. Figure 6 As shown in the exemplary embodiment of the present invention, the first signal lines SL1-1 to SL1-5 can be connected to the corresponding first sensor units SP1 located on the left edges (e.g., in the x direction) of the first detection electrodes IE1-1 to IE1-5. However, the exemplary embodiments of the present inventive concept are not limited thereto. The second signal lines SL2-1 to SL2-4 are respectively connected to the corresponding ends of the second detection electrodes IE2-1 to IE2-4. For example, Figure 6 As shown in the exemplary embodiment of the present invention, the second signal lines SL2-1 to SL2-4 can be connected to the corresponding second sensor units SP2 positioned on the top edge and the bottom edge (for example, in the y direction) of the second detection electrodes IE2-1 to IE2-4. However, the exemplary embodiments of the present inventive concept are not limited thereto. According to another exemplary embodiment, the first signal lines SL1-1 to SL1-5 can be connected to the corresponding two ends (for example, the left edge and the right edge in the x direction) of the first detection electrodes IE1-1 to IE1-5, respectively. According to another exemplary embodiment, the second signal lines SL2-1 to SL2-4 can be connected to the corresponding first ends of the second detection electrodes IE2-1 to IE2-4, respectively.

[0101] Compared with the touch unit TU including the second signal lines SL2-1 to SL2-4 respectively connected to the respective first ends of the second detection electrodes IE2-1 to IE2-4 according to the comparative example, the touch unit TU including the second signal lines SL2-1 to SL2-4 respectively connected to the respective two ends of the second detection electrodes IE2-1 to IE2-4 can provide improved sensing sensitivity. Because the second detection electrodes IE2-1 to IE2-4 have a length (e.g., a length extending in the y direction) greater than the length of the first detection electrodes IE1-1 to IE1-5 (e.g., a length extending in the x direction), a voltage drop of the detection signal (or transmission signal) occurs, and thus, the sensing sensitivity is reduced. According to the present exemplary embodiment, since the detection signal (or transmission signal) is provided via the second signal lines SL2-1 to SL2-4 respectively connected to the respective two ends of the second detection electrodes IE2-1 to IE2-4, the voltage drop of the detection signal (or transmission signal) is prevented from occurring, and thus, the reduction in sensing sensitivity can be prevented.

[0102] Each of the first signal lines SL1 - 1 to SL1 - 5 and the second signal lines SL2 - 1 to SL2 - 4 may include a line unit SL-L and a pad unit SL-P.

[0103] Reference Figure 6 and Figure 7 In the exemplary embodiment shown in FIG. 1 , each of the first detection electrodes IE1-1 to IE1-5 and the second detection electrodes IE2-1 to IE2-4 may have a mesh shape. Since each of the first detection electrodes IE1-1 to IE1-5 and the second detection electrodes IE2-1 to IE2-4 has a mesh shape, the first detection electrodes IE1-1 to IE1-5 and the second detection electrodes IE2-1 to IE2-4 and the mesh shape may be reduced. Figure 5 As will be described later, the first detection electrodes IE1-1 to IE1-5 and the second detection electrodes IE2-1 to IE2-4 do not overlap with the light emitting areas PA-R, PA-G and PA-B and are therefore not visible to the user of the display device 1.

[0104] In an exemplary embodiment, the first detection electrodes IE1-1 to IE1-5 and the second detection electrodes IE2-1 to IE2-4 each having a mesh shape may include silver, aluminum, copper, chromium, nickel, titanium, etc., on which a low temperature process may be performed. Therefore, even when the input sensing unit (ISU) is formed through a continuous process, the Figure 8 However, exemplary embodiments of the inventive concept are not limited thereto.

[0105] although Figure 7 Only the first sensor unit SP1 is shown, but each of the other first sensor units SP1 and each of the second sensor units SP2 may have the same Figure 7 The structure of the first sensor unit SP1 shown in FIG. 1 is substantially the same as that of the first sensor unit SP1. The first sensor unit SP1 does not overlap with the light emitting areas PA-R, PA-G, and PA-B, but overlaps with the non-light emitting area NPA. Each of the light emitting areas PA-R, PA-G, and PA-B may be defined as Figure 8 The light emitting area PA is the same.

[0106] The grid lines of the first sensor unit SP1 may define a plurality of grid holes OPR, OPG, and OPB (hereinafter, referred to as grid holes). In an exemplary embodiment, the grid lines may have a three-layer structure of titanium / aluminum / titanium. The grid holes OPR, OPG, and OPB may have a one-to-one correspondence with the light emitting areas PA-R, PA-G, and PA-B.

[0107] The light emitting areas PA-R, PA-G, and PA-B may be classified into a plurality of groups according to the colors of light beams generated by the organic light emitting diodes OLED. Figure 7 The light emitting areas PA-R, PA-G and PA-B classified into three groups according to the colors of the emitted light beams are shown. According to an exemplary embodiment, the light emitting areas PA-R, PA-G and PA-B may emit red light, green light and blue light, respectively.

[0108] exist Figure 7 In the exemplary embodiment shown in FIG. 1 , the grid holes OPR, OPG, and OPB are shown to have a one-to-one correspondence with the light-emitting areas PA-R, PA-G, and PA-B. However, the exemplary embodiments of the inventive concept are not limited thereto. For example, in other exemplary embodiments, each of the grid holes OPR, OPG, and OPB may correspond to two or more of the light-emitting areas PA-R, PA-G, and PA-B. Figure 7 In the exemplary embodiment of the present invention, the planar shapes of the mesh holes OPR, OPG, and OPB correspond to the shapes of the light emitting areas PA-R, PA-G, and PA-B, and are therefore shown as rhombus shapes. However, the exemplary embodiments of the inventive concept are not limited thereto. For example, the mesh holes OPR, OPG, and OPB may have a planar shape of any other polygonal shape (such as a polygonal shape with rounded corners, etc.) other than a rhombus shape.

[0109] According to the present exemplary embodiment, the above reference Figure 5The thickness of the thin film encapsulation layer TFE described may be adjusted so that the noise generated by the components of the organic light emitting diode OLED does not affect the touch unit TU. For example, in an exemplary embodiment, the thickness of the thin film encapsulation layer TFE may be about 10 μm. In another exemplary embodiment, the thickness of the thin film encapsulation layer TFE may be about 5 μm to about 15 μm.

[0110] In a comparative example, when the touch unit is included as a dedicated panel (e.g., a touch panel) and is stacked on a display unit (e.g., a display panel), the thickness of the substrate included in the touch panel results in a gap of approximately 200 μm or more between a detection electrode included in the touch panel and a counter electrode included in the display panel.

[0111] However, in an embodiment in which the touch unit TU is directly disposed on the display unit DU as in an exemplary embodiment of the present inventive concept, the detection electrodes (eg, the first conductive layer CL1 and the second conductive layer CL2) of the touch unit TU are connected to each other. Figure 8 The thickness of the thin film encapsulation layer TFE is only (e.g., a gap of about 10 μm) between the counter electrode 230 included in the display unit DU. Therefore, the parasitic capacitance between the detection electrode of the touch unit TU and the counter electrode included in the display unit DU increases by about 20 times or more, and thus the sensitivity of the touch unit TU decreases.

[0112] The capacitor can satisfy the formula of Equation 1:

[0113] [Equation 1]

[0114]

[0115] In Equation 1, cap is capacitance, ε is dielectric constant, A is area, and d is the distance between the detection electrode and the counter electrode of the touch unit TU. Therefore, the capacitance cap is defined as being inversely proportional to the distance d between the detection electrode and the counter electrode of the touch unit TU, and being proportional to the dielectric constant ε and the area A. Therefore, in order to reduce the parasitic capacitance between the detection electrode and the counter electrode, the dielectric constant ε needs to be reduced.

[0116] The refractive index can satisfy the formula of Equation 2:

[0117]

[0118] n: refractive index, ε: dielectric constant, μ: magnetic permeability, v: speed of light in the medium, c: speed of light in vacuum, μ 0 : Vacuum magnetic permeability, ε 0 : Vacuum dielectric constant, ε r : Relative dielectric constant.

[0119] Referring to Equation 2, the dielectric constant ε is defined to be substantially proportional to the square of the refractive index n.

[0120] Therefore, the display device 1 according to an exemplary embodiment of the inventive concept includes a thin film encapsulation layer TFE having a low refractive index to reduce the dielectric constant ε of the thin film encapsulation layer TFE. In an exemplary embodiment, the thin film encapsulation layer TFE may include organic particles each having a core-shell structure providing a low refractive index. Figure 8 and Fig. 9 This is described in detail.

[0121] Figure 8 is a portion of the display device 1 according to the exemplary embodiment. Figure 7 A cross-sectional view taken along line CC'. Fig. 9 yes Figure 8 Magnified image of the organic particles OP.

[0122] Reference Figure 8 , the display unit DU can be obtained by sequentially arranging a circuit layer CL, an organic light emitting diode OLED, and a thin film encapsulation layer TFE on a substrate 100. The bottom of the circuit layer CL can be directly disposed on the top of the substrate 100 (for example, in the z direction). The bottom of the organic light emitting diode OLED can be directly disposed on the top of the circuit layer CL (for example, in the z direction). The bottom of the thin film encapsulation layer TFE can be directly disposed on the top of the organic light emitting diode OLED (for example, in the z direction). The bottom of the touch unit TU can be directly disposed on the top of the thin film encapsulation layer TFE (for example, in the z direction).

[0123] The organic light emitting diode OLED includes a pixel electrode 210, an opposing electrode 230 disposed on the pixel electrode 210 to face the pixel electrode 210, and an intermediate layer 220 located between the pixel electrode 210 and the opposing electrode 230, the intermediate layer 220 including an emission layer. The bottom of the intermediate layer 220 (e.g., in the z direction) is disposed on the top of the pixel electrode 210 exposed by the pixel defining layer 112, and may be defined as a light emitting area PA. The periphery of the light emitting area PA (i.e., an area located between the light emitting areas PA (e.g., in the x direction)) may be defined as a non-light emitting area NPA.

[0124] The organic light emitting diode OLED is covered with a thin film encapsulation layer TFE. The thin film encapsulation layer TFE may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. For example, Figure 8The exemplary embodiment shown in shows that the thin film encapsulation layer TFE includes a first inorganic encapsulation layer 310, a second inorganic encapsulation layer 330, and an organic encapsulation layer 320 disposed between the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330. For example, the bottom of the organic encapsulation layer 320 (e.g., in the z direction) is directly disposed on the top of the first inorganic encapsulation layer 310, and the bottom of the second inorganic encapsulation layer 330 (e.g., in the z direction) is directly disposed on the top of the organic encapsulation layer 320. However, in another exemplary embodiment, the number of organic encapsulation layers, the number of inorganic encapsulation layers, and their stacking order may be modified.

[0125] In an exemplary embodiment, the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include at least one inorganic material such as aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may be a single layer or multiple layers including the aforementioned materials. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may include the same material, or may include different materials.

[0126] The thicknesses (e.g., lengths in the z direction) of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may be different from each other. For example, in an exemplary embodiment, the thickness of the first inorganic encapsulation layer 310 may be greater than the thickness of the second inorganic encapsulation layer 330. However, in other exemplary embodiments, the thickness of the second inorganic encapsulation layer 330 may be greater than the thickness of the first inorganic encapsulation layer 310, or the thicknesses of the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may be the same.

[0127] In an exemplary embodiment of the present inventive concept, the organic encapsulation layer 320 may include a monomer-based organic material or a polymer-based material (ie, an organic encapsulation material). Examples of polymer-based materials may include acrylic resin, epoxy resin, polyimide, and polyethylene. In an exemplary embodiment, the organic encapsulation layer 320 may include acrylate.

[0128] The organic encapsulation layer 320 may also include organic particles OP each having a core-shell structure including a hollow core and a shell surrounding the hollow core. The organic particles OP float in the organic encapsulation layer 320 and may be distributed in a random, uneven arrangement. According to an exemplary embodiment, the organic particles OP may be included in the organic encapsulation layer 320 at a concentration of about 10% to about 80% of the volume of the organic encapsulation material. In an embodiment in which the percentage of the organic particles OP is less than 10%, the reduction in the dielectric constant ε may be insufficient. On the other hand, in an embodiment in which the percentage of the organic particles OP exceeds 80%, the organic particles OP are agglomerated together and therefore may not be easily dispersed. In addition, when the thin film encapsulation layer TFE includes a plurality of organic encapsulation layers 320, each of the plurality of organic encapsulation layers 320 may include organic particles OP. In another embodiment, when the thin film encapsulation layer TFE includes a plurality of organic encapsulation layers 320, some of the plurality of organic encapsulation layers 320 may include organic particles OP, while other organic encapsulation layers may not include organic particles OP.

[0129] The organic encapsulation layer 320 including the organic particles OP may have a dielectric constant of about 2.6 or less. According to an exemplary embodiment, the organic encapsulation layer 320 may have a dielectric constant of about 1.0 to about 2.6. The organic encapsulation layer 320 including the organic particles OP may have a refractive index of about 1.4 or less. According to an exemplary embodiment, the organic encapsulation layer 320 may have a refractive index of about 1.0 to about 1.4. The organic encapsulation layer 320 including the organic particles OP may have optical properties that provide both a low dielectric constant and a low refractive index.

[0130] In the comparative example, when the organic encapsulation layer includes inorganic particles (e.g., silicon dioxide particles), a low refractive index of 1.4 or less can be obtained. However, a low dielectric constant of 2.6 or less may not be obtained. In this embodiment, the dielectric constant is increased due to the presence of charged particles (e.g., OH) on the surface of the inorganic particles. - ). Due to the charged particles present on the surface of the inorganic particles, the dielectric constant increases with the increased reactivity to the external electric field. In this embodiment, the organic encapsulation layer does not follow the above equation 2. Therefore, based on the material used to form the hollow particles, even in the embodiment including the hollow particles, the low refractive index does not lead to a low dielectric constant.

[0131] Therefore, the organic encapsulation layer 320 according to the exemplary embodiment includes organic particles OP that do not include charged particles on the surface thereof. Since the organic particles OP do not include any charged particles on the surface thereof, the organic encapsulation layer 320 may have a low refractive index of about 1.4 or less, and may also have a low dielectric constant of about 2.6 or less.

[0132] The touch unit TU can be directly disposed on the thin film encapsulation layer TFE. Figure 5 Described more specifically, the touch unit TU may include a first conductive layer 410 having the first sensor unit SP1 , a second conductive layer 420 having the second sensor unit SP2 , a first insulating layer 412 , and a second insulating layer 422 .

[0133] Reference Fig. 9 , the organic particles OP may have a core-shell structure. The organic particles OP may include a hollow core C and a shell S surrounding the hollow core C. In this case, the hollow core C may be understood as an empty space that does not include a material and is disposed within the shell S. According to an exemplary embodiment, the organic particles OP may have a diameter R of about 10 nm to about 200 nm. Preferably, the organic particles OP may have a diameter R of about 60 nm to about 100 nm. In an embodiment in which the diameter R of the organic particles OP is less than 10 nm, the dielectric constant ε is slightly reduced, and in an embodiment in which the diameter R of the organic particles OP exceeds 200 nm, the dielectric constant ε is greatly reduced. Therefore, light is excessively scattered and haze is generated, and thus the transmittance of the thin film encapsulation layer TFE is reduced. Although Fig. 9 The exemplary embodiment of FIG. 4 shows the shell S having a circular shape, but in other embodiments, the shell S may have various shapes.

[0134] According to an exemplary embodiment, the shell S may include a high molecular weight material. For example, in an exemplary embodiment, the shell S may include at least one selected from acrylic polymers, polyimides, urethane polymers, styrene polymers, siloxane polymers, epoxy polymers, and combinations thereof. However, exemplary embodiments of the inventive concept are not limited thereto, and the shell S may include polymers based on various materials other than the aforementioned materials.

[0135] According to an exemplary embodiment, the shell S may have a thickness t of about 5 nm to about 50 nm. For example, the shell S may have a thickness t of about 8 nm to about 20 nm. In another exemplary embodiment, the shell S may have a thickness t of about 15 nm to about 35 nm. In organic particles OP having the same diameter R, as the thickness t of the shell S decreases, the percentage (volume percentage) of the hollow core C increases, which results in an increase in the decrease in the dielectric constant ε. However, when the thickness t of the shell S is less than 5 nm, the organic particles OP are likely to break. In an embodiment in which the thickness t of the shell S exceeds 50 nm, the percentage of the hollow core C decreases, and thus the dielectric constant ε decreases slightly.

[0136] According to an exemplary embodiment, the surface of the shell S may be electrically neutral. For example, the surface of the shell S may be electrically neutral by not including charged particles having positive or negative charges thereon. The charged particles may be ionic particles, such as ions, protons, and electrons.

[0137] Fig.10 is a cross-sectional view of a portion of a display apparatus 1 according to an exemplary embodiment of the inventive concept. Fig.10 A cross-sectional view of the display unit DU is shown, and a display area DA and a non-display area NDA are also shown. A touch unit TU disposed on the display unit DU is not shown.

[0138] Reference Fig.10 In an exemplary embodiment, the substrate 100 may include glass or a polymer resin. Examples of polymer resins may include polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, and cellulose acetate propionate. The substrate 100 including the polymer resin may be flexible, rollable, or bendable. The substrate 100 may have a multilayer structure including a layer having a polymer resin and an inorganic layer.

[0139] The buffer layer 101 may be disposed on the substrate 100, and may reduce or prevent penetration of foreign matter, moisture, or ambient air from below the substrate 100, and may provide a flat surface on the substrate 100. Fig.10 As shown in the exemplary embodiment of FIG. 1 , the bottom of the buffer layer 101 may be directly disposed on the top of the substrate 100 (e.g., in the z direction). The buffer layer 101 may include an inorganic material (such as an oxide or a nitride), an organic material, or an organic-inorganic composite, and may be formed as a single layer or multiple layers of an inorganic material and an organic material. According to an exemplary embodiment, the buffer layer 101 may include silicon oxide (SiO x ), silicon nitride (SiN x ) or / and silicon oxynitride (SiON). However, exemplary embodiments of the inventive concept are not limited thereto.

[0140] Thin film transistor TFT and storage capacitor Cst (see Figure 4 ) may be disposed at a position corresponding to the display area DA on the substrate 100. The organic light emitting diode OLED is electrically connected to the thin film transistor TFT and the storage capacitor Cst.

[0141] The thin film transistor TFT may be located in the display area DA of the substrate 100. The thin film transistor TFT may include a semiconductor layer 134, a gate electrode 136, a source electrode 138s, and a drain electrode 138d. Fig.10The exemplary embodiment of the present invention shows the thin film transistor TFT located in the display area DA, but the thin film transistor TFT may also be located in the non-display area NDA. For example, the thin film transistor TFT located in the non-display area NDA may control the driving circuit.

[0142] In an exemplary embodiment, the semiconductor layer 134 may include at least one of amorphous silicon (a-Si), polycrystalline silicon, an oxide semiconductor, and an organic semiconductor material. According to an exemplary embodiment, the semiconductor layer 134 may include low temperature polycrystalline silicon (LTPS). Since polycrystalline silicon material has a high electron mobility (100 cm 2 / Vs or greater), so the power consumption is low and the reliability is high, and thus it can be used as a semiconductor layer of the thin film transistor TFT of the display device 1.

[0143] The semiconductor layer 134 may include a channel region 131 overlapping with a gate electrode 136 (e.g., in the z direction), a source region 132 and a drain region 133 are respectively disposed on both sides of the channel region 131 (e.g., in the x direction), and the source region 132 and the drain region 133 include a higher concentration of impurities than the channel region 131. The impurities may be N-type impurities or P-type impurities. The source region 132 and the drain region 133 may be connected to a source electrode 138s and a drain electrode 138d of the thin film transistor TFT, respectively.

[0144] The gate insulating layer 103 may be located between the semiconductor layer 134 and the gate electrode 136 (eg, in the z-direction). In an exemplary embodiment, the gate insulating layer 103 may include silicon oxide (SiO x ), silicon nitride (SiN x ) or / and silicon oxynitride (SiON), and can be a single layer or a multilayer.

[0145] The interlayer insulating layer 107 may be disposed on the gate electrode 136 (eg, in the z direction). In an exemplary embodiment, the interlayer insulating layer 107 may include silicon oxide (SiO x ), silicon nitride (SiN x ) or / and silicon oxynitride (SiON), and can be a single layer or a multilayer.

[0146] The thin film transistor TFT may include a source electrode 138s and a drain electrode 138d respectively connected to the source region 132 and the drain region 133 of the semiconductor layer 134. The source electrode 138s and the drain electrode 138d may be respectively electrically connected to the source region 132 and the drain region 133 of the semiconductor layer 134 via contact holes passing through the gate insulating layer 103 and the interlayer insulating layer 107.

[0147] The source electrode 138s and the drain electrode 138d may include aluminum (Al), copper (Cu) or titanium (Ti), and may be formed as a single layer or as a multilayer. According to an exemplary embodiment, the source electrode 138s and the drain electrode 138d may have a multilayer structure such as Ti / Al / Ti or TiN / Al / Ti.

[0148] In an exemplary embodiment, Figure 4 The data lines DL and Figure 4 The driving voltage line PL may be formed on the same layer on which the source electrode 138 s and the drain electrode 138 d are formed, and may include the same material as that included in the source electrode 138 s and the drain electrode 138 d.

[0149] According to an exemplary embodiment, the thin film transistor TFT may be covered by a protective layer 109. The protective layer 109 may prevent a wire including a metal (such as aluminum) that may be damaged by an etchant from being exposed to an etching environment during the manufacture of the display device 1. In an exemplary embodiment, the protective layer 109 may extend to the non-display area NDA (e.g., in the x-direction). In some embodiments, the protective layer 109 may be omitted.

[0150] A planarization layer 111 for planarizing the upper surface of the thin film transistor TFT may be disposed on the protective layer 109. Fig.10 As shown in the exemplary embodiment of , the bottom surface of the planarization layer 111 may be disposed directly on the top surface of the protective layer 109 (e.g., in the z direction). The upper surface on which the pixel electrode 210 is to be disposed may be planarized by the planarization layer 111. In an exemplary embodiment, the planarization layer 111 may include an organic insulating material and may be formed as a single layer or as a multilayer.

[0151] The pixel electrode 210 may be located on the planarization layer 111. The pixel electrode 210 may be a (semi) light-transmitting electrode or a reflective electrode. According to an exemplary embodiment, the pixel electrode 210 may include a reflective layer and a transparent or semi-transparent electrode layer formed on the reflective layer, and the reflective layer is formed of silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr) or a mixture thereof. The transparent or semi-transparent electrode layer may include a layer made of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In 2 O 3 ), indium gallium oxide (IGO), and aluminum zinc oxide (AZO). According to an exemplary embodiment, the pixel electrode 210 may have a stack structure of ITO / Ag / ITO. However, exemplary embodiments of the inventive concept are not limited thereto.

[0152] The pixel defining layer 112 may be located on the pixel electrode 210, and the pixel defining layer 112 may have an opening corresponding to each sub-pixel. The pixel defining layer 112 may define a light emitting area PA (see FIG. 1 ) by including an opening through which at least a central portion of the pixel electrode 210 is exposed. Figure 8 ). The pixel defining layer 112 can prevent arcing, etc. from occurring between the edge of the pixel electrode 210 and the counter electrode 230 by increasing the distance between the edge of the pixel electrode 210 and the counter electrode 230. In an exemplary embodiment, the pixel defining layer 112 may be formed of an organic material such as polyimide or hexamethyldisiloxane (HMDSO).

[0153] In an exemplary embodiment, the spacer 113 may be located on the pixel defining layer 112. For example, the bottom surface of the spacer 113 may be directly disposed on the top surface of the pixel defining layer 112 (eg, in the z-direction). Fig.10 In the exemplary embodiment shown in FIG. 1 , the spacer 113 is located in the non-display area NDA. However, in other exemplary embodiments, the spacer 113 may be located in the display area DA. The spacer 113 may prevent the organic light emitting diode OLED from being damaged due to sagging of the mask in a mask process. In an exemplary embodiment, the spacer 113 may include an organic insulating material and may be formed as a single layer or as a multilayer.

[0154] The planarization layer 111, the pixel defining layer 112, and the spacer 113 may include an organic insulating material. In an exemplary embodiment, the organic insulating material may include an imide polymer, a commercial polymer such as polymethyl methacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenolic group, an acrylic polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer, a vinyl alcohol polymer, a blend thereof, and the like. According to an exemplary embodiment, the planarization layer 111 may include polyimide. However, exemplary embodiments of the inventive concept are not limited thereto.

[0155] The intermediate layer 220 is disposed (eg, in the z direction) between the pixel electrode 210 and the counter electrode 230. Fig.10 As shown in the exemplary embodiment of , the bottom surface (e.g., in the z direction) of the intermediate layer 220 is disposed on the top surface of the pixel electrode 210. The bottom surface (e.g., in the z direction) of the counter electrode 230 is disposed on the top surface of the intermediate layer 220. The intermediate layer 220 may include a low molecular weight material or a high molecular weight material.

[0156] In an exemplary embodiment in which the intermediate layer 220 includes a low molecular weight material, the intermediate layer 220 may be formed by stacking a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL) in a single structure or a composite structure, and may include a material such as copper phthalocyanine (CuPc), N,N'-di(naphthalene-1-yl)-N,N'-diphenyl-benzidine (NPB), or tris-8-hydroxyquinoline aluminum (Alq 3 ) of any of various materials. However, exemplary embodiments of the inventive concept are not limited thereto. In exemplary embodiments, these layers may be formed via vacuum deposition.

[0157] In an exemplary embodiment in which the intermediate layer 220 includes a high molecular weight material, the intermediate layer 220 may generally have a structure including an HTL and an EML. In this embodiment, the HTL may include poly(ethylenedioxythiophene) (PEDOT), and the EML may include a high molecular weight material such as a poly(p-phenylene vinylene) (PPV)-based material or a polyfluorene-based material.

[0158] However, the intermediate layer 220 is not limited to the above structure, and may have any of various other structures. For example, at least one of the layers constituting the intermediate layer 220 may be formed integrally with the counter electrode 230. According to another exemplary embodiment, the intermediate layer 220 may include a layer patterned to correspond to each of the plurality of pixel electrodes 210.

[0159] In an exemplary embodiment, the counter electrode 230 may be arranged in the display area DA and may cover the entire display area DA. For example, the counter electrode 230 may be integrally formed to cover a plurality of pixels P (see FIG. Figure 1 and Figure 3 ). However, in other exemplary embodiments, the counter electrode 230 may include a discrete pattern extending only within a single pixel P. The counter electrode 230 may be in electrical contact with the common power line 70 disposed in the non-display area NDA. Fig.10 As shown in the exemplary embodiment of FIG. 2 , the counter electrode 230 may extend to the partition wall PW (eg, in the x-direction).

[0160] The thin film encapsulation layer TFE may cover the entire display area DA and extend toward the non-display area NDA (eg, in the x-direction) to cover a portion of the non-display area NDA. Fig.10 As shown in the exemplary embodiment of , the thin film encapsulation layer TFE may extend (e.g., in the x-direction) to the outside of the common power line 70. For example, compared with the side edge of the common power line 70 farthest from the display area DA, the end of the thin film encapsulation layer TFE in the non-display area NDA may extend farther from the display area DA (e.g., in the x-direction).

[0161] like Fig.10 As shown in the exemplary embodiment of the present invention, the thin film encapsulation layer TFE may include a first inorganic encapsulation layer 310, a second inorganic encapsulation layer 330, and an organic encapsulation layer 320 located between the first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330. Figure 8 and Fig. 9 As described, the organic encapsulation layer 320 may include organic particles OP. The organic particles OP may reduce the refractive index n and the dielectric constant ε of the organic encapsulation layer 320. Therefore, the parasitic capacitance between the touch unit TU on the thin film encapsulation layer TFE and the counter electrode 230 is reduced, thereby improving the sensitivity of the touch unit TU.

[0162] The partition wall PW may be located in the non-display area NDA of the substrate 100. According to an exemplary embodiment, the partition wall PW may include, but is not limited to, a portion 111P of the planarization layer 111, a portion 112P of the pixel defining layer 112, and a portion 113P of the spacer 113.

[0163] The partition wall PW is arranged to surround the display area DA, and the organic encapsulation layer 320 of the thin film encapsulation layer TFE can be prevented from overflowing to the outside of the substrate 100. Therefore, the organic encapsulation layer 320 can be in contact with the inner surface of the partition wall PW facing the display area DA. In this embodiment, the organic encapsulation layer 320 in contact with the inner surface of the partition wall PW can be understood as: the first inorganic encapsulation layer 310 is located between the organic encapsulation layer 320 and the partition wall PW, and the organic encapsulation layer 320 is in direct contact with the first inorganic encapsulation layer 310. The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 can be located on the partition wall PW and can extend toward the edge of the substrate 100.

[0164] As described above, according to exemplary embodiments of the inventive concept, a display device having a reduced thickness and improved touch sensitivity at the same time may be realized. Of course, the scope of the disclosure is not limited thereto.

[0165] It should be understood that the exemplary embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or aspects within each exemplary embodiment should generally be considered applicable to other similar features or aspects in other embodiments. Although one or more exemplary embodiments have been described with reference to the drawings, it will be understood by those of ordinary skill in the art that various changes in form and detail may be made herein without departing from the spirit and scope as defined by the claims.

Claims

1. A display device, comprising: A substrate, including a display area and a non-display area; A light emitting device, located on the display area; A thin film encapsulation layer, located on the light-emitting device, the thin film encapsulation layer includes at least one inorganic encapsulation layer and at least one organic encapsulation layer, wherein the at least one organic encapsulation layer includes a plurality of organic particles having a core-shell structure, the core-shell structure including a hollow core and a shell surrounding the hollow core; as well as The touch unit is located on the thin film encapsulation layer.

2. The display device according to claim 1, wherein: The at least one organic encapsulating layer has a dielectric constant of 2.6 or less.

3. The display device according to claim 1, wherein: The at least one organic encapsulating layer has a refractive index of 1.4 or less.

4. The display device according to claim 1, wherein: The shell comprises a high molecular weight material.

5. The display device according to claim 4, wherein: The shell includes at least one compound selected from acrylic polymers, polyimides, urethane polymers, styrene-based polymers, siloxane-based polymers, epoxy-based polymers, and combinations thereof.

6. The display device according to claim 1, wherein: The surface of the shell is electrically neutral.

7. The display device according to claim 6, wherein: The surface of the shell does not include any charged particles thereon.

8. The display device according to claim 1, wherein: The shell has a thickness of 5 nm to 50 nm.

9. The display device according to claim 1, wherein: A diameter of each of the plurality of organic particles is 10 nm to 200 nm.

10. The display device according to claim 1, wherein: The at least one organic encapsulation layer further comprises an organic encapsulation material, wherein the organic encapsulation material comprises a monomeric organic material or a polymeric material, and The plurality of organic particles are included in the at least one organic encapsulating layer at a percentage of 10% to 80% by volume of the organic encapsulating material.

11. The display device according to claim 1, wherein: The touch unit is directly located on the thin film encapsulation layer, wherein the touch unit includes: A detection electrode, located on the display area; and The signal line is located on the non-display area and connected to the detection electrode.

12. The display device according to claim 11, wherein: The detection electrodes have a grid shape.

13. The display device according to claim 11, wherein: The detection electrodes include a first detection electrode and a second detection electrode; and The signal line includes a first signal line connected to the first detection electrode and a second signal line connected to the second detection electrode.

14. The display device according to claim 1, wherein: The touch unit is directly located on the thin film encapsulation layer, wherein the touch unit includes: a first conductive layer; a second conductive layer, located on the first conductive layer; a first insulating layer, located between the first conductive layer and the second conductive layer; and The second insulating layer is located on the second conductive layer.

15. The display device according to claim 14, wherein: The first conductive layer and the second conductive layer are electrically connected to each other via a contact hole defined in the first insulating layer.

16. The display device according to claim 14, wherein: The light emitting device comprises a pixel electrode, a counter electrode on the pixel electrode, and an intermediate layer between the pixel electrode and the counter electrode, wherein the intermediate layer comprises an emission layer; and The distance between the first conductive layer and the counter electrode is 5 μm to 20 μm.

17. A display device, comprising: substrate; A pixel electrode, located on the substrate; an intermediate layer, arranged on the pixel electrode and comprising an emission layer; a counter electrode, located on the intermediate layer; a thin film encapsulation layer located on the counter electrode and comprising an inorganic encapsulation layer and an organic encapsulation layer located on the inorganic encapsulation layer, wherein the organic encapsulation layer has a dielectric constant of 2.6 or less; and a touch unit directly located on the thin film encapsulation layer and including a conductive layer configured to detect an external input, The organic encapsulation layer includes an organic encapsulation material and a plurality of organic particles having a core-shell structure, wherein the core-shell structure includes a hollow core and a shell surrounding the hollow core.

18. The display device according to claim 17, wherein: The plurality of organic particles include at least one compound selected from acrylic polymers, polyimides, urethane polymers, styrene-based polymers, siloxane-based polymers, epoxy-based polymers, and combinations thereof.

19. The display device according to claim 17, wherein: The surface of the shell is electrically neutral.

20. A thin film encapsulation layer for a display device, the thin film encapsulation layer comprising: at least one inorganic encapsulation layer; as well as at least one organic encapsulation layer; Wherein, the at least one organic encapsulation layer comprises: Organic packaging materials, including monomeric organic materials or polymeric materials; and a plurality of organic particles having a core-shell structure including a hollow core and a shell surrounding the hollow core, The plurality of organic particles are included in the at least one organic encapsulating layer at a percentage of 10% to 80% by volume of the organic encapsulating material.

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