Control device and motor device

Abstract

A control device includes a first substrate (22) provided with a chip electronic component, a second substrate (23) having a surface provided with an electronic component including a high component higher than the chip electronic component, the surface of the second substrate (23) facing a surface of the first substrate (22) provided with the chip electronic component, and a heat sink (21) provided between the first substrate (22) and the second substrate (23). The heat sink (21) includes a component receiving portion (71) configured to receive the high component and a heat radiating portion (72) configured to perform heat exchange between the first substrate (22) and the second substrate (23), and the component receiving portion (71) and the heat radiating portion (72) are provided so as not to overlap each other when viewed in a facing direction in which the first substrate (22) and the second substrate (23) face each other.

Description

Technical Field

[0001] This invention relates to control devices and motor devices. Background Technology

[0002] A motor device already exists that includes a motor and a control device, with the motor and control device integrally mounted together. For example, in Japanese Unexamined Patent Application Publication No. 2017-189033 (JP 2017-189033 A), the control device is located at the end portion of the motor. This control device includes: two substrates facing each other and perpendicular to the axial direction of the motor; and a heat sink disposed between the two substrates. Various electronic components that operate by consuming electricity are mounted on the two substrates, and the heat generated by these electronic components is dissipated through the heat sink.

[0003] For example, in the first substrate on the motor side, a switching element forming an inverter circuit is provided on a first surface of the first substrate located on the side opposite to the heat sink, and a capacitor and a microcomputer are provided on a second surface of the first substrate located on the heat sink side. The height of the capacitor from the substrate is greater than the height of the microcomputer from the substrate, and therefore, the capacitor is received in a recess formed in the heat sink, thereby avoiding interference between the capacitor and the heat sink. The microcomputer remains in contact with the heat sink. Summary of the Invention

[0004] When using a motor unit as a drive source for various installation objects, there is a situation where the size of the motor unit needs to be reduced according to the installation object to ensure the installation space for the motor unit.

[0005] The present invention provides a control device and a motor device, each of which enables a reduction in size while ensuring heat dissipation.

[0006] A control device according to a first aspect of the present invention includes: a first substrate having chip electronic components disposed thereon; a second substrate having a surface having a plurality of electronic components disposed thereon, the plurality of electronic components including a tall component higher than the chip electronic components, the surface of the second substrate facing the surface of the first substrate, and the chip electronic components being disposed on the surface of the first substrate; and a heat sink disposed between the first substrate and the second substrate. The heat sink includes a component receiving portion and a heat dissipation portion, the component receiving portion being configured to receive the tall component on the second substrate, the heat dissipation portion being configured to perform heat exchange between the first substrate and the second substrate, and the component receiving portion and the heat dissipation portion being configured not to overlap each other when viewed along a facing direction in which the first substrate and the second substrate face each other.

[0007] With this configuration, the tall component on the second substrate is received within the component receiving portion of the heat sink. Therefore, interference between the tall component on the second substrate and the heat sink is avoided. Furthermore, by placing the heat sink between the first and second substrates, heat generated by both the first and second substrates is appropriately dissipated through the heat sink. Moreover, the component receiving portion and the heat dissipation portion are arranged so that they do not overlap when viewed along the facing direction of the first and second substrates. Therefore, heat exchange is not required between the portion of the heat sink corresponding to the component receiving portion and the first substrate. Consequently, the thickness of the portion of the heat sink on the first substrate side—that is, the side opposite to the side where the tall component is inserted into the component receiving portion—can be reduced, allowing the dimensions of the heat sink in the facing direction of the first and second substrates to be correspondingly shortened.

[0008] In the control device according to the first aspect, the component receiving portion can extend through the heat sink along the facing direction of the first substrate and the second substrate facing each other. As described above, heat exchange is not required between the portion of the heat sink corresponding to the component receiving portion and the first substrate. Therefore, it is not necessary for the portion of the heat sink corresponding to the component receiving portion to contact the first substrate. Therefore, the configuration described above, in which the component receiving portion extends through the heat sink, can be adopted. Since the thickness of the portion of the heat sink located on the first substrate side can be further reduced, the dimension of the heat sink in the facing direction of the first substrate and the second substrate facing each other can be further shortened.

[0009] In the control device according to the first aspect, the component receiving portion may be disposed in the central portion of the radiator, and the heat dissipation portion may be disposed in the peripheral portion surrounding the component receiving portion of the radiator.

[0010] With this configuration, the distance between the heat dissipation section and the air outside the control device is shortened compared to when the heat dissipation section is located in the central part of the radiator. Therefore, the heat transferred to the heat dissipation section is dissipated into the air more quickly. This further improves the heat dissipation efficiency of the radiator.

[0011] In the control device according to the first aspect, the heat sink may include a partition wall and a peripheral wall, the partition wall being located between the first substrate and the second substrate, and the peripheral wall being disposed on the peripheral edge portion of the partition wall and surrounding both the first substrate and the second substrate.

[0012] Using this configuration, heat generated by the first substrate and heat generated by the second substrate are dissipated through the partition wall and the peripheral wall. Since the contact area between the heat sink and the air is ensured by providing the peripheral wall in the heat sink, the heat dissipation effect of the heat sink is further improved. Furthermore, the peripheral wall protects the first and second substrates from dust, impacts, and other harmful substances.

[0013] In the control device according to the first aspect, the first substrate can be configured to control the power supply to an electrical device, and the second substrate can be configured to supply power to the electrical device through control performed by the first substrate. In this case, the second substrate can be positioned closer to the electrical device than the first substrate.

[0014] With this configuration, since the second substrate that supplies power to the electrical device is located closer to the electrical device, the power supply distance from the second substrate to the electrical device can be shortened.

[0015] In the control device according to the first aspect, a terminal block for connection to a terminal of an electrical device may be provided on the surface of a second substrate, and a raised component may be provided on the surface of the second substrate. In this case, the heat sink may include a terminal block receiving portion configured to receive the terminal block, the terminal block receiving portion being configured not to overlap with a component receiving portion or a heat sink portion when viewed in a facing direction where the first substrate and the second substrate face each other.

[0016] With this configuration, since the terminal block is received in the terminal block receiving portion, the size of the control device in the facing direction between the first substrate and the second substrate can be shortened compared to the case where the terminal block is placed on the side opposite to the tall member of the second substrate.

[0017] The motor device according to a second aspect of the invention includes a control device according to the first aspect and a motor as an electrical device, the motor and the control device being integrally disposed. The control device according to the first aspect is suitable as a control device for a motor.

[0018] By utilizing the control device and motor device according to the first and second aspects of the present invention, the size can be reduced while ensuring heat dissipation. Attached Figure Description

[0019] The features, advantages, and technical and industrial significance of exemplary embodiments of the present invention will now be described with reference to the accompanying drawings, in which the same reference numerals denote the same elements, and in the drawings:

[0020] Figure 1 This is an exploded perspective view of a motor assembly including a control device according to an embodiment;

[0021] Figure 2 This is a cross-sectional view of the main parts of a motor device including a control device according to an embodiment;

[0022] Figure 3 This is a perspective view of the first substrate in the embodiment;

[0023] Figure 4 This is a perspective view of the second substrate in the embodiment;

[0024] Figure 5 This is a plan view of the heat sink as seen from the side of the first substrate accommodating portion in the embodiment;

[0025] Figure 6 This is a bottom view of the heat sink as seen from the side of the second substrate accommodating portion in the embodiment;

[0026] Figure 7 This is a perspective view of the heat sink as seen from the side of the first substrate accommodating portion in the embodiment;

[0027] Figure 8 This is a perspective view of the heat sink as seen from the side of the second substrate accommodating portion in the embodiment; and

[0028] Figure 9 This is a plan view of the motor device as seen from the control device side along the axial direction in the embodiment, wherein the cover and the first substrate are omitted. Detailed Implementation

[0029] The following description provides an embodiment in which a control device is implemented within a motor assembly. For example... Figure 1 As shown, the motor assembly 10 includes a motor 11 and a control unit 12. For example, a three-phase brushless motor is used as the motor 11. The motor 11 has two winding groups. The control unit 12 is located at the end portion of the motor 11. The control unit 12 independently controls the power supply to the winding groups of the two systems in the motor 11 for each system.

[0030] The control device 12 includes a heat sink 21, a first substrate 22, a second substrate 23, and a cover 24. The heat sink 21, the first substrate 22, the second substrate 23, and the cover 24 are assembled into a sub-assembly. The control device 12, as this sub-assembly, is attached to the end portion of the motor 11.

[0031] like Figure 2 As shown, the heat sink 21 is fixed to the end portion of the motor 11. The heat sink 21 is made of a metal material with excellent thermal conductivity, such as aluminum. The heat sink 21 includes a first substrate receiving portion 21a and a second substrate receiving portion 21b. The first substrate receiving portion 21a is located on the side of the heat sink 21 opposite to the motor 11 (i.e., Figure 2 The second substrate accommodating portion 21b is open at the side surface of the heat sink 21 located on the motor 11 side (i.e., the upper side). Figure 2 The lower side surface is open.

[0032] like Figure 2As shown, a first substrate 22 is housed in a first substrate housing portion 21a of a heat sink 21. The first substrate 22 is fixed to a cover 24. The first substrate 22 is provided with electronic components configured to control the power supply to the motor 11. The first substrate 22 is a so-called control substrate.

[0033] like Figure 3 As shown, on the first surface of the first substrate 22 ( Figure 3 On the upper surface of the first substrate 22, a plurality of (four in this document) chip electronic components 31 to 34 are mounted, such as integrated circuits corresponding to the winding groups of the two systems. On the second surface of the first substrate 22, Figure 3 Two electronic components 35 and 36, corresponding to the winding assemblies of the two systems, are mounted on the lower surface of the substrate 22. Electronic components 35 and 36 are microcomputers. The six electronic components 31 to 36 generate heat due to their operation. It should be noted that the first surface of the first substrate 22 is the side surface of the first substrate 22 located on the side opposite to the motor 11, and the second surface of the first substrate 22 is the side surface of the first substrate 22 located on the side of the motor 11.

[0034] When viewed along a direction perpendicular to the first substrate 22, electronic components 31 to 36 are arranged in an orthogonal grid. Specifically, when viewed along a direction perpendicular to the first substrate 22, electronic components 31, 35, and 33 are arranged along the same straight line L1, and when viewed along a direction perpendicular to the first substrate 22, electronic components 32, 36, and 34 are arranged along the same straight line L2. Straight lines L1 and L2 are parallel to each other. Furthermore, when viewed along a direction perpendicular to the first substrate 22, two electronic components 31 and 32 are arranged along directions perpendicular to lines L1 and L2, two electronic components 35 and 36 are arranged along directions perpendicular to lines L1 and L2, and two electronic components 33 and 34 are arranged along directions perpendicular to lines L1 and L2.

[0035] like Figure 2 As shown, the second substrate 23 is housed within the second substrate housing portion 21b of the heat sink 21. The second substrate 23 is fixed to the inner bottom surface of the second substrate housing portion 21b. The second substrate 23 is provided with electronic components configured to supply power to the motor 11 via control executed by the first substrate 22. The second substrate 23 is a so-called power substrate.

[0036] like Figure 4 As shown, on the first surface of the second substrate 23 ( Figure 4Two terminal blocks 40a and 40b, corresponding to the winding assemblies of the two systems, are mounted on the upper surface of the substrate 23. Each of the terminal blocks 40a and 40b has a rectangular parallelepiped shape. The terminal blocks 40a and 40b are respectively disposed in two side edge portions of the second substrate 23, and the two side edge portions are located on opposite sides of each other.

[0037] A plurality of electronic components 41 to 48 (eight in this document) are mounted on the first surface of the second substrate 23. These electronic components 41 to 48 are, for example, electrolytic capacitors corresponding to the winding assemblies of the two systems. The electronic components 41 to 48 are disposed in the central portion between two terminal blocks 40a and 40b on the first surface of the second substrate 23. When viewed in a direction perpendicular to the second substrate 23, three electronic components 43, 45, and 47 are located on the same straight line L3, which extends in a direction perpendicular to the facing direction of the two terminal blocks 40a and 40b. When viewed in a direction perpendicular to the second substrate 23, three electronic components 44, 46, and 48 are located on the same straight line L4, which extends in a direction perpendicular to the facing direction of the two terminal blocks 40a and 40b.

[0038] When viewed along a direction perpendicular to the second substrate 23, the two electronic components 41 and 42 are arranged such that the two electronic components 43 and 44 are located between the electronic components 41 and 42. When viewed along a direction perpendicular to the second substrate 23, the four electronic components 41 to 44 are arranged along a facing direction in which the two terminal blocks 40a and 40b face each other. The two electronic components 45 and 46 are arranged along a facing direction in which the two terminal blocks 40a and 40b face each other, and the two electronic components 47 and 48 are arranged along a facing direction in which the two terminal blocks 40a and 40b face each other.

[0039] Each of the eight electronic components 41 to 48 is a so-called "high component" that is taller than the chip electronic components. Four of the eight electronic components 41 to 48, 45 to 48, are taller than the remaining four electronic components 41 to 44. The height of electronic components 41 to 48 refers to their height from the first surface of the second substrate 23.

[0040] like Figure 4 As shown by the dashed line in the diagram, on the second surface of the second substrate 23 ( Figure 4Two inverter circuits 51 and 52, corresponding to the winding groups of the two systems, are mounted on the lower surface of the second substrate 23. Inverter circuit 51 is positioned near terminal block 40a in the second substrate 23. Inverter circuit 52 is positioned near terminal block 40b in the second substrate 23. Specifically, when viewed along a direction perpendicular to the second substrate 23, the two inverter circuits 51 and 52 are respectively positioned on the second substrate 23 at the portion between terminal block 40a and electronic component group (43 to 48) and at the portion between terminal block 40b and electronic component group (43 to 48). Inverter circuit 51 includes multiple field-effect transistors (FETs) 53. Inverter circuit 52 also includes multiple FETs 54. The two inverter circuits 51 and 52 generate heat due to their operation. FETs 53 and 54 are chip electronic components. On the second surface of the second substrate 23 ( Figure 4 A rotation angle sensor (not shown) is provided at the center of the lower surface of the motor 11, which is configured to detect the rotation of the motor 11.

[0041] like Figure 2 As shown, the cover 24 is attached to the side surface of the heat sink 21 located on the side opposite to the motor 11. The cover 24 is integrally made of synthetic resin material. The cover 24 covers and encloses the first substrate receiving portion 21a of the heat sink 21. The first substrate 22 is fixed to the inner bottom portion of the cover 24.

[0042] like Figure 1 As shown, on the side surface of the cover 24 located on the side opposite to the heat sink 21 ( Figure 1 On the upper surface of the heat sink 21, two connector mounting portions 24a and 24b are mounted, corresponding to the winding assemblies of the two systems. Each connector mounting portion 24a and 24b has a rectangular tubular shape and is open to the side opposite to the heat sink 21. Each of the two connector mounting portions 24a and 24b is fitted with a plug-in connector. Each plug-in connector is located at the second end portion of the wire, the first end portion of which is connected to a DC power source such as a battery. DC power from the DC power source is supplied to the first substrate 22 and the second substrate 23 through power terminals respectively located in the two connector mounting portions 24a and 24b.

[0043] Electronic component 35, which is a first microcomputer mounted on the first substrate 22, generates switching commands for inverter circuit 51 on the second substrate 23 based on the rotation angle of motor 11 detected by a rotation angle sensor. The FETs 53 of inverter circuit 51 are switched based on the switching commands generated by electronic component 35 (which is the microcomputer), converting DC power supplied from a DC power source into three-phase AC power. The AC power generated by inverter circuit 51 is supplied to the first winding group of motor 11 via a busbar serving as a power supply path.

[0044] Electronic component 36, a second microcomputer mounted on the first substrate 22, generates switching commands for the inverter circuit 52 on the second substrate 23 based on the rotation angle of the motor 11 detected by a rotation angle sensor. The FETs 54 of the inverter circuit 52 switch based on the switching commands generated by electronic component 36, converting DC power supplied from a DC power source into three-phase AC power. The AC power generated by the inverter circuit 52 is supplied to the second winding of the motor 11 via a busbar serving as a power supply path.

[0045] like Figure 1 As shown, a three-phase busbar 61 corresponding to the first winding group of the motor 11 and a three-phase busbar 62 corresponding to the second winding group of the motor 11 are configured to protrude from the end surface 11a of the motor 11, which is located on the side to which the control device 12 is attached. Busbars 61 and 62 are respectively disposed in two side edge portions of the end surface 11a of the motor 11, with the two side edge portions located on opposite sides. The three busbars 61 are arranged in an upright row along the corresponding side edge portions of the end surface 11a. The three busbars 62 are also arranged in an upright row along the corresponding side edge portions of the end surface 11a. Busbars 61 are configured to correspond to terminal block 40a. Busbars 62 are configured to correspond to terminal block 40b.

[0046] Next, the configuration of the heat sink 21 will be described in detail. For example... Figure 5 and Figure 7As shown, the heat sink 21 includes a component receiving portion 71 and a heat dissipation portion 72. The component receiving portion 71 is disposed near the center of a partition wall 21c, which defines a first substrate receiving portion 21a and a second substrate receiving portion 21b within the heat sink 21. The heat dissipation portion 72 is disposed around the component receiving portion 71 within the partition wall 21c. The partition wall 21c is provided with two terminal block insertion holes 73a and 73b, which serve as terminal block insertion portions. The two terminal block insertion holes 73a and 73b are respectively positioned on opposite sides, such that the component receiving portion 71 and the heat dissipation portion 72 are located between the terminal block insertion holes 73a and 73b. The two terminal block insertion holes 73a and 73b extend along the peripheral wall 21d of the heat sink 21. The two terminal block insertion holes 73a and 73b correspond to two terminal blocks 40a and 40b disposed on the second substrate 23, respectively. Figure 7 As shown, in the peripheral wall 21d of the heat sink 21, openings 74a and 74b are respectively provided at positions corresponding to the two terminal block insertion holes 73a and 73b.

[0047] like Figure 5 and Figure 7 As shown, the component receiving portion 71 includes a first component receiving portion 71a and a second component receiving portion 71b. Each of the first component receiving portion 71a and the second component receiving portion 71b is a portion provided with a rectangular hole extending through the partition wall 21c. The opening area of ​​the first component receiving portion 71a is configured to receive four electronic components 43 to 46 disposed on the second substrate 23 (see Figure 24). Figure 4 The opening area of ​​the second component receiving portion 71b is configured to receive two electronic components 47 and 48 disposed on the second substrate 23 (see...). Figure 4 ).

[0048] The heat dissipation portion 72 includes a first heat dissipation portion 72a, a second heat dissipation portion 72b, and a third heat dissipation portion 72c. The first heat dissipation portion 72a is a rectangular wall surrounding the first component receiving portion 71a and the second component receiving portion 71b. Six contact portions 81 to 86 are provided on the distal end surface of the first heat dissipation portion 72a. The contact portions 81 to 86 correspond to six electronic components 31 to 36 respectively disposed on the first substrate 22. It should be noted that the distal end surface of the first heat dissipation portion 72a is the end surface of the first heat dissipation portion 72a located on the side opposite to the partition wall 21c.

[0049] like Figure 5As shown by the alternating long and two short dashed lines, the two contact portions 81 and 82 correspond to electronic components 31 and 32, respectively; the two contact portions 83 and 84 correspond to electronic components 35 and 36, which are microcomputers, respectively; and the two contact portions 85 and 86 correspond to electronic components 33 and 34, respectively. When viewed along a direction perpendicular to the first substrate 22, the two contact portions 81 and 82 and the electronic components 31 and 32 coincide with each other. When viewed along a direction perpendicular to the first substrate 22, the two contact portions 83 and 84 and the electronic components 35 and 36 coincide with each other. When viewed along a direction perpendicular to the first substrate 22, the two contact portions 85 and 86 and the electronic components 33 and 34 coincide with each other.

[0050] like Figure 7 As shown, the height of the four contact portions 81, 82, 85, and 86 is greater than the height of the two contact portions 83 and 84. The height of contact portions 81 to 86 refers to the height from the distal end surface of the first heat dissipation portion 72a. The heights of the four contact portions 81, 82, 85, and 86 are set such that, in the assembled state of the control device 12, the contact portions 81, 82, 85, and 86 are in substantially contact with the second surface of the first substrate 22 at the portions corresponding to the electronic components 31, 32, 33, and 34. The heights of the two contact portions 83 and 84 are set such that the contact portions 83 and 84 are in substantially contact with the two electronic components 35 and 36, respectively, which are microcomputers mounted on the second surface of the first substrate 22. The heat generated by the four electronic components 31, 32, 33, and 34 is transferred through the first substrate 22 to the four contact portions 81, 82, 85, and 86. The heat generated by the two electronic components 35 and 36, which are microcomputers, is directly transferred to the two contact portions 83 and 84.

[0051] like Figure 5 As shown, the second heat dissipation portion 72b and the third heat dissipation portion 72c are also part of the partition wall 21c. The second heat dissipation portion 72b is the portion of the partition wall 21c between the first heat dissipation portion 72a and the terminal block insertion hole 73a. The third heat dissipation portion 72c is the portion of the partition wall 21c between the first heat dissipation portion 72a and the terminal block insertion hole 73b.

[0052] like Figure 6 The alternating long and short dashed lines in the image, as shown below, are as follows: Figure 8As shown, when the heat sink 21 is viewed from the second substrate housing portion 21b side, inverter circuit 51 corresponds to the second heat sink portion 72b, and inverter circuit 52 corresponds to the third heat sink portion 72c. In the assembled state of the control device 12, the second heat sink portion 72b and the third heat sink portion 72c are held in a state where the second heat sink portion 72b and the third heat sink portion 72c are close to or in contact with portions of the inverter circuits 51 and 52 corresponding to those mounted on the second surface of the second substrate 23. Heat generated by inverter circuit 51 is transferred to the second heat sink portion 72b through the second substrate 23. Heat generated by inverter circuit 52 is transferred to the third heat sink portion 72c through the second substrate 23.

[0053] It should be noted that a thermally conductive and electrically insulating grease can be applied as a heat dissipation material to the side surfaces of the second heat dissipation portion 72b and the third heat dissipation portion 72c, the side surfaces being located on the side of the second substrate 23. Figure 6 The paper side (i.e., the side closest to the observer in a direction perpendicular to the paper surface). Specifically, grease can be placed between the second heat dissipation portion 72b and the portion of the second substrate 23 where the inverter circuit 51 is located, and between the third heat dissipation portion 72c and the portion of the second substrate 23 where the inverter circuit 52 is located. With this configuration, the heat generated by the inverter circuits 51 and 52 is more effectively transferred to the second heat dissipation portion 72b and the third heat dissipation portion 72c.

[0054] The second heat dissipation portion 72b and the third heat dissipation portion 72c are located on the side of the second substrate 23. Figure 6 A plurality of recesses 87 are formed in the side surface of the paper (i.e., the side closer to the observer in a direction perpendicular to the paper surface), and the plurality of recesses 87 are formed at portions corresponding to the inverter circuits 51, 52. The recesses 87 are configured to receive electronic components, such as capacitors, mounted on the first surface of the second substrate 23 (the surface on the side of the recesses 87) and mounted at portions corresponding to the inverter circuits 51, 52.

[0055] The third component receiving portion 71c and the fourth component receiving portion 71d, forming the component receiving portion 71, are respectively disposed in the side surfaces of the second heat dissipation portion 72b and the third heat dissipation portion 72c, which are part of the partition wall 21c, and the side surfaces are located on the side of the second substrate 23. The third component receiving portion 71c and the fourth component receiving portion 71d are recessed portions, which are configured such that the portion of the first component receiving portion 71a located on the side opposite to the second component receiving portion 71b is arranged in a direction perpendicular to the direction in which the first component receiving portion 71a and the second component receiving portion 71b are arranged (along... Figure 6 It widens in the left and right directions.

[0056] In other words, the third component receiving portion 71c and the fourth component receiving portion 71d are connected to the first component receiving portion 71a. The third component receiving portion 71c and the fourth component receiving portion 71d each have a portion of the first heat dissipation portion 72a oriented towards the side opposite to the motor 11 (towards...). Figure 6 The paper side (i.e., the side away from the observer in a direction perpendicular to the paper surface) is cut out. In the second heat dissipation portion 72b and the third heat dissipation portion 72c, wall portions 88a and 88b are provided as part of the second heat dissipation portion 72b and the third heat dissipation portion 72c, respectively, at the portions corresponding to the third component receiving portion 71c and the fourth component receiving portion 71d.

[0057] like Figure 6 As shown by the alternating long and two short dashed lines, the third component receiving portion 71c corresponds to the electronic component 41 on the second substrate 23, and the fourth component receiving portion 71d corresponds to the electronic component 42 on the second substrate 23. The third component receiving portion 71c and the fourth component receiving portion 71d are configured to receive the electronic components 41 and 42 disposed on the second substrate 23. In the assembled state of the control device 12, the electronic components 41 and 42 on the second substrate 23 are held in a state where the electronic components 41 and 42 are close to or in contact with the wall portions 88a and 88b, respectively.

[0058] like Figure 9 As shown, with the control device 12 attached to the motor 11, terminal blocks 40a and 40b on the second substrate 23 are inserted into terminal block insertion holes 73a and 73b of the heat sink 21, respectively. Terminal blocks 40a and 40b face from the inside openings 74a and 74b provided in the peripheral wall 21d of the heat sink 21. With the control device 12 attached to the motor 11, a busbar 61 corresponding to the first system (first winding group) of the motor 11 is provided between the terminal block 40a in the terminal block insertion hole 73a of the heat sink 21 and the peripheral wall 21d. By inserting a bolt 25a through the opening 74a and tightening the bolt 25a, the three busbars 61 are secured to the terminal block 40a. With the control device 12 attached to the motor 11, a busbar 62 corresponding to the second system (second winding group) of the motor 11 is provided between the terminal block 40b in the terminal block insertion hole 73b of the heat sink 21 and the peripheral wall 21d. By inserting bolt 25b through opening 74b and tightening bolt 25b, the three busbars 62 are secured to terminal block 40b. Figure 1 As shown, the two openings 74a and 74b of the radiator 21 are closed by covers 26 and 27, respectively.

[0059] Next, the operation of the control device 12 configured as described above will be described. The control device 12 is assembled separately from the motor 11 as a sub-component, and the assembled control device 12 is attached to the end portion of the motor 11 to obtain the motor device 10.

[0060] like Figure 2 and Figure 9 As shown, with the control device 12 attached to the motor 11, four electronic components 43 to 46 on the second substrate 23 are received in the first component receiving portion 71a of the heat sink 21. Furthermore, with the control device 12 attached to the motor 11, two electronic components 47 and 48 on the second substrate 23 are received in the second component receiving portion 71b of the heat sink 21. Additionally, with the control device 12 attached to the motor 11, electronic component 41 on the second substrate 23 is received in the third component receiving portion 71c of the heat sink 21, and electronic component 42 on the second substrate 23 is received in the fourth component receiving portion 71d of the heat sink 21. Therefore, interference between the larger electronic components 41 to 48 disposed on the second substrate 23 and the heat sink 21 can be avoided.

[0061] Furthermore, larger electronic components 41 to 48 are clustered in the central portion of the second substrate 23, and a component receiving portion 71 for receiving electronic components 41 to 48 is disposed in the central portion inside the heat sink 21. Additionally, a heat dissipation portion 72 for dissipating heat generated by the first substrate 22 and heat generated by the second substrate 23 is disposed inside the heat sink 21 around the component receiving portion 71. That is, since the component receiving portion 71 and the heat dissipation portion 72 are clearly separated from each other in the heat sink 21, it is not necessary for the portion of the heat sink 21 corresponding to the component receiving portion 71 to contact the first substrate 22 or the second substrate 23. Therefore, the component receiving portion 71 can be configured as an aperture portion extending through the partition wall 21c of the heat sink 21 and providing communication between the first substrate receiving portion 21a and the second substrate receiving portion 21b.

[0062] Therefore, the dimension of the component receiving portion 71 in the direction in which the first substrate 22 and the second substrate 23 are arranged can be set to the required minimum size according to the largest electronic component 45 to 48 among the electronic components 41 to 48. Therefore, the dimension of the component receiving portion 71 in the direction in which the first substrate 22 and the second substrate 23 are arranged can be shortened. Therefore, the distance between the first substrate 22 and the second substrate 23 can be shortened, and thus the length of the motor device 10 in its axial direction can be shortened.

[0063] In this document, a heat sink 21 with a configuration in which the component receiving portion 71 and the heat dissipation portion 72 are not separated from each other can be envisioned as a comparative example. For example, the component receiving portion 71 is formed as a recessed shape that opens toward the second substrate receiving portion 21b, and the first substrate 22 contacts the bottom portion of the component receiving portion 71 having the recessed shape, which is part of the heat dissipation portion. Even with this configuration, the heat generated by the first substrate 22 can be dissipated through the bottom portion of the component receiving portion 71 having the recessed shape. However, in this case, there is a concern that the dimension of the component receiving portion 71 in the direction in which the first substrate 22 and the second substrate 23 are arranged may increase due to the thickness of the bottom portion of the component receiving portion 71 having the recessed shape. Therefore, there is a possibility that the distance between the first substrate 22 and the second substrate 23 may increase, and thus the length of the motor device 10 in its axial direction may increase.

[0064] Regarding this aspect, in this embodiment, the component receiving portion 71 does not need to have a portion that closes the opening of the component receiving portion 71 on the first substrate 22 side and contacts the first substrate 22. According to this embodiment, since the component receiving portion 71 does not have a portion that contacts the first substrate 22 as a heat dissipation portion, the size of the component receiving portion 71 can be correspondingly shortened. Therefore, the distance between the first substrate 22 and the second substrate 23 can be shortened.

[0065] Furthermore, by placing the heat sink 21 between the first substrate 22 and the second substrate 23, a heat dissipation path is ensured for dissipating heat generated by both the first substrate 22 and the second substrate 23. Specifically, as by Figure 2 As indicated by arrow A1, heat generated by electronic components disposed on the first substrate 22 is directly transferred to the heat sink 21 or transferred through the first substrate 22 to the heat sink 21, and thus dissipated. For example, by... Figure 2 As indicated by arrow A2, heat generated by electronic components mounted on the second substrate 23 is directly transferred to the heat sink 21 or transferred through the second substrate 23 to the heat sink 21, and thus dissipated. For example, by... Figure 2 As indicated by arrow A3, the heat generated by the electronic components mounted on the second substrate 23 is also transferred to the housing of the motor 11. Therefore, the heat dissipation of the control device 12 is further enhanced.

[0066] Therefore, according to this embodiment, the following effects can be obtained. (1) In the heat sink 21, the component receiving portion 71, which is configured to receive the electronic components 41 to 48 of the second substrate 23, and the heat dissipation portion 72, which is configured to dissipate the heat generated by the first substrate 22, are arranged separately so as not to overlap each other. Since it is not necessary to provide a portion in the heat sink 21 that contacts the first substrate 22 at the portion corresponding to the component receiving portion 71, the length of the component receiving portion 71 in the direction in which the first substrate 22 and the second substrate 23 are arranged can be shortened accordingly, and therefore the distance between the first substrate 22 and the second substrate 23 can be shortened accordingly. Therefore, the length of the motor device 10 in its axial direction can be shortened. Therefore, the size of the control device 12 can be reduced, and therefore the size of the motor device 10 can be reduced.

[0067] (2) Since it is not necessary to configure the component receiving portion 71 to have a portion that contacts the first substrate 22, the component receiving portion 71 can be configured to be open to both the interior of the first substrate receiving portion 21a and the interior of the second substrate receiving portion 21b within the heat sink 21. Because the first substrate receiving portion 21a and the second substrate receiving portion 21b are connected to each other through the component receiving portion 71 in the heat sink 21, air circulates between the first substrate receiving portion 21a and the second substrate receiving portion 21b. Therefore, the heat dissipation effect of the heat sink 21 can be further improved.

[0068] (3) A heat sink 21 is disposed between the first substrate 22 and the second substrate 23. Therefore, the heat generated by the first substrate 22 and the heat generated by the second substrate 23 are both dissipated through the heat sink 21. More specifically, the heat generated by the first substrate 22 and the heat generated by the second substrate 23 are dissipated through the partition wall 21c provided with the heat dissipation portion 72 and through the peripheral wall 21d. Therefore, the heat dissipation effect of the control device 12 is further improved.

[0069] (4) The heat sink 21 includes a peripheral wall 21d surrounding the first substrate 22 and the second substrate 23. By ensuring the contact area between the heat sink 21 and the air, the heat dissipation effect of the heat sink 21 is further improved.

[0070] (5) In the heat sink 21, the component receiving portion 71 is disposed in the central portion of the heat sink 21, and the heat dissipation portion 72, configured to dissipate heat generated by the first substrate 22 and heat generated by the second substrate 23, is disposed around the component receiving portion 71. Compared to the case where the heat dissipation portion 72 is disposed in the central portion of the heat sink 21, the distance between the heat dissipation portion 72 and the peripheral wall 21d is shortened. Therefore, the heat transferred to the heat dissipation portion 72 is transferred to the peripheral wall 21d and dissipated into the air more quickly. Therefore, the heat dissipation effect of the heat sink 21 can be further improved.

[0071] (6) The control device 12 controls the power supply to the winding groups of the two systems of the motor 11. Unlike the control device for a motor with a single winding group, it is necessary to provide inverter circuits 51 and 52 for two systems. As the number of inverter circuits increases, the total heat generation increases. In this respect, the control device 12 of this embodiment, which has a higher heat dissipation effect, is suitable as a control device for a motor 11 with multiple winding groups.

[0072] (7) In the heat sink 21, the first substrate receiving portion 21a and the second substrate receiving portion 21b are defined by a partition wall 21c and a peripheral wall 21d. The first substrate 22 is received in the first substrate receiving portion 21a, and the second substrate 23 is received in the second substrate receiving portion 21b. Therefore, the first substrate 22 and the second substrate 23 can be protected from dust, impact, etc.

[0073] (8) Terminal blocks 40a and 40b, which are connected to the busbar assembly of the motor 11 in both systems, are disposed on the surface of the second substrate 23 on the side of the heat sink 21. In the assembled state of the control device 12, terminal blocks 40a and 40b are held in a position where they are inserted into the terminal block insertion holes 73a and 73b of the heat sink 21, respectively. Therefore, compared to the case where terminal blocks 40a and 40b are disposed on the surface of the second substrate 23 on the side of the motor 11, the length of the control device 12 in the direction in which the first substrate 22 and the second substrate 23 are arranged can be shortened, and thus the length of the motor device 10 in its axial direction can be shortened. This is because when terminal blocks 40a and 40b are disposed on the surface of the second substrate 23 on the side of the motor 11, mounting space for terminal blocks 40a and 40b needs to be provided between the second substrate 23 and the motor 11.

[0074] (9) When the assembled control device 12 is attached to the end portion of the motor 11, the busbars of the motor 11 are inserted into the terminal block insertion holes 73a and 73b of the radiator 21, respectively. In this state, the busbars of the motor 11 and the terminal blocks 40a and 40b are fixed to each other by bolts 25a and 25b passing through the openings 74a and 74b provided in the peripheral wall 21d of the radiator 21 from the outside. That is, since the control device 12 is assembled as a sub-assembly, the assembly operation of the control device 12 and the operation of attaching the assembled control device 12 to the motor 11 are made easier. In addition, the control device 12 can be easily carried.

[0075] This embodiment can be modified and implemented as follows. The heat sink 21 can have the function of positioning the first substrate 22 and the second substrate 23. For example, the partition wall 21c of the heat sink 21 is provided with pins, and the pins are respectively inserted into positioning holes provided in the first substrate 22 and the second substrate 23. With this configuration, the first substrate 22 and the second substrate 23 are positioned relative to the heat sink 21. Therefore, the relative positional accuracy of the first substrate 22 and the second substrate 23 is improved.

[0076] The positions of the component receiving portion 71 and the heat dissipation portion 72 can be reversed according to product specifications, etc. Specifically, the heat dissipation portion 72 is located in the central part of the heat sink 21, while the component receiving portion 71 is located at the peripheral edge of the heat sink 21.

[0077] The positions of the first substrate 22 and the second substrate 23 can be reversed according to product specifications, etc. Specifically, the first substrate 22 is disposed on the side closer to the motor 11, while the second substrate 23 is disposed on the side farther away from the motor 11. It should be noted that the orientation or structure of the heat sink 21 can be appropriately changed according to the positions of the first substrate 22 and the second substrate 23.

[0078] Depending on product specifications, a configuration in which the component receiving portion 71 does not extend through the heat sink 21 can be adopted. Specifically, the opening of the component receiving portion 71 on the first substrate 22 side can be closed. It should be noted that since this closed portion does not need to be used as a heat dissipation portion, it is not necessary to ensure the thickness of the closed portion.

[0079] The control device 12 can be used as a control device for a motor with a winding assembly of a single system. In this case, the control device 12 includes electrical components for a single system only, such as an inverter circuit.

[0080] The motor unit 10 is suitable as a power source for an electric power steering system. The motor unit 10 is also suitable as a source of generating steering reaction force or a source of generating steering force for turning the steering wheels in a steer-by-wire system.

[0081] The control device 12 can be implemented as a control device for electrical devices other than the motor 11.

Claims

1. A motor device, wherein a control device and a motor as an electrical device are integrally arranged, characterized in that, The control device includes: A first substrate (22) is provided with chip electronic components; A second substrate (23) having a surface on which a plurality of electronic components are disposed, the plurality of electronic components including a height component that is higher than the chip electronic components, the surface of the second substrate (23) facing the surface of the first substrate (22) on which the chip electronic components are disposed; and A heat sink (21) is disposed between the first substrate (22) and the second substrate (23). The heat sink (21) includes a component receiving portion (71) and a heat dissipation portion (72). The component receiving portion (71) is configured to receive the tall component on the second substrate (23), and the heat dissipation portion (72) is configured to perform heat exchange between the first substrate (22) and the second substrate (23). The component receiving portion (71) and the heat dissipation portion (72) are arranged so that they do not overlap when viewed in a facing direction where the first substrate (22) and the second substrate (23) face each other. Furthermore, the control device is attached to the motor in such a way that heat generated by the electronic components disposed on the second substrate is transferred to the motor. The first substrate (22) is configured to control the supply of power to an electrical device, and the second substrate (23) is configured to supply the power to the electrical device via control performed by the first substrate (22); and The second substrate (23) is positioned closer to the electrical device than the first substrate (22). A terminal block for connection to the terminals of the electrical device is provided on the surface of the second substrate (23) where the high component is provided; and The heat sink (21) includes a terminal block receiving portion configured to receive the terminal block, the terminal block receiving portion being configured not to overlap with the component receiving portion (71) or the heat dissipation portion (72) when viewed in the facing direction along which the first substrate (22) and the second substrate (23) face each other.

2. The motor device according to claim 1, characterized in that, The component receiving portion (71) extends through the heat sink (21) along the facing direction of the first substrate (22) and the second substrate (23) facing each other.

3. The motor device according to claim 1, characterized in that, The component receiving portion (71) is disposed in the central portion of the radiator (21), and the heat dissipation portion (72) is disposed in the peripheral portion of the radiator (21) surrounding the component receiving portion (71).

4. The motor device according to any one of claims 1 to 3, characterized in that, The heat sink (21) includes a partition wall (21c) and a peripheral wall (21d), the partition wall (21c) being located between the first substrate (22) and the second substrate (23), and the peripheral wall (21d) being disposed on the peripheral edge portion of the partition wall (21c) and surrounding both the first substrate (22) and the second substrate (23).

Images