Electronic device including a biometric sensor

Abstract

An electronic device is provided, comprising: a transparent member including a transparent material; a display panel disposed below the transparent member and including a plurality of pixels; a biometric sensor disposed below the display panel; and a filter disposed between the display panel and the biometric sensor and covering the biometric sensor.

Description

[0001] This application is a divisional application of a patent application with an application date of February 14, 2019, application number 201980013634.1, and invention name “Electronic device including a biometric sensor”. Technical Field

[0002] The present disclosure relates to a device including a biometric sensor for sensing biometric information of a user. Background Art

[0003] Recently, a technology has been developed to perform user authentication using biometric information of the user obtained through a biometric sensor, such as fingerprint, iris, etc. Biometric sensors for fingerprint recognition can be divided into optical type, ultrasonic type and capacitive type according to the method of obtaining fingerprint information.

[0004] The above information is provided as background information only to assist with understanding the present disclosure. No determination or assertion is made as to whether any of the above content is applicable as prior art with respect to the present disclosure. Summary of the invention

[0005] Technical issues

[0006] The optical sensor must maintain a constant distance between the display and the sensor and prevent foreign matter (such as dust) from being introduced between the display and the sensor. However, due to external impact or aging during the use of the electronic device, the distance between the display and the biometric sensor may change, or the performance of the sensor may be degraded due to foreign matter introduced between the display and the sensor.

[0007] Embodiments of the present disclosure at least solve the above problems and / or disadvantages, and provide at least the following advantages. Therefore, one aspect of the present disclosure is to provide a biometric sensor having a structure for stably maintaining a distance between a display and a sensor to prevent and / or reduce foreign matter from being introduced between the display and the sensor, and a device including the biometric sensor.

[0008] Technical Solution

[0009] According to one aspect of the present disclosure, an electronic device is provided. The electronic device may include: a transparent member including a transparent material; a display panel disposed below the transparent member and including a plurality of pixels; a biometric sensor disposed below the display panel; and a filter disposed between the display panel and the biometric sensor to cover the biometric sensor.

[0010] According to another aspect of the present disclosure, an electronic device is provided. The electronic device may include: a display including a panel layer and a supporting layer configured to support the panel layer; a transparent member including a transparent material disposed on the panel layer; a biometric sensor module including a biometric sensor disposed below the supporting layer; and a processor electrically connected to the panel layer and the biometric sensor module, and configured to control the electronic device to obtain biometric information using the biometric sensor module. The biometric sensor module may include: a circuit board; a sensor housing having one side disposed below the supporting layer and having another side disposed on the circuit board, and having one side in which an opening is formed, wherein the biometric sensor is disposed in the sensor housing and disposed on the circuit board; an optical layer disposed on the biometric sensor; and an optical filter disposed in the opening.

[0011] According to various embodiments of the present disclosure, the electronic device may stably maintain the distance between the display and the sensor to prevent and / or reduce foreign matter from being introduced between the display and the sensor, thereby preventing performance degradation of the sensor.

[0012] Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure.

[0013] Beneficial Effects

[0014] According to various embodiments of the present disclosure, the electronic device may stably maintain the distance between the display and the sensor to prevent and / or reduce foreign matter from being introduced between the display and the sensor, thereby preventing performance degradation of the sensor.

[0015] Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following detailed description in conjunction with the accompanying drawings, in which:

[0017] Figure 1 is a block diagram illustrating an example electronic device in a network environment according to various embodiments;

[0018] Figure 2 is a diagram showing the appearance of an exemplary electronic device according to an embodiment;

[0019] Figure 3 is an exploded perspective view showing an example electronic device according to an embodiment;

[0020] Figure 4a and Figure 4bis a cross-sectional view illustrating an example electronic device according to various embodiments;

[0021] Figure 5a , Figure 5b and Figure 5c is a cross-sectional view showing an example packaging structure of a biometric sensor module according to various embodiments; and

[0022] Figure 6a , Figure 6b and Figure 6c is a cross-sectional view illustrating an example electronic device according to various embodiments. DETAILED DESCRIPTION

[0023] Figure 1 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input device 150, a sound output device 155, a display device 160, an audio module 170, a sensor module 176, an interface 177, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the components (e.g., the display device 160 or the camera module 180) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the components may be implemented as a single integrated circuit.For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illumination sensor) may be implemented to be embedded in the display device 160 (eg, a display).

[0024] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may load a command or data received from another component (e.g., sensor module 176 or communication module 190) into the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 123 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 121 in operation. Additionally or alternatively, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be specifically used for a specified function. The auxiliary processor 123 may be implemented separately from the main processor 121 , or as part of the main processor 121 .

[0025] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., display device 160, sensor module 176, or communication module 190) among the components of the electronic device 101 (not the main processor 121), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component (e.g., display device 160, sensor module 176, or communication module 190) among the components of the electronic device 101 together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) that is functionally related to the auxiliary processor 123.

[0026] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0027] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0028] The input device 150 may receive commands or data to be used by other components (eg, the processor 120) of the electronic device 101 from outside the electronic device 101 (eg, a user). The input device 150 may include, for example, a microphone, a mouse, or a keyboard.

[0029] The sound output device 155 can output a sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records, and the receiver can be used for incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as a part of the speaker.

[0030] The display device 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display device 160 may include a touch circuit adapted to detect a touch or a sensor circuit (e.g., a pressure sensor) adapted to measure the strength of a force caused by a touch.

[0031] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input device 150, or output sound via the sound output device 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0032] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0033] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0034] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0035] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0036] The camera module 180 may capture still images or moving images. According to an embodiment, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0037] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0038] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0039] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0040] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include one or more antennas, and thus, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna.

[0041] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0042] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 and the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute the requested at least part of the function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

[0043] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0044] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include all possible combinations of items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” when the terms “operably” or “communicatively” are used or when the terms “operably” or “communicatively” are not used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0045] As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0046] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), but the term does not distinguish between data being semi-permanently stored in a storage medium and data being temporarily stored in a storage medium.

[0047] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0048] According to various embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities. According to various embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to various embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0049] Figure 2 is a diagram showing an appearance of an exemplary electronic device according to an embodiment.

[0050] Reference Figure 2 According to one embodiment, the display (or display panel) 210 and the housing 220 may be exposed to the electronic device 201 (eg Figure 1 According to an embodiment, the electronic device 201 may include various hardware modules not shown. For example, a pressure sensor that senses the strength (pressure) of a user's touch input and / or a biometric sensor that detects a user's fingerprint may be provided on the rear surface of the display 210.

[0051] According to an embodiment, the electronic device 201 may detect a user's fingerprint through the second area 212 of the display 210. To this end, a biometric sensor for detecting a fingerprint may be provided on a rear surface of the second area 212 of the display 210.

[0052] According to various embodiments of the present disclosure, although the biometric sensor is disposed on the rear surface of the display 210, it is possible to provide a sensor packaging structure capable of maintaining an appropriate distance from the display 210 to accurately obtain information about the user's fingerprint and prevent and / or reduce performance degradation due to the introduction of foreign matter external to the biometric sensor.

[0053] exist Figure 2 In the embodiment, the electronic device 201 is only illustrative and is not limited to the above examples. For example, a receiver, a camera module, an iris sensor, other biometric sensors, etc. can be disposed on the rear surface of the display 210.

[0054] Figure 3 is an exploded perspective view illustrating an example electronic device according to an embodiment.

[0055] Reference Figure 3 , electronic device 301 (eg Figure 1 The electronic device 101 or Figure 2 The electronic device 201 may include a transparent member 310 (eg, a cover glass), a display device 320, a support member (eg, a support member) 330, a circuit board 340, a side member 350, a battery 360, and / or a back cover 370. According to various embodiments, the electronic device 301 may not include Figure 3 Some of the components shown, and may further include Figure 3 Components not shown.

[0056] According to an embodiment, the transparent member 310 (e.g., a first plate including a transparent material such as, for example, a cover glass) may transmit light generated by the display device 320. For another example, the user may touch the transparent member 310 with a part of his or her body (e.g., a finger) to provide a touch input (including a touch using an electronic pen) to the electronic device 301. The transparent member 310 may be formed of various transparent materials (such as, for example but not limited to, tempered glass, reinforced plastic, flexible polymer material, etc.) to protect the display device 320 and the configuration included in the electronic device 301 from external impact. According to various embodiments, the transparent member 310 may be referred to as a glass window or a cover glass.

[0057] According to an embodiment, the display device 320 may be disposed in a space between the transparent member 310 (e.g., the first plate) and the back cover 370 (e.g., the second plate). The display device 320 may be arranged or combined, for example, below the transparent member 310, and may be exposed through at least a portion of the transparent member 310. The display device 320 may output content (e.g., text, images, videos, icons, widgets, symbols, etc.) and / or may receive input (e.g., touch input or electronic pen input) from a user.

[0058] According to an embodiment, the display device 320 may include, for example, but not limited to, a display panel, a touch sensor, and / or an electronic pen sensor. The display panel may include, for example, but not limited to, one or more of a liquid crystal display (LCD) panel, a light emitting diode (LED) display panel, an organic LED (OLED) display panel, a micro-electromechanical system (MEMS) display panel, an electronic paper display panel, etc. The touch sensor may include, for example, but not limited to, a capacitive touch panel, a resistive touch panel, an infrared touch panel, an ultrasonic touch panel, etc. The touch panel may be inserted between display panels (add-on touch panel), may be directly formed on the display panel (on-cell touch panel), or may be included in the display panel (in-cell touch panel). The electronic pen sensor (e.g., a digitizer) may detect touch, gesture, hovering, etc. from the electronic pen. According to an embodiment, the display device 320 may include a biometric sensor module (e.g., a fingerprint sensor module) for obtaining biometric information (e.g., a fingerprint) of a user.

[0059] According to an embodiment, the display device 320 may include a planar area 321 and a curved area 322 extending from one side (e.g., upper side, lower side, left side, or right side) of the planar area 321. Pixels of a display panel (e.g., OLED, etc.), conductive patterns of a touch sensor, conductive patterns of an electronic pen sensor, etc. may be disposed on the planar area 321. The curved area 322 may be electrically connected to a flexible printed circuit board (FPCB) 325 through various conductive patterns (wiring), and the flexible printed circuit board (FPCB) 325 may be located on the rear surface of the display device 320.

[0060] According to an embodiment, a portion of the curved region 322 may be bent toward the rear surface of the planar region 321. According to various embodiments, the wiring of the FPCB 325 may pass through one side of the support member (support) 330 and may be electrically connected to the circuit board 340 (e.g., the main circuit board 340m) via a designated connector. According to various embodiments, similar to the planar region 321, pixels for displaying various information may be arranged on the curved region 322.

[0061] According to an embodiment, the support member 330 (e.g., a bracket) may include, for example, but not limited to, a metal material, a polymer material, etc. The support member 330 may be disposed, for example, between the display device 320 and the circuit board 340. The support member 330 may be combined with the display device 320 and the circuit board 340 to physically support the display device 320 and the circuit board 340. According to an embodiment, a bulging gap for accommodating the expansion of the battery 360 may be formed in the support member 330.

[0062] According to an embodiment, the circuit board 340 may include, for example, a main circuit board 340m and / or a sub-circuit board 340s. According to an embodiment, the main circuit board 340m and the sub-circuit board 340s may be arranged under the support member 330, and may be electrically connected to each other via a specified connector or a specified wiring. Each of the circuit boards 340m and 340s may be implemented as, for example, but not limited to, a rigid PCB (RPCB) and / or a FPCB, etc. According to an embodiment, various electronic components, devices, printed circuits, etc. (e.g., processors, memories, communication modules (e.g., wireless communication circuits), etc.) of the electronic device 301 may be installed or arranged on the circuit boards 340m and 340s. According to various embodiments, each of the circuit boards 340m and 340s may be referred to as, for example, a main board or a printed board assembly (PBA), or may be referred to as a PCB for short.

[0063] According to an embodiment, the side member 350 may be disposed between the circuit board 340 and the back cover 370 and receive components of the electronic device 301. The side member 350 may be combined with, for example, the support member 330 and / or the back cover 370 of the electronic device 301. The side member 350 may surround a space between the transparent member 310 (e.g., the first plate) and the back cover 370 (e.g., the second plate).

[0064] According to an embodiment, the battery 360 may, for example, convert chemical energy and electrical energy in a variety of ways. For example, the battery 360 may convert chemical energy into electrical energy, and may supply the electrical energy to the display device 320 and various components or modules mounted on the circuit board 340. For another example, the battery 360 may convert electrical energy supplied from the outside into chemical energy, and may store the chemical energy. According to an embodiment, a power management module including a function for managing the charging and discharging of the battery 360 may be included in the circuit board 340.

[0065] According to an embodiment, a back cover 370 (e.g., a second plate) may be combined with the rear surface of the electronic device 301. The back cover 370 may be formed, for example, but not limited to, by tempered glass, a plastic molded part, a metal, etc. According to various embodiments, the back cover 370 may be integrated with the side member 350 and / or may be implemented to be detachable by a user. The side member 350 may be referred to as a back cover, a back plate, etc.

[0066] Figure 4a is a cross-sectional view illustrating an example electronic device according to an embodiment.

[0067] Figure 4a The cross-sectional view shown corresponds to a state in which the biometric sensor module is not attached to the display (or display panel) 420 (eg Figure 3 A cross-sectional view of a display device 320). Figure 4a , electronic device 401 (eg Figure 3The electronic device 301 may include a transparent member 410 (eg Figure 3 transparent component 310) and display 420.

[0068] The transparent member 410 may be located on the top layer of the electronic device 401. The display 420 may be located below the transparent layer 410. The display 420 may include a panel layer 421 and a layer structure 425 including a plurality of layers. According to one embodiment, the panel layer 421 may include at least one light emitting device (not shown) and may be disposed below the transparent layer 410. According to one embodiment, the layer structure 425 may be disposed below the panel layer 421. In one embodiment, the layer structure 425 may include a first layer group 425-1 and a second layer group 425-2. The first layer group 425-1 may include, for example but not limited to, a support layer 41 (e.g., an EMBO layer) on which a pattern is formed, a digitizer (or electronic pen sensor) 43 for receiving input from an electronic pen, and a metal layer 45 (e.g., a copper sheet). The support layer 41 may absorb external impacts on the panel layer 421 to enhance optical properties, and may visually hide the pattern included in the digitizer 43. The second layer group 425-2 may include, for example but not limited to, a radiation sheet 47 for performing a radiation function, and a buffer layer 49 for absorbing external impacts. Wherein Figure 4a The structure in which the first layer group 425-1 and the second layer group 425-2 are stacked is only illustrative. The layer structure 425 may not include Figure 4a Some of the multiple layers shown may further include at least one other layer, or at least some of the multiple layers may be arranged in a position that is varied. For example, the layer structure 425 may not include the digitizer 43 and the metal layer 45. For another example, the layer structure 425 may not include the support layer 41 and the radiation sheet 47.

[0069] According to an embodiment, the layer structure 425 may include a through region (or opening). For example, the first layer group 425 - 1 and the second layer group 425 - 2 may include a through region having a first width w1.

[0070] According to one embodiment, a pressure sensor (not shown) may be disposed below the layer structure 425. According to one embodiment, a circuit board (e.g. Figure 3 The FPCB 325 of the pressure sensor can be arranged below the pressure sensor. Figure 3 As described above, the circuit board may extend from one side of the display 420 (eg, the panel layer 421 ) to be folded in the direction of the rear surface of the layer structure 425 , and may be attached to the pressure sensor.

[0071] Figure 4b is a cross-sectional view illustrating an example electronic device according to an embodiment.

[0072] Figure 4b The cross-sectional view shown corresponds to a state in which the biometric sensor module is not attached to the display (or display module) 420 (eg Figure 3 A cross-sectional view of a display device 310 in a state of FIG. Figure 4b , electronic device 401 (eg Figure 3 The electronic device 301 may include a transparent member 410 (eg Figure 3 transparent component 310) and display 420.

[0073] According to an embodiment, the through regions (or openings) formed in the first layer group 425-1 and the second layer group 425-2, respectively, may be different in size from each other. For example, the width w2 of the through region of the second layer group 425-2 may be greater than the width w1 of the through region of the first layer group 425-1. Therefore, the layer structure 425 may form a stepped structure through the first layer group 425-1 and the second layer group 425-2.

[0074] Figure 5a , Figure 5b and Figure 5c is a cross-sectional view illustrating an example packaging structure of a biometric sensor module according to various embodiments.

[0075] Figure 5a , Figure 5b and Figure 5c An example of a cross-sectional view of a biometric sensor module is shown.

[0076] Reference Figure 5a The biometric sensor module 503 may include a circuit board 531 (eg, a PCB), a biometric sensor 532 (eg, an image sensor), an optical layer 533 , a housing 534 , an optical filter 535 , conductive wiring 536 , and circuit elements 537 .

[0077] According to an embodiment, the circuit board 531 may include an RPCB and an FPCB. The RPCB may include passive components, a printed circuit, and a sensor integrated circuit (IC) for controlling a biometric sensor. The passive components, the printed circuit, and the sensor IC may be arranged on the rear surface of the RPCB. The FPCB may extend from one side of the RPCB or may be attached to the rear surface of the RPCB to be electrically connected to the RPCB. The FPCB (or the connecting portion) may be attached to a display (e.g., Figure 4a 420) is connected to another circuit board (eg Figure 3 FPCB 325 or circuit board 340) is electrically connected.

[0078] According to an embodiment, a biometric sensor 532 (e.g., a complementary metal oxide semiconductor (CMOS) image sensor) may be provided on the circuit board 531. For example, the biometric sensor 532 may be attached to the circuit board 531 through a first adhesive film 51 (e.g., a die attach film (DAF)). The biometric sensor 532 may be, for example, an array-type image sensor on which a plurality of image sensors are arranged at specified intervals. The biometric sensor 532 may, for example, but not limited to, obtain fingerprint information (or a fingerprint image) using reflected light reflected from a user's finger.

[0079] According to an embodiment, the optical layer 533 may be provided on the biometric sensor 532. The optical layer 533 may enhance the optical characteristics of reflected light reflected from, for example, an external object (e.g., a finger), and may refract the reflected light to enhance the light receiving efficiency of the biometric sensor 532. According to an embodiment, the optical layer 533 may include a microlens having a form protruding in an upward direction in units corresponding to each pixel of the image sensor.

[0080] According to an embodiment, the housing 534 may be disposed on the circuit board 531. For example, the housing 534 may be attached to the circuit board 531 by a first adhesive film 51 (e.g., DAF) on the circuit board 531. The housing 534 may include, for example, a polymer material such as, for example but not limited to, epoxy resin and / or a metal material such as stainless steel or aluminum. According to an embodiment, the housing 534 may include an opening 539.

[0081] According to an embodiment, an optical filter 535 may be attached to at least a portion of one surface of the housing 534 to block the biometric sensor 532 from the outside. For example, the optical filter 535 may be attached to the bottom surface of the housing 534 through a second adhesive film 52 (e.g., DAF) to cover the opening 539 of the housing 534.

[0082] According to an embodiment, the optical filter 535 may be formed, for example, as a layer-shaped optical filter layer that is disposed in the opening 539 of the housing 534 .

[0083] According to one embodiment, the optical filter 535 may be spaced apart from the optical layer 533 by a specified distance. Therefore, the biometric sensor module 503 may include a dielectric material layer 538, through which a dielectric material (e.g., air) is filled between the optical layer 533 and the optical filter 535. The optical layer 533 may refract reflected light incident through the optical filter 535 based on, for example, a difference in dielectric constant between the optical layer 533 and the dielectric layer 538. The optical filter 535 may transmit light of a specific wavelength (e.g., visible light), and may block light of another wavelength (e.g., infrared light) among reflected light reflected from, for example, an external object (e.g., a finger). For example, the optical filter 535 may transmit light of a wavelength necessary for the biometric sensor 532 to obtain fingerprint information (e.g., green light) or light that can well pass through a panel layer (e.g., infrared light) formed on a display. Figure 4a According to an embodiment, the optical filter 535 may include, for example but not limited to, a polyethylene terephthalate (PET) film.

[0084] According to an embodiment, the conductive wiring 536 may electrically connect the circuit board 531 with the biometric sensor 532. The conductive wiring 536 may include, for example, a plurality of wirings that connect the circuit board 531 with the biometric sensor 532. Fingerprint information obtained by the biometric sensor 532 may be transferred to a sensor IC disposed on the circuit board 531 through the conductive wiring 536.

[0085] According to one embodiment, the circuit element 537 may be disposed on the circuit board 531. The circuit element 537 may include, for example, but not limited to, various elements necessary for the biometric sensor module 503 to acquire, process, and transmit biometric information (e.g., capacitors, electrically erasable programmable read-only memory (EEPROM)), ICs, etc. According to one embodiment, the circuit element 537 may be disposed under the circuit board 531.

[0086] According to various embodiments, the biometric sensor module 503 may not include Figure 5a Some of the components shown, and may further include Figure 5a For example, when the circuit board 531 and the biometric sensor 532 are directly connected to each other, the biometric sensor module 503 may not include the conductive wiring 536.

[0087] Reference Figure 5b The biometric sensor module 505 may include a circuit board 531 (eg, a PCB), a biometric sensor 532 (eg, an image sensor), an optical layer 533 , a housing 534 , an optical filter 535 , conductive wiring 536 , and circuit elements 537 .

[0088] According to an embodiment, the housing 534 may be disposed on the circuit board 531. For example, the housing 534 may be attached to the circuit board 531 by a first adhesive film 51 (e.g., DAF) on the circuit board 531. According to an embodiment, the housing 534 may be disposed to cover the circuit element 537 to fix the circuit element 537 and protect the circuit element 537 from external influences. The circuit element 537 may be blocked from the outside by the housing 534.

[0089] According to an embodiment, the optical filter 535 may be attached to at least a portion of one surface of the housing 534 to block the biometric sensor 532 from the outside. For example, the optical filter 535 may be attached to a portion of the top surface of the housing 534 through the second adhesive film 52 (e.g., DAF) to cover the opening 539 of the housing 534.

[0090] Reference Figure 5c The biometric sensor module 507 may include a circuit board 531 (eg, a PCB), a biometric sensor 532 (eg, an image sensor), an optical layer 533 , a housing 534 , an optical filter 535 , conductive wiring 536 , and circuit elements 537 .

[0091] According to an embodiment, the housing 534 may be disposed on the circuit board 531 and the biometric sensor 532. For example, the housing 534 may be formed on the circuit board 531 and the biometric sensor 532, for example, by injection molding. According to an embodiment, the housing 534 may be disposed to cover the conductive wiring 536 and the circuit element 537 to fix the circuit element 537 and protect the circuit element 537 from external influences. The circuit element 537 may be completely blocked from the outside by the housing 534.

[0092] According to an embodiment, the optical filter 535 may be attached to at least a portion of one surface of the housing 534 to block the biometric sensor 532 from the outside. For example, the optical filter 535 may be attached to the entire area of ​​the top surface of the housing 534 through the second adhesive film 52 (e.g., DAF) to cover the opening 539 of the housing 534.

[0093] Figure 6a , Figure 6b and Figure 6c is a cross-sectional view illustrating an example electronic device according to various embodiments.

[0094] Figure 6a , Figure 6b and Figure 6c The cross-sectional view shown may correspond to a cross-sectional view in a state where the biometric sensor module 630 is attached to the display (or display panel) 620. Figure 6a , electronic device 601 (eg Figure 3The electronic device 301 may include a transparent member 610 (eg Figure 3 transparent member 310), display 620 (eg Figure 3 display device 320) and a biometric sensor module 630.

[0095] According to an embodiment, the biometric sensor module 630 may be attached to the display 620 through the top surface of the housing 634. For example, the biometric sensor module 630 may be attached to one surface (e.g., the bottom surface) of the layer structure 625 through the third adhesive film 63 disposed between the housing 634 and the layer structure 625.

[0096] According to an embodiment, in a state where the biometric sensor module 630 is attached to the display 620, the biometric sensor module (e.g., image sensor, optical layer, and optical filter) may face the panel layer 621. According to an embodiment, the third adhesive film 63 may have a specified thickness to ensure the performance of the biometric sensor module 630.

[0097] Reference Figure 6b , electronic device 603 (eg Figure 3 The electronic device 301 may include a transparent member 610 (eg Figure 3 transparent member 310), display 620 (eg Figure 3 display device 320) and a biometric sensor module 630.

[0098] According to an embodiment, the biometric sensor module 630 may be attached to the display 620 through a portion (e.g., the second region) of the top surface of the housing 634. The portion of the top surface of the housing 634 may be a region other than a region (e.g., the first region) to which the optical filter is attached in the top surface of the housing 634. For example, the biometric sensor module 630 may be attached to one surface (e.g., the bottom surface) of the layer structure 625 through a third adhesive film 63 disposed between a partial region of the housing 634 and the layer structure 625.

[0099] According to an embodiment, in a state where the biometric sensor module 630 is attached to the display 620, the biometric sensor module (e.g., image sensor, optical layer, and optical filter) may face the panel layer 621. According to an embodiment, the third adhesive film 63 may have a specified thickness to ensure the performance of the biometric sensor module 630.

[0100] Reference Figure 6c , electronic device 605 (e.g. Figure 3 The electronic device 301 may include a transparent member 610 (eg Figure 3 transparent member 310), display 620 (eg Figure 3display device 320) and a biometric sensor module 630.

[0101] According to an embodiment, the biometric sensor module 630 may be attached to the display 620 through the optical filter 635. For example, the biometric sensor module 630 may be attached to one surface (e.g., bottom surface) of the layer structure 625 through the third adhesive film 63 disposed between a partial region of the optical filter 635 and the layer structure 625.

[0102] According to an embodiment, in a state where the biometric sensor module 630 is attached to the display 620, the biometric sensor module (e.g., image sensor, optical layer, and optical filter) may face the panel layer 621. According to an embodiment, the third adhesive film 63 may have a specified thickness to ensure the performance of the biometric sensor module 630.

[0103] As used herein, the expression "suitable for or configured to" may be used interchangeably as, for example, the expression "suitable for," "having the ability to," "changed to," "made to," "capable of," or "designed to," in terms of hardware or software or any combination thereof, as the case may be. The expression "a device configured to" may refer, for example, to a situation where the device is "capable of" operating with another device or other parts. For example, "a processor configured to (or set to) perform A, B, and C" may refer to, but is not limited to, a dedicated processor (e.g., an embedded processor) for performing the corresponding operations, a general-purpose processor (e.g., a central processing unit (CPU), an application processor (AP)) that performs the corresponding operations by running one or more software programs stored in a storage device (e.g., memory 830), and the like.

[0104] The term "module" used herein may include a unit implemented in hardware, software or firmware or any combination thereof, and may be used interchangeably with the terms "logic", "logic block", "part", "circuit", etc. A "module" may be the smallest unit of an integrated part or a part thereof, or may be the smallest unit for performing one or more functions or a part thereof. A "module" may be implemented mechanically and / or electronically, and may include, for example but not limited to, an application specific IC (ASIC) chip, a field programmable gate array (FPGA), a programmable logic device, etc., for performing some known or to-be-developed operations.

[0105] At least a portion of the apparatus (e.g., module or function thereof) or method (e.g., operation) according to various embodiments may be implemented, for example, by instructions stored in a computer-readable storage medium (e.g., memory 830) in the form of a program module. When the instruction is executed by a processor (e.g., processor 820), the processor may perform a function corresponding to the instruction. The computer-readable recording medium may include a hard disk, a floppy disk, a magnetic medium (e.g., a magnetic tape), an optical medium (e.g., a compact disk read-only memory (CD-ROM) and a digital versatile disk (DVD), a magneto-optical medium (e.g., a floppy disk)), an embedded memory, etc. One or more instructions may include a code generated by a compiler or a code executable by an interpreter.

[0106] Each component (e.g., module or program module) according to various embodiments may include a single entity or multiple entities, may omit a portion of the above-mentioned subcomponents, or may further include other subcomponents. Alternatively or additionally, after being integrated into an entity, some components (e.g., modules or program modules) may identically or similarly perform the functions performed by each corresponding component before integration. According to various embodiments, the operations performed by modules, program modules or other components may be performed by a sequential method, a parallel method, a repetitive method or a heuristic method, or at least a portion of the operations may be performed or omitted in a different order. Alternatively, other operations may be added.

[0107] While the present disclosure has been shown and described with reference to various example embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made without departing from the spirit and scope of the present disclosure as defined, for example, by the appended claims and their equivalents.

Claims

1. An electronic device, comprising: Transparent layer; a display panel disposed below the transparent layer and comprising pixels; a sensor housing disposed below the transparent layer and below the display panel, the sensor housing comprising at least one side wall and an upper wall in which an opening is formed; a biometric sensor mounted on a printed circuit board (PCB), wherein the sensor housing is mounted on the PCB such that the biometric sensor is disposed within the at least one side wall of the sensor housing when viewed from above; as well as an optical filter at least partially within the at least one side wall of the sensor housing when viewed from above, the optical filter overlapping the opening defined in the upper wall of the sensor housing when viewed from above, wherein the optical filter is spaced apart from both the biometric sensor and the display panel, wherein an air gap is formed between the optical filter and the biometric sensor, wherein the biometric sensor is configured to receive light reflected from an object to be positioned on the transparent layer and passing through each of the display panel, the opening defined in the upper wall of the sensor housing, and the optical filter, and Wherein the opening defined in the upper wall of the sensor housing has an area smaller than an area of ​​a top surface of the biometric sensor when viewed from above.

2. The electronic device according to claim 1, wherein the upper wall of the sensor housing includes a first portion partially facing the rear surface of the display panel and forming a first portion of the opening, and a second portion surrounding the optical filter and forming a second portion of the opening, and The first portion of the opening has a first size, and the second portion of the opening has a second size, the second size being larger than the first size and smaller than a size of a top surface of the biometric sensor.

3. The electronic device according to claim 2, wherein the optical filter has a larger cross-sectional area than the first portion of the opening when viewed in a direction perpendicular to the display panel, and the optical filter is disposed in the second portion of the opening to cover the first portion of the opening. 4 . The electronic device of claim 3 , wherein the optical filter has a cross-sectional area smaller than a cross-sectional area of ​​the top surface of the biometric sensor when viewed in a direction perpendicular to the display panel. 5 . The electronic device of claim 4 , wherein the biometric sensor is electrically connected to the PCB by wire bonding.

6. The electronic device of claim 5, further comprising a circuit element electrically connected to the biometric sensor.

7. The electronic device according to claim 1, wherein the display panel comprises a plurality of layers, and the plurality of layers comprises a metal-containing layer forming a rear surface of the display panel, and wherein a second opening is formed in the metal-containing layer, and Wherein the opening of the sensor housing is partially aligned with the second opening of the metal-containing layer. 8 . The electronic device of claim 7 , further comprising a layer disposed between an area around the second opening of the metal-containing layer and an area around the opening of the sensor housing such that the sensor housing and the metal-containing layer are spaced apart from each other.

9. The electronic device according to claim 7, wherein the display panel comprises a flat area and a curved area extending from one side of the flat area, and The bending area may be electrically connected to a flexible printed circuit board below the display panel. 10 . The electronic device of claim 7 , further comprising a supporting member combined with the display panel to physically support the display panel.

11. The electronic device of claim 1, wherein the light received by the biometric sensor includes light emitted from the pixel and reflected from the object. 12 . The electronic device of claim 11 , wherein the optical filter is configured to transmit light in a visible wavelength band and block at least a portion of light in an infrared wavelength band.

13. The electronic device of claim 1, wherein the air gap between the biometric sensor and the optical filter is in close proximity to at least one of the biometric sensor and the optical filter.

14. An electronic device comprising: Transparent layer; a display panel disposed below the transparent layer and comprising pixels; a sensor housing disposed below the display panel, the sensor housing comprising at least one side wall and an upper wall in which a first opening is formed; a metal-containing layer disposed at least between the display panel and the upper wall of the sensor housing, wherein a second opening at least partially aligned with the first opening is formed in the metal-containing layer; a biometric sensor mounted on a printed circuit board (PCB), wherein the sensor housing is mounted on the PCB such that the biometric sensor is disposed within the sensor housing when viewed from above; an optical filter disposed inside the sensor housing when viewed from above, and attached to a portion of the sensor housing corresponding to the first opening such that the optical filter is spaced apart from both the biometric sensor and the display panel, wherein an air gap is formed between the optical filter and the biometric sensor; a circuit element mounted on the PCB and disposed inside the sensor housing when viewed from above, the circuit element being electrically connected to the biometric sensor; and wherein the biometric sensor is configured to receive light emitted from the pixel and reflected from an object positioned on the transparent layer and passing through each of the display panel, the second opening of the metal layer, the first opening of the sensor housing, and the optical filter, and Wherein the first opening defined in the upper wall of the sensor housing has a cross-sectional area that is smaller than a top surface area of ​​the biometric sensor when viewed from above.

15. The electronic device according to claim 14, wherein the upper wall of the sensor housing includes a first portion at least partially facing the metal layer, and a second portion formed below the first portion, and wherein the first portion forms a first part of the first opening having a first size, and the second portion forms a second part of the first opening having a second size greater than the first size, and The optical filter is disposed in the second portion of the first opening and partially overlaps with the first portion of the first opening. 16 . The electronic device of claim 15 , wherein the optical filter has a larger cross-sectional area than the first portion of the first opening when viewed in a direction perpendicular to the display panel.

17. The electronic device of claim 15, wherein the biometric sensor is electrically connected to the PCB by wire bonding.

18. An electronic device comprising: Transparent layer; a display panel disposed below the transparent layer and comprising pixels; a sensor housing disposed below the display panel, the sensor housing comprising at least one side wall and an upper wall in which a first opening is formed; a metal layer disposed between the display panel and the upper wall of the sensor housing, wherein a second opening is formed in the metal layer, and the second opening is at least partially aligned with the first opening; a biometric sensor mounted on a printed circuit board (PCB) and electrically connected to the PCB by wire bonding, wherein the sensor housing is mounted on the PCB such that the biometric sensor is disposed within the sensor housing when viewed from above; an optical filter disposed inside the sensor housing and attached to at least a portion of the sensor housing corresponding to the first opening, such that the optical filter is spaced apart from the biometric sensor, wherein an air gap is formed between the optical filter and the biometric sensor; a circuit element mounted on the PCB and disposed inside the sensor housing when viewed from above, the circuit element being electrically connected to the biometric sensor; a layer provided at least between a region around the second opening of the metal layer and a region around the first opening of the sensor housing, the layer having a thickness such that the metal layer and the upper wall of the sensor housing are spaced apart; as well as wherein the biometric sensor is configured to receive light emitted from at least one of the pixels and reflected from an object positioned on the transparent layer to at least partially contact the transparent layer and passing through each of the display panel, the second opening of the metal layer, the first opening of the sensor housing, and the optical filter, and Wherein the first opening in the upper wall of the sensor housing has a cross-sectional area that is smaller than a top surface area of ​​the biometric sensor when viewed from above.

19. The electronic device according to claim 18, wherein the upper wall of the sensor housing includes a first portion partially facing the metal layer and forming a first portion of the first opening, and a second portion surrounding the optical filter and forming a second portion of the opening, the first portion and the second portion of the opening being stepped with each other at the first opening; and Wherein the first portion of the opening has a first size and the second portion of the opening has a second size greater than the first size.

20. The electronic device of claim 18, wherein the layer includes an adhesive for attaching the upper wall of the housing and the metal layer.

21. The electronic device of claim 18, wherein the air gap between the biometric sensor and the optical filter is proximate to at least one of the biometric sensor and the optical filter.

22. An electronic device comprising: Transparent components; a display panel disposed below the transparent member and comprising pixels; a sensor housing disposed below the display panel, the sensor housing comprising at least one side wall and an upper wall in which an opening is formed; a biometric sensor mounted on a printed circuit board (PCB), wherein the sensor housing is mounted on the PCB such that the biometric sensor is disposed within the sensor housing; as well as an optical filter disposed inside the sensor housing and attached to a portion of the sensor housing corresponding to the opening such that the optical filter is spaced apart from both the biometric sensor and the display panel, wherein an air gap is provided between the biometric sensor and the optical filter; wherein the biometric sensor is configured to receive light reflected from an object positioned on the transparent member and passing through the display panel, the opening of the sensor housing, and the optical filter, and Wherein the opening formed at the upper wall of the sensor housing has a cross-sectional area smaller than a top surface area of ​​the biometric sensor when viewed in a direction perpendicular to the display panel.

23. The electronic device according to claim 22, wherein the upper wall of the sensor housing includes a first portion partially facing the rear surface of the display panel and forming a first portion of the opening, and a second portion surrounding the optical filter and forming a second portion of the opening, and The first portion of the opening has a first size, and the second portion of the opening has a second size, the second size being larger than the first size and smaller than a size of a top surface of the biometric sensor. 24 . The electronic device of claim 23 , wherein the optical filter has a larger cross-sectional area than the first portion of the opening when viewed in a direction perpendicular to the display panel, and the optical filter is disposed in the second portion of the opening.

25. The electronic device of claim 22, wherein the optical filter has a cross-sectional area smaller than a cross-sectional area of ​​a top surface of the biometric sensor when viewed in a direction perpendicular to the display panel.

26. The electronic device of claim 22, wherein the biometric sensor is electrically connected to the PCB by wire bonding.

27. The electronic device of claim 22, wherein the display panel comprises a metal-containing layer at a rear surface of the display panel, and wherein a second opening is formed in the metal-containing layer, and Wherein the opening of the sensor housing is partially aligned with the second opening of the metal-containing layer. 28 . The electronic device of claim 27 , further comprising a layer disposed between an area around the second opening of the metal-containing layer and an area around the opening of the sensor housing such that the sensor housing and the metal-containing layer are spaced apart from each other.

29. The electronic device of claim 22, wherein the optical filter is configured to transmit light in at least one visible wavelength band and block at least a portion of light in an infrared wavelength band.

30. The electronic device of claim 22, wherein the air gap provided between the biometric sensor and the optical filter is in close proximity to at least one of the biometric sensor and the optical filter.

Images