A method for preparing a Mini LED display module

Abstract

The present invention relates to a method for preparing a Mini LED display module, which includes a control circuit, a substrate, a chip layer, and a quantum dot film. The control circuit, the substrate, the chip layer, and the quantum dot film are sequentially arranged from bottom to top. The quantum dot powder layer includes multiple groups of quantum dot powder block units arranged at uniform intervals. Each group of quantum dot powder block units includes a red quantum dot powder block, a green quantum dot powder block, and a blue quantum dot powder block. The chip layer includes multiple groups of blue light chip units arranged at uniform intervals. Each group of blue light chip units includes three blue light chips arranged at uniform intervals. The red quantum dot powder block, the green quantum dot powder block, and the blue quantum dot powder block in the quantum dot powder block unit respectively correspond to one blue light chip in the blue light chip unit. Adhesive is provided at the position of each blue light chip corresponding to the substrate to fix the blue light chip on the substrate. The beneficial effects are that the production efficiency and display effect of the Mini LED display module are improved and its production cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of Mini LED, and particularly to a Mini LED display module and a preparation method thereof. Background Art

[0002] The Mini LED display module mainly includes a substrate, a chip, and a quantum dot film, and the substrate, the chip, and the quantum dot film are sequentially arranged from bottom to top. The chip excites the quantum dot powder on the quantum dot film to form a full-color display.

[0003] Currently, the general setting of the Mini LED display module is as follows: The chip includes a red light chip, a green light chip, and a blue light chip. Among them, when preparing the red light chip, it is necessary to first peel the gallium phosphide (AlGaAs) epitaxial wafer from the gallium arsenide (GaAs) substrate, and then bond the epitaxial wafer to the sapphire. The processing difficulty of this process is relatively large, resulting in a low production yield and a high production cost, thereby increasing the production cost of the Mini LED display module and reducing the production efficiency. At the same time, when transferring the chip from the blue film to the substrate in this form of Mini LED display module, it is necessary to first distinguish the red light chip, the green light chip, and the blue light chip, and then transfer the three chips to the corresponding positions on the substrate in a certain order. This process is complex and cumbersome and requires a high position accuracy, resulting in low production efficiency and production straight-through rate of the Mini LED display module.

[0004] Therefore, there is an urgent need for a Mini LED display module and a preparation method thereof with high production efficiency and low production cost. Summary of the Invention

[0005] (1) Technical Problems to be Solved

[0006] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a Mini LED display module and a preparation method thereof, which solve the technical problems that the current Mini LED display module has low production efficiency and high production cost due to the complex and cumbersome process of the chip transfer process, the low production yield and high production cost of the red light chip therein.

[0007] (2) Technical Solutions

[0008] In order to achieve the above object, the main technical solutions adopted by the present invention include:

[0009] In a first aspect, an embodiment of the present invention provides a Mini LED display module, including a control circuit, a substrate, a chip layer, and a quantum dot film, and the control circuit, the substrate, the chip layer, and the quantum dot film are sequentially arranged from bottom to top.

[0010] The quantum dot film includes a quantum dot powder layer, and the quantum dot powder layer includes multiple groups of quantum dot powder block units arranged at uniform intervals; each group of the quantum dot powder block units includes a red quantum dot powder block, a green quantum dot powder block, and a blue quantum dot powder block;

[0011] The quantum dot powder block units are arranged at uniform intervals in the arrangement order of one red quantum dot powder block, one green quantum dot powder block, and one blue quantum dot powder block to form the quantum dot powder block units;

[0012] The chip layer includes multiple groups of blue light chip units arranged at uniform intervals; each group of the blue light chip units includes three blue light chips arranged at uniform intervals, and the blue light chips are arranged at intervals;

[0013] The red quantum dot powder block, the green quantum dot powder block, and the blue quantum dot powder block in the quantum dot powder block unit respectively correspond to one blue light chip in the blue light chip unit;

[0014] Bonding glue is provided at the position of the substrate corresponding to each blue light chip to fix the blue light chip on the substrate;

[0015] The control circuit is used to control the operation of the blue light chip.

[0016] According to the present invention, the chip layer further includes chip glue, the chip glue coats the blue light chip, and the chip glue is black.

[0017] According to the present invention, the heights of each red quantum dot powder block, the green quantum dot powder block, and the blue quantum dot powder block are the same.

[0018] According to the present invention, the quantum dot powder layer further includes glue blocks, the glue blocks are black, and the glue blocks are arranged at the gaps between adjacent quantum dot powder blocks in each group of quantum dot powder block units and at the gaps between adjacent quantum dot powder block units;

[0019] The quantum dot film further includes two layers of optical films, and the two layers of optical films are symmetrically arranged on the upper and lower sides of the quantum dot powder layer respectively.

[0020] According to the present invention, the red quantum dot powder block is a uniform mixture of red quantum dot powder, nano-silicon, silicon oxide, carbon, and glue;

[0021] The green quantum dot powder block is a uniform mixture of green quantum dot powder, nano-silicon, silicon oxide, carbon, and glue;

[0022] The blue quantum dot powder block is a uniform mixture of blue quantum dot powder, nano-silicon, silicon oxide, carbon, and glue.

[0023] According to the present invention, the adhesive is a polyimide-based conductive adhesive.

[0024] In a second aspect, an embodiment of the present invention further provides a method for manufacturing a Mini LED display module, including the following steps:

[0025] S11: First, clean the substrate, then transfer a plurality of the blue light chips to the adhesive at corresponding positions on the substrate, and then weld the blue light chips to the substrate and bake the adhesive.

[0026] S12: Prepare the chip glue and then remove the air in the chip glue.

[0027] S13: Coat the blue light chips with the chip glue, and then bake the chip glue to cure the chip glue.

[0028] S14: Grind the chip glue until the height of the chip glue is 1 - 2 times the height of the blue light chips.

[0029] S15: Perform spin coating on the side surface of the chip glue away from the substrate.

[0030] S16: Place the quantum dot film on the side surface of the chip layer away from the substrate, so that one red quantum dot powder block, one green quantum dot powder block, and one blue quantum dot powder block respectively correspond to one blue light chip.

[0031] S17: The quantum dot film is adhered to the chip layer through an adhesive, and then the adhesive is dried.

[0032] According to the present invention, in the initial state, the blue film is located above the substrate, the blue film carries a plurality of spaced blue light chips, and the blue light chips correspond to the adhesive on the substrate one by one.

[0033] The process of transferring the blue light chips to the substrate is as follows:

[0034] S21: The suction nozzle moves above the blue film and corresponds to the position of the blue light chip.

[0035] S22: The suction nozzle moves downwards to fit with the blue light chip.

[0036] S23: The suction nozzle continues to move downwards and drives the blue light chip to move downwards to fit with the adhesive on the substrate. At this time, the blue film undergoes elastic deformation.

[0037] S24: The suction nozzle resets, the blue film rebounds, and the blue light chip is transferred to the substrate and fixed on the substrate through the adhesive.

[0038] According to the present invention, the preparation method of the quantum dot film is as follows:

[0039] S41: Clean the optical film, and then prepare red quantum dot powder glue, green quantum dot powder glue, and blue quantum dot powder glue respectively;

[0040] S42: Coat the red quantum dot powder glue, the green quantum dot glue, and the blue quantum dot glue on the optical film at uniform intervals in this order. After the red quantum dot powder glue, the green quantum dot glue, and the blue quantum dot glue are cured, they are respectively formed into the red quantum dot powder block, the green quantum dot powder block, and the blue quantum dot powder block;

[0041] S43: Repeat step S multiple times so that multiple groups of the quantum dot powder block units formed in the arrangement order of one red quantum dot powder block, one green quantum dot powder block, and one blue quantum dot powder block are arranged at uniform intervals;

[0042] S44: Fix another optical film on the side of the quantum dot powder layer away from the optical film.

[0043] According to the present invention, an ultrasonic stirring device is adopted, and by the method of stirring while coating, the quantum dot powder is uniformly distributed in the quantum dot powder glue;

[0044] Adopt a roll-to-roll coating process to uniformly coat the red quantum dot powder glue, the green quantum dot glue, and the blue quantum dot glue on the optical film respectively, and control the heights of each red quantum dot powder block, green quantum dot powder block, and blue quantum dot powder block to be the same.

[0045] (III) Beneficial effects

[0046] The beneficial effects of the present invention are as follows: A Mini LED display module and its preparation method according to the present invention have the following beneficial effects:

[0047] First, traditional Mini LED display modules usually use three types of chips, namely red light chips, green light chips, and blue light chips, to achieve full-color display. However, the present invention only needs to set one type of chip, that is, a blue light chip, and the blue light chip correspondingly excites red quantum dot powder, green quantum dot powder, and blue quantum dot powder to emit red light, green light, and blue light respectively, so as to achieve full-color display.

[0048] In the present invention, the types of chips are reduced to one kind. During the process of transferring the chips onto the substrate to form a chip layer, the process of identifying the types of chips and arranging different types of chips in a certain order is cancelled, reducing the processing difficulty of the chips, simplifying the steps of chip transfer, reducing operation errors and improving the position accuracy of the chips on the substrate, achieving high-speed and high-precision transfer of the chips from the blue film to the substrate, thereby improving the production efficiency, production through rate, processing precision and display effect of the Mini LED display module, and reducing the production cost.

[0049] Second, the present invention uses a blue light chip to simultaneously excite the red quantum dot powder in the red quantum dot powder block, the green quantum dot powder in the green quantum dot powder block, and the blue quantum dot powder in the blue quantum dot powder block to generate red light, green light and blue light respectively, so as to ensure that the red quantum dot powder, the green quantum dot powder and the blue quantum dot powder respond to the blue light chip simultaneously and emit red light, green light and blue light simultaneously, avoiding the deviation of response time caused by different excitation methods and affecting the display effect of the Mini LED display module.

[0050] Third, the blue light chip used in the present invention emits near-ultraviolet light. Compared with visible lights such as red, green and blue, the transmittance of near-ultraviolet light is lower and it is more easily absorbed by the quantum dot powder, so as to avoid optical crosstalk between adjacent blue light chips, thereby improving the display effect of the Mini LED display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 is a schematic diagram of an embodiment of the Mini LED display module of the present invention;

[0052] Figure 2 is Figure 1 a schematic diagram of the quantum dot film in

[0053] Figure 3 is Figure 1 a schematic diagram of step S21 when transferring the blue light chip from the blue film to the substrate in

[0054] Figure 4 is Figure 1 a schematic diagram of step S22 when transferring the blue light chip from the blue film to the substrate in

[0055] Figure 5 is Figure 1 a schematic diagram of step S23 when transferring the blue light chip from the blue film to the substrate in

[0056] Figure 6 is Figure 1 a schematic diagram of step S24 when transferring the blue light chip from the blue film to the substrate in

[0057] Figure 7Schematic diagram of step 31 in the traditional process of transferring a blue light chip from a blue film to a substrate;

[0058] Figure 8 Schematic diagram of step 32 in the traditional process of transferring a blue light chip from a blue film to a substrate;

[0059] Figure 9 Schematic diagram of step 33 in the traditional process of transferring a blue light chip from a blue film to a substrate;

[0060] Figure 10 Schematic diagram of step 34 in the traditional process of transferring a blue light chip from a blue film to a substrate;

[0061] Figure 11 Schematic diagram of step 35 in the traditional process of transferring a blue light chip from a blue film to a substrate;

[0062] Figure 12 Schematic diagram of step 36 in the traditional process of transferring a blue light chip from a blue film to a substrate;

[0063] Figure 13 Schematic diagram of step 37 in the traditional process of transferring a blue light chip from a blue film to a substrate;

[0064] Figure 14 Schematic diagram of step 38 in the traditional process of transferring a blue light chip from a blue film to a substrate;

[0065] Figure 15 Flow chart of an embodiment of the method for manufacturing a Mini LED display module of the present invention.

[0066]

Explanation of reference numerals

[0067] 1: Substrate; 11: Adhesive;

[0068] 2: Chip layer; 21: Blue light chip; 22: Chip glue;

[0069] 3: Quantum dot film; 31: Quantum dot powder block; 311: Red quantum dot powder block; 312: Green quantum dot powder block; 313: Blue quantum dot powder block; 32: Glue block; 33: Optical thin film;

[0070] 4: Blue film;

[0071] 5: Suction nozzle;

[0072] 6: Control circuit. Detailed implementation manners

[0073] For better explaining the present invention for easier understanding, the present invention will be described in detail below in conjunction with the accompanying drawings through specific embodiments. Among them, the orientation nouns such as "upper" and "lower" mentioned herein are referenced with Figure 1 for orientation.

[0074] Referring to Figure 1 as shown, the present invention provides a Mini LED display module, including a control circuit 6, a substrate 1, a chip layer 2 and a quantum dot film 3. The control circuit 6, the substrate 1, the chip layer 2 and the quantum dot film 3 are arranged in sequence from bottom to top.

[0075] Referring to Figures 3 - 6 as shown, a plurality of groups of adhesive units are uniformly spaced on the substrate 1, and each group of adhesive units includes three adhesives 11 uniformly spaced.

[0076] An adhesive 11 is provided at the position corresponding to each blue light chip 21 to fix the blue light chip 21 on the substrate 1.

[0077] Referring to Figure 2 as shown, the quantum dot film 3 includes a quantum dot powder layer, and the quantum dot powder layer includes a plurality of groups of quantum dot powder block units uniformly spaced. Each group of quantum dot powder block units includes three kinds of quantum dot powder blocks 31, namely a red quantum dot powder block 311, a green quantum dot powder block 312 and a blue quantum dot powder block 313. A group of quantum dot powder block units is formed by uniformly spacing and arranging in the order of one red quantum dot powder block 311, one green quantum dot powder block 312 and one blue quantum dot powder block 313.

[0078] Referring to Figure 1 as shown, the chip layer 2 includes a plurality of groups of blue light chip units uniformly spaced, and each group of blue light chip units includes three blue light chips 21 uniformly spaced. The blue light chips 21 correspond to the adhesives 11 on the substrate 1 one by one to fix the blue light chips 21 on the adhesives 11. The red quantum dot powder block 311, the green quantum dot powder block 312 and the blue quantum dot powder block 313 in the quantum dot powder block unit respectively correspond to one blue light chip 21 in the blue light chip unit. The control circuit 6 is used to control the blue light chips 21 to work. The near-ultraviolet light emitted by each blue light chip 21 correspondingly excites the red quantum dot powder in the red quantum dot powder block 311, the green quantum dot powder in the green quantum dot powder block 312 and the blue quantum dot powder in the blue quantum dot powder block 313 to emit red light, green light and blue light respectively, thereby forming a full-color display.

[0079] Through the above settings, the present invention has the following effects:

[0080] First, traditional Mini LED display modules usually use three types of chips, namely red light chips, green light chips, and blue light chips 21, to achieve full-color display. However, in the present invention, only one type of chip, i.e., the blue light chip 21, needs to be set, and the blue light chip 21 correspondingly excites red quantum dot powder, green quantum dot powder, and blue quantum dot powder to emit red light, green light, and blue light respectively, thereby achieving full-color display.

[0081] In the present invention, by reducing the type of chips to one, and during the process of transferring the chips onto the substrate 1 to form the chip layer 2, the process of identifying the types of chips and arranging different types of chips in a certain order is cancelled, reducing the processing difficulty of the chips, simplifying the steps of chip transfer, reducing operation errors, and improving the position accuracy of the chips on the substrate 1, achieving high-speed and high-precision transfer of the chips from the blue film 4 to the substrate 1, thereby improving the production efficiency, production straight-through rate, processing accuracy, and display effect of the Mini LED display module, and reducing the production cost.

[0082] Second, the present invention uses the blue light chip 21 to simultaneously excite the red quantum dot powder in the red quantum dot powder block 311, the green quantum dot powder in the green quantum dot powder block 312, and the blue quantum dot powder in the blue quantum dot powder block 313 to correspondingly generate red light, green light, and blue light, so as to ensure that the red quantum dot powder, green quantum dot powder, and blue quantum dot powder simultaneously respond to the blue light chip 21 and simultaneously emit red light, green light, and blue light, avoiding the deviation of the response time caused by different excitation methods and affecting the display effect of the Mini LED display module.

[0083] Third, the blue light chip 21 used in the present invention emits near-ultraviolet light. Compared with visible light such as red, green, and blue, the transmittance of near-ultraviolet light is lower and it is more easily absorbed by the quantum dot powder, so as to avoid optical crosstalk between adjacent blue light chips 21, thereby improving the display effect of the Mini LED display module.

[0084] In the initial state, the blue light chip 21 is carried on the blue film 4.

[0085] Refer to Figure 15 As shown, further, the specific preparation process of the Mini LED display module is as follows:

[0086] S11: First, clean the substrate 1, and then transfer several blue light chips 21 from the blue film 4 to the bonding glue 11 at corresponding positions on the substrate 1 respectively, so that several blue light chips 21 are arranged at intervals. Subsequently, weld the blue light chips 21 to the substrate 1 and bake the bonding glue 11;

[0087] S12: Configure the chip glue 22, and then remove the air in the chip glue 22;

[0088] S13: Coating the chip glue 22 on the blue light chip 21, and then baking the chip glue 22 to cure the chip glue 22;

[0089] S14: Grinding the chip glue 22 until the height of the chip glue 22 is 1-2 times the height of the blue light chip 21;

[0090] S15: Spin coating the side surface of the chip glue 22 away from the substrate 1;

[0091] S16: Placing the quantum dot film 3 on the side surface of the chip layer 2 away from the substrate 1, so that one red quantum dot powder block 311, one green quantum dot powder block 312, and one blue quantum dot powder block 313 in the quantum dot powder block unit respectively correspond to one blue light chip 21 in the blue light chip unit;

[0092] S17: The quantum dot film 3 is adhered to the chip layer 2 through an adhesive, and then the adhesive is dried.

[0093] Among them, spin coating means coating a liquid-phase photoresist material by the method of spin coating.

[0094] Specifically, on the formed Mini LED display module, every three adjacent blue light chips 21 correspond to one pixel.

[0095] Specifically, the bonding glue 11 is preferably a polyimide-based conductive glue. In the present invention, the polyimide-based conductive glue is used to replace the traditional solder paste, which can improve the bonding stability between the blue light chip 21 and the substrate 1, avoid the problems of chip drift and voids in the solder paste, and thus improve the reliability of the Mini LED display module.

[0096] Refer to Figure 1 As shown, further, the control circuit 6 includes active and passive components such as a driving IC and a resistor to control the operation of the blue light chip 21. The control circuit 6 belongs to the prior art and can be purchased on the market. Among them, the active component represents a component that obtains or depends on the current direction. The passive component represents a component that does not require an energy source to perform its specific function.

[0097] Further, the chip layer 2 further includes a chip glue 22, and the chip glue 22 coats the blue light chip 21.

[0098] The chip glue 22 is a mixture of an epoxy resin structural glue, an acrylate structural glue, and carbon. Among them, carbon is used to make the chip glue 22 black, so that each blue light chip 21 is in a black environment, avoiding optical crosstalk of the near-ultraviolet light emitted by adjacent blue light chips 21. The epoxy resin structural glue and the acrylate structural glue are used to stably fix the blue light chip 21 on the substrate 1.

[0099] In the initial state, the blue film 4 is located above the substrate 1. The blue film 4 is used to carry a plurality of blue light chips 21 arranged at intervals, and the blue light chips 21 correspond to the bonding adhesives 11 on the substrate 1 one by one.

[0100] Referring to Figures 3 - 6 As shown, specifically, the process of transferring the blue light chip 21 from the blue film 4 to the substrate 1 in the present invention is as follows:

[0101] S21: The suction nozzle 5 moves above the blue film 4 and corresponds to the position of the blue light chip 21.

[0102] S22: The suction nozzle 5 moves downward to fit with the blue light chip 21.

[0103] S23: The suction nozzle 5 continues to move downward and drives the blue light chip 21 to move downward to fit with the bonding adhesive 11 on the substrate 1. At this time, the blue film 4 undergoes elastic deformation.

[0104] S24: The suction nozzle 5 resets, the blue film 4 rebounds, and the blue light chip 21 is transferred to the substrate 1 and fixed on the substrate 1 through the bonding adhesive 11.

[0105] Referring to Figures 8 - 14 As shown, the traditional process of transferring the blue light chip 21 from the blue film 4 to the substrate 1 is as follows:

[0106] S31: The suction nozzle 5 moves above the blue film 4 and corresponds to the position of the blue light chip 21.

[0107] S32: The ejector pin located below the blue film 4 pushes up the blue film 4. At this time, the blue film 4 undergoes elastic deformation.

[0108] S33: Negative pressure is applied to the suction nozzle 5 to contact the chip.

[0109] S34: The suction nozzle 5 adsorbs the chip.

[0110] S35: The ejector pin resets, and the blue film 4 rebounds.

[0111] S36: The suction nozzle 5 adsorbing the chip moves above the position of the bonding adhesive 11 on the substrate 1.

[0112] S37: The suction nozzle 5 moves downward and drives the blue light chip 21 to move downward to fit with the bonding adhesive 11 on the substrate 1.

[0113] S38: The suction nozzle 5 leaves and resets, and the blue light chip 21 is transferred to the substrate 1 and fixed on the substrate 1 through the bonding adhesive 11.

[0114] In summary, the traditional chip transfer process requires 8 process steps to complete one chip transfer. The complex and cumbersome process results in low production efficiency. However, through process optimization, the present invention reduces the steps of the chip transfer process to 4, simplifies the operation process to improve production efficiency, and thus realizes high-speed chip transfer.

[0115] Referring to Figure 1 and 2 As shown, further, the side surface of the quantum dot powder block 31 close to the blue light chip 21 has the same size as the corresponding surface of the blue light chip 21, so that the blue light chip 21 can uniformly excite each quantum dot powder in the quantum dot powder block 31, thereby improving the display effect of the Mini LED display module.

[0116] Specifically, the red quantum dot powder block 311 in the quantum dot powder layer is a uniform mixture of red quantum dot powder, nano-silicon, silicon oxide, carbon and glue. The green quantum dot powder block 312 is a uniform mixture of green quantum dot powder, nano-silicon, silicon oxide, carbon and glue. The blue quantum dot powder block 313 is a uniform mixture of blue quantum dot powder, nano-silicon, silicon oxide, carbon and glue. Among them, nano-silicon and silicon oxide are used to absorb moisture and oxygen in the air to prevent the quantum dot powder from undergoing chemical or physical reactions with water and oxygen, resulting in failure. Carbon is used to conduct heat to improve the heat resistance of the quantum dot powder.

[0117] The particle size of the quantum dot powder is preferably 2 - 8 nm. During use, quantum dot powder with approximately the same size needs to be used to improve the size uniformity of the quantum dot powder, thereby improving the display effect of the Mini LED display module.

[0118] Further, the quantum dot film 3 further includes glue blocks 32. The glue blocks 32 are located at the gaps between adjacent quantum dot powder blocks 31 in each group of quantum dot powder block units and at the gaps between adjacent quantum dot powder block units.

[0119] Specifically, the glue blocks 32 are black, that is, each quantum dot powder block 31 is in a black environment. This black environment can improve the contrast of the light beams emitted by the quantum dot powder in adjacent quantum dot powder blocks 31, thereby improving the display effect of the Mini LED display module. More specifically, the glue blocks 32 are a mixture of carbon and glue.

[0120] Further, the quantum dot film 3 further includes optical films 33. Two layers of optical films 33 are symmetrically arranged on the upper and lower sides of the quantum dot powder layer respectively. The optical films 33 are used to fix the quantum dot powder layer and transmit the light beams generated after the red quantum dot powder, green quantum dot powder and blue quantum dot powder are excited to the outside.

[0121] Specifically, the optical film 33 is preferably a PET transparent film. Among them, PET represents polyethylene terephthalate.

[0122] Preferably, a polymer material can also be evenly coated on the quantum dot powder layer. The polymer material is used to improve the bonding stability between the quantum dot powder block 31 and the optical film 33, and can isolate moisture and oxygen in the air.

[0123] The polymer material is preferably PMMA, EVOH, PET, PS, PVP, LDPE or PVDC. Among them, PMMA represents polymethyl methacrylate, EVOH represents ethylene-vinyl alcohol copolymer, PS represents polystyrene, PVP represents polyvinylpyrrolidone, LDPE represents low-density polyethylene, and PVDC represents polyvinylidene fluoride.

[0124] Refer to Figure 15 As shown, further, the preparation method of the quantum dot film 3 is as follows:

[0125] S41: Clean the optical film 33, and then prepare red quantum dot powder glue, green quantum dot powder glue and blue quantum dot powder glue respectively. The quantum dot powder glue is a uniform mixture of quantum dot powder, nano silicon, silicon oxide, carbon and glue.

[0126] S42: Coat the red quantum dot powder glue, green quantum dot powder glue and blue quantum dot powder glue on the optical film 33 at uniform intervals in this order, and ensure that the coating height of each quantum dot powder glue is the same. After each quantum dot powder glue is cured, it forms a quantum dot powder block 31 with the same height.

[0127] S43: Repeat step S2 multiple times to uniformly arrange multiple groups of quantum dot powder block units formed in the arrangement order of one red quantum dot powder block 311, one green quantum dot powder block 312 and one blue quantum dot powder block 313 at uniform intervals;

[0128] S44: Fix another optical film 33 on the side of the quantum dot powder layer away from the optical film 33.

[0129] Since the uniformity of the distribution of the quantum dot powder in the quantum dot powder block 31 and the thickness uniformity of each quantum dot powder block 31 are important factors affecting the display effect of the Mini LED display module, therefore, the present invention adopts an ultrasonic stirring device, and by the method of stirring while coating, the quantum dot powder is evenly distributed in the quantum dot powder glue, and a roll-to-roll coating process is adopted during coating to control the height of the quantum dot powder glue to be the same each time, thereby improving the display effect of the Mini LED display module.

[0130] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those of ordinary skill in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A method for preparing a Mini LED display module, characterized in that; the Mini LED display module includes a control circuit (6), a substrate (1), a chip layer (2) and a quantum dot film (3), and the control circuit (6), the substrate (1), the chip layer (2) and the quantum dot film (3) are arranged in sequence from bottom to top: the quantum dot film (3) includes a quantum dot powder layer, and the quantum dot powder layer includes multiple groups of quantum dot powder block units arranged at uniform intervals; each group of the quantum dot powder block units includes a red quantum dot powder block (311), a green quantum dot powder block (312) and a blue quantum dot powder block (313); the red quantum dot powder block (311), the green quantum dot powder block (312) and the blue quantum dot powder block (313) are arranged at uniform intervals in the arrangement order to form the quantum dot powder block units; the chip layer (2) includes multiple groups of blue light chip units arranged at uniform intervals; each group of the blue light chip units includes three blue light chips (21) arranged at uniform intervals, and the blue light chips (21) are arranged at intervals; the red quantum dot powder block (311), the green quantum dot powder block (312) and the blue quantum dot powder block (313) in the quantum dot powder block units respectively correspond to one of the blue light chips (21) in the blue light chip units; adhesive (11) is provided at the position of the substrate (1) corresponding to each blue light chip (21) to fix the blue light chip (21) on the substrate (1); the control circuit (6) is used to control the blue light chips (21) to work; the preparation method includes the following steps: S11: First, clean the substrate (1), then transfer several blue light chips (21) to the adhesive (11) at the corresponding positions on the substrate (1), and then weld the blue light chips (21) to the substrate (1) and bake the adhesive (11); S12: Prepare chip glue (22), and then remove the air in the chip glue (22); S13: Coat the blue light chips (21) with the chip glue (22), and then bake the chip glue (22) to cure the chip glue (22); S14: Grind the chip glue (22) until the height of the chip glue (22) is 1-2 times the height of the blue light chips (21); S15: Perform spin coating on the side surface of the chip glue (22) away from the substrate (1); S16: Place the quantum dot film (3) on the side surface of the chip layer (2) away from the substrate (1) so that a red quantum dot powder block (311), a green quantum dot powder block (312) and a blue quantum dot powder block (313) respectively correspond to one blue light chip (21); S17: The quantum dot film (3) is adhered to the chip layer (2) through an adhesive, and then the adhesive is dried.

2. The manufacturing method of the Mini LED display module according to claim 1, characterized in that, the chip layer (2) further includes a chip glue (22), the chip glue (22) coats the blue light chip (21), and the chip glue (22) is black.

3. The manufacturing method of the Mini LED display module according to claim 2, characterized in that, the height of each of the red quantum dot powder block (311), the green quantum dot powder block (312), and the blue quantum dot powder block (313) is the same.

4. The manufacturing method of the Mini LED display module according to claim 1, characterized in that, the quantum dot powder layer further includes a glue block (32), the glue block (32) is black, and the glue block (32) is disposed at the gaps between adjacent quantum dot powder blocks (31) in each group of quantum dot powder block units and at the gaps between adjacent quantum dot powder block units; the quantum dot film (3) further includes two optical films (33), and the two optical films (33) are symmetrically disposed on the upper and lower sides of the quantum dot powder layer respectively.

5. The manufacturing method of the Mini LED display module according to claim 1, characterized in that, the red quantum dot powder block (311) is a uniform mixture of red quantum dot powder, nano silicon, silicon oxide, carbon, and glue; the green quantum dot powder block (312) is a uniform mixture of green quantum dot powder, nano silicon, silicon oxide, carbon, and glue; the blue quantum dot powder block (313) is a uniform mixture of blue quantum dot powder, nano silicon, silicon oxide, carbon, and glue.

6. The manufacturing method of the Mini LED display module according to claim 1, characterized in that, the bonding adhesive (11) is a polyimide-based conductive adhesive.

7. The manufacturing method of the Mini LED display module according to claim 1, characterized in that, in the initial state, the blue film (4) is located above the substrate (1), the blue film (4) carries a plurality of spaced blue light chips (21), and the blue light chips (21) correspond to the bonding adhesives (11) on the substrate (1) one by one; the process of transferring the blue light chips (21) to the substrate (1) is as follows: S21: The suction nozzle (5) moves above the blue film (4) and corresponds to the position of the blue light chip (21); S22: The suction nozzle (5) moves down to fit with the blue light chip (21); S23: The suction nozzle (5) continues to move down and drives the blue light chip (21) to move down to fit with the bonding adhesive (11) on the substrate (1). At this time, the blue film (4) undergoes elastic deformation; S24: The suction nozzle (5) resets, the blue film (4) rebounds, and the blue light chip (21) is transferred to the substrate (1) and fixed on the substrate (1) through the bonding adhesive (11).

8. The manufacturing method of the Mini LED display module according to claim 1, characterized in that, the manufacturing method of the quantum dot film (3) is as follows: S41: Clean the optical film (33), and then prepare red quantum dot powder glue, green quantum dot powder glue, and blue quantum dot powder glue respectively; S42: Coat the red quantum dot powder glue, the green quantum dot glue, and the blue quantum dot glue on the optical film (33) at equal intervals in this order. After curing, the red quantum dot powder glue, the green quantum dot glue, and the blue quantum dot glue are respectively formed into the red quantum dot powder block (311), the green quantum dot powder block (312), and the blue quantum dot powder block (313); S43: Repeat step S2 multiple times so that multiple groups of the quantum dot powder block units formed in the arrangement order of one red quantum dot powder block (311), one green quantum dot powder block (312), and one blue quantum dot powder block (313) are arranged at equal intervals; S44: Fix another optical film (33) on the side of the quantum dot powder layer away from the optical film (33).

9. The method for preparing a Mini LED display module according to claim 8, characterized in that, An ultrasonic stirring device is used, and by the method of stirring while coating, the quantum dot powder is evenly distributed in the quantum dot powder glue; A roll-to-roll coating process is adopted to evenly coat the red quantum dot powder glue, the green quantum dot glue, and the blue quantum dot glue on the optical film (33), and the heights of each red quantum dot powder block (311), green quantum dot powder block (312), and blue quantum dot powder block (313) are controlled to be the same.

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