Apparatus for distributing load and system for treating substrate with the apparatus

By designing a load dispersion device and using non-contact methods such as magnet components and air bearings to disperse the load of the inkjet head module, the problem of distortion and mechanical deformation of the gantry unit due to weight is solved, and a more stable substrate processing system is achieved.

CN113547847AActive Publication Date: 2021-10-26SYSTEM ENGINEERING MEGA SOLUTION CO LTD
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Patent Information

Application Number
CN202110434664.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2020-04-23
Filing Date
2021-04-22
Publication Date
2021-10-26
Estimated Expiration
2041-04-22

AI Technical Summary

Technical Problem

In the case where multiple inkjet head modules are disposed on the gantry unit, the gantry unit may be twisted and mechanically deformed due to the weight of the inkjet head modules, especially the yaw phenomenon due to increased thermal deformation.

Method used

A load dispersion device is designed. By using a combination of a second support member and a first support member, a non-contact method such as a magnet member and an air bearing is used to support the inkjet head module, distribute its load, and adjust the load distribution through a height control member. , to reduce the impact of supporting weight and temperature changes on the drive shaft.

Benefits of technology

It effectively reduces the impact of the load of the inkjet head module on the drive shaft, reduces mechanical deformation and deflection, and improves the stability and operational reliability of the equipment.

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Abstract

Provided are a load distribution apparatus capable of efficiently distributing loads for a plurality of inkjet head modules and a substrate treatment system including the same. The load distribution apparatus includes a second support formed to be elongated in one direction and having both side portions higher than a central portion and in which a head module for discharging droplets onto a substrate is installed in the central portion, a first support supporting the second support on at least one side and supporting the second support below the second support, a first support unit supporting the second support on at least one side and supporting the second support above the second support, and a plate installed above the first support unit and connected to the first support unit, wherein a load of the head module is distributed by the first support and the first support unit.
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