An LED light source with adjustable color temperature and color rendering index and its packaging method
By using a variety of LED chips and phosphor glue layers in the LED light source, and combining multiple control to adjust the current ratio, the problems of small color gamut and low color rendering index in the existing technology are solved, and the color temperature is adjustable and the light color uniformity is achieved, which significantly improves the index and LER.
Patent Information
- Application Number
- CN202110525041.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-05-13
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2041-05-13
AI Technical Summary
The existing adjustable color temperature LED light sources have problems such as small color gamut, low color rendering index, low efficiency and poor color uniformity. It is difficult for the prior art to achieve the improvement of index and LER in the standard deviation of maintaining the color coordinates on the Planck trajectory.
By using the first blue light LED chip, the second blue light LED chip, the green LED chip and the red LED chip in the LED light source, the first phosphor powder glue layer and the second phosphor powder glue layer are respectively excited, and the current ratio is adjusted in combination with multiple controls, the color temperature adjustment and light color uniformity are achieved.
The color temperature is adjustable within a certain range, the color coordinates are maintained within the standard deviation of the Planck trajectory, the index index and LER have been improved, and the light and color are evenly distributed, which significantly improves the visual performance of the product.
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Figure CN113658942B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of LED light sources, and particularly relates to an LED light source with adjustable color temperature and color rendering index and a packaging method thereof. Background Art
[0002] LED light sources have the advantages of being green, having a long lifespan, being energy-saving, having high reliability, good luminous efficiency, and small size, and are widely used. With the increasing requirements for healthy lighting, LED light sources with a single color temperature and a single color rendering index can no longer meet people's needs.
[0003] In the prior art, there are also products with adjustable color temperature. Most of these adjustable color temperature products are based on RGB three primary colors, which have problems such as a small color gamut and a low color rendering index. Or by increasing the number of monochromatic lights of colored LEDs, the color gamut can be expanded and the color rendering index can be improved, but the efficiency is low and the light color uniformity is poor.
[0004] In addition, there is also a method of using a group of high-color temperature light sources and a group of low-color temperature light sources. Users can select the color temperature according to their needs. If an intermediate color temperature is required, the high-color temperature light sources and the low-color temperature light sources work together, and different color temperature effects can be achieved according to the different proportions of the two color temperatures. However, the intermediate color will fall on the straight line formed by connecting the two color temperature light sources, and the coordinates on this straight line are not above or below the Planckian locus. Moreover, the color rendering index of this adjustable color temperature technical method has not been changed and is still relatively single. Summary of the Invention
[0005] In order to overcome the deficiencies of the prior art, the purpose of the present invention is to provide an LED light source with adjustable color temperature and color rendering index, so that the color temperature can be changed within a certain range, and the color coordinates are kept within the standard deviation of the Planckian locus, realizing an adjustable color temperature high color rendering index white LED with an improved color rendering index, LER, and uniform light color distribution.
[0006] The present invention provides an LED light source with adjustable color temperature and color rendering index, which includes a substrate, a first blue LED chip, a first phosphor glue layer, a second blue LED chip, a second phosphor glue layer, a green LED chip, a red LED chip, a control circuit, and a dam. The first blue LED chip, the second blue LED chip, the green LED chip, and the red LED chip are fixed on the substrate. The first blue LED chip, the second blue LED chip, the green LED chip, and the red LED chip are connected to the control circuit. The dam forms a closed ring to surround the first blue LED chip, the second blue LED chip, the green LED chip, and the red LED chip. The first phosphor glue layer and the second phosphor glue layer are filled in the dam. The second phosphor glue layer and the first phosphor glue layer cover the first blue LED chip in the order from outside to inside. The second phosphor glue layer covers the second blue LED chip. The second phosphor glue layer covers the green LED chip. The second phosphor glue layer covers the red LED chip.
[0007] Further, the dominant wavelengths of both the first blue LED chip and the second blue LED chip are 420nm - 490nm; the dominant wavelength of the green LED chip is 495nm - 540nm; the dominant wavelength of the red LED chip is 615nm - 660nm.
[0008] Further, the first blue LED chip, the second blue LED chip, the green LED chip, and the red LED chip are evenly and cross - distributed within the light - emitting area.
[0009] Further, the control circuit includes a first blue light control circuit, a second blue light control circuit, a green light control circuit, and a red light control circuit. The first blue light control circuit is connected to the first blue LED chip. The second blue light control circuit is connected to the second blue LED chip. The green light control circuit is connected to the green LED chip. The red light control circuit is connected to the red LED chip.
[0010] Further, both the first phosphor glue and the second phosphor glue are made by mixing multiple phosphors and silica gel. The phosphors include a yellow - green phosphor with a peak wavelength of 515nm - 545nm and a half - wave width of 105nm ± 5nm, a first red phosphor with a peak wavelength of 625nm ± 5nm and a half - wave width of 76nm ± 5nm, and a second red phosphor with a peak wavelength of 647nm ± 5nm and a half - wave width of 91nm ± 5nm.
[0011] Further, the ratio of the total amount of silica gel, yellow-green phosphor, first red phosphor, and second red phosphor in the first phosphor glue is 38.1% ± 0.5%: 57.1% ± 0.5%: 1% ± 0.5%: 3.8% ± 0.5%, where the diluent accounts for 2 to 3 times the total amount of silica gel;
[0012] The ratio of the total amount of silica gel, yellow-green phosphor, first red phosphor, and second red phosphor in the second phosphor glue is 86% ± 0.5%: 12.9% ± 0.5%: 0.2% ± 0.5%: 0.9% ± 0.5%.
[0013] Further, the color temperature obtained by exciting the first phosphor glue with the first blue LED chip is 4090K ± 116K, DUV is -0.018 ± 0.0025, or the target color temperature is 4090K ± 116K, DUV is -0.018 ± 0.0025, and then exciting the second phosphor glue to obtain a color temperature of 2725K ± 63K, DUV is 0 ± 0.0025;
[0014] The color temperature obtained by exciting the second phosphor glue with the second blue LED chip is 3985K ± 116K, DUV is 0.001 ± 0.0025, or the target color temperature is 3465K ± 93K, DUV is 0.0005 ± 0.0025, or the target color temperature is 4503K ± 139K, DUV is 0.0015 ± 0.0025, or the target color temperature is 5029K ± 220K, DUV is 0.002 ± 0.0025, or the target color temperature is 5667K ± 202K, DUV is 0.0025 ± 0.0025, or the target color temperature is 6532K ± 255K, DUV is 0.0031 ± 0.0025;
[0015] The color coordinates obtained by exciting the second phosphor glue with the green LED chip are x: 0.3197 ± 0.0072, x: 0.6136 ± 0.0164.
[0016] Further, the ratio of the first blue LED chip, the second blue LED chip, the green LED chip, and the red LED chip is 1:1:1:1.
[0017] Further, it further includes a transparent silica gel layer, and the transparent silica gel layer is filled in the dam and covers the second phosphor glue layer.
[0018] An LED light source packaging method with adjustable color temperature and color rendering index includes the following steps:
[0019] Coding and bonding: Spray the identification information on the substrate, fix the first blue LED chip, the second blue LED chip, the green LED chip and the red LED chip to the light-emitting surface area of the substrate according to the chip arrangement drawing, and cure according to the curing conditions of the bonding glue;
[0020] Spraying the first phosphor glue, fixing the steel mesh on the substrate, exposing only the chip that needs to be doped with phosphor twice, mixing the phosphor, silica gel and diluent according to the proportion, spraying the prepared first phosphor glue on the chip exposed by the steel mesh, removing the steel mesh after spraying, and curing the first phosphor glue;
[0021] Wire bonding: perform wire bonding according to the wire bonding drawing to make the positive and negative electrodes of the chip and the substrate form a complete circuit;
[0022] Dam: Use dam glue to surround the products with finished die bonding and wire bonding along the outer circle of the luminous surface to form a protection zone. After completion, the dam glue is cured;
[0023] Dot the second phosphor glue, mix the phosphor and silica gel according to the proportion, dot the prepared second phosphor glue into the luminous surface area, and then settle it according to the sedimentation conditions. When the coordinates fall into the user's required area, the second phosphor glue is cured to form a finished product image, or the second phosphor glue is sprayed first, and then transparent silica gel is applied after curing, and then cured;
[0024] Sorting and packaging: the finished products are inspected and packaged in bins.
[0025] Compared with the prior art, the present invention has the following beneficial effects:
[0026] The present invention provides an LED light source with adjustable color temperature rendering index, including a first blue LED chip fixed on a substrate to excite a first phosphor glue layer and then excite a second phosphor glue, a second blue LED chip to excite the second phosphor glue, a green LED chip to excite the second phosphor glue, and a red LED chip to excite the second phosphor glue. The color temperature rendering index that meets the needs of users can be obtained by adjusting the current ratio, thereby effectively controlling the phosphor excitation spectrum, improving the maximum visual efficiency LER of the product, and optimizing the light source rendering index. By adjusting the current ratio through multi-channel control, the color temperature can be changed within a certain range, and the color coordinates are kept within the standard deviation on the Planckian locus, so as to achieve an adjustable color temperature high rendering index white light LED with a certain improvement in rendering index and LER and uniform light color distribution.
[0027] Compared with the light source produced by the conventional process, the light source produced by the production method of the present invention has Figure 1 As shown, the spectrum has a wider half-width, which means that the CRI of the light source is higher, and the spectrum has a higher relative light intensity value at 500-550nm, which means better visual performance LER.
[0028] The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and be able to implement it according to the content of the description, the following will describe in detail with reference to the preferred embodiments of the present invention and the accompanying drawings. The specific implementation manners of the present invention are given in detail by the following embodiments and their accompanying drawings. Brief Description of the Drawings
[0029] The drawings described herein are used to provide a further understanding of the present invention, and constitute a part of this application. The schematic embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation to the present invention. In the drawings:
[0030] Figure 1 is a spectral shape effect diagram of the light source manufactured by the manufacturing method of the present invention and the light source manufactured by the conventional process;
[0031] Figure 2 is the chip layout diagram of the present invention;
[0032] Figure 3 is the spectral comparison effect diagram of the first blue LED chip of the present invention exciting the first phosphor glue and then exciting the second phosphor glue;
[0033] Figure 4 is the spectral comparison effect diagram of the second blue LED chip of the present invention exciting the second phosphor glue;
[0034] Figure 5 is the spectral comparison effect diagram of the green LED chip of the present invention exciting the second phosphor glue;
[0035] Figure 6 is the flowchart of the manufacturing method of an LED light source with adjustable color temperature and color rendering index of the present invention;
[0036] Figure 7 is the schematic diagram of the LED light source sprayed with the first phosphor glue of the present invention;
[0037] Figure 8 is the schematic diagram of an LED light source with adjustable color temperature and color rendering index of the present invention;
[0038] Figure 9 is the schematic diagram of the data comparison before and after exciting the phosphor glue of the present invention;
[0039] Figure 10 is the schematic diagram of the adjustable color temperature and color rendering index data of the present invention.
[0040] In the figure: 1. Substrate; 2. Pad; 3. First blue LED chip; 4. Second blue LED chip; 5. Green LED chip; 6. Red LED chip; 7. Dam; 8. Stencil; 9. First phosphor glue layer; 10. Second phosphor glue layer; 11. Transparent silicone layer. Detailed implementation mode
[0041] Next, in combination with the accompanying drawings and specific implementation modes, the present invention will be further described. It should be noted that, on the premise of no conflict, the following-described embodiments or technical features can be arbitrarily combined to form new embodiments.
[0042] An LED light source with adjustable color temperature and color rendering index, as Figure 2 、 Figure 6 and Figure 7 shown, includes a substrate 1, a first blue LED chip 3, a first phosphor glue layer 9, a second blue LED chip 4, a second phosphor glue layer 10, a green LED chip 5, a red LED chip 6, a control circuit, a transparent silica gel layer 11, and a dam 7. The first blue LED chip 3, the second blue LED chip 4, the green LED chip 5, and the red LED chip 6 are fixed on the substrate 1. A control circuit connecting the first blue LED chip 3, the second blue LED chip 4, the green LED chip 5, and the red LED chip 6 and corresponding pads 2 is also provided on the substrate 1. The first blue LED chip 3, the second blue LED chip 4, the green LED chip 5, and the red LED chip 6 are connected to the control circuit. The dam 7 surrounds the first blue LED chip 3, the second blue LED chip 4, the green LED chip 5, and the red LED chip 6 in a closed loop. The first phosphor glue layer 9, the second phosphor glue layer 10, and the transparent silica gel layer 11 are filled in the dam 7. The second phosphor glue layer 10 and the first phosphor glue layer 9 cover the first blue LED chip 3 in the order from outside to inside. The first blue LED chip 3 excites the first phosphor glue layer 9, and then excites the second phosphor glue layer 10. The first blue LED chip 3 excites the first phosphor glue layer 9 and then excites the second phosphor glue layer 10, making the spectral half-width wider, as Figure 3 or Figure 9 shown. The second phosphor glue layer 10 covers the second blue LED chip 4. The second blue LED chip 4 excites the second phosphor glue layer 10. The second phosphor glue layer 10 covers the green LED chip 5. The green LED chip 5 excites the second phosphor glue layer 10. The second phosphor glue layer covers the red LED chip 6. The red LED chip 6 excites the second phosphor glue layer 10. The transparent silica gel layer 11 covers the second phosphor glue layer 10. The user's requirements can be met by adjusting the current ratio to obtain the corresponding color temperature and color rendering index, thereby effectively controlling the excitation spectrum of the phosphor, improving the maximum visual efficacy LER of the product, and optimizing the color rendering index of the light source.
[0043] The peak wavelengths of both the first blue LED chip 3 and the second blue LED chip 4 are 420 nm - 490 nm. For example, a blue LED chip with a peak wavelength of 450 nm - 460 nm can be selected; the peak wavelength of the green LED chip 5 is 495 nm - 540 nm. For example, a green LED chip 5 with a peak wavelength of 520 nm - 530 nm can be selected; the peak wavelength of the red LED chip 6 is 615 nm - 660 nm. For example, a red LED chip 6 with a peak wavelength of 620 nm - 630 nm can be selected. The structures of the first blue LED chip 3, the second blue LED chip 4, the green LED chip 5, and the red LED chip 6 are not limited to horizontal structure, vertical structure, and flip-chip structure. The ratio of the first blue LED chip 3, the second blue LED chip 4, the green LED chip 5, and the red LED chip 6 is 1:1:1:1. By adjusting the current ratio, data on the Planck locus can be obtained, such as Figure 10 shown.
[0044] The first blue LED chip 3, the second blue LED chip 4, the green LED chip 5, and the red LED chip 6 are evenly and cross-distributed within the light-emitting area, facilitating the adjustment of current or power to obtain the required color temperature and color rendering index.
[0045] The control circuit includes a first blue control circuit, a second blue control circuit, a green control circuit, and a red control circuit. The first blue control circuit is connected to the first blue LED chip 3, the second blue control circuit is connected to the second blue LED chip 4, the green control circuit is connected to the green LED chip 5, and the red control circuit is connected to the red LED chip 6. The four circuits are independently controlled respectively.
[0046] Both the first phosphor glue and the second phosphor glue are made by mixing various phosphors and silica gel; the phosphors include yellow-green phosphors with a peak wavelength of 515 nm - 545 nm and a half-wave width of 105 nm ± 5 nm, first red phosphors with a peak wavelength of 625 nm ± 5 nm and a half-wave width of 76 nm ± 5 nm, and second red phosphors with a peak wavelength of 647 nm ± 5 nm and a half-wave width of 91 nm ± 5 nm.
[0047] The ratio of the total amount of silica gel, yellow-green phosphors, first red phosphors, and second red phosphors in the first phosphor glue is 38.1% ± 0.5%: 57.1% ± 0.5%: 1% ± 0.5%: 3.8% ± 0.5%, where the diluent accounts for 2 to 3 times the total amount of silica gel; the ratio of the total amount of silica gel, yellow-green phosphors, first red phosphors, and second red phosphors in the second phosphor glue is 86% ± 0.5%: 12.9% ± 0.5%: 0.2% ± 0.5%: 0.9% ± 0.5%.
[0048] According to the requirements of color temperature / DUV / Ra, the phosphors are mixed in a certain proportion. The color temperature obtained by exciting the first phosphor glue with the first blue LED chip 3 is 4090K ± 116K, the DUV is -0.018 ± 0.0025, or the target color temperature is 4090K ± 116K, the DUV is -0.018 ± 0.0025, and then the color temperature obtained by exciting the second phosphor glue is 2725K ± 63K, the DUV is 0 ± 0.0025.
[0049] As Figure 4 or Figure 9 shown, the color temperature obtained by exciting the second phosphor glue with the second blue LED chip 4 is 3985K ± 116K, the DUV is 0.001 ± 0.0025, or the target color temperature is 3465K ± 93K, the DUV is 0.0005 ± 0.0025, or the target color temperature is 4503K ± 139K, the DUV is 0.0015 ± 0.0025, or the target color temperature is 5029K ± 220K, the DUV is 0.002 ± 0.0025, or the target color temperature is 5667K ± 202K, the DUV is 0.0025 ± 0.0025, or the target color temperature is 6532K ± 255K, the DUV is 0.0031 ± 0.0025.
[0050] As Figure 5 or Figure 9 shown, the color coordinates obtained by exciting the second phosphor glue with the green LED chip 5 are x: 0.3197 ± 0.0072, x: 0.6136 ± 0.0164.
[0051] In the above specific embodiments, an LED light source with adjustable color temperature and color rendering index is provided. Correspondingly, the present application also provides a method for manufacturing an LED light source with adjustable color temperature and color rendering index. Since the method embodiments are basically similar to the device embodiments, the description is relatively simple. For related parts, refer to the partial description of the device embodiments. The method embodiments described below are only illustrative.
[0052] A method for packaging an LED light source with adjustable color temperature and color rendering index, as Figure 8 shown, includes the following steps:
[0053] Jet coding and die bonding. Spray the identification information on the substrate 1, and fix the first blue LED chip 3, the second blue LED chip 4, the green LED chip 5, and the red LED chip 6 to the light-emitting surface area of the substrate 1 according to the chip layout drawing, and cure according to the curing conditions of the die bonding glue;
[0054] The first phosphor glue is sprayed, and the steel mesh 8 is fixed on the substrate 1, and only the chip that needs to be dotted with phosphor powder twice is exposed. The phosphor powder, silica gel and diluent are mixed according to the proportion, and the prepared first phosphor glue is sprayed on the chip exposed by the steel mesh 8. After the spraying is completed, the steel mesh 8 is removed and the first phosphor glue is cured. Figure 6 It should be noted that this step is not required for CSP.
[0055] Wire bonding: Wire bonding is performed according to the wire bonding drawing so that the positive and negative electrodes of the chip form a complete circuit with the substrate 1. It should be noted that flip chip does not require a wire bonding step.
[0056] Dam 7: Use dam 7 glue to surround the products that have completed die bonding and wire bonding along the outer circle of the light-emitting surface to form a protection zone. After completion, the dam 7 glue is cured;
[0057] The second phosphor glue is dotted. The phosphor and silica gel are mixed in proportion. The prepared second phosphor glue is dotted into the luminous surface area, and then settled according to the settlement conditions. When the coordinates fall into the user's required area, the second phosphor glue is cured to form a finished product. Figure 7 Or spray the second fluorescent glue first, and then apply transparent silicone glue after curing, and then cure.
[0058] Sorting and packaging: the finished products are inspected and packaged in bins.
[0059] The LED light source manufactured in combination with the manufacturing method technology of the present invention can realize any one-way or multi-way control to provide a variety of power options, can adapt to various occasions that require color changes, realize different light colors that can be adjusted, and make the adjusted color coordinates fall on the Planck locus, and make the original color rendering index 90 increase by ≥95, and the LER increase by about 2.5%; and the monochromatic light point array is evenly distributed in the light-emitting area, and no light spot phenomenon will occur, meeting people's needs for light adjustment in different environments.
[0060] The above are only preferred embodiments of the present invention and are not intended to limit the present invention in any form. Any ordinary technician in the industry can smoothly implement the present invention as shown in the drawings and above. However, any equivalent changes, modifications and evolutions made by technicians familiar with the profession without departing from the scope of the technical solution of the present invention using the technical content disclosed above are all equivalent embodiments of the present invention. At the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of the present invention are still within the protection scope of the technical solution of the present invention.
Claims
1. An LED light source with adjustable color temperature and color rendering index, characterized in that: it includes a substrate, a first blue LED chip, a first phosphor glue layer, a second blue LED chip, a second phosphor glue layer, a green LED chip, a red LED chip, a control circuit, and a dam. The first blue LED chip, the second blue LED chip, the green LED chip, and the red LED chip are fixed on the substrate. The first blue LED chip, the second blue LED chip, the green LED chip, and the red LED chip are connected to the control circuit. The dam forms a closed loop surrounding the first blue LED chip, the second blue LED chip, the green LED chip, and the red LED chip. The first phosphor glue layer and the second phosphor glue layer are filled in the dam. The second phosphor glue layer and the first phosphor glue layer cover the first blue LED chip in the order from outside to inside. The second phosphor glue layer covers the second blue LED chip. The second phosphor glue layer covers the green LED chip. The second phosphor glue layer covers the red LED chip. The first blue LED chip excites the first phosphor glue layer and then excites the second phosphor glue layer, making the spectral half-width wider. By adjusting the current ratio through multi-channel control, the color temperature can be changed within a certain range, and the color coordinates are kept within the standard deviation on the Planckian locus.
2. The LED light source with adjustable color temperature and color rendering index according to claim 1, characterized in that: the main wavelengths of the first blue LED chip and the second blue LED chip are both 420nm - 490nm; the main wavelength of the green LED chip is 495nm - 540nm; the main wavelength of the red LED chip is 615nm - 660nm.
3. The LED light source with adjustable color temperature and color rendering index according to claim 1, characterized in that: the first blue LED chip, the second blue LED chip, the green LED chip, and the red LED chip are evenly and cross - distributed in the light - emitting area.
4. The LED light source with adjustable color temperature and color rendering index according to claim 1, characterized in that: the control circuit includes a first blue light control circuit, a second blue light control circuit, a green light control circuit, and a red light control circuit. The first blue light control circuit is connected to the first blue LED chip. The second blue light control circuit is connected to the second blue LED chip. The green light control circuit is connected to the green LED chip. The red light control circuit is connected to the red LED chip.
5. The LED light source with adjustable color temperature and color rendering index according to claim 1, characterized in that: Both the first phosphor glue and the second phosphor glue are made by mixing a variety of phosphors and silica gel; the phosphors include yellow-green phosphors with a peak wavelength of 515nm - 545nm and a half-width of 105nm ± 5nm, first red phosphors with a peak wavelength of 625nm ± 5nm and a half-width of 76nm ± 5nm, and second red phosphors with a peak wavelength of 647nm ± 5nm and a half-width of 91nm ± 5nm.
6. An adjustable color temperature and color rendering index LED light source according to claim 1, characterized in that: The ratio of the total amount of silica gel, yellow-green phosphors, first red phosphors, and second red phosphors in the second phosphor glue is 86% ± 0.5%: 12.9% ± 0.5%: 0.2% ± 0.5%: 0.9% ± 0.5%.
7. An adjustable color temperature and color rendering index LED light source according to claim 1, characterized in that: The color temperature obtained by the first blue LED chip exciting the first phosphor glue is 4090K ± 116K, DUV is -0.018 ± 0.0025, or the target color temperature is 4090K ± 116K, DUV is -0.018 ± 0.0025, and then the color temperature obtained by exciting the second phosphor glue is 2725K ± 63K, DUV is 0 ± 0.0025; The color temperature obtained by the second blue LED chip exciting the second phosphor glue is 3985K ± 116K, DUV is 0.001 ± 0.0025, or the target color temperature is 3465K ± 93K, DUV is 0.0005 ± 0.0025, or the target color temperature is 4503K ± 139K, DUV is 0.0015 ± 0.0025, or the target color temperature is 5029K ± 220K, DUV is 0.002 ± 0.0025, or the target color temperature is 5667K ± 202K, DUV is 0.0025 ± 0.0025, or the target color temperature is 6532K ± 255K, DUV is 0.0031 ± 0.0025; The color coordinates obtained by the green LED chip exciting the second phosphor glue are x: 0.3197 ± 0.0072, y: 0.6136 ± 0.0164.
8. An adjustable color temperature and color rendering index LED light source according to claim 1, characterized in that: The ratio of the first blue LED chip, the second blue LED chip, the green LED chip, and the red LED chip is 1:1:1:
1.
9. An adjustable color temperature and color rendering index LED light source according to claim 1, characterized in that: It further includes a transparent silica gel layer, and the transparent silica gel layer is filled in the dam and covers the second phosphor glue layer.
10. A method for packaging an adjustable color temperature and color rendering index LED light source, characterized in that, comprising the following steps: Coding and bonding: Spray the identification information on the substrate, fix the first blue LED chip, the second blue LED chip, the green LED chip and the red LED chip to the light-emitting surface area of the substrate according to the chip arrangement drawing, and cure according to the curing conditions of the bonding glue; Spraying the first phosphor glue, fixing the steel mesh on the substrate, exposing only the first blue LED chip that needs to be doped with phosphor twice, mixing the phosphor, silica gel and diluent according to a certain ratio, spraying the prepared first phosphor glue on the chip exposed by the steel mesh, removing the steel mesh after spraying, and curing the first phosphor glue; Wire bonding: perform wire bonding according to the wire bonding drawing to make the positive and negative electrodes of the chip and the substrate form a complete circuit; Dam: Use dam glue to surround the products with finished die bonding and wire bonding along the outer circle of the luminous surface to form a protection zone. After completion, the dam glue is cured; Dot the second phosphor glue, mix the phosphor and silica gel according to the proportion, dot the prepared second phosphor glue into the luminous surface area, and then settle it according to the sedimentation conditions. When the coordinates fall into the user's required area, the second phosphor glue is cured to form a finished product image, or the second phosphor glue is sprayed first, and then transparent silica gel is applied after curing, and then cured; The first blue LED chip excites the first phosphor glue layer and then the second phosphor glue layer, so that the half-wave width of the spectrum is wider, and the current ratio is adjusted by multi-channel control so that the color temperature can be changed within a certain range, and the color coordinates are kept within the standard deviation on the Planckian locus; Sorting and packaging: bin inspection and packaging of finished products.
Citation Information
Patent Citations
LED light source with adjustable color temperature and color rendering index
CN215342580U