Apparatus for manufacturing a display device

Abstract

An apparatus configured to manufacture a display device is provided. The apparatus configured to manufacture a display device includes a stage configured to place a process target object on an upper surface thereof, a bending head in contact with the process target object to bend the process target object, a distance measurement sensor installed above the stage to be movable in a horizontal direction, and an air cylinder configured to adjust a vertical position of the bending head.

Description

Technical Field

[0001] The present invention relates to an apparatus configured to manufacture a display device and a method for manufacturing a display device. Background Technology

[0002] With the development of multimedia technology, the importance of display devices has steadily increased. Therefore, various types of display devices are now in use, such as organic light-emitting diodes (OLEDs) and liquid crystal displays (LCDs).

[0003] Recently, mobile electronic devices have been widely used. Mobile electronic devices can include compact electronic devices such as mobile phones and desktop personal computers (PCs).

[0004] Such mobile electronic devices are equipped with display devices for providing users with visual information such as images and videos to support various functions. Recently, with the miniaturization of other components used to drive the display devices, the display devices are becoming one of the largest components constituting electronic devices, and are evolving from a flat state to bend at an angle.

[0005] The information disclosed in this background section is only for understanding the background technology of the inventive concept, and therefore may contain information that does not constitute prior art. Summary of the Invention

[0006] It will be understood that both the foregoing general description and the following detailed description are exemplary and illustrative, and are intended to provide further explanation of the invention as claimed.

[0007] One aspect of the present invention is to provide an apparatus for manufacturing a display device, which is capable of stably and precisely bending a process target object.

[0008] Another aspect of the present invention is to provide a method for manufacturing a display device, which is capable of stably and precisely bending a process target object.

[0009] Additional features of the inventive concept will be set forth in the following description and will be apparent in part from the description, or may be learned by practice of the inventive concept.

[0010] An embodiment of an apparatus for manufacturing a display device includes: a bench configured to place a process target object on its upper surface; a bending head that contacts the process target object to bend it; a distance measuring sensor mounted above the bench to be movable in the horizontal direction; and a cylinder configured to adjust the vertical position of the bending head.

[0011] An embodiment of a method for manufacturing a display device includes: adjusting the positions of a bench and a bending head; placing a process target object on the bench; and bending the process target object while the bending head contacts it, wherein the adjustment includes using a distance measuring sensor for each partition to measure a first distance between the distance measuring sensor and the upper surface of the bending head and a second distance between the distance measuring sensor and the upper surface of the bench; calculating the slope of the bending head based on the first distance and the slope of the bench based on the second distance; adjusting the slope of the bending head when the slope of the bending head exceeds a tolerance range, and adjusting the slope of the bench when the slope of the bench exceeds a tolerance range; measuring a third distance using a distance measuring sensor, the third distance being the height difference between the upper surface of the bending head and the upper surface of the bench; and adjusting the position of the bending head when the third distance exceeds a tolerance range.

[0012] The display device manufacturing apparatus according to the embodiment can improve the reliability and display quality of the display device manufactured from the process target object by stably and accurately bending the process target object.

[0013] The display device manufacturing method according to the embodiments can improve the reliability and display quality of the display device manufactured from the process target object by stably and accurately bending the process target object.

[0014] The effects of this invention are not limited to those described above, and various other effects are included in this specification. Attached Figure Description

[0015] The above and other aspects and features of the present invention will become more apparent from the detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings, in which:

[0016] Figure 1 This is a plan view illustrating a display device according to an exemplary embodiment;

[0017] Figure 2 This is a schematic partial cross-sectional view illustrating a display device according to an exemplary embodiment;

[0018] Figure 3 This is a perspective view showing a display device manufacturing apparatus according to an exemplary embodiment;

[0019] Figure 4 This is a schematic diagram illustrating a bending process using a display device manufacturing apparatus according to an exemplary embodiment;

[0020] Figure 5 This is a schematic diagram illustrating the operation of the upper sensor according to an exemplary embodiment;

[0021] Figure 6This is a schematic diagram illustrating the operation of a side sensor according to an exemplary embodiment;

[0022] Figure 7 This is a schematic diagram illustrating a bending unit according to an exemplary embodiment;

[0023] Figure 8 This is a flowchart illustrating a method for inspecting and correcting the position of a test bench and bending unit according to an exemplary embodiment; and

[0024] Figure 9 , Figure 10 , Figure 11 and Figure 12 This is a schematic diagram illustrating an inspection and correction method for a bench and bending unit according to an exemplary embodiment. Detailed Implementation

[0025] The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the invention and, together with the description, serve to illustrate the inventive concept.

[0026] In the following description, numerous specific details are set forth for illustrative purposes to provide a thorough understanding of various exemplary embodiments or embodiments of the invention. As used herein, “implementation” and “example” are interchangeable terms and are non-limiting examples of apparatus or methods employing one or more of the inventive concepts disclosed herein. However, it will be apparent, however, that various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and apparatuses are shown in block diagram form to avoid unnecessarily obscuring the various exemplary embodiments. Furthermore, the various exemplary embodiments may be different, but not necessarily exclusive. For example, a particular shape, configuration, and characteristic of an exemplary embodiment may be used or implemented in another exemplary embodiment without departing from the inventive concept.

[0027] Unless otherwise stated, the exemplary embodiments shown should be understood as providing exemplary features of different details of some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise stated, features, components, modules, layers, films, panels, regions and / or aspects (hereinafter individually or collectively referred to as “elements”) of various embodiments may be combined, separated, interchanged and / or rearranged without departing from the inventive concept.

[0028] The use of crosshairs and / or shading in the accompanying drawings is generally for the purpose of clarifying the boundaries between adjacent elements. Therefore, unless otherwise specified, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for a particular material, material properties, size, scale, commonalities between the elements shown, and / or any other characteristics, properties, etc., of the elements. Furthermore, in the accompanying drawings, the dimensions and relative dimensions of elements may be exaggerated for clarity and / or descriptive purposes. When exemplary embodiments can be implemented differently, the specific process sequence may be performed differently than the described sequence. For example, two consecutively described processes may be performed substantially simultaneously, or in the reverse order of their description. Furthermore, the same reference numerals denote the same elements.

[0029] The D1, D2, and D3 axes are not limited to the three axes of a Cartesian coordinate system (such as the x, y, and z axes) and can be interpreted in a broader sense. For example, the D1, D2, and D3 axes may be perpendicular to each other or may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0030] Although the terms “first,” “second,” etc., may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the teachings of this disclosure, the first element discussed below may be referred to as the second element.

[0031] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” as used herein are intended to also include the plural forms. Furthermore, when used in this specification, the terms “comprising,” “including,” “comprise,” and / or “including” describe the presence of stated features, integrals, steps, operations, elements, components, and / or groups thereof, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. It should also be noted that, as used herein, the terms “substantially,” “about,” and other similar terms are used as approximations rather than terms of degree, and are therefore used to explain inherent deviations in measurements, calculated values, and / or provided values ​​that would be recognized by one of ordinary skill in the art.

[0032] Various exemplary embodiments are described herein with reference to cross-sectional and / or exploded views as schematic diagrams of idealized exemplary embodiments and / or intermediate structures. Thus, deviations from the illustrated shapes due to, for example, manufacturing techniques and / or tolerances will be expected. Therefore, the exemplary embodiments disclosed herein should not necessarily be construed as limited to the specific shapes of the regions shown, but rather include deviations in shape caused, for example, by manufacturing processes. In this way, the regions shown in the figures may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and are therefore not necessarily intended to be limiting.

[0033] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. Terms, such as those defined in common dictionaries, shall be interpreted as having the meaning consistent with their meaning in the context of the relevant art and shall not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0034] The invention will now be described more fully below with reference to the accompanying drawings, in which preferred embodiments of the invention are illustrated. However, the invention may be embodied in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0035] It will also be understood that when a layer is referred to as being "on" another layer or substrate, it may be located directly on said other layer or substrate, or there may be an intermediate layer. Conversely, when an element is referred to as being "directly" on another element, there is no intermediate element. For this reason, the term "connection" may refer to a physical, electrical, and / or fluid connection with or without an intermediate element.

[0036] For ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” “upper,” etc., may be used herein to describe the relationship between one element or feature and another element (or feature) or feature (or feature) as shown in the figures. It will be understood that, in addition to the orientation depicted in the figures, spatial relative terms are intended to encompass different orientations of the device in use or operation. For example, if the device in the figures is flipped, an element described as “below” or “under” other elements or features will consequently be oriented “above” other elements or features. Thus, the exemplary term “below” can encompass both above and below orientations. The device may have other orientations (rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein should be interpreted accordingly.

[0037] Throughout this specification, the same reference numerals denote the same components.

[0038] In the following description, exemplary embodiments will be described with reference to the accompanying drawings.

[0039] Figure 1 This is a plan view illustrating a display device according to an exemplary embodiment. Figure 2 This is a schematic partial cross-sectional view illustrating a display device according to an exemplary embodiment.

[0040] Reference Figure 1 and Figure 2 A display device (DD) is a device configured to display moving or still images. Display devices (DDs) can be used as display screens for a variety of products, such as televisions, laptops, monitors, billboards, and Internet of Things (IoT) devices, as well as portable electronic devices such as mobile phones, smartphones, tablet PCs, smartwatches, watch phones, mobile communication terminals, e-notebooks, e-readers, portable multimedia players (PMPs), navigation systems, and ultra-mobile PCs (UMPCs). Examples of display devices (DDs) may include organic light-emitting display devices, liquid crystal display devices, plasma display devices, field emission display devices, electrophoretic display devices, electrowetting display devices, quantum dot light-emitting display devices, micro LED display devices, etc. In the following description, organic light-emitting display devices will be used as examples of display devices (DDs), but the inventive concept is not limited thereto.

[0041] The display device DD may include a display panel 10. The display panel 10 may include a flexible substrate, which includes a flexible polymer material such as polyimide. Therefore, the display panel 10 can be bent, folded, or rolled.

[0042] The display panel 10 may include a main region MR and a curved region BD connected to one side of the main region MR. The display panel 10 may also include a sub-region SR connected to the curved region BD and overlapping the main region MR in the thickness direction.

[0043] When a portion of the display screen of the display panel 10 is defined as the display area DA and a portion of the non-display screen of the display panel 10 is defined as the non-display area NDA, the display area DA of the display panel 10 is disposed in the main area MR. The remaining portion other than the display area DA becomes the non-display area NDA of the display panel 10. In one embodiment, the peripheral edge portion of the display area DA in the main area MR, the entire curved area BD, and the entire sub-area SR can be the non-display area NDA. However, the inventive concept is not limited thereto, and the curved area BD and / or the sub-area SR may also include the display area DA.

[0044] The main region MR may have a shape substantially similar to the external shape of the display device DD in a plan view. The main region MR may be a flat area located on a plane. However, the inventive concept is not limited thereto, and at least one of the remaining edges of the main region MR, except for the edge (side) that connects to the curved region BD, may be curved into an arc shape or curved in the vertical direction.

[0045] The display area DA of the display panel 10 can be located at the center of the main area MR. The display area DA can include multiple pixels. The display area DA can have a rectangular shape or a rectangular shape with rounded corners. However, the present invention is not limited to this, and the display area DA can have various shapes such as square, other polygons, circles, ellipses, etc.

[0046] If at least one of the edges of the main region MR, other than the edge connecting to the curved region BD, is arc-shaped or curved, then the display region DA may also be disposed on the corresponding edge. However, the inventive concept is not limited thereto, and the non-display region NDA, which does not display a screen, may be disposed on the arc-shaped or curved edge. Alternatively, both the display region DA and the non-display region NDA may be disposed thereon.

[0047] The non-display area NDA can be positioned within the main area MR around the display area DA. The non-display area NDA of the main area MR can be placed in the area from the outer boundary of the display area DA to the edge of the display panel 10. Signal lines or drive circuits can be provided in the non-display area NDA of the main area MR to apply signals to the display area DA.

[0048] In the curved region BD, the display panel 10 can be bent in the thickness direction with a downward curvature (i.e., the direction opposite to the display surface). The curved region BD can have a constant radius of curvature. However, it is not limited to this; the curved region BD can have different radii of curvature for each segment. When the display panel 10 is bent in the curved region BD, the surface of the display panel 10 is flipped. In other words, an upward-facing surface of the display panel 10 can be changed through the curved region BD to face outward and then downward.

[0049] Sub-region SR extends from the curved region BD. Sub-region SR may extend from the point where the curve is completed in a direction parallel to the main region MR. Sub-region SR may overlap with the main region MR in the thickness direction of the display panel 10. Sub-region SR may overlap with the non-display area NDA at the edge of the main region MR, and further overlap with the display area DA of the main region MR.

[0050] The width of the sub-region SR can be the same as the width of the curved region BD, but is not limited to this.

[0051] A driver chip 30 may be disposed on a sub-region SR of the display panel 10. The driver chip 30 may include an integrated circuit configured to drive the display panel 10. In one embodiment, the integrated circuit may be, but is not limited to, a data driver integrated circuit that generates and provides data signals. The driver chip 30 may be mounted on the display panel 10 in the sub-region SR. When the bending region BD is bent and flipped as described above, the driver chip 30 mounted on a surface of the display panel 10 (the same surface as the display surface) may be mounted on the downward-facing surface of the display panel 10 in the thickness direction, such that the upper surface of the driver chip 30 faces downward.

[0052] The driver chip 30 can be attached to the display panel 10 via an anisotropic conductive film or by ultrasonic welding. The width of the driver chip 30 in the horizontal direction can be smaller than the width of the display panel 10 in the horizontal direction. The driver chip 30 can be disposed in the center of the sub-region SR in the horizontal direction. The left and right edges of the driver chip 30 can be separated from the left and right edges of the sub-region SR, respectively.

[0053] A pad portion (not shown) may be provided at the end of a sub-region SR of the display panel 10, and a printed circuit board 20 may be connected to the pad portion (not shown). The printed circuit board 20 may be a flexible printed circuit board or a film.

[0054] Figure 3 This is a perspective view showing a display device manufacturing apparatus according to an exemplary embodiment.

[0055] Figure 4 This is a schematic diagram illustrating a bending process using a display device manufacturing apparatus according to an exemplary embodiment. Figure 5 This is a schematic diagram illustrating the operation of the upper sensor according to an exemplary embodiment. Figure 6 This is a schematic diagram illustrating the operation of a side sensor according to an exemplary embodiment. Figure 7 This is a schematic diagram illustrating a bending unit according to an exemplary embodiment.

[0056] Reference Figures 3 to 7 The display device manufacturing apparatus according to an exemplary embodiment may include a support fixing device 100, a stand 200, a bending unit 300, a guide member 400, a controller 500, an upper sensor 600, and a side sensor 700.

[0057] The process target object 1 can be placed on the stand 200. The process target object 1 may include a display panel 10, a printed circuit board 20, and a driver chip 30. The stand 200 provides space to place the process target object 1. Specifically, the display panel 10 can be placed on the stand 200. The stand 200 may have, but is not limited to, a rectangular parallelepiped shape, a cylindrical shape, or other polygonal prism shape with a flat upper surface.

[0058] The stand 200 may include a suction member 210 configured to fix a display panel 10 placed on its upper surface. The display panel 10 placed on the stand 200 may be fixed to the upper surface of the stand 200 by means of the suction member 210. For example, the suction member 210 may be connected to a vacuum module (not shown) arranged outside the stand 200 and includes suction holes configured to generate negative pressure. However, the inventive concept is not limited thereto, and the suction member 210 may include an adhesive chuck or an electrostatic chuck. Although described later, a process configured to bend the process target object 1 with the bending unit 300 may be performed with the display panel 10 fixed on the stand 200. The stand 200 may be replaced depending on the type of display panel 10. For example, the stand 200 may be replaced depending on the size, shape, and material of the display panel 10.

[0059] On the bottom portion of the test bench 200, a test bench drive member 220 may be arranged to move the test bench 200. The test bench drive member 220 may have a mechanical structure capable of rotating the test bench 200. The test bench drive member 220 may also include a cylinder capable of moving the test bench 200 in the vertical direction. Due to the nature of calibration or the process, the test bench drive member 220 may move horizontally in a first direction DR1 or a second direction DR2, or rotate about one of an axis extending in the first direction DR1, an axis extending in the second direction DR2, or an axis extending in the third direction DR3. That is, the test bench drive member 220 may be provided with a transfer device configured to move the test bench 200.

[0060] The bench 200 and bench drive member 220 can be clamped together by a plurality of bench clamping members 230. In an exemplary embodiment, the bench drive member 220 may have clamping holes (not shown), each clamping hole having threads on its inner circumference, and the bench 200 may have clamping recesses (not shown), each clamping recess having threads on its inner circumference. The bench clamping members 230 may be, but are not limited to, bolts, each bolt having threads on its outer circumference to engage with the clamping holes of the bench drive member 220 and the clamping recesses of the bench 200. The bench clamping members 230 can clamp the bench 200 and the bench drive member 220 to substantially the same degree of tightness (or clamp with substantially the same tightness force) such that the bench 200 and the bench drive member 220 remain substantially parallel. As described above, the stage 200 can be replaced depending on the type of display panel 10 to which the bending process is applied, and whenever the stage 200 is replaced, multiple stage clamping members 230 can be removed and reinstalled. In this case, if the stage clamping members 230 are reinstalled to a different tightness (or reinstalled with a different tightness force), the parallelism between the stage drive member 220 and the replaced stage 200 may be lost.

[0061] A bench drive member 220 may be connected to a guide member 400 to slide the bench 200. The guide member 400 may be located below the bench drive member 220. In an exemplary embodiment, the guide member 400 may have a shape extending in a first direction DR1. The bench 200 may be connected to the bench drive member 220 to slide along the guide member 400 in the first direction DR1. Furthermore, the bench drive member 220 may include an air flotation device to reduce the sliding friction of the bench 200. In this case, the bench 200 can be moved with less force.

[0062] A support and fixing device 100 may be arranged below the guide member 400. The support and fixing device 100 can support the guide member 400 during the process. The guide member 400 may be mounted on the support and fixing device 100, the bench drive member 220 may be mounted on the guide member 400, and the bench 200 may be connected to the bench drive member 220. The support and fixing device 100 provides space for placing the bench 200.

[0063] The bending unit 300 may be arranged outside the bench 200, for example, on one side in the first direction DR1. Although as will be described later, in Figures 3 to 6 The bending unit 300 is depicted as being separate from the support fixing device 100, but the inventive concept is not limited thereto, and the bending unit 300 may be mounted on the support fixing device 100.

[0064] The bending unit 300 may contact one surface of the printed circuit board 20 on one side. That is, the printed circuit board 20 may contact the bending unit 300 on one side and may be connected to the display panel 10 on the other side. The bending unit 300 is configured to bend the display panel 10. In other words, while the bending unit 300 is connected to the printed circuit board 20, the bending unit 300 moves the printed circuit board 20 to bend the display panel 10. The bending unit 300 may have a rod shape extending in the first direction DR1, but is not limited to that shown.

[0065] The bending unit 300 may include a bending head 310, a vertical moving member 320, and a bending driving member 330. The bending unit 300 may be driven by the vertical moving member 320 and the bending driving member 330.

[0066] The bending head 310 can directly contact and hold the printed circuit board 20 during the bending process. The bending head 310 may include a suction member 311 that directly contacts the printed circuit board 20 and a connecting member 312 that is connected to the bending drive member 330. The suction member 311 may hold the printed circuit board 20 by vacuum suction or by adhesive, but is not limited thereto.

[0067] The vertical moving member 320 can move the bending unit 300 in a direction perpendicular to the upper surface of the bending head 310. The vertical moving member 320 may include a cylinder.

[0068] The bending drive member 330 can rotate and move the bending unit 300 horizontally to perform a bending process. Although not shown, the bending drive member 330 can rotate about an axis extending in a second direction DR2. The bending drive member 330 can also move in a first direction DR1 and a third direction DR3. As described later, a bending head 310 can be connected to the bending drive member 330 to rotate and move along the bending drive member 330. Therefore, the printed circuit board 20 attracted to the bending head 310 can rotate and move as the bending drive member 330 rotates and moves to perform a bending process on the process target object 1.

[0069] The connecting member 312 and the bending drive member 330 can be connected by a plurality of bending clamping members 340. In an exemplary embodiment, the connecting member 312 may have a bending connection hole 312h, each bending connection hole 312h having threads on its inner circumference, and the bending drive member 330 may have a bending connection recess 330h, each bending connection recess 330h having threads on its inner circumference. The bending clamping members 340 may be, but are not limited to, bolts, each bolt having threads on its outer circumference to engage with the bending connection hole 312h of the connecting member 312 and the bending connection recess 330h of the bending drive member 330. The bending clamping members 340 can clamp the connecting member 312 and the bending drive member 330 of the bending head 310 to substantially the same degree of tightness (or clamp with substantially the same tightness force), such that the bending drive member 330 and the connecting member 312 remain substantially parallel. As described above, the bending head 310 can be replaced depending on the type of printed circuit board 20 to which the bending process is applied, which includes the removal and reinstallation of multiple bending fixture components 340. In this case, if the bending fixture components 340 are reinstalled to a different tightness (or reinstalled with a different tightness force), the parallelism between the connecting component 312 and the replaced bending drive component 330 may be lost.

[0070] Although the bending unit 300 is depicted in the figure as being arranged below the bottom portion of the printed circuit board 20, the inventive concept is not limited thereto, and the bending unit 300 may be arranged on the upper portion of the printed circuit board 20.

[0071] Although not shown, the bending unit 300 may also include a bending controller (not shown). The operation of the bending unit 300 may be controlled by the bending controller (not shown). The bending controller (not shown) may include a measuring unit (not shown), a memory unit (not shown), a signal unit (not shown), and an operating unit (not shown).

[0072] A memory unit (not shown) can store a reference path and the movement path of the bending unit 300, which is measured by a measuring unit (not shown). A signal unit (not shown) can generate start and end signals to the measuring unit (not shown). The measuring unit (not shown) can start measuring the movement path of the bending unit 300 when it receives a start signal from the signal unit (not shown) and end the measurement when it receives an end signal. An operation unit (not shown) can compare the movement path of the bending unit 300 measured by the measuring unit (not shown) with the reference path, or compare two or more movement paths of the bending unit 300 measured by the measuring unit (not shown).

[0073] The bending controller (not shown) can control the bending drive member 330 to drive the bending unit 300 based on the result of a comparison performed by the operating unit (not shown). That is, it is possible to correct the movement path of the bending unit 300 based on the result of a comparison performed by the operating unit (not shown).

[0074] A display device manufacturing apparatus according to an exemplary embodiment may include a controller 500. The controller 500 may receive signals from an upper sensor 600 and a side sensor 700, which will be described later, and generate correction signals to a table drive member 220 and a vertical movement member 320. That is, the controller 500 may adjust the position of the vertical movement member 320 relative to the bending head 310 and the position of the table drive member 220 relative to the table 200.

[0075] The upper sensor 600 may be located on one side of the test bench 200 and the bending unit 300 on the third-direction DR3. The upper sensor 600 may be a laser sensor including a light transmission member 610 and a light receiving member 620, the light transmission member 610 being configured to emit a laser beam LB and the light receiving member 620 being configured to receive the laser beam LB. The upper sensor 600 may also be a distance measurement sensor. The upper sensor 600 can measure the time it takes for the laser beam LB transmitted through the light transmission member 610 to reach the light receiving member 620 after being reflected from the distance measurement target object, in order to determine the distance to the object.

[0076] The upper sensor 600 is movable in the first direction DR1 and the second direction DR2. Therefore, the upper sensor 600 can scan the upper surfaces of the stage 200 and the bending unit 300 to measure the distance from the upper sensor 600 to the stage 200 and the distance from the upper sensor 600 to the bending unit 300.

[0077] Although not shown, the upper sensor 600 may also include an upper sensor operation unit (not shown) and an upper sensor display unit (not shown). It is possible to calculate the tilt of the surface of the target object based on distance values ​​measured by scanning each zone using the upper sensor operation unit (not shown). The calculated measurements can be displayed on the upper sensor display unit (not shown).

[0078] In one exemplary embodiment, the tilt degree of the distance measurement target object can be derived from the slope calculated by the upper sensor operation unit (not shown) based on the maximum and minimum values ​​among the distance values ​​measured in the corresponding partitions, and the horizontal distance between the point with the maximum value and the point with the minimum value. In another embodiment, the tilt degree of the distance measurement target object can be derived from the standard deviation calculated by the upper sensor operation unit (not shown) based on the distance value data measured in the corresponding partitions.

[0079] A first height difference h1 can be measured as the height difference between the upper surface of the platform 200 and the upper surface of the bending unit 300 using the upper sensor 600. The first height difference h1 can be measured with the upper surfaces of the platform 200 and the bending unit 300 parallel and aligned. The first height difference h1 can be derived from the distance from the upper sensor 600 to the upper surface of the platform 200 and the distance from the upper sensor 600 to the upper surface of the bending unit 300. Although in an exemplary embodiment the first height difference h1 may be approximately equal to the thickness of the printed circuit board 20, the inventive concept is not limited thereto.

[0080] The upper sensor 600 can measure the distance between the upper sensor 600 and the upper surface of the bending head 310 and the distance between the upper sensor 600 and the upper surface of the platform 200, and send the measurement results to the controller 500. The controller 500 can deduce the distance between the upper surface of the bending head 310 and the upper surface of the platform 200 based on the respective distances, and determine the vertical adjustment amount of the vertical moving member 320 in the vertical direction based on the deduced distance.

[0081] The side sensor 700 may be located on one side of the stage 200 in the second direction DR2. The side sensor 700 may include a camera module (not shown).

[0082] In an exemplary embodiment, the side sensor 700 is movable in a first direction DR1. The side sensor 700 can be adjusted in height, or remain at a corresponding height if no operation is performed. The side sensor 700 can sense the test bench 200 along a reference line VL. The reference line VL can be a virtual line extending in the direction in which the side sensor 700 is oriented. In an exemplary embodiment, the reference line VL of the side sensor 700 can be flush with the upper surface of the test bench 200. When the test bench 200 is replaced, the side sensor 700 can sense changes in the height of the upper surface of the test bench 200. For example, the upper surface of the test bench 200 can be set to be flush with the reference line VL of the side sensor 700. If the upper surface of the test bench 200 is not flush with the reference line VL, the side sensor 700 can generate a signal to the controller 500 to cause the controller 500 to control the test bench drive member 220 such that the upper surface of the test bench 200 is positioned flush with the reference line VL. That is, since the height of the side sensor 700 remains constant even when the test bench 200 is replaced, it is possible to minimize the height variation of the test bench 200 by setting the height of the upper surface of the replaced test bench 200 to be flush with the reference line VL of the side sensor 700.

[0083] The display device manufacturing apparatus according to the exemplary embodiment can identify the degree of tilt of the stage 200 and the bending unit 300. It can measure the height of the stage 200 and, based on the height of the stage 200, measure the height of the bending unit 300 for automatic correction. This allows the process target object 1 to be accurately positioned across the stage 200 and the bending unit 300 and stably bent by the bending unit 300, resulting in improved reliability and display quality of the display device DD manufactured from the process target object 1.

[0084] The following describes a method for manufacturing a display device according to an exemplary embodiment. Specifically, it describes the operation of an apparatus configured to manufacture a display device.

[0085] Figure 8 This is a flowchart illustrating a method for inspecting and correcting the position of the test bench and bending unit according to an exemplary embodiment. Figures 9 to 12 This is a schematic diagram illustrating an inspection and correction method for a bench and bending unit according to an exemplary embodiment.

[0086] A display device manufacturing method according to an exemplary embodiment may include checking and correcting the positions of the bench 200 and the bending head 310, arranging the process target object 1 on the bench 200, and bending the process target object 1 in a state of contact with the bending head 310.

[0087] In the following text, see references Figures 8 to 12 A method for checking and calibrating the position of the test bench 200 and the bending head 310 is described.

[0088] Reference Figure 8 The method for checking and correcting the positions of the test bench 200 and the bending head 310 according to the embodiment may include: at operation S100, measuring the slope of the test bench 200 and the bending head 310 using the upper sensor 600; at operation S200, determining whether the slopes of the test bench 200 and the bending head 310 each exceed a predetermined tolerance range; at operation S210, correcting the slopes of the test bench 200 and the bending head 310; at operation S300, measuring the slope of the test bench 200 using the side sensor 700. At operation S400, determine whether the height of the test bench 200 exceeds the tolerance range; at operation S410, correct the height of the test bench 200; at operation S500, measure the height difference between the test bench 200 and the bending head 310 using the upper sensor 600; at operation S600, determine whether the height difference between the test bench 200 and the bending head 310 exceeds the tolerance range; and at operation S610, correct the height difference between the test bench 200 and the bending head 310.

[0089] If the slope, height, and height difference are determined to exceed the corresponding tolerance range at operation S200, operation S400, and operation S600, respectively, the slope of the calibration bench 200 and the bending head 310 can be corrected at operation S210, the height of the calibration bench 200 can be corrected at operation S410, and the height difference between the calibration bench 200 and the bending head 310 can be corrected at operation S610.

[0090] Reference Figure 8 , Figure 9 and Figure 10 The method for checking and correcting the position of the test bench 200 and the bending head 310 according to the embodiment can be performed by first measuring the slope of the test bench 200 and the bending head 310. The slope measurement can be performed first on the test bench 200 and then on the bending head 310, but is not limited thereto, and can be performed first on the bending head 310.

[0091] Measuring the slope of the test bench 200 and the bending head 310 at operation S100 can be performed by an upper sensor 600 via laser scanning on the upper surfaces of the test bench 200 and the bending head 310. As described above, the upper sensor 600 may include a light transmission member 610 configured to emit a laser beam LB and a light receiving member 620 configured to receive the laser beam LB. The upper sensor 600 can measure the time taken for the laser beam LB transmitted through the light transmission member 610 to reach the light receiving member 620 after being reflected from the upper surfaces of the test bench 200 and the bending head 310, in order to determine the distance to the upper surfaces of the test bench 200 and the bending head 310. The section on the bending head 310 substantially scanned by the laser beam LB may be a suction member 311.

[0092] The slope of the test bench 200 can be derived from the maximum and minimum distance values ​​among the distance values ​​of each partition on the upper surface of the test bench 200 measured from the upper sensor 600, and the horizontal distance between the points having the maximum and minimum values. For example, the test bench 200 can be tilted such that one end faces upward in the second direction DR2 and the other end faces downward in the second direction DR2. The distance from the upper sensor 600 to said one end of the test bench 200, measured in the third direction DR3, can be referred to as a first distance d1, and the distance from the upper sensor 600 to said other end can be referred to as a second distance d2; the second distance d2 can be greater than the first distance d1. The slope of the test bench 200 can be derived from the first distance d1, the second distance d2, and the distance between one end and the other end of the test bench 200.

[0093] The slope of the bending head 310 can be derived based on the maximum and minimum distance values ​​among the distance values ​​of each partition on the upper surface of the bending head 310 measured from the upper sensor 600, and the horizontal distance between the points having the maximum and minimum values. Since the laser beam LB emitted from the upper sensor 600 substantially scans the suction member 311 of the bending head 310, the slope of the bending head 310 can be derived based on the maximum and minimum distance values ​​among the distance values ​​of each partition on the upper surface of the suction member 311 measured from the upper sensor 600, and the horizontal distance between the points having the maximum and minimum values. For example, the suction member 311 can be tilted such that one end faces upward and the other end faces downward in the first direction DR1. The distance from the upper sensor 600 to the other end of the suction member 311 in the third direction DR3 can be referred to as the third distance d3, and the distance from the upper sensor 600 to the one end of the suction member 311 in the third direction DR3 can be referred to as the fourth distance d4; the fourth distance d4 can be less than the third distance d3. The slope of the bending head 310 can be derived based on the third distance d3, the fourth distance d4, and the distance between one end and the other end of the suction member 311.

[0094] However, the inventive concept is not limited thereto. The slope of the bent head 310 can be derived based on a standard deviation calculated from data of distance values ​​measured in a partition scanned by a laser beam LB.

[0095] After measuring the slopes of the test bench 200 and the bending head 310 using the upper sensor 600 at operation S100, it can be determined at operation S200 whether the slopes of the test bench 200 and the bending head 310 each exceed a predetermined tolerance range, and the slopes of the test bench 200 and the bending head 310 can be corrected at operation S210. Although it is preferred that the test bench 200 and the bending head 310 are horizontal and not tilted (i.e., in a state with a slope of 0), the bending process can be performed if the slopes are within the tolerance range. The tolerance range of the slopes of the test bench 200 and the bending head 310 can be changed according to the target object 1 to be bent.

[0096] As described above, if the previously derived slopes of the test bench 200 and the bending head 310 exceed tolerances, the slopes of the test bench 200 and the bending head 310 can be corrected at operation S210. Correcting the slope of the test bench 200 may include adjusting the tightness (or tightening force) of each of the plurality of test bench clamping members 230. Correcting the slope of the bending head 310 may also include, but is not limited to, adjusting the tightness (or tightening force) of each of the plurality of bending clamping members 340. The upper surfaces of the test bench 200 and the bending head 310 after slope correction can be substantially horizontal.

[0097] However, if the slopes of the test bench 200 and the bending head 310 are within tolerance, the height of the test bench 200 can be measured at operation S300 using the side sensor 700 as the next operation.

[0098] Reference Figures 8 to 11 A side sensor 700, fixed in height on one side of the test bench 200, can sense changes in the height of the upper surface of the test bench 200. In an exemplary embodiment, if the height of the test bench 200 changes, it is possible to measure the height difference a1 between the reference line VL and the upper surface of the test bench 200.

[0099] After measuring the height of the test bench 200 using the side sensor 700 at operation S300, it can be determined at operation S400 whether the height of the test bench 200 exceeds the tolerance range, and the height of the test bench 200 can be corrected at operation S410. In an exemplary embodiment, if the height of the test bench 200 measured from the reference line VL is within a predetermined tolerance range, a bending process can be performed. The tolerance range of the height of the test bench 200 can be changed according to the process target object 1.

[0100] As described above, if the height of the test bench 200 measured from the reference line VL exceeds the tolerance range, the height of the test bench 200 can be corrected at operation S410. The height correction of the test bench 200 can be performed by the controller 500 controlling the test bench drive member 220 to move the test bench 200 in the vertical direction. For example, if the upper surface of the test bench 200 is not flush with the reference line VL, the side sensor 700 can generate a signal to the controller 500, causing the controller 500 to control the test bench drive member 220 to move the test bench 200 in the vertical direction by approximately the height difference a1 of the upper surface of the test bench 200, so that it is flush with the reference line VL. Although the height of the test bench 200 can be automatically measured and corrected under the control of the controller 500, the inventive concept is not limited thereto.

[0101] However, if the height of the test bench 200 is within tolerance, the height difference between the test bench 200 and the bending head 310 can be measured at operation S500 using the upper sensor 600.

[0102] Reference Figures 8 to 12 The upper sensor 600 can be used to measure the height difference between the upper surfaces of the test bench 200 and the bending head 310. As described above, the upper sensor 600 can be a distance measuring sensor capable of measuring the distance from the upper sensor 600 to the upper surface of the test bench 200 and the distance from the upper sensor 600 to the upper surface of the bending head 310, and the height difference between the upper surfaces of the test bench 200 and the bending head 310 can be derived from these two distances.

[0103] As described above, if the height difference between the previously measured test bench 200 and the bending head 310 exceeds the tolerance range, the height difference between the test bench 200 and the bending head 310 can be corrected at operation S610. The correction of the height difference between the test bench 200 and the bending head 310 can be performed by the controller 500 controlling the vertical movement member 320 of the bending unit 300 to move the bending unit 300 in the vertical direction.

[0104] In an exemplary embodiment, the height difference between the upper surfaces of the reference test bench 200 and the bending head 310 may be referred to as a first height difference h1. If at least one of the test bench 200 and the bending unit 300 changes in height, the height difference between the upper surfaces of the test bench 200 and the bending head 310 may be changed to a second height difference h2. In this case, the upper sensor 600 may generate a signal to the controller 500 to cause the controller 500 to control the vertical movement member 320 of the bending unit 300 to move, such that the height difference between the upper surfaces of the test bench 200 and the bending head 310 is corrected to the first height difference h1. Although the measurement and correction of the height difference between the test bench 200 and the bending head 310 can be performed automatically under the control of the controller 500, the inventive concept is not limited thereto.

[0105] However, if the height difference between the test bench 200 and the bending head 310 is within the tolerance range, the subsequent operation can be to arrange the process target object 1 on the test bench 200 and bend the process target object 1 while it is in contact with the bending head 310. The process for bending the process target object 1 has been referenced. Figures 3 to 7 A description was provided, and that description is omitted below.

[0106] According to the embodiment, the display device manufacturing method can identify the degree of tilt of each of the gantry 200 and the bending unit 300. It can also measure the height of the gantry 200 and the height of the bending unit 300 relative to the gantry 200, and correct the height of the bending unit 300. This allows the process target object 1 to be accurately placed across the gantry 200 and the bending unit 300 and stably bent by the bending unit 300, resulting in improved reliability and display quality of the display device DD manufactured from the process target object 1.

[0107] In concluding this detailed description, those skilled in the art will understand that many changes and modifications can be made to the preferred embodiments without substantially departing from the principles of the invention. Therefore, the preferred embodiments of the invention disclosed herein are for general and descriptive purposes only and are not intended to be limiting.

Claims

1. An apparatus configured to manufacture a display device, comprising: A stand configured to place the process target object on its upper surface; A bending head contacts the target object in the process to bend the target object. A distance measurement sensor is mounted above the platform so that it can move in the horizontal direction; A cylinder configured to adjust the vertical position of the bending head; as well as The controller is configured to control the position adjustment of the cylinder relative to the bending head. The distance measuring sensor measures a first distance between itself and the upper surface of the bending head, and a second distance between itself and the upper surface of the platform, and sends the measured distances to the controller. The controller derives a third distance between the upper surface of the bending head and the upper surface of the platform based on the first distance and the second distance, and determines the vertical position adjustment amount of the cylinder based on the third distance.

2. The apparatus according to claim 1, wherein, The distance measurement sensor includes an optical transmission component configured to emit a laser beam and an optical receiving component configured to receive the laser beam.

3. The apparatus according to claim 2, wherein, The distance measurement sensor calculates the distance by measuring the time it takes for the laser beam emitted from the optical transmission member to reach the optical receiving member.

4. The apparatus according to claim 1, further comprising: The height measurement sensor is located outside the test bench. The height measuring sensor measures the height difference between itself and the upper surface of the platform.

5. The apparatus according to claim 1, further comprising: The first leveling adjustment component is configured to adjust the levelness of the bending head; as well as The second leveling component is configured to adjust the levelness of the platform.

6. The apparatus according to claim 1, wherein, The upper surface of the platform and the upper surface of the bending head are parallel to each other.

7. The apparatus according to claim 1, further comprising: A bench drive component, wherein the bench is fastened to the bench drive component; as well as The guide member has a shape that extends in one direction and guides the movement of the platform drive member.

8. The apparatus according to claim 1, wherein, The bending head includes a first suction component.

9. The apparatus according to claim 8, wherein, The first suction member includes a plurality of suction holes configured to provide negative pressure.

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