Workpiece holding mechanism and processing device
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- DISCO CORP
- Filing Date
- 2021-05-14
- Publication Date
- 2026-07-24
AI Technical Summary
In the prior art, when using adhesive tape to hold plate-shaped workpieces, there are problems such as high cost and difficulty in properly holding miniaturized chips, and magnetic covers are prone to causing the workpieces to be attracted and difficult to remove.
Employing a holding base and release component with magnets, and by setting concave and convex structures or a peeling accelerator layer on the cover plate, combined with a fluid supply and an ejector, the workpiece is held by magnetic force and easily removed by fluid expansion and negative pressure.
It enables proper holding and easy removal of the workpiece, reduces costs, and improves the applicability and operational efficiency of the holding mechanism.
Smart Images

Figure CN113707592B_ABST