Board-level MCU data interactive storage system, method, controller and electrical equipment

Abstract

The present invention relates to a board-level MCU data interactive storage system, method, controller and electrical equipment. The board-level MCU data interactive storage system includes: an external storage chip, a read-write interlock transmission component and a single-chip microcomputer pair; the single-chip microcomputer pair includes two MCUs; the two MCUs are connected through the read-write interlock transmission component to realize the interlocking relationship between the two MCUs. One MCU sends external storage usage information and external storage read-write requirements to another MCU; the MCU receiving communication transmission data controls the read-write interlock transmission component to unlock according to the external storage usage information and the external storage read-write requirements, so that the MCU sending the communication transmission data performs read and write operations on the external storage chip. This solution expands the storage capacity through the external storage chip, improves the storage efficiency, and realizes the interactive unlocking when the MCU accesses the external storage chip through the interlocking relationship between the two MCUs, thereby improving the storage confidentiality and security.

Description

Technical Field

[0001] The present invention relates to the technical field of data interaction storage, and in particular to a board-level MCU data interaction storage system, method, controller and electrical equipment. Background Art

[0002] The controller is the core part of the control system of various electrical equipment, responsible for controlling the functional operation of each component of the electrical equipment. For example, the air conditioner controller is responsible for controlling the cooling, dehumidification, heating, automatic, air supply, switch, self-test and other functional operations of each component of the air conditioner. With the prevalence of artificial intelligence and the Internet of Things, as the intelligence of various electrical equipment deepens, the controller's demand for embedded computing resources has further increased. It is becoming more and more common for multiple MCUs on a single board to work together, and at the same time, the demand for running memory for a single MCU is also increasing.

[0003] In the prior art, the memory used to store data interactions between various MCUs in a control board of a controller of an electrical device is small and has no confidentiality measures, which affects data storage efficiency and storage security.

[0004] Therefore, how to improve the storage efficiency and storage security of data interaction storage between MCUs at the board level is a technical problem that technical personnel in this field urgently need to solve. Summary of the invention

[0005] In view of this, the purpose of the present invention is to provide a board-level MCU data interaction storage system, method, controller and electrical equipment to solve the problem that the memory for data interaction storage between each MCU in the control board of the controller in the prior art is small and there is no confidentiality measure, which affects the data storage efficiency and storage security.

[0006] To achieve the above objectives, the present invention adopts the following technical solutions:

[0007] A board-level MCU data interaction storage system, comprising: an external storage chip, at least one set of read-write interlock transmission components and at least one set of single-chip microcomputer pairs; the read-write interlock transmission components correspond to the single-chip microcomputer pairs one by one; the single-chip microcomputer pairs include two MCUs;

[0008] Each of the MCUs is connected to the external storage chip via the read-write interlock transmission component;

[0009] The two MCUs are connected via the read-write interlock transmission component to achieve an interlocking relationship between the two MCUs;

[0010] The read-write interlock transmission component is used to control the communication between the two MCUs and the external storage chip or the communication disconnection;

[0011] The two MCUs are connected, and one MCU sends communication transmission data to the other MCU; the communication transmission data includes external storage usage information and external storage read and write requirements;

[0012] The MCU receiving the communication transmission data controls the read-write interlock transmission component to unlock according to the external storage usage information and the external storage read-write requirements, so as to enable the communication between the MCU sending the communication transmission data and the external storage chip;

[0013] The MCU that sends communication transmission data performs read and write operations on the external storage chip through the read-write interlock transmission component according to the external storage usage information and the external storage read and write requirements.

[0014] Furthermore, in the above-mentioned board-level MCU data interaction storage system, the communication transmission data also includes: work interaction information;

[0015] The MCU receiving the communication transmission data updates the pre-stored historical communication transmission data according to the communication transmission data sent by the MCU sending the communication transmission data, and operates according to the work interaction information.

[0016] Furthermore, in the above-mentioned board-level MCU data interaction storage system, the MCU sending the communication transmission data performs a read and write operation on the external storage chip through the read-write interlock transmission component according to the external storage usage information and the external storage read and write requirements, including:

[0017] If the external storage read / write requirement indicates a write requirement, the MCU that sends the communication transmission data writes the work interaction information into the external storage chip through the read / write interlock transmission component, and updates the external storage usage information according to the write address of the work interaction information;

[0018] If the external storage read / write requirement indicates a read requirement, the MCU sending the communication transmission data reads the target information corresponding to the external storage read / write requirement from the external storage chip through the read / write interlock transmission component according to the external storage usage information.

[0019] Furthermore, in the above-mentioned board-level MCU data interaction storage system, each group of the read-write interlock transmission components includes: a storage communication component, a transmission circuit and two groups of interlock circuits;

[0020] The interlocking circuit corresponds to the MCU one by one;

[0021] The interlocking circuit is connected to the MCU corresponding to the interlocking circuit;

[0022] Each group of the interlocking circuits is connected to the transmission circuit via the storage communication component;

[0023] The transmission circuit is connected to the external storage chip;

[0024] The MCU receiving the communication transmission data sends a high level signal to the interlock circuit corresponding to the MCU sending the communication transmission data according to the external storage usage information and the external storage read and write requirements;

[0025] After the interlocking circuit corresponding to the MCU that sends communication transmission data receives the high-level signal, the communication between the storage communication component and the transmission circuit is connected, so that the MCU that sends communication transmission data performs read and write operations on the external storage chip through the interlocking circuit corresponding to the MCU that sends communication transmission data, the storage communication component and the transmission circuit.

[0026] Furthermore, the above-mentioned board-level MCU data interaction storage system further includes: a hardware protection component;

[0027] The hardware protection component is connected to the external storage chip and is used for performing hardware protection on the external storage chip.

[0028] Furthermore, in the above-mentioned board-level MCU data interaction storage system, the interlocking circuit corresponding to the MCU sending the communication transmission data includes: a first transistor, a first resistor and a second resistor;

[0029] The interlock circuit corresponding to the MCU receiving the communication transmission data includes: a second transistor, a third resistor and a fourth resistor;

[0030] The transmission circuit comprises: a fifth resistor;

[0031] The first pin of the MCU sending the communication transmission data is connected to the base of the first transistor through the first resistor;

[0032] The collector of the first transistor is connected to the second pin of the MCU receiving the communication transmission data;

[0033] The emitter of the first transistor is grounded through the second resistor;

[0034] The first pin of the MCU receiving the communication transmission data is connected to the base of the second transistor through the third resistor;

[0035] The collector of the second transistor is connected to the second pin of the MCU that transmits communication transmission data;

[0036] The emitter of the second transistor is grounded through the fourth resistor;

[0037] The emitter of the first transistor and the emitter of the second transistor are both connected to the fifth resistor through the storage communication component;

[0038] The fifth resistor is connected to the external storage chip;

[0039] After the MCU receiving the communication transmission data receives the external storage usage information and the external storage read and write requirements, the second pin of the MCU receiving the communication transmission data sends a high-level signal to the collector of the first transistor, so that the emitter of the first transistor outputs a high-level signal, thereby achieving communication conduction between the MCU sending the communication transmission data and the external storage chip;

[0040] The MCU sending communication transmission data can perform read and write operations on the external storage chip through the emitter of the first transistor, the storage communication component and the fifth resistor.

[0041] Further, in the above-mentioned board-level MCU data interaction storage system, the hardware protection component includes: a sixth resistor, a seventh resistor, a third transistor and a fourth transistor;

[0042] The collector of the third triode is connected to a power supply;

[0043] The second pin of the MCU sending the communication transmission data is connected to the base of the third transistor through the sixth resistor;

[0044] The emitter of the third triode is connected to the collector of the fourth triode;

[0045] The second pin of the MCU receiving the communication transmission data is connected to the base of the fourth transistor through the seventh resistor;

[0046] The emitter of the fourth transistor is connected to the external storage chip.

[0047] Furthermore, the above-mentioned board-level MCU data interaction storage system further includes: an inter-board communication component;

[0048] The two MCUs are connected via the inter-board communication component.

[0049] Furthermore, in the above-mentioned board-level MCU data interaction storage system, the inter-board communication component includes a UART communication component; and the storage communication component includes: an I2C bus.

[0050] Furthermore, in the above-mentioned board-level MCU data interaction storage system, the two MCUs include: an external interaction MCU and a special task MCU.

[0051] Furthermore, in the above-mentioned board-level MCU data interaction storage system, if the MCU sending the communication transmission data is an external interaction MCU, and the MCU receiving the communication transmission data is a special task MCU, the work interaction information includes: the unit information data corresponding to the external interaction MCU, the current unit operation data, and the first program operation intermediate data;

[0052] If the MCU sending the communication transmission data is a special task MCU, and the MCU receiving the communication transmission data is an external interaction MCU, the work interaction information includes: the special task running result corresponding to the special task MCU and the intermediate data of the second program running.

[0053] The present invention also provides a board-level MCU data interaction storage method, which is applied to the above-mentioned board-level MCU data interaction storage system, comprising:

[0054] One of the MCUs sends communication transmission data to another of the MCUs; the communication transmission data includes external storage usage information and external storage read and write requirements;

[0055] The MCU receiving the communication transmission data controls the read-write interlock transmission component to unlock according to the external storage usage information and the external storage read-write requirements, so as to enable the communication between the MCU sending the communication transmission data and the external storage chip;

[0056] The MCU that sends communication transmission data performs read and write operations on the external storage chip through the read-write interlock transmission component according to the external storage usage information and the external storage read and write requirements.

[0057] Furthermore, in the above-mentioned board-level MCU data interaction storage method, the communication transmission data also includes: work interaction information;

[0058] The board-level MCU data interaction storage method further includes:

[0059] The MCU receiving the communication transmission data updates the pre-stored historical communication transmission data according to the communication transmission data sent by the MCU sending the communication transmission data, and operates according to the work interaction information.

[0060] Furthermore, in the above-mentioned board-level MCU data interaction storage method, the MCU sending the communication transmission data performs a read and write operation on the external storage chip through the read-write interlock transmission component according to the external storage usage information and the external storage read and write requirements, including:

[0061] If the external storage read / write requirement indicates a write requirement, the MCU that sends the communication transmission data writes the work interaction information into the external storage chip through the read / write interlock transmission component, and updates the external storage usage information according to the write address of the work interaction information;

[0062] If the external storage read / write requirement indicates a read requirement, the MCU sending the communication transmission data reads the target information corresponding to the external storage read / write requirement from the external storage chip through the read / write interlock transmission component according to the external storage usage information.

[0063] The present invention also provides a controller, comprising: a control board and the above-mentioned board-level MCU data interaction storage system;

[0064] The board-level MCU data interaction storage system is arranged on the control board.

[0065] The present invention also provides an electrical device, comprising the above controller.

[0066] A board-level MCU data interaction storage system, method, controller and electrical equipment, the board-level MCU data interaction storage system includes: an external storage chip, at least one group of read-write interlock transmission components and at least one group of single-chip microcomputer pairs; the read-write interlock transmission components correspond to the single-chip microcomputer pairs one by one; the single-chip microcomputer pairs include two MCUs; each MCU is connected to the external storage chip through the read-write interlock transmission component; the two MCUs are connected through the read-write interlock transmission component to achieve the interlocking relationship between the two MCUs; the read-write interlock transmission component is used to control the communication conduction or communication disconnection between the two MCUs and the external storage chip. One MCU sends communication transmission data to another MCU; the communication transmission data includes external storage usage information and external storage read-write requirements; the MCU receiving the communication transmission data controls the read-write interlock transmission component to unlock according to the external storage usage information and the external storage read-write requirements, so that the MCU sending the communication transmission data is connected to the external storage chip; the MCU sending the communication transmission data performs read-write operations on the external storage chip through the read-write interlock transmission component according to the external storage usage information and the external storage read-write requirements. By adopting the technical solution of the present invention, the storage capacity is expanded and the storage efficiency is improved by setting an external storage chip, and the interlocking relationship between the two MCUs in the control board is realized when the MCU accesses the external storage chip, thereby improving the storage confidentiality and security.

[0067] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0069] Figure 1 It is a circuit block diagram provided by an embodiment of the board-level MCU data interaction storage system of the present invention;

[0070] Figure 2 It is a circuit connection diagram of a read-write interlock transmission component and a hardware protection component in the board-level MCU data interaction storage system of the present invention;

[0071] Figure 3 It is a flow chart provided by an embodiment of the board-level MCU data interaction storage method of the present invention;

[0072] Figure 4 It is a structural block diagram provided by an embodiment of the controller of the present invention. DETAILED DESCRIPTION

[0073] To make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other implementation methods obtained by ordinary technicians in this field without creative work belong to the scope of protection of the present invention.

[0074] Figure 1 : is a circuit block diagram provided by an embodiment of the board-level MCU data interaction storage system of the present invention, such as Figure 1 As shown, the board-level MCU data interaction storage system of this embodiment includes: an external storage chip 13, at least one set of read-write interlock transmission components 12 and at least one set of single-chip microcomputer pairs 11, wherein the read-write interlock transmission components 12 correspond to the single-chip microcomputer pairs 11 one by one, that is, one set of single-chip microcomputer pairs 11 corresponds to one set of read-write interlock transmission components 12. Each set of single-chip microcomputer pairs 11 includes two MCUs, for example Figure 1 The external interaction MCU 111 and the special task MCU 112 in the embodiment. Each MCU is connected to the external storage chip 13 through the read-write interlock transmission component 12; the two MCUs are connected through the read-write interlock transmission component 12, so that the interlock relationship between the two MCUs can be realized.

[0075] The read-write interlock transmission component 12 can control the communication between the two MCUs and the external storage chip 13 or the communication disconnection. When the two MCUs are connected, one MCU sends communication transmission data to the other MCU, wherein the communication transmission data includes external storage usage information and external storage read-write requirements. The MCU receiving the communication transmission data can control the read-write interlock transmission component 12 to unlock according to the external storage usage information and the external storage read-write requirements, so that the communication between the MCU sending the communication transmission data and the external storage chip is connected. In this way, the MCU sending the communication transmission data can perform read and write operations on the external storage chip through the read-write interlock transmission component 12 according to the external storage usage information and the external storage read-write requirements. The technical solution of this embodiment is adopted, and the storage capacity is expanded and the storage efficiency is improved by setting the external storage chip 13, and the interactive unlocking when the MCU accesses the external storage chip 13 is realized by controlling the interlocking relationship between the two MCUs in the single board, thereby improving the storage confidentiality and security.

[0076] Furthermore, the board-level MCU data interaction storage system of this embodiment further includes an inter-board communication component 14, and the two MCUs are connected via the inter-board communication component 14. One MCU can send communication transmission data to another MCU via the inter-board communication component 14. Among them, the inter-board communication component 121 preferably adopts a UART communication component.

[0077] Furthermore, the communication transmission data also includes work interaction information. The MCU receiving the communication transmission data can update the pre-stored historical communication transmission data according to the received communication transmission data, and the MCU receiving the communication transmission data can also work according to the received work interaction information.

[0078] Further, when the external storage read / write demand sent by the MCU that sends communication transmission data indicates a write demand, after the MCU that receives the communication transmission data controls the read / write interlock transmission component 12 to unlock, the MCU that sends the communication transmission data writes the working interaction information into the external storage chip 13 through the read / write interlock transmission component 12, and updates the external storage usage information to the write address of the working interaction information; when the external storage read / write demand sent by the MCU that sends communication transmission data indicates a read demand, after the MCU that receives the communication transmission data controls the read / write interlock transmission component 12 to unlock, the MCU that sends the communication transmission data reads the target information corresponding to the external storage read / write demand from the external storage chip 13 through the read / write interlock transmission component 12 according to the external storage usage information.

[0079] Specifically, the two MCUs include: an external interaction MCU 111 and a special task MCU 112. The external interaction MCU 111 can be used for external interaction, logic operation, load driving, etc.; the special task MCU 112 can be used for special task operation, model operation, etc.

[0080] When the external interaction MCU 111 is used as the MCU to send communication transmission data, and the special task MCU 112 is used as the MCU to receive communication transmission data:

[0081] First, the external interaction MCU 111 controls the operation of the air conditioner, and the special task MCU 112 waits for the external interaction MCU 111 to transmit data.

[0082] Second, the external interaction MCU111 and the special task MCU112 perform data interaction through the inter-board communication component 14, and the external interaction MCU111 sends communication transmission data to the special task MCU112, wherein the communication transmission data includes: work interaction information, external storage usage information, and external storage read and write requirements. The work interaction information sent by the external interaction MCU111 includes: unit information data such as the model and cooling capacity of the unit, current unit operation data (for example, indoor ambient temperature, outdoor ambient temperature, air conditioner on / off status, user set temperature, user set air conditioning mode, etc.) and the first program operation intermediate data; external storage usage information includes: storage data address, storage data type and number of groups.

[0083] The special task MCU 112 stores the historical communication transmission data previously sent by the external interaction MCU 111. When the special task MCU 112 receives the communication transmission data sent by the external interaction MCU 111 again, it will update the pre-stored historical communication data according to the latest received communication transmission data. In addition, when the patent task MCU is working, it may apply the work interaction information sent by the external interaction MCU 111, so the patent task MCU can also work according to the work interaction information.

[0084] Third, the special task MCU112 controls the unlocking of the read-write interlock transmission component 12 according to the external storage usage information and the external storage read-write requirements, so as to enable the communication between the external interaction MCU111 and the external storage chip 13.

[0085] Fourth, if the external storage read and write demand indicates a write demand, the external interactive MCU111 writes the unit information data, the first program operation intermediate data and the working interaction information into the external storage chip 13 through the read-write interlock transmission component 12. For example, multiple sets of current unit operation data are periodically written to the external storage chip 13 (for example, recorded once every minute). Among them, the external interactive MCU111 can only write data that cannot be stored in the space of the external interactive MCU111 itself into the external storage chip 13. The external interactive MCU111 also needs to update the external storage usage information according to the write address of each data, so that when the external interactive MCU111 needs to read data, it can find the storage address of the data according to the external storage usage information.

[0086] If the external storage read / write requirement indicates a read requirement, the external interaction MCU 111 reads the target information corresponding to the external storage read / write requirement from the external storage chip 13 through the read / write interlock transmission component 12 according to the address corresponding to the external storage usage information.

[0087] When the dedicated task MCU 112 is used as the MCU to send communication transmission data, and the external interaction MCU 111 is used as the MCU to receive communication transmission data:

[0088] First, the external interaction MCU 111 and the special task MCU 112 exchange data through the inter-board communication component 14, and the special task MCU 112 sends communication transmission data to the external interaction MCU 111, wherein the communication transmission data includes: work interaction information, external storage usage information and external storage read and write requirements. The work interaction information sent by the special task MCU 112 includes: the special task operation results corresponding to the special task MCU 112 (for example, the Internet of Things networking status, cloud-based power on and off settings, etc.) and the second program operation intermediate data; the external storage usage information includes: the storage data address, the storage data type and the number of groups.

[0089] The external interaction MCU 111 stores the historical communication transmission data previously sent by the special task MCU 112. When the external interaction MCU 111 receives the communication transmission data sent by the special task MCU 112 again, it will update the pre-stored historical communication data according to the latest received communication transmission data. In addition, when the external interaction MCU 111 is working, it may apply the work interaction information sent by the special task MCU 112, so the external interaction MCU 111 can also work according to the work interaction information.

[0090] Second, the external interaction MCU111 controls the unlocking of the read-write interlock transmission component 12 according to the external storage usage information and the external storage read-write requirements, so as to enable the communication between the special task MCU112 and the external storage chip 13.

[0091] Third, if the external storage read / write demand indicates a write demand, the special task MCU 112 writes the intermediate data of the second program operation and the work interaction information into the external storage chip 13 through the read / write interlock transmission component 12, wherein the special task MCU 112 can only write the data that cannot be stored in the space of the special task MCU 112 itself into the external storage chip 13. The special task MCU 112 also needs to update the external storage usage information according to the write address of each data, so that when the special task MCU 112 needs to read the data, it can find the storage address of the data according to the external storage usage information.

[0092] If the external storage read / write requirement indicates a read requirement, the special task MCU 112 reads the target information corresponding to the external storage read / write requirement from the external storage chip 13 through the read / write interlock transmission component 12 according to the address corresponding to the external storage usage information.

[0093] Further, in this embodiment, each set of read-write interlock transmission components 12 includes: a storage communication component 122, a transmission circuit 123 and two sets of interlock circuits 121. The interlock circuit 121 corresponds to the MCU one by one, that is, each MCU is provided with a set of interlock circuits 121, and each MCU is connected to its corresponding interlock circuit 121. Each set of interlock circuits 121 is connected to the transmission circuit 123 through the storage communication component 122, and the transmission circuit 123 is connected to the external storage chip 13. Among them, the storage communication component 122 includes an I2C bus.

[0094] The MCU that receives the communication transmission data sends a high-level signal to the interlocking circuit 121 corresponding to the MCU that sends the communication transmission data according to the external storage usage information and the external storage read and write requirements; after the interlocking circuit 121 corresponding to the MCU that sends the communication transmission data receives the high-level signal, the communication between the storage communication component 122 and the transmission circuit 123 is connected, so that the MCU that sends the communication transmission data can perform read and write operations on the external storage chip 13 through its corresponding interlocking circuit 121, storage communication component 122 and transmission circuit 123.

[0095] This embodiment provides an inter-board communication component 14 and a storage communication component 122. The use of multi-channel communication can improve the confidentiality of the external storage chip 13. Multi-channel communication and two MCUs share external storage, and three types of interactions between the two MCUs (communication interaction between the two MCUs, read and write interaction between the MCU and the external storage chip 13, and external storage read and write interlock interaction) are provided to increase the data acquisition speed, thereby reducing the computing pressure of the MCU.

[0096] Furthermore, the board-level MCU data interaction storage system of this embodiment further includes: a hardware protection component. The hardware protection component is connected to the external storage chip 13 and is used to perform hardware protection on the external storage chip 13.

[0097] Specifically, Figure 2 It is a circuit connection diagram of the read-write interlock transmission component and the hardware protection component in the board-level MCU data interaction storage system of the present invention, such as Figure 2As shown, MCU-A is the MCU that sends communication transmission data, and MCU-B is the MCU that receives communication transmission data. The interlocking circuit 121 corresponding to the MCU that sends communication transmission data in this embodiment includes: a first transistor Q1, a first resistor R1, and a second resistor R2. The interlocking circuit corresponding to the MCU that receives communication transmission data includes: a second transistor Q2, a third resistor R3, and a fourth resistor R4. The transmission circuit includes: a fifth resistor R5. The first pin of MCU-A is connected to the base of the first transistor Q1 through the first resistor R1; the collector of the first transistor Q1 is connected to the second pin of MCU-B; the emitter of the first transistor Q1 is grounded through the second resistor R2; the first pin of MCU-B is connected to the base of the second transistor Q2 through the third resistor R3; the collector of the second transistor Q2 is connected to the second pin of MCU-A; the emitter of the second transistor Q2 is grounded through the fourth resistor R4; the emitter of the first transistor Q1 and the emitter of the second transistor Q2 are both connected to the fifth resistor R5 through the storage communication component 122; the fifth resistor R5 is connected to the pin SDA of the external storage chip 13.

[0098] After MCU-B receives the external storage usage information and the external storage read and write requirements, the second pin of MCU-B sends a high-level signal MCU-A-LOCK to the collector of the first transistor Q1. The first transistor Q1 has a switching function. When the collector of the first transistor Q1 is at a low level, the signal I2C_SDA at the emitter of the first transistor Q1 cannot be pulled high, thereby failing to conduct the communication between MCU-A and the external storage chip 13. Therefore, only when the high-level signal MCU-A-LOCK turns on the first transistor Q1 can the signal I2C_SDA output by the emitter of the first transistor Q1 be high, thereby achieving communication conduction between MCU-A and the external storage chip 13. MCU-A can be connected to the fifth resistor R5 through the emitter of the first transistor Q1 through the storage communication component 122, so that MCU-A can perform read and write operations on the external storage chip 13.

[0099] Specifically, Figure 2 As shown, the hardware protection component includes: a sixth resistor R6, a seventh resistor R7, a third transistor Q3 and a fourth transistor Q4; the collector of the third transistor Q3 is connected to the power supply VDD; the second pin of MCU-A is connected to the base of the third transistor Q3 through the sixth resistor R6; the emitter of the third transistor Q3 is connected to the collector of the fourth transistor Q4; the second pin of MCU-B is connected to the base of the fourth transistor Q4 through the seventh resistor R7; the emitter of the fourth transistor Q4 is connected to the pin WP of the external storage chip 13.

[0100] Specifically, the fifth pin of MCU-A is connected to the eighth resistor R8 through the storage communication component 122, and the eighth resistor R8 is connected to the pin SCL of the external storage chip 13. The third pin of MCU-A is connected to the third pin of MCU-B through the RX line in the UART communication component; the fourth pin of MCU-A is connected to the fourth pin of MCU-B through the TX line in the UART communication component. The emitter of the third transistor Q3 is grounded through the ninth resistor R9 and the first capacitor C1 respectively; the pins A0, A1, A2, and GND of the external storage chip 13 are all grounded; the pins A0, A1, A2, and GND of the external storage chip 13 are all connected to the power supply VDD through the second capacitor C2. The pin SCL of the external storage chip 13 is connected to the power supply VDD through the tenth resistor R10; the pin SDA of the external storage chip 13 is connected to the power supply VDD through the eleventh resistor R11.

[0101] For the purpose of being more comprehensive, corresponding to the board-level MCU data interaction storage system provided in the embodiment of the present invention, the present application also provides a board-level MCU data interaction storage method.

[0102] Figure 3 FIG. 1 is a flow chart of an embodiment of a board-level MCU data interaction storage method of the present invention. Figure 3 As shown, the board-level MCU data interaction storage method of this embodiment is applied to the board-level MCU data interaction storage system described in the above embodiment, and the board-level MCU data interaction storage method specifically includes the following steps:

[0103] S101, one MCU sends communication transmission data to another MCU. The communication transmission data includes external storage usage information and external storage read and write requirements.

[0104] S102, the MCU receiving the communication transmission data controls the read-write interlock transmission component 12 to unlock according to the external storage usage information and external storage read-write requirements contained in the communication transmission data, so as to enable the communication between the MCU sending the communication transmission data and the external storage chip 13.

[0105] S103, the MCU sending the communication transmission data performs read and write operations on the external storage chip 13 through the read-write interlock transmission component 12 according to the external storage usage information and the external storage read and write requirements.

[0106] By adopting the technical solution of this embodiment, the storage capacity is expanded and the storage efficiency is improved by setting up an external storage chip 13, and by controlling the interlocking relationship between the two MCUs in the single board, interactive unlocking is achieved when the MCU accesses the external storage chip 13, thereby improving storage confidentiality and security.

[0107] Furthermore, in the board-level MCU data interaction storage method of this embodiment, the communication transmission data also includes: work interaction information. The board-level MCU data interaction storage method also includes:

[0108] The MCU receiving the communication transmission data updates the pre-stored historical communication transmission data according to the communication transmission data sent by the MCU sending the communication transmission data, and works according to the work interaction information.

[0109] Furthermore, in the board-level MCU data interaction storage method of this embodiment, step S103 specifically includes the following steps:

[0110] First, if the external storage read / write demand indicates a write demand, the MCU sending the communication transmission data writes the work interaction information into the external storage chip 13 through the read / write interlock transmission component 12, and updates the external storage usage information according to the write address of the work interaction information;

[0111] Second, if the external storage read / write demand indicates a read demand, the MCU sending the communication transmission data reads the target information corresponding to the external storage read / write demand from the external storage chip 13 through the read / write interlock transmission component 12 according to the external storage usage information.

[0112] Regarding the method in the above embodiment, the specific manner of executing the operation in each step has been described in detail in the embodiment of the board-level MCU data interaction storage system, and will not be elaborated here.

[0113] Figure 4 is a structural block diagram provided by an embodiment of the controller of the present invention, such as Figure 4 As shown, the controller of this embodiment includes: a control board 21 and a board-level MCU data interaction storage system 22 described in the above embodiment. The board-level MCU data interaction storage system 22 is arranged on the control board 21. By adopting the technical solution of this embodiment, the board-level MCU data interaction storage system 22 expands the storage capacity and improves the storage efficiency by setting an external storage chip 13, and realizes the interactive unlocking when the MCU accesses the external storage chip 13 through the interlocking relationship between the two MCUs in the control board 21, thereby improving the storage confidentiality and security.

[0114] The present invention also provides an electrical device, which includes the controller described in the above embodiment. In this way, the electrical device of this embodiment can expand the storage capacity and improve the storage efficiency by setting an external storage chip 13 in the controller, and through the interlocking relationship between the two MCUs in the controller, interactive unlocking is realized when the MCU accesses the external storage chip 13, thereby improving storage confidentiality and security.

[0115] It can be understood that the same or similar parts of the above embodiments can be referenced to each other, and the contents not described in detail in some embodiments can refer to the same or similar contents in other embodiments.

[0116] It should be noted that, in the description of the present invention, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, the meaning of "plurality" refers to at least two.

[0117] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0118] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A board-level MCU data interaction storage system, characterized in that: include: An external storage chip, at least one set of read-write interlock transmission components and at least one set of single-chip microcomputer pairs; the read-write interlock transmission components correspond to the single-chip microcomputer pairs one by one; the single-chip microcomputer pairs include two MCUs; Each of the MCUs is connected to the external storage chip via the read-write interlock transmission component; The two MCUs are connected via the read-write interlock transmission component to achieve an interlocking relationship between the two MCUs; The read-write interlock transmission component is used to control the communication between the two MCUs and the external storage chip or the communication disconnection; The two MCUs are connected, and one MCU sends communication transmission data to the other MCU; the communication transmission data includes external storage usage information and external storage read and write requirements; The MCU receiving the communication transmission data controls the read-write interlock transmission component to unlock according to the external storage usage information and the external storage read-write requirements, so as to enable the communication between the MCU sending the communication transmission data and the external storage chip; The MCU that sends communication transmission data performs read and write operations on the external storage chip through the read-write interlock transmission component according to the external storage usage information and the external storage read and write requirements.

2. The board-level MCU data interaction storage system according to claim 1, characterized in that: The communication transmission data also includes: work interaction information; The MCU receiving the communication transmission data updates the pre-stored historical communication transmission data according to the communication transmission data sent by the MCU sending the communication transmission data, and operates according to the work interaction information.

3. The board-level MCU data interaction storage system according to claim 2, characterized in that: The MCU sending the communication transmission data performs a read and write operation on the external storage chip through the read-write interlock transmission component according to the external storage usage information and the external storage read and write requirements, including: If the external storage read / write requirement indicates a write requirement, the MCU that sends the communication transmission data writes the work interaction information into the external storage chip through the read / write interlock transmission component, and updates the external storage usage information according to the write address of the work interaction information; If the external storage read / write requirement indicates a read requirement, the MCU sending the communication transmission data reads the target information corresponding to the external storage read / write requirement from the external storage chip through the read / write interlock transmission component according to the external storage usage information.

4. The board-level MCU data interaction storage system according to claim 1, characterized in that: Each set of the read-write interlock transmission components includes: a storage communication component, a transmission circuit and two sets of interlock circuits; The interlocking circuit corresponds to the MCU one by one; The interlocking circuit is connected to the MCU corresponding to the interlocking circuit; Each group of the interlocking circuits is connected to the transmission circuit via the storage communication component; The transmission circuit is connected to the external storage chip; The MCU receiving the communication transmission data sends a high level signal to the interlock circuit corresponding to the MCU sending the communication transmission data according to the external storage usage information and the external storage read and write requirements; After the interlocking circuit corresponding to the MCU that sends communication transmission data receives the high-level signal, the communication between the storage communication component and the transmission circuit is connected, so that the MCU that sends communication transmission data performs read and write operations on the external storage chip through the interlocking circuit corresponding to the MCU that sends communication transmission data, the storage communication component and the transmission circuit.

5. The board-level MCU data interaction storage system according to claim 4, characterized in that: Also includes: Hardware protection components; The hardware protection component is connected to the external storage chip and is used for performing hardware protection on the external storage chip.

6. The board-level MCU data interaction storage system according to claim 5, characterized in that: The interlock circuit corresponding to the MCU sending the communication transmission data includes: a first transistor, a first resistor and a second resistor; The interlock circuit corresponding to the MCU receiving the communication transmission data includes: a second transistor, a third resistor and a fourth resistor; The transmission circuit comprises: a fifth resistor; The first pin of the MCU sending the communication transmission data is connected to the base of the first transistor through the first resistor; The collector of the first transistor is connected to the second pin of the MCU receiving the communication transmission data; The emitter of the first transistor is grounded through the second resistor; The first pin of the MCU receiving the communication transmission data is connected to the base of the second transistor through the third resistor; The collector of the second transistor is connected to the second pin of the MCU that transmits communication transmission data; The emitter of the second transistor is grounded through the fourth resistor; The emitter of the first transistor and the emitter of the second transistor are both connected to the fifth resistor through the storage communication component; The fifth resistor is connected to the external storage chip; After the MCU receiving the communication transmission data receives the external storage usage information and the external storage read and write requirements, the second pin of the MCU receiving the communication transmission data sends a high-level signal to the collector of the first transistor, so that the emitter of the first transistor outputs a high-level signal, thereby achieving communication conduction between the MCU sending the communication transmission data and the external storage chip; The MCU sending communication transmission data can perform read and write operations on the external storage chip through the emitter of the first transistor, the storage communication component and the fifth resistor.

7. The board-level MCU data interaction storage system according to claim 6, characterized in that: The hardware protection component includes: a sixth resistor, a seventh resistor, a third transistor and a fourth transistor; The collector of the third triode is connected to a power supply; The second pin of the MCU sending the communication transmission data is connected to the base of the third transistor through the sixth resistor; The emitter of the third triode is connected to the collector of the fourth triode; The second pin of the MCU receiving the communication transmission data is connected to the base of the fourth transistor through the seventh resistor; The emitter of the fourth transistor is connected to the external storage chip.

8. The board-level MCU data interaction storage system according to claim 4, characterized in that: Also includes: Inter-board communication components; The two MCUs are connected via the inter-board communication component.

9. The board-level MCU data interaction storage system according to claim 8, characterized in that: The inter-board communication component includes a UART communication component; the storage communication component includes: an I2C bus.

10. The board-level MCU data interaction storage system according to claim 2, characterized in that: The two MCUs include: an external interaction MCU and a special task MCU.

11. The board-level MCU data interaction storage system according to claim 10, characterized in that: If the MCU sending the communication transmission data is an external interaction MCU, and the MCU receiving the communication transmission data is a special task MCU, the work interaction information includes: the unit information data corresponding to the external interaction MCU, the current unit operation data, and the first program operation intermediate data; If the MCU sending the communication transmission data is a special task MCU, and the MCU receiving the communication transmission data is an external interaction MCU, the work interaction information includes: the special task running result corresponding to the special task MCU and the intermediate data of the second program running.

12. A board-level MCU data interaction storage method, applied to the board-level MCU data interaction storage system according to any one of claims 1 to 11, characterized in that: include: One of the MCUs sends communication transmission data to another of the MCUs; the communication transmission data includes external storage usage information and external storage read and write requirements; The MCU receiving the communication transmission data controls the read-write interlock transmission component to unlock according to the external storage usage information and the external storage read-write requirements, so as to enable the communication between the MCU sending the communication transmission data and the external storage chip; The MCU that sends communication transmission data performs read and write operations on the external storage chip through the read-write interlock transmission component according to the external storage usage information and the external storage read and write requirements.

13. The board-level MCU data interactive storage method according to claim 12, characterized in that: The communication transmission data also includes: work interaction information; The board-level MCU data interaction storage method further includes: The MCU receiving the communication transmission data updates the pre-stored historical communication transmission data according to the communication transmission data sent by the MCU sending the communication transmission data, and operates according to the work interaction information.

14. The board-level MCU data interactive storage method according to claim 13, characterized in that: The MCU sending the communication transmission data performs a read and write operation on the external storage chip through the read-write interlock transmission component according to the external storage usage information and the external storage read and write requirements, including: If the external storage read / write requirement indicates a write requirement, the MCU that sends the communication transmission data writes the work interaction information into the external storage chip through the read / write interlock transmission component, and updates the external storage usage information according to the write address of the work interaction information; If the external storage read / write requirement indicates a read requirement, the MCU sending the communication transmission data reads the target information corresponding to the external storage read / write requirement from the external storage chip through the read / write interlock transmission component according to the external storage usage information.

15. A controller, characterized in that: include: A control board and a board-level MCU data interaction storage system as described in any one of claims 1 to 11; The board-level MCU data interaction storage system is arranged on the control board.

16. An electrical device, characterized in that: include: A controller as claimed in claim 15.

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