Display panel, flexible display screen, electronic device, and method for manufacturing a display panel

Abstract

The present application provides a display panel, a flexible display screen, an electronic device and a method for preparing a display panel. The display panel includes a substrate, an electroluminescent layer and a packaging structure. Among them: the electroluminescent layer is arranged on one side of the substrate to realize the display function of the display panel. The packaging structure includes a packaging layer and a barrier, and the packaging layer and the barrier are arranged on the first side of the substrate; the display panel has a central component, and the barrier is arranged around the central component. The packaging layer covers the electroluminescent layer and the barrier, and the electroluminescent layer covers part of the surface of the barrier. The barrier includes at least two layers of unit structures, and the at least two layers of unit structures have two side surfaces facing and away from the central component, one of the two side surfaces is provided with at least two annular grooves, and one unit structure includes at least one annular groove. The display panel of the present application can prevent water and oxygen from entering the display area of ​​the display panel along the electroluminescent layer, which is conducive to improving the display reliability of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a display panel, a flexible display screen, an electronic device, and a method for manufacturing a display panel. Background Art

[0002] An organic light-emitting diode (OLED) display device has been listed as a next-generation display technology with great development prospects because of its advantages such as thinness, light weight, wide viewing angle, active emission, continuously adjustable emission color, low cost, fast response speed, low energy consumption, low driving voltage, wide operating temperature range, simple production process, high luminous efficiency, and flexible display.

[0003] OLED light-emitting devices are very sensitive to water vapor and oxygen. Water vapor and oxygen that penetrate into the interior of OLED light-emitting devices are the main factors affecting the lifespan of OLED light-emitting devices. Therefore, a packaging structure is mostly adopted to block water vapor and oxygen.

[0004] Currently, in a flexible active-matrix organic light-emitting diode (AMOLED) display screen, the method of opening vias in the active area (AA) for placing modules such as cameras has become one of the mainstream full-screen design solutions in the industry. However, opening vias in the AA area will cause the OLED light-emitting devices to be exposed on the sidewalls of the vias, and external water and oxygen can enter the AA area along the electroluminescent layer of the OLED light-emitting devices, causing black spots in the OLED light-emitting devices and affecting the display reliability of the display screen.

[0005] However, since each layer of the OLED light-emitting device except the emitting layer (EML), such as the hole transport layer (HTL), the electron transport layer (ETL), or the cathode, etc., uses a traditional mask method during evaporation coating, it cannot shield the via area. Therefore, how to form a packaging structure to avoid the exposure of OLED light-emitting devices on the sidewalls of the vias has become a difficult problem that needs to be solved urgently by those skilled in the art. Summary of the Invention

[0006] The technical solution of the present application provides a display panel, a flexible display screen, an electronic device, and a method for manufacturing a display panel to improve the packaging characteristics of the display panel.

[0007] In a first aspect, the technical solution of the present application provides a display panel, which may include a substrate, an electroluminescent layer and an encapsulation layer. The electroluminescent layer is arranged on the first side of the substrate, which can be used to realize the display function of the display panel. The encapsulation structure includes an encapsulation layer and a barrier portion, and the encapsulation layer and the barrier portion are arranged on the first side of the substrate. The display panel also has a central component, and when the barrier portion is specifically arranged, the barrier portion can be arranged around the central component. In addition, the barrier portion includes at least two layers of unit structures, and the two layers of unit structures have two side surfaces facing and away from the central component, and one of the two side surfaces is provided with at least two annular grooves, and in addition, a unit structure includes at least one annular groove. The electroluminescent layer covers a portion of the surface of the barrier portion, and the encapsulation layer covers the electroluminescent layer and the barrier portion to provide encapsulation protection therefor. The display panel of the embodiment of the present application is provided with a barrier portion, and the electroluminescent layer only covers a portion of the surface of the barrier portion to avoid exposure of the electroluminescent layer at the edge of the central component; in addition, the barrier portion can act as a water and oxygen barrier, thereby preventing water and oxygen from corroding and damaging the electroluminescent layer used to connect to the driving circuit, which is beneficial to improving the display reliability of the display panel, and can extend the service life of the display panel.

[0008] In a possible implementation, the central component on the display panel may be a through hole penetrating the encapsulation layer, and the through hole may be used to place devices such as a camera. In addition, when the central component is a through hole, the center line of the barrier portion may coincide with the center line of the through hole, so that the edge of the through hole is more beautiful and is conducive to realizing a narrow frame design of the edge of the through hole.

[0009] In a possible implementation, the display panel includes a display area and a non-display area, and the non-display area is arranged around the display area. In this implementation, the central part is the display area, so that the barrier portion can be located in the non-display area and arranged around the display area to prevent the electroluminescent layer from being exposed at the edge of the display area.

[0010] In a possible implementation, in addition to providing at least two annular grooves on one side of the at least two-layer unit structure, at least one annular groove may be provided on another side of the at least two-layer unit structure. Since the electroluminescent layer is not easily formed in the annular groove on the side of the barrier, by providing annular grooves on both sides of the barrier, the area of ​​the surface of the barrier covered by the electroluminescent layer can be reduced, so that the electroluminescent layer is effectively disconnected at the barrier, thereby effectively reducing the risk of the electroluminescent layer being damaged by water and oxygen.

[0011] In a possible implementation, each layer of the unit structure may include at least three stacked sub-layers. In this way, when an annular groove is provided on each layer of the unit structure, the annular groove may be formed between the three stacked sub-layers. By making the partition portion include at least two layers of unit structures, the water and oxygen barrier ability of each partition portion can be improved. On the basis of meeting the water and oxygen barrier requirements, the number of partition portions can be reduced, which is beneficial to narrowing the border on the periphery of the central component.

[0012] In a possible implementation, the partition portion may be provided on the same layer as the source and drain electrodes of the display area of the display panel, and the stacked structure included in each layer of the unit structure is the same as that of the source and drain electrodes.

[0013] Exemplarily, each layer of the unit structure may include a first titanium metal layer, an aluminum metal layer, and a second titanium metal layer sequentially arranged in a direction away from the substrate. Among them, the side wall of the annular groove is formed by the first titanium metal layer and the second titanium metal layer, and the bottom of the annular groove is formed by the aluminum metal layer.

[0014] In a possible implementation, when specifically setting the encapsulation layer, the encapsulation layer includes a first inorganic layer and a second inorganic layer. Among them, the second inorganic layer covers one side of the first inorganic layer, and the other side of the first inorganic layer faces the electroluminescent layer.

[0015] In addition, the first inorganic layer covers the side surface and the top surface of the partition portion, and the bottom surface of the partition portion opposite to the top surface of the partition portion faces the substrate. By making the encapsulation layer provided with the first inorganic layer and the second inorganic layer, and making the first inorganic layer cover the side surface and the top surface of the partition portion, it can achieve a good water and oxygen barrier effect, thereby realizing the effective encapsulation of the display panel.

[0016] In a possible implementation, the encapsulation layer further includes an organic layer, which is provided between the first inorganic layer and the second inorganic layer, and the organic layer is provided in the display area of the display panel. The water and oxygen isolation effect of the inorganic layer is good. Setting the organic layer between the two inorganic layers can make the encapsulation layer have a good water sample isolation effect and can be bent to a certain extent, thereby reducing the possibility of the encapsulation layer breaking and improving its encapsulation performance.

[0017] In a possible implementation, the display panel may further be provided with a dam, which is arranged around the central component. Among them, the height of the dam above the surface of the substrate is greater than the height of the partition portion above the surface of the substrate. In this way, when forming the organic layer, the organic layer material can be blocked by the dam to prevent it from overflowing, so that the organic layer is only formed on one side of the dam.

[0018] In addition, in the thickness direction of the display panel, the first inorganic layer covers the side and top surfaces of the dam, and the bottom surface of the dam opposite to the top surface of the dam faces the substrate. This can enable the encapsulation layer to achieve a better water and oxygen barrier effect at the dam, thereby realizing effective encapsulation of the display panel.

[0019] In a possible implementation, the partition portion can be set to at least two. In this case, the at least two partition portions can be, but are not limited to, divided into two groups, and the two groups of partition portions are respectively disposed on both sides of the dam.

[0020] In a possible implementation, the display panel can further include a planarization layer, which is disposed on the side of the dam away from the organic layer. Moreover, the surface of the second inorganic layer of the encapsulation structure that is farthest from the substrate can be flush with the surface of the planarization layer that is farthest from the substrate. This is beneficial for reducing stress concentration caused by unevenness in the area where the partition portion is provided during edge cutting, thereby improving the overall reliability of the display panel.

[0021] In a second aspect, the technical solution of the present application further provides a display panel. In the plane direction of the display panel, the display panel includes a central component, a dam area surrounding the central component. The dam area is provided with one or more dams. A first partition portion surrounding the central component is provided between the dam area and the central component, and a second partition portion is provided on the side of the dam area away from the central component; both the first partition portion and the second partition portion have two side surfaces facing the central component and away from the central component, and at least two annular grooves are provided on one of the two side surfaces. In the thickness direction of the display panel, the display panel includes a substrate, an insulating layer, an electroluminescent layer, and an encapsulation layer stacked in sequence. The first partition portion and the second partition portion also each include at least two stacked unit structures, and the at least two unit structures are located between the insulating layer and the encapsulation layer, wherein one unit structure includes at least one annular groove. By using the display panel of the embodiment of the present application, by providing the first partition portion and the second partition portion, the function of effectively blocking water and oxygen can be achieved, thereby avoiding erosion and damage of the electroluminescent layer used for connecting with the driving circuit by water and oxygen, which is beneficial for improving the display reliability of the display panel and can extend the service life of the display panel.

[0022] In a possible implementation, the central component on the display panel can be a through hole penetrating the encapsulation layer, and the through hole can be used to place devices such as a camera. In addition, when the central component is a through hole, the center line of the partition portion can be made to coincide with the center line of the through hole, so that the edge of the through hole is more beautiful and is beneficial for realizing a narrow border design of the edge of the through hole.

[0023] In a possible implementation, the display panel includes a display area and a non-display area, and the non-display area is disposed around the display area. In this implementation, the central component is the display area, so that the partition portion is located in the non-display area and is disposed around the display area to prevent the electro-luminescent layer from being exposed at the edge of the display area.

[0024] In a possible implementation, in addition to providing at least two annular grooves on one side of at least two-layer unit structures, at least one annular groove may also be provided on the other side of the at least two-layer unit structures. Since the electro-luminescent layer is not easily formed in the annular grooves on the side surface of the partition portion, by providing annular grooves on both side surfaces of the partition portion, the area of the electro-luminescent layer covering the surface of the partition portion can be reduced, so that the electro-luminescent layer is effectively disconnected at the partition portion, thereby effectively reducing the risk of damage to the electro-luminescent layer by water and oxygen.

[0025] In a possible implementation, each layer of unit structures may include at least three stacked sub-layers. In this way, when an annular groove is provided on each layer of unit structures, the annular groove can be formed between the three stacked sub-layers. By making the partition portion include at least two-layer unit structures, the water and oxygen barrier ability of each partition portion can be improved. On the basis of meeting the water and oxygen barrier requirements, the number of partition portions can be reduced, which is beneficial to narrowing the border on the peripheral side of the central component.

[0026] In a possible implementation, the first partition portion and / or the second partition portion may be provided on the same layer as the source and drain electrodes located in the display area of the display panel, and the stacked structure included in each layer of unit structures is the same as that of the source and drain electrodes.

[0027] Exemplarily, each layer of unit structures may include a first titanium metal layer, an aluminum metal layer, and a second titanium metal layer sequentially disposed in a direction away from the substrate. Among them, the side walls of the annular groove are formed by the first titanium metal layer and the second titanium metal layer, and the bottom of the annular groove is formed by the aluminum metal layer.

[0028] In a possible implementation, on one side of the dam area facing the display area of the display panel, the encapsulation layer includes a first organic layer, an organic layer, and a second organic layer. The organic layer is located between the first inorganic layer and the second inorganic layer, and the first inorganic layer covers the electro-luminescent layer. The inorganic layer has a good water and oxygen isolation effect. By disposing the organic layer between the two inorganic layers, on the basis of enabling the encapsulation layer to have a good water sample isolation effect, a certain degree of bending can occur, thereby reducing the possibility of the encapsulation layer breaking and improving its encapsulation performance.

[0029] In the thickness direction of the display panel, the dam may also be made higher than the partition portion. In this way, when the organic layer is formed, the dam can block the organic layer material to prevent it from overflowing, so that the organic layer is only formed on one side of the dam.

[0030] In addition, along the horizontal direction of the display panel, within the dam itself that is farthest from the central component and in the area extending towards the non-display area of the display panel, the encapsulation layer includes a first inorganic layer and a second inorganic layer. The second inorganic layer covers the electroluminescent layer, and the first organic layer covers the second inorganic layer. By setting the area of the encapsulation layer within the non-display area of the display panel as the stacked first inorganic layer and second inorganic layer, and making the second inorganic layer cover the electroluminescent layer, it can achieve a better water and oxygen barrier effect, thereby realizing the effective encapsulation of the display panel.

[0031] In a possible implementation, the electroluminescent layer covers partial surfaces of the first partition and the second partition, thereby preventing the electroluminescent layer from being exposed at the edge of the central component.

[0032] In a possible implementation, there are grooves between the adjacent first partition and the dam, and between the adjacent second partition and the dam. By providing grooves between the first partition and the dam, and between the second partition and the dam, it can be used to achieve the barrier effect of the first partition, the second partition, and the dam.

[0033] In a possible implementation, when there are multiple first partitions, there is a groove between two adjacent first partitions. In addition, a groove is provided on the side of the first partition that is farthest from the central component and faces away from the central component to enhance the barrier effect of the first partition.

[0034] Similarly, when there are multiple second partitions, there is a groove between two adjacent second partitions. By providing a groove between two adjacent partitions, the barrier effect of the first partition can be effectively enhanced.

[0035] In a third aspect, the technical solution of the present application also provides a flexible display screen, which includes a protective cover plate, a polarizer, a touch panel, and the display panel of the first aspect or the second aspect. Among them: the polarizer is fixed to the protective cover plate, and the touch panel is disposed between the polarizer and the display panel; or, the touch panel is fixed to the protective cover plate, and the polarizer is disposed between the touch panel and the display panel.

[0036] For the flexible display screen adopting the technical solution of the present application, since the electroluminescent layer of its display panel is disconnected at the partition, it can prevent the electroluminescent layer from being exposed at the edge of the central component, thereby avoiding the erosion and damage of the electroluminescent layer caused by water and oxygen, so as to realize the reliable display of the display panel. Therefore, the flexible display screen of the technical solution of the present application has better display reliability and a longer service life.

[0037] Fourth aspect, the technical solution of the present application further provides an electronic device, which includes a middle frame, a rear shell, a printed circuit board, and the flexible display screen of the second aspect, wherein: the middle frame is used to carry the printed circuit board and the flexible display screen, and the printed circuit board and the flexible display screen are located on both sides of the middle frame; the rear shell is located on the side of the printed circuit board away from the middle frame. The electronic device of the technical solution of the present application has relatively reliable display performance and a long service life.

[0038] Fifth aspect, the technical solution of the present application further provides a method for manufacturing a display panel, and the manufacturing method includes:

[0039] Prepare a substrate;

[0040] Form a first unit structure on the substrate, and perform patterning on the first unit structure to form a first annular structure;

[0041] Form a second unit structure on the first annular structure, and perform patterning on the second unit structure to form a second annular structure;

[0042] Perform lateral etching on two sides of the first annular structure to form a first annular groove; perform lateral etching on two sides of the second annular structure to form a second annular groove, thereby forming a partition;

[0043] Form an electroluminescent layer on the partition, and the electroluminescent layer covers part of the surfaces of the first annular structure and the second annular structure;

[0044] Form a packaging layer on the electroluminescent layer and the partition, and the packaging layer covers the electroluminescent layer, the first annular structure, and the second annular structure;

[0045] Form a through hole on the substrate, and the through hole is arranged in the area surrounded by the first annular structure or the second annular structure. It can be understood that at this time, the through hole penetrates the packaging layer.

[0046] For the display panel obtained by using the manufacturing method of the present technical solution, by forming a partition and disconnecting the electroluminescent layer at the partition, it is possible to prevent the electroluminescent layer from being exposed at the edge of the through hole. In addition, the partition can play a role in blocking water and oxygen, thereby preventing water and oxygen from eroding and damaging the electroluminescent layer used for connecting to the driving circuit, which is beneficial to improving the display reliability of the display panel and can extend the service life of the display panel.

[0047] In a possible implementation, the first unit structure may be a first source-drain layer structure, which may include a metal titanium layer, a metal aluminum layer, and a metal titanium layer sequentially deposited on a substrate. Lateral etching is performed on the side surface of the first annular structure to form a first annular groove, including: laterally etching the side surface of the metal aluminum layer so that the width of the metal aluminum layer is less than the width of the two metal titanium layers. So that the side walls of the first annular groove are formed by the two metal titanium layers, and the bottom wall of the annular groove is formed by the metal aluminum layer.

[0048] In addition, the second unit structure may be a second source-drain layer structure, which may also include a metal titanium layer, a metal aluminum layer, and a metal titanium layer sequentially deposited on a substrate. Lateral etching is performed on the side surface of the second annular structure to form a second annular groove, including: laterally etching the side surface of the metal aluminum layer so that the width of the metal aluminum layer is less than the width of the two metal titanium layers. So that the side walls of the second annular groove are formed by the two metal titanium layers, and the bottom wall of the annular groove is formed by the metal aluminum layer.

[0049] In a possible implementation, in addition to the above steps, the method for manufacturing a display panel may further include: forming a planarization layer on the encapsulation layer. The surface of the planarization layer farthest from the substrate is flush with the surface of the encapsulation layer farthest from the substrate. In this way, a planarization design of the surface of the display panel can be achieved, thereby reducing the risk of film layer breakage caused by stress concentration due to unevenness on the surface of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 Schematic structural diagram of an electronic device provided by an embodiment of the present application;

[0051] Figure 2 Schematic structural diagram of a display screen provided by an embodiment of the present application;

[0052] Figure 3 Schematic structural diagram of a display panel provided by an embodiment of the present application;

[0053] Figure 4 is Figure 3 A-A cross-sectional view of the display panel in ;

[0054] Figure 5 is Figure 4 Cross-sectional view of the partition shown in ;

[0055] Figure 6 Schematic structural diagram of a display panel provided by another embodiment of the present application;

[0056] Figure 7 Flowchart of the method for manufacturing a display panel according to an embodiment of the present application.

[0057] Reference Signs:

[0058] 1 - Display screen; 2 - Middle frame; 3 - Rear case; 4 - Printed circuit board; 41 - Components; 11 - Protection cover plate;

[0059] 12 - Polarizer; 13 - Touch panel; 14 - Display panel; 15 - Adhesive; 16 - Back glue; 141 - Display area;

[0060] 142 - Non - display area; 143 - Through - hole; 144 - Substrate; 1441 - Substrate; 1442 - Water - blocking layer; 1443 - Insulating layer;

[0061] 145 - Electroluminescent layer; 146 - Encapsulation structure; 1461 - Encapsulation layer; 1461a - First inorganic layer; 1461b - Organic layer;

[0062] 1461c Second inorganic layer; 1462 - Partition; 14621 - Annular groove; 14622 - Unit structure; 14622a - Titanium metal layer;

[0063] 14622b - Aluminum metal layer; 147 - Dam; 148 - Planarization layer; 149 - Groove. Detailed implementation manners

[0064] To facilitate understanding of the display panel provided in the embodiments of the present application, the application scenarios of the display panel provided in the embodiments of the present application will be described first below. The display panel can be disposed in electronic devices such as mobile phones, tablet computers, wearable devices, personal digital assistants (PDAs), etc. Referring to Figure 1 , the electronic device generally may include a display screen 1, a middle frame 2, a rear case 3, and a printed circuit board 4 (printed circuit board, PCB). Among them, the middle frame 2 can be used to carry the printed circuit board 4 and the display screen 1. The display screen 1 and the printed circuit board 4 are located on both sides of the middle frame 2, and the rear case 3 is located on the side of the printed circuit board 4 away from the middle frame 2. In addition, the electronic device may further include components 41 disposed on the PCB, and the components 41 may be disposed, but not limited to, on the side of the PCB facing the middle frame 2. Referring together to Figure 2, the display panel 14 provided in the embodiments of the present application is specifically disposed in the display screen 1 of the electronic device, and the display screen 1 can be a flexible display screen or a rigid display screen. Among them, the flexible display screen can be an OLED flexible display screen, or a quantum dot light emitting diode (QLED) flexible display screen, or an active-matrix organic light-emitting diode (AMOLED) flexible display screen. In the following embodiments of the present application, the display screen is taken as an AMOLED flexible display screen as an example for description, and the setting methods of other forms of display screens are similar.

[0065] Referring to Figure 2 , the display screen 1 of the embodiments of the present application may but is not limited to include a protective cover plate 11, a polarizer 12, a touch panel 13, and a display panel 14. Among them, when specifically setting the display screen 1, reference can be made to Figure 2 , the polarizer 12 is fixed to the protective cover plate 11, the touch panel 13 is disposed between the polarizer 12 and the display panel 14, and the protective cover plate 11 and the polarizer 12, the polarizer 12 and the touch panel 13, and the touch panel 13 and the display panel 14 can be bonded through an adhesive 15 such as an optically transparent adhesive or a transparent pressure-sensitive adhesive. A back glue 16 can also be coated on the side of the display panel 14 away from the touch panel 13. The back glue 16 is a composite film layer to play an electromagnetic shielding role, thereby avoiding signal interference between the display screen 1 and the printed circuit board 4 ( Figure 2 not shown in the figure, reference can be made to Figure 1 ). In addition, the back glue 16 can also play a role in protecting and supporting the entire display screen 1. In some other embodiments, the touch panel 13 can also be fixed to the protective cover plate 11, and then the polarizer 12 is disposed between the touch panel 13 and the display panel 14. The setting methods of other structures and the connection methods between the structures can refer to Figure 2 the embodiments shown in the figure and will not be elaborated here.

[0066] The protective cover plate 11 can be a transparent glass cover plate or a cover plate made of organic materials such as polyimide, etc., so as to reduce the influence on the display effect of the display screen while playing a protective role. The polarizer 12 can be but is not limited to a circular polarizer 12, which is used to reduce the contrast reduction caused by external light reflection. The touch panel 13 can be set separately or integrated with the display panel 14 into an integrated structure. In addition, a plurality of OLED light-emitting devices are provided on the display panel 14. Components such as water vapor and oxygen in the air have a great impact on the lifespan of the OLED light-emitting devices in the display panel 14. The reason is as follows: When the OLED light-emitting device works, electrons need to be injected from the cathode, which requires the cathode work function to be as low as possible. However, the cathode usually uses metal materials such as aluminum, magnesium, and calcium, and its chemical properties are relatively active, and it is extremely easy to react with the infiltrated water vapor and oxygen. In addition, water vapor and oxygen will also chemically react with the hole transport layer (HTL) and the electron transport layer (ETL) of the OLED light-emitting device, and these reactions will cause the failure of the OLED light-emitting device.

[0067] Referring to Figure 3 , an embodiment of the present application provides a display panel 14. The display panel 14 has a display area 141 and a non-display area 142. Among them, the non-display area 142 can be the edge area of the display panel 14, and the non-display area 142 is arranged around the display area 141. Then, external water and oxygen can enter the display panel 14 along the non-display area 141 and enter the display area 141 along Figure 4 the electroluminescent layer 145 shown in, so that the OLED light-emitting device generates black spots, affecting the display reliability of the display screen.

[0068] In addition, continuing to refer to Figure 3 , currently, in the AMOLED flexible display screen, the method of opening a through hole 143 in the display area 141 for placing modules such as cameras has become one of the mainstream full-screen design solutions in the industry. However, it can be referred to together Figure 3 and Figure 4 , opening a through hole 143 in the display area 141 will cause the OLED light-emitting device to be exposed on the side wall of the through hole 143, and external water and oxygen can enter the display area 141 along the electroluminescent layer 145 of the OLED light-emitting device, so that the OLED light-emitting device generates black spots, affecting the display reliability of the display screen.

[0069] The display panel 14 proposed in this application aims to solve the above problems, avoid the exposure of the OLED light-emitting device at the edge of the display area 141 or the edge of the through hole 143 of the display panel 14, so as to fully separate the OLED light-emitting device from components such as water vapor and oxygen in the atmosphere, thereby extending the life of the OLED light-emitting device and further extending the service life of the AMOLED display device. The following will combine with the drawings to detail the specific structure of the display panel 14 provided in the embodiments of this application.

[0070] In the embodiments of this application, the "upper" side of the display panel 14 refers to the side close to the user when the display panel 14 is in use. Refer to Figure 4 It can be seen that the display panel 14 may include a substrate 144, an electroluminescent layer 145 disposed on the substrate 144, and a packaging structure 146. Among them, the electroluminescent layer 145 is disposed on the first side of the substrate 144. Refer to Figure 1 and Figure 2 , and one side surface of the substrate 144 opposite to its first side can be fixed to the middle frame 2 through the back glue 16. It can be understood that, in addition to the above structure, the display panel 14 usually may also include thin film transistors (not shown in the figure) disposed between the substrate 144 and the electroluminescent layer 145, so that the electroluminescent layer 145 can be electrically connected to the thin film transistors to realize the display function of the display panel 14.

[0071] Continue to refer to Figure 4 , when specifically setting the packaging structure 146, the packaging structure 146 may include a packaging layer 1461 and a partition portion 1462. Among them, the partition portion 1462 is a convex structure arranged around the central component. It can be understood that, in the embodiments of this application, "around" means that the partition portion 1462 is arranged to surround the central component 360 degrees in the plane direction of the display panel, and the projection of the convex structure on the plane of the display panel is a closed shape with the head and tail connected. The closed shape can be, but is not limited to, regular figures such as circles, rectangles, and hexagons, and can also be other irregular figures.

[0072] In the embodiments of this application, by setting the partition portion 1462, a part of the surface of the partition portion 1462 can be covered by the electroluminescent layer 145, so that the electroluminescent layer 145 is disconnected at the partition portion 1462, so that the partition portion 1462 can play a role in blocking water and oxygen, avoiding the electroluminescent layer 145 from being eroded by water and oxygen. In addition, the packaging layer 1461 can be covered on the electroluminescent layer 145 and the partition portion 1462 to realize the packaging protection of the display panel 14.

[0073] Since the display panel 14 of the embodiments of this application is adopted and the partition portion 1462 can play a role in blocking water and oxygen, therefore, refer to Figure 3 and Figure 4, the entire display area 141 of the display panel 14 or the through hole 143 provided in the display area 141 can be used as the central component of the display panel 14, so as to avoid the erosion of the electro-luminescent layer 145 by water and oxygen by arranging the partition portion 1462 around the central component. Also, whether the partition portion 1462 is arranged around the entire display area 141 or around the through hole 143, the arrangement methods are similar. First, the arrangement of the partition portion 1462 around the through hole 143 will be described below.

[0074] In a possible embodiment of the present application, when the partition portion 1462 is arranged around the through hole 143, the center line of the partition portion 1462 can but is not limited to coincide with the center line of the through hole 143. When specifically arranging the partition portion 1462, reference can be made to Figure 5 , the partition portion 1462 has a side surface facing the through hole 143 ( Figure 5 the X direction in Figure 5 ), and a side surface facing away from the through hole 143 ( Figure 5 the -X direction in Figure 5 ). At least two annular grooves 14621 are provided on one of these two side surfaces. Exemplarily, annular grooves 14621 are only provided on the surface of the partition portion 1462 facing the through hole 143, and the number of the annular grooves 14621 is two, three or more. Or, annular grooves 14621 are provided on the surface of the partition portion 1462 facing away from the through hole 143, and the number of the annular grooves 14621 is two, three or more.

[0075] Since generally, the electro-luminescent layer 145 can be formed by evaporation, it may be formed on the upper surface of the partition portion 1462, the side surface of the partition portion 1462 close to or away from the through hole, or the bottom of the annular groove 14621. By providing at least two annular grooves 14621 on one side surface of the partition portion 1462, during the formation of the electro-luminescent layer 145, the substances for forming the electro-luminescent layer 145 entering the interior of each annular groove 14621 can be reduced, so that the formed electro-luminescent layer 145 only covers a part of the surface of the partition portion 1462, and the electro-luminescent layer 145 is disconnected at the partition portion 1462.

[0076] It can be understood that the electroluminescent layer 145 located on the side of the partition portion 1462 away from the through hole 143 can be connected to the driving circuit to emit light, so as to realize the display of the display panel 14; while the electroluminescent layer 145 formed on the partition portion 1462 and between the partition portion 1462 and the through hole 143 is disconnected from the driving circuit and is not used for the display of the display panel 14. Therefore, by adopting the display panel 14 of the embodiment of the present application, it is possible to effectively prevent the electroluminescent layer 145 used to realize the display function of the display panel 14 from being exposed at the through hole 143, thereby avoiding the display failure of the display panel 14 caused by components such as water vapor or oxygen entering the through hole 143, and extending the service life of the display panel 14.

[0077] In some other embodiments of the present application, in order to effectively disconnect the electroluminescent layer 145 at the partition portion 1462, referring to Figure 5 , annular grooves 14621 can be provided on both the side of the partition portion 1462 facing and away from the through hole 143, and at least two annular grooves 14621 can be provided on one side, and at least one annular groove 14621 can be provided on the other side. In this way, the depth of each annular groove 14621 can be designed to be relatively small, which is conducive to the encapsulation layer 1461 filling the annular grooves 14621 of the isolation posts, so as to effectively improve the film forming quality of the encapsulation layer 1461 covering the isolation posts and improve the encapsulation protection effect. In this embodiment, when setting the annular grooves 14621 on the two sides of the partition portion 1462, the number of annular grooves 14621 on the two sides of the partition portion 1462 facing and away from the through hole 143 can be the same or different. For example, when the number of annular grooves 14621 on both sides is the same, the number of annular grooves 14621 on each side can be two, three or more; or when the number of annular grooves 14621 on both sides is different, the number of annular grooves 14621 on one side can be one, two, three or more, and the number of annular grooves 14621 on the other side can be two, three or more.

[0078] In some embodiments of the present application, continuing to refer to Figure 5 , the partition portion 1462 may include at least two layers of unit structures 14622, and the at least two layers of unit structures 14622 have two sides facing and away from the through hole, and at least two annular grooves 14621 are provided on one of the two sides, wherein each layer of unit structure 14622 includes at least one annular groove 14621.

[0079] In addition, referring to Figure 5, each unit structure 14622 of each layer may include three sub-layers, so that the annular groove 14621 can be arranged between the three sub-layers. In a possible embodiment of the present application, when the partition portion 1462 is arranged on the substrate 144, the partition portion 1462 may be arranged on the same layer as other structures of the display panel 14, so that through one-time metal layer deposition and mask process, the patterns of other structures and the partition portion 1462 can be formed simultaneously. Exemplarily, the partition portion 1462 may be arranged on the same layer as the source and drain electrodes in the display area of the display panel, so that the stacked structure of each unit structure 14622 of the partition portion 1462 is the same as the stacked structure of the source and drain electrodes, so as to form the pattern of the partition portion 1462 around the through hole 143 of the display panel 14 while forming the source and drain electrode patterns. By arranging the partition portion 1462 on the same layer as the source and drain electrodes, convenience can be provided for the manufacture of the partition portion 1462, thereby effectively reducing the processing cost.

[0080] In addition, the metal layer used to form the source and drain electrode patterns is usually a layer structure formed by sequentially depositing metal titanium, metal aluminum, and metal titanium. Therefore, when the partition portion 1462 is arranged on the same layer as the source and drain electrodes, the partition portion 1462 can also be formed by a layer structure formed by sequentially depositing metal titanium, metal aluminum, and metal titanium. In order to form the annular groove 14621 on the partition portion 1462, the width of the metal aluminum layer 14622b can be made smaller than the metal titanium layers 14622a on both sides of the metal aluminum layer 14622b, so that the metal aluminum layer 14622b forms the bottom wall of the annular groove 14621, and at the same time, the two metal titanium layers 14622a respectively form a side wall of the annular groove 14621.

[0081] In some other embodiments of the present application, the partition portion 1462 can be obtained by superimposing two source and drain electrode layer structures, and the width of the metal aluminum layer 14622b of each source and drain electrode layer is made smaller than the metal titanium layers 14622a on both sides of the metal aluminum layer 14622b. Through reasonable setting, two annular grooves 14621 can be formed on both the side of the partition portion 1462 facing and away from the through hole 143. It can be understood that the number of annular grooves 14621 on the partition portion 1462 and the height of the partition portion 1462 can also be increased by continuously increasing the sequentially stacked metal titanium layers 14622a, metal aluminum layers 14622b, and metal titanium layers 14622a on the partition portion 1462, thereby effectively improving the water and oxygen barrier ability of each partition portion 1462. In addition, after the height of the partition portion 1462 is increased, the number of partition portions 1462 can be correspondingly reduced, which is beneficial to narrowing the border on the periphery of the through hole 143.

[0082] In some other embodiments of the present application, the partition portion 1462 can also be formed separately through processes such as metal deposition and etching, so that its setting method and its setting position on the substrate 144 are more flexible.

[0083] Continuing to refer to Figure 4 When specifically setting the encapsulation layer 1461, the encapsulation layer 1461 can be, but is not limited to, thin film encapsulation (TFE). The encapsulation layer 1461 can include a first inorganic layer 1461a, an organic layer 1461b, and a second inorganic layer 1461c. Among them, the second inorganic layer 1461c covers one side of the first inorganic layer 1461a, and the other side of the second inorganic layer 1461c faces the electroluminescent layer 145. In the embodiments of the present application, the second inorganic layer 1461c covering the first inorganic layer 1461a includes the second inorganic layer 1461c directly covering the first inorganic layer 1461a and the second inorganic layer 1461c indirectly covering the first inorganic layer 1461a. Among them, the second inorganic layer 1461c directly covering the first inorganic layer 1461a means that the second inorganic layer 1461c is in direct contact with the first inorganic layer 1461a, which can play a better water-blocking role. In addition, the second inorganic layer 1461c indirectly covering the first inorganic layer 1461a means that there are other layer structures between the second inorganic layer 1461c and the first inorganic layer 1461a.

[0084] In addition, the first inorganic layer 1461a can also cover all surfaces of the partition portion 1462, including the top surface, the side surfaces facing and away from the through hole, and the bottom surface of the annular groove 14621. In the embodiments of the present application, the bottom surface of the partition portion 1462 opposite to the top surface of the partition portion 1462 faces the substrate.

[0085] The organic layer 1461b is disposed between the first inorganic layer 1461a and the second inorganic layer 1461c, and the first inorganic layer 1461a is disposed between the second inorganic layer 1461c and the substrate 144. It can be understood that the inorganic layer has a good water and oxygen isolation effect. Disposing the organic layer 1461b between the two inorganic layers can, on the basis of enabling the encapsulation layer 1461 to have a good water and oxygen isolation effect, make the organic layer play a role in particle coverage, planarization, and stress release, thereby reducing the possibility of the encapsulation layer 1461 breaking and improving its encapsulation performance.

[0086] In some embodiments of the present application, referring to Figure 4 in the plane direction of the display panel 14, a dam area can also be provided on the display panel 14, and the dam area surrounds the through hole 143. One or more dams 147 are provided in the dam area. Exemplarily, the number of dams 147 can be one, two, three, or more.

[0087] Among them, the dam 147 can also be disposed on the same layer as the layer structure of the display panel. Exemplarily, the dam 147 can be disposed on the same layer as the planarization layer, pixel definition layer, or mask plate support layer of the display area of the display panel. In addition, the height of the dam 147 above the surface of the substrate 144 can be made greater than the height of the partition portion 1462 above the surface of the substrate 144, so that when forming the organic layer 1461b of the encapsulation layer 1461 in the display area 141 of the display panel 14 (refer to Figure 3 ), the dam 147 can block it to prevent the overflow of the organic layer 1461b material and make its processing process easy to control. It can be understood that the more the number of dams 147, the more reliable the blocking effect can be achieved. In addition, in this embodiment, along the thickness direction of the display panel 14 (the stacking direction of the layer structure of the display panel 14), the first inorganic layer 1461a of the encapsulation layer 1461 can also cover the side surface and the top surface of the dam 147, and the bottom surface of the dam 147 opposite to the top surface of the dam 147 faces the substrate 144.

[0088] In addition, when the dam 147 is provided on the display panel 14, if the partition portion 1462 has two or more, the partition portion 1462 can be divided into a first partition portion and a second partition portion. Among them, the first partition portion is disposed in the area between the dam area and the through hole (the non-display area of the display panel 14), and the second partition portion is disposed in the area on the side of the dam area away from the through hole (the display area of the display panel 14). It can be understood that the specific structures of the first partition portion and the second partition portion can be set with reference to the partition portion 1462 in the above embodiment, and will not be elaborated here.

[0089] In this embodiment, along the horizontal direction of the display panel 14, on the side of the dam area facing the display area of the display panel 14, the encapsulation layer 1461 includes a first inorganic layer 1461a, an organic layer 1461b, and a second inorganic layer 1461c. The organic layer 1461b is located between the first inorganic layer 1461a and the second inorganic layer 1461c, and the first inorganic layer 1461a covers the electroluminescent layer 145; in the dam itself farthest from the through hole and the area extending toward the through hole (the non-display area of the display panel), the encapsulation layer 1461 includes a first inorganic layer 1461a and a second inorganic layer 1461c. The second inorganic layer 1461c covers the electroluminescent layer 145, and the first inorganic layer 1461a covers the second inorganic layer 1461c. At this time, the first partition portion is covered by the first inorganic layer 1461a and the second inorganic layer 1461c of the encapsulation layer 1461, and the second partition portion is covered by the encapsulation layer 1461 formed by the first inorganic layer 1461a, the organic layer 1461b, and the second inorganic layer 1461c.

[0090] In some embodiments, reference can be made to Figure 4, along the horizontal direction of the display panel 14, there are grooves 149 between adjacent first barrier portions and the dam 147, and between adjacent second barrier portions and the dam 147. By providing the grooves 149 between the first barrier portion and the dam 147, and between the second barrier portion and the dam 147, the blocking effects of the first barrier portion, the second barrier portion, and the dam 147 can be achieved.

[0091] When there are multiple first barrier portions, there is a groove 149 between two adjacent first barrier portions. In addition, a groove 149 is provided on the side of the first barrier portion farthest from the through hole and facing away from the through hole to enhance the blocking effect of the first barrier portion.

[0092] Similarly, when there are multiple second barrier portions, there is a groove 149 between two adjacent second barrier portions. By providing the groove 149 between two adjacent barrier portions, the blocking effect of the first barrier portion can be effectively enhanced.

[0093] Continue to refer to Figure 4 , when specifically setting the substrate 144, the substrate 144 may include a stacked substrate 1441, a water blocking layer 1442, and an insulating layer 1443. Among them, the water blocking layer 1442 is disposed between the substrate 1441 and the insulating layer 1443, and the insulating layer 1443 is disposed between the electroluminescent layer 145 and the water blocking layer 1442. The water blocking layer 1442 may be, but is not limited to, an inorganic water blocking layer 1442 to prevent water vapor from entering the display panel 14 from the substrate 144 side. In addition, the insulating layer 1443 may be, for example, an inorganic insulating layer 1443. At this time, the barrier portion 1462 may be disposed between the insulating layer 1443 and the encapsulation layer 1461, and pattern regions for forming the electroluminescent layer 145 and the barrier portion 1462 may be formed on the insulating layer 1443, and the electroluminescent layer 145 and the barrier portion 1462 may be disposed in the corresponding pattern regions.

[0094] Refer to Figure 6 , in some other embodiments of the present application, the display panel 14 may further be provided with a planarization layer 148. The planarization layer 148 is disposed on the side of the encapsulation layer 1461 away from the substrate 144, and the planarization layer 148 may cover part or all of the encapsulation layer 1461 to achieve a planarization design of the surface of the display panel 14, thereby reducing the risk of film layer breakage caused by stress concentration due to unevenness on the surface of the display panel 14.

[0095] Continue to refer to Figure 6, when the dam 147 is provided on the display panel 14, the planarization layer 148 can be provided in the area between the dam area and the edge of the through hole 143, and this area is also the non-display area of the display panel 14. At this time, the surface of the planarization layer 148 that is farthest from the substrate 144 can be flush with the surface of the encapsulation layer 1461 away from the substrate 144, which is beneficial to reducing the stress concentration caused by the unevenness of the area where the partition portion 1462 is provided during edge cutting, thereby improving the overall reliability of the display panel 14.

[0096] In some embodiments of the present application, reference may be made to Figure 3 , when the partition portion 1462 is provided around the entire display area 141 of the display panel 14, the partition portion 1462 can be provided in the non-display area 142 surrounding the display area 141. In this embodiment, the specific setting method of the partition portion 1462 is the same as that of Figure 4 and Figure 5 In the embodiment where the partition portion 1462 is provided around the through hole 143, the specific setting method of the partition portion 1462 is similar, and will not be elaborated here.

[0097] In addition, when the partition portion 1462 is provided around the entire display area 141, in the plane direction of the display panel 14, a dam area can also be provided on the display panel 14, and this dam area surrounds the entire display area 141. One or more dams 147 are provided in the dam area. Exemplarily, the number of dams 147 can be one, two, three or more.

[0098] Among them, the dam 147 can also be provided on the same layer as the layer structure of the display panel. Exemplarily, the dam 147 can be provided on the same layer as the planarization layer, pixel definition layer or mask plate support layer of the display area of the display panel. In addition, the height of the dam 147 above the surface of the substrate 144 can be made greater than the height of the partition portion 1462 above the surface of the substrate 144, so that when the organic layer 1461b of the encapsulation layer 1461 is formed in the display area 141 of the display panel 14 (reference can be made to Figure 3 ), the dam 147 can block it to avoid the overflow of the material of the organic layer 1461b and make its processing process easy to control. It can be understood that the more the number of dams 147, the more reliable the blocking effect can be achieved. In addition, in this embodiment, along the thickness direction of the display panel 14 (the stacking direction of the layer structure of the display panel 14), the first inorganic layer 1461a of the encapsulation layer 1461 can also cover the side surface and the top surface of the dam 147, and the bottom surface of the dam 147 opposite to the top surface of the dam 147 faces the substrate 144.

[0099] In addition, when the dam 147 is provided on the display panel 14, if the partition part 1462 has two or more, the partition part 1462 can be divided into a first partition part and a second partition part. Among them, the first partition part is arranged in the area between the dam area and the through hole (the non-display area of the display panel 14), and the second partition part is arranged in the area on the side of the dam area away from the through hole (the display area of the display panel 14). It can be understood that the specific structures of the first partition part and the second partition part can be set with reference to the partition part 1462 in the above embodiments, and will not be elaborated here.

[0100] In this embodiment, along the horizontal direction of the display panel 14, on the side of the dam area facing the display area of the display panel 14, the encapsulation layer 1461 includes a first inorganic layer 1461a, an organic layer 1461b, and a second inorganic layer 1461c. The organic layer 1461b is located between the first inorganic layer 1461a and the second inorganic layer 1461c, and the first inorganic layer 1461a covers the electroluminescent layer 145; in the dam itself that is farthest from the through hole and the area extending toward the through hole (the non-display area of the display panel), the encapsulation layer 1461 includes the first inorganic layer 1461a and the second inorganic layer 1461c. The second inorganic layer 1461c covers the electroluminescent layer 145, and the first inorganic layer 1461a covers the second inorganic layer 1461c. At this time, the first partition part is covered by the first inorganic layer 1461a and the second inorganic layer 1461c of the encapsulation layer 1461, and the second partition part is covered by the encapsulation layer 1461 formed by the first inorganic layer 1461a, the organic layer 1461b, and the second inorganic layer 1461c.

[0101] In some embodiments, along the horizontal direction of the display panel 14, there are grooves 149 between the adjacent first partition part and the dam 147, and between the adjacent second partition part and the dam 147. By providing the grooves 149 between the first partition part and the dam 147, and between the second partition part and the dam 147, it can be used to achieve the blocking effect of the first partition part, the second partition part, and the dam 147.

[0102] When there are multiple first partition parts, there are grooves 149 between two adjacent first partition parts. In addition, a groove 149 is provided on the side of the first partition part farthest from the through hole facing away from the through hole to improve the blocking effect of the first partition part.

[0103] Similarly, when there are multiple second partition parts, there are grooves 149 between two adjacent second partition parts. By providing the grooves 149 between two adjacent partition parts, the blocking effect of the first partition part can be effectively improved.

[0104] It is worth mentioning that, as Figure 4As shown, when the planarization layer 148 is provided on the display panel 14, the planarization layer 148 can also be provided in the non-display area 142 provided around the display area 141. Specifically, it can be provided on the side of the dam 147 away from the display area 141, and the surface of the planarization layer 148 on this side that is farthest from the substrate 144 is flush with the surface of the encapsulation layer 1461 away from the substrate 144, which is beneficial to reducing the stress concentration caused by the unevenness of the area provided with the partition portion 1462 during edge cutting, thereby improving the overall reliability of the display panel 14.

[0105] It can be understood that in some embodiments of the present application, when the display panel 14 has a through hole 143, partition portions 1462 can also be provided around both the display area 141 and the through hole 143 at the same time, so as to achieve effective encapsulation of the display panel 14 and improve the water and oxygen barrier ability of the display panel 14.

[0106] To further understand the display panel 14 of the embodiments of the present application, refer to Figures 4 to 6 , next, taking the through hole 143 as the central component of the display panel 14 as an example, the manufacturing method of the display panel 14 will be introduced. Refer to Figure 7 , Figure 7 is the flowchart of the manufacturing method of the display panel of the embodiments of the present application, and the manufacturing method includes:

[0107] Step 001: Prepare the substrate 144;

[0108] Step 002: Form a first unit structure on the substrate 144, and perform patterning on the first unit structure to form a first annular structure;

[0109] Step 003: Form a second unit structure on the first annular structure, and perform patterning on the second unit structure to form a second annular structure;

[0110] Step 004: Perform lateral etching on the side surface of the first annular structure to form a first annular groove; perform lateral etching on the side surface of the second annular structure to form a second annular groove, thereby forming the partition portion 1462;

[0111] It can be understood that the first annular structure and the second annular structure can both be obtained by, but are not limited to, dry etching methods. In addition, the first annular groove can be formed on one side surface of the first annular structure, or formed on both side surfaces of the first annular structure at the same time. The second annular groove can be formed on one side surface of the second annular structure, or formed on both side surfaces of the second annular structure. When forming the first annular groove and the second annular groove, they can be obtained by, but are not limited to, wet etching methods, so as to better achieve the effect of lateral etching.

[0112] In addition, after the partition portion 1462 is formed, a wet etching method can be used to optimize its shape to obtain a partition portion 1462 with a shape that meets the requirements.

[0113] Step 005: An electroluminescent layer 145 is formed on the partition portion 1462. The electroluminescent layer 145 is usually formed by evaporation. During the formation of the electroluminescent layer 145, since the first annular groove and the second annular groove are provided on the partition portion 1462, it can prevent the substances used to form the electroluminescent layer 145 from entering the first annular groove and the second annular groove, so that the electroluminescent layer 145 only covers partial surfaces of the first annular structure and the second annular structure of the partition portion 1462, causing the electroluminescent layer 145 to be disconnected at the partition portion 1462.

[0114] Step 006: A packaging layer 1461 is formed on the electroluminescent layer 145 and the partition portion 1462. The packaging layer 1461 may include a first inorganic layer 1461a, an organic layer 1461b, and a second inorganic layer 1461c. Among them, the first inorganic layer 1461a covers the surfaces of the electroluminescent layer 145 and the partition portion 1462, and the organic layer 1461b is disposed between the first inorganic layer 1461a and the second inorganic layer 1461c. It can be understood that the inorganic layer has a good water and oxygen isolation effect. Disposing the organic layer 1461b between two inorganic layers can, on the basis of enabling the packaging layer 1461 to have a good water isolation effect, make the organic layer play a role in particle covering, planarization, and stress release, thereby reducing the possibility of the packaging layer 1461 breaking and improving its packaging performance.

[0115] Step 007: A through hole 143 is formed in the substrate 144 by means of femtosecond laser cutting or the like. The through hole 143 is disposed within the area surrounded by the first annular structure or the second annular structure. It can be understood that at this time, the through hole 143 penetrates the packaging layer 1461.

[0116] In some embodiments of the present application, after the second annular structure is formed on the substrate 144 and before the electroluminescent layer 145 is formed, a dam 147 can be formed on the substrate 144 through steps such as material deposition and etching. At this time, if there are two or more partition portions 1462, the partition portions 1462 can be disposed on both sides of the dam 147.

[0117] When forming the encapsulation layer 1461, first, a first inorganic layer 1461a forming the encapsulation layer 1461 is deposited, and the first inorganic layer 1461a covers the electroluminescent layer 145, the dam 147, and the partition 1462. Secondly, an organic layer 1461b of the encapsulation layer 1461 is formed by inkjet printing or the like. During this process, the dam 147 can block the material of the organic layer 1461b to prevent it from overflowing. Finally, a second inorganic layer 1461c of the encapsulation layer 1461 is deposited. It can be understood that after the encapsulation layer 1461 is formed, the partition 1462 between the dam 147 and the through hole 143 is covered by the first inorganic layer 1461a and the second inorganic layer 1461c of the encapsulation layer 1461, and the partition 1462 provided on the side of the dam 147 away from the through hole 143 is covered by the encapsulation layer 1461 formed by the first inorganic layer 1461a, the organic layer 1461b, and the second inorganic layer 1461c.

[0118] In addition, in a possible embodiment of the present application, reference may be made to Figure 5 , the first unit structure may be a first source-drain layer structure. The first source-drain metal layer structure may include a metal titanium layer 14622a, a metal aluminum layer 14622b, and a metal titanium layer 14622a sequentially deposited on the substrate. Lateral etching is performed on the side surface of the first annular structure to form a first annular groove, including: laterally etching the side surface of the metal aluminum layer 14622b so that the width of the metal aluminum layer 14622b is smaller than the width of the two metal titanium layers 14622a. So that the side wall of the first annular groove is formed by the two metal titanium layers 14622a, and the bottom wall of the first annular groove is formed by the metal aluminum layer 14622b.

[0119] Similarly, the second unit structure may be a second source-drain layer structure. Referring to Figure 5 , the second source-drain layer structure may also include a metal titanium layer 14622a, a metal aluminum layer 14622b, and a metal titanium layer 14622a sequentially deposited on the substrate. Lateral etching is performed on the side surface of the second annular structure to form a second annular groove, including: laterally etching the side surface of the metal aluminum layer 14622b so that the width of the metal aluminum layer 14622b is smaller than the width of the two metal titanium layers 14622a. So that the side wall of the second annular groove is formed by the two metal titanium layers 14622a, and the bottom wall of the second annular groove is formed by the metal aluminum layer 14622b.

[0120] In addition to the above steps, in some embodiments of the present application, the method for manufacturing the display panel 14 may further include: forming a planarization layer 148 on the encapsulation layer 1461. The surface of the planarization layer 148 that is farthest from the substrate 144 is flush with the surface of the encapsulation layer 1461 that is farthest from the substrate 144. In this way, a planarization design of the surface of the display panel 14 can be achieved, thereby reducing the risk of film layer breakage caused by stress concentration due to the unevenness of the surface of the display panel 14.

[0121] The above method for manufacturing the display panel 14 only introduces the case where the partition portion 1462 has two unit structures. In some other embodiments of the present application, a third annular structure may be further formed on the second annular structure of the partition portion 1462, and a third annular groove may be formed on the side surface of the third annular structure to increase the height of the partition portion 1462 and the number of the annular grooves 14621, thereby facilitating the improvement of the water and oxygen barrier effect of the partition portion 1462. On the basis that the water and oxygen barrier effect of the partition portion 1462 meets the requirements, the number of the partition portions 1462 can be appropriately reduced to simplify its processing technology. It can be understood that the number of the annular grooves 14621 on the partition portion 1462 and the height of the partition portion 1462 can also be increased by continuously adding stacked annular structures on the partition portion 1462, such as a fourth annular structure, a fifth annular structure, etc., so as to effectively improve the water and oxygen barrier ability of each partition portion 1462.

[0122] In addition, in a possible embodiment of the present application, the partition portion 1462 can also be formed separately by processes such as metal deposition and etching, so that its setting method and its setting position on the substrate 144 are more flexible.

[0123] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of changes or substitutions, which should all be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A display panel, It is characterized in that The invention comprises a substrate, an electroluminescent layer and a packaging structure, wherein: The electroluminescent layer is disposed on the first side of the substrate; The packaging structure comprises a packaging layer and a barrier portion, wherein the packaging layer and the barrier portion are arranged on a first side of the substrate; The display panel has a central component, the barrier portion is arranged around the central component, and the barrier portion includes at least two layers of unit structure; the encapsulation layer covers the electroluminescent layer and the barrier portion, and the electroluminescent layer covers a part of the surface of the barrier portion; The at least two layers of unit structures have two side surfaces facing toward and away from the central component, one of the two side surfaces is provided with at least two annular grooves, wherein each layer of the unit structures includes at least one annular groove.

2. The display panel according to claim 1, It is characterized in that The other side surface of the two side surfaces is provided with at least one annular groove.

3. The display panel according to claim 1 or 2, It is characterized in that The central component is a through hole, and the through hole penetrates the packaging layer.

4. The display panel according to claim 3, It is characterized in that The center line of the blocking portion coincides with the center line of the through hole.

5. The display panel according to claim 1 or 2, It is characterized in that The display panel includes a display area and a non-display area, the non-display area surrounds the display area, and the central component is the display area; wherein the barrier portion is located in the non-display area.

6. The display panel according to claim 1 or 2, It is characterized in that Each layer of the unit structure includes at least three stacked sub-layers.

7. The display panel according to claim 6, It is characterized in that The barrier portion is arranged in the same layer as the source and drain electrodes located in the display area of ​​the display panel, and the unit structure of each layer is the same as the stacked structure included in the source and drain electrodes.

8. The display panel according to claim 6, It is characterized in that Each layer of the unit structure includes a first metal titanium layer, a metal aluminum layer and a second metal titanium layer arranged in sequence away from the substrate, the sidewall of the annular groove is formed by the first metal titanium layer and the second metal titanium layer, and the bottom of the annular groove is formed by the metal aluminum layer.

9. The display panel according to claim 1, It is characterized in that The encapsulation layer includes a first inorganic layer and a second inorganic layer, wherein the second inorganic layer covers one side of the first inorganic layer, and the other side of the first inorganic layer faces the electroluminescent layer.

10. The display panel according to claim 9, It is characterized in that The first inorganic layer covers the side surfaces and the top surface of the barrier portion, wherein the bottom surface of the barrier portion opposite to the top surface of the barrier portion faces the substrate.

11. The display panel according to claim 9, It is characterized in that The display panel is further provided with a dam, the dam is arranged around the central component, a height of the dam above a surface of the substrate is greater than a height of the partition portion above the surface of the substrate, and in a thickness direction of the display panel, the first inorganic layer covers a side surface and a top surface of the dam, wherein a bottom surface of the dam opposite to the top surface of the dam faces the substrate.

12. The display panel according to claim 11, wherein, the encapsulation layer further includes an organic layer, the organic layer is arranged between the first inorganic layer and the second inorganic layer, and the organic layer is arranged in a display area of the display panel.

13. The display panel according to claim 11, wherein, the partition portion is at least two, and the at least two partition portions are respectively arranged on two sides of the dam.

14. The display panel according to claim 12 or 13, wherein, the display panel further includes a planarization layer, the planarization layer is arranged on a side of the dam away from the organic layer; a surface of the second inorganic layer farthest from the substrate is flush with a surface of the planarization layer farthest from the substrate.

15. A display panel, wherein, in a plane direction of the display panel, the display panel includes a central component and a dam area surrounding the central component, the dam area is provided with one or more dams, a first partition portion surrounding the central component is arranged between the dam area and the central component, and a second partition portion is arranged on a side of the dam area away from the central component; both the first partition portion and the second partition portion have two side surfaces facing the central component and away from the central component, and at least two annular grooves are formed in one of the two side surfaces; in a thickness direction of the display panel, the display panel includes a substrate, an electroluminescent layer and an encapsulation layer stacked in sequence, the substrate includes an insulating layer; both the first partition portion and the second partition portion further include at least two stacked unit structures, the at least two unit structures are located between the insulating layer and the encapsulation layer, and each of the unit structures includes at least one of the annular grooves.

16. The display panel according to claim 15, wherein, at least one annular groove is formed in the other side surface of the two side surfaces.

17. The display panel according to claim 15 or 16, wherein, the central component is a through hole, and the through hole penetrates through the encapsulation layer.

18. The display panel according to claim 15 or 16, wherein, the central component is a display area of the display panel.

19. The display panel according to claim 15 or 16, wherein, each of the unit structures includes at least three stacked sub-layers.

20. The display panel according to claim 15 or 16, wherein, the first partition portion and / or the second partition portion are / is arranged on the same layer as source-drain electrodes located in a display area of the display panel, and each of the unit structures has the same stacked structure as that of the source-drain electrodes.

21. The display panel according to claim 20, It is characterized in that each layer of the unit structure includes a first titanium layer, an aluminum layer, and a second titanium layer arranged in sequence away from the substrate. The side wall of the annular groove is formed by the first titanium layer and the second titanium layer, and the bottom of the annular groove is formed by the aluminum layer.

22. The display panel according to claim 15 or 16, It is characterized in that along the horizontal direction of the display panel, on one side of the dam area facing the display area of the display panel, the encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer. The organic layer is located between the first inorganic layer and the second inorganic layer, and the first inorganic layer covers the electroluminescent layer.

23. The display panel according to claim 15 or 16, It is characterized in that along the horizontal direction of the display panel, in the dam itself that is farthest from the central component and in the area extending towards the non-display area of the display panel, the encapsulation layer includes a first inorganic layer and a second inorganic layer. The second inorganic layer covers the electroluminescent layer, and the first inorganic layer covers the second inorganic layer.

24. The display panel according to claim 15 or 16, It is characterized in that the electroluminescent layer covers part of the surfaces of the first partition and the second partition.

25. The display panel according to claim 15 or 16, It is characterized in that along the thickness direction of the display panel, the dam is higher than the partition.

26. The display panel according to claim 15 or 16, It is characterized in that there are grooves between the adjacent first partition and the dam, and between the adjacent second partition and the dam.

27. The display panel according to claim 15 or 16, It is characterized in that when there are multiple first partitions, there is a groove between two adjacent first partitions.

28. The display panel according to claim 15 or 16, It is characterized in that when there are multiple second partitions, there is a groove between two adjacent second partitions.

29. The display panel according to claim 15 or 16, It is characterized in that a groove is provided on the side of the first partition farthest from the central component facing away from the central component.

30. A flexible display screen, It is characterized in that it includes a protection cover plate, a polarizer, a touch panel, and the display panel according to any one of claims 1 to 29, wherein: the polarizer is fixed to the protection cover plate, and the touch panel is arranged between the polarizer and the display panel; or, the touch panel is fixed to the protection cover plate, and the polarizer is arranged between the touch panel and the display panel.

31. An electronic device, It is characterized in that it includes a middle frame, a rear shell, a printed circuit board, and the flexible display screen according to claim 30, wherein: the middle frame is used to carry the printed circuit board and the flexible display screen, and the printed circuit board and the flexible display screen are located on both sides of the middle frame; the rear shell is located on the side of the printed circuit board away from the middle frame.

32. A method for manufacturing a display panel, It is characterized in that The method includes: Preparing a substrate; Forming a first unit structure on the substrate, and patterning the first unit structure to form a first annular structure; Forming a second unit structure on the first annular structure, and patterning the second unit structure to form a second annular structure; Performing side etching on two side surfaces of the first annular structure to form a first annular groove, and performing side etching on two side surfaces of the second annular structure to form a second annular groove; Forming an electroluminescent layer, and the electroluminescent layer covers part of the surfaces of the first annular structure and the second annular structure; Forming a packaging layer, and the packaging layer covers the electroluminescent layer, the first annular structure and the second annular structure; Forming a through hole on the substrate, and the through hole is formed in an area surrounded by the first annular structure or the second annular structure.

33. The preparation method according to claim 32, It is characterized in that The first unit structure is a first source-drain layer structure, and the first source-drain layer structure includes a metal titanium layer, a metal aluminum layer and a metal titanium layer sequentially deposited on the substrate. The side etching of the side surface of the first annular structure to form a first annular groove includes: performing side etching on the side surface of the metal aluminum layer so that the width of the metal aluminum layer is smaller than the widths of the two metal titanium layers.

34. The preparation method according to claim 32 or 33, It is characterized in that The second unit structure is a second source-drain layer structure, and the second source-drain layer structure includes a metal titanium layer, a metal aluminum layer and a metal titanium layer sequentially deposited on the first annular structure. The side etching of the side surface of the second annular structure to form a second annular groove includes: performing side etching on the side surface of the metal aluminum layer so that the width of the metal aluminum layer is smaller than the widths of the two metal titanium layers.

35. The preparation method according to claim 32 or 33, It is characterized in that The method further includes: forming a planarization layer on the packaging layer, and the surface of the packaging layer farthest from the substrate is flush with the surface of the planarization layer farthest from the substrate.

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