A display module and a display device

Abstract

The present invention relates to the field of display technology, and discloses a display module and a display device, wherein the display module comprises: a panel; a cover plate, wherein the cover plate is located on the light emitting side of the panel; an optical glue, wherein the optical glue is located on the side of the cover plate facing the panel; a polarizer, wherein the polarizer is located between the optical glue and the panel; an antistatic shielding layer, wherein the antistatic shielding layer is located on the side of the panel facing away from the cover plate; a conductive glue layer, wherein the conductive glue layer is located between the cover plate and the antistatic shielding layer, and wherein the conductive glue layer is electrically connected to the cover plate and the antistatic shielding layer respectively, wherein a conductive medium layer is provided on the side of the cover plate facing the conductive glue layer, and wherein the conductive glue layer comprises a first conductive film located between the panel and the conductive medium layer, wherein the thickness of the first conductive film is the sum of the thickness of the optical glue and the thickness of the polarizer; and the display module is used for reducing the influence of static electricity on the display device.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] With the continuous development of science and technology, more and more display devices are widely used in people's daily life and work, bringing great convenience to people's daily life and work, and becoming an indispensable and important tool for people today. Display devices display images through display modules.

[0003] Existing display modules will generate electric charges during use and testing. The large amount of electric charges generated will form static electricity accumulation. Due to the complex circuit and the thinness of the display module itself, it is sensitive to static electricity. When static electricity accumulates on the display screen, it is easy to cause problems such as green display screen and flickering. Summary of the invention

[0004] The invention discloses a display module and a display device, which are used to reduce the influence of static electricity on the display device.

[0005] In order to achieve the above object, the present invention provides the following technical solutions:

[0006] In a first aspect, the present invention provides a display module, comprising:

[0007] panel;

[0008] A cover plate, the cover plate being located on the light emitting side of the panel;

[0009] Optical adhesive, the optical adhesive is located on a side of the cover plate facing the panel;

[0010] A polarizer, the polarizer is located between the optical adhesive and the panel;

[0011] an antistatic shielding layer, the antistatic shielding layer being located on a side of the panel facing away from the cover plate;

[0012] A conductive adhesive layer, wherein the conductive adhesive layer is located between the cover plate and the antistatic shielding layer, and the conductive adhesive layer is electrically connected to the cover plate and the antistatic shielding layer respectively, a conductive dielectric layer is provided on the side of the cover plate facing the conductive adhesive layer, and the conductive adhesive layer includes a first conductive film located between the panel and the conductive dielectric layer, and the thickness of the first conductive film is the sum of the thickness of the optical adhesive and the thickness of the polarizer.

[0013] An optical adhesive and a polarizer are provided between the cover plate and the panel. An antistatic shielding layer is provided on the side of the panel facing away from the cover plate. The cover plate and the antistatic shielding layer are electrically connected through a conductive adhesive layer located between the cover plate and the antistatic shielding layer, and a conductive medium layer is provided on the side of the cover plate facing the conductive adhesive layer. With the above structure, the static electricity on the cover plate is conducted from the conductive adhesive layer to the antistatic shielding layer by the conductive medium layer, and then the antistatic shielding layer is connected to the grounded middle frame to complete the conduction path for the static electricity accumulated on the cover plate, thereby improving the problem of green display of the display device. Specifically, the conductive adhesive layer includes a first conductive film located between the panel and the conductive medium layer, and the thickness of the first conductive film is the sum of the thicknesses of the optical adhesive and the polarizer. In this way, when the first conductive film is connected to the conductive medium layer, it can be in full contact with the conductive medium layer, making the electrical connection more stable.

[0014] Optionally, the projection of the conductive medium layer on the cover plate covers the projection of the first conductive film on the cover plate.

[0015] Optionally, the thickness of the first conductive film is 130μm - 320μm.

[0016] Optionally, the panel includes a main body portion and a rear folding portion;

[0017] The conductive adhesive layer further includes a second conductive film connected to the first conductive film. The first conductive film is located in the main body portion, and the second conductive film is located in the rear folding portion.

[0018] Optionally, the thickness of the first conductive film is greater than the thickness of the second conductive film.

[0019] Optionally, the thickness of the second conductive film is 50μm - 130μm.

[0020] Optionally, the display module further includes a heat dissipation film located between the panel and the antistatic shielding film.

[0021] Optionally, the heat dissipation film includes: a first conductive layer, a buffer layer, and a paste layer;

[0022] The paste layer is located on the side of the panel facing away from the cover plate;

[0023] The first conductive layer is located on the side of the paste layer facing away from the panel;

[0024] The buffer layer is located between the paste layer and the first conductive layer.

[0025] Optionally, the shape of the paste layer is grid-like.

[0026] Optionally, the antistatic shielding film includes: a protective layer, a second conductive layer, and an insulating film layer;

[0027] The insulating film layer is located on the side of the heat dissipation film facing away from the panel;

[0028] The protective layer is located on the side of the insulating film layer facing away from the panel;

[0029] The second conductive layer is located between the protective layer and the insulating film layer.

[0030] Optionally, the first conductive layer is electrically connected to the second conductive layer.

[0031] Optionally, a flexible printed circuit board is provided between the antistatic shielding layer and the heat dissipation film.

[0032] Optionally, the projection of the second conductive layer on the first conductive layer covers the projection of the flexible printed circuit board on the first conductive layer.

[0033] Optionally, the conductive medium layer is conductive ink.

[0034] In a second aspect, the present invention provides a display device, including the display module according to any one of the first aspect. Description of the Drawings

[0035] Figure 1 It is a three-dimensional structural schematic diagram of a display module provided by an embodiment of the present invention;

[0036] Figure 2 It is an exploded view of a display module provided by an embodiment of the present invention;

[0037] Figure 3 It is a front view of a display module provided by an embodiment of the present invention;

[0038] Figure 4 is Figure 3 a cross-sectional view of the Y-Y plane of;

[0039] Figure 5 is Figure 4 a partially enlarged schematic diagram of the local structure of A of;

[0040] Figure 6 It is a structural schematic diagram of a display device provided by an embodiment of the present invention.

[0041] Icon: 1 - Display module; 11 - Panel; 111 - Main body; 112 - Rear folding part; 113 - Back film; 12 - Cover plate; 13 - Optical adhesive; 14 - Polarizer; 15 - Antistatic shielding layer; 151 - Protective layer; 152 - Second conductive layer; 153 - Insulating film layer; 16 - Conductive adhesive layer; 161 - First conductive film; 162 - Second conductive film; 17 - Conductive medium layer; 18 - Heat dissipation film; 181 - First conductive layer; 182 - Buffer layer; 183 - Adhesive layer; 19 - Flexible printed circuit board; 2 - Display device. Detailed implementation manners

[0042] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0043] In the first aspect, as Figures 1 - 5 shown, an embodiment of the present invention provides a display module, including:

[0044] Panel 11;

[0045] Cover plate 12, the cover plate 12 is located on the light-emitting side of the panel 11;

[0046] Optical adhesive 13, the optical adhesive 13 is located on the side of the cover plate 12 facing the panel 11;

[0047] Polarizer 14, the polarizer 14 is located between the optical adhesive 13 and the panel 11;

[0048] Antistatic shielding layer 15, the antistatic shielding layer 15 is located on the side of the panel 11 facing away from the cover plate 12;

[0049] Conductive adhesive layer 16, the conductive adhesive layer 16 is located between the cover plate 12 and the antistatic shielding layer 15, and the conductive adhesive layer 16 is electrically connected to the cover plate 12 and the antistatic shielding layer 15 respectively. A conductive medium layer 17 is provided on the side of the cover plate 12 facing the conductive adhesive layer 16, and the conductive adhesive layer 16 includes a first conductive film 161 located between the panel 11 and the conductive medium layer 17, and the thickness of the first conductive film 161 is the sum of the thicknesses of the optical adhesive 13 and the polarizer 14.

[0050] It should be noted that an optical adhesive 13 and a polarizer 14 are provided between the cover plate 12 and the panel 11. An antistatic shielding layer 15 is provided on the side of the panel 11 facing away from the cover plate 12. The cover plate 12 and the antistatic shielding layer 15 are electrically connected through a conductive adhesive layer 16 located between the cover plate 12 and the antistatic shielding layer 15, and a conductive medium layer 17 is provided on the side of the cover plate 12 facing the conductive adhesive layer 16. Through the above structure, the static electricity of the cover plate 12 is led out to the antistatic shielding layer 15 by the conductive medium layer 17 through the conductive adhesive layer 16, and then the antistatic shielding layer 15 is connected to the grounded middle frame to complete the conduction path of the static electricity accumulated on the cover plate 12, thereby improving the problem of green display of the display device 2. Specifically, the conductive adhesive layer 16 includes a first conductive film 161 located between the panel 11 and the conductive medium layer 17, and the thickness of the first conductive film 161 is the sum of the thickness of the optical adhesive 13 and the thickness of the polarizer 14, so that when the first conductive film 161 is connected to the conductive medium layer 17, it can be in full contact with the conductive medium layer 17, making the electrical connection more stable.

[0051] Among them, as Figure 3 shown, the panel 11 is used for display. The panel 11 can be a flexible OLED (Organic Light Emitting Diode) panel 11 or a rigid OLED panel 11, and those skilled in the art can set it according to actual needs.

[0052] Continue to refer to Figure 3 , a cover plate 12 is provided on the light-emitting side of the panel 11. The cover plate 12 is used to protect the panel 11. The cover plate 12 can be a 3D glass cover plate 12 or a 2D glass cover plate 12. Of course, the cover plate 12 can also be made of other transparent materials other than glass, and the cover plate 12 can also be a flexible transparent material, such as plastic (CPI: Colorless PI; PET: polyethylene terephthalate, etc.) or ultra-thin glass (UTG: Ultra Thin Glass), etc. Those skilled in the art can set it according to actual needs.

[0053] Continue to refer to Figure 3 , an antistatic shielding layer 15 is provided on the side of the panel 11 facing away from the cover plate 12. The antistatic shielding layer 15 is used for conducting heat, conducting static electricity and shielding signals, and can prevent the high-frequency signals of the flexible printed circuit board 19 from affecting the normal operation of other electrical components of the display module 1, so as to ensure the reliability of the display module 1. And the antistatic shielding layer 15 can play a good role in heat dissipation and protection.

[0054] Continue to refer to Figure 3, the conductive adhesive layer 16 is located between the cover plate 12 and the antistatic shielding layer 15, and the conductive adhesive layer 16 is electrically connected to the cover plate 12 and the antistatic shielding layer 15 respectively. The charge generated on the cover plate 12 is conducted by the conductive adhesive layer 16 from the cover plate 12 to the antistatic shielding layer 15, that is, the charge is released through the conductive adhesive layer 16 to the antistatic shielding layer 15 in sequence, avoiding the formation of electrostatic accumulation of a large amount of charge, thereby effectively reducing the influence of static electricity on the panel 11.

[0055] It should be noted that the connection between the conductive adhesive layer 16 and the cover plate 12 can be that the conductive adhesive layer 16 is in direct contact connection with the cover plate 12, or a conductive medium layer 17 is provided on the side of the cover plate 12 facing the conductive adhesive layer 16 (specific reference Figure 5 ), and the conductive adhesive layer 16 is connected to the cover plate 12 through the conductive medium layer 17; the charge generated on the cover plate 12 is conducted to the conductive adhesive layer 16 by the conductive medium layer 17, and the conductive adhesive layer 16 is used to conduct the charge from the conductive medium layer 17 to the antistatic shielding layer 15, that is, the charge is released through the conductive medium layer 17, the conductive adhesive layer 16 to the antistatic shielding layer 15 in sequence, avoiding the formation of electrostatic accumulation of a large amount of charge, thereby effectively reducing the influence of static electricity on the panel 11; as long as it is ensured that the static electricity on the cover plate 12 can be conducted to the conductive adhesive layer 16.

[0056] Specifically, the conductive medium layer 17 can be selected as conductive ink or ITO (Indium Tin Oxides) with conductive properties.

[0057] Among them, if the conductive medium layer 17 is conductive ink, on the one hand, the conductive ink layer has conductive performance and can be used as part of the electrostatic dissipation path to conduct out static electricity; on the other hand, the conductive ink can block components such as the driving circuit and connecting traces in the display module 1, playing a decorative role and enhancing the aesthetic feeling of the display module 1.

[0058] In addition, if the conductive medium layer 17 includes indium tin oxide, on the one hand, indium tin oxide has conductive performance, which can ensure that the conductive medium layer 17 is used as part of the electrostatic dissipation path to conduct out static electricity; on the other hand, the indium tin oxide layer is relatively thin and light, which helps to reduce the thickness of the conductive medium layer 17, and further reduces the space occupied by the conductive adhesive layer 16, and reduces the influence of the conductive adhesive layer 16 on the display module 1 and the whole machine.

[0059] Optionally, the conductive adhesive layer 16 includes a first conductive film 161 located between the panel 11 and the conductive medium layer 17, and the thickness of the first conductive film 161 is the sum of the thicknesses of the optical adhesive 13 and the polarizer 14. This enables the first conductive film 161 to be in full contact with the conductive medium layer 17 when connected, resulting in better electrical connection stability.

[0060] Among them, such asFigure 2 As shown in the figure, a polarizer 14 is provided on one side of the panel 11 close to the cover plate 12. The polarizer 14 can reduce the reflected light in the ambient light on the light-emitting side of the cover plate 12, thereby helping to improve the display effect of the display module 1.

[0061] Optionally, an optical adhesive 13 (Optically Clear Adhesive, OCA) is further provided on the side of the polarizer 14 close to the cover plate 12, and the polarizer 14 is attached to the cover plate 12 through the optical adhesive 13. Among them, the optical adhesive 13 has the characteristics of being colorless and transparent, having a high light transmittance, good bonding strength, and small curing shrinkage, etc., so as to well fix the panel 11 and the cover plate 12 while ensuring the display effect of the display module 1.

[0062] In a specific embodiment, the projection of the conductive medium layer 17 on the cover plate 12 covers the projection of the first conductive film 161 on the cover plate 12. Since the conductive medium layer 17 is used to conduct the static electricity on the cover plate 12, and the conductive adhesive layer 16 is connected to the cover plate 12 through the conductive medium layer 17, in order to ensure the effective export of a large amount of static electricity on the cover plate 12, the projected area of the conductive medium layer 17 on the cover plate 12 is larger than the projected area of the first conductive film 161 on the cover plate 12, and the conductive medium layer 17 is located in the non-display area of the cover plate 12, so it does not affect the display of the display module 1 provided by the embodiment of the present invention. It should be noted that the overlapping area of the conductive adhesive layer with the cover plate or the conductive medium layer 17 can be adjusted according to the requirements of the whole machine or the antistatic ability of the module, and the setting position of the conductive adhesive layer can also be set according to actual needs. The embodiment of the present invention does not make specific limitations on this.

[0063] As Figure 5 shown, specifically, the thickness of the first conductive film 161 is D1, where 130 μm ≤ D1 ≤ 320 μm. The thickness of the first conductive film 161 ensures conductivity on the one hand and avoids the increase in the preparation difficulty caused by the relatively thin thickness of the first conductive film 161 on the other hand, thereby effectively reducing the process cost.

[0064] On the side of the panel 11 provided by the embodiment of the present invention facing away from the cover plate, a back film 113 for protecting the panel is provided. The panel 11 is bent to form a main body portion 111 and a rear folding portion 112. In order not to affect the bending of the panel, there is no back film in the bending area of the panel here. The panel 11 provided by the embodiment of the present invention includes a main body portion 111 and a rear folding portion 112;

[0065] The conductive adhesive layer 16 also includes a second conductive film 162 connected to the first conductive film 161. The first conductive film 161 is located on the main body 111, and the second conductive film 162 is located on the rear folding portion 112. Here, the panel 11 is bent to form the rear folding portion 112, and the rear folding portion 112 is bent along the side away from the cover plate 12. The rear folding portion 112 is connected to a flexible printed circuit board 19 (flexible printed circuit, FPC). At this time, since the flexible printed circuit board 19 is located on the side of the panel 11 away from the back plate, the size of the frame can be reduced and the screen ratio of the display module 1 can be increased.

[0066] Specifically, the thickness of the first conductive film 161 is greater than the thickness of the second conductive film 162 .

[0067] Of course, the material of the conductive adhesive layer 16 can be selected as UV (Ultraviolet Rays) adhesive or conductive soft adhesive; the specific manufacturing methods of the conductive adhesive layer 16 can be as follows: Method 1, apply a layer of uniform thickness and cure it through UV light, then bend it (Bending), and then tilt the coating to the area where a gap is required between the UV adhesive and the conductive medium layer 17.

[0068] Method 2: Apply glue in two stages. The first stage is to form the thickness of the coating area and then cure it with UV light. The second application of glue is concentrated on the area where thicker glue is required, that is, the second application of glue is performed on the first conductive film 161, and then cured with UV light.

[0069] Specifically, the thickness of the second conductive film 162 is D2, where 50 μm≤D2≤130 μm. The thickness of the second conductive film 162 ensures conductivity and avoids increased difficulty in preparation due to the thin thickness of the second conductive film 162, thereby effectively reducing process costs.

[0070] The display module 1 provided by the embodiment of the present invention further includes a heat dissipation film 18 located between the panel 11 and the antistatic shielding film.

[0071] Among them, the heat dissipation film 18 includes: a first conductive layer 181, a buffer layer 182 and an adhesive layer 183; the adhesive layer 183 is located on the side of the panel 11 away from the cover plate 12; the first conductive layer 181 is located on the side of the adhesive layer 183 away from the panel 11; the buffer layer 182 is located between the adhesive layer 183 and the first conductive layer 181.

[0072] In order to enhance the anti-deformation capability of the heat dissipation film 18 , an adhesive layer 183 may be added between the first conductive layer 181 and the buffer layer 182 . Specifically, the adhesive layer 183 may be made of polyethylene terephthalate (PET) and polyimide (PI).

[0073] Specifically, the first conductive layer 181 may select metal materials such as copper, aluminum, and silver for conduction; the buffer layer 182 may select materials such as foam for buffering; the adhesive layer 183 is attached to the side of the panel 11 facing away from the backplane and adopts a grid shape for exhausting air and preventing the generation of bubbles during fitting.

[0074] The antistatic shielding film for conducting static electricity includes: a protective layer 151, a second conductive layer 152, and an insulating film layer 153;

[0075] The insulating film layer 153 is located on the side of the heat dissipation film 18 facing away from the panel 11; the protective layer 151 is located on the side of the insulating film layer 153 facing away from the panel 11; the second conductive layer 152 is located between the protective layer 151 and the insulating film layer 153.

[0076] And the first conductive layer 181 is electrically connected to the second conductive layer 152.

[0077] A flexible printed circuit board 19 is provided between the antistatic shielding layer 15 and the heat dissipation film 18.

[0078] The part of the second conductive layer 152 that extends beyond the flexible printed circuit board 19 is connected to the first conductive layer 181 in the heat dissipation film 18, that is, the projection of the second conductive layer 152 on the first conductive layer 181 covers the projection of the flexible printed circuit board 19 on the first conductive layer 181.

[0079] The specific transmission path of the static electricity formed on the cover plate 12 is: conducted from the conductive medium layer 17 on the side of the cover plate 12 facing the panel 11 to the conductive adhesive layer 16, the conductive adhesive layer 16 conducts the static electricity to the second conductive layer 152 in the antistatic shielding layer 15, the second conductive layer 152 is electrically connected to the first conductive layer 181, and the first conductive layer 181 conducts the static electricity to the middle frame of the display device 2, transferring the charge on the cover plate 12 and avoiding the influence of charge accumulation on the display of the panel 11.

[0080] In a second aspect, an embodiment of the present invention provides a display device, including the display module 1 according to any one of the first aspects.

[0081] Based on the same inventive concept, an embodiment of the present invention also provides a display device, Figure 6 is a schematic structural diagram of a display device provided by an embodiment of the present invention. As Figure 6 shown, the display device 2 includes the display module 1 according to any embodiment of the present invention. Therefore, the display device 2 provided by the embodiment of the present invention has the technical effects of the technical solutions in any of the above embodiments, and the explanations of the same or corresponding structures and terms as those in the above embodiments will not be repeated here.

[0082] The display device 2 provided by the embodiment of the present invention may beFigure 6 The mobile phone shown can also be any electronic product with a display function, including but not limited to the following categories: televisions, laptop computers, desktop monitors, tablet computers, digital cameras, smart bracelets, smart glasses, in-vehicle displays, medical devices, industrial control devices, touch interaction terminals, etc. The embodiments of the present invention do not make special limitations in this regard.

[0083] Obviously, those skilled in the art can make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these changes and modifications.

Claims

1. A display module, characterized in that, Comprising: A panel; A cover plate located on the light-emitting side of the panel; An optical adhesive located on the side of the cover plate facing the panel; A polarizer located between the optical adhesive and the panel; An antistatic shielding layer located on the side of the panel facing away from the cover plate; A conductive adhesive layer located between the cover plate and the antistatic shielding layer, and the conductive adhesive layer is electrically connected to the cover plate and the antistatic shielding layer respectively. A conductive medium layer is provided on the side of the cover plate facing the conductive adhesive layer, and the conductive adhesive layer includes a first conductive film located between the panel and the conductive medium layer, and the thickness of the first conductive film is the sum of the thickness of the optical adhesive and the thickness of the polarizer.

2. The display module according to claim 1, wherein, The projection of the conductive medium layer on the cover plate covers the projection of the first conductive film on the cover plate.

3. The display module according to claim 1, wherein The thickness of the first conductive film is 130μm - 320μm.

4. The display module according to claim 3, wherein, The panel includes a main body portion and a rear folding portion; The conductive adhesive layer further includes a second conductive film connected to the first conductive film. The first conductive film is located on the main body portion, and the second conductive film is located on the rear folding portion.

5. The display module according to claim 4, wherein The thickness of the first conductive film is greater than the thickness of the second conductive film.

6. The display module according to claim 4, wherein The thickness of the second conductive film is 50μm - 130μm.

7. The display module according to claim 1, wherein The display module further includes a heat dissipation film located between the panel and the antistatic shielding film.

8. The display module according to claim 7, wherein The heat dissipation film includes: a first conductive layer, a buffer layer, and an adhesive layer; The adhesive layer is located on the side of the panel facing away from the cover plate; The first conductive layer is located on the side of the adhesive layer facing away from the panel; The buffer layer is located between the adhesive layer and the first conductive layer.

9. The display module according to claim 8, wherein, The shape of the adhesive layer is grid-like.

10. The display module according to claim 8, characterized in that, The antistatic shielding film includes: a protective layer, a second conductive layer, and an insulating film layer; The insulating film layer is located on the side of the heat dissipation film facing away from the panel; The protective layer is located on the side of the insulating film layer facing away from the panel; The second conductive layer is located between the protective layer and the insulating film layer.

11. The display module according to claim 10, wherein The first conductive layer is electrically connected to the second conductive layer.

12. The display module according to claim 11, wherein A flexible printed circuit board is provided between the antistatic shielding layer and the heat dissipation film.

13. The display module according to claim 12, wherein, The projection of the second conductive layer on the first conductive layer covers the projection of the flexible printed circuit board on the first conductive layer.

14. The display module according to claim 1, wherein The conductive medium layer is conductive ink.

15. A display device, characterized in that, Including the display module according to any one of claims 1 - 14.

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