Camera modules and array camera modules based on integrated packaging technology

Abstract

A camera module and an array camera module based on an integrated packaging process, the camera module comprising: a circuit board, an integrated base, a photosensitive element, a lens, a filter element lens holder and a filter element mounted on the filter element lens holder; the filter element lens holder is supported on at least a portion of the top surface of the integrated base, and the filter element lens holder cooperates with the integrated base to form a light window to provide a light path for the photosensitive element; wherein the integrated base is integrally packaged with the circuit board and the photosensitive element and embeds the photosensitive element connector, the circuit board connector and the connecting wire, and the distance between the inner edge of the top surface of the integrated base and the optical axis of the camera module is not greater than the distance between the outer edge of the circuit board connector and the optical axis of the camera module, so that the top surface of the integrated base provides a larger mounting surface.

Description

Technical Field

[0001] The present invention relates to the field of camera modules, and further to a camera module and an array camera module based on an integrated packaging process. Background Art

[0002] Camera modules are an essential component of smart electronic devices, including, but not limited to, smartphones, cameras, computers, and wearable devices. With the continuous development and widespread adoption of these devices, the requirements for camera modules are becoming increasingly demanding.

[0003] In recent years, smart electronic devices have experienced rapid development, becoming increasingly thinner and lighter. To adapt to this trend, camera modules are increasingly required to be multifunctional, lightweight, and miniaturized. This allows smart electronic devices to be made thinner and meet the imaging requirements of camera modules. Therefore, camera module manufacturers continue to strive to design and manufacture camera modules that meet these requirements.

[0004] Molded packaging technology is a new packaging technology developed on the basis of traditional COB packaging. Figure 1A The figure shows a circuit board encapsulated using existing molded packaging technology. In this structure, a molded portion 1 is encapsulated on a circuit board 2 through a molded package, and then a chip 3 is connected to the circuit board 2. The filter 4 is mounted on the molded portion 1. The molded portion 1 covers the electronic components 5 on the circuit board, thereby reducing the space occupied by the electronic components 5 in the camera module, reducing the size of the camera module, and solving the problem of dust attached to the electronic components affecting the imaging quality of the camera module.

[0005] Reference Figure 1B This is a conventional COB packaged circuit board, with the chip attached to the circuit board 2 and the lens holder 7 mounted on the circuit board 2. More specifically, the bottom of the lens holder 7 has support feet 701, which adhere the lens holder 7 to the circuit board 2. However, because the lens holder 7 needs to avoid the electronic component 5, the bottom side of the support feet 701 is relatively small, resulting in a small contact area between the support feet 701 and the circuit board 2. Accordingly, the bonding area between the two is also limited. As a result, in camera modules based on conventional COB packaging technology, the support feet 701 can easily detach from the circuit board 2, resulting in a weak connection between the lens holder 7 and the circuit board 2. Furthermore, the lens holder 7 is typically used with a lens or a lens assembly with a driver or a fixed lens barrel. Therefore, any stress from the lens or lens assembly above the lens holder 7 is transferred to the smaller support feet 701, which can easily lead to excessive stress concentration and damage. Furthermore, both the support feet 701 and the upper portion of the conventional lens holder 7, which houses the filter, require a predetermined thickness. This results in a relatively large thickness, typically exceeding 0.7 mm.

[0006] Compared with traditional COB packaging technology, molded packaging technology has many advantages, such as replacing the lens holder 7 with the molded part 1, reducing the space occupied by the electronic component 5 and reducing the size of the camera module; avoiding dust adhesion on the electronic component 5 to affect the imaging quality of the camera module, etc. However, this structure also brings some new problems.

[0007] Optical filters are a crucial component in modern camera modules, filtering infrared light, making the image closer to what the human eye sees. However, due to their vulnerability to damage and their significant contribution to the overall cost of the camera module, the larger the filter, the more expensive it is. Furthermore, the larger the filter, the more difficult it is to control manufacturing precision. Therefore, optical filters pose a significant challenge in mold packaging technology.

[0008] First, compared with the traditional COB packaging method, the molded packaging method covers the electronic component 5 through the molded part, utilizing the spatial position of the electronic component 5. However, the molded part increases the installation space of the upper filter 4 relative to the COB lens seat. In other words, the molded packaging requires a larger area of ​​the filter 4.

[0009] Specifically, refer to Figure 1B In the traditional COB, the filter is installed on the lens holder 7. Since the lens holder 7 is installed on the circuit board 2 later, it can be manufactured into different shapes, such as extending inward, so that the area of ​​the filter can be reduced as much as possible on the basis of ensuring that the photosensitive area is not blocked, so that it is more convenient to install while ensuring the use requirements. The price of small-area filters is lower, which reduces the cost of the overall camera module. In the molded package, the molding part 1 is integrally formed on the circuit board 2 through a mold, and the molding part extends from bottom to top. Therefore, the area of ​​the filter 4 is determined by the opening of the molding part 1, and the required area of ​​the filter 4 is larger.

[0010] Secondly, in the molded packaging method, refer to Figure 1AThe filter 4 needs to be installed within the groove 6 of the molded portion 1. However, due to the mold packaging process, the shape of the corners is difficult to control. That is, the groove walls forming the groove 6, especially where the groove walls meet, may deform, such as burrs, which prevents the filter 4 from being properly installed and smooth. This can also easily damage the filter. Furthermore, the traditional lens holder 7 has an inner groove 8, which means that the lens holder 7 can extend inward, providing a position for the filter 4 and reducing the installation area of ​​the filter 4. However, since molding is a one-step process, there are mold release issues during the mold manufacturing process. Therefore, traditional lens holder structures cannot be manufactured using molding. Therefore, mold packaging is limited to certain structures, such as a molded portion 1 without the inner groove 8. Traditional lens holders and mold packaging lens holders, as well as their corresponding molding processes, each have their own advantages and disadvantages, so it is necessary to combine the advantages of both.

[0011] Third, even if the molded portion 1 is formed into a platform shape without the groove 6, a relatively smooth surface can be ensured, providing better installation conditions for the optical filter 4. However, in this structure, on the one hand, the optical filter 4 needs to be coordinated with other components such as the lens or driver to be allocated to the packaging portion, which requires high installation precision and can easily damage the optical filter during installation. On the other hand, the optical filter is close to the lens, and the lens elements in the lens can easily contact the optical filter, which also increases the back focal length of the lens.

[0012] In addition, the photosensitive element, the electronic component and the molded part need to be installed on the circuit board. The layout of these components will affect the area required for the circuit board. Based on the molding method of the packaging part, the width is usually greater than the width of the traditional lens holder, thereby increasing the area occupied on the circuit board. Summary of the Invention

[0013] One object of the present invention is to provide a camera module and an array camera module based on an integrated packaging process, wherein the camera module includes a filter element lens holder, and the filter element lens holder and the integrated base of the camera module cooperate to provide support for different components of the camera module.

[0014] One object of the present invention is to provide a camera module and an array camera module based on an integrated packaging process, wherein the filter element lens holder provides a suitable installation position for the filter element, so that the filter element does not need to be directly installed on the integrated base of the camera module.

[0015] One object of the present invention is to provide a camera module and an array camera module based on an integrated packaging process, wherein the filter element lens holder has a supporting groove, and the filter element is suitable for being installed in the supporting groove, so that the filter element is relatively sunken.

[0016] One object of the present invention is to provide a camera module and an array camera module based on an integrated packaging process, wherein the filter element lens seat has an engagement groove, and the engagement groove is suitable for engaging with the integrated base, so that the relative height of the filter element lens seat and the integrated base is reduced, so that the filter element is closer to the photosensitive element of the camera module.

[0017] One object of the present invention is to provide a camera module and an array camera module based on an integrated packaging process, wherein the filter element lens holder includes a main body and at least one inner extension arm, and the inner extension arm extends inward from the lower part of the main body to form the support groove.

[0018] One object of the present invention is to provide a camera module and an array camera module based on an integrated packaging process, wherein the filter element lens seat portion includes at least one sinking arm, the sinking arm extends longitudinally from the main body, and the inward extension arm extends laterally from the sinking arm, respectively forming the coupling groove and the supporting groove.

[0019] One object of the present invention is to provide a camera module and an array camera module based on an integrated packaging process, wherein the integrated base has at least one notch connected to the outside, and the filter element lens holder includes at least one extended edge, and the extended edge corresponds to the notch to adapt to the different lateral widths of the integrated base.

[0020] One object of the present invention is to provide a camera module and an array camera module based on an integrated packaging process, wherein the filter element lens holder includes an upper extension wall, and the upper extension wall constrains and limits the position of the driver or lens of the camera module so that the optical axis of the camera module is consistent.

[0021] One object of the present invention is to provide a camera module and an array camera module based on an integrated packaging process, wherein the filter element lens holder is used to alleviate the stress exerted on the filter element when it is directly mounted on the integrated base, thereby protecting the filter element.

[0022] One object of the present invention is to provide a camera module and an array camera module based on an integrated packaging process, wherein the array camera module includes a conjoined filter element lens holder, which is formed by integrally connecting at least two filter element lens holders to simultaneously support multiple filter elements to ensure consistency between multiple camera module units.

[0023] One object of the present invention is to provide a camera module and an array camera module based on an integrated packaging process, wherein the integrated base of the camera module is integrally packaged in a circuit board and a non-photosensitive area of ​​a photosensitive element, so that compared with being only integrally packaged in the circuit board, the integrated base has a larger top surface area to provide a larger and flatter mounting surface for optical devices above the camera module, such as a filter element lens holder, lens or lens assembly.

[0024] One object of the present invention is to provide a camera module and an array camera module based on an integrated packaging process, wherein in order to facilitate the demolding operation of the molding process and avoid stray light, the inner surface of the integrated base is usually extended obliquely to form a light window with an opening gradually larger from bottom to top, which will cause the area of ​​the top surface of the integrated base to tend to decrease and fail to provide sufficient installation area. Compared with the integrated base that does not encapsulate the photosensitive element and its connecting wires but only encapsulates it integrally on the edge of the circuit board, this method requires reserving space for wire connection between the circuit board and the photosensitive element. The integrated base that is integrally encapsulated on the circuit board and the photosensitive element can make full use of the position space above the photosensitive element connector, the circuit board connector and the connecting wire, so that the end of the inner surface of the integrated base that extends obliquely from the photosensitive element in the direction away from the photosensitive element and cannot provide a mounting surface does not exceed the outer edge of the circuit board connector, thereby obtaining a larger mounting surface area for the top side of the integrated base.

[0025] One object of the present invention is to provide a camera module and an array camera module based on an integrated packaging process, wherein the integrated base is integrally packaged with the circuit board and the photosensitive element and the connecting wires are integrally embedded, thereby preventing stray light from being reflected to the photosensitive element due to the exposed connecting wires.

[0026] One object of the present invention is to provide a camera module and an array camera module based on an integrated packaging process, wherein the assembly of the filter element lens holder and the integrated base replaces the traditional lens holder, so that the thickness of the filter element lens holder is reduced relative to the traditional lens holder for installing the filter element. The thickness of the filter element lens holder of the present invention is less than 0.7 mm.

[0027] One object of the present invention is to provide a camera module and an array camera module based on an integrated packaging process, wherein, compared with a traditional camera module in which a lens holder is adhered to a circuit board via supporting feet, the bottom surface of the filter element lens holder that is matched with the filter element provides a larger bonding area with the integrated base, so that the filter element lens holder can be more firmly combined with the integrated base, and the stress applied to the filter element lens holder can be more effectively transferred to the integrated base and the circuit board.

[0028] One object of the present invention is to provide a camera module and an array camera module based on an integrated packaging process. In some embodiments, the inner surface of the filter element lens holder and the inner surface of the integrated base form an inner chamfer shape, thereby effectively preventing stray light and preventing stray light from reaching the photosensitive element.

[0029] One object of the present invention is to provide a camera module and an array camera module based on an integrated packaging process, wherein in some embodiments, the filter element is arranged on the filter element holder so as to reduce the area of ​​the filter element, for example, at least a portion of the outer edge of the filter element is located on the inner side of the inner edge of the top surface of the integrated base, so that the filter element is assembled on the filter element holder relative to the integrated base, thereby reducing the area of ​​the filter element and preventing damage and breakage of the filter element.

[0030] One object of the present invention is to provide a camera module and an array camera module based on an integrated packaging process, wherein in some embodiments, the height of the electronic component is greater than the height of the connecting line between the photosensitive element and the circuit board, and the step surface forming the mounting groove on the top side of the integrated base may be no higher than the height of the electronic component but above the height of the connecting line between the photosensitive element and the circuit board, thereby further sinking the position of the filter element lens holder and the filter element, thereby reducing the height of the camera module.

[0031] In order to achieve at least one of the above purposes of the present invention, one aspect of the present invention provides a camera module, which includes: at least one integrated base assembly; at least one photosensitive element; at least one lens; at least one filter element holder and at least one filter element; wherein the integrated base assembly includes an integrated base and a circuit board, and the integrated base is integrally packaged in the circuit board; wherein the photosensitive element is operably connected to the circuit board, the filter element holder is installed on the integrated base, and cooperates with the integrated base to form a light window to provide a light path for the photosensitive element, and the filter element is arranged on the filter element holder so that the filter element is located in the light sensitive path of the photosensitive element; and wherein the lens is located in the light sensitive path of the photosensitive element.

[0032] According to some embodiments, the filter element holder in the camera module includes a filter element holder body and at least one inner extension arm, and the inner extension arm partially extends laterally from the filter element holder body to form a support groove suitable for installing the filter element.

[0033] According to some embodiments, the filter element holder in the camera module includes a filter element holder body, at least one sinking arm and at least one inward extension arm, the sinking arm extends from the filter element holder body to form an engagement groove, suitable for engaging with the integrated base, and the inward extension arm extends from the sinking arm to form a support groove, suitable for installing the filter element.

[0034] According to some embodiments, a corner opening is formed between the adjacent inner extension arms in the camera module, and the corner opening extends outward from the light window to increase the luminous flux at the corner opening.

[0035] According to some embodiments, the sinking arm in the camera module extends from the filter element lens holder body toward a direction adjacent to the photosensitive element, and the filter element sinks adjacent to the photosensitive element.

[0036] According to some embodiments, the inner extension arm in the camera module extends laterally inward from the sinking arm, thereby reducing the installation area of ​​the filter element.

[0037] According to some embodiments, the integrated base in the camera module has at least one mounting groove and at least one notch, the mounting groove is connected to the light window, and the notch is connected to the light window and the outside, and the filter element lens holder body of the filter element lens holder includes at least one joining edge and at least one extended edge, the joining edge is suitable for joining to the mounting groove, and the extended edge is suitable for filling the notch to form a closed environment.

[0038] According to some embodiments, the integrated base in the camera module includes three mounting grooves, the mounting grooves form a U-shaped structure, and the filter element lens holder body of the filter element lens holder has three joining edges to form a U-shaped structure suitable for joining to the mounting grooves.

[0039] According to some embodiments, the integrated base in the camera module has two mounting grooves and two notches, the mounting grooves are connected to the light window, and the notches are connected to the light window and the outside, and the filter element lens holder main body of the filter element lens holder includes two joining edges and two extended edges, the two joining edges are suitable for joining to the two mounting grooves, and the two extended edges are suitable for extending to the two notches to form a closed environment.

[0040] According to some embodiments, the two mounting grooves of the integrated base in the camera module are opposite to each other, the two notches are opposite to each other, the two joining edges of the filter element holder are opposite to each other, and the two extending edges are opposite to each other.

[0041] According to some embodiments, the two mounting grooves of the integrated base in the camera module are adjacent, the two notches are adjacent, the two joining edges of the filter element holder are adjacent, and the two extended edges are adjacent.

[0042] According to some embodiments, the integrated base in the camera module has a mounting groove and three notches, the mounting groove is connected to the light window, and the notches are connected to the light window and the outside, and the filter element lens holder body of the filter element lens holder includes a joining edge and three extension edges, the joining edge is suitable for joining to the mounting groove, and the three extension edges are suitable for extending to the three notches to form a closed environment.

[0043] According to some embodiments, the filter element holder in the camera module includes an upper extension wall, which extends upward from the filter element holder body to form a limiting opening.

[0044] According to some embodiments, the filter element holder in the camera module includes an upper extension wall and a lower extension wall, the upper extension wall extends upward from the filter element holder body to form a limit opening, and the lower extension wall extends downward from the filter element holder body to form a lower package opening.

[0045] According to some embodiments, the filter element holder of the camera module has a receiving opening for receiving the filter element so that the filter element is located in the light-sensitive path of the photosensitive element.

[0046] According to some embodiments, the integrated base in the camera module includes a base body, which is integrally packaged on the circuit board. The base body has at least one opening connecting the light window and the outside, and the filter element lens seat is supplemented in the opening to form the light window.

[0047] According to some embodiments, the opening in the camera module has an inverted trapezoidal structure that gradually increases from bottom to top.

[0048] According to some embodiments, the filter element holder in the camera module is at least partially connected to the circuit board.

[0049] According to some embodiments, the filter element holder in the camera module includes at least one extension leg, which extends downward from the filter element holder body to the circuit board, supplementing the opening of the integrated base, so that the light window is closed around.

[0050] According to some embodiments, the opening in the camera module is an inverted trapezoidal structure that gradually increases from bottom to top, and the extending leg is an inverted trapezoidal structure that matches the shape of the opening to facilitate limiting the filter element lens holder through the opening.

[0051] According to some embodiments, the camera module includes at least one driver, which is at least partially selectively mounted on the integrated base and the filter element holder, and the lens is mounted on the driver.

[0052] According to some embodiments, the lens in the camera module is at least partially selectively mounted on the integrated base and the filter element holder.

[0053] According to some embodiments, the lens in the camera module is at least partially mounted on the integrated base.

[0054] According to some embodiments, the filter element in the camera module is selected from the group consisting of an infrared cutoff filter, a blue glass filter, and a wafer-level infrared cutoff filter.

[0055] According to some embodiments, the integrated packaging process in the camera module is integrated packaging by molding.

[0056] According to some embodiments, the circuit board in the camera module includes at least one electronic component and a substrate, the electronic component is arranged on the substrate, and the integrated base covers the electronic component and is integrally packaged on the substrate.

[0057] According to some embodiments, the integrated base in the camera module has a lens barrel wall forming a lens chamber suitable for installing a lens.

[0058] According to some embodiments, the filter element holder in the camera module is formed by injection molding.

[0059] According to some embodiments, the integrated base in the camera module has an inner side surface, the inner side surface has an inclination angle, and the engagement groove has an engagement angle adapted to the inclination angle.

[0060] According to some embodiments, the camera module includes a plurality of the integrated base assemblies, a plurality of the photosensitive elements, a plurality of lenses, a plurality of filter element holders and a plurality of filters to form an array camera module, wherein each of the integrated base assemblies and the circuit board are integrally connected to form a connected circuit board, each of the integrated bases are integrally connected to form a connected base, and each of the filter element holders are integrally connected to form a connected filter element holder.

[0061] According to some embodiments, the filter element holder in the camera module includes at least one limiting protrusion, and the limiting protrusion extends upward at least partially and protrudingly from the top of the filter element holder body.

[0062] According to some embodiments, the limiting protrusion in the camera module is an annular structure.

[0063] According to some embodiments, the camera module includes a driver, the lens is mounted on the driver, and the limiting protrusion is suitable for limiting the driver to the outside.

[0064] Another aspect of the present invention provides an array camera module, which includes a plurality of camera module units arranged in an array, each of the camera module units including: an integrated base assembly; a photosensitive element; a lens; a filter element holder and a filter element; wherein the integrated base assembly includes an integrated base and a circuit board, the integrated base is integrally encapsulated in the circuit board to form a light window, providing a light path for the photosensitive element; wherein each of the photosensitive elements is operably connected to the circuit board, the filter element holder is mounted on the integrated base, and the filter element is arranged on the filter element holder so that the filter element is located in the light sensitive path of the photosensitive element; wherein the lens is located in the light sensitive path of the photosensitive element; wherein the integrated bases of a plurality of the camera module units are integrally connected to form a connected base.

[0065] According to some embodiments, the plurality of circuit boards are integrally connected to form a conjoined circuit board, and the plurality of filter element holders are integrally connected to form a conjoined filter element holder. It is understood that, in some embodiments, the plurality of circuit boards may be independent circuit boards, and the plurality of filter element holders may be independent filter element holders.

[0066] According to some embodiments, the connected base in the array camera module includes a plurality of base bodies, each of the base bodies forms the light window, and adjacent base bodies are integrally connected to form a connected portion, and the connected filter element lens seat includes a plurality of support grooves, which are connected to the corresponding light windows, and the support grooves are suitable for installing the filter elements, and adjacent filter element lens seats are integrally connected to form a bridge portion, and the bridge portion bridges the connected portion of the connected base.

[0067] According to some embodiments, each filter element holder in the array camera module includes a filter element holder body and at least one inner extension arm, and the inner extension arm partially extends laterally from the filter element holder body to form a support groove suitable for installing the filter element.

[0068] According to some embodiments, each filter element holder in the array camera module includes a filter element holder body, at least one sinking arm and at least one inward extension arm, the sinking arm extends from the filter element holder body to form an engagement groove, which is suitable for engaging with the integrated base, and the inward extension arm extends from the sinking arm to form a support groove, which is suitable for installing the filter element.

[0069] According to some embodiments, the adjacent inner extension arms in the array camera module form a corner opening, and the corner opening extends outward from the light window to increase the light flux at the corner opening position.

[0070] According to some embodiments, the sinking arm in the array camera module extends in the opposite direction from the filter element lens holder body to the photosensitive element, and the filter element sinks to the photosensitive element.

[0071] According to some embodiments, the inner extension arm in the array camera module extends laterally inward from the inner extension arm, thereby reducing the installation area of ​​the filter element.

[0072] According to some embodiments, each of the integrated bases in the array camera module has at least one mounting groove and at least one notch, the mounting groove is connected to the light window, and the notch is connected to the light window and the outside, and the filter element holder body of the filter element holder includes at least one joining edge and at least one extended edge, the joining edge is suitable for joining to the mounting groove, and the extended edge is suitable for extending the notch to form a closed environment.

[0073] According to some embodiments, each of the integrated bases in the array camera module includes three mounting grooves, the mounting grooves forming a U-shaped structure, and the filter element lens holder main body of the filter element lens holder includes three joining edges, the joining edges forming a U-shaped structure suitable for joining to the mounting grooves.

[0074] According to some embodiments, each of the integrated bases in the array camera module has two mounting grooves and two notches, the mounting grooves are connected to the light window, and the notches are connected to the light window and the outside, and the filter element holder body of the filter element holder includes two joining edges and two extended edges, the two joining edges are suitable for joining to the two mounting grooves, and the two extended edges are suitable for extending to the two notches to form a closed environment.

[0075] According to some embodiments, the two mounting grooves of each integrated base in the array camera module are opposite to each other, the two notches are opposite to each other, the two joining edges of the filter element lens holder are opposite to each other, and the two extended edges are opposite to each other.

[0076] According to some embodiments, the two mounting grooves of each integrated base in the array camera module are adjacent, the two notches are adjacent, the two joining edges of the filter element holder are adjacent, and the two extended edges are adjacent.

[0077] According to some embodiments, each of the integrated bases in the array camera module has a mounting groove and three notches, the mounting groove is connected to the light window, and the notches are connected to the light window and the outside, and the filter element lens holder body of the filter element lens holder includes a joining edge and three extended edges, the joining edge is suitable for joining to the mounting groove, and the three extended edges are suitable for extending to the three notches to form a closed environment.

[0078] According to some embodiments, each filter element holder in the array camera module includes an upper extension wall, and the upper extension wall extends upward from the filter element holder body to form a limiting opening.

[0079] According to some embodiments, each filter element holder in the array camera module includes an upper extension wall and a lower extension wall, the upper extension wall extends upward from the filter element holder body to form a limit opening, and the lower extension wall extends downward from the filter element holder body to form a lower package opening.

[0080] According to some embodiments, the integrated base in the array camera module has at least one opening extending to the circuit board, and the integrated filter element lens holder includes at least one extending leg supplementing the opening of the integrated base and connected to the circuit board.

[0081] According to some embodiments, the extension legs in the array camera module extend from the filter element lens holder body to the circuit board, so that the corresponding light window is closed.

[0082] According to some embodiments, the extension leg in the array camera module is located between two adjacent light windows to separate the two light windows.

[0083] According to some embodiments, each filter element lens holder in the array camera module has at least one accommodating opening for accommodating the filter element so that the filter element is located in the light-sensitive path of the photosensitive element.

[0084] According to some embodiments, the array camera module includes at least one driver, which is at least partially selectively installed on the integrated base and the integrated filter element lens holder, and the lens is installed on the driver to form a dynamic focus camera module.

[0085] According to some embodiments, at least one lens in the array camera module is at least partially selectively mounted on the integrated base and the integrated filter element holder to form a fixed-focus camera module.

[0086] According to some embodiments, at least one camera module unit in the array camera module is a dynamic focus camera module, and at least one camera module unit is a fixed focus camera module.

[0087] According to some embodiments, at least two of the camera module units in the array camera module are dynamic focus camera modules.

[0088] According to some embodiments, at least two of the camera module units in the array camera module are fixed-focus camera modules.

[0089] According to some embodiments, the array camera module includes two camera module units to form a dual camera module.

[0090] According to another aspect of the present invention, the present invention provides an array camera module, comprising:

[0091] At least two shots;

[0092] at least two photosensitive elements;

[0093] At least one conjoined circuit board;

[0094] At least one integrated base, which is integrally packaged with the integrated circuit board and forms at least two light windows, which respectively provide light passages for the corresponding lens and the photosensitive element;

[0095] at least two filter elements; and

[0096] At least two filter element holders, each of which is mounted on the integrated base, and each of which is mounted on a corresponding filter element holder and located between the corresponding lens and the photosensitive element.

[0097] Another aspect of the present invention provides an electronic device, which includes an electronic device body and one or more camera modules, each of which is arranged on the electronic device body.

[0098] According to some embodiments, the electronic device includes but is not limited to: a smart phone, a wearable device, a computer device, a television, a vehicle, a camera, and a monitoring device.

[0099] Another aspect of the present invention provides an electronic device, which includes an electronic device body and one or more array camera modules, each of which is arranged on the electronic device body.

[0100] Another aspect of the present invention provides a camera module, comprising:

[0101] at least one integral base assembly;

[0102] at least one photosensitive element;

[0103] at least one lens, wherein the lens is located in the light sensing path of the light sensing element;

[0104] at least one filter element holder; and

[0105] At least one filter element, which is mounted on the filter element holder; wherein the integrated base assembly includes at least one integrated base and at least one circuit board, wherein the photosensitive element has at least one group of photosensitive element connectors, and the circuit board has at least one group of circuit board connectors, and the photosensitive element connectors and the circuit board connectors are connected by at least one group of connecting lines so that the photosensitive element can be operatively connected to the circuit board; wherein the filter element holder is supported on at least a portion of the top surface of the integrated base, and the filter element holder cooperates with the integrated base and forms a light window to provide a light path for the photosensitive element; wherein the integrated base is integrally encapsulated in at least a portion of the non-photosensitive area of ​​the circuit board and the photosensitive element and embeds the photosensitive element connectors, the circuit board connectors and the connecting lines, and the distance between the inner edge of the top surface of the integrated base and the optical axis of the camera module is not greater than the distance between the outer edge of the circuit board connector and the optical axis of the camera module, so that the top surface of the integrated base provides a larger mounting surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0106] Figure 1A It is a circuit board assembly with an existing molded package.

[0107] Figure 1B It is a circuit board component of the existing COB package.

[0108] Figure 2 It is a cross-sectional view of a camera module according to a first preferred embodiment of the present invention.

[0109] Figure 3 It is an exploded view of a camera module according to a first preferred embodiment of the present invention.

[0110] Figure 4 A schematic diagram of a partial assembly process of a camera module according to a first preferred embodiment of the present invention.

[0111] Figure 5 It is a schematic diagram of a modified implementation of the camera module according to the first preferred embodiment of the present invention.

[0112] Figure 6 This is another implementation of the camera module according to the first preferred embodiment of the present invention.

[0113] Figure 7 It is a cross-sectional view of a first variant implementation of an integrated base assembly and a filter element holder according to a first preferred embodiment of the present invention.

[0114] Figure 8A It is a cross-sectional view of a second modified embodiment of the integrated base assembly and the filter element holder according to the first preferred embodiment of the present invention.

[0115] Figure 8B This is a modified embodiment of the second modified implementation of the filter element holder of the first preferred embodiment of the present invention.

[0116] Figure 8C This is another modified embodiment of the second modified implementation of the filter element holder according to the first preferred embodiment of the present invention.

[0117] Figure 9A It is a three-dimensional diagram of a third modified implementation of the filter element holder according to the first preferred embodiment of the present invention.

[0118] Figure 9B This is the fourth variant implementation of the integrated base assembly and filter element lens holder of the camera module according to the first preferred embodiment of the present invention.

[0119] Figure 10A 、 10B It is a cross-sectional view in different directions of a camera module according to a second preferred embodiment of the present invention.

[0120] Figure 11 It is a perspective exploded view of an integrated base assembly and a filter element holder according to a second preferred embodiment of the present invention.

[0121] Figure 12A 、 12B A cross-sectional view showing a modified embodiment of the integrated base assembly and the filter element holder in different directions according to a second preferred embodiment of the present invention.

[0122] Figure 13A It is a three-dimensional exploded view of a modified implementation of the integrated base assembly and the filter element holder according to the second preferred embodiment of the present invention.

[0123] Figure 13B It is another modified implementation of the integrated base assembly and filter element lens holder of the camera module according to the second preferred embodiment of the present invention.

[0124] Figure 13C yes Figure 13B Exploded diagram of .

[0125] Figure 14 It is a cross-sectional view of a camera module according to a third preferred embodiment of the present invention.

[0126] Figure 15A 、 15B It is a cross-sectional view of a camera module in different directions according to the fourth preferred embodiment of the present invention.

[0127] Figure 16A 、 16B It is a cross-sectional view in different directions of the camera module according to the fifth preferred embodiment of the present invention.

[0128] Figure 17A ,17B is a cross-sectional view of the camera module in different directions according to the sixth preferred embodiment of the present invention.

[0129] Figure 18A , 18B is a cross-sectional view in different directions of a deformed implementation of the camera module according to the sixth preferred embodiment of the present invention.

[0130] Figure 19A 、 19B It is a cross-sectional view in different directions of the camera module according to the seventh preferred embodiment of the present invention.

[0131] Figure 20A It is a cross-sectional view of a camera module according to the eighth preferred embodiment of the present invention.

[0132] Figure 20B This is a cross-sectional view of another camera module according to the eighth preferred embodiment of the present invention.

[0133] Figure 21 It is a three-dimensional exploded view of the camera module according to the eighth preferred embodiment of the invention.

[0134] Figure 22 It is a cross-sectional view of a camera module according to the ninth preferred embodiment of the present invention.

[0135] Figure 23 It is a cross-sectional view of a camera module according to the tenth preferred embodiment of the present invention.

[0136] Figure 24 It is an application diagram according to the above preferred embodiment of the present invention.

[0137] Figure 25A 、 25B It is a cross-sectional view of an array camera module in different directions according to the eleventh preferred embodiment of the present invention.

[0138] Figure 26 It is an exploded view of an array camera module according to the eleventh preferred embodiment of the present invention.

[0139] Figure 27 This is a stereoscopic diagram of a conjoined filter element lens holder of an array camera module according to the eleventh preferred embodiment of the present invention.

[0140] Figure 28A 、 28B It is a cross-sectional view of another array camera module according to the eleventh preferred embodiment of the present invention.

[0141] Figure 29A 、 29B This is a cross-sectional view of another array camera module according to the eleventh preferred embodiment of the present invention.

[0142] Figure 30A 、 30B It is a schematic diagram of a modified implementation of the array camera module according to the eleventh preferred embodiment of the present invention.

[0143] Figure 31 It is a cross-sectional view of a first variant implementation of a one-piece base assembly and an one-piece filter element holder according to the eleventh preferred embodiment of the present invention.

[0144] Figure 32A It is a cross-sectional view of a second variant implementation of the array camera module according to the eleventh preferred embodiment of the present invention.

[0145] Figure 32B This is a modified embodiment of the second modified implementation manner of the integrated filter element holder according to the eleventh preferred embodiment of the present invention.

[0146] Figure 32C This is another modified embodiment of the second modified implementation manner of the integrated filter element holder according to the eleventh preferred embodiment of the present invention.

[0147] Figure 33A This is a stereoscopic diagram of a third variant implementation of the one-piece base assembly and the one-piece filter element lens holder of the array camera module according to the eleventh preferred embodiment of the present invention.

[0148] Figure 33B This is the fourth variant implementation of the one-piece base assembly and the one-piece filter element lens holder of the array camera module according to the eleventh preferred embodiment of the present invention.

[0149] Figure 34A , 34B is a cross-sectional view in different directions of the array camera module according to the twelfth preferred embodiment of the present invention.

[0150] Figure 35 This is a three-dimensional split diagram of the integrated base and the integrated filter element lens holder of the array camera module according to the twelfth preferred embodiment of the present invention.

[0151] Figure 36A 36B is a cross-sectional view in different directions of a deformed implementation of the integrated base and the integrated filter element lens holder of the array camera module according to the twelfth preferred embodiment of the present invention.

[0152] Figure 36CIt is a three-dimensional exploded view of a deformed implementation of a conjoined base and a conjoined filter element lens holder of an array camera module according to the twelfth preferred embodiment of the present invention.

[0153] Figure 37A It is a stereoscopic diagram of another modified implementation of the one-piece base assembly and the one-piece filter element lens holder of the array camera module according to the twelfth preferred embodiment of the present invention.

[0154] Figure 37B yes Figure 37A Exploded diagram of .

[0155] Figure 38A 、 38B It is a cross-sectional view in different directions of the array camera module according to the thirteenth preferred embodiment of the present invention.

[0156] Figure 39 It is a three-dimensional exploded view of the integrated base assembly and filter element lens holder of the array camera module according to the thirteenth preferred embodiment of the present invention.

[0157] Figure 40A 、 40B It is a cross-sectional view of an array camera module in different directions according to the fourteenth preferred embodiment of the present invention.

[0158] Figure 41 It is a three-dimensional exploded view of the integrated base assembly and the integrated filter element lens holder of the array camera module according to the fourteenth preferred embodiment of the present invention.

[0159] Figure 42A 、 42B It is a cross-sectional view in different directions of a deformed implementation method of the array camera module according to the fourteenth preferred embodiment of the present invention.

[0160] Figure 43 It is a three-dimensional exploded view of the integrated base assembly and the integrated filter element lens holder of the array camera module according to the fourteenth preferred embodiment of the present invention.

[0161] Figure 44A , 44B is a cross-sectional view of the array camera module in different directions according to the fifteenth preferred embodiment of the present invention.

[0162] Figure 45 This is a three-dimensional exploded view of the integrated base assembly and the integrated filter element lens holder of the array camera module according to the fifteenth preferred embodiment of the present invention.

[0163] Figure 46A 46B is a cross-sectional view in different directions of the deformation implementation of the one-piece base assembly and the one-piece filter element lens holder of the array camera module according to the fifteenth preferred embodiment of the present invention.

[0164] Figure 47It is a disassembled view of a deformed implementation of the one-piece base assembly and the one-piece filter element lens holder of the array camera module according to the fifteenth preferred embodiment of the present invention.

[0165] Figure 48A 、 48B It is a cross-sectional view in different directions of the array camera module according to the sixteenth preferred embodiment of the present invention.

[0166] Figure 49 This is a three-dimensional exploded view of the integrated base assembly and the integrated filter element lens holder of the array camera module according to the sixteenth preferred embodiment of the present invention.

[0167] Figure 50A 、 50B It is a cross-sectional view in different directions of the array camera module according to the seventeenth preferred embodiment of the present invention.

[0168] Figure 51 This is a disassembled view of the array camera module according to the seventeenth preferred embodiment of the invention.

[0169] Figure 52 It is a cross-sectional view of an array camera module according to the eighteenth preferred embodiment of the present invention.

[0170] Figure 53 It is a cross-sectional view of an array camera module according to the nineteenth preferred embodiment of the present invention.

[0171] Figure 54A It is a three-dimensional exploded schematic diagram of an array camera module according to the twentieth preferred embodiment of the present invention.

[0172] Figure 54B This is a cross-sectional view of an array camera module according to the twenty-first preferred embodiment of the present invention.

[0173] Figure 55 2 is a schematic diagram of an application of an array camera module according to the above preferred embodiment of the present invention.

[0174] Figure 56 This is a schematic diagram of one of the manufacturing steps of a camera module according to the twenty-second preferred embodiment of the present invention, wherein the photosensitive element of the camera module is mounted on a circuit board, and the non-photosensitive area of ​​the photosensitive element and the circuit board are connected by a set of leads.

[0175] Figure 57A and Figure 57B It is a schematic diagram of the second manufacturing step of the camera module according to the above preferred embodiment of the present invention, wherein a supporting element of the camera module is arranged in the non-photosensitive area of ​​the photosensitive element.

[0176] Figure 58It is a schematic diagram of a variant implementation of the third manufacturing step of the camera module according to the above-mentioned preferred embodiment of the present invention, wherein the circuit board, the photosensitive element and the supporting element are placed between an upper mold and a lower mold of a molding mold, and a covering film is provided between the pressing surface of the upper mold and the supporting element.

[0177] Figure 59 This is a schematic diagram of the fourth manufacturing step of the camera module according to the above-mentioned preferred embodiment of the present invention, wherein the molding material for forming a molded base of the camera module is added to form a molding space between the upper mold and the lower mold.

[0178] Figure 60 This is a schematic diagram of the fifth manufacturing step of the camera module according to the above preferred embodiment of the present invention, wherein the molding material is solidified to form the molding base.

[0179] Figure 61 This is a schematic diagram of the sixth manufacturing step of the camera module according to the above preferred embodiment of the present invention, wherein a filter element of the camera module is assembled on the mold base.

[0180] Figure 62 This is a schematic diagram of the seventh manufacturing step of the camera module according to the above-mentioned preferred embodiment of the present invention, wherein an optical lens of the camera module is assembled to a driver, and the driver is assembled to the molding base to obtain the camera module.

[0181] Figure 63 It is a schematic diagram of a modified implementation of the camera module according to the above preferred embodiment of the present invention.

[0182] Figure 64A It is a schematic diagram of a first variant implementation of a molded photosensitive component of the camera module according to the above preferred embodiment of the present invention.

[0183] Figure 64B It is a schematic diagram of a second variant implementation of the molded photosensitive component of the camera module according to the above preferred embodiment of the present invention.

[0184] Figure 64C It is a schematic diagram of a third variant implementation of the molded photosensitive component of the camera module according to the above preferred embodiment of the present invention.

[0185] Figure 65A It is a schematic diagram of the fourth variant implementation of the molded photosensitive component of the camera module according to the above preferred embodiment of the present invention.

[0186] Figure 65BIt is a schematic diagram of the fifth variant implementation of the molded photosensitive component of the camera module according to the above preferred embodiment of the present invention.

[0187] Figure 66 It is a schematic diagram of the sixth variant implementation of the module photosensitive component of the camera module according to the above preferred embodiment of the present invention.

[0188] Figure 67 It is a schematic diagram of a modified implementation of the camera module according to the above preferred embodiment of the present invention.

[0189] Figure 68 It is a schematic diagram of another variant implementation of the camera module according to the above preferred embodiment of the present invention.

[0190] Figure 69 This is a disassembled diagram of a camera module according to the twenty-third preferred embodiment of the present invention.

[0191] Figure 70 The camera module according to the preferred embodiment of the present invention is Figure 69 Cross-sectional view of line BB.

[0192] Figure 71 A schematic diagram of a partial assembly process of a camera module according to the above preferred embodiment of the present invention.

[0193] Figure 72A This is a structural diagram of the camera module according to the preferred embodiment of the present invention, in which the distance between the inner edge of the top surface of the integrated base and the optical axis is not greater than the distance between the outer edge of the circuit board connector and the optical axis.

[0194] Figure 72B Schematic diagram of the principle of reducing stray light of the camera module according to the above preferred embodiment of the present invention.

[0195] Figure 73 It is a structural schematic diagram of a first variant implementation of the camera module according to the above preferred embodiment of the present invention.

[0196] Figure 74A It is a structural diagram of a second variant implementation of the camera module according to the above preferred embodiment of the present invention.

[0197] Figure 74B It is a structural diagram of a third variant implementation of the camera module according to the above preferred embodiment of the present invention.

[0198] Figure 75A It is a structural diagram of a fourth variant implementation of the camera module according to the above preferred embodiment of the present invention.

[0199] Figure 75B It is a structural diagram of the fifth variant implementation of the camera module according to the above preferred embodiment of the present invention.

[0200] Figure 75C It is a structural diagram of a sixth variant implementation of the camera module according to the above preferred embodiment of the present invention.

[0201] Figure 76 It is a structural diagram of the seventh variant implementation of the camera module according to the above preferred embodiment of the present invention.

[0202] Figure 77 It is a structural diagram of the eighth variant implementation of the camera module according to the above preferred embodiment of the present invention.

[0203] Figure 78 This is a disassembled diagram of a camera module according to the twenty-fourth preferred embodiment of the present invention.

[0204] Figure 79 The camera module according to the preferred embodiment of the present invention is Figure 78 Cross-sectional view along the CC line.

[0205] Figure 80 3 is a schematic diagram of the principle of reducing stray light by the camera module according to the above preferred embodiment of the present invention.

[0206] Figure 81 It is a schematic diagram of a first variant implementation of the camera module according to the above preferred embodiment of the present invention.

[0207] Figure 82 It is a schematic diagram of a second variant implementation of the camera module according to the above preferred embodiment of the present invention.

[0208] Figure 83 It is a decomposition diagram of a third variant implementation of the camera module according to the above preferred embodiment of the present invention.

[0209] Figure 84A and 84B They are respectively another variant implementation of the camera module according to the above preferred embodiment of the present invention. Figure 83 Cross-sectional view along line DD and line EE.

[0210] Figure 85 It is a structural diagram of a fourth variant implementation of the camera module according to the above preferred embodiment of the present invention.

[0211] Figure 86 It is a structural diagram of the fifth variant implementation of the camera module according to the above preferred embodiment of the present invention.

[0212] Figure 87 It is a structural schematic diagram illustrating the sinking of the filter element lens holder in the fifth variant implementation manner of the camera module of the above preferred embodiment of the present invention.

[0213] Figure 88 This is a decomposition diagram of the array camera module according to the twenty-fifth preferred embodiment of the present invention.

[0214] Figure 89 The array camera module according to the above preferred embodiment of the present invention is Figure 88 Cross-sectional view along the FF line. DETAILED DESCRIPTION

[0215] The following description is intended to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are for illustrative purposes only, and those skilled in the art will readily appreciate other obvious variations. The basic principles of the present invention defined in the following description may be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the present invention.

[0216] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0217] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the elements may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0218] The molding packaging process is an important application process that has recently developed in the field of camera modules. Although it is a well-known technology in other fields, in the field of camera modules, especially for the recently popular multi-lens, high-pixel camera modules, the molding packaging process has shown its advantages and importance and has entered a stage of suitable application. Compared with the traditional COB packaging camera modules, the camera modules based on the molding packaging process use molding to form a lens holder, replacing the traditional separate lens holder. This can reduce the size of the camera module and provide a flat mounting surface. However, the replacement lens holder formed by the molding package needs to assume the functions of the original lens holder, such as installing filter elements. As mentioned earlier, the lens holder formed by the molding package is not suitable for directly installing filter elements. On the other hand, the layout of the photosensitive elements and electronic components on the circuit board will affect the size of the camera module. According to the present invention, a camera module and an array camera module based on an integrated packaging process and a filter element lens holder thereof are provided, wherein a filter element lens holder is introduced into the camera module and the array camera module of the integrated packaging process, so that the filter element lens holder and the integrated base cooperate with each other and assume the function of a traditional lens holder. On the basis of applying an integrated packaging process, such as an integrated molding process, good installation conditions can be provided for the filter element, driver or lens, thereby compensating for the installation problems caused by the integrated packaging process, and more reasonably arranging the components on the circuit board, so that the space of the circuit board is fully utilized, further reducing the size of the camera module.

[0219] like Figures 2 to 4 FIG2 shows a camera module according to a first preferred embodiment of the present invention. The camera module 100 can be applied to various electronic devices, such as, but not limited to, smartphones, wearable devices, computers, televisions, vehicles, cameras, and surveillance devices. The camera module 100 cooperates with the electronic devices to capture and reproduce images of target objects.

[0220] like Figures 2 to 4 FIG. 1 is a camera module according to a first preferred embodiment of the present invention, wherein the camera module 100 comprises an integrated base assembly 10 , a photosensitive element 20 , a lens 30 , a filter element holder 40 and a filter element 50 .

[0221] The integrated base assembly 10 includes an integrated base 11 and a circuit board 12. The integrated base 11 is integrally packaged with the circuit board 12, for example, but not limited to, being molded integrally with the circuit board 12. The filter element lens holder 40 is mounted on the integrated base 11. Thus, the integrated base 11 and the filter element lens holder 40 cooperate with each other to replace the lens holder or bracket of a traditional camera module, and do not require the lens holder or bracket to be attached to the circuit board with glue as in traditional packaging processes. The photosensitive element 20 is operatively connected to the circuit board 12. The photosensitive element 20 is electrically connected to the circuit board 12 of the integrated base assembly 10. The filter element lens holder 40 is mounted on the integrated base assembly 10. The lens 30 is located in the light sensing path of the photosensitive element 20.

[0222] The integrated base 11 has a light window 111 and a base body 112 forming the light window 111. The light window 111 provides a light path for the photosensitive element 20. The base body 112 is molded and integrally encapsulated in the circuit board 12. In particular, in this embodiment, the light window 111 is a ring-shaped structure with a closed periphery, so as to provide a closed internal environment for the lens 30. The circuit board 12 includes a substrate 121, and a plurality of electronic components 122 formed on the substrate 121, such as those mounted by SMT technology. The electronic components 122 include but are not limited to resistors, capacitors, driver devices, etc. In this embodiment of the present invention, the integrated base 11 is integrally encapsulated in the substrate 121 and integrally covered with the electronic components 122, thereby preventing dust and debris from adhering to the electronic components 122, as in traditional camera modules, and contaminating the photosensitive element 20 and affecting the imaging effect. It is understandable that in other modified embodiments, it is also possible that the electronic components 122 are embedded in the substrate 121, that is, the electronic components 122 may not be exposed. The substrate 121 of the circuit board 12 may be a PCB hard board, a PCB soft board, a hard-flex board, a ceramic substrate, etc. It is worth mentioning that in this preferred embodiment of the present invention, because the integrated base 11 can completely cover these electronic components 122, the electronic components 122 may not be embedded in the substrate 121. The substrate 121 is only used to form a conductive circuit, so that the thickness of the final integrated base assembly 10 can be smaller.

[0223] It is worth mentioning that in some embodiments, the electronic components 122 are arranged around the photosensitive element 20, and in different implementations, the arrangement positions of the electronic components 122 can be designed and laid out as needed, such as concentrated on one side or both sides, and can be coordinated with the arrangement position of the photosensitive element 20 and the subsequent arrangement position of the electrical connection element 203 and the shape of the filter element holder 40, so as to more reasonably utilize the spatial position on the substrate 122 and minimize the size of the camera module. It should be understood by those skilled in the art that the arrangement position and type of the electronic components 122 are not limitations of the present invention. It is worth mentioning that in an actual cross-section, due to the different arrangement positions of the electronic components 122, the electronic components may not be visible in the cross-section or may only be visible on one side, but in the drawings of the present invention, for ease of understanding and explanation, the electronic components 122 are all visible in the cross-section, and the present invention is not limited in this respect.

[0224] More specifically, the substrate 121 has an upper surface 1211 and a lower surface 1212. The upper surface 1211 is opposite to the lens 30, while the lower surface 1212 is opposite to the lens 30. The photosensitive element 20 includes a front surface 201 and a back surface 202. The front surface 201 is opposite to the lens 30 and is used for light sensing. The back surface 202 is opposite to the lens 30 and is adapted to adhere to the upper surface 1211 of the substrate 121. The photosensitive element 20 is electrically connected to the substrate 121 via at least one electrical connection element 203. The electrical connection element 203 may be, for example, but not limited to, gold wire, silver wire, copper wire, or aluminum wire. The electrical connection element 203 can be set on one side, two sides, three sides or four sides of the photosensitive element 20. In some drawings of the present invention, the implementation method of setting the electrical connection element 203 on four sides is used as an example for illustration, but in other implementations, the electrical connection element 203 can be set on one side, two sides or three sides as needed. It should be understood by those skilled in the art that the number, position and type of the electrical connection element 203 are not limitations of the present invention.

[0225] The photosensitive element 20 is mounted on the substrate 121 by, for example, but not limited to, SMT (Surface Mount Technology) and electrically connected to the substrate 121 by COB (Chip On Board) gold wire bonding. Of course, in other embodiments of the present invention, the photosensitive element 20 can be mounted on the substrate 121 by other means, such as embedded, FC (Flip Chip), etc. Those skilled in the art should understand that the connection and mounting method of the photosensitive element 20 and the circuit board 12 is not a limitation of the present invention.

[0226] More specifically, the front surface 201 of the photosensitive element 20 has a photosensitive area 1311 and a non-photosensitive area 1312. In particular, the non-photosensitive area 1312 surrounds the photosensitive area 1311. The photosensitive area 1311 is used to perform photosensitivity and convert light signals into electrical signals. The non-photosensitive area 1312 is electrically connected to the circuit board 12 via the electrical connection element 203 to transmit the electrical signals to the circuit board 12. The lens 30 and the photosensitive element 20 are optically aligned with each other, with the optical axes being consistent, so that light passing through the lens 30 can reach the photosensitive element 20 via the light window 111. After further photoelectric conversion by the photosensitive element 20, the electrical signals can be transmitted to the circuit board 12, thereby allowing the camera module 100 to capture image information.

[0227] like Figure 2 and Figure 3 As shown, the camera module 100 includes a filter element 50 for filtering the light passing through the lens 30. The filter element 50 includes, for example but not limited to, an infrared cutoff filter, a blue glass filter, a wafer-level infrared cutoff filter, a fully transparent filter, and a visible light filter. The filter element 50 is mounted on the filter element lens holder 40, located in the light path of the photosensitive element 20. The camera module may also include a driver 60, such as a voice coil motor, a piezoelectric motor, etc. The lens 30 is mounted on the driver 60 to form a dynamic focus camera module, that is, an AF (Auto Focus) camera module. The driver 60 includes at least one pin 61, and the driver 60 is operatively connected to the circuit board 12 through the pin 61. The pin 61 can be one of a single pin, a double pin, a single row of pins or a double row of pins. In some drawings of the present invention, a double pin is used as an example for illustration, but it is not a limitation. The pin 61 is usually located near the edge, from Figure 3 The position corresponding to the AA line in the position is cut into sections, corresponding to Figure 2 cross-sectional view, and the pin 61 corresponds to Figure 2The pins 61 are not actually visible in the cross-sectional views, but for ease of understanding and explanation, dotted lines are used in the corresponding cross-sectional views to indicate the presence of the pins 61. Those skilled in the art will appreciate that the type, shape, and location of the pins 61 are not limitations of the present invention.

[0228] like Figures 2 to 4 As shown, the filter element 50 is mounted on the filter element holder 40 and sunken into the optical window 111 of the integrated base 11. The integrated base 11 of the integrated base assembly 10 has a top surface 113. The filter element holder 40 is mounted on this top surface 113 of the integrated base 11, and the driver 60 is mounted on the filter element holder 40. According to this embodiment of the present invention, the top surface 113 of the integrated base 11 extends flat. In other words, the integrated base 11 forms a platform structure without any stepped protrusions, and the filter element holder 40 is mounted on this platform structure. It is worth noting that in this manner, the top surface 113 of the integrated base 11 extends flat without any significant bends. Therefore, during the integrated packaging process, such as molding, a smoother, burr-free mounting surface can be obtained, providing smooth mounting conditions for the filter element holder 40.

[0229] It's worth noting that the filter element 50, such as a blue glass filter, is a relatively fragile and expensive component that's easily broken. Therefore, protecting the filter element 50 is crucial during camera module manufacturing. In the present invention, the integrated base 11 is manufactured using a molding process, such as injection molding or compression molding. The filter element holder 40 can be made of any material, as long as it's strong enough to support the filter element 50. Preferably, the filter element holder 40 and the integrated base 11 can be manufactured using different manufacturing processes, such as injection molding for the filter element holder 40 and transfer molding for the integrated base 11. Therefore, different materials can be used, resulting in different hardnesses and surface flexibilities for the filter element holder 40 and the integrated base 11. For example, the filter element holder 40 can be made more flexible, so that when the filter element 50 is mounted on the filter element holder 40, it is subjected to less stress than when it is mounted on the integrated base 11, making it more suitable for mounting the filter element 50 and preventing damage or breakage of the filter element 50. In other words, the filter element holder 40 alleviates external stresses that may be applied to the filter element 50, such as stress experienced when directly bonded to the integrated base 11.

[0230] Furthermore, the filter element holder 40 has at least one supporting groove 41 and at least one engaging groove 42. The supporting groove 41 is used to mount the filter element 50, and the engaging groove 42 is used to mount the filter element 50 on the integrated base 11. The supporting groove 41 communicates with the light window 111, forming a receiving opening 411 for accommodating the filter element 50. The engaging groove 42 surrounds the bottom periphery of the filter element holder 40. In other words, the filter element holder 40 has the receiving opening 411 for accommodating the filter element 50, so that the filter element 50 is located in the light sensing path of the photosensitive element 20.

[0231] It is worth mentioning that the filter element 50 is installed in the supporting groove 41, and the relative height with respect to the filter element lens holder 40 is reduced, so that the filter element 50 does not protrude or protrudes less from the filter element lens holder 40, thereby not increasing the height of the camera module 100 and is not easy to touch the lens 50 or the driver 60.

[0232] In other words, the supporting groove 41 forms an inner loop, so that the filter element 50 can be installed inside the filter element holder 40, in the light path of the photosensitive element 20. The engaging groove 42 forms an outer loop, so that it can be engaged with the integral base 11 outward, providing a mounting position for the filter element holder 40 through the integral base 11.

[0233] More specifically, the shape of the engagement groove 42 matches the shape of the integrated base 11 , so as to facilitate stably mounting the filter element holder 40 on the integrated base 11 .

[0234] Further, refer to Figures 2 to 4 The filter element holder 40 includes a filter element holder body 43, at least one inwardly extending arm 44, and at least one downwardly extending arm 45. The downwardly extending arm 45 integrally extends longitudinally from the filter element holder body 43 to facilitate sinking the installation position of the filter element 50 into the light window 111. The inwardly extending arm 44 integrally extends laterally from the downwardly extending arm 45 to provide a horizontal installation position for the filter element 50, so that the optical axes of the filter element 50 and the photosensitive element 20 are aligned. In the example shown in the figure, the filter element holder 40 includes four integrally connected inwardly extending arms 44 and four integrally connected downwardly extending arms 45. Each of the inwardly extending arms 44 and the downwardly extending arms 45 extends at different positions to form the annular, integrated filter element holder 40.

[0235] In other words, the sinking arm 45 extends longitudinally and integrally to the inner side of the filter element lens holder body 43, and the engaging groove 42 is formed on the bottom side of the filter element lens holder body 43 to facilitate engagement with the integrated base 11. The inner extension arm 44 extends transversely to the inner side of the sinking arm 45, and the supporting groove 41 is formed on the top side of the inner extension arm 44 to facilitate support of the filter element 50.

[0236] In one embodiment, the shape of the engagement groove 42 of the filter element holder 40 is consistent with the shape of the light window 111 formed by the integrated base 11, and the shape of the support groove 41 is consistent with the shape of the filter element 50. In particular, the filter element 50 is a square structure, and the top view of the support groove 41 is an annular structure, such as a square ring.

[0237] The filter element holder 40 has a receiving opening 411 for accommodating the filter element 50, so that the filter element 50 is located in the light-sensing path of the photosensitive element 20. Specifically, the holder body 43 and the inner extension arm 44 form the receiving opening 411. In other words, the extended length of the inner extension arm 44 determines the minimum required area of ​​the filter element 50. It is worth noting that in the molding process, since the inner extension arm 44 cannot be formed, the required filter element area is larger, or in other words, the filter element area required is increased compared to the filter element area required by traditional holders. In the present invention, the inner extension arm 44 extends inward, thereby reducing the required area of ​​the filter element 50, combining the advantages of the filter element holder 40 with those of an integrated package.

[0238] For example, refer to Figure 2 , the distance between the inner extension arms 44 on both sides is marked as L, then the diameter of the filter element 50 only needs to be larger than L, and it can be mounted on the inner extension arm 44 without being mounted on the base body 112, thereby reducing the required area of ​​the filter element 50.

[0239] It is worth mentioning that the extended distance of the sinking arm 45 affects the depth of the filter element 50 in the light window 111, while the extended distance of the inner extension arm 44 affects the size of the installed filter element 50. For example, when the extended distance of the sinking arm 45 is greater, the filter element 50 sinks further downward in the light window 111, the distance from the photosensitive element 20 is smaller, and the corresponding back focal length of the camera module 100 is smaller; when the extended distance of the inner extension arm 44 is greater, the receiving opening 411 of the filter element holder 40 is smaller, and the required area of ​​the filter element 50 is smaller, thereby making it easier to obtain a suitable filter element 50 and facilitating installation, thereby reducing the cost of the camera module 100. Of course, the extension distance of the sinking arm 45 needs to be combined with the imaging effect of the camera module, such as reducing the back focal length so as not to cause dark spots, such as the image of dust; and the extension distance of the inner extension arm 44 needs to take into account factors such as the light path of the camera module 100 and the photosensitive area 1311 and the non-photosensitive area 1312 of the photosensitive element 20 and the remaining width of the circuit board 12. For example, when the inner extension arm 44 is extended inward, when the filter element 50 is small, the inner extension arm 44 will not block the photosensitive area 1311 of the photosensitive element 20, will not excessively block the incoming light flux, and can extend more at the position where the remaining width of the circuit board 12 package is wider, and extend less at the position where the remaining width of the circuit board 12 package is smaller, thereby reducing the area of ​​the filter element 50 as much as possible while ensuring the imaging quality.

[0240] The shape of the filter element holder 40 matches the shape of the integrated base 11. In some embodiments, the integrated base 11 has an approximately regular symmetrical structure, such as a square ring shape. Accordingly, the filter element holder 40 has a symmetrical structure, the filter element holder body 43 has a regular shape, the inner extension arms 44 have a uniform shape, and the lowering arms 45 have a uniform shape. In other embodiments, due to the different positions of the electronic components 122 to be enclosed, the interior of the integrated base 11 has inwardly protruding portions with varying widths. Accordingly, the filter element holder body 43 can be provided with corresponding grooves or protruding portions, or the inner extension arms 44 can be made of different lengths to accommodate the shape of the integrated base 11, the position of the photosensitive element 20, and facilitate the installation of the filter element 50.

[0241] In some embodiments, the filter element holder 40 can be mounted on the integrated base 11 by gluing, and the flatness of the filter element holder 40 can be adjusted by the thickness of the glue.

[0242] It is worth mentioning that in this embodiment of the present invention, the integrated base 11 is encapsulated on the upper surface 1211 of the circuit board 12, while in other embodiments of the present invention, the integrated base 11 can extend to the side and / or bottom surface of the circuit board 12. Those skilled in the art should understand that the integrated molding range of the integrated base 11 is not a limitation of the present invention.

[0243] In one embodiment, during the assembly process of the integrated base assembly 10 and the filter element holder 40 of the camera module 100, reference is made to Figure 4 First, the integrated base 11 is formed on the substrate 121, and then the filter element 50 is installed on the filter element holder 40, and then the filter element holder 40 with the filter element 50 is installed on the integrated base 11, so that the installation process of the filter element 50 is completed relatively conveniently.

[0244] It is also worth mentioning that in this embodiment of the present invention, the substrate 121 is a flat plate, and the photosensitive element 20 is attached to the upper surface 1211 of the substrate 121. In another embodiment, the substrate 121 may have an inner groove, and the photosensitive element 20 is accommodated in the inner groove to reduce the height of the photosensitive element 20 protruding from the substrate 121. In another embodiment, the substrate 121 may have a through hole connecting both sides of the substrate 121, and the photosensitive element 20 is accommodated in the through hole, so that the relative position of the photosensitive element 20 and the substrate 121 can be adjusted, for example, the upper surface of the photosensitive element 20 is aligned with the upper surface 1211 of the substrate 121, or the lower surface of the photosensitive element 20 is aligned with the lower surface 1212 of the substrate 121. In another embodiment, the substrate 121 may have a stepped passage, and the photosensitive element 20 is mounted in the passage via a flip-chip mounting method. In another embodiment, the substrate 121 may have a reinforcement hole, and the integrated base 11 extends into the reinforcement hole to enhance the structural strength of the integrated base 11 assembly 10. In another embodiment, the circuit board 12 includes a back plate, which is laminated on the bottom of the substrate 121 to enhance the structural strength and heat dissipation performance of the integrated base assembly 10. The back plate is, for example but not limited to, a metal plate. In another embodiment, the integrated base assembly 10 includes an electromagnetic shielding layer, which is wrapped around the outside of the integrated base 11 or surrounds the inside to enhance the anti-electromagnetic interference capability of the camera module 100. In other embodiments of the present invention, the circuit board 12 may also have various other deformations to increase or enhance the different performances of the integrated base assembly 10. Those skilled in the art should understand that the structural deformation of the circuit board 12 described above is not a limitation of the present invention.

[0245] In the above embodiment of the present invention, the filter element holder 40 is mounted on the integrated base 11, and the driver 60 is mounted on the filter element holder 40, that is, the filter element holder 40 is disposed between the driver 60 and the integrated base 11. In another variant embodiment of the present invention, referring to Figure 5 The filter element holder 40 and the driver 60 are both mounted on the top surface 113 of the integrated base 11. Furthermore, the filter element holder 40 is mounted near the inner side of the integrated base 11, and the driver 60 is mounted near the outer side of the integrated base 11, so that the driver 60 and the filter element holder 40 coordinately allocate the top surface 113 of the integrated base 11.

[0246] It is worth mentioning that in the above preferred embodiment of the present invention, the camera module 100 includes the driver 60, and the lens 30 is installed on the driver 60, thereby forming a dynamic focus camera module AF that can automatically adjust the focal length. In another embodiment of the present invention, referring to Figure 6 The camera module 100 does not include the driver 60, forming a fixed focus camera module, that is, an FF (Fix Focus) camera module, and the lens 30 is directly mounted on the filter element holder 40. It should be understood by those skilled in the art that the type of the camera module 100 is not a limitation of the present invention.

[0247] Those skilled in the art will appreciate that the filter element holder 40 of the present invention can be manufactured using conventional holder manufacturing methods, with the dimensions of the filter element holder 40 being designed based on the dimensions of the integrated base 11. For example, the filter element holder 40 can be manufactured by injection molding or by assembly, such as by bonding.

[0248] It is worth mentioning that the various components of the filter element holder 40, namely, the filter element holder body 43, the inner extension arm 44, and the downward sinking arm 45, can be integrally formed of the same material, or can be made of different materials. For clarity of illustration, the various components are represented by different line shading in the drawings, but this does not constitute a limitation on material or structure.

[0249] It is also worth mentioning that the filter element holder 40 can be used to install the filter element 50, and can also be used to install the lens 30 or the driver 60. Those skilled in the art should understand that the mounting components on the filter element holder 40 are not limitations of the present invention.

[0250] like Figure 7FIG. 1 shows a first variant embodiment of an integrated base assembly and filter element holder according to the first preferred embodiment of the present invention. In this embodiment, the internal portion of the integrated base 11A extends upwardly at an angle, forming a light window 111A with a gradually increasing opening. More specifically, the integrated base 11A has an inner side surface 114A that forms an inclination angle α with the central optical axis of the camera module 100, thereby gradually increasing the opening of the light window 111A, facilitating the manufacturing of the integrated base 11A. The value of α ranges from 3° to 30°. In some embodiments, the value of α is selected from 3° to 15°, 15° to 20°, or 20° to 30°. Accordingly, the engagement groove 42A of the filter element holder 40A has an engagement angle α1, which corresponds to the inclination angle α. This ensures that the shape of the engagement groove 42A conforms to the inclined shape of the inner side surface 114A, making the filter element holder 40A more stable.

[0251] In other words, the downward-facing arm 45A extends obliquely and downwardly from the filter element holder body 43A, thereby forming the engagement angle α1 corresponding to the inclination angle α. Furthermore, in one embodiment, the inward-facing arm 44A extends obliquely and horizontally from the downward-facing arm 45A, forming a support angle β greater than 90° to facilitate installation of the filter element 50. Of course, a filter element holder 40 without the engagement angle α1 or the support angle β can also be installed on the integrated base 11 with the inclination angle α.

[0252] like Figure 8A FIG. 4 shows a second variant embodiment of the integrated base assembly and filter element holder according to the first preferred embodiment of the present invention. The filter element holder 40B has a support groove 41B that communicates with the optical window 111 of the integrated base 11B, providing a mounting location for the filter element 50. In other words, the filter element 50 is mounted in the support groove 41B.

[0253] Furthermore, the filter element holder 40B includes a filter element holder body 43B and at least one inner extension arm 44B. The inner extension arm 44B extends inwardly and integrally from the lower portion of the filter element holder body 43B to form the support groove 41B. The filter element holder body 43B is joined to the integrated base 11.

[0254] That is, the filter element holder 40B does not include the sinking arm 45 and does not have the engaging groove 42. Therefore, compared with the above embodiment, the installation position of the filter element 50 is not sunken into the light window 111. However, the extension distance of the inner extension arm 44B can also reduce the required area of ​​the filter element 50. Moreover, the filter element 50 is accommodated in the supporting groove 41B, so that the relative height between the filter element 50 and the filter element holder body 43B is reduced.

[0255] Figure 8B This is a modified embodiment of the second modified embodiment of the filter element holder of the first preferred embodiment of the present invention. The filter element holder 40B1 has a supporting groove 41B1 and a mounting groove 48B1, which provide mounting locations for the lens 30 and the filter element 50, respectively.

[0256] Furthermore, the filter element holder 40B1 includes a filter element holder body 43B1 and at least one inner extension arm 44B1. The inner extension arm 44B1 extends inwardly and integrally from a lower portion of the filter element holder body 43B1 to form the support groove 41B1 and the mounting groove 48B1. The filter element holder 40B1 also includes a lens portion 49B1, which extends upward and integrally from the filter element holder body 43B1 to accommodate the lens 30. In this embodiment of the present invention, the filter element 50 is mounted on the inner extension arm 44B1 in an inverted manner.

[0257] Furthermore, in this embodiment of the present invention, the interior of the lens portion 49B1 is flat and has no threaded structure, and is suitable for installing a threadless lens 30.

[0258] That is, when the camera module 100 is a fixed-focus camera module, the lens 30 can be directly installed inside the filter element lens holder 40B1, thereby limiting the position of the lens 30. In particular, there is a gap between the lens portion 49B1 and the lens 30 to facilitate installation and adjustment of the lens 30 before fixing it in place.

[0259] Figure 8C This is another variant embodiment of the second variant implementation of the filter element holder according to the first preferred embodiment of the present invention. The filter element holder 40B2 has a supporting groove 41B2 and a mounting groove 48B2, which provide mounting locations for the lens 30 and the filter element 50, respectively.

[0260] Furthermore, the filter element holder 40B2 includes a filter element holder body 43B2 and at least one inner extension arm 44B2. The inner extension arm 44B2 integrally extends inwardly and laterally from a lower portion of the filter element holder body 43B2, forming the support groove 41B2 and the mounting groove 48B2. The filter element holder 40B2 also includes a lens portion 49B2, which integrally extends upward from the filter element holder body 43B2 to accommodate the lens 30. In this embodiment of the present invention, the filter element 50 is mounted on the inner extension arm 44B2 in an inverted manner.

[0261] Furthermore, in this embodiment of the present invention, the lens portion 49B1 has a threaded structure inside, suitable for installing a threaded lens 30.

[0262] That is to say, when the camera module 100 is a fixed-focus camera module, the lens 30 can be directly installed inside the filter element lens holder 40B2, thereby limiting the lens 30.

[0263] It is worth mentioning that the above two embodiments are only used as examples to illustrate possible deformation modes of the filter element holder, indicating that the lens 30 can be directly installed inside the filter element holders 40B1 and 40B2, but this is not a limitation.

[0264] like Figure 9A FIG. 4 shows a third variant embodiment of the filter element holder according to the first preferred embodiment of the present invention. In this embodiment, the filter element holder 40 has at least one corner opening 441C, which is located at a corner position of the filter element holder 40 to facilitate installation of the filter element 50 and reduce edge shadows caused by sharp corners in the imaging of the camera module. More specifically, two adjacent inner extension arms 44C form a corner opening 441C, which extends outward to increase the luminous flux of the camera module at the corner position of the filter element holder 40. In other words, the adjacent inner extension arms 44C form an outwardly extending corner opening 441C to increase the luminous flux of the filter element holder 40 at the corner opening 441C and reduce edge shadows.

[0265] Specifically, in one embodiment, the corner openings 441C may be extended square corners. For example, but not limited to, four corresponding extended square corners are provided at the four corners of the filter element holder 40. In other embodiments, the corner openings 441C may be rounded corners to increase the luminous flux at the corners of the filter element holder 40. Of course, in some embodiments, the corner openings 441C may not be provided. Those skilled in the art will understand that the shape, number, and location of the corner openings 441C are not limitations of the present invention.

[0266] like Figure 9B FIG. 4 shows a variation of the first preferred embodiment of the present invention. The filter element holder 40 includes at least one limiting protrusion 46P, which extends at least partially and protrudingly upward from the top of the filter element holder 40. Furthermore, the limiting protrusion 46P extends at least partially and protrudingly upward from the top surface of the filter element holder body 43 to facilitate positioning of the mounted component and prevent dust or light from entering the camera module. The limiting protrusion 46P is used, for example but not limited to, to limit the position of the driver 60 or the lens 30. Specifically, in one embodiment, the limiting protrusion 46P is positioned in the middle of the holder body 43, dividing the top of the holder body 43 into two sections: the outer section for mounting the driver 60 and the inner section for mounting the lens 30. In this manner, the limiting protrusion 46P can locate the position of the driver 60 and reduce its displacement. Furthermore, during assembly, the glue used to mount the driver 60 can be prevented from overflowing into the interior and contaminating the lens or internal components. In particular, the stop protrusion 46P can be an annular protrusion, thereby positioning the driver 60 as a whole and preventing the glue from overflowing into the interior.

[0267] It is worth mentioning that in other embodiments of the present invention, the surface of the limiting protrusion 46P may be provided with threads to facilitate direct installation of the lens 30. When threads are provided on the outer side of the limiting protrusion 46P, it is suitable for the lens 30 with a larger aperture.

[0268] like Figures 10A to 11 FIG. 1 shows a camera module, its integrated base assembly, and filter element holder according to a second preferred embodiment of the present invention. The integrated base 11D includes a base body 112D forming at least one light window 111D, providing a light path for the photosensitive element 20. Furthermore, the base body 112D has at least one opening 1121D connecting the light window 111D with the outside. The filter element holder 40D complements the opening 1121D, thereby forming a laterally enclosed light window 111D.

[0269] In other words, in this embodiment, the base body 112D is not a closed structure but an open structure, and the base body 112D is closed by the addition of the filter element holder 40D.

[0270] The filter element holder 40D includes at least one extension leg 433D that integrally extends downward from the filter element holder body 43D to the substrate 121 to close the opening 1121D. For example, but not limited to, the extension leg 433D is connected to the substrate 121 and / or the base body 112 by adhesive bonding.

[0271] Specifically, the base body 112D forms a U-shaped structure, the filter element holder body 43 is engaged with the U-shaped structure of the base body 112D, and the extended leg 433D of the filter element holder 40D is added to the opening position of the U-shaped structure, thereby closing the integrated base 11D to form a closed internal environment.

[0272] In other words, in this embodiment, the integrated base 11D and the filter element lens holder 40D jointly assume the function of the lens holder of the camera module, so that the advantages of the integrated package and the function of the filter element lens holder 40D are combined.

[0273] It's worth noting that, due to increasing demands for camera module size, the layout of the electronic components 122 on the circuit board 12, the placement of the electrical connector 203, and the packaging position of the integrated base 11 require rational arrangement. This minimizes the component layout area while fully utilizing the substrate 121, thereby further reducing the size of the camera module. According to this embodiment of the present invention, the integrated packaging is performed in the direction in which the electronic components 122 are arranged, encapsulating them. This utilizes the spatial location of the electronic components 122 and reduces electromagnetic interference between them and the electrical connector 203. Furthermore, the extended legs 433D of the filter element holder 40D are positioned on the side where the electronic components 122 are not located, fully utilizing the remaining space on the substrate 121. Furthermore, the bonding process of the filter element holder 40D can adjust and improve the flatness of the integrated base 11D, providing optimal installation conditions for the camera module.

[0274] It is also worth mentioning that the photosensitive element 20, the electronic components 122, the electrical connection element 203, the integrated base 11D, and the filter element holder 40D need to be arranged on the substrate 121. The electronic components 122, the electrical connection element 203, the integrated base 11D, and the filter element holder 40D are arranged around the photosensitive element 20. In other words, the substrate 121 has a plurality of mounting areas 1213, which surround the outside of the photosensitive element 20. In order to improve the space utilization on the substrate 121, in some embodiments, the electronic components 122 are concentratedly arranged in the installation area 1213 on one side or the installation areas 1213 on both sides of the substrate 121, and the installation area 1213 where the electronic components 122 are arranged is integrally packaged by the integrated base 11D, and then the electronic components 122 are covered by the integrated base 11D, and the filter element lens seat 40D is connected to the area of ​​the installation area 1213 where the electronic components 122 and / or adjacent to the electrical connection element 203 are not arranged, so that the filter element lens seat 40D utilizes the narrower position on the substrate 121 through the filter element lens seat 40D, and the filter element lens seat 40D and the integrated base 11D match and form the light window 111D to provide a light path for the photosensitive element 20. In other words, the photosensitive element 20 may not be positioned centrally on the substrate 121, but rather offset to one side, forming mounting areas 1213 of varying widths, thereby facilitating centralized placement of the electronic components 122. Furthermore, the extended legs 433D of the filter element holder 40D are connected to a narrower portion where the electronic components 122 and the electrical connection elements 203 are not located, while the wider mounting area 1213 accommodates the electronic components 122 and the electrical connection elements 203. The integrated base 11D is integrally formed to enclose the electronic components 122. For example, the widths of the photosensitive element may be W1 and W2, with W1 being smaller than W2. The extended legs 433D of the filter element holder 40D are connected to the narrower W1 side, while the electronic components 122 are located on the wider W2 side. This allows the electronic components 122 to be concentrated on the wider side.

[0275] For example, but not limited to, in some embodiments, the assembly process of the integrated base assembly 10 may be to first attach the photosensitive element 20 to the substrate 121 and then install the photosensitive element 20 at a location designed for installation, such as adjacent to one side, to form the mounting areas 1213 of varying widths. The electronic component 122 may then be installed in the mounting areas 1213, such as the wider mounting area. Furthermore, the electronic component 122 may be integrally packaged in the mounting area 1213 containing at least the electronic component to form the integrated base 11D. The filter element holder 40D may then be installed on the integrated base 11D. In another embodiment, the electronic component 122 may first be attached to the predetermined location, such as the predetermined mounting area 1213, to form the integrated base 11D, and then the photosensitive element 20 may be installed.

[0276] It is also worth mentioning that the filter element holder 40D can be manufactured by injection molding, so compared with the molding method of the integrated base 11D, a smaller wall thickness can be obtained. That is, the thickness d1 of the extended leg of the filter element holder 40D can be smaller than the thickness d2 of the integrated base, so that the installation areas 1213 of different widths of the substrate 121 can be more reasonably utilized.

[0277] like Figures 12A to 13A FIG. 1 shows a modified embodiment of an integrated base assembly and filter element holder according to a second preferred embodiment of the present invention. The integrated base 11E includes a base body 112E, which forms at least one light window 111E, providing a light path for the photosensitive element 20. Furthermore, the integrated base 11E has two openings 1121E, each connecting the light window 111E to the outside. The filter element holder 40E complements the two openings 1121E, sealing the sides of the light window 111E.

[0278] The filter element holder 40E includes two extension legs 433E. Each extension leg 433E integrally extends downward from the filter element holder body 43E to the substrate 121 to close each opening 1121E. For example, but not limited to, each extension leg 433E is connected to the substrate 121 and / or the base body 112E by adhesive bonding.

[0279] More specifically, in one embodiment, the base body 112E is a parallel structure, the filter element holder body 43E is coupled to the parallel structure of the base body 112E, and the extended legs 433E of the filter element holder 40E are supplemented at the opening positions at both ends of the parallel structure, thereby closing the base body 112E to form a closed internal environment.

[0280] like Figure 13B and Figure 13C FIG. 1 shows another variant embodiment of the integrated base assembly and filter element holder according to the second preferred embodiment of the present invention. In this embodiment, the integrated base 11Q includes a base body 112Q, which forms at least one light window 111Q, providing a light path for the photosensitive element 20. Furthermore, the integrated base 11Q has two openings 1121Q, each of which connects the light window 111Q to the outside. The filter element holder 40Q complements the two openings 1121Q, enclosing the light window 111Q. Unlike the above embodiment, the two openings 1121Q are positioned opposite each other and have an inverted trapezoidal structure, facilitating the positioning and installation of the filter element holder 40Q. In other words, the two openings 1121Q separate the base body 112Q into two opposite parts, and when the filter element holder 40Q is mounted on the base body 112Q, the two parts of the base body 121Q are closed by the filter element holder 40Q.

[0281] Accordingly, the filter element holder 40Q includes two extension legs 433Q, each integrally extending downward from the filter element holder body 43Q to the substrate 121 to close the opening 1121Q. Specifically, the two extension legs 433Q are disposed opposite each other and have an inverted trapezoidal structure, adapted to complement the opening 1121Q. For example, when the filter element holder 40Q is installed, the extension legs 433Q are confined within the opening 1121Q. In other words, the openings 1121Q gradually increase in size from bottom to top, while the extension legs 433Q gradually widen from bottom to top, complementing the openings 1121Q and thus closing the openings 1121Q.

[0282] Those skilled in the art should understand that the shape and size of the opening 1121Q in the embodiment of the present invention are merely examples to illustrate possible implementations and are not limitations of the present invention.

[0283] In particular, in some embodiments, the electronic components 122 can be concentrated on one side and covered by at least a portion of the base body 112Q, and covered by the wider base body 112Q, while the side without the electronic components 122 corresponds to the narrower base body 112Q. The filter element holder 40Q is mounted on the base body 43Q, and the extension leg 433Q complements the opening 1121Q between the two parts.

[0284] Furthermore, the base body 112Q has at least one opening surface 1122Q, and the opening 1121Q is formed relative to the two opening surfaces 1122Q. The opening surface 1122Q extends upward from the base plate 121 at an angle, so as to form the inverted trapezoidal opening 1121Q. Accordingly, the extension leg 433Q has at least one supplementary surface 4331Q, which corresponds to the opening surface 1122Q, so as to complement the shape of the extension leg 433Q to the opening 1121Q and seal the periphery of the light window 111Q. It is understood that a gap may exist between the supplementary surface 4331Q of the extension leg 433Q and the opening surface 1122Q of the opening 112Q to facilitate the application of an adhesive medium, such as glue, but the size or presence of the gap is not a limitation of the present invention.

[0285] In particular, the extension leg 433Q, the supplementary surface 4331Q and the opening surface 1122Q of the base body 112Q can be fixed or sealed by gluing.

[0286] like Figure 14 FIG. 1 shows a camera module, its base assembly, and filter element holder according to a third preferred embodiment of the present invention. The integrated base 11F has a mounting groove 115F that communicates with the optical window 111F. According to this embodiment of the present invention, the mounting groove 115F is an annular connecting groove, and the filter element holder 40 is mounted therein.

[0287] Specifically, the engaging groove 42 of the filter element holder 40 is engaged with the mounting groove 115F of the integrated base 11F, so that the filter element holder body 43 of the filter element holder 40 is supported and accommodated in the 115F.

[0288] The filter element holder body 43 of the filter element holder 40 has a predetermined thickness, thereby preventing it from contacting components located above, such as the driver 60 or the lens 30. Preferably, when the filter element holder 40 is installed in the mounting slot 115F, the top surface of the filter element holder 40 is aligned with the top surface of the base body 112F, thereby preventing the filter element holder 40 from protruding from the base body 112F and from contacting the driver 60 or the lens 30 located above. Of course, in other embodiments of the present invention, the top surface of the filter element holder 40 may protrude from the base body 112F to accommodate drivers 60 of different sizes, to position the driver 60, and to prevent glue from overflowing during installation. The present invention is not limited in this respect.

[0289] More specifically, the integral base 11F includes a plurality of raised steps 116F protruding from the base body 112F. The raised steps 116F partially extend upward from the base body 112F to form the mounting groove 115F. In other embodiments of the present invention, an annular integral step 116F can be used to form the mounting groove 115F.

[0290] According to this embodiment of the present invention, the integrated base 11F includes four raised steps 116F, each of which is integrally connected and rotated to form a square annular raised structure. The driver 60 is at least partially mounted on the raised steps 116F, thereby forming a dynamic focus camera module. The driver 60 is operably connected to the circuit board 12 via at least one pin 61. In other embodiments, the lens 30 is at least partially mounted on the raised steps 116F, forming a fixed focus camera module.

[0291] In this embodiment of the present invention, the lateral widths of the raised steps 116F are uniform, and the widths of the formed mounting grooves 115F are uniform. Accordingly, the width of the filter element holder body 43 of the filter element holder 40 can be designed based on the dimensions of the support groove 41, and the width of the filter element holder body 43 in all directions is uniform. In other embodiments of the present invention, the width of the raised steps 116F can be varied as needed, and accordingly, the width of the filter element holder body 43 can be designed based on the width of the mounting grooves 115F.

[0292] like Figure 15A and 15B , is a camera module according to a fourth preferred embodiment of the present invention. The integrated base 11G has at least one mounting groove 115G and at least one notch 117G. The mounting groove 115G is connected to the light window 111G, and the notch 117G connects the light window 111G and the outside. In other words, the mounting groove 115G is an open connecting groove, not a closed structure. The filter element lens holder 40G is mounted in the mounting groove 115G. More specifically, in this embodiment, the mounting groove 115G is a U-shaped groove, and the U-shaped opening corresponds to the notch 117G.

[0293] Specifically, the filter element holder 40G is engaged with the mounting groove 115G of the integrated base 11G, so that the filter element holder body 43G of the filter element holder 40G is supported in the mounting groove 115G.

[0294] The filter element holder body 43G of the filter element holder 40G has a predetermined thickness, thereby preventing it from easily contacting components located above, such as the driver 60 or the lens 30. Preferably, when the filter element holder 40G is installed in the installation groove 115G, the top surface of the filter element holder 40G is aligned with the top surface of the base body 112G, thereby preventing the filter element holder 40G from protruding from the base body 112G and preventing it from easily contacting the driver 60 or the lens 30 located above.

[0295] More specifically, the integrated base 11G includes a plurality of raised steps 116G protruding from the base body 112G. Each raised step 116G partially extends upward from the base body 112G to form the mounting slot 115G. At least one side surface of the integrated base 11G lacks the raised step 116G, forming the notch 117G.

[0296] According to this embodiment of the present invention, the integrated base 11G includes three raised steps 116G, each of which is integrally connected to form a mounting groove 115G. In other words, the side without the raised steps 116G forms the notch 117G. More specifically, the three raised steps 116G are integrally connected to form a U-shaped raised structure.

[0297] The filter element holder body 43G of the filter element holder 40G includes at least one engaging edge 431G and at least one extending edge 432G. The engaging edge 431G is configured to engage with the mounting groove 115G, and the extending edge 432G is configured to fill the gap 117G. In other words, the extending edge 432G extends into the gap 117G, filling the gap 117G and thereby forming a closed internal environment.

[0298] According to this embodiment of the present invention, the filter element holder body 43G of the filter element holder 40G includes three joining edges 431G and one extended edge 432G, and each of the joining edges 431G and the extended edge 432G is integrally connected in a rotational manner to adapt to the shape of the mounting groove 115G.

[0299] The sinking arm 45G is turned and integrally extended downward from the joint edge 431G and the extension edge 432G, thereby forming the joint groove 42G. The inner extension arm 44G is turned and integrally extended laterally from the sinking arm 45G, thereby forming the support groove 41G.

[0300] It is worth mentioning that the electronic components 122 are arranged at different positions of the main body of the circuit board 12, and the integrated base 11G covers the electronic components 122. At the position where the electronic components 122 are arranged, the integrated base 11G requires a larger thickness and is convenient for setting the mounting groove 115G. However, the position without the electronic components 122 can be set with a smaller thickness, thereby reducing the size of the circuit board 12 and is not suitable for forming the mounting groove 115G. According to this embodiment of the present invention, the electronic components 122 are arranged on the integrated base 11G corresponding to the three joint edges 431G. The corresponding part of the integrated base 11G has a larger lateral thickness and is used to form the mounting groove 115G. The lateral thickness of the integrated base 11G on the side corresponding to the extended edge 432G is smaller and is not used to form the mounting groove 115G. Instead, the extended edge 432G is used to fill the gap 117G and serve as the raised step 116G.

[0301] The driver 60 is at least partially mounted on the raised step 116G, thereby forming a dynamic focus camera module. The driver 60 is operatively connected to the circuit board 12 via at least one pin 61. In other embodiments, the lens 30 is at least partially mounted on the raised step 116G, thereby forming a fixed focus camera module.

[0302] More specifically, three sides of the driver 60 are mounted on the raised step 116G, while the remaining side is mounted on the extended edge 432G of the filter element holder 40G. In some embodiments, a gap exists between the driver 60 and the extended edge 432G, and the gap is sealed with glue, thereby forming a closed internal environment for the camera module. In other words, the surface height of the extended edge 432G is lower than the surface height of the raised step 116G, and the height difference can be compensated by glue. In particular, the driver 60 can be mounted on the raised step 116G by bonding, so that the optical axes of the lens 30 and the photosensitive element 20 are aligned.

[0303] like Figure 16A and 16B FIG. 1 shows a camera module according to a fifth preferred embodiment of the present invention. The integrated base 11H has at least one mounting slot 115H, which is connected to the optical window 111H. The filter element holder 40H is mounted in the mounting slot 115H. More specifically, each mounting slot 115H forms a U-shaped structure with no opening.

[0304] Specifically, the engaging groove 42H of the filter element holder 40H is engaged with the mounting groove 115H of the integrated base 11H, so that the filter element holder body 43H of the filter element holder 40H is supported in the supporting groove 41H.

[0305] Furthermore, the filter element holder 40H is a U-shaped structure with an opening in the U-shape, and the U-shaped structure of the filter element holder 40H matches the shape formed by each of the mounting grooves 115H.

[0306] The filter element holder body 43H of the filter element holder 40H has a predetermined thickness, thereby preventing it from easily contacting components located above, such as the driver 60 or the lens 30. Preferably, when the filter element holder 40H is installed in the installation slot 115H, the top surface of the filter element holder 40H is aligned with the top surface of the base body 112H, thereby preventing the filter element holder 40H from protruding from the base body 112H and preventing it from easily contacting the driver 60 or the lens 30 located above.

[0307] More specifically, the integrated base 11H includes a plurality of raised steps 116H protruding from the base body 112H. Each raised step 116H partially extends upward from the base body 112H to form the mounting slot 115H. At least one side surface of the integrated base 11H lacks the raised step 116H, forming the notch 117H.

[0308] According to this embodiment of the present invention, the integrated base 11H includes four raised steps 116H, three of which are integrally connected to form the mounting slot 115H. The remaining raised step 116H integrally extends upward from the base body 112H and does not form the mounting slot 115H. In other words, the U-shaped opening of the mounting slot 115H is blocked by one of the raised steps 116H, forming a closed structure.

[0309] The filter element holder body 43H of the filter element holder 40H includes at least one joining edge 431H. The joining edge 431H is used to be joined to the mounting groove 115H.

[0310] According to this embodiment of the present invention, the filter element holder body 43H of the filter element holder 40H includes three joining edges 431H, and each of the joining edges 431H is integrally connected in a rotational manner to form a U-shaped structure with an opening to adapt to the shape of the mounting groove 115H.

[0311] The downward-facing arm 45H extends downward from the engagement edge 431H to form an integral engagement groove 42H, which facilitates engagement with the mounting groove 115H. The inward-extending arm 44H extends laterally from the downward-facing arm 45H to form a integral support groove 41H, providing a mounting position for the filter element 50. Unlike the previous embodiment, both the engagement groove 42H and the support groove 41H are U-shaped structures with one side open, rather than closed. That is, when the filter element 50 is mounted on the filter element holder 40H, only three sides are secured, with one side directly abutting the inner surface of the raised step 116H, which does not form the mounting groove 115H.

[0312] It is worth mentioning that the electronic components 122 are arranged at different positions of the main body of the circuit board 12, and the integrated base 11H covers the electronic components 122. At the position where the electronic components 122 are arranged, the integrated base 11H requires a larger thickness and is convenient for setting the mounting groove 115H, while the position without the electronic components 122H can be set with a smaller thickness, thereby reducing the size of the circuit board 12 and is not suitable for forming the mounting groove 115H. According to this embodiment of the present invention, the electronic components 122 are arranged on the integrated base 11H corresponding to the three joint edges 431H, the lateral thickness of the integrated base 11H is larger, and the mounting groove 115H is set, while the lateral thickness of the integrated base 11H on the other side corresponding to the raised step 116H that is not used to form the mounting groove 115 is smaller.

[0313] The driver 60 is at least partially mounted on the raised step 116, thereby forming a dynamic focus camera module. The driver 60 is operably connected to the circuit board 12 via at least one pin 61. In other embodiments, the lens 30 is at least partially mounted on the raised step 116H, forming a fixed focus camera module.

[0314] More specifically, the driver 60 is mounted on the raised step 116H, wherein three sides are supported on the raised step 116H forming the mounting groove 115H, and the remaining side is mounted on the raised step 116H not used to form the mounting groove 115H.

[0315] In other words, unlike the above-mentioned preferred embodiment, in this embodiment, the filter element holder 40H removes the extended edge 432G to form an open U-shaped structure, and the raised step 116H of the integrated base 11H at least partially extends upward to form a closed U-shaped structure without forming the notch 117G.

[0316] like Figure 17A 、 17B , which is a cross-sectional view taken along two perpendicular directions of a camera module according to a sixth preferred embodiment of the present invention. Unlike the aforementioned preferred embodiments, the integrated base 11I includes two raised steps 116I and two notches 117I. The raised steps 116I are integrally connected and rotated to form the mounting slot 115I. In other words, the notches 117I are formed on both sides without the raised steps 116I.

[0317] The filter element holder body 43I of the filter element holder 40I includes at least one engaging edge 431I and at least one extending edge 432I. The engaging edge 431I is configured to engage with the mounting groove 115I, and the extending edge 432I is configured to fill the indentation 117I. In other words, the extending edge 432I extends into the indentation 117I, filling the indentation 117I and thereby forming a closed internal environment.

[0318] According to this embodiment of the present invention, the filter element holder body 43I of the filter element holder 40I includes two joining edges 431I and two extended edges 432I, and each of the joining edges 431I and the extended edges 432I are integrally connected in a rotational manner to adapt to the shape of the mounting groove 115I.

[0319] The sinking arm 45I extends downward from the joint edge 431I and the extension edge 432I, thereby forming the joint groove 42I. The inner extension arm 44I extends laterally from the inner extension arm 44I, thereby forming the support groove 41I.

[0320] Furthermore, the two raised steps 116I of the integrated base 11I are adjacent to the two engaging edges 431I, and the two notches 117I are adjacent to each other. In other words, the two raised steps 116I form an L-shaped structure, thereby forming an L-shaped mounting groove 115I. The two notches 117I are adjacent to each other, thereby forming an L-shaped structure. Accordingly, the two engaging edges 431I of the filter element holder 40I are adjacent to each other, suitable for engaging with the L-shaped mounting groove 115I, and the two extended edges 432I are adjacent to each other, suitable for filling the L-shaped notches 117I, thereby forming a closed internal environment.

[0321] The driver 60 is at least partially mounted on the raised step 116I, thereby forming a dynamic focus camera module. The driver 60 is operatively connected to the circuit board 12 via at least one pin 61. In other embodiments, the lens 30 is at least partially mounted on the raised step 116I or the filter element lens holder body 43I, forming a fixed focus camera module.

[0322] More specifically, two sides of the driver 60 are supported on the raised steps 116I forming the mounting groove 115I, and the remaining two sides are mounted on the extended edge 432I of the filter element holder 40I.

[0323] like Figure 18A and 18B 1 and 2 show a modified implementation of the integrated base assembly and filter element lens holder of the camera module according to the sixth preferred embodiment of the present invention. Figure 18A and 18B The two cross-sectional views are taken in two perpendicular directions. Unlike the previous embodiment, the two joining edges 431J are opposed, and the two notches 117J are opposed. Accordingly, the two joining edges 431J of the filter element holder 40J are opposed, adapted to fit within the two opposing mounting grooves 115J, while the two extended edges 432J are opposed, adapted to fill the two opposing notches 117J, thereby forming a closed internal environment.

[0324] like Figure 19A and 19B , which is shown in FIG. 1 , is a camera module according to the seventh preferred embodiment of the present invention. Figure 19A and 19B The figures are cross-sectional views taken in two perpendicular directions. Unlike the aforementioned preferred embodiment, the integrated base 11K includes a raised step 116K and three notches 117K. The raised step 116K partially and integrally extends upward from the base body 112K to form the mounting slot 115K. In other words, the notches 117K are formed on the three sides without the raised step 116K.

[0325] The filter element holder body 43K of the filter element holder 40K includes at least one engaging edge 431K and at least one extending edge 432K. The engaging edge 431K is configured to engage with the mounting groove 115K, and the extending edge 432K is configured to fill the notch 117K. In other words, the extending edge 432K extends into the notch 117K, filling the notch 117K and thereby forming a closed internal environment.

[0326] According to this embodiment of the present invention, the filter element holder body 43K of the filter element holder 40K includes a joining edge 431K and three extended edges 432K, and each of the joining edges 431K and the extended edges 432K are integrally connected in a rotational manner to adapt to the shapes of the mounting groove 115K and the notch 117K.

[0327] The sinking arm 45K extends downward from the joint edge 431K and the extension edge 432K, thereby forming the joint groove 42K. The inner extension arm 44K extends laterally from the inner extension arm 44K, thereby forming the support groove 41K.

[0328] The driver 60 is at least partially mounted on the raised step 116K, thereby forming a dynamic focus camera module. The driver 60 is operatively connected to the circuit board 12 via at least one pin 61. In other embodiments, the lens 30 is at least partially mounted on the raised step 116K, forming a fixed focus camera module.

[0329] More specifically, one side of the driver 60 is supported by the raised step 116K forming the mounting groove 115K, and the remaining three sides are mounted on the extended edge 432K of the filter element holder 40K.

[0330] like Figures 20A to 21 , is a camera module according to the eighth preferred embodiment of the present invention. The camera module can be a fixed-focus camera module. Unlike the above preferred embodiments, the filter element holder 40L includes an upper extension wall 46L, which extends upward from the filter element holder body 43L to form a limit opening 461L. The limit opening 461L is used to limit the installed components, such as, but not limited to, the driver 60 or the lens 30. That is, when assembling the camera module, the driver 60 or the lens 30 is installed in the limit opening 461L of the filter element holder 40L, limiting the driver 60 or the lens 30 so that the optical axis of the driver 60 or the lens 30 is aligned with the optical axis of the photosensitive element 20. The size of the limit opening 461L can be determined according to the size of the installed components.

[0331] In other words, the upper extension wall 46L acts as a frame constraint, preventing excessive deviation of components such as the driver 60 or the lens 30 when mounted on the filter element holder 40L, thereby ensuring the consistency of the camera module's optical system. Furthermore, the upper extension wall 46L protects mounted components, such as the driver 60 or lens 30, from unwanted external contact, ensuring stable installation. It also prevents dust from entering the camera module.

[0332] Further, when the camera module is a dynamic focus camera module, refer to Figure 20BThe filter element holder 40L has at least one pin hole 462L for passing the pin 61. That is, when the driver 60 is installed in the limiting hole 461L of the filter element holder 40L, the pin of the driver 60 passes through the pin hole 462L and is electrically connected to the circuit board 12. Of course, when the camera module is a fixed-focus camera module, the filter element holder 40L may not be provided with the pin hole 462L. It is worth mentioning that the pin hole 462L may not be visible in the actual cross-sectional view passing through the center line, but for ease of explanation and understanding, the possible projected position of the pin hole 462L is indicated by a dotted line. The position of the pin hole 462L needs to be determined based on the position of the pin 61, and the present invention is not limited in this regard.

[0333] like Figure 22 FIG2 shows a camera module according to a ninth preferred embodiment of the present invention. Unlike the aforementioned preferred embodiments, the filter element holder 40M includes an upper extension wall 46M and a lower extension wall 47M. The upper extension wall 46M extends upward from the filter element holder body 43M, forming a retaining opening 461M. The lower extension wall 47M extends downward from the filter element holder body 43M, forming a lower opening 471M. Specifically, the lower extension wall 47M extends integrally from the upper extension wall 46M, forming a single outer retaining wall.

[0334] The limiting opening 461M is used to limit the installed components, such as but not limited to the driver 60 and the lens 30. The lower opening 471M is used to accommodate the integrated base 11. That is, when assembling the camera module 100, the driver 60 or the lens 30 is installed in the limiting opening 461M of the filter element holder 40M, and the integrated base 11 is accommodated in the lower opening 471M. The upper extension wall 46M limits and blocks the lens 30, so that the optical axis of the lens 30 and the photosensitive element 20 are aligned. The lower extension wall 47M blocks the integrated base 11, making the overall structure of the camera module more regular, convenient for installation, and more beautiful in appearance. The sizes of the limiting opening 461M and the lower opening 471M can be determined according to the sizes of the installed components, such as but not limited to the sizes of the driver 60, the lens 30, and the integrated base 11.

[0335] In one embodiment, the lower extension wall 47M may extend to the circuit board 12 and be fixedly connected to the circuit board 12 by, for example but not limited to, gluing, so that the filter element holder 40M is installed more stably.

[0336] like Figure 23 As shown, it is a camera module according to the tenth preferred embodiment of the present invention.

[0337] The integrated base 11N includes a lens wall 118N, which at least partially extends upward from the raised step 116N to form a lens chamber 1181N suitable for mounting the lens 30, thereby forming a fixed-focus camera module.

[0338] Furthermore, the raised step 116N and the base body 112N form the mounting groove 115N for mounting the filter element holder 40. The lens wall 118N and the raised step 116N form another mounting groove 115N for providing a mounting position for the lens 30. That is, in this embodiment, the integrated base 11N has two mounting grooves 115N, one of which is for mounting the filter element holder 40, and the other is for mounting the lens 30.

[0339] Furthermore, the engaging groove 42 of the filter element holder 40 engages with one of the mounting grooves 115N, and the filter element 50 is mounted in the supporting groove 41 of the filter element holder 40. The lens 30 is mounted in the other mounting groove 115N.

[0340] The lens wall 118N provides an installation position for the lens 30 and constrains the installation position of the lens 30, so that the optical axes of the lens 30 and the photosensitive element 20 are consistent, thereby improving the installation accuracy.

[0341] Figure 24 : This is an application diagram of the camera module according to the above preferred embodiment of the present invention. The camera module 100 can be applied to various electronic devices 300, and the electronic device 300 includes an electronic device body 200. The camera module 100 is arranged on the electronic device body 200, and cooperates with the electronic device body 200 to complete image acquisition and reproduction. The electronic device 300 includes, but is not limited to, smart phones, wearable devices, computer equipment, televisions, vehicles, cameras, monitoring devices, etc. The camera module 100 cooperates with the electronic device 300 to realize image acquisition and reproduction of the target object. The camera module 100 in the figure is applied to a smart phone to assist the smart phone in acquiring and reproducing image information.

[0342] like Figures 25A to 27This is an array camera module according to the eleventh preferred embodiment of the present invention. The array camera module 1000 includes a plurality of camera module units 100, each of which cooperates with each other to achieve image capture. The array camera module 1000 can be applied to various electronic devices 300, such as, but not limited to, smartphones, wearable devices, computer devices, televisions, vehicles, cameras, and monitoring devices. The array camera module 1000 cooperates with the electronic devices 300 to capture and reproduce images of target objects.

[0343] It is worth mentioning that, for the sake of convenience of explanation, in the following embodiments and accompanying drawings of the present invention, an array camera module 1000 composed of two camera module units 100, i.e., a dual-camera array camera module, is taken as an example for explanation. In other embodiments of the present invention, the array camera module 1000 may include more units, such as three or more, and each of the camera module units 100 is arranged in an array to form the array camera module 1000, such as arranged in parallel.

[0344] It is also worth mentioning that the camera modules 100 in the above-mentioned preferred embodiments 1 to 10, the camera modules formed by the combination of their features, and the equivalently implemented camera modules can all be used as the camera module monomer 100 to constitute the array camera module 1000.

[0345] Specifically, the camera module unit 100 includes an integrated base assembly 10 , a photosensitive element 20 , a lens 30 , a filter element lens holder 40 and a filter element 50 .

[0346] The integrated base assembly 10 includes an integrated base 11 and a circuit board 12. The integrated base 11 is integrally packaged with the circuit board 12, for example, but not limited to, by molding. The filter element lens holder 40 is mounted on the integrated base 11. Thus, the integrated base 11 and the filter element lens holder 40 cooperate with each other to replace the lens holder or bracket of a traditional camera module, and do not require the lens holder or bracket to be attached to the circuit board with glue as in traditional packaging processes. The photosensitive element 20 is operatively connected to the circuit board 12.

[0347] The photosensitive element 20 is electrically connected to the integrated base assembly 10 , the filter element holder 40 is mounted on the integrated base assembly 10 , and the lens 30 is located in the light sensing path of the photosensitive element 20 .

[0348] The integrated base 11 includes a light window 111 and a base body 112 forming the light window 111. The light window 111 provides a light path for the photosensitive element 20. The base body 112 is molded and integrally encapsulated with the circuit board 12. Specifically, the light window 111 is a closed ring structure, thereby providing a sealed internal environment for the lens 30.

[0349] The circuit board 12 includes a substrate 121, and a plurality of electronic components 122 formed on the substrate 121 such as those mounted by the SMT process, and the electronic components 122 include but are not limited to resistors, capacitors, drive devices, etc. In this embodiment of the present invention, the integrated base 11 is integrally packaged in the substrate 121 and integrally covered with the electronic components 122, thereby preventing dust and debris similar to those in traditional camera modules from adhering to the electronic components 122 and further contaminating the photosensitive element 20, thereby affecting the imaging effect. It is understandable that in other modified embodiments, it is also possible that the electronic components 122 are buried in the substrate 121, that is, the electronic components 122 may not be exposed to the outside. The substrate 121 of the circuit board 12 can be a PCB hard board, a PCB soft board, a hard-soft combination board, a ceramic substrate, etc. It is worth mentioning that in this preferred embodiment of the present invention, because the integrated base 11 can completely cover these electronic components 122, the electronic components 122 do not need to be buried in the substrate 121. The substrate 121 is only used to form a conductive circuit, so that the final integrated base assembly 10 can be thinner.

[0350] More specifically, the substrate 121 has an upper surface 1211 and a lower surface 1212. The upper surface 1211 is opposite to the lens 30, while the lower surface 1212 is opposite to the lens 30. The photosensitive element 20 includes a front surface 201 and a back surface 202. The front surface 201 is opposite to the lens 30 and is used for light sensing, while the back surface 202 is opposite to the lens 30 and is mounted on the upper surface 1211 of the substrate 121. The photosensitive element 20 is electrically connected to the substrate 121 via at least one electrical connection element 203. The electrical connection element 203 may be, for example, but not limited to, gold wire, silver wire, copper wire, or aluminum wire. The photosensitive element is mounted on the substrate 121 using, for example, but not limited to, surface mount technology (SMT) or gold wire bonding using a chip on board (COB). Of course, in other embodiments of the present invention, the photosensitive element 20 can be installed on the substrate 121 in other ways, such as embedded, FC (Flip Chip, chip flip), etc. Those skilled in the art should understand that the connection and installation method of the photosensitive element 20 and the circuit board 12 is not a limitation of the present invention.

[0351] More specifically, the front surface 201 of the photosensitive element 20 has a photosensitive area 1311 and a non-photosensitive area 1312. In particular, the non-photosensitive area 1312 surrounds the photosensitive area 1311. The photosensitive area 1311 is used to perform photosensitivity and convert light signals into electrical signals. The non-photosensitive area 1312 transmits the electrical signals to the circuit board 12 via the electrical connection element 203. The lens 30 and the photosensitive element 20 are optically aligned with each other, with the optical axes being consistent, so that light passing through the lens 30 can reach the photosensitive element 20 via the light window 111. After further photoelectric conversion by the photosensitive element 20, the electrical signals can be transmitted to the circuit board 12, thereby allowing the camera module to capture image information.

[0352] like Figures 25A to 26As shown, the camera module unit 100 includes a filter element 50 for filtering the light passing through the lens 30. The filter element 50 includes, for example but not limited to, an infrared cutoff filter element 50 and a blue glass filter. The filter element 50 is mounted on the filter element lens holder 40, located in the light path of the photosensitive element 20. The camera module unit 100 may also include a driver 60, such as a voice coil motor, a piezoelectric motor, etc. The lens 30 is mounted on the driver 60 to form a dynamic focus camera module. The driver 60 includes at least one pin 61, and the driver 60 is operatively connected to the circuit board 12 through the pin 61. The pin 61 can be one of a single pin, a double pin, a single row of pins or a double row of pins. In the drawings of the present invention, a double pin is used as an example for illustration, but it is not a limitation. The pin 61 is usually located near the edge, from Figure 26 The cross-center line in the position corresponds to the position section, corresponding to Figure 25A and 25B cross-sectional view, and the pin 61 corresponds to Figure 25A and 25B The pins 61 are not actually visible in the cross-sectional views, but for ease of understanding and explanation, dotted lines are used in the corresponding cross-sectional views to indicate the presence of the pins 61. This does not indicate the actual location of the pins 61. The situation is similar in the subsequent figures. Those skilled in the art will understand that the type, shape, and location of the pins 61 are not limitations of the present invention.

[0353] like Figures 25A to 27 As shown, the filter element 50 is mounted on the filter element holder 40 and sunken into the optical window 111 of the integrated base 11. The integrated base 11 of the integrated base assembly 10 has a top surface 113. The filter element holder 40 is mounted on this top surface 113 of the integrated base 11, and the driver 60 is mounted on the filter element holder 40. According to this embodiment of the present invention, the top surface 113 of the integrated base 11 extends flat. In other words, the integrated base 11 forms a platform structure without any stepped protrusions, and the filter element holder 40 is mounted on this platform structure. It is worth noting that in this manner, the top surface 113 of the integrated base 11 extends flat without any significant bends. Therefore, during the integrated packaging process, such as molding, a smoother, burr-free mounting surface can be obtained, providing smooth mounting conditions for the filter element holder 40.

[0354] Furthermore, the filter element holder 40 has a supporting groove 41 and an engaging groove 42. The supporting groove 41 is used to mount the filter element 50, and the engaging groove 42 is used to mount the filter element 50 on the integrated base 11. The supporting groove 41 is connected to the light window 111 to form a receiving opening 411 for accommodating the filter element 50. The engaging groove 42 surrounds the outer periphery of the filter element holder 40.

[0355] In other words, the supporting groove 41 forms an inner loop, so that the filter element 50 can be installed inside the filter element holder 40, in the light path of the photosensitive element 20. The engaging groove 42 forms an outer loop, so that it can be engaged with the integral base 11 outward, providing a mounting position for the filter element holder 40 through the integral base 11.

[0356] More specifically, the shape of the engagement groove 42 matches the shape of the integrated base 11 , so as to facilitate stably mounting the filter element holder 40 on the integrated base 11 .

[0357] Furthermore, the filter element holder 40 includes a filter element holder body 43, at least one inwardly extending arm 44, and at least one downwardly extending arm 45. The downwardly extending arm 45 extends longitudinally and flexibly from the filter element holder body 43 to facilitate sinking the filter element's mounting position into the light window 111. The inwardly extending arm 44 extends laterally and flexibly from the downwardly extending arm 45 to provide a horizontal mounting position for the filter element 50, aligning the optical axes of the filter element 50 and the photosensitive element 20. Specifically, the filter element holder 40 includes four integrally connected inwardly extending arms 44 and four integrally connected downwardly extending arms 45, each of which extends at different positions to form the annular, integrated filter element holder 40.

[0358] In one embodiment, the shape of the engagement groove 42 of the filter element holder 40 is consistent with the shape of the light window 111 formed by the integrated base 11, and the shape of the support groove 41 is consistent with the shape of the filter element 50. In particular, the filter element 50 is a square structure, and the top view of the support groove 41 is annular, such as a square ring.

[0359] It is worth mentioning that the extension distance of the sinking arm 45 affects the sinking depth of the filter in the light window 111, while the extension distance of the inner extension arm 44 affects the size of the installed filter area. For example, when the extension distance of the sinking arm 45 is greater, the position of the filter in the light window 111 sinks further, the distance from the photosensitive element 20 is smaller, and the corresponding back focal length of the camera module is smaller; when the extension distance of the inner extension arm 44 is greater, the accommodating opening 411 of the filter element lens holder 40 is smaller, and the required area of ​​the filter element 50 is smaller, thereby making it easier to obtain a suitable filter element 50 and convenient to install, thereby reducing the cost of the camera module. Of course, the extension distance of the sinking arm 45 needs to be combined with the imaging effect of the camera module, such as reducing the back focal length so that dark spots such as the image of dust do not appear; and the extension distance of the inner extension arm 44 needs to take into account factors such as the light path of the camera module unit and the photosensitive area 1311 and the non-photosensitive area 1312 of the photosensitive element 20 and the remaining width of the circuit board 12. For example, when the inner extension arm 44 is extended inward, when the filter element 50 is small, the inner extension arm 44 will not block the photosensitive area 1311 of the photosensitive element 20, will not excessively block the incoming light flux, and can extend more at the position where the remaining width of the circuit board 12 package is wider, and extend less at the position where the remaining width of the circuit board 12 package is smaller, thereby reducing the area of ​​the filter element 50 as much as possible while ensuring the imaging quality.

[0360] For example, refer to Figure 25B , the distance between the inner extension arms 44 on both sides is marked as L, then the diameter of the filter element 50 only needs to be larger than L, and it can be mounted on the inner extension arm 44 without being mounted on the base body 112, thereby reducing the required area of ​​the filter element 50.

[0361] The shape of the filter element holder 40 matches the shape of the integrated base 111A. In some embodiments, the integrated base 11 has a roughly regular symmetrical structure, such as a square ring shape. Accordingly, the filter element holder 40 has a symmetrical structure, the filter element holder body 43 has a regular shape, and the inner extension arms 44 and the lowering arms 45 have a uniform shape. In other embodiments, due to the different positions of the electronic components 122 to be encapsulated, the integrated base 11 has inwardly protruding portions with varying widths. Accordingly, the filter element holder body 43 can be provided with corresponding grooves or protrusions, or the inner extension arms 44 can be made of varying lengths to accommodate the shape of the integrated base 11, the position of the photosensitive element 20, and facilitate installation of the filter element 50.

[0362] In some embodiments, the filter element holder 40 can be mounted on the integrated base 11A by gluing, and the flatness of the filter element holder 40 can be adjusted by the thickness of the glue.

[0363] Furthermore, the two camera module monomers are connected in a conjoined manner to form an array structure. Specifically, the two integrated base assemblies 10 of the two camera module monomers 100 are connected in a conjoined manner to form a conjoined base assembly 1100. The two circuit boards 12 are connected in an integral manner to form a conjoined circuit board 1120. The two integrated bases 11 are connected in a conjoined manner to form a conjoined base 1110. The two filter element holders 40 are connected in a conjoined manner to form a conjoined filter element holder 1400. That is, the conjoined base 1110 formed in the integrated packaging process forms two light windows 111 to provide light paths for the two photosensitive elements 20 respectively. Alternatively, the two filter element holders 40 can be independent holders, which are not connected in an integral manner and are respectively mounted on the conjoined base 1110. The two integrated bases 11 can also be two independent bases.

[0364] Specifically, the integrated base 1110 is integrally packaged with the integrated circuit board 1120. The integrated base 1110 has two light windows 111, which respectively provide light passages for the two photosensitive elements 20 and the lens 30. The integrated filter element holder 1400 has two supporting grooves 41, each for mounting the filter element 50.

[0365] It's worth noting that the conjoined arrangement of the two camera modules 100 helps improve their consistency and saves space. For example, the conjoined filter element holder 1400 can simultaneously provide mounting locations for the two filter elements 50. During the manufacturing process, the consistency of the two support grooves 41 can be controlled by area, thereby providing a consistent mounting environment for the filter elements 50.

[0366] The integrated base 1110 includes a connecting portion 1111 that integrally connects the adjacent integrated bases 11. The integrated filter element holder 1400 includes a bridging portion 1410 that integrally connects the two filter element holders 40 and is adapted to bridge the connecting portion 1111 of the integrated base 1110. More specifically, two adjacent edges of the base bodies 112 of the two integrated bases 11 are integrally connected to form the connecting portion 1111. Two adjacent edges of the filter element holder bodies 43 of the two filter element holders 40 are integrally connected to form the bridging portion 1410.

[0367] It is worth mentioning that in this embodiment of the present invention, referring to Figure 25A , 25B, the two camera module monomers 100 both include the driver 60, that is, the two camera module monomers 100 are dynamic focus camera modules, and the two dynamic focus camera modules cooperate with each other to achieve image acquisition. In other embodiments of the present invention, the array camera module 1000 can also be a combination of other types of camera module monomers. In one embodiment, referring to Figure 28A , 28B, the two camera module monomers 100 do not include the driver 60, that is, the two camera module monomers 100 are fixed-focus camera modules, and the two fixed-focus camera modules cooperate with each other to achieve image acquisition. In one embodiment, referring to Figure 29A , 29B, one of the camera module units 100 of the array camera module 1000 includes a driver 60, constituting a dynamic focus camera module, and the other camera module unit 100 does not include the driver 60, constituting a fixed focus camera module, and the dynamic focus camera module and the fixed focus camera module cooperate to realize image acquisition.

[0368] In this embodiment, the integrated filter element holder 1400 is mounted on the integrated base 1110, and each of the drivers 60 is mounted on the integrated filter element holder 1400. In other words, the integrated filter element holder 1400 is disposed between the driver 60 and the integrated base 1110. In another variant embodiment, referring to Figure 30A , 30B The one-piece base 1110 and the driver 60 are both mounted on the top surface 113 of the one-piece base 1110. Furthermore, the one-piece filter element holder 1400 is mounted near the inner side of the one-piece base 11, and the driver 60 is mounted near the outer side of the one-piece base 1110, so that the driver 60 and the one-piece filter element holder 1400 coordinately share the top surface 113 of the one-piece base 1110.

[0369] like Figure 31As shown, it is a first variant embodiment of the one-piece base and the one-piece filter element holder according to the eleventh preferred embodiment of the present invention. In this embodiment, the interior of each one-piece base 11A extends upwardly at an angle to form the light window 111A with a gradually increasing opening. More specifically, each one-piece base 11A has an inner side surface 114A, and the inner side surface 114A forms an inclination angle α with the central optical axis of the camera module, so that the opening of the light window 111A gradually increases to facilitate the manufacturing and molding of the one-piece base 11A. The size range of α is 3° to 30°. In some embodiments, the value of α is selected from 3° to 15°, 15° to 20°, or 20° to 30°. Correspondingly, the engagement groove 42A of each filter element holder 40A has an engagement angle α1, which corresponds to the inclination angle α, so that the shape of the engagement groove 42A is adapted to the inclined shape of the inner surface 114A, making the installation of the filter element holder 40A more stable.

[0370] In other words, the sinking arm 45A extends obliquely and downwardly from the filter element holder body 43A, thereby forming the engagement angle α1 corresponding to the tilt angle α. Furthermore, in one embodiment, the inwardly extending arm 44A extends obliquely and horizontally from the sinking arm 45A, forming a support angle β greater than 90° to facilitate installation of the filter element 50. Of course, a filter element holder 40A without the engagement angle α1 or the support angle β can also be installed on the integrated base 11A with the tilt angle α.

[0371] like Figure 32A FIG. 2 shows a second variant embodiment of the one-piece base assembly and one-piece filter element holder according to the eleventh preferred embodiment of the present invention. Each filter element holder 40B has a support groove 41B that communicates with the corresponding optical window 111B of the one-piece base 11B, providing a mounting location for the filter element 50. In other words, the filter element 50 is mounted in the support groove 41B.

[0372] Furthermore, the filter element holder 40B includes a filter element holder body 43B and at least one inner extension arm 44B. The inner extension arm 44B extends inwardly and integrally from the lower portion of the filter element holder body 43B to form the support groove 41B. The filter element holder body 43B is joined to the integral base 11B.

[0373] That is, the filter element holder 40B does not include the sinking arm 45 and the engagement slot 42. Therefore, compared to the above embodiment, the installation position of the filter element 50 is not sunken into the light window 111B. However, by extending the inner extension arm 44B, the required area of ​​the filter element 50 can also be reduced.

[0374] Figure 32B This is a modified embodiment of the second modified embodiment of the integrated filter element holder according to the eleventh preferred embodiment of the present invention. Each filter element holder 40B1 has a supporting groove 41B1 and a mounting groove 48B1, providing mounting locations for the lens 30 and the filter element 50, respectively.

[0375] Furthermore, each filter element holder 40B1 includes a filter element holder body 43B1 and at least one inner extension arm 44B1. The inner extension arm 44B1 extends inwardly and laterally from a lower portion of the filter element holder body 43B1, forming the support groove 41B1 and the mounting groove 48B1. The filter element holder 40B1 also includes a lens portion 49B1, which extends upward and integrally from the filter element holder body 43B1 to accommodate the lens 30. In this embodiment of the present invention, the filter element 50 is mounted on the inner extension arm 44B1 in an inverted manner.

[0376] Furthermore, in this embodiment of the present invention, the interior of the lens portion 49B1 is flat and has no threaded structure, and is suitable for installing a threadless lens 30.

[0377] That is, when the camera module unit 100B1 is a fixed-focus camera module, the lens 30 can be directly installed inside the filter element lens holder 40B1, thereby limiting the position of the lens 30. In particular, there is a gap between the lens portion 49B1 and the lens 30 to facilitate installation and adjustment of the lens 30.

[0378] Figure 32C This is another variant embodiment of the second variant implementation of the integrated filter element holder according to the eleventh preferred embodiment of the present invention. Each filter element holder 40B2 has a support groove 41B2 and a mounting groove 48B2, providing mounting locations for the lens 30 and the filter element 50, respectively.

[0379] Furthermore, each filter element holder 40B2 includes a filter element holder body 43B2 and at least one inner extension arm 44B2. The inner extension arm 44B2 extends inwardly and integrally from the lower portion of the filter element holder body 43B2 to form the support groove 41B2 and the mounting groove 48B2. The filter element holder 40B2 also includes a lens portion 49B2, which extends upward and integrally from the filter element holder body 43B2 to accommodate the lens 30. In this embodiment of the present invention, the filter element 50 is mounted on the inner extension arm 44B2 in an inverted manner.

[0380] Furthermore, in this embodiment of the present invention, the lens portion 49B1 has a threaded structure inside, suitable for installing a threaded lens 30.

[0381] That is to say, when the camera module unit 100B2 is a fixed-focus camera module, the lens 30 can be directly installed inside the filter element lens holder 40B2, thereby limiting the lens 30.

[0382] It is worth mentioning that the above two embodiments are only used as examples to illustrate possible deformation modes of the filter element holder 40, indicating that the lens 30 can be directly installed inside the filter element holders 40B1 and 40B2, but are not restrictive.

[0383] like Figure 33A FIG. 3 shows a third variant embodiment of the array camera module according to the eleventh preferred embodiment of the present invention. In this embodiment, each filter element holder 40C has at least one corner opening 441C. This corner opening 441C is located at a corner of the filter element holder 40 to facilitate installation of the filter element 50 and reduce edge shadowing caused by sharp corners in the camera module image. More specifically, two adjacent inwardly extending arms 44C form a corner opening 441C that extends outward to increase the luminous flux of the camera module at the corner position of the filter element holder 40C.

[0384] Specifically, in one embodiment, the corner openings 441C may be extended square corners. For example, but not limited to, four corresponding extended square corners are provided at the four corners of the filter element holder 40C. In other embodiments, the corner openings 441C may also be rounded corners to increase the luminous flux at the corners of the filter element holder 40C. Of course, in some embodiments, the corner openings 441C may not be provided. Those skilled in the art will understand that the shape, location, and number of the corner openings 441C are not limitations of the present invention.

[0385] like Figure 33BFIG. 1 shows a variant embodiment of the eleventh preferred embodiment of the present invention. In this embodiment, each filter element holder 40P includes a limiting protrusion 46P that extends upward from at least a portion of the top surface of the filter element holder body 43P in a raised manner to help position the mounted component and prevent dust and light from entering the camera module. The limiting protrusion 46P is used, for example but not limited to, to position the driver 60 or lens 30. Specifically, in this embodiment, the conjoined filter element holder 1400P includes two limiting protrusions 46P, each forming an annular protrusion to position the corresponding driver 60. In another embodiment, the middle portion of the conjoined filter element holder 1400P, i.e., the bridge portion 1410P, formed by the two filter element holders 40P, may not be provided with the limiting protrusion 46P, but rather may be provided only around the periphery of the conjoined filter element holder 1400P.

[0386] In this embodiment of the present invention, the limiting protrusion 46P can locate the position of the driver 60, reduce the offset of the driver 60, and during the assembly process, prevent the glue used to install the driver 60 from overflowing into the interior and contaminating the lens 50 or internal components.

[0387] It is worth mentioning that in other embodiments of the present invention, the surface of the limiting protrusion 46P may be provided with threads to facilitate direct installation of the lens 30. When threads are provided on the outer side of the limiting protrusion 46P, it is suitable for the lens 30 with a larger aperture.

[0388] like Figures 34A to 35 , an array camera module according to the twelfth preferred embodiment of the present invention is shown. Each integrated base 11D includes a base body 112D forming at least one light window 111D, providing a light path for the photosensitive element 20. Furthermore, the base body 112D has at least one opening 1121D connecting the light window 111D with the outside. The filter element holder 40D complements the opening, thereby forming a laterally enclosed light window 111D.

[0389] Each filter element holder 40D includes at least one extension leg 433D that integrally extends downward from the filter element holder body 43D to the substrate 121D to close the opening 1121D. For example, but not limited to, the extension leg 433D is connected to the substrate 121D and / or the base body 112D by adhesive bonding.

[0390] The base body 112D forms a U-shaped structure, the filter element holder body 43D is engaged with the U-shaped structure of the base body 121D, and the extended leg 433D of the filter element holder 40D is added to the opening position of the U-shaped structure, thereby closing the integrated base 11D to form a closed internal environment.

[0391] In other words, in this embodiment, the integrated base 11D and the filter element lens holder 40D jointly assume the function of the lens holder of the camera module, so that the advantages of the integrated package and the function of the filter element lens holder 40D are combined.

[0392] It's worth noting that, due to increasing demands for camera module size, the layout of the electronic components 122D on the circuit board 12D, the placement of the electrical connector 203, and the packaging position of the integrated base 11D require rational arrangement. This minimizes the component layout area while fully utilizing the substrate 121D, thereby further reducing the size of the camera module. According to this embodiment of the present invention, the electronic components 122D are packaged in the direction in which they are arranged, encapsulating them. This utilizes the spatial location of the electronic components while reducing electromagnetic interference between the electrical components and the electrical connector 203. The filter element holder 40D is provided without the electrical components, fully utilizing the remaining space on the substrate 121D. Furthermore, the bonding process of the filter element holder 40D adjusts and improves the flatness of the integrated base 11D, providing optimal installation conditions for the camera module.

[0393] like Figures 36A to 36C FIG. 1 shows a modified embodiment of a one-piece base and one-piece filter element holder for an array camera module according to the twelfth preferred embodiment of the present invention. The one-piece base 11E includes a base body 112E, which forms at least one light window 111E, providing a light path for the photosensitive element 20. Furthermore, the one-piece base 11E has two openings 1121E, each connecting the light window 111E to the outside. The filter element holder 40E complements the two openings 1121E, sealing the sides of the light window 111E.

[0394] The filter element holder 40E includes two extension legs 433E, each extending integrally downward from the filter element holder body 43E to the substrate 121E to seal each opening. For example, but not limited to, each extension leg 433E is attached to the substrate 121E and / or the base body 112E by adhesive bonding. More specifically, in one embodiment, the base body 112E is a parallel structure. The filter element holder 40E body is coupled to the parallel structure of the base body 112E, and the extension legs 433E of the filter element holder 40E complement the openings at both ends of the parallel structure, thereby closing the base body 112E and forming a closed internal environment. In some embodiments, two adjacent extension legs 433E are integrally connected to form a common extension leg, i.e., a shared leg. Specifically, the shared leg is spaced apart from the two light windows 111E, isolating the light paths of the two camera module units. That is, in this embodiment, the conjoined filter element holder 1400E includes three extending legs 433E arranged in parallel. The middle extending leg 433E separates the two light windows 111E, while the remaining two extending legs 433E complement the openings 1121E of the conjoined base 1110E, thereby forming two closed, independent light windows 111E. In other words, in the array camera module 1000E, the two light windows 111E of the two camera modules 100E are interconnected, and the conjoined filter element holder 1400E complements the conjoined base 1110E, forming two separated, closed light windows 111E. Adjacent extending legs 433E of the filter element holder 40E form a common portion, replacing the conjoined portion 1111E of the conjoined base 1110E. In one embodiment, two adjacent extending legs 433E are integrally connected.

[0395] like Figure 37A and Figure 37B FIG. 1 shows another variant embodiment of the integrated base assembly and filter element holder according to the twelfth preferred embodiment of the present invention. In this embodiment, each integrated base includes a base body 112Q, which forms at least one light window 111E, providing a light path for the photosensitive element 20. Furthermore, the integrated base 11Q has at least one opening 1121Q, each of which connects the light window 111Q to the outside. The filter element holder 40Q complements the opening 1121Q, enclosing the light window 111Q. Unlike the above embodiment, in the conjoined base assembly 1100Q, the two openings 1121Q of the two integrated base bodies 112Q are positioned opposite each other, thereby facilitating the positioning of the conjoined filter element holder 1400Q from both sides.

[0396] Furthermore, each opening 1121Q has an inverted trapezoidal structure to facilitate positioning and installation of the filter element holder 40Q. Accordingly, the filter element holder includes at least one extension leg 433Q, each integrally extending downward from the filter element holder body 43Q to the substrate 121 to facilitate sealing the opening 1121Q. Specifically, two extension legs 433Q are disposed opposite each other and have an inverted trapezoidal structure, adapted to complement the corresponding opening 1121Q. For example, when the filter element holder 40Q is installed, the extension legs are confined within the opening 1121Q, sealing the perimeter of each of the two light windows 111Q.

[0397] Those skilled in the art should understand that the shape and size of the opening 1121Q in the embodiment of the present invention are merely examples to illustrate possible implementations and are not limitations of the present invention.

[0398] In particular, in some embodiments, the electronic components 122Q can be concentrated on one side and covered by at least a portion of the base body 112Q, and are covered by the wider base body 112Q, while the side without the electronic components 122Q corresponds to the narrower base body 112Q. The filter element holder is mounted on the base body 43Q by 40Q, and the extension leg 433Q is inserted into the opening 1121Q between the two parts.

[0399] Furthermore, the base body 112Q has at least one opening surface 1122Q, with the opening 1121Q formed between two opposing opening surfaces. The opening surface 1121Q extends upwardly and integrally from the base plate 121 at an angle, thereby forming the trapezoidal opening 1121Q. Accordingly, the extension leg 433Q has at least one complementary surface 4331Q, which corresponds to the opening surface 1122Q, so that the extension leg 433Q complements the opening 1121Q in a complementary manner, thereby sealing the perimeter of the light window 111Q.

[0400] In particular, the extension leg 433Q, the supplementary surface 4331Q, and the opening surface 1122Q of the base body 112Q can be fixed by gluing.

[0401] like Figures 38A to 39, which illustrates an array camera module according to the thirteenth preferred embodiment of the present invention. Each integral base 11F has a mounting slot 115F and at least one notch 117F. The mounting slot 115F is connected to the optical window 111F. In this embodiment of the present invention, the notch 117F is located adjacent to the two integral bases, above the connecting portion 1111F of the conjoined base 1110F, and connects both sides. In other words, the notch 117F connects the two mounting slots 115 to accommodate the bridging portion 1410F of the conjoined filter element holder 1400F.

[0402] Each filter element holder 40F is mounted in the mounting groove 115F. More specifically, the mounting groove 115F is a U-shaped groove, with the U-shaped opening corresponding to the notch 117F. In particular, the U-shaped grooves of the two filter element holders 40F abut against each other, forming an internally connected, closed structure. When the conjoined filter element holder 1400 is mounted on the conjoined base 1110, the bridge portion 1410 of the conjoined filter element holder 1400 bridges the central notch 117F.

[0403] Specifically, the engaging groove 42F of the filter element holder 40F is engaged with the mounting groove 115F of the integrated base 111F, so that the filter element holder body 43F of the filter element holder 40F is supported in the supporting groove 41F.

[0404] The filter element holder body 43F of the filter element holder 40F has a predetermined thickness, thereby preventing it from easily contacting components located above, such as the driver 60 or the lens 30. Preferably, when the filter element holder 40F is installed in the installation slot 115F, the top surface of the filter element holder 40F is aligned with the top surface of the base body 112F, thereby preventing the filter element holder 40F from protruding from the base body 112F or protruding less than the top surface, and preventing it from easily contacting the driver 60 or the lens 30 located above.

[0405] More specifically, each integrated base 11F includes a plurality of raised steps 116F protruding from the base body 112F. Each raised step 116F partially extends upward from the base body 112F to form the mounting slot 115F. At least one side surface of the integrated base 11F lacks the raised steps 116F, forming the notch 117F.

[0406] According to this embodiment of the present invention, each of the integrated bases 11F includes three raised steps 116F, which are integrally connected to form a U-shaped mounting groove 115F. In other words, the notch 117F is formed on the side without the raised steps 116F.

[0407] The filter element holder body 43F of the filter element holder 40F includes at least one engaging edge 431F and at least one extended edge 432F. The engaging edge 431F is configured to engage with the mounting groove 115F, while the extended edge 432F is configured to fill the gap 117F. In other words, the extended edge 432F extends into the gap 117F, filling the gap 117F and thus forming a closed internal environment. In this embodiment, the extended edge 432F forms the bridging portion 1410F.

[0408] According to this embodiment of the present invention, the filter element holder body 43F of the filter element holder 40F includes three joining edges 431F and one extended edge 432F, and each of the joining edges 431F and the extended edge 432F is integrally connected in a rotational manner to adapt to the shape of the mounting groove 115F.

[0409] The sinking arm 45F extends downward from the joint edge 431F and the extension edge 432F, thereby forming the joint groove 42F. The inner extension arm 44F extends laterally from the inner extension arm 44F, thereby forming the support groove 41F.

[0410] It is worth mentioning that the electronic components 122F are arranged at different positions of the main body of the circuit board 12F, and the integrated base 11F covers the electronic components 122F. At the position where the electronic components are arranged, the integrated base 11F requires a larger thickness and is convenient for setting the mounting groove 115F, while the position without the electronic components 122F can be set with a smaller thickness, thereby reducing the size of the circuit board 12F, and is not suitable for setting the mounting groove 115F. According to this embodiment of the present invention, the electronic components 122F are arranged on the integrated base 11F corresponding to the three joining edges 431F, the lateral thickness of the integrated base 11F is larger, and the mounting groove 115F is set, while the lateral thickness of the integrated base 11F on the side corresponding to the extended edge 432F is smaller, and the mounting groove 115F is not set. Instead, the extended edge 432F is used to fill the gap 117F and assume the role of the raised step 116F.

[0411] The driver 60 is at least partially mounted on the raised step 116F, thereby forming a dynamic focus camera module. The driver 60 is operatively connected to the circuit board 12 via at least one pin 61. In other embodiments, the lens 30 is mounted on the raised step 116F or the filter element holder 40F, forming a fixed focus camera module.

[0412] More specifically, three sides of the driver 60 are mounted on the raised step 116F, while the remaining side is mounted on the extended edge 432F of the filter element holder 40F. In some embodiments, a gap exists between the driver 60 and the extended edge 432F, which is sealed with glue to create a closed internal environment for the camera module. In other words, the surface height of the extended edge 432F is lower than the surface height of the raised step 116F, and the height difference can be compensated by glue. In particular, the driver 60 can be mounted on the raised step 116F by bonding, so that the optical axes of the lens 30 and the photosensitive element 20 are aligned.

[0413] like Figures 40A to 41 , which is shown in FIG. 1 , is an array camera module according to the fourteenth preferred embodiment of the present invention.

[0414] Each integrated base 11R includes a base body 112R defining at least one light window 111R, providing a light path for the photosensitive element 20. Furthermore, the base body 112R has at least one opening 1121R connecting the light window 111R with the outside. The filter element holder 40R complements the opening, thereby forming a laterally enclosed light window 111R. In this embodiment, the two openings 1121R of the two integrated bases 11R of the conjoined base 1110R communicate with each other.

[0415] Each filter element holder 40R includes at least one extension leg 433R that integrally extends downward from the filter element holder body 43R to the substrate 121R to close the opening 1121R. For example, but not limited to, the extension leg 433R is connected to the substrate 121R and / or the base body 112R by adhesive bonding.

[0416] In some embodiments, two adjacent extension legs 433R are integrally connected to form a common extension leg, i.e., a shared leg. Specifically, the shared leg is spaced between the two light windows 111R, isolating the light paths of the two camera modules. In other words, in this embodiment, the conjoined filter element holder 1400R includes two integrally connected extension legs 433R, located between the two intermediate light windows 111R, separating the two light windows 111R, thereby forming two enclosed, independent light windows 111R.

[0417] The integrated base 11R has at least one mounting groove 115R and an opening 117R. The mounting groove 115R is connected to the light window 111R, and the notch 117R is connected to the light windows 111R on both sides. The filter element holder 40R is installed in the mounting groove 115R.

[0418] According to this embodiment of the present invention, the integrated base 11R includes three raised steps 116R, wherein each of the raised steps 116R partially extends upward from the base body 112R to form the mounting groove 115R.

[0419] The filter element holder body 43R of the filter element holder 40R includes at least one joining edge 431R, and the joining edge 431R is used to be joined to the mounting groove 115R.

[0420] According to this embodiment of the present invention, the filter element holder body 43R of each filter element holder 40R includes three joining edges 431R and one extended edge 432R. The joining edges 431R of adjacent integral bases 11R extend in unison and are mutually parallel, with the extended edge 432R disposed between the joining edges 431R. In other words, in this embodiment, the notch 117R of the conjoined base is disposed adjacent to and interconnected between the two integral bases 11R. The extended edges 432R of the conjoined filter element holder are disposed at corresponding adjacent locations, integrally connecting to form the bridging portion 1410R.

[0421] The sinking arm 45R extends downward from the engagement edge 431R to form an engagement groove 42R, which facilitates engagement with the mounting groove 115R. The inner extension arm 44R extends laterally from the sinking arm 45R to form a support groove 41R, which provides a mounting location for the filter element 50. It is worth mentioning that the electronic components 122R are arranged at different positions on the circuit board body 121R, and the integrated base 11R covers the electronic components 122R. In the positions where the electronic components are arranged, the integrated base 11R requires a greater thickness and is convenient for forming the mounting groove 115R. In the positions where the electronic components 122R are not arranged, a smaller thickness can be set, thereby reducing the size of the circuit board 12R and making it unsuitable for forming the mounting groove 115R. According to this embodiment of the present invention, the electronic components 122R are arranged on the integrated base 11R corresponding to the two joint edges 431R, the lateral thickness of the integrated base 11R is relatively large, and the mounting groove 115R is provided, while the lateral thickness of the integrated base 11R on the other side corresponding to the raised step 116R where the mounting groove 115R is not formed is relatively small.

[0422] The driver 60 is at least partially mounted on the raised step 116R, thereby forming a dynamic focus camera module. The driver 60 is operatively connected to the circuit board 12R via at least one pin 61. In other embodiments, the lens 30 is mounted on the raised step 116R or the filter element holder 40R, forming a fixed focus camera module.

[0423] More specifically, the driver 60 is mounted on the raised step 116R, wherein two sides are supported on the raised step 116R forming the mounting groove 115R, and the remaining side is mounted on the raised step 116R not forming the mounting groove 115R, and the remaining side is supported on the extended edge 432R.

[0424] like Figures 42A to 43, which is a modified embodiment of an array camera module according to the fourteenth preferred embodiment of the present invention. Each integrated base 11H includes three raised steps 116H, which are integrally connected in a rotational manner. Two of the raised steps 116H and the base body 112H form a mounting groove 115H, while another raised step 116H extends upward from the base body 112H and does not form the mounting groove 115H. Adjacent positions of the two integrated bases 11H do not include the raised steps 116H, but instead form a notch 117H. In other words, the integrated base 1110H forms two parallel mounting grooves 115H, with the notch 117H located between the two mounting grooves 115H. Accordingly, each filter element holder 40H forms a U-shaped structure, with the opening of the U-shaped structure facing the raised step 116H that does not form the mounting groove 115H. That is, the integrated filter element holder 1400H is an E-shaped structure when viewed from above, with the middle portion of the E-shaped middle structure spanning the integrated portion 1111H of the integrated base 1110H, and the openings at both ends being blocked by the raised steps 116H.

[0425] like Figure 44A 、 44B Yes and Figure 45 , which is shown in FIG. 15 , is an array camera module according to the fifteenth preferred embodiment of the present invention.

[0426] Unlike the above preferred embodiment, the integrated base 11I includes a raised step 116I and three notches 117I. The raised step 116I partially extends upward from the integrated base 112I to form the mounting slot 115I. In other words, the notches 117I are formed on the three sides without the raised step 116I.

[0427] The filter element holder body 43I of the filter element holder 40I includes at least one engaging edge 431I and at least one extending edge 432I. The engaging edge 431I is configured to engage with the mounting groove 115I, and the extending edge 432I is configured to fill the indentation 117I. In other words, the extending edge 432I extends into the indentation 117I, filling the indentation 117I and thereby forming a closed internal environment.

[0428] According to this embodiment of the present invention, the filter element holder body 43I of the filter element holder 40I includes a joint edge 431I and three extended edges 432I. The joint edge 431I and the extended edges 432I are integrally connected in a rotationally oriented manner to accommodate the shape of the mounting slot 115I. It is worth noting that in this embodiment, in the array camera module, the two adjacent extended edges 432I of the conjoined filter element holder 1400I formed by the two filter element holders 40I are integrally connected to form a common portion between the two adjacent camera module units 100I, namely, the bridging portion 1410I.

[0429] The sinking arm 45I extends downward from the joint edge 431I and the extension edge 432I, thereby forming the joint groove 42I. The inner extension arm 44I extends laterally from the inner extension arm 44I, thereby forming the support groove 41I.

[0430] Furthermore, in this embodiment, the two raised steps 116I of the two integral bases 11I of the combined base 1100I extend and connect integrally to form a straight-line structure, thereby forming a straight-line mounting groove. The notches 117I are adjacent to each other, forming an E-shaped structure. Accordingly, the extended edges 432I of the filter element holder 40I are adjacent to each other, forming a U-shaped structure, with the joint edge 431I positioned at the end of the U-shaped structure. In the combined filter element holder 1400I, two adjacent extended edges 432I are integrally connected to form a bridging portion 1410I, which accommodates the combined portion 1111I of the combined base 1110I. According to another variant embodiment, the two raised steps 116I and the two joint edges 431I of the integral base 11I are adjacent to each other, and the two notches 117I are adjacent to each other. That is to say, the two raised steps 116I form an L-shaped structure, thereby forming an L-shaped mounting groove 115I. The notches 117I are adjacent to each other, thereby forming an L-shaped extension opening. Correspondingly, the two joining edges 431I of the filter element holder 40I are adjacent to each other, suitable for joining to the L-shaped mounting groove 115I, and the two extended edges 432I are adjacent to each other, suitable for filling the L-shaped notch 117I, thereby forming a closed internal environment. The driver 60 is at least partially mounted on the raised step 116I, thereby forming a dynamic focus camera module. The driver 60 is operably connected to the circuit board 12I through at least one pin 61. In other embodiments, the lens 30 is mounted on the raised step 116I or the filter element holder 40I to form a fixed focus camera module. More specifically, two sides of the driver 60 are supported on the raised steps 116I forming the mounting groove 115I, and the remaining two sides are mounted on the extended edge 432I of the filter element holder 40I.

[0431] like Figure 46A and Figure 47 As shown, it is a modified embodiment of the array camera module according to the fifteenth preferred embodiment of the present invention. In this embodiment of the present invention, the setting position of the raised step 116J is different from the above-mentioned preferred embodiment. In the one-piece base 1110J of the array camera module, the raised steps 116J of the two one-piece bases 11J stand opposite to each other to form a parallel structure, and each of the raised steps 116J and the corresponding base body 111 form the mounting groove 115J. That is to say, the two mounting grooves 115J located in the one-piece base 1110J are arranged at positions opposite to each other. Compared with the above-mentioned embodiment fifteen, in this modified embodiment, the two raised steps 116J of the one-piece base 1110J are changed from being arranged in a straight line to being arranged in relative parallel.

[0432] like Figure 48A 、48B and Figure 49 , which illustrates an embodiment of an array camera module according to the sixteenth preferred embodiment of the present invention. Unlike the aforementioned preferred embodiments, each integral base 11K includes a raised step 116K and three notches 117K. The raised step 116K partially and integrally extends upward from the base body 112K to form the mounting slot 115K. In other words, the notches 117K are formed on the three sides without the raised step 116K.

[0433] The filter element holder body 43K of the filter element holder 40K includes at least one engaging edge 431K and at least one extending edge 432K. The engaging edge 431K is configured to engage with the mounting groove 115K, and the extending edge 432K is configured to fill the notch 117K. In other words, the extending edge 432K extends into the notch 117K, filling the notch 117K and thereby forming a closed internal environment.

[0434] According to this embodiment of the present invention, the filter element holder body 43K of the filter element holder 40K includes a joint edge 431K and three extended edges 432K. Each joint edge 431K and the extended edges 432K are integrally connected in a rotational manner to accommodate the shapes of the mounting groove 115K and the notch 117K. Two adjacent extended edges 432K are integrally connected to form the bridging portion 1410K of the integrated filter element holder 1400, which bridges the integrated portion 1111K of the integrated base 1110K.

[0435] The sinking arm 45K extends downward from the joint edge 431K and the extension edge 432K, thereby forming the joint groove 42K. The inner extension arm 44K extends laterally from the inner extension arm 44K, thereby forming the support groove 41K.

[0436] The driver 60 is at least partially mounted on the raised step 116K, thereby forming a dynamic focus camera module. The driver 60 is operatively connected to the circuit board 12K via at least one pin 61. In other embodiments, the lens 30 is mounted on the raised step 116K or the filter element holder 40K, forming a fixed focus camera module.

[0437] More specifically, one side of the driver 60 is supported by the raised step 116K forming the mounting groove 115K, and the remaining three sides are mounted on the extended edge 432K of the filter element holder 40K.

[0438] It is worth noting that in this embodiment of the present invention, the two raised steps 116K of the two integral bases 11K are parallel and staggered, thereby limiting the installation position of the integrated filter element holder 1400. In other embodiments of the invention, the relative positions of the raised steps 116K can be arranged in other arrangements, such as parallel or perpendicular directions. Those skilled in the art will understand that the arrangement structure of the two raised steps 116K is not a limitation of the present invention.

[0439] like Figures 50A to 51 , is an array camera module according to the seventeenth preferred embodiment of the present invention. Unlike the above preferred embodiments, each filter element holder 40L includes an upper extension wall 46, which extends upward from the filter element holder body 43L to form a limit opening 461L. The limit opening 461L is used to limit the installed components, for example but not limited to the driver 60 and the lens 30. That is, when assembling the array camera module 1000L, each driver 60 or the lens 30 is installed in the limit opening 461L of each filter element holder 40L, limiting the driver 60 or the lens 30 so that the optical axis of each driver 60 or each lens 30 is aligned with the optical axis of each photosensitive element 20. The size of the limit opening 461L can be determined according to the size of the installed components.

[0440] In other words, the upper extension wall 46L acts as a frame constraint, preventing excessive deviation of components such as the driver 60 or the lens 30 when mounted on the filter element holder 40L, thereby ensuring the consistency of the camera module's optical system. Furthermore, the upper extension wall 46L protects mounted components, such as the driver 60 or lens 30, from unwanted external contact, ensuring stable installation. It also blocks external dust from entering the interior of each camera module unit 100L.

[0441] Furthermore, when the camera module 100L is a dynamic-focus camera module, the filter element holder 40L has at least one pin hole 462L for receiving the pin 61. That is, when the driver 60 is mounted in the retaining hole 461L of the filter element holder 40L, the pin of the driver 60 passes through the pin hole 462L and is electrically connected to the circuit board 12L. Of course, when the camera module 100L is a fixed-focus camera module, the filter element holder 40L may not have the pin hole 462L.

[0442] It is worth mentioning that the pin port 462L may not be visible in the actual cross-sectional view, but for ease of explanation and understanding, the pin port 462L is indicated by a dotted line in the figure, and this position is not limited to the corresponding actual setting position.

[0443] It is worth mentioning that the driver 60 or the lens 30 of the array camera module 1000L is limited to the upper extension wall 46L, which helps to constrain the optical axis consistency of the camera module monomer 100L and facilitates the control of the consistency of the two camera module monomers 100L.

[0444] like Figure 52 FIG2 shows an array camera module according to the eighteenth preferred embodiment of the present invention. Unlike the aforementioned preferred embodiments, each filter element holder 40M includes an upper extension wall 46M and a lower extension wall 47M. The upper extension wall 46M extends upward from the filter element holder body 43M to form a retaining opening 461M, while the lower extension wall 47M extends downward from the filter element holder body 43M to form a lower opening 471M. Specifically, the lower extension wall 47M extends integrally from the upper extension wall 46M to form a single outer retaining wall.

[0445] The limiting opening 461M is used to limit the installed components, for example but not limited to the lens 30. The lower opening 471M is used to accommodate the integrated base 11M. That is, when assembling the array camera module 1000M, the driver 60 or the lens 30 is installed in the limiting opening 461M of the filter element lens holder 40M, and the integrated base 11M is accommodated in the lower opening 471M. The upper extension wall 46M limits and blocks the lens 30, so that the optical axis of the lens 30 is consistent with that of the photosensitive element 20. The lower extension wall 47M blocks the integrated base 11M, making the overall structure of the array camera module 1000M more regular, convenient for installation, and more beautiful in appearance. The sizes of the limiting opening 461M and the lower opening 471M can be determined according to the sizes of the installed components, for example but not limited to the sizes of the driver 60, the lens 30, and the integrated base 11M.

[0446] In one embodiment, the lower extension wall 47M may extend to the circuit board 12M, and may be fixedly connected to the circuit board 12M by, for example but not limited to, gluing, so that the filter element holder 40M is installed more stably.

[0447] Figure 53 It is a cross-sectional view of an array camera module according to the nineteenth preferred embodiment of the present invention.

[0448] Each of the integrated bases 11N includes a lens wall 118N, which at least partially extends upward from the raised step 116N to form a lens chamber 1181N suitable for installing the lens 30, thereby forming a fixed-focus camera module.

[0449] Furthermore, the raised step 116N and the base body 112N form the mounting groove 115N for mounting the filter element holder 40N. The lens wall 118N and the raised step 116N form another mounting groove 115N for providing a mounting position for the lens 30.

[0450] Furthermore, the engaging groove 42N of the filter element holder 40N engages with the mounting groove 115N, and the filter element 50 is mounted in the supporting groove 41N of the filter element holder 40N. The lens 30 is mounted in the other mounting groove 115N.

[0451] The lens wall 118N provides an installation position for the lens 30 and constrains the installation position of the lens 30, so that the optical axes of the lens 30 and the photosensitive element 20 are consistent, thereby improving the installation accuracy.

[0452] like Figure 54A , is a decomposition diagram of the array camera module according to the twentieth preferred embodiment of the present invention. The array camera module 1000S includes two camera module monomers 100S, and each of the camera module monomers 100S includes an integrated base assembly 10S, wherein the integrated base assembly 10S includes a circuit board 12S. Different from the above preferred embodiment, the two circuit boards 12S of the two camera module monomers 100S are spliced ​​together to form the conjoined circuit board 1120S, and the integrated base 11S is integrally encapsulated in the two circuit boards 12S. In other words, the two circuit boards 12S are not connected as a whole. In another embodiment of the present invention, the two circuit boards 12S can be independent of each other and there is a gap between them, and they are not spliced ​​together. It can be understood that the present invention is not limited in this regard.

[0453] like Figure 54B, is a cross-sectional view of an array camera module according to the twentieth preferred embodiment of the present invention. The array camera module 1000T includes two integrally connected camera module units 100T, which include a conjoined circuit board 1120T and a conjoined base 1110T integrally formed on the conjoined circuit board 1120T. The conjoined base 1110T has two light windows 111T, which respectively provide light paths for two photosensitive elements 20 and two lenses 30. The conjoined base 1110T also forms two mounting grooves 115T on the top side. Two independent filter element holders 40T are respectively disposed in the two mounting grooves 115T for respectively carrying two filter elements 50. It is understood that in another variant embodiment, the conjoined base 1110T may not have the mounting grooves 115T formed on the top side, but may instead have a flat surface for mounting the two independent filter element holders 40T. It is worth mentioning that each of the independent filter element holders 40T can also be constructed into any structure in the first to tenth embodiments described above.

[0454] It is worth mentioning that in the above embodiment, a dual-lens array camera module composed of two camera module units 100 is used as an example for description. In other embodiments, the array camera module 1000 may further include more camera module units 100. In the above embodiment, the features of each camera module unit 100 are arranged in a symmetrical form to form the array camera module 1000. In other implementations, the features of each camera module unit 100 can be arbitrarily combined to form an asymmetric array camera module 1000. The present invention is not limited in this respect.

[0455] like Figure 55 FIG2 is a schematic diagram of an application of the array camera module according to the above embodiment of the present invention. The array camera module 1000 is set in an electronic device body 200 to form an electronic device 300 with the array camera module 1000.

[0456] like Figure 55 As shown, the array camera module 1000 is applied to a smartphone, and cooperates with the smartphone to realize image acquisition and reproduction. In other embodiments, the array camera module 1000 can be set in other electronic device bodies 200 to form different electronic devices 300. Specific examples of the electronic devices 300 include, but are not limited to, wearable devices, tablet computers, laptop computers, cameras, monitoring equipment, etc.

[0457] It is worth mentioning that in the present invention, the filter element holder is supplemented with the camera module using an integrated packaging process, and cooperates with the integrated base of the camera module to share the functions of a traditional holder. Therefore, based on the advantages of the integrated packaging process, the application shortcomings of the integrated packaging are compensated and improved. On the other hand, the filter element holder can be integrally formed, such as by injection molding, so it has good flatness. More preferably, the material's inherent properties can be used to reduce the reflectivity of incident light. In addition, it can be seen from the above embodiments that, combined with the shape of the integrated base, the filter element holder can have multiple variations, with a simple molding structure and easy processing. More preferably, when a suitable plastic material is selected, the reflectivity of the incident light can be reduced and stray light can be avoided without the need for etching or other processes, and without blackening or roughening treatment.

[0458] With reference to the accompanying drawings of the present invention Figures 56 to 62 According to a preferred embodiment of the present invention, a camera module is illustrated, wherein the camera module includes at least one optical lens 310 and at least one molded photosensitive component 320. Each molded photosensitive component 320 further includes a photosensitive element 321, a circuit board 322 (i.e., a circuit board), a molded base 323, and a group of leads 324. The two ends of each lead 324 extend to be connected to the non-photosensitive area of ​​each photosensitive element 321 and each circuit board 322. Each molded base 323 is at least integrally molded with each circuit board 322, so that the molded base 323 and the circuit board 322 form an integrated structure. Each optical lens 310 is respectively arranged in the photosensitive path of the photosensitive element 321 of each molded photosensitive component 320. The light reflected by the object enters the interior of the camera module from each of the optical lenses 310, and is subsequently received by each of the photosensitive elements 321 and photoelectrically converted, thereby obtaining an image associated with the object.

[0459] It is worth mentioning that the photosensitive element 321 has a set of chip connectors 3211, and the circuit board 322 has a set of circuit board connectors 3221, wherein the two ends of each lead 324 can be connected to each chip connector 3211 of the photosensitive element 321 and each circuit board connector 3221 of the circuit board 322, respectively. In this way, the photosensitive element 321 and the circuit board 322 are connected. In one example of the present invention, each chip connector 3211 of the photosensitive element 321 and each circuit board connector 3221 of the circuit board 322 can be a connection pad, that is, each chip connector 3211 of the photosensitive element 321 and each circuit board connector 3221 of the circuit board 322 can be disk-shaped, so that the two ends of each lead 324 can be connected to each chip connector 3211 of the photosensitive element 321 and each circuit board connector 3221 of the circuit board 322, respectively. In another example of the present invention, each chip connector 3211 of the photosensitive element 321 and each circuit board connector 3221 of the circuit board 322 may be spherical. For example, solder paste or other soldering materials may be applied to the photosensitive element 321 and the circuit board 322 to form the chip connector 3211 of the photosensitive element 321 and the circuit board connector 3221 of the circuit board 322, respectively. However, the shapes of the chip connector 3211 of the photosensitive element 321 and the circuit board connector 3221 of the circuit board 322 do not limit the content and scope of the present invention.

[0460] The photosensitive element 321 includes a photosensitive area 3212 and a non-photosensitive area 3213. The photosensitive area 3212 and the non-photosensitive area 3213 of the photosensitive element 321 are integrally formed, and the photosensitive area 3212 is located in the middle of the photosensitive element 321. The non-photosensitive area 3213 is located outside the photosensitive element 321 and surrounds the photosensitive area 3212. After light reflected by an object enters the interior of the camera module from the optical lens 310, it can be received by the photosensitive area 3212 of the photosensitive element 321 and converted into photoelectric energy to obtain an image associated with the object.

[0461] Those skilled in the art will appreciate that each chip connector 3211 of the photosensitive element 321 is disposed in the non-photosensitive region 3213 of the photosensitive element 321. Furthermore, the non-photosensitive region 3213 of the photosensitive element 321 has a chip inner portion 32131, a chip connector 32132, and a chip outer portion 32133, wherein the chip inner portion 32131 surrounds the photosensitive region 3212, and two sides of the chip connector 32132 extend and connect to the chip inner portion 32131 and the chip outer portion 32132, respectively. That is, the area of ​​the non-photosensitive region 3213 from the position where the chip connector 3211 is provided to the edge of the photosensitive region 3212 is defined as the chip inner portion 32131, the area of ​​the non-photosensitive region 3213 where the chip connector 3211 is provided is defined as the chip connecting portion 32132, and the area of ​​the non-photosensitive region 3213 from the position where the chip connector 3211 is provided to the outer edge of the photosensitive element 321 is defined as the chip outer portion 32132. In other words, from a top view of the photosensitive element 321, the photosensitive element 321 comprises, from the outside to the inside, the chip outer portion 32133, the chip connecting portion 32132, the chip inner portion 32131, and the photosensitive region 3212.

[0462] In addition, the circuit board 322 includes a flat chip-mounting area 3222 and an edge area 3223. The edge area 3223 is integrally formed with the chip-mounting area 3222 and is located around the chip-mounting area 3222. The chip-mounting area 3222 is used to mount the photosensitive element 321, and the circuit board connector 3221 is disposed in the edge area 3223. The edge area 3223 of the circuit board 322 includes a circuit board inner portion 32231, a circuit board connector 32232, and a circuit board outer portion 32233. The circuit board inner portion 32231 surrounds the chip-mounting area 3222, and the two sides of the circuit board connector 32232 extend and connect to the circuit board inner portion 32231 and the circuit board outer portion 32233, respectively. That is, the area of ​​edge region 3223 from the location where circuit board connector 3221 is provided to the edge of chip mounting region 3222 is defined as circuit board inner portion 32231, the area of ​​edge region 3223 where circuit board connector 3221 is provided is defined as circuit board connection portion 32232, and the area of ​​edge region 3223 from the location where circuit board connector 3221 is provided to the outer edge of edge region 3223 is defined as circuit board outer portion 32233. In other words, from a top view of circuit board 322, circuit board 322 comprises, from inside to outside, circuit board outer portion 32233, circuit board connection portion 32232, circuit board inner portion 32231, and chip mounting region 3222A. The type of the lead 324 is not limited in the camera module of the present invention. For example, in a specific example, the lead 324 can be implemented as a gold wire, that is, the photosensitive element 321 and the circuit board 322 can be connected together by punching the gold wire, so that after the photosensitive element 321 converts the optical signal into an electrical signal, the electrical signal can be further transmitted to the circuit board 322 through the lead 324. It will be understood by those skilled in the art that, in other examples of the camera module, the lead 324 can also be implemented as a silver wire, copper wire, or any other material that can realize the transmission of the electrical signal between the photosensitive element 321 and the circuit board 322.

[0463] In addition, in one example, the camera module can be implemented as a fixed-focus camera module, wherein the camera module is assembled on the molded base 323 by a lens mount so that the optical lens 310 is maintained in the light-sensitive path of the photosensitive element 321.

[0464] In another example, the camera module can be implemented as a zoom camera module, wherein the camera module adjusts the focal length of the camera module by changing the distance between the optical lens 310 and the photosensitive element 321. Specifically, Figure 62 In the example shown, the camera module further includes at least one driver 330, wherein each optical lens 310 is correspondingly disposed on each driver 330, each driver 330 is assembled on each molded base 323, and each driver 330 is electrically connected to each circuit board 322. After the circuit board 322 transmits electrical energy and control signals to the driver 330, the driver 330 can drive the optical lens 310 to move back and forth along the light-sensing path of the photosensitive element 321, thereby adjusting the focal length of the camera module. In other words, the optical lens 310 is drivably disposed on the driver 330.

[0465] It is worth mentioning that the type of the driver 330 is not limited in the camera module of the present invention. For example, in a specific example, the driver 330 can be implemented as any driver such as a voice coil motor that can drive the optical lens 310 to shift along the photosensitive path of the photosensitive element 321, wherein the driver 330 can receive electrical energy and control signals to be in a working state.

[0466] Further, refer to Figure 62 As shown, the camera module further includes at least one filter element 340, wherein each of the filter elements 340 is respectively assembled on each of the molded bases 323, and each of the filter elements 340 is respectively located in the light-sensing path of each of the photosensitive elements 321. The light reflected by the object enters the interior of the camera module from the optical lens 310, and is filtered by the filter element 340 before it can be received by the photosensitive element 321 and subjected to photoelectric conversion. In other words, the filter element 340 can filter out stray light, such as infrared light, from the light reflected by the object that enters the interior of the camera module from the optical lens 310. In this way, the imaging quality of the camera module can be changed.

[0467] Those skilled in the art will understand that, in different examples of the camera module, the filter element 340 can be implemented as different types, for example, the filter element 340 can be implemented as an infrared cutoff filter, a full-spectrum filter, and other filters or a combination of multiple filters. For example, the filter element 340 can be implemented as a combination of an infrared cutoff filter and a full-spectrum filter, that is, the infrared cutoff filter and the full-spectrum filter can be switched to be selectively located on the photosensitive path of the photosensitive element 321. For example, when the camera module is used in an environment with sufficient light, such as during the day, the infrared cutoff filter can be switched to the photosensitive path of the photosensitive element 321 to filter the infrared rays in the light reflected by the object entering the camera module through the infrared cutoff filter. When the camera module is used in an environment with darker light, such as at night, the full-spectrum filter can be switched to the photosensitive path of the photosensitive element 321 to allow the infrared rays in the light reflected by the object entering the camera module to partially pass through.

[0468] refer to Figure 62 As shown, the molded photosensitive component 320 of the camera module further includes a supporting element 325, wherein before the molded base 323 is molded, the supporting element 325 is arranged in the non-photosensitive area 3213 of the photosensitive element 321, so that after the molded base 323 is molded, the molded base 323 covers the circuit board 322, the non-photosensitive area 3213 of the photosensitive element 321 and a portion of the supporting element 325 to form the molded photosensitive component 320, wherein the supporting element 325 can effectively improve the product yield of the camera module and improve the imaging quality of the camera module. In the following description, the characteristics and advantages of the supporting element 325 will be further explained and disclosed.

[0469] Furthermore, the supporting element 325 has a top surface 32501, an inner side surface 32502, and an outer side surface 32503, wherein two sides of the top surface 32501 are respectively connected to the inner side surface 32502 and the outer side surface 32503. It is worth mentioning that the side of the supporting element 325 facing the photosensitive element 321 is defined as the inner side surface 32502 of the supporting element 325, and the side of the supporting element 325 facing the circuit board 322 is defined as the outer side surface 32503 of the supporting element 325.

[0470] Reference Attachment Figure 62As shown, the molded photosensitive assembly 320 of the camera module further includes a plurality of electronic components 326, wherein each of the electronic components 326 can be mounted on the edge area 3223 of the circuit board 322 by a process such as SMT (Surface Mount Technology). Preferably, each of the electronic components 326 is mounted on the outer side 32233 of the circuit board in the edge area 3223. The photosensitive element 321 and each of the electronic components 326 can be mounted on the same side or opposite sides of the circuit board 322. For example, in a specific example, the photosensitive element 321 and each of the electronic components 326 are mounted on the same side of the circuit board 322, and the photosensitive element 321 is mounted on the chip mounting area 3222 of the circuit board 322, and each of the electronic components 326 is mounted on the edge area 3223 of the circuit board 322. After the molded base 323 is integrally formed on the circuit board 322, the molded base 323 covers each of the electronic components 326 to isolate adjacent electronic components 326 and isolate the electronic components 326 from the photosensitive element 321 through the molded base 323. Therefore, in the camera module of the present invention, even when the distance between adjacent electronic components 326 is relatively close, the molded base 323 can prevent adjacent electronic components 326 from contacting or interfering with each other, and the way in which the molded base 323 covers the electronic components 326 can also prevent pollutants generated on the surface of the electronic components 326 from contaminating the photosensitive area 3212 of the photosensitive element 321, thereby reducing the volume of the camera module and improving the imaging quality of the camera module. In other words, the camera module of the present invention allows more electronic components 326 to be mounted on a small circuit board 322 by encapsulating the electronic components 326 with the molded base 323. It is worth mentioning that the types of electronic components 326 include, but are not limited to, resistors, capacitors, and drivers.

[0471] In addition, those skilled in the art will appreciate that although Figures 56 to 62 The manufacturing steps of the camera module and the molded photosensitive component 320 are disclosed by taking a single camera module as an example. In the example shown in Figure 8, the camera module can also be implemented as a dual-lens camera module or an array camera module. The present invention is not limited in this respect.

[0472] exist Figures 56 to 62 The illustrated example describes the manufacturing steps of the camera module and the manufacturing steps of the molded photosensitive component 320.

[0473] refer to Figure 56As shown, the photosensitive element 321 is mounted on the chip mounting area 3222 of the circuit board 322, and each chip connector 3211 in the non-photosensitive area 3213 of the photosensitive element 321 and each circuit board connector 3221 in the edge area 3223 of the circuit board 322 are connected via a set of leads 324. Furthermore, each electronic component 326 is mounted on the circuit board outer portion 32233 of the edge area 3223 of the circuit board 322. In other words, the ends of a set of leads 324 are connected to the photosensitive element 321 and the circuit board 322, respectively, with each lead 324 protruding from the upper surface of the photosensitive element 321 in an upward arc shape. It is understood that due to limitations in the wire bonding process for connecting the photosensitive element 321 and the circuit board 322 using the leads 324 and the characteristics of the leads 324 themselves, after the ends of the leads 324 are connected to each chip connector 3211 in the non-photosensitive area 3213 of the photosensitive element 321 and each circuit board connector 3221 in the outer area 223 of the circuit board 322, the leads 324 must protrude from the upper surface of the photosensitive element 321 in an upward arc shape. Furthermore, maintaining a smooth curvature of each lead 324 helps ensure the ability of the leads 324 to transmit electrical signals between the photosensitive element 321 and the circuit board 322. Each lead 324 is arranged between the photosensitive element 321 and the circuit board 322, and, for example, each lead 324 may be equally spaced. It will be understood by those skilled in the art that, during the manufacturing process of the camera module and during the use of the camera module, keeping each lead 324 in its initial state is beneficial to ensuring the ability of the lead 324 to transmit the electrical signal between the photosensitive element 321 and the circuit board 322, thereby ensuring the imaging quality of the camera module.

[0474] It will be understood by those skilled in the art that although Figure 56 In the embodiment, the manufacturing steps of the camera module and the molded photosensitive component 320 of the camera module of the present invention are described by taking one photosensitive element 321 mounted on one circuit board 322 as an example. In another example, multiple photosensitive elements 321 can also be mounted on different positions of one circuit board 322 to subsequently manufacture a dual-lens camera module or an array camera module. In another example, multiple circuit boards 322 can also be spliced ​​together to form a circuit board panel, and then each photosensitive element 321 is mounted on the circuit board 322 at a corresponding position of the circuit board panel to subsequently separate the circuit board panel. The present invention is not limited in this respect.

[0475] refer to Figure 57A and Figure 57B As shown, the supporting element 325 is arranged in the non-photosensitive area 3213 of the photosensitive element 321, so as to form a molded photosensitive component semi-finished product by the photosensitive element 321, the circuit board 322 and the supporting element 325, wherein the supporting element 325 is arranged to cover the chip inner part 32131, the chip connection part 32132 and the chip outer part 32133 of the non-photosensitive area 3213 of the photosensitive element 321. In other words. The supporting element 325 can cover a portion of each of the leads 324, so that in the subsequent process of manufacturing the camera module and the process of molding the photosensitive component 320, the supporting element 325 can cover the leads 324 to improve the imaging quality of the camera module. It can be understood by those skilled in the art that in this embodiment of the camera module of the present invention, the supporting element 325 covers the chip connector 3211 of the photosensitive element 321. Furthermore, the support element 325 includes a frame-shaped support body 3251 and a through hole 3252. The support body 3251 is disposed in the non-photosensitive area 3213 of the photosensitive element 321 so that the photosensitive area 3212 of the photosensitive element 321 corresponds to the through hole 3252 of the support element 325. Thus, during the molding process, the support body 3251 can protect the photosensitive area 3212 of the photosensitive element 321. After molding, the molding base 323 covers the outer side surface 32503 and at least a portion of the top surface 32501 of the support body 3251. It is worth noting that the inner side surface 32502 of the support element 325 is used to form the through hole 3252 of the support element 325.

[0476] Preferably, the supporting body 3251 covers the chip inner part 32131, the chip connecting part 2131 and the chip outer part 32133 of the photosensitive element 321, that is, the supporting body 3251 can cover the chip connector 3211, so that the supporting body 3251 can prevent the connection position between the lead 324 and the chip connector 3211 from contacting the molding material used to form the molding base 323, so as to prevent the lead 324 from falling off the chip connector 3211. It is understood that when the support body 3251 covers the connection between the lead 324 and the chip connector 3211, the support body 3251 can isolate the connection between the lead 324 and the chip connector 3211 from the molding material, thereby preventing the molding material from causing deformation of the end of the lead 324 used for connecting to the chip connector 3211 or the lead 324 from falling off the chip connector 3211 during the molding process. In one embodiment, the support body 3251 can be formed by applying glue to the non-photosensitive area 3213 of the photosensitive element 321 and curing the glue to make the support body 3251 elastic. After the support body 3251 is formed, the through hole 3252 is formed on the inner side surface 32502 of the support body 3251, and the photosensitive area 3212 of the photosensitive element 321 corresponds to the through hole 3252. In addition, the support body 3251 formed by the glue can also have stickiness, so as to be used for subsequent adhesion of pollutants such as dust, thereby preventing these pollutants from contaminating the photosensitive area 3212 of the photosensitive element 321 and causing stains on the photosensitive area 3212 of the photosensitive element 321, thereby further ensuring the imaging quality of the camera module. For example, the support body 3251 is arranged between the photosensitive area 3212 of the photosensitive element 321 and the electronic component 326, so that pollutants such as solder powder generated when the electronic component 326 is mounted on the circuit board 322 will be adhered to the support body 3251, thereby preventing these pollutants such as solder powder from contaminating the photosensitive area 3212 of the photosensitive element 321.

[0477] Preferably, the support body 3251 can be formed by applying glue in a sticky state to the non-photosensitive area 3213 of the photosensitive element 321 and after the glue is cured, so as to prevent the glue from flowing after being applied to the non-photosensitive area 3213 of the photosensitive element 321 and contaminating the photosensitive area 3212 of the photosensitive element 321. In other words, the glue has good plasticity before being cured to form the support body 3251, so as to prevent the glue from being applied to the non-photosensitive area 3213 of the photosensitive element 321 and deforming during the curing process. It will be understood by those skilled in the art that by applying glue in a sticky state to the non-photosensitive area 3213 of the photosensitive element 321, the support body 3251 formed by the glue can cover the lead 324, and the process of applying the glue to the non-photosensitive area 3213 of the photosensitive element 321 can avoid damaging the lead 324.

[0478] Reference Attachment Figures 57A to 58 As shown, during the molding process, a molding mold 3100 is used to form the molding material into the molding base 323 that is at least integrally formed on the circuit board 322 after solidification. In this way, the size of the camera module and the assembly error of the camera module can be reduced, thereby making the structure of the camera module more compact and improving the imaging quality of the camera module.

[0479] Specifically, the molding die 3100 includes an upper die 3101 and a lower die 3102, wherein at least one of the upper die 3101 and the lower die 3102 is movable to enable the upper die 3101 and the lower die 3102 to be closed and to form at least one molding space 3103 between the upper die 3101 and the lower die 3102, wherein the molding base 323 is formed by the molding material being added to the molding space 3103 and solidified. For example, in one embodiment, the lower die 3102 is generally fixed, and the upper die 3101 is movable relative to the lower die 3102 along guide pins to close the mold when the upper die 3101 is moved toward the lower die 3102, thereby forming the molding space 3103 between the upper die 3101 and the lower die 3102, and to be ejected when the upper die 3101 is moved away from the lower die 3102. Or in another example, the upper mold 3101 is fixed, and the lower mold 3102 can move relative to the upper mold 3101 along the guide column to close the mold when the lower mold 3102 is moved toward the upper mold 3101, thereby forming the molding space 3103 between the lower mold 3102 and the upper mold 3101, and to demold when the lower mold 3102 moves away from the upper mold 3101.

[0480] The photosensitive element 321 and the circuit board 322 are connected by a set of leads 324 and the supporting body 3251 is formed in the non-photosensitive area 3213 of the photosensitive element 321 to cover a part of the leads 324 to form the molded photosensitive component semi-finished product. The molded photosensitive component semi-finished product is placed on the lower mold 3102 of the molding mold 3100, and the upper mold 3101 and / or the lower mold 3102 of the molding mold 3100 are operated to close the upper mold 3101 and the lower mold 3102, thereby The molding space 3103 is formed between the upper mold 3101 and the lower mold 3102, and the photosensitive element 321, the circuit board 322 and the supporting element 325 respectively partially occupy the molding space 3103 of the molding mold 3100, wherein the pressing surface 31011 of the upper mold 3101 contacts the top surface 32501 of the supporting body 3251 and supports the upper mold 3101 upward by the supporting body 3251 to prevent the pressing surface 31011 of the upper mold 3101 from applying pressure to the lead 324. For example, in the present invention, such as the attached Figure 62In the specific example shown, the outside of the circuit board 322, the non-photosensitive area of ​​the photosensitive element 321 and a portion of the supporting element 325 are located in the molding space 3103 of the molding mold 3100, so that when the molding base 323 is molded in the molding space 3103, the molding base 323 covers the outside of the circuit board 322, the non-photosensitive area of ​​the photosensitive element 321 and a portion of the supporting element 325.

[0481] Therefore, those skilled in the art can understand that the molding space 3103 of the molding mold 3100 can be an annular space to form the annular molding base 323 after the molding material is added to the molding space 3103 and solidified.

[0482] It is worth mentioning that the support body 3251 is elastic, so that when the molding die 3100 is closed, the impact force generated by the pressing surface 31011 of the upper mold 3101 of the molding die 3100 at the moment of contacting the top surface 32501 of the support body 3251 is absorbed by the support body 3251, thereby preventing the impact force from being further transmitted to the photosensitive element 321, thereby preventing the photosensitive element 321 from being damaged or preventing the photosensitive element 321 from being displaced relative to the photosensitive element 321 due to the force. It will be understood by those skilled in the art that by absorbing the impact force by the support body 3251 and preventing the impact force from being further transmitted to the photosensitive element 321, it is also possible to ensure that the flatness of the photosensitive element 321 when it is mounted on the circuit board 322 is not affected, thereby ensuring the imaging quality of the camera module.

[0483] It is worth mentioning that the Shore hardness of the support body 3251 ranges from A50 to A80, and the elastic modulus ranges from 0.1 GPa to 1 GPa.

[0484] Preferably, in the present invention, such as Figure 62In the example shown, the height of the supporting body 3251 can be implemented to be higher than or equal to the height of the upward protrusion of the lead 324, so that when the molding mold 3100 is subjected to the mold closing operation, when the pressing surface 31011 of the upper mold 3101 of the molding mold 3100 contacts the top surface 32501 of the supporting body 3251, the supporting body 3251 can support the upper mold 3101 upward and prevent the upper mold 3101 from applying pressure on the lead 324. For example, in one example, the height of the supporting body 3251 is equal to the height of the upward protrusion of the lead 324, so that when the upper mold 3101 and the lower mold 3102 of the molding mold 3100 are clamped, the supporting body 3251 supports the upper mold 3101 upward, so that although the pressing surface 31011 of the upper mold 3101 can contact the lead 324, the pressing surface 31011 of the upper mold 3101 cannot exert pressure on the lead 324. In another example, the height of the support body 3251 is higher than the height of the upward protrusion of the lead 324. Therefore, when the upper mold 3101 and the lower mold 3102 of the molding die 3100 are clamped, the support body 3251 supports the upper mold 3101 upward to prevent the pressing surface 31011 of the upper mold 3101 from contacting the lead 324, thereby preventing the pressing surface 31011 of the upper mold 3101 from applying pressure to the lead 324. In other words, the support body 3251 can support the upper mold 3101 upward to reserve a safe distance between the pressing surface 31011 of the upper mold 3101 and the lead 324.

[0485] In addition, the supporting body 3251 is elastic. After the upper mold 3101 and the lower mold 3102 of the molding mold 3100 are clamped, the pressing surface 31011 of the upper mold 3101 contacts the top surface 32501 of the supporting body 3251 and applies pressure to the top surface 32501 of the supporting body 3251. The pressure applied by the pressing surface 31011 of the upper mold 3101 to the top surface 32501 of the supporting body 3251 can cause the supporting body 3251 to be slightly deformed, so as to prevent a gap from being generated between the pressing surface 31011 of the upper mold 3101 and the top surface 32501 of the supporting body 3251. That is to say, the upper mold 3101 of the molding module 100 can fit tightly with the supporting body 3251 so that the photosensitive area of ​​the photosensitive element 321 corresponding to the through hole 3252 of the supporting element 325 is in a sealed environment, so as to avoid the molding material entering the sealed environment and contaminating the photosensitive area of ​​the photosensitive element 321 during the molding process.

[0486] Figures 57A to 58 A modified embodiment of the molded photosensitive component 320 of the present invention in this process is shown, wherein the supporting element 325 can be made of a hard material, that is, when the supporting body 3251 of the supporting element 325 is formed on at least a part of the non-photosensitive area 3213 of the photosensitive element 321, and the pressing surface 31011 of the upper mold 3101 of the molding mold 3100 applies pressure on the top surface 32501 of the supporting body 3251, the supporting body 3251 will not be deformed to ensure the good electrical properties of the lead 324, thereby ensuring the yield of the camera module in subsequent processes and further ensuring the imaging quality of the camera module.

[0487] It is worth mentioning that the Shore hardness of the support body 3251 is greater than D70, and the elastic modulus is greater than 1 FPa.

[0488] The molding mold 3100 further includes a covering film 3106, so that when the upper mold 3101 and the lower mold 3102 are clamped, the covering film 3106 is located between the pressing surface 31011 of the upper mold 3101 and the top surface 32501 of the supporting body 3251. Preferably, the covering film 3106 can be first set on the pressing surface 31011 of the upper mold 3101 before the upper mold 3101 and the lower mold 3102 are clamped. The covering film 3106 is arranged between the pressing surface 31011 of the upper mold 3101 and the supporting body 3251. On the one hand, it can prevent a gap from being generated between the pressing surface 31011 of the upper mold 3101 and the supporting body 3251. On the other hand, the covering film 3106 can absorb the impact force generated when the upper mold 3101 and the lower mold 3102 are closed, thereby avoiding damage to the photosensitive element 321, the circuit board 322 and the lead 324 when the upper mold 3101 and the lower mold 3102 are closed.

[0489] Reference Attachment Figure 59 As shown, after the fluid molding material is added to the molding space 3103 of the molding mold 3100, the molding material will fill the entire molding space 3103, wherein the supporting body 3251 formed in the non-photosensitive area 3213 of the photosensitive element 321 can prevent the molding material from entering the photosensitive area 3212 of the photosensitive element 321 at the contact position between the supporting body 3251 and the non-photosensitive area 3213 of the photosensitive element 321. In addition, the supporting body 3251 prevents the generation of a gap between the pressing surface 31011 of the upper mold 3101 and the top surface 32501 of the supporting body 3251 by generating deformation, thereby preventing the molding material from entering the sealed environment at the contact position between the top surface 32501 of the supporting body 3251 and the pressing surface 31011 of the upper mold 3101, and can avoid the phenomenon of "flash" after the molding material is solidified.

[0490] It is worth noting that the fluid molding material of the present invention can be a liquid material, a solid particulate material, or a mixture of liquid and solid particulate materials. It is understood that regardless of whether the molding material is implemented as a liquid material, a solid particulate material, or a mixture of liquid and solid particulate materials, it can solidify to form the molding base 323 after being added to the molding space 3103 of the molding mold 3100. For example, in this specific example of the present invention, the fluid molding material is implemented as a liquid thermoplastic material, and the molding material solidifies to form the molding base 323 after being added to the molding space 3103 of the molding mold 3100. It is worth noting that the solidification method of the fluid molding material after being added to the molding space 3103 of the molding mold 3100 does not limit the content and scope of the present invention.

[0491] Reference Attachment Figure 60 As shown, the supporting body 3251 is arranged along the non-photosensitive area 3213 of the photosensitive element 321. After the molding material is added to the molding space 3103 of the molding mold 3100, the supporting body 3251 can prevent the molding material from entering the photosensitive area 3212 of the photosensitive element 321, so that after the molding material is solidified to form the molding base 323, the molding base 323 further forms a light window 3231 to correspond to the photosensitive area 3212 of the photosensitive element 321, so that subsequently, the light window 3231 of the molding base 323 allows light to pass through to be received by the photosensitive area 3212 of the photosensitive element 321 and undergo photoelectric conversion. That is, after solidification, the molding material added to the molding space 3103 of the molding mold 3100 forms a molding body 3232 of the molding base 323 and forms the light window 3231 in the middle of the molding base 323. In other words, the molding base 323 includes the molding body 3232 and the light window 3231. The light window 3231 provides a light path for the optical lens 310 and the photosensitive element 321. Thus, after light reflected by an object enters the interior of the camera module from the optical lens 310, the light passes through the light window 3231 of the molding base 323 and is received by the photosensitive area 3212 of the photosensitive element 321 for photoelectric conversion.

[0492] It is worth mentioning that after the molded base 323 is formed, the molded base 323 covers each of the electronic components 326, thereby isolating each of the electronic components 326 through the molded base 323 and isolating the electronic components 326 from the photosensitive element 321 through the molded base 323. In this way, even if the adjacent electronic components 326 are close to each other, the molded base 323 can prevent the adjacent electronic components 326 from contacting each other, and the molded base 323 can also prevent the pollutants generated by the electronic components 326 from contaminating the photosensitive area of ​​the photosensitive element 321, so as to improve the imaging quality of the camera module.

[0493] Reference Attachment Figure 61 As shown, the filter element 340 is assembled on the top surface of the molded base 323 so that the filter element 340 closes the light window 3231 of the molded base 323, so that the light subsequently entering the interior of the camera module from the optical lens can be further filtered by the filter element 340 to improve the imaging quality of the camera module.

[0494] Furthermore, the top surface of the mold base 323 forms an inner surface 3233 and an outer surface 3234, wherein in one example, the inner surface 3233 and the outer surface 3234 of the mold base 323 are in the same plane, so that the top surface of the mold base 323 forms a flat plane, wherein the filter element 340 is assembled on the inner surface 3233 of the mold base 323, the driver 330 or the lens holder is assembled on the outer surface 3234 of the mold base 323, or the optical lens 310 is directly assembled on the outer surface 3234 of the mold base 323. In another example, the plane where the inner surface 3233 of the mold base 323 is located may be lower than the plane where the outer surface 3234 is located, so that the top surface of the mold base 323 forms a stepped surface, that is, the plane where the inner surface 3233 of the mold base 323 is located is lower than the plane where the outer surface 3234 is located to form a groove 3235 of the mold base 323, wherein the filter element 340 assembled on the inner surface 3233 of the mold base 323 is accommodated in the groove 3235 of the mold base 323, and the driver 330 is assembled on the outer surface 3234 of the mold base 323 so that the optical lens 310 assembled on the driver 330 is further maintained in the light-sensitive path of the photosensitive element 321, as shown in FIG. Figure 62 , thereby obtaining the camera module.

[0495] Reference Attachment Figure 64AWhat is shown is the first variant embodiment of the camera module of the present invention. Different from the above-mentioned embodiment of the camera module of the present invention, each lead 324 of the molded photosensitive component 320 of the camera module of the present invention is completely covered inside the supporting body 3251.

[0496] Specifically, the supporting body 3251 covers at least a portion of the inner side 32131 of the chip, the chip connecting portion 32132, the outer side 32133 of the chip, the inner side 32231 of the circuit board, the circuit board connecting portion 32232 and at least a portion of the outer side 32233 of the circuit board, so that the supporting body 3251 not only covers the eye part of the lead 324, but also covers the connection position of the lead 324 and the chip connector 3211 of the photosensitive element 321 and the connection position of the lead 324 and the circuit board connector 3221 of the circuit board 322, so as to pre-fix the lead 324 by means of the supporting body 3251. Therefore, when the molding base 323 is formed by the subsequent molding process, when the upper mold 3101 and the lower mold 3102 of the molding mold 3100 are clamped, the pressing surface 31011 of the upper mold 3101 contacts the top surface 32501 of the supporting body 3251 to avoid the pressing surface 31011 of the upper mold 3101 directly applying pressure to the lead 324, thereby preventing the lead 324 from being deformed or damaged due to force.

[0497] Furthermore, the leads 324 are entirely enclosed within the support body 3251, allowing the support body 3251 to prevent the molding material introduced into the molding space 3103 formed between the upper mold 3101 and the lower mold 3102 from directly contacting the leads 324, thereby preventing the higher temperature molding material from damaging the leads 324. Preferably, the support body 3251 has excellent thermal insulation properties to prevent the temperature of the molding material from being transferred to the leads 324. More preferably, the height of the support body 3251 is higher than the height of the protruding portions of the leads 324. Thus, during the molding process, the support body 3251 supports the upper mold 3101 upward, maintaining a safe distance between the pressing surface 31011 of the upper mold 3101 and the protruding portions of the leads 324.

[0498] In addition, the supporting body 3251 covers the chip outer portion 32133 of the photosensitive element 321 and the circuit board inner portion 32231 of the circuit board 322, so that the supporting body 3251 covers the mounting position of the photosensitive element 321 and the circuit board 322. In this way, the supporting body 3251 can not only pre-fix the photosensitive element 321 and the circuit board 322, so that during the molding process, the supporting body 3251 can prevent the various parts of the photosensitive element 321 and the circuit board 322 from shifting due to uneven force, but also the supporting body 3251 can prevent the molding material from contacting the mounting position of the photosensitive element 321 and the circuit board 322, so as to ensure the flatness of the photosensitive element 321 and improve the imaging quality of the camera module.

[0499] It can be understood by those skilled in the art that the supporting body 3251 is arranged along the mounting position of the photosensitive element 321 and the circuit board 322 so that the supporting body 3251 is in a square shape, so that during the molding process, the supporting body 3251 can prevent the molding material from entering the photosensitive area 3212 of the photosensitive element 321, so that the molding material forms the molding body 3232 covering the edge area 3223 of the circuit board 322 and the outer side surface 32503 of the supporting body 3251 after curing, and forms the light window 3231 in the middle of the molding body 3232. The photosensitive area 3212 of the photosensitive element 321 corresponds to the light window 3231 of the molding base 323, so that the light window 3231 provides a light path for the optical lens 310 and the photosensitive element 321. Preferably, the molded body 3232 covers at least a portion of the edge area 3223 of the circuit board 322, the outer side surface 32503 of the supporting body 3251 and the top surface 32501 after molding.

[0500] In the attached Figure 64B In the second variant embodiment of the camera module of the present invention, the supporting body 3251 covers at least a portion of the chip outer portion 32133 of the photosensitive element 321, the circuit board inner portion 32231 of the circuit board 322, the circuit board connecting portion 32232 and the circuit board outer portion 32233. Figure 64B In the example of the camera module shown, the support body 3251 may not cover the chip connection portion 32132 of the photosensitive element 321. Figure 64CIn the third embodiment of the camera module of the present invention, the supporting body 3251 covers the chip connection portion 32132 and the chip outer portion 32133 of the photosensitive element 321 and the circuit board inner portion 32231 and the circuit board connection portion 32232 of the circuit board 322. Figure 64C In the embodiment of the camera module of the present invention shown, the support body 3251 may not cover the chip inner portion 32131 of the photosensitive element 321 and the circuit board outer portion 32233 of the circuit board 322. Figure 64A 、 Figure 64B and Figure 64C In the several modified embodiments of the camera module shown, the supporting body 3251 can simultaneously cover the mounting positions of the photosensitive element 321 and the circuit board 322, so as to pre-fix the photosensitive element 321 and the circuit board 322 by the supporting body 3251, and prevent the generation of gaps at the mounting positions of the photosensitive element 321 and the circuit board 322 by the supporting body 3251, so that during the molding process, the supporting body 3251 can prevent the various parts of the photosensitive element 321 and the circuit board 322 from shifting due to uneven force, and the supporting body 3251 can prevent the molding material from entering between the photosensitive element 321 and the circuit board 322 to ensure the flatness of the photosensitive element 321.

[0501] Reference Attachment Figure 65A The figure shows a fourth variant embodiment of the camera module of the present invention, wherein the supporting body 3251 covers at least a portion of the inner side portion 32231 of the circuit board in the edge area 22 of the circuit board 322, the circuit board connecting portion 32232 and at least a portion of the outer side portion 32233 of the circuit board, that is, the supporting body 3251 covers the circuit board connector 3221 of the circuit board 322, so that during the molding process, on the one hand, the lead 324 is pre-fixed by the supporting body 3251, and on the other hand, the lead 324 and the circuit board connector 3221 are prevented from contacting the molding material by the supporting body 3251, thereby preventing the lead 324 from falling off the circuit board connector 3221.

[0502] Reference Attachment Figure 65BThe figure shows the fifth variant embodiment of the camera module of the present invention, wherein the supporting body 3251 only covers the chip inner side 32131 of the photosensitive element 321, so that during the molding process, the supporting body 3251 prevents the molding material from entering the photosensitive area 3212 of the photosensitive element 321, thereby forming the molding body 3232 covering the edge area 3223 of the circuit board 322 and the chip outer side 32133 and the chip connecting part 32132 of the photosensitive element 321 after the molding material is solidified, and forming the light window 3231 at the position corresponding to the photosensitive area 3212 of the photosensitive element 321.

[0503] Reference Attachment Figure 66 The sixth variant embodiment of the camera module of the present invention is shown. Different from the above embodiments of the present invention, the molded body 3232 does not cover the top surface 32501 of the support body 3251 after molding. Figure 66 In the specific example shown, the molded body 3232 covers the edge region 3223 of the circuit board 322 and the outer side surface 32503 of the support body 3251 after molding.

[0504] It is worth mentioning that although Figures 56 to 66 The figures show that the height of the supporting body 3251 is higher than the height of the protruding portion of each lead 324. In other examples of the camera module of the present invention, the height of the supporting body 3251 may also be equal to the height of the protruding portion of each lead 324, or in some other examples, the height of the supporting body 3251 may also be lower than the height of the protruding portion of each lead 324, as long as the pressing surface 31011 of the upper mold 3101 of the molding mold 3100 contacts the top surface of the supporting body 3251 during the molding process and the pressing surface of the upper mold 3101 does not directly apply pressure to each lead 324.

[0505] Attachment Figure 67A modified embodiment of the camera module is shown, wherein the filter element 340 is not directly assembled to the molded body 3232, but at least one support member 370 is provided by the camera module, that is, the molded photosensitive component also includes at least one support member 370, the filter element 340 is assembled to the support member 370, and then the support member 370 is assembled to the top surface 3236 of the molded body 3232 so that the filter element 340 is maintained between the optical lens 310 and the photosensitive element 321. In this way, relative to the direct mounting of the filter element on the molded body 3232, the support member 370 provides a buffer so that the filter element 340 is not easily damaged and broken, and the size of the filter element 340 can be reduced, and the height of the camera module can be lowered. Furthermore, the top surface 3236 of the molded body 3232 can be a flat surface, so that after the mold base 323 is formed, the support member 370 is first assembled to the top surface 3236 of the molded body 3232, and then the lens carrier, such as the driver 330 or the lens barrel, is assembled to the support member 370, or the lens 10 is directly assembled to the support member 370. In other words, the driver 330, the lens barrel, or the lens 10 may not be directly assembled to the top surface 3236 of the molded body 3232, but may be assembled to the support member 370.

[0506] The support member 370 is an annular structure with a through hole formed in the middle. It includes an annular support member body 371 and an inner extension arm 372. The inner extension arm 372 extends inward from the inner surface of the support member body 371 to form a support groove 373 on the top side of the inner extension arm 372 for mounting the filter element 340. In other words, the support member 370 is equivalent to the filter element lens holder 40 mentioned in the above embodiment, the support member body 371 is equivalent to the filter element lens holder body 43, and the inner extension arm 372 is equivalent to the inner extension arm 44 mentioned in the above embodiment.

[0507] In the present invention, the support member 370 is a filter element lens holder, which can be implemented as Figures 2 to 23 The structure of the filter element holder in the embodiment shown in FIG. 3 , the molded base 323 can be implemented as Figures 2 to 23 The structure of the integrated base in the embodiment shown in FIG. 3 and the structure in which the support member 370 and the molded base 323 cooperate can also be implemented as follows: Figures 2 to 23 The structure of the filter element lens holder and the integrated base matching each other is shown in FIG.

[0508] In the present invention, the molded base 323 of the camera module is integrally packaged in the circuit board 322 and at least a portion of the non-photosensitive area 3213 of the photosensitive element 321, so that compared with being only integrally packaged in the circuit board 322, the molded base 323 has a larger top surface area to provide a larger mounting surface for the support member 370.

[0509] More specifically, the photosensitive element 321 has a photosensitive element connector 3211, and the circuit board 322 has a circuit board connector 3221. The photosensitive element connector 3211 and the circuit board connector 3221 are connected by a set of connecting wires 324, so that the photosensitive element 321 is operably connected to the circuit board 322. The molded base 323 and the supporting member 325 further embed the photosensitive element connector 3211, the circuit board connector 322, and the connecting wires 324. The molded base 323 is integrally encapsulated with the circuit board 322 and the photosensitive element 321 and integrally embeds the connecting wires 324, thereby preventing stray light from being reflected to the photosensitive element 321 due to the exposed connecting wires 324.

[0510] The support member 370 is supported on the top surface 3236 of the molded base 323, and the support member 370 cooperates with the molded base 323 to form a light window to provide a light path for the photosensitive element 321, wherein the inner edge 3237 of the top surface 3236 of the molded base 323 is closer to the optical axis X of the camera module relative to the outer edge 32211 of the circuit board connector 3221, that is, the inner edge 3237 of the top surface 3236 of the molded base 323 is closer to the optical axis X of the camera module, so as to increase the area of ​​the top surface 3236 of the molded base 323 for supporting the support member 370 as a filter element lens holder. As shown in the figure, in the cross-sectional view, the distance between the inner edge 3237 of the top surface 3236 of the molding base 323 and the optical axis X is indicated as D1, and the distance between the outer edge 32211 of the circuit board connector 3221 and the optical axis X is indicated as D2, wherein D1 is not greater than D2, so that the inner edge 3237 of the top surface 3236 of the molding base 323 is located further inside the camera module, thereby increasing the area of ​​the top surface 3236 of the molding base 323.

[0511] It is understandable that if Figure 67As shown in the figure, the top surface area S of the mold base 323 between the outer edge 32211 of the circuit board connector 3221 and the inner edge 3237 of the top surface 3236 of the mold base 323 is equivalent to the area that can be increased by only integrally encapsulating the mold base 323 on the edge of the circuit board 322 but not on the photosensitive element 321 and the connecting line 324, so as to more stably support the support member 370, provide a flatter and enlarged mounting surface for the support member 370, and reduce assembly tolerances.

[0512] In addition, it is understood that in order to facilitate the demoulding operation of the molding process and avoid stray light, the inner surface of the molding base 323 is usually extended at an angle to form a light window with a gradually larger opening from bottom to top. This will cause the area of ​​the top surface of the molding base 323 to tend to decrease and fail to provide sufficient installation area. Figures 2 to 23 The molded base 323 is an integral base that is only integrally packaged at the edge of the circuit board. In this embodiment of the present invention, the molded base 323 is integrally packaged at the circuit board 322 and the photosensitive element 321 and buries the circuit board connector 3221 and the connecting wire 324. The molded base 323 can make full use of the space above the photosensitive element connector 3211, the circuit board connector 3221 and the connecting wire 324, so that the portion of the inner surface corresponding to the molded base 323 that extends obliquely is mainly concentrated above the photosensitive element connector 3211, the connecting wire 324 and the circuit board connector 3221. In this way, the end of the inner surface of the molded base 323 that extends obliquely away from the photosensitive element 321, that is, the inner edge 3237 of the top surface 3236 of the molded base 323, does not exceed the outer edge of the circuit board connector 3221, thereby gaining a larger area of ​​the top surface 3236 for the top side of the molded base 323, thereby providing a larger mounting surface.

[0513] In addition, relative to Figure 1B In the conventional camera module shown in FIG, the lens mount 7 is adhered to the circuit board 2 through the support foot 701, and the bottom surface of the support member 370 of the filter element 340 provides a larger bonding area with the molded base 323. As shown in FIG12 , the bonding area of ​​the support member 370 in contact with the molded base 323 is the top surface 3236 of the molded base 323, so that the support member 370 can be more firmly combined with the molded base 323, and the bonding area is increased, which can more effectively prevent the support member 370 from tilting, thereby affecting the imaging quality.

[0514] In addition, the combination of the mold base 323 and the support member 370 can replace Figure 1BIn the conventional lens holder 7, the molded base 323 has a greater connection strength because it is integrated with the circuit board 322, and the support member 370 is a structural member for carrying the filter element 340. Thus, the combination of these two parts is relatively Figure 1B The lens mount 7 shown in FIG. 3 provides stronger support for the lens 310 above, or for a lens assembly with a driver 330 or a lens barrel. In other words, stress on the support member 370 can be more effectively transferred to the mold base 323 and the circuit board 322. Furthermore, because the mold base 323 and the circuit board 322 are integrally packaged, they form a more secure bond and can more effectively distribute stress.

[0515] Furthermore, the assembly of the support member 370 and the molded base 323 replaces Figure 1B The conventional mirror base 7 in the embodiment of the present invention can significantly reduce the thickness of the support member 370 relative to the conventional mirror base 7 for mounting a filter element. The thickness of the support member 370 in the present invention is less than 0.7 mm.

[0516] Attachment Figure 68 Another variant embodiment of the camera module is shown, wherein the top surface 3236 of the molded body 3232 has two stepped surfaces 32361 and 32362. A groove 3235 is formed on the top side of the first stepped surface 32361. The support member 370, assembled on the first stepped surface 32361 of the top surface 3236 of the molded body 3232, is accommodated in the groove 3235, further reducing the height of the camera module. The support member 370 is an annular structure with a through hole formed in the middle. It includes an annular support member body 371 and an inner extension arm 372. The inner extension arm 372 extends inward from the inner surface of the support member body 371 to form a support groove 373 on the top side of the inner extension arm 372 for mounting the filter element 340. At this time, the driver 330, or the lens barrel, or the lens 10 can be directly assembled to the second step surface 32362 of the top surface 3236 of the molded body 3232. It is understood that in other modified embodiments, the driver 330, or the lens barrel, or the lens 10 can also be assembled to the molded body 3232 and the support member 370.

[0517] Nevertheless, it will be understood by those skilled in the art that, in other examples of the camera module of the present invention, the optical lens 310 may also be directly assembled on the top surface of the molded body 3232 or the optical lens 310 may also be directly assembled on the top surface of the support member 370.

[0518] The molded base 323 of the camera module is integrally encapsulated with the circuit board 322 and at least a portion of the non-photosensitive area 3213 of the photosensitive element 321. Thus, compared to a case where the molded base 323 is only integrally encapsulated with the circuit board 322, the molded base 323 has a larger top surface 3236, thereby providing a larger mounting surface for the support member 370. For example, in the embodiment shown in the figure, the mounting surface provided by the support member 370 comprises a second stepped surface 32362 for supporting the driver 330 of the lens assembly, and another portion comprises a first stepped surface 32361 for supporting the support member 370.

[0519] More specifically, the photosensitive element 321 has a set of photosensitive element connectors 3211, and the circuit board 322 has a set of circuit board connectors 3221. The photosensitive element connectors 3211 and the circuit board connectors 3221 are connected by a set of connecting wires 324 so that the photosensitive element 321 can be operatively connected to the circuit board 322. The molded base 323 and the supporting element 325 further embed the photosensitive element connectors 3211, the circuit board connectors 322 and the connecting wires 324. The support member 370 supports On the top surface 3236 of the molded base 323, the support member 370 cooperates with the molded base 323 to form a light window, providing a light path for the photosensitive element 321, wherein the inner edge 3237 of the top surface 3236 of the molded base 323 is closer to the optical axis X of the camera module relative to the outer edge 32211 of the circuit board connector 3221, so as to increase the area of ​​the top surface 3236 of the molded base 323, and in particular, a first step surface 32361 is provided for supporting the support member 370 as a filter element lens seat. As shown in the figure, in the cross-sectional view, the inner edge 3237 of the top surface 3236 of the molding base 323 is the inner edge of the first step surface 32361, and the distance between it and the optical axis X is indicated as D1, and the distance between the outer edge 32211 of the circuit board connector 3221 and the optical axis X is indicated as D2, where D1 is not greater than D2, so that the inner edge 3237 of the top surface 3236 of the molding base 323 is located further inside the camera module, thereby increasing the area of ​​the top surface 3236 of the molding base 323.

[0520] like Figure 68As shown in the figure, the top surface area S of the mold base 323 corresponding to the outer edge 32211 of the circuit board connector 3221 and the inner edge 3237 of the top surface 3236 of the mold base 323 is equivalent to the area that can be increased by at least the edge of the mold base 323 being integrally encapsulated in the circuit board 322, so as to more firmly support the support member 370, provide a flatter and increased mounting surface for the support member 370, and reduce assembly tolerances.

[0521] The end of the inner surface of the molded base 323 extending obliquely away from the photosensitive element 321, that is, the inner edge of the first step surface 32361 of the top surface 3236 of the molded base 323, does not exceed the outer edge of the circuit board connector 3221, thereby making it possible to gain a larger area of ​​the top surface 3236 for the top side of the molded base 323, thereby providing a larger mounting surface.

[0522] In addition, relative to Figure 1B In the conventional camera module shown in FIG, lens mount 7 is attached to the outside of the electronic components of circuit board 2 via support legs 701. Space is limited there, and the bottom surface of support member 370, which is used with filter element 340, provides a larger bonding area with mold base 323. As shown in FIG13 , the bonding area between support member 370 and mold base 323 is the first stepped surface 32361 of mold base 323. Because support member 370 is not restricted to being located outside electronic components 326 of circuit board 322, mold base 323 does not need to avoid electronic components 326, thereby providing a larger first stepped surface 32361 to support support member 370. This allows support member 370 to be more firmly bonded to mold base 323, and the increased bonding area effectively prevents tilting of support member 370, which could affect image quality. Moreover, in this embodiment, the support member 370 is only supported on the first step surface 32361. Compared with the traditional mirror base 7 which needs to support the outer side of the electronic component 326, the outer edge of the traditional mirror base is farther away from the optical axis X, so the traditional mirror base 7 with a ring-shaped top surface requires a larger area.

[0523] In addition, similar Figure 67 The combination of the mold base 323 and the support member 370 can replace Figure 1BCompared to conventional lens mount 7, the molded base 323, because it is integrally bonded to the circuit board 322, has a greater connection strength, providing stronger support for the lens 310 above, or the lens assembly with the driver 330 or lens barrel. This means that stress applied to the molded base 323 by the lens 310, driver 330, or lens barrel above can be directly transferred to the circuit board 322 through the molded base 323. Furthermore, because the molded base 323 and circuit board 322 are integrally packaged, the bond is more secure, allowing for more effective stress distribution.

[0524] Moreover, in Figure 68 In the illustrated embodiment, the second step surface 32361 is used to support the driver 330, and the top surface 3701 of the support member 370 can provide an overflow surface for the bonding between the driver 330 and the second step surface 32361, that is, the glue for the bonding between the driver 330 and the second step surface 32361 can extend to the top surface 3701 of the support member 370, which is equivalent to the molded base 323 and the support member 370 together being able to provide a more secure support effect for the driver 330.

[0525] Similarly, in this embodiment, the assembly of the support member 370 and the molded base 323 replaces Figure 1B The conventional mirror base 7 in the embodiment of the present invention can significantly reduce the thickness of the support member 370 relative to the conventional mirror base 7 for mounting a filter element. The thickness of the support member 370 in the present invention is less than 0.7 mm.

[0526] According to another aspect of the present invention, the present invention further provides a method for manufacturing a molded photosensitive component 320, wherein the manufacturing method comprises the following steps:

[0527] (a) connecting a photosensitive element 321 and a circuit board 322 via a set of leads 324;

[0528] (b) placing the photosensitive element 321 and the circuit board 322 in an upper mold 3101 or a lower mold 3102 of a molding mold 3100;

[0529] (c) during the process of closing the upper mold 3101 and the lower mold 3102, the upper mold 3101 is supported upward by a supporting element 325 to prevent the pressing surface 31011 of the upper mold 3101 from applying pressure to each set of the leads 324; and

[0530] (d) Adding a fluid molding material into a molding space 3103 formed between the upper mold 3101 and the lower mold 3102 to form a molding base 323 after the molding material is solidified, wherein the molding base 323 includes a molding body 232 and a light window 3231, wherein the molding body 3232 covers at least a portion of the edge area 3223 of the circuit board 322 and at least a portion of the supporting element 325.

[0531] According to another aspect of the present invention, the present invention further provides a method for manufacturing a molded photosensitive component 320, wherein the manufacturing method comprises the following steps:

[0532] (A) A photosensitive element 321 and a circuit board 322 are connected via a set of leads 324;

[0533] (B) at least partially covering the lead 324 with a supporting element 325 to form a molded photosensitive component semi-finished product;

[0534] (C) placing the molded photosensitive component semi-finished product on an upper mold 3101 or a lower mold 3102 of a molding mold 3100, wherein during the closing process of the upper mold 3101 and the lower mold 3102, the support element 325 supports the upper mold 3101 upward to prevent the pressing surface 31011 of the upper mold 3101 from applying pressure to the lead 324; and

[0535] (D) Adding a fluid molding material into a molding space 3103 formed between the upper mold 3101 and the lower mold 3102 to form a molding base 323 after the molding material is solidified, wherein the molding base 323 includes a molding body 3232 and a light window 3231, the molding body 3232 covers the edge area 3223 of the circuit board 322 and at least a portion of the supporting element 325, and the photosensitive area 3212 of the photosensitive element 321 corresponds to the light window 3231.

[0536] According to another aspect of the present invention, the present invention further provides a method for manufacturing a molded photosensitive component, wherein the manufacturing method comprises the following steps:

[0537] (h) mounting a photosensitive element 321 on a circuit board 322;

[0538] (i) pre-fixing the photosensitive element 321 and the circuit board 322 by a supporting element 325 to produce a molded photosensitive component semi-finished product, wherein the supporting element 325 prevents a gap from being generated between the photosensitive element 321 and the circuit board 322;

[0539] (j) placing the molded photosensitive component semi-finished product in an upper mold 3101 or a lower mold 3102 of a molding mold 3100, so that when the upper mold 3101 and the lower mold 3102 are closed, an annular molding space 3103 is formed between the upper mold 3101 and the lower mold 3102; and

[0540] (k) Adding fluid molding material into the molding space 3103 to form the molding base 323 after the molding material is solidified, wherein the molding base 323 includes a molding body 3232 and a light window 3231, the molding body 23 covers the edge area 3223 of the circuit board 322 and at least a portion of the supporting element 325, and the photosensitive area 3212 of the photosensitive element 321 corresponds to the light window 3231.

[0541] According to another aspect of the present invention, the present invention further provides a method for manufacturing a molded photosensitive component, wherein the manufacturing method comprises the following steps:

[0542] (H) a chip connector 3211 connected to a photosensitive element 321 and a circuit board connector 3221 of a circuit board 322 via a set of leads 324;

[0543] (I) placing the photosensitive element 321 and the circuit board 322 in an upper mold 3101 or a lower mold 3102 of a molding mold 3100, so that when the upper mold 3101 and the lower mold 3102 are closed, an annular molding space 3103 is formed between the upper mold 3101 and the lower mold 3102;

[0544] (J) when a fluid molding material is added to the molding space 3103 , a support element 325 located in the molding space 3103 blocks the molding material to reduce the impact of the molding material on the lead 324 ; and

[0545] (K) After the molding material is solidified, a molding base 323 is formed, wherein the molding base 323 includes a molding body 3232 and a light window 3231, wherein the molding body 3232 covers the edge area 3223 of the circuit board 322, the supporting element 325 and at least a portion of the non-photosensitive area 3213 of the photosensitive element 321.

[0546] like Figures 69 to 71FIG2 shows a camera module according to the twenty-third preferred embodiment of the present invention. The camera module includes an integrated base assembly 210, a photosensitive element 220, a lens 230, a filter element holder 240, and a filter element 250, wherein the integrated base assembly 210, the photosensitive element 220, the filter element holder 240, and the filter element 250 constitute a photosensitive assembly.

[0547] The lens 230 includes a carrier 231 and one or more lenses 232 assembled within the carrier 231. The integrated base assembly 210 includes an integrated base 211 and a circuit board 212. The integrated base 211 is integrally packaged with the circuit board 212 and the photosensitive element 220, for example, but not limited to, by molding. The filter element lens holder 240 is mounted on the integrated base 211. The integrated base 211 and the filter element lens holder 240 cooperate to form a combination that can replace the lens holder or bracket of a traditional camera module, eliminating the need to glue the lens holder or bracket to the circuit board as in traditional packaging processes. The photosensitive element 220 is operably connected to the circuit board 212. The photosensitive element 220 is electrically connected to the circuit board 212 of the integrated base assembly 210 . The filter element holder 240 is mounted on the integrated base assembly 210 . The lens 230 is located in the light sensing path of the photosensitive element 220 .

[0548] The integrated base 211 includes a light window 2111 and a base body 2112 forming the light window 2111. The light window 2111 provides a light path for the photosensitive element 220. The base body 2112 is molded and integrally encapsulated with the circuit board 212 and the photosensitive element 220. In this embodiment, the light window 2111 is a closed annular structure to provide a sealed internal environment for the lens 230. The circuit board 212 includes a substrate 2121 and a plurality of electronic components 2122 formed on the substrate 2121, such as those mounted via a surface-mounted metal (SMT) process. The electronic components 2122 include, but are not limited to, resistors, capacitors, and driver devices. In this embodiment of the present invention, the integrated base 211 is integrally encapsulated with the substrate 2121 and integrally encapsulates the electronic components 2122, thereby preventing dust and debris from adhering to the electronic components 2122 and contaminating the photosensitive element 220, as in conventional camera modules, and affecting imaging performance. It is understandable that in another variant embodiment, the electronic components 2122 may be embedded in the substrate 2121. The circuit board 212 is a circuit board, which may be a PCB hard board, a PCB soft board, a hard-flex board, a ceramic substrate, etc.

[0549] It is worth mentioning that in some embodiments, the electronic components 2122 are arranged around the photosensitive element 220, and in different implementations, the setting position of the electronic components 2122 can be designed and laid out as needed, such as being set on one side or both sides or more sides, which can be coordinated with the setting position of the photosensitive element 220 and the setting position of the structure connecting the photosensitive element 220 and the circuit board 212, as well as the shape of the filter element lens holder 240, so as to more reasonably utilize the space position on the substrate 2122 and reduce the size of the camera module as much as possible.

[0550] Preferably, these electronic components 2122 are arranged on a pair of opposite sides of the photosensitive element 220, that is, on the two wing sides 2121a of the substrate 2121, and the two end sides 2121b of the substrate 2121 are not arranged with the electronic components 2122, so that the integrated base 211 has a wider portion corresponding to the two wing sides 2121a of the substrate 2121, and a narrower portion corresponding to the two end sides 2121b of the substrate 2121. In particular, when the circuit board 212 is a rigid-flex board, it includes a rigid board portion 21211 and a flexible board portion 21212. The electronic components 2122 are not arranged on the side away from the flexible board portion 21212, so that the edge of the substrate 2121 on the side away from the flexible board portion 21212 has a reduced size.

[0551] The photosensitive element 220 is mounted on the substrate 2121 by, for example, but not limited to, SMT (surface mount technology) and electrically connected to the substrate 2121 by COB (Chip On Board) bonding. Of course, in other embodiments of the present invention, the photosensitive element 220 may be mounted on the substrate 2121 by other means, such as embedded, FC (chip flip-chip), etc. Those skilled in the art should understand that the connection and mounting method of the photosensitive element 220 and the circuit board 212 is not a limitation of the present invention.

[0552] More specifically, the photosensitive element 220 has a photosensitive area 2201 and a non-photosensitive area 2202, with the non-photosensitive area 2202 surrounding the photosensitive area 2201. The integrated base is integrally bonded to the circuit board 212 and at least a portion of the non-photosensitive area 2202 of the photosensitive element 220. The photosensitive area 2201 is configured to sense light and convert light signals into electrical signals. The non-photosensitive area 2202 is electrically connected to the circuit board 212 via the connecting wire 2203, transmitting the electrical signals to the circuit board 212. The lens 230 is optically aligned with the photosensitive element 220, with their optical axes aligned. This allows light passing through the lens 230 to reach the photosensitive element 220 via the light window 2111. After further photoelectric conversion by the photosensitive element 220, the electrical signals are transmitted to the circuit board 212, thereby enabling the camera module to capture image information.

[0553] like Figure 69 and Figure 70 As shown, the filter element 250 of the camera module is used to filter light passing through the lens 230. Examples of the filter element 250 include, but are not limited to, an infrared cutoff filter, a blue glass filter, a wafer-level infrared cutoff filter, a fully transparent filter, or a visible light filter. The filter element 250 is mounted on the filter element holder 240, located in the light path of the photosensitive element 220. The camera module may also include a driver 260, such as a voice coil motor or a piezoelectric motor. The lens 230 is mounted on the driver 260 to form a lens assembly 2300, thereby forming a dynamic focus camera module, i.e., an AF (Auto Focus) camera module. The driver 260 includes at least one pin 261, which is operably connected to the circuit board 212 via the pin 261. The pin 261 can be a single pin, a double pin, a single-row pin, or a double-row pin. In some figures of the present invention, a double pin is used as an example, but this is not limiting. The pin 261 is usually located near the edge, and the corresponding position of the BB line is viewed from the cross section. Figure 70 While the pins 261 are not actually visible in the corresponding cross-sectional views, for ease of understanding and explanation, the presence of the pins 261 is indicated by dashed lines in the corresponding cross-sectional views. Those skilled in the art will appreciate that the type, shape, and placement of the pins 261 are not limitations of the present invention. It is understood that the camera module may be a fixed-focus camera module without the driver 260, i.e., the lens 230 or a lens assembly 2300 with a lens barrel mounted above the integrated base 211 and the filter element holder 240.

[0554] like Figures 69 to 71As shown, in this preferred embodiment, the filter element 250 is mounted on the filter element holder 240 and sunken into the light window 2111 of the integrated base 211. The integrated base 211 of the integrated base assembly 210 has a top surface 2113. The filter element holder 240 is mounted on the top surface 2113 of the integrated base 211, and the driver 260 is mounted on the filter element holder 240. According to this embodiment of the present invention, the top surface 2113 of the integrated base 211 extends flat. In other words, the top surface of the integrated base 211 forms a flat surface without any stepped protrusions, and the filter element holder 240 is mounted on this flat surface. It is worth mentioning that in this manner, the top surface 2113 of the integrated base 211 extends in a planar manner without obvious bending angles. Therefore, during the integrated packaging process, such as the molding process, a smoother, burr-free mounting surface can be obtained, providing smooth mounting conditions for the filter element holder 240.

[0555] It's worth noting that the filter element 250, such as a blue glass filter, is a relatively fragile and expensive component that's easily broken. Therefore, protecting the filter element 250 is crucial during camera module manufacturing. In the present invention, the integrated base 211 is manufactured using a molding process, such as injection molding or compression molding. The filter element holder 240 can be made of any material, as long as it's strong enough to support the filter element 250. Preferably, the filter element holder 240 and the integrated base 211 can be manufactured using different manufacturing processes, such as injection molding for the filter element holder 240 and transfer molding for the integrated base 211. Therefore, different materials can be used, resulting in different hardness and surface flexibility for the filter element holder 240 and the integrated base 211. For example, the filter element holder 240 can be made more flexible, so that when the filter element 250 is mounted on the filter element holder 240, it is subjected to less stress than when it is mounted on the integrated base 211, making it more suitable for mounting the filter element 250 and preventing damage or breakage of the filter element 250. In other words, the filter element holder 240 alleviates stress that the filter element 250 may be subjected to, such as stress that would be experienced when it is directly bonded to the integrated base 211.

[0556] Further, refer to Figures 69 to 71The filter element holder 240 has a support groove 241 on its inner side and an engagement groove 242 formed on the outer side of its bottom. The support groove 241 is used to mount the filter element 250, and the engagement groove 242 is used to mount the filter element 250 on the integrated base 211. The support groove 241 is connected to the light window 2111. The engagement groove 242 surrounds the outer periphery of the bottom of the filter element holder 240.

[0557] It is worth mentioning that the filter element 250 is installed in the supporting groove 241, and the relative height with the filter element lens holder 240 is reduced, so that the filter element 250 does not protrude or protrudes less from the filter element lens holder 240, thereby not increasing the height of the camera module and is not easy to touch the lens 250 or the driver 260.

[0558] In other words, the supporting groove 241 is implemented as an inner annular groove, so that the filter element 250 can be installed inside the filter element holder 240, located in the light path of the photosensitive element 220. The engaging groove 242 is formed as an outer annular groove on the outer side of the bottom of the filter element holder 240, so as to be engaged with the integrated base 211, thereby providing a mounting position for the filter element holder 240 through the integrated base 211.

[0559] More specifically, the shape of the engagement groove 242 matches the shape of the integrated base 211 , so as to facilitate stably mounting the filter element holder 240 on the integrated base 211 .

[0560] Further, refer to Figures 69 to 71 The filter element holder 240 is preferably an annular structure, comprising an annular filter element holder body 243, an inwardly extending arm 244, and a downwardly extending arm 245. The downwardly extending arm 245 integrally extends downward from the bottom of the filter element holder body 243 to facilitate sinking the installation position of the filter element 250 into the light window 2111. The inwardly extending arm 244 integrally extends laterally from the downwardly extending arm 245 to provide a horizontal installation position for the filter element 250. It is understood that in possible variations, the filter element holder 240 may not be a closed annular structure, such as a U-shaped structure, and then cooperate with the integrated base 211 to provide a closed environment.

[0561] In other words, the sinking arm 245 extends longitudinally and integrally on the inner side of the filter element lens holder body 243, and the engaging groove 242 is formed on the bottom side of the filter element lens holder body 243 to facilitate engagement with the integrated base 211. The inner extension arm 244 extends transversely on the inner side of the sinking arm 245, and the supporting groove 241 is formed on the top side of the inner extension arm 244 to facilitate support of the filter element 250.

[0562] In the present invention, the integrated base 211 of the camera module is integrally packaged in the circuit board 212 and at least a portion of the non-photosensitive area 2202 of the photosensitive element 220, so that compared with being only integrally packaged in the circuit board 212, the integrated base 211 has a larger top surface area, thereby providing a larger mounting surface for the filter element lens holder 240.

[0563] In addition, if Figure 70 As shown in , the photosensitive element 220 has a set of photosensitive element connectors 221, and the circuit board 212 has a set of circuit board connectors 222. The photosensitive element connectors 221 and the circuit board connectors 222 are connected by a set of connecting wires 223. The integrated base 211 further embeds the photosensitive element connectors 221, the circuit board connectors 222, and the connecting wires 223. It is understood that in this specific example of the present invention, the photosensitive element connectors 221 and the circuit board connectors 222 can be implemented as raised connecting pads. The integrated base 211 is integrally encapsulated with the circuit board 212 and the photosensitive element 220 and integrally embeds the connecting wires 223, thereby preventing stray light from being reflected to the photosensitive element 220 due to the exposed connecting wires 223.

[0564] The filter element holder 240 is supported on the top surface 2113 of the integrated base 211, and the filter element holder 240 cooperates with the integrated base 211 to provide a light path for the photosensitive element 220, wherein the inner edge 21131 of the top surface 2113 of the integrated base 211 is located inside the outer edge 2221 of the circuit board connector 222 without exceeding the edge 2221 of the circuit board connector 222, so that the inner edge 21131 of the top surface 2113 of the integrated base 211 is closer to the optical axis X of the camera module relative to the outer edge 2221 of the circuit board connector 222, so as to increase the area of ​​the top surface 2113 of the integrated base 211, so as to provide a larger area of ​​flat mounting surface for the optical device above the camera module. Figure 72A As shown, the integrated base 211 can be in a roughly square ring shape, and the inner edge 21131 of the top surface 2113 of the integrated base 211 includes four edges. The distance between the straight line along the extension direction of the edge of the integrated base 211 and the optical axis X is shown as D1, and the distance between the outer edge 2221 of the circuit board connector 222 and the optical axis X is shown as D2, where D1 is not greater than D2, so that at least a portion of the inner edge 21131 of the top surface 2113 of the integrated base 211 is located further inside the camera module, thereby increasing the area of ​​the top surface 2113 of the integrated base 211. Figure 72A In the embodiment, all the inner edge 21131 portions of the top surface 2113 of the integrated base 211 are located further inward of the camera module, thereby increasing the area of ​​the top surface 2113 of the integrated base 211 that can be used to provide a mounting surface.

[0565] The optical components that can be mounted on the flat mounting surface include, for example, the filter element holder 240, the lens 230, and the lens assembly 2300. Figure 70 In the example, the flat mounting surface provided by the area of ​​the top surface 2113 of the integrated base 211 is used to support the filter element lens holder 240, the driver 260 and the lens 230 form the lens assembly 2300 supported on the filter element lens holder 240, and the driver 260 is assembled to the filter element lens holder 240.

[0566] That is, the inner edge 21131 of the top surface 2113 of the integrated base 211 extends toward the optical axis X of the camera module and exceeds the outer edge 2221 of the circuit board connector 222. Figure 70 As shown in FIG, the top surface area S of the integrated base 211 between the outer edge 22021 of the circuit board connector 222 and the inner edge 21131 of the top surface 2113 of the integrated base 211 is equivalent to the area that can be increased by only encapsulating the integrated base 211 with the circuit board 212 but not with the photosensitive element 220 and the connecting wire 223, thereby more stably supporting the filter element holder 240. Figure 7 The integrated base 11 shown in FIG is only integrated with the circuit board 12 and not with the photosensitive element 220 and the connecting wire 223. This method requires leaving space for the wiring connection between the circuit board 12 and the photosensitive element 20. The integrated base 11 extends upward from the circuit board 12. This structure facilitates the demoulding operation in the molding process, but reduces the area of ​​the top surface of the integrated base 11. Therefore, the integrated base 211 of this embodiment of the present invention is relatively Figure 7 The integrated base 11 can actually provide an increased top surface area that is significantly larger than the aforementioned top surface area S. In this embodiment of the present invention, the top surface 2113 of the integrated base 211 can be used as a mounting surface, providing a flatter and increased mounting surface for the filter element holder 240, allowing the filter element holder 240 to be assembled more smoothly to the integrated base 211 and enhancing the connection strength between the two.

[0567] Relative to Figure 1BIn the conventional camera module shown in FIG, the lens holder 7 is attached to the circuit board 2 via the support legs 701, and the bottom surface of the filter element lens holder 240 provided with the filter element 340 provides a larger bonding area with the integral base 211, as shown in FIG. Figure 70 As shown in , the bonding area between the filter element holder 240 and the integrated base 211 is the top surface 2113 of the integrated base 211, so that the filter element holder 240 can be more firmly combined with the integrated base 211, and the bonding area is increased, which can more effectively prevent the filter element holder 240 from tilting, thereby improving the imaging quality.

[0568] The filter element holder 240 can be attached to the integrated base 211 via glue, providing a large bonding area. The flatness of the filter element holder 240 can also be adjusted by adjusting the glue thickness. It is worth noting that the filter element 250 can be first attached to the filter element holder 240 and then attached to the integrated base 211. The filter element holder 240 can be formed via an injection molding process, having different hardnesses than the integrated base 211. Furthermore, the filter element 250 is relatively small. Consequently, when the filter element 250, carrying the filter element holder 240, is attached to the integrated base 211, the filter element holder 240 provides a stress buffer, preventing the filter element 250 from breaking. Compared to directly mounting the filter element 250 on the integrated base 211 , the filter element 250 is larger in size and has no stress buffer, so the filter element 250 is easily broken during the mounting process. Therefore, this assembly method also has higher requirements on the mounting process.

[0569] In addition, the combination of the integrated base 211 and the filter element lens holder 240 can replace Figure 1B In the conventional lens holder 7, the integrated base 211 has a greater connection strength because it is integrated with the circuit board 212, and the filter element lens holder 240 is a structural component for carrying the filter element 340. Thus, the combination of these two parts is relatively Figure 1B The lens holder 7 shown in the figure can provide stronger support for the optical components above, such as the driver 260 shown in the figure. In other words, the stress on the filter element lens holder 240 can be more effectively transferred to the integrated base 211 and the circuit board 212. Furthermore, because the integrated base 211 and the circuit board 212 are integrally packaged, the connection is more secure, and the stress can be more effectively distributed.

[0570] Moreover, the combination of the filter element holder 240 and the integral base 211 replaces Figure 1BThe conventional mirror base 7 in the embodiment of the present invention can significantly reduce the thickness of the filter element mirror base 240 relative to the conventional mirror base 7 for mounting the filter element. The thickness of the filter element mirror base 240 of the present invention is less than 0.7 mm.

[0571] In addition, in a more preferred embodiment, the integrated base 211 has an inner side surface 2114 extending obliquely from the photosensitive element 220 to form the light window 2111 having an inner diameter that gradually increases in the direction away from the photosensitive element 220 and an opening that gradually increases. On the bottom side of the filter element 250, the inner surface 2441 of the inner extension arm 244 of the filter element holder 240 extends obliquely and has an inner diameter that increases in the direction adjacent to the photosensitive...

Claims

1. A camera module, characterized in that: include: At least one shot; at least one filter element; at least one filter element holder, wherein the filter element is mounted on the filter element holder; At least one photosensitive element, wherein the photosensitive element has a photosensitive area, a non-photosensitive area surrounding the photosensitive area, and at least one set of photosensitive element connecting members located in the non-photosensitive area; as well as At least one integrated base assembly, wherein the integrated base assembly further comprises: at least one circuit board, wherein the circuit board has at least one set of circuit board connectors, the photosensitive element connectors of the photosensitive element and the circuit board connectors of the circuit board are connected; and At least one integrated base, wherein the integrated base is integrally packaged in the circuit board and the non-photosensitive area of ​​the photosensitive element, and the integrated base forms a light window and a top surface, the photosensitive area of ​​the photosensitive element corresponds to the light window of the integrated base, wherein the distance between the inner edge of the top surface of the integrated base and the optical axis of the camera module is less than or equal to the distance between the outer edge of the circuit board connector of the circuit board and the optical axis of the camera module, so that the top surface of the integrated base has a larger mounting surface, wherein the filter The element lens holder is supported on the top surface of the integrated base so that the filter element is maintained in the photosensitive path of the photosensitive element, wherein the lens is maintained in the photosensitive path of the photosensitive element, wherein the integrated base includes a base body, the base body has at least one opening, and the opening connects the light window and the outside, and the filter element lens holder includes at least one extension leg, and the extension leg extends downward from the filter element lens holder body to the substrate of the circuit board so as to close the opening, wherein no electronic components are arranged on one side of the extension leg.

2. The camera module according to claim 1, wherein the circuit board further comprises a plurality of electronic components mounted on the substrate, wherein the integrated base is integrally packaged on the substrate and integrally covered with the electronic components.

3. According to the camera module according to claim 2, the substrate has two opposite wing sides and two opposite end sides, the electronic components are arranged on the two wing sides of the substrate, and the electronic components are not arranged on the two end sides of the substrate, so that the integrated base has a wider part corresponding to the two wing sides of the substrate, and the integrated base has a narrower part corresponding to the two end sides of the substrate.

4. The camera module according to claim 3, wherein the circuit board includes a hard board part and a soft board part, the hard board part forms the substrate, and the soft board part is connected to the hard board part at one of the two end sides of the hard board part.

5. The camera module according to claim 1, wherein the filter element is sunken into the light window of the integrated base.

6. The camera module according to claim 1, wherein the filter element lens holder and the integrated base are made of different materials.

7. The camera module according to claim 1, wherein the filter element lens holder is mounted on the top surface of the integrated base by glue.

8. The camera module according to claim 1, wherein the inner side of the filter element lens holder has a supporting groove and a coupling groove is formed on the outer side of the bottom, the supporting groove is used to install the filter element, and the coupling groove is used to be installed on the integrated base.

9. The camera module according to claim 8, wherein the filter element holder comprises a filter element holder body, a sinking arm and an inner extension arm, the sinking arm integrally extends downward from the bottom side of the filter element holder body to form the engagement groove on the bottom side of the filter element holder body, the inner extension arm integrally extends laterally from the sinking arm to form the support groove on the top side of the inner extension arm, wherein the filter element is mounted on the inner extension arm.

10. The camera module according to claim 9, wherein the filter element holder is a ring structure.

11. The camera module according to claim 9, wherein the filter element holder is a "U" shaped structure.

12. The camera module according to claim 9, wherein the integrated base has an inner side surface extending obliquely from the photosensitive element to form the light window with a gradually increasing inner diameter in the direction away from the photosensitive element and a gradually increasing opening, wherein the inner surface of the inner extension arm of the filter element holder extends obliquely and has an increasing inner diameter in the direction adjacent to the photosensitive element.

13. The camera module according to claim 9, wherein on the bottom side of the filter element, the filter element lens holder and the integrated base form an inner chamfer structure.

14. The camera module according to claim 9, wherein the filter element lens holder comprises at least one limiting protrusion, and the limiting protrusion at least partially and protrudingly extends upward from the top of the filter element lens holder body.

15. The camera module according to claim 14, wherein the limiting protrusion is located in the middle of the filter element lens holder body to separate the top of the filter element lens holder body into two parts, an inner part and an outer part.

16. The camera module according to claim 15, wherein the limiting protrusion is an annular protrusion.

17. The camera module according to claim 1, wherein the filter element lens holder has a supporting groove, and the filter element is installed in the supporting groove so that the position of the filter element is moved downward.

18. The camera module according to claim 17, wherein the filter element holder comprises an annular filter element holder body and an annular inner extension arm, the inner extension arm extends inward laterally from a lower part of the filter element holder body to form the support groove, wherein the filter element holder body is supported on the top surface of the integrated base, and the filter element is mounted on the inner extension arm.

19. The camera module according to claim 18, wherein the integrated base has an inner side surface extending obliquely from the photosensitive element to form the light window with a gradually increasing inner diameter in the direction away from the photosensitive element and a gradually increasing opening, wherein the inner surface of the inner extension arm of the filter element holder extends obliquely and has an increasing inner diameter in the direction adjacent to the photosensitive element.

20. The camera module according to claim 18, wherein on the bottom side of the filter element, the filter element lens holder and the integrated base form an inner chamfer structure.

21. The camera module according to any one of claims 1 to 20, wherein the integrated base forms a mounting groove on the top surface, and the filter element lens holder is mounted in the mounting groove of the integrated base.

22. The camera module according to claim 21, wherein the top surface of the integrated base has an inner first step surface and an outer second step surface, and the mounting groove is formed on the top side of the first step surface and the inner side of the second step surface.

23. The camera module according to claim 22, wherein the first step surface and the second step surface of the integrated base respectively serve as a part of the flat mounting surface formed by the integrated base through a molding process.

24. The camera module according to any one of claims 17 to 20, wherein the integrated base forms a mounting groove on the top surface, the filter element lens holder is installed in the mounting groove of the integrated base, and the top surface of the filter element lens holder is flush with the top surface of the integrated base.

25. The camera module according to any one of claims 17 to 20, wherein the integrated base forms a mounting groove on the top surface, the filter element holder is installed in the mounting groove of the integrated base, and the top surface of the filter element holder protrudes from the top surface of the integrated base.

26. The camera module according to claim 1, wherein the integrated base forms a mounting groove on the top surface and forms a multi-stage raised step, and one or more notches are formed along its circumferential direction, and the filter element lens holder is installed in the mounting groove.

27. The camera module according to claim 26, wherein a pair of opposite sides of the mounting groove each have a notch, so that the multi-stage raised step includes steps located on a pair of opposite sides.

28. The camera module according to claim 26, wherein the mounting groove has a notch, so that the multi-stage raised step includes three stages and presents a U-shaped structure.

29. The camera module according to claim 26, wherein the mounting groove has two notches, and the two notches are adjacent to each other, so that the multi-stage raised step includes two adjacent steps and is L-shaped.

30. The camera module according to claim 26, wherein the filter element holder comprises a filter element holder body, the filter element holder body comprises a joining portion located in the middle and one or more extension portions extending from the joining portion, the joining portion is located in the mounting groove of the integrated base, and the extension portion is located in the notch of the integrated base and fills the notch.

31. The camera module according to claim 1, wherein the filter element lens holder comprises a filter element lens holder body and an upper extension wall, and the upper extension wall protrudes upward from the filter element lens holder body to form a limiting cavity.

32. The camera module according to claim 1, wherein the reflectivity of the surface of the integrated base is less than 5% so as to reflect light with a wavelength range of 435nm-660nm.

33. The camera module according to claim 1, wherein the integrated base extends to the side and / or bottom of the circuit board.

34. The camera module according to any one of claims 1 to 20 and 26 to 33 further comprises a driver, wherein the lens is mounted on the driver, and the driver is mounted on the filter element lens holder, so that the camera module forms a dynamic focus camera module.

35. The camera module according to any one of claims 1 to 20 and 26 to 33 further comprises a driver, wherein the lens is mounted on the driver, and the driver is mounted on the top surface of the integrated base so that the camera module forms a dynamic focus camera module.

36. The camera module according to any one of claims 1 to 20 and 26 to 33 further comprises a lens barrel, wherein the lens is mounted on the lens barrel, and the lens barrel is mounted on the filter element lens holder, so that the camera module forms a fixed-focus camera module.

37. The camera module according to any one of claims 1 to 20 and 26 to 33 further comprises a lens barrel, wherein the lens is mounted on the lens barrel, and the lens barrel is mounted on the top surface of the integrated base, so that the camera module forms a fixed-focus camera module.

38. A camera module according to claim 37, wherein the top side of the filter element lens holder has a plurality of step surfaces, wherein the filter element is mounted on one of the plurality of step surfaces, and the lens barrel is mounted on another of the plurality of step surfaces.

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