A heat dissipation cabinet and communication equipment

Abstract

The embodiment of the application relates to the heat dissipation technical field, and relates to a heat dissipation cabinet and communication equipment. A first accommodating area of a cabinet body can accommodate a plugboard in a stacked manner, and a heat source device of the plugboard is cooled through a heat dissipation device. An evaporator, a condenser and an evaporating pipeline of the heat dissipation device are connected to form a heat exchange loop, the evaporator is in thermal contact with the outer surface of the heat source device, and the condenser is arranged in a second accommodating area and located above the evaporator. The circulation of the refrigeration working medium in the heat exchange loop is realized, the heat of the heat source device is drawn to the condenser, the heat of the condenser is taken away through air blowing of a fan, and centralized heat dissipation is realized. The second accommodating area serves as an independent air duct, the air duct path is short, the air volume can be improved, and the system resistance is reduced. The volume of the condenser is increased, the heat dissipation area of the convection heat exchange is increased, and the heat dissipation capacity is improved. The condenser is moved out of the plugboard and serves as a heat dissipation resource pool, and the situation that the heat dissipation area of the heat dissipation device is restricted by the slot space and the non-uniform air volume of the slot causes poor heat dissipation is overcome.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation cabinet and communication equipment. Background Technology

[0002] With the development of high-capacity and high-density communication equipment, chip capacity is increasing, and multi-core stacking within chips is being adopted, leading to higher system power consumption. The heat dissipation requirements of communication equipment are also increasing, and the potential for improvement in heat dissipation capacity determines the capacity and long-term competitiveness of communication equipment. Figure 1a and Figure 1b As shown, the existing communication equipment includes a cabinet 1 and a plug-in board 2 with a chip 2a. The chip 2a is a heat source device and is equipped with a heat sink 3. The heat generated by the chip 2a is transferred to the heat sink 3. The plug-in board 2 with the chip 2a and the heat sink 3 are located in the slot space. The slot space serves as an air duct. The air duct extends from the front panel to the rear panel of the cabinet 1. The airflow generated by the fan 4 in the slot space carries the heat from the heat sink 3 out of the equipment. The arrow indicates the airflow generated by the fan 4.

[0003] Cabinet 1 requires shielding on its panel, has a long air duct path, and features densely packed components within the slots, resulting in limited internal space. This leads to high system resistance, low efficiency of fan 4, small system airflow, and poor heat dissipation. Figure 2 As shown by the arrow, the airflow enters the slot space, passes through chip 2a, and carries the heat out of the slot space. A low-speed zone easily forms at the corner 1a between the front panel and side panel of the cabinet, resulting in poor heat dissipation. For example... Figure 3 As shown, the chip 2a and its heat sink 3 on the insertion board 2 are set in the slot space. The space occupied by the heat sink 3 is constrained by the slot spacing, pitch, chip height and insertion board layout. The heat sink 3 has a small usable heat dissipation area and low utilization of slot space, resulting in poor heat dissipation effect. Summary of the Invention

[0004] This application provides a heat dissipation cabinet and communication equipment, which solves the problems of high system wind resistance and low wind speed zone when heat source devices in existing communication equipment are cooled by heat sinks and fans, and poor heat dissipation effect due to the heat dissipation area of ​​the heat sink being constrained by the slot space.

[0005] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0006] In a first aspect, embodiments of this application provide a heat dissipation cabinet, comprising a cabinet body and at least one heat dissipation device; the cabinet body has a first accommodating area and a second accommodating area, the first accommodating area being capable of accommodating stacked inserts with heat source devices; each heat dissipation device includes at least one evaporator, at least one condenser, an evaporation pipe, a liquid return pipe, and a fan; each evaporator is used for thermal contact with the outer surface of one or more heat source devices; each condenser is disposed within the second accommodating area and located above the evaporator; the evaporator and condenser in each heat dissipation device are connected through the evaporation pipe and the liquid return pipe to form a heat exchange loop, the heat exchange loop being filled with a refrigerant. The fan is used for air cooling of the condenser.

[0007] In the heat dissipation cabinet provided in this embodiment, the first accommodating area of ​​the cabinet can accommodate stacked inserts, and the heat source devices on the inserts dissipate heat through a heat dissipation device. The evaporator, condenser, evaporation pipe, and return liquid pipe in the heat dissipation device are connected to form a heat exchange loop. The evaporator is in thermal contact with the outer surface of the heat source devices, and the condenser is located in the second accommodating area of ​​the cabinet and above the evaporator. The heat generated by the heat source devices is transferred to the refrigerant in the evaporator. The refrigerant in the evaporator absorbs heat and changes from a liquid to a gaseous state. The gaseous refrigerant rises along the evaporation pipe to the condenser, where it releases heat and becomes liquid again. Then, under gravity, it returns to the evaporator through the return liquid pipe, realizing the circulation of the refrigerant within the heat exchange loop. This draws the heat from the heat source devices away to the condenser, and the heat from the condenser is quickly carried away by the airflow generated by the fan, achieving centralized heat dissipation.

[0008] Compared to traditional air-cooled heat dissipation solutions, the second accommodating area in this embodiment functions as an independent air duct with a shorter path. A fan blows air onto the condenser within this area, increasing airflow, reducing system resistance, and improving the convective heat transfer coefficient. This enhances convective heat dissipation capacity and overcomes the poor heat dissipation caused by low-velocity areas in traditional solutions. Furthermore, moving the condenser out of the mounting plate increases its volume, enlarging the convective heat dissipation area and reducing system air resistance, thus improving convective heat dissipation capacity and overcoming the limitation of heat dissipation area due to slot space constraints in traditional solutions. The condenser serves as a heat dissipation resource pool, allowing heat from different heat source devices with varying cooling requirements to be dissipated through a heat exchange loop, enabling rapid heat dissipation of unevenly cooled systems and overcoming the poor heat dissipation caused by uneven airflow in traditional solutions. Compared to traditional heat dissipation solutions, the heat dissipation cabinet of this embodiment reduces air resistance, increases the heat dissipation area, and improves overall heat dissipation performance. By removing the condenser from the expansion joint, more expansion joints can be stacked within the first accommodating area, thus increasing the equipment capacity, all within the same cabinet size.

[0009] Compared to existing heat dissipation solutions that immerse the heat source device in a sealed shell and fill it with working fluid, the heat dissipation device of this application, by having the evaporator in thermal contact with the outer surface of the heat source device, allows for a smaller evaporator, sufficient only for effective heat exchange between the evaporator and the heat source device. This results in less refrigerant being filled in the heat exchange circuit, leading to lower operating costs. Furthermore, the evaporator and the outer surface of the heat source device are easily fitted together, effectively overcoming the chemical corrosion caused by immersing the heat source device in the working fluid, thus improving the reliability of the heat source device.

[0010] In conjunction with the first aspect, in the first possible implementation of the first aspect, the second accommodating area is located at the upper part of the cabinet. The cabinet has an air inlet and an air outlet communicating with the second accommodating area. For example, the air inlet is located on the front panel of the cabinet, and the air outlet is located on the rear panel of the cabinet. In this way, when the fan is located in the second accommodating area, the airflow generated by the fan will enter the second accommodating area through the air inlet on the front side of the cabinet, and the air that has gained heat from the condenser will be blown out through the air outlet on the rear side of the cabinet. In addition, the second accommodating area can be set in a suitable position in the cabinet according to the space requirements of the system, such as being set in a position near the top of the rear of the cabinet.

[0011] In conjunction with the first aspect or the first possible implementation of the first aspect, in the second possible implementation of the first aspect, the fan is located in the second accommodating area of ​​the cabinet. The fan can be maintained or replaced independently. When multiple fans are installed, they can be arranged side by side, resulting in a compact structure that facilitates the distribution of airflow generated by the fans to the condenser to improve heat dissipation efficiency.

[0012] In a third possible implementation of the first aspect, combining any one of the first to second possible implementations, each evaporator in the same heat dissipation device has a first inlet end and a first outlet end, and each condenser has a second inlet end and a second outlet end. The two ends of the evaporation pipe are connected to the first outlet end and the second inlet end, respectively; the two ends of the return pipe are connected to the second outlet end and the first inlet end, respectively. This heat exchange circuit is easy to assemble. The evaporator and the outer surface of the heat source device are in thermal contact, and the condenser is located above the evaporator. This allows the refrigerant to circulate within the heat exchange circuit, continuously drawing the heat from the heat source device to the condenser. Combined with fan cooling, this achieves heat dissipation from the heat source device.

[0013] In conjunction with the third possible implementation of the first aspect, in the fourth possible implementation of the first aspect, when a single heat source device is arranged vertically, the corresponding evaporator is also arranged vertically, with the first inlet end located below the first outlet end. In this way, the liquid refrigerant in the evaporator absorbs heat and turns into a gaseous state, which is then discharged from the first outlet end located at the top of the evaporator. It is then transported to the condenser through the evaporation pipes. The gaseous refrigerant releases heat and turns into a liquid state in the condenser. Under the influence of gravity, the liquid refrigerant flows to the first inlet end located at the bottom of the evaporator and enters the evaporator. When the heat source device is arranged horizontally, the evaporator is also arranged horizontally. Combined with the condenser and pipes, heat transfer from the heat source device to the condenser can also be achieved for heat dissipation.

[0014] In a fifth possible implementation of the first aspect, combining the third or fourth possible implementations, the second inlet end of the condenser is detachably connected to the evaporation pipe via a first quick-connect coupling; the second outlet end of the condenser is detachably connected to the return liquid pipe via a second quick-connect coupling. The quick-connect couplings facilitate the assembly and disassembly of the condenser with the evaporation and return liquid pipes, enabling individual maintenance or replacement of the condenser or the insert plate with the evaporator. Compared to heat dissipation schemes where the heat exchange circuit is placed on the insert plate, the condenser in this embodiment can be detached from the insert plate with the evaporator and can be installed independently outside the insert plate. The condenser volume is not limited, allowing for a larger heat dissipation area. Furthermore, since the condenser space is independent, the airflow through the condenser is not obstructed by other components within the insert plate, significantly reducing resistance, increasing the system's airflow, and improving convective heat transfer capacity.

[0015] In conjunction with the fifth possible implementation of the first aspect, in the sixth possible implementation of the first aspect, the portion of the pipeline used to connect the quick-connect fitting is made into a flexible tube. The flexible tube facilitates adjustment of the quick-connect fitting's position, enabling rapid assembly and disconnection. For example, the portion of the evaporator pipeline used to connect the first quick-connect fitting is a flexible tube; or, the evaporator pipeline itself is a flexible tube. Both methods allow for rapid assembly and disassembly of the first quick-connect fitting. Similarly, the portion of the return pipeline used to connect the second quick-connect fitting is a flexible tube; or, the return pipeline itself is a flexible tube. Both methods allow for rapid assembly and disassembly of the second quick-connect fitting.

[0016] In a seventh possible implementation of the first aspect, combining any one of the third to sixth possible implementations, each condenser includes multiple heat exchange tubes and multiple heat dissipation fins. The heat exchange tubes are arranged in parallel with intervals between them. The first end of each heat exchange tube is connected to a second inlet end, and the second end of each heat exchange tube is connected to a second outlet end. The heat dissipation fins are connected to the heat exchange tubes. Arranging multiple heat exchange tubes in parallel and providing heat dissipation fins on the heat exchange tubes increases the contact area between the heat exchange tubes and the heat dissipation fins, thereby increasing the heat dissipation area. When the gaseous refrigerant from the evaporator passes through the heat exchange tubes, it releases heat and changes from a gaseous state to a liquid state. The heat from the refrigerant inside the heat exchange tubes is transferred to the heat dissipation fins through the sidewalls of the heat exchange tubes and then diffuses into the external environment, achieving rapid heat dissipation. In the same condenser, the second inlet end is located above the second outlet end. This facilitates the gaseous refrigerant from the evaporator to rise from the evaporation pipe and be transferred to the second inlet end, then enter the condenser to release heat and change from gaseous to liquid state. Under the action of gravity, it is output through the second outlet end, which reduces the internal resistance of the pipe and helps to improve the heat dissipation effect.

[0017] In conjunction with the seventh possible implementation of the first aspect, in the eighth possible implementation of the first aspect, the first ends of multiple heat exchange tubes are connected to a distributor, which distributes the refrigerant from the evaporator to the multiple heat exchange tubes. A second inlet end is provided on the distributor so that the distributor can be connected to one end of the evaporator line. The second ends of the multiple heat exchange tubes are connected to a collector, which collects the refrigerant after heat exchange through each heat exchange tube. A second outlet end is provided on the collector so that the collector can be connected to one end of the return line.

[0018] In a ninth possible implementation of the first aspect, combining any one of the eighth possible implementations of the first aspect, the number of heat dissipation devices is set to multiple, wherein the condensers of two or more heat dissipation devices are arranged adjacent to each other. As a shared heat dissipation resource pool, the heat from heat source devices with different heat dissipation needs is drawn to the heat dissipation resource pool through corresponding heat exchange loops, allowing the heat dissipation resource pool to exchange heat with the external environment. This eliminates the need to consider the resistance and airflow matching of multiple heat exchangers, significantly reducing airflow loss due to resistance matching and reducing heat dissipation bottlenecks caused by differences in the specifications of heat source devices, thus achieving rapid heat dissipation in systems with uneven heat distribution.

[0019] In combination with any one of the eighth possible implementations of the first aspect, in the tenth possible implementation of the first aspect, the number of heat dissipation devices is multiple, wherein two or more heat dissipation devices can share a condenser. That is, the evaporation pipes and return pipes of two or more heat dissipation devices are respectively connected to the second inlet end and the second outlet end of the same condenser, and the same condenser is used as a heat dissipation resource pool. Combined with the fan, the condenser is cooled by air, which can also achieve rapid heat dissipation of the system with uneven heat distribution.

[0020] In conjunction with any one of the first to tenth possible implementations of the first aspect, in the eleventh possible implementation of the first aspect, the heat dissipation device further includes a heat sink fixed to the evaporator. This draws the heat from the heat source device away to the condenser for heat dissipation, and the heat sink dissipates heat from the evaporator, achieving heat dissipation at both locations and improving the system's heat dissipation capacity. The heat sink may be a finned heat sink.

[0021] In a twelfth possible implementation of the first aspect, combining any one of the eleventh possible implementations of the first aspect, a refrigerant balancing device is connected in series on the return liquid line to replenish the refrigerant after maintenance of the heat exchange circuit. During normal use, the refrigerant balancing device stores a certain amount of refrigerant. The liquid refrigerant from the condenser passes through the return liquid line and the refrigerant balancing device before entering the evaporator. After replacing and maintaining the condenser and reconnecting the heat exchange circuit, the old condenser will carry away some refrigerant. Refrigerant evaporation also occurs during maintenance, reducing the total amount of refrigerant in the heat exchange circuit. Configuring a refrigerant balancing device replenishes the refrigerant in the heat exchange circuit, allowing it to be quickly put back into use after maintenance and improving maintenance convenience.

[0022] In a second aspect, embodiments of this application provide a communication device, including a heat dissipation cabinet and at least one plug-in board as described in the first aspect to the twelfth possible implementation of the first aspect, each plug-in board being disposed in a first accommodating area, each plug-in board having one or more heat source devices; each evaporator being in thermal contact with the outer surface of one or more heat source devices.

[0023] In conjunction with the second aspect, in the first possible implementation of the second aspect, each evaporator is fixed to the outer surface of one or more heat source devices. That is, the evaporator and heat source devices are assembled together when the plate is manufactured. When assembling the plate, the plate with the evaporator on the heat source device is directly assembled into the cabinet and then connected with other devices to form a heat exchange circuit. This can improve assembly efficiency and eliminate the need to install the evaporator onto the heat source device on site.

[0024] In a second possible implementation of the second aspect, combining the second aspect or the first possible implementation of the second aspect, the insert plate is divided into a first insert plate and a second insert plate. All first insert plates are located at the front end of the cabinet and stacked vertically, while all second insert plates are located at the rear end of the cabinet and stacked horizontally. For heat source devices installed on the first and second insert plates within the cabinet, the aforementioned heat dissipation device can be used to draw the heat generated by the heat source devices away to the condenser located in the second accommodating area. The condenser serves as a heat dissipation resource pool, and a fan is used to centrally cool the heat dissipation resource pool. This results in a shorter path in the second accommodating area, higher heat dissipation efficiency, and maximized heat dissipation capacity.

[0025] In a third possible implementation of the second aspect, in conjunction with the second possible implementation of the second aspect, the communication equipment further includes a backplane located within a first accommodating area of ​​the cabinet. The backplane has a first slot on its first surface, into which a first insert plate is pluggably installed. The backplane also has a second slot on its second surface, into which a second insert plate is pluggably installed, making the cooling cabinet a pluggable system. The first insert plate, second insert plate, and backplane can all be printed circuit boards. When the first or second insert plate is inserted into the corresponding slot on the backplane, the backplane supplies power to the corresponding insert plate. By removing the condenser from the insert plate, the number of slots on the backplane can be increased within the same cabinet size, gaining a competitive advantage in slot quantity, allowing for the placement of more first and second insert plates, and ultimately increasing equipment capacity.

[0026] In conjunction with the second aspect or the first possible implementation of the second aspect, in the fourth possible implementation of the second aspect, the insert plates are located at the front end of the cabinet and stacked vertically. For heat source devices installed on the insert plates inside the cabinet, the aforementioned heat dissipation device can be used to draw the heat generated by the heat source devices away to the condenser located in the second accommodating area. The condenser serves as a heat dissipation resource pool, and a fan is used to centrally cool the heat dissipation resource pool. This results in a shorter path in the second accommodating area, higher heat dissipation efficiency, and maximized heat dissipation capacity.

[0027] In conjunction with the fourth possible implementation of the second aspect, in the fifth possible implementation of the second aspect, the communication equipment further includes a backplane located within the first accommodating area of ​​the cabinet. The first surface of the backplane has a first slot into which a plug-in board is pluggably installed, making the cooling cabinet a pluggable system. When the plug-in board is inserted into the first slot of the backplane, the backplane supplies power to the plug-in board. By removing the condenser from the plug-in board, the number of slots on the backplane can be increased within the same cabinet size, gaining a competitive advantage in slot quantity, allowing for the placement of more plug-in boards, and thus increasing equipment capacity. Attached Figure Description

[0028] Figure 1a This is a side view of a communication device in the prior art;

[0029] Figure 1b for Figure 1a Rear view of the communication equipment;

[0030] Figure 2 This is a schematic diagram of airflow in a slot space of a prior art communication device.

[0031] Figure 3 This is a schematic diagram of the slot space structure in existing communication equipment.

[0032] Figure 4 A three-dimensional structural diagram of the communication device provided in the embodiments of this application;

[0033] Figure 5 This is a schematic diagram of the structure of a heat exchange circuit in a communication device provided in an embodiment of this application;

[0034] Figure 6 A side view of a communication device provided in another embodiment of this application;

[0035] Figure 7 for Figure 6 A three-dimensional assembly drawing of communication equipment;

[0036] Figure 8 A schematic diagram of the structure of a condenser in a communication device provided in another embodiment of this application;

[0037] Figure 9a A side view of a communication device provided in another embodiment of this application;

[0038] Figure 9b for Figure 9a Rear view of the communication equipment;

[0039] Figure 10a A front view of a communication device provided in another embodiment of this application;

[0040] Figure 10b for Figure 10a A side view of the communication equipment;

[0041] Figure 11 This is a three-dimensional structural diagram of a communication device provided in another embodiment of this application. Detailed Implementation

[0042] The heat dissipation cabinets provided in the various embodiments of this application can be applied to communication equipment to dissipate heat from heat-generating components within the equipment. These heat-generating components can be high-power chips or other components. Specifically, the communication equipment can be data communication equipment, data transmission equipment, internet technology equipment, or other multi-slot plug-in board systems. It can also be network communication equipment, server equipment, and base station unit equipment with multiple plug-in slots. The communication equipment can be used in operator computer rooms and data center computer rooms, providing Internet Protocol (IP) forwarding, data transmission, and computing functions.

[0043] See Figure 4 This application provides a heat dissipation cabinet, which includes a cabinet body 400 and at least one heat dissipation device 100. The cabinet body 400 has a first accommodating area 409 and a second accommodating area 410. The first accommodating area 409 is capable of accommodating a plate 200 having a heat source device 201 in a stacked manner. Each heat dissipation device 100 includes at least one evaporator 10, at least one condenser 20, an evaporation pipe 30, a liquid return pipe 40, and a fan 50. Each evaporator 10 is used for thermal contact with the outer surface of one or more heat source devices 201. Each condenser 20 is disposed in the second accommodating area 410 and located above the evaporator 10. The evaporator 10 and condenser 20 in each heat dissipation device 100 are connected to the liquid return pipe 40 through the evaporation pipe 30 to form a heat exchange circuit, and the heat exchange circuit is filled with a refrigerant. The fan 50 is used for air cooling of the condenser 20.

[0044] In the heat dissipation cabinet provided in this application embodiment, the first accommodating area 409 of the cabinet 400 can accommodate the stacked inserts 200, and the heat source device 201 of the insert 200 dissipates heat through the heat dissipation device 100. The evaporator 10, condenser 20, evaporation pipe 30 and return liquid pipe 40 in the heat dissipation device 100 are connected to form a heat exchange circuit. The evaporator 10 is in thermal contact with the outer surface of the heat source device 201, and the condenser 20 is located in the second accommodating area 410 of the cabinet 400 and is located above the evaporator 10. The heat generated by the heat source device 201 is transferred to the refrigerant in the evaporator 10. The refrigerant in the evaporator 10 absorbs heat and changes from liquid to gas. The gaseous refrigerant rises along the evaporation pipe 30 to the condenser 20. The refrigerant in the condenser 20 releases heat and becomes liquid again. Then, under the action of gravity, it returns to the evaporator 10 through the return pipe 40, realizing the circulation of the refrigerant in the heat exchange circuit. This draws the heat from the heat source device 201 away to the condenser 20. The fan 50 generates airflow to quickly remove the heat from the condenser 20, achieving centralized heat dissipation.

[0045] Compared to traditional air-cooled heat dissipation solutions, the second accommodating area 410 in this embodiment serves as an independent air duct with a shorter path. The fan 50 blows air onto the condenser 20 within the second accommodating area 410, increasing airflow, reducing system resistance, and improving the convective heat transfer coefficient, thereby enhancing convective heat dissipation capacity and overcoming the poor heat dissipation caused by low-speed zones in traditional heat dissipation solutions. Furthermore, moving the condenser 20 out of the insert plate 200 increases its volume, enlarging the convective heat dissipation area and reducing system air resistance, further improving convective heat dissipation capacity and overcoming the constraint of slot space on the heat dissipation area of ​​the radiator in traditional solutions. Using the condenser 20 as a heat dissipation resource pool, heat from heat source devices 201 with different heat dissipation needs is transferred to the heat dissipation resource pool through a heat exchange loop, achieving rapid heat dissipation for systems with uneven heat distribution and overcoming the poor heat dissipation caused by uneven airflow in the slots in traditional heat dissipation solutions. Compared to traditional heat dissipation solutions, the heat dissipation cabinet of this embodiment reduces air resistance, increases the heat dissipation area, and improves overall heat dissipation performance. By removing the condenser 20 from the insert plate 200, more insert plates 200 can be stacked within the first accommodating area 409 under the same size space of the cabinet 400, thereby increasing the equipment capacity.

[0046] Compared to existing heat dissipation solutions that immerse the heat source device in a sealed shell and fill it with working fluid, the heat dissipation device 100 of this application embodiment, by having the evaporator 10 in thermal contact with the outer surface of the heat source device 201, allows the evaporator 10 to be made smaller, only needing to ensure effective heat exchange between the evaporator 10 and the heat source device 201. This results in less refrigerant being filled in the heat exchange circuit, leading to lower operating costs. Furthermore, the evaporator 10 and the outer surface of the heat source device 201 are easily fitted together, effectively overcoming the chemical corrosion caused by immersing the heat source device in the working fluid, thus improving the reliability of the heat source device.

[0047] The refrigerant has a two-phase phase change characteristic, changing from liquid to gas after absorbing heat, and changing from gas to liquid after releasing heat.

[0048] For specific connections between the evaporator, condenser, evaporation piping, and return liquid piping, please refer to [reference needed]. Figure 5In the same heat dissipation device 100, each evaporator 10 has a first inlet end 10a and a first outlet end 10b, and each condenser 20 has a second inlet end 20a and a second outlet end 20b. The two ends of the evaporation pipe 30 are connected to the first outlet end 10b and the second inlet end 20a, respectively; the two ends of the return pipe 40 are connected to the second outlet end 20b and the first inlet end 10a, respectively. This heat exchange circuit is easy to assemble. The evaporator 10 is in thermal contact with the outer surface of the heat source device 201, and the condenser 20 is located above the evaporator 10. This allows the refrigerant to circulate within the heat exchange circuit, continuously drawing the heat from the heat source device 201 to the condenser 20. Combined with air cooling by the fan 50, this achieves heat dissipation from the heat source device 201. The connection points of the evaporator 10 and condenser 20 to the evaporation pipe 30 and the return pipe 40, respectively, must meet the requirements for leak prevention.

[0049] For specific settings of the evaporator and baffle plate, please refer to... Figure 5 The evaporator 10 can be fixed to the structure near the insert plate 200 or the heat source device 201, which facilitates the direct assembly of the insert plate 200 with the evaporator 10 into the cabinet 400, making assembly and disassembly convenient. The evaporator 10 can be a flat, heat-conducting shell, such as a cuboid, which rests against the outer surface of the heat source device 201. This allows the heat generated by the heat source device 201 to be transferred through the heat-conducting shell to the refrigerant inside, causing the refrigerant to change from a liquid to a gaseous state. The evaporator 10 has a compact structure and occupies little space. This allows for the arrangement of more heat source devices 201 within the same space, such as more concentrated arrangement of high-power chips, meeting the large-capacity heat dissipation requirements of the chips. Furthermore, the evaporator 10 can have other shapes and a contact surface that adheres to the heat source device 201 to transfer heat from the heat source device 201 to the refrigerant inside the evaporator 10.

[0050] See Figure 5 When a single heat source device 201 is arranged vertically, the corresponding evaporator 10 is also arranged vertically, with the first inlet end 10a located below the first outlet end 10b. In this way, the liquid refrigerant in the evaporator 10 absorbs heat and turns into a gaseous state, which is then discharged from the first outlet end 10b located at the top of the evaporator 10. It is then transferred to the condenser 20 via the evaporation pipe 30. The gaseous refrigerant releases heat and turns into a liquid state in the condenser 20. Under the influence of gravity, the liquid refrigerant flows to the first inlet end 10a located at the bottom of the evaporator 10 and enters the evaporator 10. When the heat source device 201 is arranged horizontally, the evaporator 10 is also arranged horizontally. Combined with the condenser 20 and the pipes, heat from the heat source device 201 can also be transferred to the condenser 20 for heat dissipation.

[0051] When specifically setting up the second storage area of ​​the cabinet, refer to Figure 4The second accommodating area 410 can be located at the upper part of the cabinet 400. The cabinet 400 has an air inlet and an air outlet communicating with the second accommodating area 410. For example, the air inlet can be located on the front panel 401 of the cabinet 400, and the air outlet can be located on the rear panel 402 of the cabinet 400. When the fan 50 is located in the second accommodating area 410, the airflow generated by the fan 50 will enter the second accommodating area 410 through the air inlet on the front side of the cabinet 400, and the air that has gained heat from the condenser 20 will be blown out through the air outlet on the rear side of the cabinet 400. Furthermore, the second accommodating area 410 can be located in a suitable position within the cabinet 400 according to the system's space requirements, such as near the top of the rear of the cabinet 400. The shape of the second accommodating area 410 and the positions of the air inlet and air outlet can also be configured in other ways.

[0052] When specifically setting up the fan, refer to Figure 4 The fan 50 can be located in the second accommodating area 410 of the cabinet 400. The fan 50 can be maintained or replaced independently. The number of fans 50 can be one or more, and is not limited. When multiple fans 50 are installed, they can be arranged side by side, which results in a compact structure and facilitates the supply of airflow generated by the fans 50 to the condenser 20 to improve heat dissipation efficiency. The fans 50 can be axial flow fans, with the outlet side 51 of the fan 50 facing the inlet side of the condenser 20, or the inlet side of the fan 50 facing the outlet side of the condenser 20. This results in lower air resistance and better heat dissipation.

[0053] Understandably, when a heat dissipation cabinet is used in an external environment, it can be placed in an area with low temperature and sufficient airflow throughout the year, so that the condenser 20 can be cooled by natural wind.

[0054] As another embodiment of this application, in order to allow the condenser or the evaporator-equipped plate to be maintained or replaced separately, see [reference]. Figure 6 The second inlet end 20a of the condenser 20 is detachably connected to the evaporation pipe 30 via a first quick-connect coupling 60a; the second outlet end 20b of the condenser 20 is detachably connected to the return pipe 40 via a second quick-connect coupling 60b. The quick-connect couplings facilitate the assembly and disassembly of the condenser 20 with the evaporation pipe 30 and the return pipe 40, enabling individual maintenance or replacement of the condenser 20 or the slide plate 200 with the evaporator 10. For example, if a new condenser 20 needs to be replaced in a heat exchange circuit, the corresponding quick-connect coupling is disconnected, the new condenser 20 is installed in the predetermined position, and then the new condenser 20 is connected to the evaporation pipe 30 and the return pipe 40 via the quick-connect coupling to complete the assembly. Similarly, if a slide plate 200 with the evaporator 10 needs to be replaced, the corresponding quick-connect coupling is disconnected, a new slide plate 200 with the evaporator 10 is installed, and then the quick-connect coupling is reconnected to complete the connection of the heat exchange circuit and the replacement of the slide plate 200.

[0055] The first quick-connector 60a and the second quick-connector 60b both include a male connector 61 and a female connector 62. The male connector 61 is connected to one of the two positions, the port of the condenser 20 and the end of the pipeline, and the female connector 62 is connected to the other position. When the male connector 61 and the female connector 62 are mated, a sealed connection can be achieved, thus enabling quick connection and disconnection between the condenser 20 and the pipeline.

[0056] Compared to heat dissipation solutions that place the heat exchange circuit on the baffle plate, the condenser 20 in this embodiment can be detached from the baffle plate 200 with the evaporator 10 and installed independently outside the baffle plate 200. The size of the condenser 20 is not limited, allowing for a larger heat dissipation area. Furthermore, since the space of the condenser 20 is independent, the airflow through the condenser 20 is not obstructed by other components within the baffle plate 200, significantly reducing resistance, increasing the system's airflow, and improving convective heat transfer capabilities.

[0057] In some embodiments, to improve the assembly efficiency of the first and second quick-connect couplings, the portion of the pipeline used to connect the quick-connect couplings can be made into a flexible tube. The flexible tube facilitates adjustment of the quick-connect coupling's position, enabling rapid assembly. For example, the portion of the evaporator pipeline used to connect the first quick-connect coupling is a flexible tube, while the rest of the evaporator pipeline is a rigid tube; or, the evaporator pipeline itself is a flexible tube. Both methods enable rapid assembly and disassembly of the first quick-connect coupling. Similarly, the portion of the return pipeline used to connect the second quick-connect coupling is a flexible tube, while the rest of the return pipeline is a rigid tube; or, the return pipeline itself is a flexible tube. Both methods enable rapid assembly and disassembly of the second quick-connect coupling. The flexible tube can be a hose, corrugated pipe, or other flexible tube.

[0058] In addition, the evaporator pipe 30, the return liquid pipe 40 and the condenser 20 can be made into an integrated maintenance method. The evaporator pipe 30 and the return liquid pipe 40 can be rigid pipes or flexible pipes.

[0059] In some embodiments, see Figure 6 , Figure 7To achieve heat dissipation in a system with uneven heat distribution, multiple heat dissipation devices 100 are configured, with condensers 20 in two or more of these devices arranged adjacent to each other. The uneven heat distribution system can consist of multiple circuit boards with different heat source device layouts. When using traditional air cooling, the air resistance of different circuit boards will vary, resulting in significant differences in airflow. For uneven heat distribution systems, a system resistance baseline is established using traditional air cooling to prevent circuit boards with lower air resistance from absorbing the majority of the cooling airflow. However, this resistance baseline is usually based on the highest air resistance, which leads to a higher system operating point, reduced fan output airflow, and compromised cooling capacity. Typically, low-resistance circuit boards have lower power consumption and require less airflow. If low-resistance and high-resistance circuit boards are placed in the same system for heat dissipation, the low-resistance circuit boards, with their lower resistance, allow airflow to pass more easily. However, since the system flow rate is constant, the high-resistance circuit boards receive less airflow, resulting in poorer heat dissipation. In this embodiment, the condensers 20 in multiple heat dissipation devices 100 are arranged adjacently and shared as a heat dissipation resource pool. The heat from heat source devices 201 with different heat dissipation requirements is drawn to the heat dissipation resource pool through corresponding heat exchange loops, allowing the heat dissipation resource pool to exchange heat with the external environment. This eliminates the need to consider the resistance and airflow matching of multiple heat exchangers, significantly reducing airflow loss due to resistance matching and mitigating heat dissipation bottlenecks caused by differences in the specifications of the heat source devices 201. This achieves rapid heat dissipation for systems with uneven heat distribution. The condensers 20 can be arranged in an array, resulting in a compact structure that facilitates airflow carrying away heat as it passes between adjacent condensers 20.

[0060] When the fan 50 is installed, the airflow generated by the fan 50 diffuses the heat of the refrigerant in the multiple condensers 20 to the outside. For example, the condensers 20 in the multiple heat dissipation devices 100 are arranged in an array, resulting in a compact structure that facilitates airflow from the fan 50 to the multiple condensers 20, improving heat dissipation efficiency. The condensers 20 can be expanded horizontally in different directions depending on the system space, thereby increasing the convective heat transfer area and overcoming the constraint of slot space on the heat dissipation area of ​​radiators in traditional heat dissipation schemes, resulting in stronger heat dissipation capacity. The number of condensers 20 can be one or more, and is not specifically limited.

[0061] In addition, see Figure 7The system can have multiple heat dissipation devices 100, with two or more devices 100 sharing a single condenser 20. This means that the evaporation pipes 30 and return pipes 40 of two or more heat dissipation devices 100 are respectively connected to the second inlet end 20a and the second outlet end 20b of the same condenser 20, using the same condenser 20 as a heat dissipation resource pool. Combined with air cooling by a fan 50, this allows for rapid heat dissipation in systems with uneven heat distribution. The condenser 20 can have multiple second inlet ends 20a and second outlet ends 20b, facilitating the connection of the evaporation pipes 30 and return pipes 40 of different heat dissipation devices 100 to the condenser 20. The number of heat dissipation devices 100 corresponding to one condenser 20 can be set as needed.

[0062] For specific configuration of evaporator and heat source devices, please refer to... Figure 5 In the same heat dissipation device 100, an evaporator 10 is connected between the evaporation pipe 30 and the return liquid pipe 40. The evaporator 10 is used for thermal contact with one or more heat source devices 201. That is, the evaporator 10 and the heat source device 201 can be in a one-to-one manner, or one evaporator 10 can correspond to multiple heat source devices 201. The heat generated by the heat source device 201 is transferred to the refrigerant in the evaporator 10. The refrigerant circulates in the heat exchange circuit, and the refrigerant in the condenser 20 releases heat, thus dissipating heat from the heat source device 201. When the same evaporator 10 is in thermal contact with multiple heat source devices 201, the multiple heat source devices 201 are arranged adjacently. The evaporator 10 absorbs heat from the heat source devices 201, and combined with other components of the heat dissipation device 100, heat dissipation from multiple heat source devices 201 can be achieved.

[0063] In some embodiments, to achieve heat dissipation for multiple heat source devices, or for heat source devices with different temperature specifications, refer to... Figure 6 , Figure 7 In the same heat dissipation device 100, multiple evaporators 10 are connected between the evaporation pipe 30 and the return liquid pipe 40, that is, the evaporators 10 are connected in parallel between the evaporation pipe 30 and the return liquid pipe 40. Each evaporator 10 is in thermal contact with the corresponding heat source device 201. The heat generated by the operation of different heat source devices 201 is transferred to the refrigerant in the corresponding evaporator 10. Through the circulation of the refrigerant in the heat exchange circuit, the condenser 20 is used as a heat dissipation resource pool. Heat dissipation is achieved by the refrigerant in the condenser 20 releasing heat, realizing the sharing of heat dissipation resources of heat source devices 201 of different specifications, achieving the purpose of heat dissipation assistance, and improving the heat dissipation effect. Among them, different heat source devices 201 can be different heat source devices 201 on the same plug plate 200, or heat source devices 201 on different plug plates 200.

[0064] When specifically setting up the condenser, refer to... Figure 5 Each condenser 20 includes multiple heat exchange tubes 21 and multiple heat dissipation fins 22. Several heat exchange tubes 21 are arranged in parallel with intervals. The first end of each heat exchange tube 21 is connected to the second inlet end 20a, and the second end of each heat exchange tube 21 is connected to the second outlet end 20b. The heat dissipation fins 22 are connected to the heat exchange tubes 21. Arranging multiple heat exchange tubes 21 in parallel and providing heat dissipation fins 22 on the heat exchange tubes 21 increases the contact area between the heat exchange tubes 21 and the heat dissipation fins 22, thereby increasing the heat dissipation area. When the gaseous refrigerant from the evaporator 10 passes through the heat exchange tubes 21, it releases heat and changes from a gaseous state to a liquid state. The heat from the refrigerant in the heat exchange tubes 21 is transferred to the heat dissipation fins 22 through the sidewall of the heat exchange tubes 21, and then diffuses into the external environment, achieving rapid heat dissipation. When a fan is configured, the airflow generated by the fan exchanges heat with the heat dissipation fins 22, and the airflow carries away the heat from the heat dissipation fins 22. In the same condenser 20, the second inlet end 20a is located above the second outlet end 20b. This facilitates the gaseous refrigerant from the evaporator 10 to rise from the evaporation pipe 30 and be transferred to the second inlet end 20a, then enter the condenser 20 to release heat and change from gaseous to liquid state. Under the action of gravity, it is output through the second outlet end 20b, which reduces the internal resistance of the pipe and helps to improve the heat dissipation effect.

[0065] For specific connections between heat exchange tubes, evaporation lines, and return lines, please refer to [reference needed]. Figure 5 The first ends of multiple heat exchange tubes 21 are connected to a distributor 23, which distributes the refrigerant from the evaporator 10 to the multiple heat exchange tubes 21. A second inlet end 20a is provided on the distributor 23 so that the distributor 23 can be connected to one end of the evaporator pipe 30. The second ends of the multiple heat exchange tubes 21 are connected to a collector 24, which collects the refrigerant after heat exchange through each heat exchange tube 21. A second outlet end 20b is provided on the collector 24 so that the collector 24 can be connected to one end of the return liquid pipe 40. For example, the distributor 23 and the collector 24 can be a flat shell with multiple connection ports for the ends of the heat exchange tubes 21 to be inserted. This structure is compact, easy to assemble, and can realize the distribution or collection of refrigerant. In addition, the distributor 23 and the collector 24 can also be other shapes and structures.

[0066] There are several possible methods for connecting the heat exchanger tubes and the heat sink fins. The first possible method is: [Refer to...] Figure 5 Multiple heat exchange tubes 21 are connected in parallel, and multiple heat dissipation fins 22 are arranged at intervals, with each heat dissipation fin 22 connected to multiple heat exchange tubes 21. A second optional implementation is: see [link to relevant documentation]. Figure 8Multiple heat exchange tubes 21 are arranged in parallel, with corrugated heat dissipation fins 22 connecting adjacent heat exchange tubes 21. These two methods can be adapted to different structural spaces, simplifying the assembly process and resulting in a compact overall structure of the heat exchange tubes 21 and heat dissipation fins 22. This facilitates the more uniform transfer of heat from the multiple heat exchange tubes 21 to the multiple heat dissipation fins 22, achieving uniform temperature across the multiple heat exchange tubes 21 and thus faster heat dissipation from the condenser 20. The heat dissipation fins 22 can be connected to the heat exchange tubes 21 by welding or other methods, making them easy to manufacture and ensuring reliable thermal contact between the heat dissipation fins 22 and the heat exchange tubes 21.

[0067] In addition, when specifically setting up the condenser, the condenser can also be a plate heat exchanger. The condenser needs to be set above the evaporator to realize the circulation of the refrigerant in the heat exchange loop. The refrigerant in the condenser releases heat and transfers it to the condenser. Combined with the fan blowing air onto the condenser, the heat from the heat source device can also be pulled away to the condenser for centralized heat dissipation.

[0068] In some embodiments, to improve the heat dissipation efficiency of the heat source device 201, the heat dissipation device 100 further includes a heat sink (not shown) fixed to the evaporator 10. The heat from the heat source device 201 is dissipated to the condenser 20, and the heat sink dissipates heat from the evaporator 10, achieving heat dissipation at both locations and improving the system's heat dissipation capacity. The heat sink may be a finned heat sink.

[0069] In some embodiments, a refrigerant balancing device (not shown) is connected in series on the return liquid line 40 to quickly replenish the refrigerant after maintenance of the heat exchange circuit. During normal use, the refrigerant balancing device stores a certain amount of refrigerant. The liquid refrigerant from the condenser 20 passes through the return liquid line 40 and the refrigerant balancing device before entering the evaporator 10. After replacing and maintaining the condenser 20 and reconnecting the heat exchange circuit, the old condenser 20 will carry away some refrigerant. Refrigerant evaporation also occurs during maintenance, reducing the total amount of refrigerant in the heat exchange circuit. The refrigerant balancing device replenishes the refrigerant in the heat exchange circuit, allowing it to be quickly put back into use after maintenance, improving maintenance convenience. For example, the refrigerant balancing device can be a liquid storage tank with an inlet and an outlet, connected in series on the return liquid line.

[0070] See Figure 4 , Figure 5 This application provides a communication device, including the above-mentioned heat dissipation cabinet and at least one plug-in plate 200. Each plug-in plate 200 is disposed in a first accommodating area 409, and each plug-in plate 200 has one or more heat source devices 201. Each evaporator 10 is in thermal contact with the outer surface of one or more heat source devices 201.

[0071] It should be noted that the implementation method of the above-described heat dissipation cabinet embodiment is also applicable to the embodiment of the communication device and can achieve the same technical effect, so it will not be described again here.

[0072] As another embodiment of this application, to facilitate the quick assembly of the evaporator and the mounting plate into the cabinet, see [reference needed]. Figure 4 Each evaporator 10 is fixed to the outer surface of one or more heat source devices 201. This means that the evaporator 10 and heat source device 201 are assembled together during the manufacturing of the insert plate 200. When assembling the insert plate 200, the insert plate 200 with the evaporator 10 attached to the heat source device 201 is directly assembled into the cabinet 400, and then connected with other components to form a heat exchange circuit. This improves assembly efficiency, eliminating the need to install the evaporator 10 onto the heat source device 201 on-site. Furthermore, during the manufacturing of the insert plate 200, the evaporation pipe 30 and the return liquid pipe 40 can be connected to the evaporator 10. In this case, the insert plate 200 with the heat source device 201 and the evaporator 10 connected to the evaporation pipe 30 and the return liquid pipe 40 are treated as an independent component, allowing for faster installation into the cabinet 400 and further improving assembly efficiency.

[0073] As another embodiment of this application, when the communication device is an orthogonal system with a double-sided insert, see [reference]. Figure 9a , Figure 9b The insertion plate 200 is divided into a first insertion plate 210 and a second insertion plate 220. All first insertion plates 210 are located at the front end of the cabinet 400 and are stacked vertically. All second insertion plates 220 are located at the rear end of the cabinet 400 and are stacked horizontally. For the heat source devices 201 installed on the first insertion plates 210 and the second insertion plates 220 inside the cabinet 400, the above-mentioned heat dissipation device 100 can be used to draw the heat generated by the heat source devices 201 away to the condenser 20 located in the second accommodating area 410. The condenser 20 serves as a heat dissipation resource pool, and the fan 50 is used to centrally cool the heat dissipation resource pool. In this way, the path in the second accommodating area 410 is shorter, the heat dissipation efficiency is higher, and the heat dissipation capacity is maximized. Figure 9a The arrows in the diagram indicate the direction of airflow generated by fan 50.

[0074] When assembling the first and second insert plates into the cabinet, refer to... Figure 4The communication equipment also includes a backplane 300, which is located within the first accommodating area 409 of the cabinet 400. The first surface of the backplane 300 has a first slot 301, into which a first insert plate 210 is pluggably installed. The second surface of the backplane 300 has a second slot 302, into which a second insert plate 220 is pluggably installed, making the cooling cabinet a pluggable system. The first insert plate 210, the second insert plate 220, and the backplane 300 can all be printed circuit boards. When the first insert plate 210 or the second insert plate 220 is inserted into the corresponding slot of the backplane 300, the backplane 300 supplies power to the corresponding insert plate. By moving the condenser 20 out of the insert plate 200, the number of slots on the backplane 300 can be increased within the same size space of the cabinet 400, gaining a competitive advantage in slot quantity, allowing for the placement of more first insert plates 210 and second insert plates 220, and thus increasing equipment capacity. The heat dissipation capability of the heat source device 201 on the plug-in board 200 is strong, which allows the plug-in board 200 to be hot-swapped without affecting its operation, thereby improving system reliability and quick maintenance.

[0075] For example, in combination Figure 9a , Figure 9b Within the first accommodating area 409 of the cabinet 400, a first insert plate 210 on the front side of the back panel 300 is arranged vertically, and a second insert plate 220 on the rear side of the back panel 300 is arranged horizontally. The second accommodating area 410 is located at the upper part of the cabinet 400 and extends along the front-rear direction of the cabinet 400. An air inlet 411 is on the front side of the cabinet 400, and an air outlet 412 is on the rear side of the cabinet 400. A fan 50 is located in the front area of ​​the second accommodating area 410, and a condenser 20 is located within the second accommodating area 410, with the air outlet side 51 of the fan 50 opposite to the air inlet side of the condenser 20. During operation, the airflow generated by the fan 50 flows from the front to the rear of the cabinet 400, blowing the heat released by the condenser 20 out of the cabinet 400, achieving air-cooling heat dissipation. Among them, the fans 50 can be arranged in a straight line and set at the air inlet 411 of the second accommodating area 410. This structure is compact and can provide sufficient air volume to the condenser 20.

[0076] As another embodiment of this application, when the communication device is a single-sided front panel system, see [reference]. Figure 10a , Figure 10b The insert plate 200 is located at the front end of the cabinet 400 and is stacked vertically. For the heat source device 201 installed on the insert plate 200 inside the cabinet 400, the above-mentioned heat dissipation device 100 can be used to draw the heat generated by the heat source device 201 away to the condenser 20 located in the second accommodating area 410. The condenser 20 serves as a heat dissipation resource pool, and the fan 50 is used to centrally cool the heat dissipation resource pool. In this way, the path in the second accommodating area 410 is shorter, the heat dissipation efficiency is higher, and the heat dissipation capacity is maximized. Figure 10bThe arrows in the diagram indicate the direction of airflow generated by fan 50.

[0077] When assembling the insert plate into the cabinet, refer to... Figure 11 The communication equipment also includes a backplane 300, which is located within the first accommodating area 409 of the cabinet 400. The first surface of the backplane 300 has a first slot 301 into which the insert plate 200 is pluggably installed, making the cooling cabinet a pluggable system. When the insert plate 200 is inserted into the first slot 301 of the backplane 300, the backplane 300 supplies power to the insert plate 200. By removing the condenser 20 from the insert plate 200, the number of slots on the backplane 300 can be increased within the same size space of the cabinet 400, gaining a competitive advantage in slot quantity, allowing for the placement of more insert plates 200, and thus increasing equipment capacity.

[0078] For example, in combination Figure 10a , Figure 10b The first accommodating area 409 is located at the front of the cabinet 400. Multiple insert plates 200 are stacked on the front side of the back panel 300, while no insert plates are located on the rear side of the back panel 300. The second accommodating area 410 is located at the rear of the cabinet 400, near the top, where the condenser 20 is located behind the back panel 300. The condenser 20 must be positioned higher than the evaporator 10. The air inlet 411 is located on the front side of the cabinet 400 or on the front panel of the insert plates 200, and the air outlet 412 is located on the rear side of the cabinet 400. The fan 50 is located at the rear air outlet 412 of the cabinet 400, with the air inlet side 52 of the fan 50 facing the air outlet side of the condenser 20. During operation, the airflow generated by the fan 50 flows from the front to the rear of the cabinet 400, blowing the heat released by the condenser 20 out of the cabinet 400, achieving air-cooling heat dissipation. Among them, the fans 50 can be arranged in an array and set at the air outlet 412, which makes the structure compact and can provide sufficient air volume to the condenser 20.

[0079] Finally, it should be noted that the above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation cabinet, characterized in that, Applied to communication equipment, the heat dissipation cabinet includes a cabinet body and at least one heat dissipation device; The cabinet has a first accommodating area and a second accommodating area. The first accommodating area can accommodate a plate with a heat source device in a stacked manner; the second accommodating area serves as an independent air duct. Each of the heat dissipation devices includes at least one evaporator, at least one condenser, an evaporation pipe, a return liquid pipe, and a fan; each evaporator is used for thermal contact with the outer surface of one or more of the heat source devices; each condenser is located within the second accommodating area and above the evaporator; the evaporator and the condenser in each heat dissipation device are connected to the return liquid pipe through the evaporation pipe and form a heat exchange loop, the heat exchange loop being filled with a refrigerant; the heat exchange loop can draw the heat from the heat source device to the condenser; the fan is used for air cooling of the condenser.

2. The heat dissipation cabinet according to claim 1, characterized in that, In the same heat dissipation device, each evaporator has a first inlet end and a first outlet end; each condenser has a second inlet end and a second outlet end; the two ends of the evaporation pipeline are respectively connected to the first outlet end and the second inlet end; the two ends of the return pipeline are respectively connected to the second outlet end and the first inlet end.

3. The heat dissipation cabinet according to claim 2, characterized in that, The second inlet end is detachably connected to the evaporation pipeline via a first quick-connect coupling; The second outlet end is detachably connected to the return liquid pipeline via a second quick-connect fitting.

4. The heat dissipation cabinet according to claim 3, characterized in that, The portion of the evaporator pipe used to connect to the first quick-connect fitting is a flexible pipe; or, the evaporator pipe is a flexible pipe. The portion of the return fluid line used to connect to the second quick-connect fitting is a flexible tube; or, the return fluid line is a flexible tube.

5. The heat dissipation cabinet according to any one of claims 2 to 4, characterized in that, Each of the condensers includes multiple heat exchange tubes and multiple heat dissipation fins. Several heat exchange tubes are arranged in parallel with intervals. The first end of each heat exchange tube is connected to the second inlet end, and the second end of each heat exchange tube is connected to the second outlet end. The heat dissipation fins are connected to the heat exchange tubes.

6. The heat dissipation cabinet according to any one of claims 1 to 5, characterized in that, The number of heat dissipation devices is multiple, wherein the condensers of at least two heat dissipation devices are arranged adjacent to each other; Alternatively, the number of heat dissipation devices may be multiple, with at least two of the heat dissipation devices sharing one condenser.

7. The heat dissipation cabinet according to any one of claims 1 to 6, characterized in that, The heat dissipation device also includes a radiator fixed to the evaporator.

8. The heat dissipation cabinet according to any one of claims 1 to 7, characterized in that, A refrigerant balancing device is connected in series on the return liquid line to replenish the refrigerant after maintenance of the heat exchange circuit.

9. A communication device, characterized in that, It includes a heat dissipation cabinet as described in any one of claims 1 to 8 and at least one insert plate, each of the insert plates being disposed within the first accommodating area, each of the insert plates having one or more heat source devices; each of the evaporators being in thermal contact with the outer surface of one or more of the heat source devices.

10. The communication device according to claim 9, characterized in that, Each of the evaporators is fixed to the outer surface of one or more of the heat source devices.

11. The communication device according to claim 9 or 10, characterized in that, The insert plate is divided into a first insert plate and a second insert plate. All the first insert plates are located at the front end of the cabinet and are stacked vertically. All the second insert plates are located at the rear end of the cabinet and are stacked horizontally. Alternatively, all the inserts may be located at the front end of the cabinet and stacked vertically.

12. The communication device according to claim 11, characterized in that, When the plug-in board is divided into a first plug-in board and a second plug-in board, the communication device further includes a backplate, which is disposed in the first accommodating area; the first surface of the backplate has a first slot, and the first plug-in board is pluggably installed in the first slot; the second surface of the backplate has a second slot, and the second plug-in board is pluggably installed in the second slot; When all the inserts are located at the front end of the cabinet and stacked vertically, the communication device also includes a back panel, which is located in the first accommodating area; the first surface of the back panel has a first slot, and the inserts are pluggably installed in the first slot.

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