Spacecraft integrated active panel for accommodating non-uniform heat flux devices and method of manufacturing the same

Abstract

The application provides a spacecraft integrated active plate for non-uniform heat flow devices and a manufacturing method thereof, comprising an active mounting plate, which comprises a thin-walled cavity, a mounting hole embedded part, a heat pipe, a working medium filling hole and a space three-dimensional crystal network sandwich structure; the mounting hole embedded part, the heat pipe and the space three-dimensional crystal network sandwich structure are arranged between the upper and lower walls of the thin-walled cavity; the mounting hole embedded part is used for mounting electronic equipment; the array cell of the space three-dimensional lattice network sandwich structure is in a Scherk's curved surface cell configuration; the working medium filling hole is arranged on the side wall of the thin-walled cavity; and the thin-walled cavity, the mounting hole embedded part, the heat pipe and the space three-dimensional crystal network sandwich structure are integrally manufactured. The application solves the problems of large interface thermal resistance, multi-point liquid leakage, poor temperature control and uniform temperature effect in local high heat flow area caused by the original SAR antenna active mounting plate gluing mode of more than 100 components, and meets the efficient temperature control and uniform temperature demand of the SAR antenna intermittent working surface array uniform TR component.

Description

Technical Field

[0001] This invention relates to the field of mechanical design and manufacturing technology, specifically to an integrated active board for spacecraft adapted to non-uniformly distributed heat flow devices and its manufacturing method. Background Technology

[0002] Satellite SAR antennas and other payloads are characterized by short-duration, high-power operation and periodic operation. They often employ phase change energy storage devices with metallic shells, utilizing the near-isothermal properties of paraffin phase change materials (PCMs) during melting and solidification to achieve relative temperature control of the payload. However, traditional PCMs suffer from inherently low thermal conductivity and poor temperature uniformity when used over large areas. Furthermore, traditional manufacturing processes limit the design of heat transfer fins in conventional PCMs, resulting in insufficient heat transfer enhancement efficiency. This leads to slow melting rates and uneven heat storage of low-thermal-conductivity PCMs, potentially causing overheating of the payload's thermal control surface. Increasing the number of heat transfer fins, on the other hand, results in excessive weight for the PCM, failing to meet the satellite's lightweight design requirements.

[0003] The new generation of SAR satellites has seen exponential improvements in payload capacity, power, and detection accuracy, placing stringent demands on the temperature control and consistency of the distributed high-power T / R components in the SAR antenna array. This also presents the dual requirements of lightweight design and efficient thermal control for the active mounting plate of the SAR antenna. To address these challenges, a type of adhesive-bonded composite active mounting plate for SAR antennas has been developed, such as... Figure 8 As shown, this scheme adopts a sandwich structure, consisting of an upper and lower cover plate molded from carbon fiber composite materials, and multiple components such as a high thermal conductivity carbon-based composite phase change material, aluminum alloy mounting hole embeddings, and reinforcing ribs bonded together. The high thermal conductivity carbon-based composite phase change material is formed by filling and encapsulating porous foam carbon thermal conductive carrier and paraffin phase change material under vacuum conditions. This scheme achieves relative temperature control of high heat consumption single units and distributed devices in intermittent operation through the enhanced thermal conductivity of porous foam carbon material and the heat storage / release of paraffin phase change material, while meeting the requirements for lightweighting. However, this scheme has the following two drawbacks: First, the heat transfer components are mainly assembled by adhesive bonding, resulting in multiple thermal interfaces and high thermal resistance; second, multiple mounting hole embeddings are assembled to the shell by adhesive bonding, which leads to multiple points of working fluid leakage after high and low temperature cycling. Another option is to assemble the sandwich structure, and then use aluminum alloy materials to machine the upper and lower cover plates, mounting hole columns, reinforcing ribs and other shell components, and assemble them with high thermal conductivity carbon-based composite phase change material. Then, they are connected into one piece by low temperature welding. However, this option has drawbacks such as low low temperature welding connection strength, many weld points, and easy leakage of working fluid.

[0004] Given the shortcomings of traditional methods, this invention leverages the advantages of laser additive manufacturing technology, which can fabricate almost any complex shape and fully unleash design freedom. It innovatively designs an active mounting plate for a spacecraft's high-efficiency integrated SAR antenna, encompassing load-bearing, temperature equalization, and heat storage components, and its laser additive manufacturing method. The high-efficiency integrated SAR antenna active mounting plate includes a thin-walled cavity, a micro heat pipe shell, mounting holes for electronic equipment, a spatial three-dimensional lattice network sandwich structure, and working fluid filling holes. The micro heat pipes, mounting holes, and spatial three-dimensional lattice network sandwich structure are arranged between the upper and lower walls of the thin-walled cavity. The array unit of the spatial three-dimensional lattice network sandwich structure has a Scherk's curved cell configuration, and the capillary wick channel of the micro heat pipe has a dovetail-shaped cross-section. All structural features are integrally manufactured using a laser selective melting additive manufacturing process. The micro heat pipe shell is filled with liquid ammonia as the working fluid. Through the layout design of the heat pipe and the gas-liquid phase change heat transfer, heat from local high-power heat sources is transported throughout the plate, achieving a uniform temperature effect. The thin-walled cavity of the mounting plate, excluding the heat pipe shell, is filled with paraffin wax as a heat storage medium. A three-dimensional lattice network sandwich structure is used to achieve the load-bearing function and the thermal conductivity enhancement effect of the paraffin wax solid-liquid phase change, achieving both load-bearing and uniform heat storage effects. This invention has advantages such as lightweight, uniform heat storage throughout the plate, high temperature control accuracy, good temperature uniformity, good load-bearing performance, no leakage risk caused by multi-point gluing / welding, and high reliability. It is suitable for meeting the temperature uniformity and high-precision temperature control requirements of high-power electronic equipment and area array distributed devices in the local area of ​​the SAR antenna of the new generation of spacecraft. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the purpose of this invention is to provide an integrated active board for spacecraft that is adapted to devices with non-uniformly distributed heat flow and its manufacturing method.

[0006] According to the present invention, an integrated active board for spacecraft adapted to non-uniform heat flow devices includes an active mounting plate, wherein the active mounting plate includes a thin-walled cavity, embedded mounting holes, heat pipes, working fluid filling holes, and a space three-dimensional crystal network sandwich structure.

[0007] Mounting holes, heat pipes, and a three-dimensional crystal network sandwich structure are arranged between the upper and lower walls of the thin-walled cavity.

[0008] The mounting hole is used to install electronic equipment;

[0009] The array cell of the spatial three-dimensional lattice network sandwich structure is Scherk's curved cell configuration.

[0010] The working fluid filling hole is located on the side wall of the thin-walled cavity;

[0011] The thin-walled cavity, mounting hole embedded parts, heat pipes, and spatial three-dimensional crystal network sandwich structure are manufactured as a single unit.

[0012] Preferably, the wall thickness of the thin-walled cavity is 0.5mm-0.7mm, and the inner height of the thin-walled cavity is 5mm-6mm.

[0013] Preferably, the spatial three-dimensional lattice network sandwich structure array fills the remaining space within the thin-walled cavity, excluding the micro heat pipes and mounting holes; the array cell envelope size of the lattice network sandwich structure is equal to the height of the thin-walled cavity, and the Scherk's surface cell surface equation satisfies:

[0014] exp(2πz / L2)*cos(2πx / L2)-cos(2πy / L2)=0;

[0015] In the formula, L2 is the height of the thin-walled cavity, and the x, y, z coordinate system conforms to the definition of the Cartesian rectangular coordinate system;

[0016] The cell wall thickness is 0.2mm-0.3mm;

[0017] The thin-walled cavity, excluding the heat pipe, is filled with a thermal storage medium, and the crystal network sandwich structure supports and enhances the thermal conductivity of the thermal storage fixture.

[0018] Preferably, the heat pipe includes an inner bore and multiple capillary wicking channels, wherein:

[0019] The capillary liquid absorption core channel is arranged around the inner hole;

[0020] The capillary suction core channel includes a capillary section and a dovetail section;

[0021] Preferably, the inner radius of the heat pipe cross-section is 1.2mm-1.5mm;

[0022] The capillary length of the dovetail-shaped capillary wick channel of the heat pipe is 0.5mm-0.6mm;

[0023] The capillary segment width is 0.2mm-0.3mm;

[0024] The width of the dovetail section is 0.8mm-1.1mm;

[0025] The included angle of the swallowtail section is 55°-65°.

[0026] Preferably, the angle between the heat pipe axis and the length direction of the active mounting plate is less than 45°.

[0027] Preferably, the spacing between heat pipes in the non-local high heat flux heat source area within the active plate is 100mm-180mm; each heat pipe is thermally coupled to the local high heat flux heat source area.

[0028] Preferably, the wall thickness of the mounting hole embedded column is in the range of 1.8mm-2.5mm.

[0029] Preferably, the working fluid filling orifice includes a solid-liquid phase change working fluid filling orifice and a gas-liquid phase change working fluid filling orifice;

[0030] The solid-liquid phase change working fluid filling hole is connected to the inner cavity of the thin-walled cavity;

[0031] The gas-liquid phase change working fluid filling hole is connected to the heat pipe.

[0032] A method for manufacturing an integrated active board for spacecraft based on the above-described device adapted to non-uniform heat flow, according to the present invention, includes:

[0033] Step S1: Design an integrated active board for spacecraft that adapts to devices with non-uniform heat flow;

[0034] Step S2: The integrated active mounting plate is manufactured in an integrated manner using a laser selective melting forming method, with the plane where the length direction is perpendicular to the substrate of the laser selective melting equipment and the working fluid filling hole is located as the top surface to establish the forming direction;

[0035] Step S3: Fill the heat pipe of the manufactured integrated active mounting plate with liquid ammonia working fluid. The filling amount is calculated based on the volume of the liquid absorber. After filling, seal the working fluid filling hole. Fill the remaining space of the thin-walled cavity with paraffin working fluid. The filling amount is 85% of the cavity volume. After filling, seal the working fluid filling hole.

[0036] Compared with the prior art, the present invention has the following beneficial effects:

[0037] 1. This invention is manufactured in one piece using laser selective melting additive manufacturing process, without welding points or adhesive joints. This avoids the drawbacks of the original solution, which uses more than a hundred components for adhesive / welding, such as high interface thermal resistance, multiple leakage points, and poor temperature control and uniformity in local high heat flux areas.

[0038] 2. This invention designs a dovetail-shaped capillary heat pipe, which greatly improves the capillary suction force and working fluid transport characteristics, and realizes the maximum heat transfer capacity under the constraint of a narrow space. At the same time, through the layout design of the heat pipe and gas-liquid phase change heat transfer, the heat of the local high-power heat source is transported throughout the plate, achieving the effect of uniform temperature of the whole plate.

[0039] 3. The cavity of the present invention is filled with paraffin heat storage medium in the space other than the heat pipe. The Scherk's curved surface configuration load-bearing and thermally conductive enhanced skeleton array realizes the load-bearing function and the thermally conductive enhanced function of the paraffin solid-liquid phase change process, so as to achieve the load-bearing and uniform heat storage effect.

[0040] 4. This invention has advantages such as lightweight, uniform heat storage across the entire plate, high temperature control accuracy, good temperature uniformity, good load-bearing capacity, no risk of leakage caused by multi-point gluing / welding, and high reliability. It is suitable for meeting the temperature uniformity and high-precision temperature control requirements of high-power electronic equipment and surface array distributed devices in the local area of ​​the SAR antenna of the new generation of spacecraft. Attached Figure Description

[0041] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0042] Figure 1 This is a schematic diagram of the front-side distributed device arrangement of the active mounting plate of the spacecraft high-efficiency load-temperature equalization-heat storage integrated SAR antenna for adapting to non-uniform heat flow components in the present invention.

[0043] Figure 2 This invention relates to the arrangement of high-power electronic devices on the back side of an integrated SAR antenna active mounting plate for spacecraft with high efficiency in supporting, isothermal equalization, and thermal storage, adapting to non-uniform heat flux components.

[0044] Figure 3 This is a three-dimensional schematic diagram of an active mounting plate for a spacecraft-integrated SAR antenna that adapts to non-uniformly distributed heat flow components, according to the present invention.

[0045] Figure 4 This is a three-dimensional AA-section schematic diagram of the active mounting plate of an integrated SAR antenna for spacecraft that adapts to non-uniform heat flow components, which is a high-efficiency load-bearing, temperature-equalizing, and heat-storage system according to the present invention.

[0046] Figure 5 This is a three-dimensional schematic diagram of a space three-dimensional lattice network sandwich structure array unit for an integrated SAR antenna active mounting plate for spacecraft that adapts to non-uniformly distributed heat flow components.

[0047] Figure 6 This is a three-dimensional schematic diagram of the micro heat pipe layout of an active mounting plate for a spacecraft-integrated SAR antenna that adapts to non-uniformly distributed heat flow components, according to the present invention.

[0048] Figure 7 This is a three-dimensional schematic diagram of the laser selective melting forming direction of the active mounting plate of the spacecraft's high-efficiency load-bearing, temperature equalization, and heat storage integrated SAR antenna for adapting to non-uniformly distributed heat flux components, according to the present invention.

[0049] Figure 8 This is a schematic diagram of the active mounting plate for the original glued / screw-jointed composite phase-change SAR antenna. Detailed Implementation

[0050] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the invention in any way. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all fall within the protection scope of the present invention.

[0051] like Figures 1 to 7 As shown, the active mounting plate of the spacecraft's high-efficiency load-bearing, temperature-equalizing, and heat-storage integrated SAR antenna, adapted to non-uniformly distributed heat flow components, according to the present invention, includes a thin-walled cavity, a micro heat pipe shell, mounting holes for mounting electronic equipment, a spatial three-dimensional lattice network sandwich structure, working fluid filling holes, and other structural features. The micro heat pipes, mounting holes, and spatial three-dimensional lattice network sandwich structure are arranged between the upper and lower walls of the thin-walled cavity. The array unit of the spatial three-dimensional lattice network sandwich structure is a Scherk's curved cell configuration, and the capillary wick channel cross-section of the micro heat pipe is dovetail-shaped. All structural features of the spacecraft's high-efficiency load-bearing, temperature-equalizing, and heat-storage integrated SAR antenna active mounting plate are made of aluminum alloy or magnesium alloy and are manufactured in one piece using a laser selective melting additive manufacturing process.

[0052] Furthermore, the design range for the cavity wall thickness is 0.5mm to 0.7mm. The design range for the inner cavity height of the thin-walled cavity is 5mm to 6mm.

[0053] Furthermore, the micro heat pipe layout design must adhere to the following principles: the spacing between micro heat pipes within the non-localized high heat flux heat source area of ​​the active mounting plate is designed to be 100mm to 180mm. The specific spacing value can be determined based on constraints such as the position of the mounting hole embedded parts within the plate. Based on this, combined with the width of the active mounting plate, the number of micro heat pipes required within the plate is calculated. On this basis, considering the constraints of the additive forming overhang angle, a meandering heat pipe route design and a shared sidewall design between heat pipes are adopted to ensure that each heat pipe within the plate forms a thermal coupling with the localized high heat flux heat source area. Through the gas-liquid phase change heat transfer of the liquid working fluid within the pipe, the heat from the localized high-power heat source is relatively transported throughout the plate, achieving a uniform temperature effect.

[0054] Furthermore, the angle between the axis of the micro heat pipe and the length direction of the active mounting plate is less than 45°.

[0055] Furthermore, the inner radius of the micro heat pipe cross-section is designed to be in the range of 1.2mm to 1.5mm; the capillary length of the dovetail capillary wick channel is designed to be in the range of 0.5mm to 0.6mm, the capillary width is designed to be in the range of 0.2mm to 0.3mm, the dovetail width is designed to be in the range of 0.8mm to 1.1mm, and the dovetail angle is designed to be in the range of 55° to 65°; the minimum wall thickness of the micro heat pipe is designed to be in the range of 0.5mm to 0.8mm.

[0056] Furthermore, the spatial three-dimensional lattice network sandwich structure array fills the remaining space within the thin-walled cavity, excluding the micro heat pipes and mounting hole embeddings; the cell element of the sandwich structure array is a Scherk's surface cell configuration, with the cell envelope size equal to the height of the thin-walled cavity, and the surface equation of the Scherk's surface cell satisfies:

[0057] exp(2πz / L2)*cos(2πx / L2)-cos(2πy / L2)=0

[0058] The wall thickness of the cell is designed to be in the range of 0.2mm to 0.3mm; the space of the thin-walled cavity of the mounting plate, excluding the heat pipe shell, is filled with paraffin heat storage medium. The three-dimensional lattice network sandwich structure realizes the load-bearing function and the thermal conductivity enhancement effect of the solid-liquid phase change of paraffin, thereby achieving the load-bearing and uniform heat storage effect.

[0059] Furthermore, both the solid-liquid phase change working fluid filling hole and the gas-liquid phase change working fluid filling hole are located on the side wall of the component. The solid-liquid phase change working fluid filling hole has a diameter of 5mm and also serves as an additive manufacturing powder cleaning hole. The gas-liquid phase change working fluid filling hole has the same cross-sectional shape as the heat pipe.

[0060] Furthermore, the wall thickness t5 of the mounting hole embedded column is designed to be in the range of 1.8mm~2.5mm.

[0061] Furthermore, the integrated SAR antenna active mounting plate is manufactured in one piece using a laser selective melting forming method. The forming direction is established with the plane where the length direction is perpendicular to the substrate of the laser selective melting equipment and the working fluid filling hole is located as the top surface. The laser selective melting forming parameters are designed as follows: laser power 150-180W; scanning speed 1050-1450mm / s; melt channel spacing 0.08mm; powder layer thickness 0.03mm; and scanning strategy is "Z" type scanning.

[0062] Furthermore, the micro heat pipe is filled with liquid ammonia as the working fluid, and the filling amount is calculated based on the volume of the wick. After filling, the working fluid filling tube is cut off and sealed with cold welding pliers. The remaining space of the thin-walled cavity is filled with paraffin wax as the working fluid, and the filling amount is 85% of the cavity volume. After filling, the working fluid filling tube is cut off and sealed with cold welding pliers.

[0063] The specific implementation steps of this invention are as follows:

[0064] Step 1: Complete the design of an active mounting plate for a spacecraft's high-efficiency integrated SAR antenna with homogenization and thermal storage, designed for laser additive manufacturing. The active mounting plate includes a thin-walled cavity, a micro heat pipe shell, mounting holes for electronic equipment, a three-dimensional lattice network sandwich structure, and working fluid filling holes. The micro heat pipes, mounting holes, and the three-dimensional lattice network sandwich structure are arranged between the upper and lower walls of the thin-walled cavity. The array unit of the three-dimensional lattice network sandwich structure is a Scherk's curved cell configuration, and the capillary wick channel of the micro heat pipe has a dovetail-shaped cross-section. All structural features are made of aluminum or magnesium alloy and manufactured in one piece using laser selective melting additive manufacturing.

[0065] The design range for the thin-walled cavity wall thickness t1 is 0.5mm~0.7mm, and the design range for the inner cavity height L2 is 5mm~6mm. The micro heat pipe layout design must meet the following principles: the spacing S of the micro heat pipes within the non-local high heat flux heat source area of ​​the active mounting plate is designed to be 100mm~180mm. The specific spacing value can be determined based on constraints such as the position of the embedded parts in the mounting holes within the plate. Based on this, combined with the width of the active mounting plate, the number of micro heat pipes that need to be arranged within the plate is calculated. On this basis, methods such as a meandering micro heat pipe route design and a shared sidewall design between heat pipes are adopted to ensure that each heat pipe within the plate forms a thermal coupling with the local high heat flux heat source area. Through the gas-liquid phase change heat transfer of the liquid working fluid inside the pipe, the heat from the local high-power heat source is relatively transported throughout the plate, achieving a uniform temperature effect. Simultaneously, the angle between the axis of the micro heat pipe and the length direction of the active mounting plate must be less than 45°. The design range of the inner radius of the micro heat pipe cross-section is 1.2mm~1.5mm; the design range of the capillary length t3 of the dovetail capillary wick channel is 0.5mm~0.6mm, the design range of the capillary width d1 is 0.2mm~0.3mm, the design range of the dovetail width d2 is 0.8mm~1.1mm, and the design range of the dovetail angle α is 55°~65°; the design range of the minimum wall thickness t2 of the micro heat pipe is 0.5mm~0.8mm. A spatial three-dimensional lattice network sandwich structure array fills the remaining space within the thin-walled cavity, excluding the micro heat pipes and mounting hole embedded parts. The cell of the sandwich structure array is a Scherk's surface cell configuration, with the cell envelope size equal to the height of the thin-walled cavity. The surface equation of the Scherk's surface cell satisfies exp(2πz / L2)*cos(2πx / L2)-cos(2πy / L2)=0. The wall thickness t4 of the cell is designed to range from 0.2mm to 0.3mm. The space within the thin-walled cavity of the mounting plate, excluding the heat pipe shell, is filled with paraffin heat storage medium. The spatial three-dimensional lattice network sandwich structure achieves both load-bearing capacity and enhanced thermal conductivity due to the solid-liquid phase change of paraffin, thus achieving load-bearing capacity and uniform heat storage. Both the solid-liquid phase change working fluid filling hole and the gas-liquid phase change working fluid filling hole are located on the side wall of the component. The solid-liquid phase change working fluid filling hole has a diameter of 5 mm and also serves as an additive manufacturing powder cleaning hole. The gas-liquid phase change working fluid filling hole has the same cross-sectional shape as the heat pipe.

[0066] Step 2: The integrated SAR antenna active mounting plate is manufactured using the laser selective melting forming method. The forming direction is determined by taking the plane with the length direction perpendicular to the substrate of the laser selective melting equipment and the plane where the working fluid filling hole is located as the top surface. The laser selective melting forming parameters are designed as follows: laser power 150~180W; scanning speed 1050~1450mm / s; melt channel spacing 0.08mm; powder layer thickness 0.03mm; and the scanning strategy is "Z" type scanning.

[0067] Step 3: Fill the tiny heat pipe of the manufactured integrated SAR antenna active mounting plate with liquid ammonia working fluid. The filling amount is calculated based on the volume of the liquid wick. After filling, cut and seal the working fluid filling tube with cold welding pliers. Fill the remaining space of the thin-walled cavity with paraffin working fluid. The filling amount is 85% of the cavity volume. After filling, cut and seal the working fluid filling tube with cold welding pliers.

[0068] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0069] Specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. Unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

Claims

1. A spacecraft integrated active panel adapted for non-uniform heat flux devices, characterized by, Including the active mounting plate, which is manufactured in one piece using a laser selective melting additive manufacturing process; The active mounting plate includes a thin-walled cavity, mounting hole embedded parts, heat pipes, working fluid filling holes, and a three-dimensional crystal network sandwich structure. Mounting holes, heat pipes, and a three-dimensional crystal network sandwich structure are arranged between the upper and lower walls of the thin-walled cavity. The mounting hole is used to install electronic equipment; The working fluid filling hole is located on the side wall of the thin-walled cavity; The array cell of the spatial three-dimensional lattice network sandwich structure is Scherk's curved cell configuration. The spatial three-dimensional lattice network sandwich structure array fills and arranges the remaining space in the thin-walled cavity except for the heat pipes and mounting hole embedded parts; the height of the Scherk's curved cell configuration is equal to the height of the thin-walled cavity. The thin-walled cavity of the mounting plate, excluding the heat pipe shell, is filled with paraffin thermal storage medium. The three-dimensional lattice network sandwich structure achieves the load-bearing function and the thermal conductivity enhancement effect of the solid-liquid phase change of paraffin, thus achieving the effects of load-bearing and uniform heat storage.

2. The spacecraft integrated active panel accommodating non-uniform heat flux devices of claim 1, wherein, The Scherk's surface cell equation satisfies: exp(2πz / L2)*cos(2πx / L2)-cos(2πy / L2)=0; In the formula, L2 is the height of the thin-walled cavity, and the x, y, z coordinate system conforms to the definition of the Cartesian rectangular coordinate system; The cell wall thickness is 0.2mm-0.3mm.

3. The spacecraft integrated active panel accommodating non-uniform heat flux devices of claim 1, wherein, The heat pipe is filled with liquid ammonia as the working fluid.

4. The spacecraft integrated active panel accommodating non-uniform heat flux devices of claim 1, wherein, The wall thickness of the thin-walled cavity is 0.5mm-0.7mm, and the height of the inner cavity is 5mm-6mm.

5. The spacecraft integrated active panel accommodating non-uniform heat flux devices of claim 1, wherein, The angle between the heat pipe axis and the length direction of the active mounting plate is less than 45°.

6. The spacecraft integrated active panel accommodating non-uniform heat flux devices of claim 1, wherein, The heat pipe includes an inner bore and multiple capillary wicking channels, wherein: The capillary liquid absorption core channel is arranged around the inner hole; The capillary suction core channel includes a capillary section and a dovetail section; One end of the capillary segment is connected to the inner hole, and the other end of the capillary segment is connected to the dovetail segment. The inner radius of the heat pipe cross-section is 1.2mm-1.5mm; The capillary length of the dovetail-shaped capillary wick channel of the heat pipe is 0.5mm-0.6mm; The capillary segment width is 0.2mm-0.3mm; The width of the dovetail section is 0.8mm-1.1mm; The included angle of the swallowtail section is 55°-65°.

7. The spacecraft integrated active panel accommodating non-uniform heat flux devices of claim 1, wherein, The heat pipe layout must meet the following requirements: The spacing between heat pipes in the non-localized heat flow heat source area within the active mounting plate is designed to be 100mm-180mm. The specific spacing value is determined based on the positional constraints of the embedded parts in the mounting holes within the plate. Based on this, and combined with the width of the active mounting plate, the number of heat pipes that need to be arranged within the plate is calculated. By adopting a meandering heat pipe route design and a shared sidewall design between heat pipes, it is ensured that each heat pipe in the plate is thermally coupled with a local high heat flux heat source area. Through the gas-liquid phase change heat transfer of the liquid working fluid in the pipe, the heat of the local high power heat source is transported relatively throughout the plate, achieving a uniform temperature effect.

8. The spacecraft integrated active panel accommodating non-uniform heat flux devices of claim 1, wherein, The wall thickness of the mounting hole embedded column ranges from 1.8mm to 2.5mm.

9. The spacecraft integrated active panel accommodating non-uniform heat flux devices of claim 1, wherein, The working fluid filling orifice includes a solid-liquid phase change working fluid filling orifice and a gas-liquid phase change working fluid filling orifice. The solid-liquid phase change working fluid filling hole is connected to the inner cavity of the thin-walled cavity; The gas-liquid phase change working fluid filling hole is connected to the heat pipe. The diameter of the filling hole for the solid-liquid phase change working medium is 5 mm. The shape of the gas-liquid phase change working fluid filling hole is consistent with the shape of the center hole of the heat pipe cross section.

10. A method for manufacturing an integrated active board for spacecraft based on any one of claims 1-9, characterized in that, include: Step S1: Design an integrated active board for spacecraft that adapts to devices with non-uniform heat flow; Step S2: The integrated active mounting plate is manufactured in an integrated manner using a laser selective melting forming method, with the plane where the length direction is perpendicular to the substrate of the laser selective melting equipment and the working fluid filling hole is located as the top surface to establish the forming direction; Step S3: Fill the heat pipe of the manufactured integrated active mounting plate with liquid ammonia working fluid. The filling amount is calculated based on the volume of the liquid absorber. After filling, seal the working fluid filling hole. Fill the remaining space of the thin-walled cavity with paraffin working fluid. The filling amount is 85% of the cavity volume. After filling, seal the working fluid filling hole.

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