Vibration feedback module, touch control device and electronic equipment

Abstract

The present invention discloses a vibration feedback module, a touch control device and an electronic device. The vibration feedback module comprises: a circuit board (1); a thin film pressure sensor (2) disposed on the surface of the circuit board (1) and electrically connected to the circuit board (1); and a thin film driver (3) disposed on the surface of the circuit board (1) and electrically connected to the circuit board (1); wherein the thin film driver (3) vibrates in response to a pressure signal detected by the thin film pressure sensor (2). The vibration feedback module in the present invention can detect pressure through the thin film pressure sensor, and the thin film driver generates vibration feedback. At the same time, the thin film pressure sensor and the thin film driver are layered structures with a small thickness, which is convenient for realizing the thinness and miniaturization of the vibration feedback module, thereby saving the internal space of the electronic device and realizing the thinness and miniaturization of the electronic device.

Description

Technical Field

[0001] The present invention relates to the field of vibration feedback technology, and in particular to a vibration feedback module, a touch control device and an electronic device. Background Art

[0002] Electronic devices often have functions such as touch feedback or press feedback. For example, the touchpad of a laptop or the touch screen of a mobile phone can give users vibration feedback and respond to the user's control through vibration, providing a better user experience.

[0003] Currently, electronic devices are often equipped with vibration motors to feedback vibration signals. The vibration motors are relatively large in size, which increasingly limits the thinness and miniaturization of electronic devices.

[0004] In addition, current electronic devices are equipped with pressure sensors to detect pressure in order to control the vibration of the vibration motor according to the pressure. The design and installation of current pressure sensors are relatively complex, requiring a specific cantilever beam to implement, and are relatively expensive. Moreover, when the vibration motor vibrates, it will affect the data collected by the pressure sensor, thereby affecting the normal control of the vibration motor.

[0005] Therefore, it is necessary to improve the prior art to overcome the above defects in the prior art. Summary of the invention

[0006] The object of the present invention is to provide a vibration feedback module, a touch control device and an electronic device. The vibration feedback module has a simple structure and is lighter and thinner.

[0007] To achieve the above-mentioned object of the invention, on the one hand, the present invention proposes a vibration feedback module, comprising:

[0008] Circuit boards;

[0009] a thin film pressure sensor, disposed on the surface of the circuit board and electrically connected to the circuit board; and

[0010] A thin film driver, disposed on the surface of the circuit board and electrically connected to the circuit board;

[0011] The thin film driver vibrates in response to the pressure signal detected by the thin film pressure sensor.

[0012] Further, the thin film pressure sensor and the thin film driver are arranged on the same surface of the circuit board; or, the thin film pressure sensor and the thin film driver are respectively arranged on two surfaces of the circuit board.

[0013] Furthermore, the thin film pressure sensor is a combination of one or more of a strain sensor, a piezoelectric film and a strain detection ink; the thin film driver is a combination of one or more of a piezoelectric ceramic, an organic piezoelectric film, an electret diaphragm and a memory alloy with a driving function.

[0014] Furthermore, the vibration feedback module also includes a control unit electrically connected to the circuit board, and the control unit controls the vibration of the thin film driver according to the pressure signal detected by the thin film pressure sensor when the thin film driver is not vibrating.

[0015] Furthermore, the control unit includes a pressure acquisition and signal processing module connected to the film pressure sensor, a vibration drive module connected to the film driver, a pressure detection and vibration switching switch connected to both the pressure acquisition and signal processing module and the vibration drive module, and a processor connected to the pressure detection and vibration switching switch, and the processor is used to control the pressure detection and vibration switching switch to connect the pressure acquisition and signal processing module with the processor or to connect the vibration drive module with the processor.

[0016] Furthermore, the circuit board is a flexible circuit board, and the circuit board includes a first body for mounting the thin film pressure sensor, a second body for mounting the thin film driver, and a connecting portion connected between the first body and the second body.

[0017] Furthermore, the first body includes a flexible layer and a reinforcement layer that are bonded to each other, the thin film pressure sensor is bonded to the flexible layer, and the first body includes a main body and a supporting foot protruding from the main body, and the supporting foot extends obliquely toward the side where the thin film pressure sensor is located and away from the outer periphery of the main body.

[0018] Furthermore, the reinforcement layer is a combination of one or more of a metal material reinforcement layer, an organic material reinforcement layer and a composite material reinforcement layer.

[0019] Furthermore, the supporting foot comprises a supporting surface, and a distance between the supporting surface and a base surface of the first body on which the thin film pressure sensor is mounted is 0.03-1 mm.

[0020] Furthermore, the second body is bent through the connecting portion to be arranged opposite to the first body, and the first body and the second body are connected by an adhesive layer.

[0021] Furthermore, the thin film pressure sensor and the thin film driver are respectively located on both sides of the first body and the second body.

[0022] In a second aspect, the present invention provides a touch control device, comprising the vibration feedback module as described in any one of the above items.

[0023] In a third aspect, the present invention provides a touch control device, comprising:

[0024] Touchpad;

[0025] a support plate; and,

[0026] A vibration feedback module, wherein the support foot of the vibration feedback module is connected to the touch panel, and the film driver of the vibration feedback module is connected to the support panel.

[0027] In a fourth aspect, the present invention provides an electronic device, comprising the vibration feedback module as described above or the touch control device as described above.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] 1. By arranging a thin film pressure sensor and a thin film driver on the circuit board, the pressure can be detected by the thin film pressure sensor, and the vibration feedback can be generated by the thin film driver. At the same time, the thin film pressure sensor and the thin film driver are layered structures with a small thickness, which is convenient for realizing the lightweight and miniaturization of the vibration feedback module, thereby saving the internal space of the electronic equipment and realizing the lightweight and miniaturization of the electronic equipment.

[0030] 2. By setting the pressure detection and vibration switching switch, the pressure acquisition and signal processing module can be selectively connected to the processor or the vibration drive module can be selectively connected to the processor, so that the pressure collected by the film driver and the vibration of the film driver are staggered, preventing the influence of vibration on pressure acquisition and enhancing the reliability of the vibration feedback module.

[0031] 3. By setting the circuit board as a flexible circuit board, and the circuit board includes a first body, a second body and a connecting portion connected between the first body and the second body, the first body and the second body can be conveniently folded in half, so that the installation area occupied by the vibration feedback module can be further reduced, making its structure more compact and small, which is more conducive to realizing the lightweight and miniaturization of electronic equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 1 is a schematic diagram of the structure of a vibration feedback module according to an embodiment of the present invention, in which a thin film pressure sensor and a thin film driver are located on the same surface of a circuit board.

[0033] Figure 2 It is a structural schematic diagram of a vibration feedback module according to an embodiment of the present invention, in which a thin film pressure sensor and a thin film driver are respectively located on two surfaces of a circuit board and arranged opposite to each other.

[0034] Figure 3 It is a structural schematic diagram of a vibration feedback module according to an embodiment of the present invention, in which the thin film pressure sensor and the thin film driver are respectively located on two surfaces of the circuit board and are staggered.

[0035] Figure 4 It is a module block diagram of the control unit in the present invention.

[0036] Figure 5 It is a plan view of a vibration feedback module according to one embodiment of the present invention, wherein the circuit board in the figure is a flexible circuit board.

[0037] Figure 6 It is a cross-sectional schematic diagram of a vibration feedback module according to one embodiment of the present invention.

[0038] Figure 7 1 is a top view schematic diagram of a vibration feedback module according to an embodiment of the present invention, in which the double-sided tape is not shown.

[0039] Figure 8 1 is a bottom view schematic diagram of a vibration feedback module according to an embodiment of the present invention, in which the double-sided tape is not shown.

[0040] Fig. 9 It is a cross-sectional schematic diagram of a touch control device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0041] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. It is to be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only some structures related to the present application are shown in the accompanying drawings, rather than all structures. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0042] The terms "including" and "having" and any variations thereof in this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products or devices.

[0043] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0044] like Figure 1 As shown, a vibration feedback module corresponding to a preferred embodiment of the present invention includes a circuit board 1 and a thin film pressure sensor 2 and a thin film driver 3 both electrically connected to the circuit board 1. The thin film pressure sensor 2 and the thin film driver 3 are both arranged on the surface of the circuit board 1. Among them, the thin film pressure sensor 2 is used to detect pressure. When an external force is applied to the thin film pressure sensor 2 by pressing or other means, the thin film pressure sensor 2 can generate a pressure signal according to the pressure. The pressure signal is transmitted to the circuit board 1 in the form of an electrical signal. The thin film driver 3 can vibrate in response to the pressure signal detected by the thin film pressure sensor 2, thereby generating vibration feedback.

[0045] In a preferred embodiment, reference Figure 1 The thin film pressure sensor 2 and the thin film driver 3 are arranged on the same surface of the circuit board 1. In another preferred embodiment, the thin film pressure sensor 2 and the thin film driver 3 are respectively arranged on two surfaces of the circuit board 1. In this embodiment, the thin film pressure sensor 2 can be arranged on the same surface of the circuit board 1 as the thin film driver 3. Figure 2 As shown, it can also be set up like Figure 3 As shown, the staggered arrangement in the vertical direction and the facing arrangement are obviously beneficial to reducing the volume of the entire vibration feedback module.

[0046] The vibration feedback module also includes a control unit, which can be electrically connected to the circuit board 1, and electrically connected to the thin film pressure sensor 2 and the thin film driver 3 through the circuit board 1, or directly electrically connected to the thin film pressure sensor 2 and the thin film driver 3. The control unit is used to receive the pressure signal sensed by the thin film pressure sensor 2, and control the film driver 3 to vibrate after analysis and processing. The control unit can be directly set on the circuit board 1, or it can be set outside the circuit board 1, and electrically connected to the circuit board 1 through cables, etc. For example, when the vibration feedback module is applied to an electronic device, the control unit can be set on the main board of the electronic device, and the main board and the circuit board 1 are connected through cables. Of course, the vibration feedback module can also have an independent main board, and the control unit is set on its own main board.

[0047] In order to reduce the influence of the vibration of the thin film driver 3 on the pressure collection of the thin film pressure sensor 2, the vibration feedback module also includes a control unit electrically connected to the circuit board 1, and the control unit is configured to control the vibration of the thin film driver 3 according to the pressure signal detected by the thin film pressure sensor 2 when the thin film driver 3 is not vibrating. In this way, the distorted pressure signal detected during vibration is eliminated, and the vibration feedback is more accurate.

[0048] The control unit can, for example, record the time when the film driver 3 vibrates, thereby excluding the pressure signal collected during this period to ensure the accuracy of the collected signal. Figure 4 The control unit includes a pressure acquisition and signal processing module 5 connected to the thin film pressure sensor 2, a vibration driving module 50 connected to the thin film driver 3, a pressure detection and vibration switching switch 51 connected to both the pressure acquisition and signal processing module 5 and the vibration driving module 50, and a processor 52 connected to the pressure detection and vibration switching switch 51. The pressure detection and vibration switching switch 51 is used to control the pressure acquisition and signal processing module 5 to be connected to the processor 52 or the vibration driving module 50 to be connected to the processor 52. The signal collected by the thin film pressure sensor 2 can be processed by the pressure acquisition and signal processing module 5, and the vibration driving module 50 is used to control the vibration of the thin film driver 3 according to the control instruction of the processor 52.

[0049] The processor 52 is preferably a single chip microcomputer, which can control the action of the pressure detection and vibration switching switch 51, so that the pressure acquisition and signal processing module 5 is connected to the processor 52 or the vibration drive module 50 is connected to the processor 52, so that when the thin film pressure sensor 2 collects the pressure signal, the thin film driver 3 does not vibrate, and when the thin film driver 3 vibrates, the signal transmission between the processor 52 and the thin film pressure sensor 2 is turned off, and the processor 52 does not collect the pressure signal, thereby preventing the interference of the vibration on the thin film pressure sensor 2, and the detection result is more accurate. Preferably, the processor 52 can control the pressure detection and vibration switching switch 51 to switch once every certain time interval, so that after collecting the pressure signal for a period of time, the thin film driver 3 is controlled to vibrate according to the pressure signal, and the pressure is collected again after the thin film driver 3 vibrates for a period of time. Of course, when the pressure accuracy requirement is not high, the switch can also be placed in an empty state, so that the pressure acquisition and signal processing module 5 and the vibration drive module 50 are connected to the processor 52 at the same time, and the thin film pressure sensor 2 can detect the pressure when the thin film driver 3 vibrates.

[0050] Furthermore, the magnitude of the vibration force generated by the thin film driver 3 can be controlled. The thin film pressure sensor 2 generates electrical signals of different sizes according to the detected pressure. The control unit drives the thin film driver 3 to generate vibration forces of different sizes according to the electrical signals of different sizes, so that the greater the pressing force, the greater the vibration force fed back by the thin film driver 3, thereby providing a better user experience.

[0051] The thin film pressure sensor 2 and the thin film driver 3 are both film-like structures with a small thickness, which is conducive to the thinness and miniaturization of the entire vibration feedback module. The thin film pressure sensor 2 has a static force detection function, and preferably detects pressure through deformation. The thin film pressure sensor 2 can be, for example, a combination of one or more materials or components with pressure detection functions such as strain sensors, piezoelectric films, and strain detection inks (in the case of combination, for example, a layer of strain sensors and a layer of piezoelectric films can be set at the same time). The thin film driver 3 is preferably a piezoelectric material such as piezoelectric ceramics or organic piezoelectric films, which generates vibrations through the piezoelectric effect. The thin film driver 3 can also be an electret diaphragm or a memory alloy with a driving function. Of course, the thin film driver 3 is not limited to containing only a single material or component. For example, it can be a combination of multiple materials such as piezoelectric ceramics, organic piezoelectric films, electret diaphragms, or a memory alloy with a driving function (for example, a layer of piezoelectric ceramics and a layer of organic piezoelectric films are set at the same time).

[0052] The circuit board 1 can be a hard PCB board or a flexible circuit board (FPC). As a preferred embodiment, the circuit board 1 is a flexible circuit board. Figures 5 to 9 An embodiment in which the circuit board 1 is a flexible circuit board is shown.

[0053] refer to Figure 5 , Figure 5 A plan view of a vibration feedback module is shown, wherein the circuit board 1 includes a first body 12 for mounting a thin film pressure sensor 2, a second body 14 for mounting a thin film driver 3, and a connecting portion 15 connected between the first body 12 and the second body 14. Since the connecting portion 15 is flexible, the connecting portion 15 can be conveniently bent to adjust the angle between the first board 12 and the second body 14, thereby facilitating the installation of the vibration feedback module.

[0054] As a preferred embodiment, refer to Figure 6 , Figure 7 and Figure 8 , Figure 6 , Figure 7 and Figure 8They are respectively a cross-sectional schematic diagram, a top view schematic diagram and a bottom view schematic diagram of the vibration feedback module. The second body 14 and the thin film pressure sensor 2 are respectively located on both sides of the first body 12, and the first body 12 and the second body 14 are connected by the adhesive layer 4, that is, the second body 14 is folded in half to just below the first body 12 through the connecting portion 15, and the two are connected by the adhesive layer 4. In this way, the space occupied by the vibration feedback module in the horizontal direction is smaller. Further preferably, the thin film pressure sensor 2 and the thin film driver 3 are respectively located on both sides of the first body 12 and the second body 14, that is, before folding, the thin film pressure sensor 2 and the thin film driver 3 are arranged on the same side of the circuit board 1, and after folding, the two are respectively located on both sides of the vibration feedback module, so that the thin film driver 3 can more conveniently contact with external shells and other components, transmit the vibration more directly, and reduce force attenuation.

[0055] Further preferably, the first body 12 includes a flexible layer 12a and a reinforcement layer 12b that are bonded to each other. Furthermore, the first body 12 also includes a body portion 120 and a support foot 121 that protrudes from the body portion 120, and the support foot 121 protrudes toward the side where the thin film pressure sensor 2 is located. The support foot 121 is used to withstand external pressure, thereby driving the body portion 120 to deform. At this time, the thin film pressure sensor 2 bonded to the body portion 120 will also deform with the deformation of the body portion 120, thereby generating a pressure signal. When the external pressure is lost, the body portion 120 and the support foot 121 will restore to their original state under the action of their own elasticity. Obviously, the reinforcement layer 12b can improve the ability of the first body 12 to restore to its original state. The support foot 121 protrudes obliquely from the outer periphery of the first body 12 in a direction away from the outer periphery. Therefore, when the external pressure acts on the support foot 121, the body portion 120 can be more easily driven to deform, so that the thin film pressure sensor 2 can perform pressure detection more sensitively. Preferably, the support legs 121 extend beyond the thin film pressure sensor 2, so that when subjected to external pressure, the thin film pressure sensor 2 will not be directly squeezed, and the protection effect of the thin film pressure sensor 2 is better. The number of support legs 121 is not limited, for example, it can be one or more, preferably, the number is more than two, and they are evenly distributed with the center of the main body 120 as the center of the circle to drive the main body 120 to deform evenly, and the main body 120 is preferably circular.

[0056] Preferably, the reinforcing layer 12b is a combination of one or more reinforcing layers with supporting functions, such as a metal reinforcing layer, an organic material reinforcing layer, and a composite material reinforcing layer. The metal material reinforcing layer can be, for example, a stainless steel reinforcing layer, an aluminum alloy reinforcing layer, etc. When the reinforcing layer 12b is a metal material reinforcing layer, its thickness range is preferably 0.02-1.2 mm, and more preferably 0.12 mm; the organic material reinforcing layer can be, for example, a PI reinforcing layer, a PET reinforcing layer, a PC reinforcing layer, and a PEEK reinforcing layer, etc. When the reinforcing layer 12b is an organic material reinforcing layer, its thickness range is preferably 0.05-1.5 mm; the composite material reinforcing layer can be, for example, a PCB board reinforcing layer, etc. When the reinforcing layer 12b is a composite material reinforcing layer, its thickness range is preferably 0.08 mm-1.2 mm. The reinforcing layers 12b of different materials can achieve better reinforcing and restoring effects within the specified thickness range, thereby ensuring the reliability of product use. When the reinforcing layer 12 b includes multiple reinforcing layers, for example, two types of reinforcing layers may be stacked and provided.

[0057] Preferably, reference Figure 6 The support foot 121 includes a connecting portion 1210 parallel to the main body 120 and an inclined portion 1211 connected between the main body 120 and the connecting portion 1210. The connecting portion 1210 has a supporting surface 1212 for connecting and installing with other objects. The main body 120 has a base surface 1213 for installing the thin film pressure sensor 2. The distance between the supporting surface 1212 and the base surface 1213 ranges from 0.03 to 1 mm, preferably 0.3 mm.

[0058] In the embodiment where the circuit board 1 is a flexible circuit board, the circuit board 1 is an electrical signal transmission carrier of the thin film pressure sensor 2 and the thin film driver 3. The connection portion 1210 of the support foot 121 is provided with a pin 1214 (soldered bare copper), which can be connected to the external mainboard for power supply through SMT. The thin film driver 3 is provided with two silver paste connection points 30, which are used to be electrically connected to the circuit board 1 and further connected to the pins 1214. The number of pins 1214 can be set as needed.

[0059] As a preferred embodiment, double-sided tape 31 is provided on the support surface 1212 and the surface of the thin film driver 3, and the vibration feedback module can be conveniently connected to the position where it needs to be connected through the double-sided tape 31, which makes installation more convenient.

[0060] The present invention also proposes a touch device, which includes the vibration feedback module mentioned above. When the touch device is pressed, the touch device can generate vibration feedback through the vibration feedback module. Since the vibration feedback module has a small volume, the touch device can be easily miniaturized.

[0061] In a preferred embodiment, reference Fig. 9 The touch control device includes a housing 60, a touch panel 6 movably arranged in the housing 60, and a vibration feedback module 8 arranged below the touch panel 6. The upper surface of the touch panel 6 is exposed to the housing 60, and it can move up and down relative to the housing 60, and has a certain amount of movement, so that when the touch panel 6 is touched or pressed, the touch panel 6 can press down the vibration feedback module below. The housing 60 includes a support plate 7 arranged opposite to the touch panel 6, and the vibration feedback device 8 is arranged between the touch panel 6 and the support plate 7. The support foot 121 of the vibration feedback module 8 is connected to the touch panel 6, and the film driver 3 of the vibration feedback module 8 is connected to the support plate 7. The support foot 121 and the touch panel 6, as well as the film driver 3 and the support plate 7 can be connected by double-sided adhesive 31. The touch control device can be applied to a laptop computer, for example, and the touch panel 6 is the touch panel of the laptop computer. After a human touches or presses the touch panel 6, the touch panel 6 drives the first body 12 and the film pressure sensor 2 thereon to deform, thereby causing the film driver 3 to generate vibration feedback.

[0062] It is understandable that the number of vibration feedback modules in the touch device is not limited. Fig. 9 , multiple vibration feedback modules 8 can be set between the touch panel 6 and the support panel 7 so that vibration feedback can be generated in multiple areas, the vibration is more uniform, and the experience is better.

[0063] The present invention further provides an electronic device, which includes the vibration feedback module as described above or includes the touch control device as described above. The electronic device may be, for example, a notebook computer, a tablet computer, or a mobile phone.

[0064] The present invention has at least the following advantages:

[0065] 1. By arranging a thin film pressure sensor and a thin film driver on the circuit board, the pressure can be detected by the thin film pressure sensor, and the vibration feedback can be generated by the thin film driver. At the same time, the thin film pressure sensor and the thin film driver are layered structures with a small thickness, which is convenient for realizing the lightweight and miniaturization of the vibration feedback module, thereby saving the internal space of the electronic equipment and realizing the lightweight and miniaturization of the electronic equipment.

[0066] 2. By setting the pressure detection and vibration switching switch, the pressure acquisition and signal processing module can be selectively connected to the processor or the vibration drive module can be selectively connected to the processor, so that the pressure collected by the film driver and the vibration of the film driver are staggered, preventing the influence of vibration on pressure acquisition and enhancing the reliability of the vibration feedback module.

[0067] 3. By setting the circuit board as a flexible circuit board, and the circuit board includes a first body, a second body and a connecting portion connected between the first body and the second body, the first body and the second body can be conveniently folded in half, so that the installation area occupied by the vibration feedback module can be further reduced, making its structure more compact and small, which is more conducive to realizing the lightweight and miniaturization of electronic equipment.

[0068] The above is only a specific implementation of the present invention, and any other improvements made based on the concept of the present invention are considered to be within the protection scope of the present invention.

Claims

1. A vibration feedback module, characterized in that: include: Circuit board (1); A thin film pressure sensor (2) is arranged on the surface of the circuit board (1) and is electrically connected to the circuit board (1); as well as, A thin film driver (3) is disposed on the surface of the circuit board (1) and is electrically connected to the circuit board (1); wherein the thin film driver (3) vibrates in response to a pressure signal detected by the thin film pressure sensor (2); The thin film pressure sensor (2) and the thin film driver (3) are arranged on the same surface of the circuit board (1); or, the thin film pressure sensor (2) and the thin film driver (3) are arranged on two surfaces of the circuit board (1) respectively; The circuit board (1) is a flexible circuit board, and comprises a first body (12) for mounting the thin film pressure sensor (2), a second body (14) for mounting the thin film driver (3), and a connecting portion (15) connected between the first body (12) and the second body (14); The second body (14) is bent through the connecting portion (15) to be arranged opposite to the first body (12); The thin film pressure sensor (2) and the thin film driver (3) are respectively located on both sides of the first body (12) and the second body (14).

2. The vibration feedback module according to claim 1, characterized in that: The thin film pressure sensor (2) is a combination of one or more of a strain sensor, a piezoelectric film and a strain detection ink; the thin film driver (3) is a combination of one or more of a piezoelectric ceramic, an organic piezoelectric film, an electret diaphragm and a memory alloy with a driving function.

3. The vibration feedback module according to claim 1, characterized in that: It also includes a control unit electrically connected to the circuit board (1), and the control unit controls the vibration of the thin film driver (3) according to a pressure signal detected by the thin film pressure sensor (2) when the thin film driver (3) is not vibrating.

4. The vibration feedback module according to claim 3, characterized in that: The control unit comprises a pressure acquisition and signal processing module (5) connected to the thin film pressure sensor (2), a vibration driving module (50) connected to the thin film driver (3), a pressure detection and vibration switching switch (51) connected to both the pressure acquisition and signal processing module (5) and the vibration driving module (50), and a processor (52) connected to the pressure detection and vibration switching switch (51); the processor (52) controls the pressure acquisition and signal processing module (5) to be connected to the processor (52) or controls the vibration driving module (50) to be connected to the processor (52) or controls the pressure acquisition and signal processing module (5) and the vibration driving module (50) to be connected to the processor (52) at the same time through the pressure detection and vibration switching switch (51).

5. The vibration feedback module according to any one of claims 1 to 4, characterized in that: The first body (12) comprises a flexible layer (12a) and a reinforcing layer (12b) which are bonded to each other, the thin film pressure sensor (2) is bonded to the flexible layer (12a), the first body (12) comprises a main body (120) and a supporting foot (121) protruding from the main body (120), and the supporting foot (121) extends obliquely toward the side where the thin film pressure sensor (2) is located and away from the periphery of the main body (120).

6. The vibration feedback module according to claim 5, characterized in that: The reinforcing layer (12b) is a combination of one or more of a metal material reinforcing layer, an organic material reinforcing layer and a composite material reinforcing layer.

7. The vibration feedback module according to claim 5, characterized in that: The supporting foot (121) comprises a supporting surface (1212), and the distance between the supporting surface (1212) and a base surface (1213) of the first body (12) on which the thin film pressure sensor (2) is mounted is 0.03 to 1 mm.

8. The vibration feedback module according to any one of claims 1 to 4, characterized in that: The first body (12) and the second body (14) are connected via an adhesive layer (4).

9. A touch device, characterized in that: It comprises a vibration feedback module as described in any one of claims 1 to 8.

10. A touch device, characterized in that: include: Touchpad (6); a support plate (7); and, The vibration feedback module as claimed in claim 5, wherein the support foot (121) of the vibration feedback module is connected to the touch panel (6), and the thin film driver (3) of the vibration feedback module is connected to the support plate (7).

11. An electronic device, characterized in that: It comprises the vibration feedback module as claimed in any one of claims 1 to 8 or the touch control device as claimed in claim 9 or claim 10.

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