Circuit board, antenna package and display device

Abstract

The present invention provides a circuit board, an antenna package and a display device. According to one embodiment, the circuit board includes a core layer having a first area and a second area, and an antenna power supply wiring arranged on the core layer across the first area and the second area, wherein the antenna power supply wiring may include a first portion extending in a first direction in the first area, a second portion extending in a second direction in the first area, and a third portion extending in the first direction in the second area, and the interval between adjacent second portions of the antenna power supply wiring is less than 3 times the interval between adjacent third portions of the antenna power supply wiring.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Korean Patent Application No. 10-2020-0109675 filed on August 28, 2020, in the Korean Intellectual Property Office (KIPO), the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The invention relates to a circuit board, an antenna package and a display device. Background Art

[0004] Recently, with the development of information society, wireless communication technologies such as Wi-Fi, Bluetooth, etc. are implemented in the form of smart phones, for example, by combining with display devices. In this case, an antenna can be coupled to the display device to perform a communication function.

[0005] Recently, as mobile communication technology becomes more advanced, it is necessary to couple an antenna that performs communication in a high frequency or ultra-high frequency band corresponding to, for example, 3G to 5G to a display device.

[0006] In order to drive the antenna to radiate, a circuit board for supplying power, transmitting control signals, etc. may be connected to the antenna. For example, in order to connect with the antenna driving circuit, the circuit board may be bent, in which case damage to the circuit board wiring, failure of adhesion to the antenna due to bending stress, etc. may be caused.

[0007] Meanwhile, in recent years, the thickness of a display device coupled with an antenna has been reduced, and the area of ​​a frame portion of the display device has been reduced. Therefore, it is necessary to design a circuit board and an antenna package that can ensure the reliability of the bonding of the circuit board and the circuit connection, and enable the antenna to be coupled thereto even when the frame portion has a small area, while maintaining or improving the radiation characteristics of the antenna. Summary of the invention

[0008] An object of the present invention is to provide a circuit board, an antenna package, and a display device including the antenna package.

[0009] In order to achieve the above object, the present invention adopts the following technical solutions.

[0010] 1. A circuit board, comprising: a core layer having a first area and a second area; and an antenna power supply wiring, which is arranged on the core layer across the first area and the second area, wherein the antenna power supply wiring includes a first portion extending along a first direction in the first area, a second portion extending along a second direction in the first area, and a third portion extending along the first direction in the second area, and the interval between adjacent second portions of the antenna power supply wiring is less than 3 times the interval between adjacent third portions of the antenna power supply wiring.

[0011] 2. The circuit board according to 1 above, wherein the interval between the adjacent second portions of the antenna power supply wiring is 0.5 times or more the interval between the adjacent third portions of the antenna power supply wiring.

[0012] 3. The circuit board according to 1 above, wherein an interval between adjacent third portions of the antenna power supply wiring is 0.05 mm or more and 1 mm or less.

[0013] 4. The circuit board according to 1 above, wherein an interval between adjacent third portions of the antenna power supply wiring is 0.1 mm or more and 0.7 mm or less.

[0014] 5. The circuit board according to 1 above, wherein the first area includes an antenna area, the antenna pattern and the antenna power supply wiring are connected to the antenna area, and the second area includes an antenna driving unit area, the antenna driving unit and the antenna power supply wiring are connected to the antenna driving unit area.

[0015] 6. The circuit board according to 1 above, wherein the antenna power supply wirings are formed to have substantially the same length as each other.

[0016] 7. The circuit board according to 6 above, wherein the antenna power supply wiring is formed so that a gain deviation of an antenna pattern connected to the antenna power supply wiring is less than 1 dBi or a phase delay difference of the antenna power supply wiring is less than 10 degrees.

[0017] 8. An antenna package, comprising: the circuit board according to 1 above; and an antenna pattern connected to an antenna power supply wiring of the circuit board.

[0018] 9. A display device comprising the antenna package according to 8 above.

[0019] According to one embodiment, the circuit board may include a core layer having a first region and a second region and an antenna power supply wiring arranged on the core layer across the first region and the second region. In this case, the antenna power supply wiring may be formed so that the spacing in the first region in the first direction is less than a predetermined multiple of the spacing in the second region in the second direction.

[0020] Therefore, the independence of the electrical signal applied to each antenna pattern can be maintained to prevent signal interference between antenna power supply wirings, and the length of the first area of ​​the circuit board in the first direction can be reduced. Thus, even if the light shielding portion or the frame portion formed on the front of the display device has a small area, the antenna package including the circuit board can be easily coupled to the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and other objects, features and other advantages of the present invention will be more clearly understood from the following detailed description in conjunction with the accompanying drawings, in which:

[0022] Figure 1 is a schematic plan view showing an antenna package according to one embodiment;

[0023] Figure 2 is a schematic cross-sectional view showing an antenna package according to one embodiment;

[0024] Figure 3 is a schematic plan view showing an antenna package according to another embodiment; and

[0025] Figure 4 is a schematic plan view showing a display device according to an embodiment. DETAILED DESCRIPTION

[0026] Hereinafter, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, since the drawings attached to the present disclosure are only provided for the purpose of illustrating one of the preferred various embodiments of the present invention in order to easily understand the technical spirit of the present invention having the above-mentioned invention, it should not be interpreted as being limited to such description shown in the accompanying drawings.

[0027] It should be understood that, although the words first, second, etc. may be used herein to describe various elements or components, these elements or components should not be limited by these words. In the use herein, the singular forms "the" and "said" also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the words "including" and "comprising" indicate the presence of the listed features, integers, steps, operations, elements, components and / or combinations thereof when used herein, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0028] In addition, directional terms such as "one side", "the other side", "upper", "lower", "upper surface", "lower surface", "first direction", "second direction", etc. are used in relation to the orientation of the disclosed drawings. Since elements or components of embodiments of the present invention can be positioned in various orientations, these directional terms are used for illustrative purposes and are not intended to limit the present invention thereto.

[0029] Figure 1 is a schematic plan view showing an antenna package according to one embodiment, Figure 2 is a schematic cross-sectional view showing an antenna package according to one embodiment.

[0030] Reference Figure 1 and Figure 2 , an antenna package according to one embodiment may include an antenna element 100 and a circuit board 200 .

[0031] The antenna element 100 may include an antenna dielectric layer 110 and an antenna pattern 120 .

[0032] The antenna dielectric layer 110 may include an insulating material having a predetermined dielectric constant. According to one embodiment, the antenna dielectric layer 110 may include an inorganic insulating material such as glass, silicon oxide, silicon nitride, or metal oxide, or an organic insulating material such as epoxy resin, acrylic resin, or imide resin. The antenna dielectric layer 110 may be used as a thin film substrate of the antenna element 100 formed with the antenna pattern 120.

[0033] According to one embodiment, the antenna dielectric layer 110 may include polyester resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, polybutylene terephthalate, etc.; cellulose resins such as diacetyl cellulose, triacetyl cellulose, etc.; polycarbonate resins; acrylic resins such as polymethyl (meth)acrylate, polyethyl (meth)acrylate, etc.; styrene resins such as polystyrene, acrylonitrile-styrene copolymers, etc.; polyolefin resins such as polyethylene, polypropylene, cyclic polyolefins or polyolefins having a norbornene structure, ethylene-propylene copolymers, etc.; vinyl chloride resins; amide resins such as nylon, aromatic polyamide; imide resins; polyether sulfonic acid resins; sulfonic acid resins; polyether ether ketone resins; polyphenylene sulfide resins; vinyl alcohol resins; vinylidene chloride resins; vinyl butyral resins; allyl resins; polyoxymethylene resins; thermoplastic resins such as epoxy resins, etc. These compounds may be used alone or in combination of two or more. In addition, a transparent film made of a thermosetting resin or an ultraviolet curing resin such as (meth)acrylate, urethane, acrylic urethane, epoxy resin, silicone resin, etc. may be used as the antenna dielectric layer 110 .

[0034] According to one embodiment, the antenna dielectric layer 110 may include an adhesive film such as an optically clear adhesive (OCA), an optically clear resin (OCR), or the like.

[0035] According to one embodiment, the antenna dielectric layer 110 may be formed as substantially a single layer, or may be formed as a multi-layer structure of two or more layers.

[0036] The antenna dielectric layer 110 may generate capacitance or inductance, thereby adjusting the frequency band that the antenna element 100 can drive or sense. When the dielectric constant of the antenna dielectric layer 110 exceeds about 12, the driving frequency is excessively reduced, and the driving of the antenna at a desired high frequency band may not be achieved. Therefore, according to one embodiment, the dielectric constant of the antenna dielectric layer 110 may be adjusted to a range of about 1.5 to 12, and preferably about 2 to 12.

[0037] The antenna pattern 120 may be formed on an upper surface of the antenna dielectric layer 110. For example, a plurality of antenna patterns 120 may be linearly or non-linearly arranged on the upper surface of the antenna dielectric layer 110 to form an array antenna.

[0038] The antenna pattern 120 may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy including at least one thereof. They may be used alone or in combination of two or more. For example, the antenna pattern 120 may include silver (Ag) or a silver alloy (e.g., a silver-palladium-copper (APC) alloy) to achieve low resistance. As another example, considering low resistance and a fine line width pattern, the antenna pattern 120 may include copper (Cu) or a copper alloy (e.g., a copper-calcium (CuCa) alloy).

[0039] According to one embodiment, the antenna pattern 120 may include a transparent metal oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), zinc oxide (ZnOx), or copper oxide (CuO).

[0040] According to one embodiment, the antenna pattern 120 may include a laminated structure of a transparent conductive oxide layer and a metal layer, for example, a double-layer structure of a transparent conductive oxide layer-metal layer or a triple-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer. In this case, the metal layer can improve flexibility while reducing resistance to increase signal transmission speed, and the transparent conductive oxide layer can improve corrosion resistance and transparency.

[0041] According to an exemplary embodiment, the antenna pattern 120 may include a blackening treatment portion. Therefore, the reflectivity on the surface of the antenna pattern 120 may be reduced, thereby reducing the pattern from being seen due to light reflection.

[0042] According to one embodiment, the surface of the metal layer included in the antenna pattern 120 is converted into a metal oxide or a metal sulfide to form a black layer. According to one embodiment, a black layer, such as a black material coating or plating layer, may be formed on the antenna pattern 120 or the metal layer. Here, the black material coating or plating layer may include silicon, carbon, copper, molybdenum, tin, chromium, nickel, cobalt, or oxides, sulfides, or alloys containing at least one of them.

[0043] The composition and thickness of the blackened layer may be adjusted in consideration of the effect of reducing the reflectivity.

[0044] The antenna pattern 120 may include a radiator 122 and a transmission line 124 .

[0045] The radiator 122 may be formed in a mesh structure, thereby increasing the light transmittance of the radiator 122 and improving the flexibility of the antenna element 100. Therefore, the antenna element 100 may be effectively applied to a flexible display device.

[0046] The size of the radiator 122 may be determined according to the desired resonant frequency, radiation resistance, and gain. For example, the antenna pattern 120 or the radiator 122 may be implemented to transmit and receive signals in a resonant frequency band capable of performing high frequency or ultra-high frequency (e.g., 3G, 4G, 5G or higher) mobile communications, Wi-Fi, Bluetooth, near field communication (NFC), global positioning system (GPS), etc.

[0047] like Figure 1 As shown, the radiator 122 may be implemented in a rectangular shape. However, this is merely an example, and there is no particular limitation on the shape of the radiator 122. That is, the radiator 122 may be implemented in various shapes, such as a rhombus, a circle, and the like.

[0048] The transmission line 124 may be formed by extending from the radiator 122 .

[0049] According to one embodiment, the transmission line 124 may be formed as a substantially single member by being integrally connected with the radiator 122 , or may be formed as a separate member from the radiator 122 .

[0050] According to one embodiment, the transmission line 124 may be formed into a mesh structure having substantially the same shape as the radiator 122 (eg, having the same line width, the same interval, etc.), but is not limited thereto and may be formed into a mesh structure having a substantially different shape from the radiator 122.

[0051] The antenna pattern 120 may further include a signal pad 126 .

[0052] The signal pad 126 may be connected to an end of the transmission line 124 to be electrically connected to the radiator 122 through the transmission line 124. According to one embodiment, the signal pad 126 may be integrally connected with the transmission line 124 to form a substantially single member, or may be formed as a member separate from the transmission line 124. For example, the signal pad 126 may be formed as a member substantially integral with the transmission line 124, and the end of the transmission line 124 may be provided as the signal pad 126.

[0053] According to one embodiment, the ground pad 128 may be disposed around the signal pad 126. For example, a pair of ground pads 128 may be disposed to face each other with the signal pad 126 interposed therebetween. The ground pad 128 may be disposed around the signal pad 126 to be electrically and physically separated from the signal pad 126 and the transmission line 124.

[0054] According to one embodiment, the signal pad 126 and the ground pad 128 may be formed as a solid structure made of the above-mentioned metal or alloy in consideration of reducing power supply resistance and noise absorption efficiency.

[0055] Meanwhile, according to one embodiment, a dummy pattern (not shown) may be formed around the radiator 122 and the transmission line 124. The dummy pattern may include the same metal as the radiator 122 and / or the transmission line 124, and may be formed into a mesh structure having the same or different shape as the radiator 122 and / or the transmission line 124.

[0056] In addition, according to one embodiment, the antenna element 100 may further include an antenna ground layer 130 formed on the lower surface of the antenna dielectric layer 110. The antenna ground layer 130 may include the above-mentioned metal or alloy. Since the antenna element 100 includes the antenna ground layer 130, a vertical radiation characteristic may be achieved.

[0057] The antenna ground layer 130 may at least partially overlap the antenna pattern 120. For example, the antenna ground layer 130 may completely overlap the radiator 122, but may not overlap the transmission line 124, the signal pad 126, and the ground pad 128. As another example, the antenna ground layer 130 may completely overlap the radiator 122 and the transmission line 124, but may not overlap the signal pad 126 and the ground pad 128. Furthermore, as another example, the antenna ground layer 130 may completely overlap the radiator 122, the transmission line 124, the signal pad 126, and the ground pad 128.

[0058] According to one embodiment, a conductive member of a display device or a display panel mounted with an antenna package may be provided as the antenna ground layer 130. For example, the conductive member may include electrodes or wirings, such as a gate electrode, a source / drain electrode, a pixel electrode, a common electrode, a data line, a scan line, etc. of a thin film transistor (TFT) included in the display panel, and a stainless steel (SUS) plate, a heat sink, a digitizer, an electromagnetic shielding layer, a pressure sensor, a fingerprint sensor, etc. of the display device.

[0059] The circuit board 200 may include a core layer 210 and an antenna power supply wiring 220. According to one embodiment, the circuit board 200 may be a flexible printed circuit board (FPCB).

[0060] The core layer 210 may include, for example, a flexible resin such as polyimide resin, modified polyimide (MPI), epoxy resin, polyester, cycloolefin polymer (COP), liquid crystal polymer (LCP), etc. The core layer 210 may include an internal insulating layer included in the circuit board 200 .

[0061] The core layer 210 may include a first region 210a and a second region 210b. The first region 210a may include an antenna region 211 connected to the antenna element 100, and the second region 210b may include an antenna driving unit region 212 connected to the antenna driving unit 300. The pads 126 and 128 of the antenna element 100 are adhered to the core layer 210 through the antenna region 211, so that the antenna pattern 120 can be connected to the antenna power supply wiring 220. In addition, as Figure 1 As shown, the antenna driving unit 300 is mounted on the core layer 210 through the antenna driving unit region 212, so that the antenna driving unit 300 can be connected to the antenna power supply wiring 220. Thus, power and driving signals can be applied to the antenna pattern 120 through the antenna driving unit 300 via the antenna power supply wiring 220. At the same time, according to one embodiment, Figure 1 Differently, a connector for connecting the circuit board 200 and another circuit board on which the antenna driving unit is mounted can be installed in the antenna driving unit area 212. In this case, the antenna power supply wiring 220 and the antenna driving unit mounted on another circuit board can be connected by the connector. In addition, according to one embodiment, the antenna driving unit area 212 can be formed in a form that can be fastened to a connector of another circuit board on which the antenna driving unit is mounted without installing the antenna driving unit 300 and the connector (for example, a flexible flat cable (FFC) or an FFC connector (for example, a zero insertion force (ZIF) type and a non-ZIF type connector)).

[0062] According to one embodiment, the first region 210a and the second region 210b may have different widths from each other. For example, the first region 210a may have a relatively larger width than the second region 210b, so that sufficient bonding stability for the antenna element 100 can be ensured by the first region 210a having a relatively larger width. In addition, the flexibility and circuit connection characteristics of the antenna package can be improved by the second region 210b having a relatively smaller width. For example, the circuit board 200 can be folded at the boundary portion between the first region 210a and the second region 210b, so that the antenna element 100 and the first region 210a can be set in the front of the display device, and the antenna drive unit 300 and the second region 210b can be set on the side or rear of the display device.

[0063] The antenna power supply wiring 220 may be disposed on one surface of the core layer 210. For example, the circuit board 200 may further include a coating formed on one surface of the core layer 210 for covering the antenna power supply wiring 220. In this case, by cutting or removing part of the coating of the circuit board 200, one end of each antenna power supply wiring 220 may be exposed, and the exposed one end of each antenna power supply wiring 220 may be adhered to the signal pad 126. More specifically, a conductive relay structure 150 such as an anisotropic conductive film (ACF) is attached to the signal pad 126 and the ground pad 128, and then the exposed one end of each antenna power supply wiring 220 may be disposed on the conductive relay structure 150. Thereafter, the antenna region 211 of the circuit board 200 may be attached to the antenna element 100 by a heat treatment / pressing process, and each antenna power supply wiring 220 may be electrically connected to each signal pad 126. In addition, since the ground pad 128 is disposed around the signal pad 126, adhesion with the anisotropic conductive film (ACF) may be increased, and thus bonding stability may be improved.

[0064] The antenna power supply wiring 220 may be individually and independently connected to each antenna pattern 120. Thus, power supply / drive control may be independently performed for each antenna pattern 120. For example, a different phase signal may be applied to each antenna pattern 120 through the antenna power supply wiring 220 connected to the antenna pattern 120, respectively.

[0065] The antenna power supply wiring 220 may be formed across the first region 210 a and the second region 210 b. For example, the antenna power supply wiring 220 may be formed by extending from the antenna region 211 toward the antenna driving unit region 212.

[0066] The antenna power supply wiring 220 may be formed to have substantially the same length as each other. The substantially same length here may include not only the case where the lengths are exactly the same as each other, but also the case where the lengths are not exactly the same as each other due to problems in processing but satisfy predetermined conditions. In this case, the predetermined condition may include a condition that the gain deviation of the antenna pattern 120 connected to the antenna power supply wiring 220 is less than 1 dBi and / or a condition that the phase delay difference of the antenna power supply wiring 220 is less than 10 degrees.

[0067] The antenna power supply wiring 220 may be bent once or multiple times in the first region 210a. Thus, the antenna power supply wiring 220 having substantially the same length may be provided in a limited area. For example, the antenna power supply wiring 220 may include a first direction (e.g., Figure 1 The one or more first portions 220a extending in the first region 210a along the second direction (eg, Figure 1 The one or more second portions 220b extending in the first direction (eg, the x direction in the middle) and the one or more second portions 220b extending in the second region 210b along the first direction (eg, Figure 1 One or more third portions 220c extending in the y direction (in the y direction).

[0068] According to one embodiment, the interval a between adjacent second portions 220b of the antenna power supply wiring 220 is greater than 0.5 times and less than 3 times the interval b between adjacent third portions 220c of the antenna power supply wiring 220. In this case, the interval b between adjacent third portions 220c of the antenna power supply wiring 220 may be greater than 0.05 mm and less than 1 mm, preferably greater than 0.1 mm and less than 0.7 mm. By forming the interval a between adjacent second portions 220b of the antenna power supply wiring 220 to be greater than 0.5 times and less than 3 times the interval b between adjacent third portions 220c of the antenna power supply wiring 220, the independence of the electrical signal applied to each antenna pattern 120 can be maintained, thereby preventing signal interference between the antenna power supply wirings 220, and the first region 210a in the first direction (for example, Figure 1 Thus, even if the light shielding portion or frame portion formed on the front of the display device has a small area, the first region 210a can be disposed on the light shielding portion or frame portion of the display device.

[0069] According to one embodiment, a ground layer 230 may be disposed on the other surface of the core layer 210 .

[0070] The ground layer 230 may overlap the antenna power supply wiring 220. Noise and signal interference around the antenna power supply wiring 220 may be absorbed or shielded by the ground layer 230. In addition, the ground layer 230 may help generate an electric field through the antenna power supply wiring 220, thereby improving signal transmission efficiency.

[0071] Meanwhile, according to one embodiment, the antenna power supply wiring 220 and the ground layer 230 may include the above-mentioned metal or alloy.

[0072] Figure 3 is a schematic plan view showing an antenna package according to another embodiment. Figure 3 , the circuit board 200 may include a bonding pad 225 formed around the antenna power supply wiring 220. The bonding pad 225 may be included in the antenna region 211 of the circuit board 200.

[0073] The bonding pad 225 may be formed on one surface of the core layer 210 together with the antenna power supply wiring 220. For example, a pair of bonding pads 225 may be provided with one antenna power supply wiring 220 interposed therebetween.

[0074] The bonding pad 225 is electrically and physically separated from the antenna power supply wiring 220 and can be connected to the antenna power supply wiring 220 by the conductive relay structure 150 (see Figure 2 ) is adhered to the ground pad 128 of the antenna element 100. Since the bonding pad 225 is included in the antenna region 211 of the circuit board 200, the bonding stability between the antenna element 100 and the circuit board 200 can be further improved.

[0075] Figure 4 is a schematic plan view showing a display device according to one embodiment. More specifically, Figure 4 is a view showing the front or window surface of the display device.

[0076] Reference Figure 4 , the display device 400 may include a display area 410 and a peripheral area 420 formed at the front thereof. The display area 410 may refer to an area where visual information is displayed, and the peripheral area 420 may refer to an opaque area provided on both sides and / or both ends of the display area 410. For example, the peripheral area 420 may correspond to a light shielding portion or a frame portion of the display device 400.

[0077] The antenna element 100 may be disposed toward the front of the display device 400 , for example, on the display panel. In one embodiment, the radiator 122 and / or the transmission line 124 may at least partially overlap with the display area 410 .

[0078] In this case, the radiator 122 and / or the transmission line 124 may be formed in a mesh structure, and a reduction in transmittance due to the radiator 122 and / or the transmission line 124 may be prevented.

[0079] The circuit board 200 may be disposed in the peripheral area 420 to prevent deterioration of image quality in the display area 410. According to one embodiment, the circuit board 200 may be folded at a boundary portion between the first area 210a and the second area 210b so that the first area 210a is disposed in the peripheral area 420 of the display device, and the antenna driving unit 300 and the second area 210b may be disposed at the side or rear of the display device.

[0080] As described above, by forming the interval of the antenna power supply wiring 220 in the first region 210a along the first direction to be lower than the predetermined multiple of the interval thereof in the second region 210b along the second direction, signal interference between the antenna power supply wirings 220 can be prevented and the length of the first region 210a in the first direction can be reduced by maintaining the independence of the electrical signal applied to each antenna pattern 120. Thus, even if the light shielding portion or the frame portion formed on the front of the display device has a small area, the first region 210a can be disposed on the light shielding portion or the frame portion of the display device.

[0081] The present invention has been described with reference to the above preferred embodiments, and those skilled in the art will appreciate that various modifications can be made without departing from the essential features of the present invention. Therefore, it should be understood that the scope of the present invention is not limited to the above embodiments, and other various embodiments within the scope equivalent to the contents recorded in the claims are also included in the present invention.

[0082] [Experimental Example: Evaluation of the Signal Transmission Rate of the Antenna Feeding Wiring Based on the Ratio of the Interval a Between the Adjacent Second Portions of the Antenna Feeding Wiring to the Interval b Between the Adjacent Third Portions of the Antenna Feeding Wiring]

[0083] Formed with Figure 1 The antenna package of the same shape as shown. As listed in Table 1 below, the signal transmission rate of the antenna power supply wiring 220 was evaluated by changing the ratio of the interval a between the adjacent second portions 220b of the antenna power supply wiring 220 to the interval b between the adjacent third portions 220c of the antenna power supply wiring 220.

[0084] Table 1

[0085]

[0086] Referring to Table 1, it can be confirmed that, unlike the comparison example in which the ratio of the interval a between adjacent second parts 220b of the antenna power supply wiring 220 to the interval b between adjacent third parts 220c of the antenna power supply wiring 220 is 0.2 and 3.5, in the case of the embodiment in which the ratio is 0.5 to 3, the signal transmission rate in the antenna power supply wiring is excellent.

Claims

1. A circuit board, characterized in that: It includes: a core layer having a first region and a second region; as well as an antenna power supply wiring, which is arranged on the core layer across the first area and the second area, wherein the antenna power supply wiring includes a first portion extending along a first direction in the first region, a second portion extending along a second direction in the first region, and a third portion extending along the first direction in the second region, and An interval between the adjacent second portions of the antenna feeding wiring is 0.5 times or more and 3 times or less of an interval between the adjacent third portions of the antenna feeding wiring.

2. The circuit board according to claim 1, characterized in that: The interval between the adjacent third portions of the antenna power supply wiring is greater than or equal to 0.05 mm and less than or equal to 1 mm.

3. The circuit board according to claim 1, characterized in that: The interval between the adjacent third portions of the antenna power supply wiring is greater than or equal to 0.1 mm and less than or equal to 0.7 mm.

4. The circuit board according to claim 1, characterized in that: The first region includes an antenna region, an antenna pattern and the antenna power supply wiring are connected to the antenna region, and The second area includes an antenna driving unit area, and the antenna driving unit and the antenna power supply wiring are connected to the antenna driving unit area.

5. The circuit board according to claim 1, characterized in that: The antenna power supply wirings are formed to have the same length as each other.

6. The circuit board according to claim 5, characterized in that: The antenna feeding wiring is formed so that a gain deviation of an antenna pattern connected to the antenna feeding wiring is less than 1 dBi or a phase delay difference of the antenna feeding wiring is less than 10 degrees.

7. An antenna package, characterized in that: It includes: The circuit board according to claim 1; as well as An antenna pattern connected to the antenna power supply wiring of the circuit board.

8. A display device, characterized in that: It comprises the antenna package according to claim 7.

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