Resolution measuring device

Abstract

A resolution measurement apparatus is provided that includes a table configured to receive a display module including an optical component. The table includes an opening that overlaps the optical component when viewed in plan view when the display module is disposed on the table. The resolution measurement apparatus also includes a plurality of cameras disposed above the table, a light source disposed below the table and overlapping the opening when viewed in plan view, and a lens disposed between the light source and the table. The lens overlaps the opening when viewed in plan view, and the optical component overlaps the lens when viewed in plan view when the display module is disposed on the table.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2020-0111939, filed on September 2, 2020, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] Embodiments of the present invention relate to a resolution measuring device and a method for measuring resolution using the resolution measuring device. Background Technology

[0003] Electronic devices that provide images to users (such as smartphones, digital cameras, laptops, navigation devices, and smart TVs) may include display devices. Display devices can generate images and provide them to users via a screen.

[0004] Such a display device may include a display panel, which includes a plurality of pixels for generating images, driving components for driving the pixels, and functional elements for providing various functions to the user. The functional elements may include, for example, speakers, cameras, sensors, etc. Multiple holes may be defined in such a display device, and the functional elements may be disposed within the holes. Summary of the Invention

[0005] Embodiments of the present invention provide a resolution measuring device for measuring the resolution of an optical component of a display module, and a method for measuring the resolution of an optical component using the resolution measuring device.

[0006] According to an embodiment of the inventive concept, the resolution measuring device includes a stage configured to accommodate a display module including optical components. The stage includes an opening that, when the display module is mounted on the stage, overlaps with the optical components in a plan view. The measuring device also includes a plurality of cameras disposed above the stage and a light source disposed below the stage. When viewed in a plan view, the light source overlaps with the opening. The resolution measuring device also includes a lens disposed between the light source and the stage. When viewed in a plan view, the lens overlaps with the opening. When the display module is mounted on the stage, the optical components overlap with the lens in a plan view.

[0007] According to an embodiment of the inventive concept, the resolution measurement method includes placing a display module on a stage. When viewed in a plan view, the optical components of the display module are superimposed on an opening in the stage. The method further includes the steps of: superimposing the optical components with a lens disposed below the stage; generating light from a light source disposed below the lens; providing light to a plurality of cameras disposed above the stage through the lens and the optical components; and measuring the resolution of the optical components using information captured by the cameras. Attached Figure Description

[0008] The above and other features of the present invention will become more apparent from the detailed description of embodiments of the invention with reference to the accompanying drawings.

[0009] Figure 1 It is a perspective view of a resolution measuring device according to an embodiment of the inventive concept.

[0010] Figure 2 It is used to illustrate embodiments according to the inventive concept. Figure 1 The image shows a cross-sectional view of the resolution measuring device.

[0011] Figure 3 According to the embodiments of the inventive concept, it can be set Figure 2 The diagram shows a plan view of the display module in the recess of the platform.

[0012] Figure 4 Embodiments based on the inventive concept Figure 3 The image shows a cross-sectional view of the display module.

[0013] Figure 5 This illustrates an embodiment based on the inventive concept. Figure 4 The image shows a cross-sectional view of the display panel.

[0014] Figure 6 This illustrates an embodiment based on the inventive concept. Figure 3 A view of a portion of the optical components shown in the image.

[0015] Figure 7 This illustrates an embodiment of the inventive concept. Figure 3 The image shows a cross-sectional view of any pixel in the display area.

[0016] Figure 8 This is an exemplary illustration of an embodiment according to the inventive concept. Figure 6 A view of the cross-section of any of the transmission regions of the optical components shown, and the pixels arranged together with the transmission regions between the pixels.

[0017] Figures 9 to 11 It is used to describe embodiments for use according to the inventive concept. Figure 1 The image shows a view of the operation of a resolution measuring device that measures the resolution of an optical component. Detailed Implementation

[0018] Embodiments of the inventive concept will be described more fully below with reference to the accompanying drawings. Throughout the drawings, the same reference numerals may refer to the same elements.

[0019] In this specification, it will be understood that when an element (or region, layer, portion, etc.) is referred to as being "on," "connected to," or "bonded to" another element or layer, the element (or region, layer, portion, etc.) may be directly on, directly connected to, or bonded to the other element or layer, or a third intermediate element may exist between them. Other terms used to describe relationships between elements (e.g., "between," "adjacent to," etc.) should be interpreted in a similar manner.

[0020] The term “and / or” includes all of one or more combinations defined by the related items.

[0021] Although terms such as “first” and “second” may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of the inventive concept, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component. Unless clearly defined otherwise in the context, the singular form may include the plural form.

[0022] Additionally, terms such as "below," "under," "on," and "above" can be used to describe the relationships between the elements shown in the accompanying drawings. These terms are relative and are described relative to the directions shown in the drawings.

[0023] It should also be understood that, when used in this specification, the terms “comprising” or “having” indicate the presence of the stated features, figures, steps, operations, elements, components or combinations thereof, but do not exclude the presence or addition of one or more other features, figures, steps, operations, elements, components and / or combinations thereof.

[0024] Figure 1 It is a perspective view of a resolution measuring device according to an embodiment of the inventive concept.

[0025] Reference Figure 1 In this embodiment, the resolution measurement device RMA includes a STG, a first support component SUP1, a second support component SUP2, a third support component SUP3, a lens housing LHS, multiple cameras CAM, a first motion component MOV1, and a second motion component MOV2.

[0026] The STG may have a plane defined by a first direction DR1 and a second direction DR2 intersecting the first direction DR1. In the following description, the direction intersecting the plane defined by the first direction DR1 and the second direction DR2 in a substantially perpendicular manner (e.g., precisely perpendicular or approximately perpendicular within measurement error, as will be understood by those skilled in the art) is defined as the third direction DR3. In this specification, "when viewed in a plan view" may refer to viewing on the third direction DR3.

[0027] A recess (also called a recessed seat) RES can be defined in the upper surface of the stage STG. The recess RES can be formed such that the upper surface of the stage STG is recessed to a predetermined depth toward the lower surface of the stage STG. An opening OP can be defined in the stage STG. When viewed in a plan view, the opening OP can be disposed in the recess RES and superimposed on the recess RES.

[0028] The first support member SUP1 can be disposed below the STG platform. The first support member SUP1 can support the STG platform. When viewed in a plan view, the edge of the first support member SUP1 can overlap with the edge of the STG platform. However, embodiments of the inventive concept are not limited thereto. For example, according to an embodiment, the edge of the first support member SUP1 can be disposed outside the edge of the STG platform.

[0029] The second support member SUP2 can be disposed below the first support member SUP1. The second support member SUP2 can support the first support member SUP1. When viewed in plan view, the second support member SUP2 can have a larger area than the first support member SUP1. In addition, when viewed in plan view, the edge of the second support member SUP2 can be disposed outside the first support member SUP1.

[0030] The third support member SUP3 can be disposed below the second support member SUP2. The third support member SUP3 can support the second support member SUP2. When viewed in a plan view, the third support member SUP3 can have a smaller area than the second support member SUP2.

[0031] The lens housing LHS, extending from the third support member SUP3, can be positioned below the third support member SUP3. The lens and light source can be housed within the lens housing LHS. (Refer to...) Figure 2 Describe the lens and light source in detail. The lens housing LHS may have a cylindrical shape extending in the third direction DR3.

[0032] The camera housing CHS can be positioned above the stage STG. The camera housing CHS can have a fan-shaped form extending between its lower and upper portions. Therefore, the upper surface of the camera housing CHS can have an upwardly convex curved surface. That is, the upper surface of the camera housing CHS can convex in a third direction DR3.

[0033] The camera CAM can be mounted above the STG. The camera CAM can be mounted along the upper surface of the camera housing CHS and housed within the camera housing CHS.

[0034] The first moving part MOV1 and the second moving part MOV2 can move the STG in the first direction DR1 and the second direction DR2. For example, the first moving part MOV1 can extend in the second direction DR2 and can be connected to the side surface of the second support part SUP2, which extends in the second direction DR2. The second moving part MOV2 can extend in the first direction DR1 and can be connected to the lower portion of the side surface of the second support part SUP2, which extends in the first direction DR1.

[0035] The first moving part MOV1 can move in the second direction DR2, and the second moving part MOV2 can move in the first direction DR1. Based on the movement of the first moving part MOV1, the first support part SUP1, the second support part SUP2, the third support part SUP3, and the stage STG can move in the second direction DR2. Based on the movement of the second moving part MOV2, the first support part SUP1, the second support part SUP2, the third support part SUP3, and the stage STG can move in the first direction DR1.

[0036] In this embodiment, the first moving part MOV1 and the second moving part MOV2 can be moved by a motor. For example, in this embodiment, the first moving part MOV1 and the second moving part MOV2 can be motorized.

[0037] Figure 2 This illustrates an embodiment based on the inventive concept. Figure 1 The image shows a cross-sectional view of the resolution measuring device.

[0038] Figure 2 A cross-section of the resolution measuring device is shown when viewed in the first direction DR1.

[0039] Reference Figure 2 The recess RES and opening OP can be defined within the stage STG. The display module can be housed within the recess RES. (See reference...) Figure 9 Describe in detail the STG platform equipped with a display module.

[0040] The first support member SUP1 can be disposed below the stage STG along the edge of the stage STG. The first opening OP1 can be defined within the first support member SUP1. When viewed in plan view, the first opening OP1 can overlap with the groove RES. When viewed in plan view, the first opening OP1 can have an area larger than that of the groove RES.

[0041] The second opening OP2 can be defined within the second support member SUP2 located below the first support member SUP1. When viewed in plan view, the second opening OP2 can overlap with the groove RES. When viewed in plan view, the second opening OP2 can have an area larger than the area of ​​the groove RES.

[0042] The third opening OP3 can be defined within the third support member SUP3 located below the second support member SUP2. When viewed in plan view, the third opening OP3 can overlap with the groove RES. When viewed in plan view, the third opening OP3 can have an area larger than the area of ​​the groove RES.

[0043] A resolution measuring device (RMA) may include a lens (LN) and a light source (LTS) housed within a lens housing (LHS). The lens (LN) may be defined as an imaging lens. The light source (LTS) generates light.

[0044] The lens housing LHS can be disposed below the stage STG. When viewed in a plan view, the lens housing LHS can be stacked with the first support member SUP1, the second support member SUP2, and the third support member SUP3. The lens housing LHS can be disposed within the first opening OP1, the second opening OP2, and the third opening OP3.

[0045] The lens LN and the light source LTS can be positioned below the stage STG. The lens LN can be positioned between the light source LTS and the stage STG. The lens LN can be positioned on the upper end of the lens housing LHS. The opening L-OP where the lens LN is located can be defined within the upper end of the lens housing LHS. The lens LN can be positioned within the opening L-OP and fixed to the upper end of the lens housing LHS.

[0046] The light source LTS can be housed inside the lens housing LHS. The light source LTS can be housed inside the lens LN. The light source support component LSP that supports the light source LTS can be housed inside the lens housing LHS.

[0047] The camera housing CHS can have a fan-shaped shape and be positioned above the stage STG. The upper surface US of the camera housing CHS can have a fan-shaped curved surface. The lower surface of the camera housing CHS can be defined as the lower end of the camera housing CHS and open towards the stage STG. That is, the opening H-OP can be defined in the lower surface LS of the camera housing CHS.

[0048] The camera CAM can be positioned along the upper surface US of the camera housing CHS and housed within the camera housing CHS. For example, the upper portion of the camera CAM can be attached to the upper surface US of the camera housing CHS, while the other portions of the camera CAM can be housed within the camera housing CHS.

[0049] When viewed in a plan view, the lens LN can be superimposed on the lower surface LS of the camera housing CHS. For example, when viewed in a plan view, the lens LN can be superimposed on the opening H-OP defined in the lower surface LS of the camera housing CHS.

[0050] In an embodiment, the lower portion of the camera CAM can be configured to face the lower surface LS of the camera housing CHS. For example, the lower portion of the camera CAM can be configured to face the opening H-OP. Therefore, the lens of the camera CAM located in the lower portion of the camera CAM can be configured to face the opening H-OP. For example, the lens of the camera CAM can face the opening H-OP and can face the display module DM (see...). Figure 3 Optical components of OPP (see) Figure 3 This will be described further below.

[0051] Figure 3 According to the embodiments of the inventive concept, it can be set Figure 2 The diagram shows a plan view of the display module in the recess of the platform.

[0052] Reference Figure 3 The display module DM may include a display panel DP, a scan driver SDV, a data driver DDV, and a transmit driver EDV. The display panel DP may have a rectangular shape having a long side extending in a first direction DR1 and a short side extending in a second direction DR2. However, the shape of the display panel DP is not limited to this.

[0053] The display panel DP may include multiple optical components OPP, a display area DA surrounding each of the optical components OPP, and a non-display area NDA surrounding the display area DA. Although in Figure 3The display panel DP is shown as including two optical components OPP, but embodiments of the inventive concept are not limited thereto. For example, according to an embodiment, the display panel DP may include one optical component OPP, or it may include more than two optical components OPP. The display area DA may surround each of the optical components OPP. For example, each of the optical components OPP may be completely surrounded by the display area DA. The non-display area NDA may surround the display area DA. For example, the display area DA may be completely surrounded by the non-display area NDA.

[0054] For example, optical components (OPPs) can all have a circular shape. However, the shape of optical components is not limited to this. Functional elements can be disposed below the optical component (OPP). (See reference...) Figure 4 The functional elements are described in detail. In an embodiment, the optical component OPP is adjacent to the upper and right sides of the display area DA. However, the placement of the optical component OPP is not limited to this. In an embodiment, two optical components OPP are included. However, the number of optical components OPP is not limited to this.

[0055] The display panel DP may include multiple pixels PX, multiple scan lines SL, multiple data lines DL, multiple emitter lines EL, first control line CSL1 and second control line CSL2, first power line PL1 and second power line PL2, connection line CNL, and multiple pads (or solder pads) PD.

[0056] Pixels (PX) can be located in the display area (DA). Scan driver (SDV) and transmit driver (EDV) can be located in the non-display area (NDA) adjacent to the corresponding long side of the display panel (DP). Data driver (DDV) can be located in the non-display area (NDA) adjacent to any of the short sides of the display panel (DP). When viewed in a plan view, the data driver (DDV) can be adjacent to the bottom edge of the display panel (DP). The data driver (DDV) can be manufactured as an integrated circuit chip and mounted on the display panel (DP).

[0057] The scan line SL can extend in the second direction DR2 and connect to the pixel PX and the scan driver SDV. The data line DL can extend in the first direction DR1 and connect to the pixel PX and the data driver DDV. The transmit line EL can extend in the second direction DR2 and connect to the pixel PX and the transmit driver EDV.

[0058] The first power line PL1 may extend along the first direction DR1 and be disposed in the non-display area NDA. The first power line PL1 may be disposed between the display area DA and the transmit driver EDV. However, embodiments of the inventive concept are not limited thereto. For example, according to an embodiment, the first power line PL1 may be disposed between the display area DA and the scan driver SDV.

[0059] The connecting line CNL can extend along the second direction DR2, be arranged along the first direction DR1, and connect to the first power line PL1 and the pixel PX. A first voltage can be applied to the pixel PX through the first power line PL1 and the connecting line CNL connected to each other.

[0060] The second power line PL2 can be located in the non-display area NDA. The second power line PL2 can extend along the long side of the display panel DP and along another short side of the display panel DP, where the data driver DDV is not located. The second power line PL2 can be positioned closer to the outer edge than the scan driver SDV and the transmit driver EDV.

[0061] The second power line PL2 can extend toward the lower end of the display panel DP and connect to the pixel PX. A second voltage with a lower level than the first voltage can be applied to the pixel PX through the second power line PL2.

[0062] The first control line CSL1 can be connected to the scan driver SDV and extend towards the bottom of the display panel DP. The second control line CSL2 can be connected to the transmit driver EDV and extend towards the bottom of the display panel DP. The data driver DDV can be located between the first control line CSL1 and the second control line CSL2.

[0063] The pad PD can be placed on the display panel DP and can be adjacent to the lower end of the display panel DP. The data driver DDV, the first power line PL1, the second power line PL2, the first control line CSL1, and the second control line CSL2 can be connected to the pad PD. The data line DL can be connected to the data driver DDV, and the data driver DDV can be connected to the pad PD corresponding to the data line DL.

[0064] In this embodiment, the pad PD can be connected to a printed circuit board. Additionally, a timing controller for controlling the operation of the scan driver SDV, data driver DDV, and transmit driver EDV, as well as a voltage generation component for generating a first voltage and a second voltage, can be disposed on the printed circuit board. The timing controller and voltage generation component can be connected to the pad PD via the printed circuit board.

[0065] The scan driver (SDV) generates multiple scan signals, which are applied to pixel PX via scan line (SL). The data driver (DDV) generates multiple data voltages, which are applied to pixel PX via data line (DL). The emitter driver (EDV) generates multiple emission signals, which are applied to pixel PX via emitter line (EL).

[0066] Pixel PX can receive data voltage in response to receiving a scan signal. Pixel PX can also emit light with a brightness corresponding to the data voltage in response to receiving a light emission signal. The emission time of pixel PX can be controlled by the light emission signal.

[0067] Figure 4 Embodiments based on the inventive concept Figure 3 The image shows a cross-sectional view of the display module.

[0068] Figure 4 A cross-section of a display module DM according to an embodiment of the inventive concept is shown when viewed in the first direction DR1.

[0069] Reference Figure 4 The display module DM may include a display panel DP, an input sensing component ISP, an anti-reflection layer RPL, a window WIN, a cover layer CVL, a first adhesive layer AL1, a second adhesive layer AL2, and a third adhesive layer AL3, as well as functional elements FE. As described above, the display panel DP may include an optical component OPP, a display area DA around each of the optical components OPP, and a non-display area NDA around the display area DA.

[0070] The display panel DP can be a flexible display panel. According to embodiments of the inventive concept, the display panel DP can be, for example, a light-emitting display panel. However, embodiments of the inventive concept are not limited thereto. For example, according to embodiments, the display panel DP can be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of an organic light-emitting display panel can include organic light-emitting materials. The light-emitting layer of a quantum dot light-emitting display panel can include, for example, quantum dots, quantum rods, etc. Hereinafter, the display panel DP will be described as an organic light-emitting display panel. However, the display panel DP is not limited thereto.

[0071] An input sensing component (ISP) can be disposed on a display panel (DP). The ISP may include multiple sensor components for sensing external input. The sensor components may sense external input using, for example, electrostatic capacitance methods. When manufacturing the display panel (DP), the ISP may be directly fabricated on the DP. However, embodiments of the inventive concept are not limited thereto. For example, according to an embodiment, the ISP may also be fabricated as a separate panel and attached to the display panel (DP).

[0072] The anti-reflection layer RPL can be, for example, an external light reflection anti-reflection film. The anti-reflection layer RPL can reduce the reflectivity of external light incident on the display panel DP from above the display module DM.

[0073] When external light propagating toward the display panel (DP) is reflected by the display panel (DP) and then provided to an external user, a mirroring effect may occur due to the external light. To prevent or reduce this phenomenon, the anti-reflection layer (RPL) may include, for example, multiple color filters that display the same colors as the pixels.

[0074] A color filter can filter external light to the same color as a pixel. In this case, the external light may be invisible to the user. However, embodiments of the inventive concept are not limited to using color filters to reduce the reflectivity of external light. For example, according to an embodiment, the anti-reflection layer RPL may include a retarder and / or a polarizer to reduce the reflectivity of external light.

[0075] The window (WIN) can be placed on the anti-reflection layer (RPL). The window protects the display panel (DP), input sensing components (ISP), and the anti-reflection layer (RPL) from external scratches, vibrations, impacts, etc. The window can also be optically transparent.

[0076] A cover layer CVL can be disposed beneath the display panel DP. The cover layer CVL can absorb external impacts applied to the lower portion of the display panel DP, thus protecting the display panel DP. The cover layer CVL may include, for example, a padding layer, which may include, for example, a foam sheet with predetermined elasticity.

[0077] The first adhesive layer AL1 can be disposed between the display panel DP and the cover layer CVL. The display panel DP and the cover layer CVL can be attached to each other through the first adhesive layer AL1. The second adhesive layer AL2 can be disposed between the anti-reflection layer RPL and the input sensing component ISP. The anti-reflection layer RPL and the input sensing component ISP can be attached to each other through the second adhesive layer AL2. The third adhesive layer AL3 can be disposed between the window WIN and the anti-reflection layer RPL. The window WIN and the anti-reflection layer RPL can be attached to each other through the third adhesive layer AL3.

[0078] The functional element FE can be disposed below the optical component OPP. When viewed in a plan view, the aperture HO can be defined within the optical component OPP, which is superimposed on a portion of the cover layer CVL. The functional element FE can be disposed within the aperture HO. In an embodiment, the functional element FE may include a camera embedded in a display device. External light can be provided to the functional element FE through the window WIN. External light can be provided to the functional element FE through the optical component OPP.

[0079] The optical component OPP can display images. Additionally, the optical component OPP allows external light to pass through and provides that light to the functional element FE. (See reference...) Figures 6 to 8 Describe this construction in detail.

[0080] Figure 1The resolution measuring device RMA shown can measure the resolution of the optical component OPP. According to an embodiment, when the resolution measuring device RMA measures the resolution of the optical component OPP, the functional element FE is not disposed below the optical component OPP.

[0081] Figure 5 This illustrates an embodiment based on the inventive concept. Figure 4 The image shows a cross-sectional view of the display panel.

[0082] Reference Figure 5 The display panel DP may include a substrate SUB, a circuit element layer DP-CL disposed on the substrate SUB, a display element layer DP-OLED disposed on the circuit element layer DP-CL, and a thin film encapsulation layer TFE disposed on the display element layer DP-OLED.

[0083] The substrate SUB may include a display area DA and a non-display area NDA surrounding the display area DA. The substrate SUB may include, for example, a flexible plastic material. For instance, the substrate SUB may include polyimide (PI).

[0084] The display element layer DP-OLED can be disposed in the display area DA. The thin-film encapsulation layer TFE can be disposed on the circuit element layer DP-CL to cover the display element layer DP-OLED. Multiple pixels can be disposed in both the circuit element layer DP-CL and the display element layer DP-OLED. For example, each pixel can include a transistor disposed in the circuit element layer DP-CL and a light-emitting element disposed in the display element layer DP-OLED and connected to the transistor.

[0085] Figure 6 This illustrates an embodiment based on the inventive concept. Figure 3 A view of a portion of the optical components shown in the image.

[0086] Reference Figure 6 The optical component OPP may include multiple transmission regions TA and multiple pixels PX between the transmission regions TA. Pixels PX may have features similar to those set in the display region DA (see [link to display component]). Figure 3 The pixel PX in ) (see Figure 3 The structure is the same as that of the pixel PX. The pixel PX and the transmission region TA can be arranged in the first direction DR1 and the second direction DR2. However, the arrangement of the pixel PX and the transmission region TA is not limited to this. The pixel PX can display an image, and the transmission region TA can transmit external light.

[0087] Figure 7 This illustrates an embodiment of the inventive concept. Figure 3 The image shows a cross-sectional view of any pixel in the display area.

[0088] Reference Figure 7 The pixel PX can be disposed on the substrate SUB and includes a transistor TR and a light-emitting element OLED. The light-emitting element OLED may include a first electrode AE, a second electrode CE, a hole control layer HCL, an electron control layer ECL, and an emitter layer EML. The first electrode AE ​​can be an anode electrode, and the second electrode CE can be a cathode electrode.

[0089] Transistor TRs and light-emitting elements (OLEDs) can be mounted on a substrate SUB. Although Figure 7 A single transistor TR is shown, but embodiments of the inventive concept are not limited thereto. For example, according to an embodiment, a pixel PX may include multiple transistors and at least one capacitor, which can drive a light-emitting element OLED.

[0090] The display area DA may include a light-emitting area PA corresponding to a pixel PX and a non-light-emitting area NPA surrounding the light-emitting area PA. The light-emitting element OLED may be disposed in the light-emitting area PA.

[0091] The substrate SUB may include, for example, a flexible plastic substrate. For example, the substrate SUB may include transparent polyimide. A buffer layer BFL may be disposed on the substrate SUB. The buffer layer BFL may be, for example, an inorganic layer. A semiconductor pattern may be disposed on the buffer layer BFL. The semiconductor pattern may include, for example, polycrystalline silicon. However, embodiments of the inventive concept are not limited thereto. For example, according to an embodiment, the semiconductor pattern may include amorphous silicon or metal oxide.

[0092] Semiconductor patterns can be doped with N-type or P-type dopants. Semiconductor patterns can include heavily doped and lightly doped regions. The conductivity of the heavily doped regions can be greater than that of the lightly doped regions, and the heavily doped regions can essentially serve as the source and drain electrodes of the transistor TR. The lightly doped regions can essentially correspond to the active region (or channel) of the transistor TR.

[0093] The source region S, active region A, and drain region D of transistor TR can be formed from a semiconductor pattern. A first insulating layer INS1 can be disposed on the semiconductor pattern. The gate G of transistor TR can be disposed on the first insulating layer INS1. A second insulating layer INS2 can be disposed on the gate G. A third insulating layer INS3 can be disposed on the second insulating layer INS2.

[0094] The connecting electrode CNE can be disposed between the transistor TR and the light-emitting element OLED, thereby connecting the transistor TR and the light-emitting element OLED. The connecting electrode CNE may include a first connecting electrode CNE1 and a second connecting electrode CNE2.

[0095] The first connecting electrode CNE1 can be disposed on the third insulating layer INS3 and connected to the drain region D through a first contact hole CH1 extending through the first insulating layer INS1 to the third insulating layer INS3. The fourth insulating layer INS4 can be disposed on the first connecting electrode CNE1. The fifth insulating layer INS5 can be disposed on the fourth insulating layer INS4.

[0096] The second connecting electrode CNE2 can be disposed on the fifth insulating layer INS5. The second connecting electrode CNE2 can be connected to the first connecting electrode CNE1 through a second contact hole CH2 extending through the fourth insulating layer INS4 and the fifth insulating layer INS5. The sixth insulating layer INS6 can be disposed on the second connecting electrode CNE2. The first insulating layer INS1 to the sixth insulating layer INS6 can be, for example, inorganic layers or organic layers.

[0097] A first electrode AE ​​can be disposed on a sixth insulating layer INS6. The first electrode AE ​​can be connected to a second connecting electrode CNE2 via a third contact hole CH3 extending through the sixth insulating layer INS6. A pixel defining film PDL exposing a predetermined portion of the first electrode AE ​​can be disposed on the first electrode AE ​​and the sixth insulating layer INS6. An opening PX_OP exposing the predetermined portion of the first electrode AE ​​can be defined in the pixel defining film PDL.

[0098] The hole control layer HCL can be disposed on the first electrode AE ​​and the pixel defining film PDL. The hole control layer HCL can be commonly disposed in the light-emitting region PA and the non-light-emitting region NPA. The hole control layer HCL may include, for example, a hole transport layer and a hole injection layer.

[0099] The emitter layer (EML) can be disposed on the hole control layer (HCL). The emitter layer (EML) can be disposed in the region corresponding to the opening (PX_OP). The emitter layer (EML) can include, for example, organic or inorganic materials. The emitter layer (EML) can generate, for example, red, green, and blue light.

[0100] The electronic control layer (ECL) can be disposed on the emitter layer (EML) and the hole control layer (HCL). The ECL can be commonly disposed in the emitting region (PA) and the non-emitting region (NPA). The ECL may include, for example, an electron transport layer and an electron injection layer.

[0101] The second electrode CE can be disposed on the electronic control layer ECL. The second electrode CE can be disposed in common for multiple pixels PX. The layer from the buffer layer BFL to the light-emitting element OLED can be defined as the pixel layer.

[0102] A thin-film encapsulation layer (TFE) can be disposed on the light-emitting element (OLED). The TFE can be disposed on the second electrode (CE) and cover the pixel (PX). The TFE can include, for example, at least two inorganic layers and an organic layer between the inorganic layers. The inorganic layers can protect the pixel (PX) from, for example, moisture / oxygen. The organic layers can protect the pixel (PX) from foreign substances such as dust particles.

[0103] A first voltage can be applied to the first electrode AE ​​via transistor TR, and a second voltage with a lower level than the first voltage can be applied to the second electrode CE. Excitons can be formed by the combination of holes and electrons injected into the emitter layer EML, and the light-emitting element OLED emits light when the excitons transition to the ground state.

[0104] Figure 8 This illustrates an embodiment of the inventive concept. Figure 6 A view of the cross-section of any of the transmission regions of the optical components shown, and the pixels arranged together with the transmission regions between the pixels.

[0105] Reference Figure 8 The transmission region TA can be set between pixels PX. The structure of pixel PX can be consistent with... Figure 7 The construction of the pixel PX shown is essentially the same. Therefore, for ease of explanation, further description will be omitted.

[0106] In this embodiment, the light-emitting element OLED is not disposed in the transmission region TA. In this embodiment, the pixel defining film PDL is not disposed in the transmission region TA. The thin-film encapsulation layer TFE can be disposed on the sixth insulating layer INS6. Since the light-emitting element OLED is not disposed in the transmission region TA, the transmittance of the transmission region TA can be increased. Furthermore, external light OL can be provided to the functional element FE through the transmission region TA.

[0107] Reference Figure 4 , Figure 6 and Figure 8 External light OL is provided to the functional element FE via the optical component OPP, which can capture an external image. Therefore, the resolution of the optical component OPP can affect the sharpness of the image captured by the functional element FE. Resolution can be defined as the degree of sharpness achieved through the optical mechanism. In embodiments of the inventive concept, the resolution of the optical component OPP can be measured using a resolution measuring device RMA.

[0108] Figures 9 to 11 It is used to illustrate embodiments for use according to the inventive concept. Figure 1 The image shows a view of the device used to measure resolution, specifically for measuring the resolution of optical components.

[0109] Figures 9 to 11 The embodiments of the invention concept are shown. Figure 2 The corresponding cross-section. In Figures 9 to 11 The first support component SUP1, the second support component SUP2, and the third support component SUP3 are omitted in the text.

[0110] Reference Figure 9 The display module DM can be mounted on the STG platform. The display module DM can be mounted in the recess RES. When viewed in a plan view, the optical components OPP of the display module DM can be stacked with the opening OP.

[0111] although Figure 9 A single opening OP superimposed on an optical component OPP is shown, but embodiments of the inventive concept are not limited thereto. For example, according to an embodiment, multiple opening OPs superimposed on each of the optical components OPP may be defined in a stage STG.

[0112] As described above, the stage STG can move in the first direction DR1 and the second direction DR2. When viewed in a plan view, the stage STG can be set to move such that the opening OP is superimposed on the lens LN and the light source LTS.

[0113] When viewed in a planar view, the STG stage can be set to motion such that any optical component OPP is first superimposed on the lens LN. In the following text, first with... Figure 9 In the lens LN, the optical component OPP is defined as the first optical component OPP1, and the other optical component OPP is defined as the second optical component OPP2. For example, the first optical component OPP1 can be superimposed on the lens LN before the second optical component OPP2 is superimposed on the lens LN.

[0114] When viewed in a plan view, the central portion of the first optical component OPP1 can be superimposed on the central portion of the lens LN. For example, the stage STG can move in the first direction DR1 and the second direction DR2, such that the central portion of the first optical component OPP1 is superimposed on the central portion of the lens LN.

[0115] The opening H-OP is defined in the lower surface LS of the camera housing CHS, thus the lower surface LS of the camera housing CHS can be open toward the first optical component OPP1. The lens of the camera CAM, located in the lower part of the camera CAM, can be positioned toward the first optical component OPP1.

[0116] The stage STG can be set to move such that the first optical component OPP1 is superimposed on the lens LN, and thus the lower surface LS of the camera housing CHS can be positioned above the first optical component OPP1. Therefore, when viewed in a plan view, the first optical component OPP1 can be superimposed on the opening H-OP.

[0117] The viewing angle can be defined by the first optical component OPP1. The viewing angle can be defined as the angle of view of the scene captured by the first optical component OPP1. For example, the angle of view of the scene captured by the camera CAM can be defined as the viewing angle.

[0118] The camera housing CHS can have a shape corresponding to the viewing angle formed by the first optical component OPP1. The camera CAM can be arranged along the viewing angle defined by the first optical component OPP1.

[0119] Light generated in the light source LTS can be supplied to the camera CAM via the lens LN and the first optical component OPP1. The lens LN can be an imaging lens, and the image formed by the light supplied from the light source LTS can be supplied to the camera CAM via the lens LN. An image is formed on the camera CAM through the lens LN.

[0120] Figure 10 This is a view showing a slit formed in the upper surface of a light source according to an embodiment of the inventive concept.

[0121] Reference Figure 10 A cross-shaped slit SLT can be formed in the upper surface of the light source LTS. Light passes through the slit SLT, and as a result, it can be directed to the camera CAM (see...). Figure 9 It provides a slit-like image. Although Figure 10 The slit SLT in the embodiments has a cross shape, but the shape of the slit SLT according to the embodiments is not limited to this.

[0122] Refer again Figure 9 The resolution of the first optical component OPP1 can be measured via the camera CAM. For example, the camera CAM can be connected to the controller CON (also known as the controller circuit), and can send signals to the controller CON (see...). Figure 11 The controller CON (see [link to controller]) provides information captured by the camera CAM. Figure 11 The resolution of the first optical component OPP1 can be measured using information captured by the camera CAM.

[0123] Resolution can be measured by the value of the modulation transfer function (MTF). The higher the MTF value, the higher the resolution.

[0124] Reference Figure 11When viewed in a planar view, the stage STG can be moved and configured such that the second optical component OPP2 is superimposed on the lower surface LS of the lens LN and the camera housing CHS. The central portion of the second optical component OPP2 can be superimposed on the central portion of the lens LN. Light generated in the light source LTS can be provided to the camera CAM through the lens LN and the second optical component OPP2, thus the resolution of the second optical component OPP2 can be measured.

[0125] According to embodiments of the inventive concept, a resolution measurement operation can be performed on two optical components (OPPs). For example, a stage STG can move in a first direction DR1 and a second direction DR2, and the resolution of the optical components OPPs can be measured simultaneously while two or more OPPs are sequentially superimposed on a lens LN. For example, in response to movement of the stage STG in at least one of the first direction DR1 and the second direction DR2, the central portions of two or more optical components OPPs can be sequentially superimposed on the central portion of the lens LN.

[0126] According to an embodiment of the inventive concept, whenever the central portion of the optical component OPP is sequentially superimposed on the central portion of the lens LN and the optical component OPP and the lens LN are superimposed, light is provided to the camera CAM through the optical component OPP, and the resolution of the optical component OPP can be measured sequentially.

[0127] Therefore, according to embodiments of the inventive concept, the resolution of the optical component OPP of the display module DM can be effectively measured using a resolution measuring device RMA.

[0128] The resolution measuring device according to an embodiment of the inventive concept can measure the resolution of the optical components of a display module.

[0129] Although the inventive concept has been specifically shown and described with reference to embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope of the inventive concept as defined by the claims.

Claims

1. A resolution measuring device, the resolution measuring device comprising: A platform is configured to house a display module including optical components, wherein the platform includes an opening that overlaps with the optical components when viewed in a plan view when the display module is mounted on the platform. Multiple cameras are mounted above the platform and arranged along a field of view defined by the optical components; A light source is disposed below the platform, wherein, when viewed in a plan view, the light source overlaps with the opening; and A lens is disposed between the light source and the stage. When viewed in a plan view, the lens overlaps with the opening. When the display module is mounted on the platform, the optical component is superimposed on the lens when viewed in a plan view. Light from the light source is sequentially provided to the plurality of cameras through the lens and the optical component, thereby measuring the resolution of the optical component using information captured by the plurality of cameras.

2. The resolution measuring device according to claim 1, wherein, When viewed in a plan view, the central portion of the optical component overlaps with the central portion of the lens.

3. The resolution measuring device according to claim 2, wherein, The platform has a plane defined by a first direction and a second direction intersecting the first direction, and The stage moves in the first direction and the second direction, and the central portion of the optical component overlaps with the central portion of the lens in response to the movement of the stage in at least one of the first direction and the second direction.

4. The resolution measuring device according to claim 3, wherein, The optical component is one of a plurality of optical components, and The central portions of the plurality of optical components are sequentially superimposed on the central portions of the lens in response to movement of the stage in at least one of the first and second directions.

5. The resolution measuring device according to claim 1, wherein, The lenses of the plurality of cameras face the optical component.

6. The resolution measuring device according to claim 1, further comprising: A camera housing, having a fan-shaped design, is positioned above the platform and configured to accommodate the plurality of cameras. The upper surface of the camera housing is curved, and the plurality of cameras are arranged along the upper surface of the camera housing.

7. The resolution measuring device according to claim 6, wherein, The lower surface of the camera housing is open toward the optical components, and When viewed in a plan view, the lens overlaps with the lower surface of the camera housing.

8. The resolution measuring device according to claim 1, further comprising: The lens housing is configured to house the lens and the light source. The lens is fixed to the upper end of the lens housing, and the light source is disposed below the lens within the lens housing.

9. The resolution measuring device according to claim 1, wherein, The platform includes a recess defined in the upper surface of the platform, the opening being disposed in the recess when viewed in a plan view, and the recess being configured to accommodate the display module.

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