Substrate cleaning method and substrate cleaning apparatus

Abstract

This invention relates to a substrate cleaning method and a substrate cleaning apparatus for cleaning substrates such as wafers. In the substrate cleaning method, a substrate (W) is held at its periphery by a plurality of holding rollers (6). By rotating the plurality of holding rollers (6) around their respective axes, the substrate (W) is rotated around its axes. While a dual-fluid jet nozzle (2) is moved in the radial direction of the substrate (W), a dual-fluid jet consisting of a mixture of a first liquid and a gas is introduced from the dual-fluid jet nozzle (2) onto the surface of the substrate (W). As the dual-fluid jet is introduced onto the surface of the substrate (W), a fan-shaped jet consisting of a second liquid is introduced from a spray nozzle (3) onto the surface of the substrate (W), forming a flow of the second liquid on the surface of the substrate (W). The fan-shaped jet exits from the dual-fluid jet.

Description

Technical Field

[0001] This invention relates to a substrate cleaning method and a substrate cleaning apparatus for cleaning substrates such as wafers. Background Technology

[0002] In recent years, components such as memory circuits, logic circuits, and image sensors (e.g., CMOS sensors) have become increasingly integrated. During the fabrication of these components, foreign matter such as microparticles and dust can adhere to them. This foreign matter can cause short circuits or circuit failures between wirings. Therefore, to improve component reliability, it is necessary to clean the wafers on which components are formed to remove foreign matter. Such foreign matter, including microparticles and dust, can also adhere to the back side of the wafer (the non-component side). When this foreign matter adheres to the back side of the wafer, it can cause the wafer to deviate from the stage reference plane of the exposure apparatus, or cause the wafer surface to tilt relative to the stage reference plane, resulting in pattern formation deviations and focal distance deviations.

[0003] Therefore, one method involves introducing a two-fluid jet consisting of a liquid and gas mixture onto the wafer surface (front or back side) to clean the wafer surface. During this two-fluid jet cleaning, the wafer's periphery is held by grippers, and the chuck rotates around the wafer's axis along with the wafer, spraying the two-fluid jet onto the wafer surface from nozzles. Furthermore, by oscillating (scanning) the nozzles along the wafer's radial direction, the two-fluid jet can be directed to the entire surface of the rotating wafer.

[0004] However, when the nozzle is positioned above the periphery of the wafer, the two-fluid jet impacts the chuck's jaws, causing significant liquid splashing. Therefore, to prevent this splashing, a cleaning apparatus has been proposed that replaces the chuck, using multiple rollers to hold the wafer's periphery and rotating the wafer by rotating these rollers. With this type of cleaning apparatus, because the rollers themselves are fixed in position, the two-fluid jet will not impact the rollers even when the nozzle is positioned above the wafer's periphery.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: Japanese Patent Application Publication No. 2017-147334

[0008] The problem the invention aims to solve

[0009] However, compared to chuck-type cleaning devices, roller-type cleaning devices cannot rotate wafers at high speeds (typically, a maximum of 150 min). -1Therefore, in order to clean the entire surface of the wafer, it is necessary to slow down the movement speed of the nozzle. As a result, the time for one round trip (one scan) of the nozzle becomes longer, and the parts of the wafer that are not in contact with the liquid become semi-dry. In addition, because the wafer rotates at a low speed, there is no strong centrifugal force acting on the liquid on the wafer, and microparticles that are floated by the two-fluid jet will remain on the wafer. Summary of the Invention

[0010] Therefore, the present invention provides a substrate cleaning method and a substrate cleaning apparatus that prevents the substrate, such as a wafer, from being semi-dry and reliably removes microparticles that are floated by a dual-fluid jet from the surface of the substrate.

[0011] (Solutions)

[0012] One method provides a substrate cleaning method in which a plurality of holding rollers hold the periphery of a substrate, and the substrate is rotated about its own axis by rotating the plurality of holding rollers. While moving a dual-fluid jet nozzle in the radial direction of the substrate, a dual-fluid jet consisting of a mixture of a first liquid and a gas is introduced from the dual-fluid jet nozzle to the surface of the substrate. While the dual-fluid jet is introduced to the surface of the substrate, a fan-shaped jet consisting of a second liquid is introduced from the spray nozzle to the surface of the substrate, forming a liquid flow of the second liquid on the surface of the substrate. The fan-shaped jet exits from the dual-fluid jet.

[0013] One approach is that the angle between the spray nozzle and the surface of the substrate is in the range of 15° to 45°.

[0014] One approach is that the width of the fan-shaped jet is more than three-quarters of the radius of the substrate.

[0015] One approach is to direct the fan-shaped jet toward the outer side of the substrate.

[0016] One approach is to position the spray nozzle above the substrate.

[0017] One approach is to move the spray nozzle while introducing the fan-shaped jet from the spray nozzle onto the surface of the substrate, thereby forming a flow of the second liquid on the surface of the substrate.

[0018] One approach is to fix the dual-fluid jet nozzle and the spray nozzle to a common arm.

[0019] One method provides a substrate cleaning apparatus comprising: a plurality of holding rollers having a plurality of substrate holding surfaces for holding peripheral portions of a substrate and rotatable about their own axis; a dual-fluid jet nozzle configured to form a dual-fluid jet consisting of a mixture of a first liquid and a gas; a fan-shaped spray nozzle configured to form a fan-shaped jet consisting of a second liquid; and a nozzle moving device configured to move the dual-fluid jet nozzle and the fan-shaped spray nozzle toward a region surrounded by the plurality of substrate holding surfaces, wherein the fan-shaped spray nozzle is directed toward a direction in which the fan-shaped jet will not impinge on the dual-fluid jet.

[0020] One approach is that the angle between the fan spray nozzle and the plane through which the plurality of substrates are held is in the range of 15° to 45°.

[0021] One method is to configure the fan-shaped spray nozzle to form a fan-shaped jet with a width of more than three-quarters of the radius of the substrate.

[0022] One embodiment is that the nozzle moving device has an arm that holds the dual-fluid jet nozzle and the fan spray nozzle.

[0023] (The effect of the invention)

[0024] When the present invention is used, the fan-shaped jet forms a uniform flow of a second liquid over a wide area of ​​the substrate surface. This flow of the second liquid can wash away the microparticles that are floated by the dual-fluid jet and can prevent the substrate from becoming semi-dry. Attached Figure Description

[0025] Figure 1 This is a perspective view showing one embodiment of a substrate cleaning apparatus.

[0026] Figure 2 yes Figure 1 A top view of the substrate cleaning apparatus shown.

[0027] Figure 3 This is an enlarged side view of the retaining roller.

[0028] Figure 4A This diagram shows a state where the wafer is placed on a holding roller, but is not held by the holding roller.

[0029] Figure 4B This is a diagram showing the state in which the periphery of the wafer is held by the substrate holding surface of the holding roller.

[0030] Figure 5 This is a side view of the fan spray nozzles as seen from a direction parallel to the top of the wafer.

[0031] Figure 6 This is a flowchart illustrating one implementation of the wafer cleaning process.

[0032] Figure 7 This is a side view showing another embodiment of the substrate cleaning apparatus.

[0033] Figure 8 Viewed from the axial direction of the arm Figure 7 The diagram shows a dual-fluid jet nozzle and a fan-shaped spray nozzle.

[0034] Figure 9 yes Figure 7 A top view of the substrate cleaning apparatus shown.

[0035] Figure 10 This is a flowchart illustrating one implementation of the wafer cleaning process. Detailed Implementation

[0036] Hereinafter, embodiments of the present invention will be described with reference to the figures.

[0037] Figure 1 This is a perspective view showing one embodiment of a substrate cleaning apparatus. Figure 2 yes Figure 1 The diagram shows a top view of the substrate cleaning apparatus. The substrate cleaning apparatus of this embodiment is an apparatus for cleaning the surface (top) of a wafer W, an example of a substrate. The substrate cleaning apparatus will be described in detail below.

[0038] The substrate cleaning apparatus includes: a wafer holding part (substrate holding part) 1 that holds a wafer W and rotates it in the direction indicated by arrow A about the axis of the wafer W; a dual-fluid jet nozzle 2 that guides a dual-fluid jet into the surface (top) of the wafer W held in the wafer holding part 1; and a fan-shaped jet nozzle 3 that guides a fan-shaped jet into the surface (top) of the wafer W held in the wafer holding part 1.

[0039] The wafer holding section (substrate holding section) 1 includes: a plurality of holding rollers 6 holding the periphery of the wafer W; and a roller motor 8 for rotating these holding rollers 6. These holding rollers 6 are arranged around a predetermined reference axis O. This embodiment provides four holding rollers 6. When holding the wafer W, the holding rollers 6 are located at the same distance from the reference axis O. Therefore, the center of the wafer W held by the holding rollers 6 coincides with the reference axis O. In one embodiment, only three holding rollers 6 may be provided, or five or more holding rollers 6 may be provided. The cleaned wafer W is placed on the holding rollers 6 by a conveying device (not shown), and rotated by the holding rollers 6. Figure 2 Rotate in the direction indicated by arrow A.

[0040] Figure 3This is an enlarged side view of the holding roller 6. The holding roller 6 has a cylindrical substrate holding surface (wafer holding surface) 6a and a tapered portion 6b that slopes downward toward the radially outward side. The tapered portion 6b is connected to the lower end of the substrate holding surface 6a and expands outward toward the radially outward side from the substrate holding surface 6a. The tapered portion 6b is circular and concentric with the substrate holding surface 6a. The center of the tapered portion 6b and the center of the substrate holding surface 6a are on the axis CP of the holding roller 6. The holding roller 6 is configured to rotate around its axis CP.

[0041] Figure 4A This diagram illustrates a state where the wafer W is placed on the holding roller 6, but is not held by the holding roller 6. (Example) Figure 4A As shown, the periphery of the wafer W is placed on the tapered portion 6b of the holding roller 6 by a conveying device (not shown). Then, as... Figure 4B As shown, when the entire holding roller 6 moves in the direction indicated by the arrow, the substrate holding surface 6a of the holding roller 6 contacts the periphery of the wafer W, thereby holding the periphery of the wafer W by the substrate holding surface 6a. With the periphery of the wafer W in contact with the substrate holding surface 6a, when the holding roller 6 rotates around its axis CP, the wafer W also rotates. The holding roller 6 rotates around its axis CP, but the position of the holding roller 6 itself is fixed.

[0042] return Figure 1 Two of the four retaining rollers 6 are connected to each other via a torque transmission mechanism 10, and the other two retaining rollers 6 are also connected to each other via another torque transmission mechanism 10. The torque transmission mechanism 10 is, for example, a combination of pulleys and belts. This embodiment includes two roller motors 8. One of the two roller motors 8 is connected to the two retaining rollers 6 connected to each other via the torque transmission mechanism 10, and the other roller motor 8 is connected to the other two retaining rollers 6 connected to each other via another torque transmission mechanism 10.

[0043] In one embodiment, a single roller motor may be connected to all the retaining rollers 6 via a torque transmission mechanism. In this embodiment, all the retaining rollers 6 are connected to the roller motor 8; however, some of the multiple retaining rollers 6 may also be connected to the roller motor 8. Preferably, at least two of the multiple retaining rollers 6 are connected to the roller motor 8.

[0044] In this embodiment, two of the four holding rollers 6 can move in the approach and departure directions from the other two holding rollers 6 via a moving mechanism (not shown). After the wafer W is placed on the tapered portion 6b of the four holding rollers 6 by a conveying device (not shown), it moves towards the other two holding rollers 6 via two holding rollers 6, and the substrate holding surface 6a of the four holding rollers 6 holds the peripheral portion of the wafer W.

[0045] After cleaning the wafer W, it is moved away from the other two holding rollers 6 by two holding rollers 6. The substrate holding surface 6a of the four holding rollers 6 releases the peripheral portion of the wafer W, and the peripheral portion of the wafer W is placed on the tapered portion 6b of the four holding rollers 6. The wafer W is removed from the holding rollers 6 by a conveying device (not shown). In one embodiment, all the holding rollers 6 can be moved by a moving mechanism (not shown).

[0046] The dual-fluid jet nozzle 2 and the fan-shaped spray nozzle 3 are configured to respectively form a dual-fluid jet and a fan-shaped jet for cleaning the surface (upper surface) of the wafer W held by the holding roller 6. Figure 1 As shown, the dual-fluid jet nozzle 2 and the fan-shaped spray nozzle 3 are arranged toward the area surrounded by the substrate holding surface 6a of the holding roller 6. The area surrounded by the substrate holding surface 6a is the area where the wafer W is held by the holding roller 6. Therefore, the dual-fluid jet nozzle 2 and the fan-shaped spray nozzle 3 are arranged toward the surface (upper surface) of the wafer W held by the substrate holding surface 6a of the holding roller 6.

[0047] The substrate cleaning apparatus further includes a nozzle moving device 15 for parallel movement of the dual-fluid jet nozzle 2. The nozzle moving device 15 includes: an arm 17 holding the dual-fluid jet nozzle 2; a support shaft 18 supporting the arm 17; and a rotary motor 20 connected to the support shaft 18. The dual-fluid jet nozzle 2, the fan-spray nozzle 3, and the arm 17 are positioned higher than the holding roller 6. The dual-fluid jet nozzle 2 and the fan-spray nozzle 3 are located above the wafer W held by the holding roller 6.

[0048] A dual-fluid jet nozzle 2 is fixed to the top end of the arm 17, and a support shaft 18 is fixed to the other end of the arm 17. The dual-fluid jet nozzle 2 extends vertically downward from the top end of the arm 17. A rotary motor 20 is configured to rotate the support shaft 18 clockwise and counterclockwise by a predetermined angle. When the rotary motor 20 rotates the support shaft 18, the arm 17 and the dual-fluid jet nozzle 2 rotate clockwise and counterclockwise by a predetermined angle about the rotation axis P of the support shaft 18.

[0049] like Figure 2 As shown, with the rotational movement of the arm 17, the dual-fluid jet nozzle 2 moves along an arc-shaped track around the center of the wafer W (aligned with the reference axis O) held by the holding roller 6. More specifically, during wafer cleaning, the dual-fluid jet nozzle 2 oscillates (reciprocates) between the center of the wafer W and its periphery. The direction of movement of the dual-fluid jet nozzle 2 is essentially the radial direction of the wafer W.

[0050] The dual-fluid jet nozzle 2 is perpendicular to the surface (upper surface) of the wafer W when held on the holding roller 6. In this embodiment, the axis of the holding roller 6 and the dual-fluid jet nozzle 2 extend in the vertical direction, and the wafer W is held horizontally by the holding roller 6. In another embodiment, the axis of the holding roller 6 may be tilted relative to the vertical direction, and the wafer W may be held by the holding roller 6 in the tilted state.

[0051] The dual-fluid jet nozzle 2 is connected to: a gas supply line 24 for supplying air or an inactive gas (e.g., nitrogen); and a liquid supply line 25 for supplying a first liquid such as pure water or carbonated water. The gas supply line 24 is connected to a gas supply source (not shown), and the liquid supply line 25 is connected to a liquid supply source (not shown). The dual-fluid jet nozzle 2 is configured to form a dual-fluid jet consisting of a mixture of the first liquid and gas. The dual-fluid jet is ejected vertically from the dual-fluid jet nozzle 2 onto the surface (upper surface) of the wafer W.

[0052] like Figure 2 As shown, with the oscillation of the dual-fluid jet nozzle 2, the dual-fluid jet is introduced into a first region R1 on the surface of the wafer W. This first region R1 is an elongated region extending radially in the wafer W and encompassing the center of the wafer W. The dual-fluid jet impacts the wafer W surface perpendicularly, removing microparticles from the wafer W surface. During the cleaning of the wafer W, the retaining rollers 6 are positioned at their respective axes CP (refer to...). Figure 3 The system rotates around the center, but the position of the retaining roller 6 itself remains fixed. Therefore, the two-fluid jet will not impact the retaining roller 6, and the liquid constituting the two-fluid jet will not splash.

[0053] The fan-shaped spray nozzle 3 is fixed to a retaining member such as a bracket (not shown). Therefore, unlike the dual-fluid jet nozzle 2, the position of the fan-shaped spray nozzle 3 in the cleaning wafer W is fixed. The fan-shaped spray nozzle 3 is connected to a liquid supply line 27 that supplies a second liquid, such as pure water, an alkaline liquid, or a liquid containing surfactants. The fan-shaped spray nozzle 3 is configured to form a fan-shaped jet composed of the second liquid transported through the liquid supply line 27.

[0054] The fan-shaped spray nozzle 3 is located outside the track of the dual-fluid jet nozzle 2, and is configured such that the dual-fluid jet nozzle 2, which moves together with the arm 17, will not collide with the fan-shaped spray nozzle 3. The fan-shaped jet is ejected at the same time as or after the dual-fluid jet is ejected. Furthermore, the fan-shaped jet is ejected at the same time as or after the dual-fluid jet stops ejecting.

[0055] The fan-shaped spray nozzle 3 is positioned diagonally downwards. For example... Figure 2As shown, the fan-shaped jet is a broad jet that expands laterally and has a substantially constant velocity distribution from one end to the other. In this embodiment, the width direction of the fan-shaped jet is along the radial direction of the wafer W. The outer end of the fan-shaped jet is located outside the wafer W. The width of the fan-shaped jet is more than three-quarters of the radius of the wafer W. In one embodiment, the width of the fan-shaped jet is larger than the radius of the wafer W.

[0056] A fan-shaped jet is obliquely incident on the surface of wafer W, forming a flow of a second liquid on the surface (upper surface) of wafer W. This flow of the second liquid forms in a second region R2, including the periphery of wafer W. The second region R2 is separate from the first region R1. The advantage of the fan-shaped spray nozzle 3 is that, compared to a conical spray nozzle that sprays a conical liquid jet, the second liquid can contact an area wider than wafer W, and a flow of the second liquid with a uniform flow rate can be formed on wafer W.

[0057] like Figure 2 As shown, the fan-shaped spray nozzle 3 is configured to face the direction of rotation of the wafer W as indicated by arrow A when viewed from above, forming a fan-shaped jet stream towards the outside of the wafer W. The fan-shaped spray nozzle 3 is positioned so that the fan-shaped jet stream does not impede the dual-fluid jet stream. That is, the fan-shaped jet stream ejected from the fan-shaped spray nozzle 3 is formed at the position where the dual-fluid jet stream ejected from the dual-fluid jet nozzle 2 departs. Because the fan-shaped spray nozzle 3 is positioned in this way, the dual-fluid jet stream is not obstructed by the fan-shaped jet stream and can impact the surface of the wafer W, thereby removing microparticles from the surface of the wafer W.

[0058] In particular, when this embodiment is adopted, the direction in which the fan-shaped jet ejected from the fan-shaped jet nozzle 3 and the liquid flow of the second liquid formed on the surface (upper surface) of the wafer W do not collide with the direction of the dual-fluid jet ejected from the dual-fluid jet nozzle 2. The dual-fluid jet is not obstructed by the fan-shaped jet and the liquid flow of the second liquid on the wafer W, and can collide with the surface of the wafer W to remove microparticles from the surface of the wafer W.

[0059] Figure 5 This is a side view of the fan-shaped spray nozzle 3 as viewed from a direction parallel to the upper surface of the wafer W. The fan-shaped spray nozzle 3 is inclined relative to the surface (upper surface) of the wafer W. When the angle of the fan-shaped spray nozzle 3 is too large, the effect of clogging microparticles dominates, rather than flushing microparticles, and microparticles cannot be effectively discharged from the wafer W. From this point of view, the angle α of the fan-shaped spray nozzle 3 relative to the surface (upper surface) of the wafer W in one embodiment is in the range of 15° to 45°. The angle α of the fan-shaped spray nozzle 3 in one embodiment is 30°. The wafer W is held by the substrate holding surface 6a of the four holding rollers 6 ( Figure 5Only the two holding rollers 6 are shown, and the surface (top) of the wafer W is parallel to the plane (hypothetical plane) S passing through these substrate holding surfaces 6a. Therefore, the angle α of the fan spray nozzle 3 relative to the plane (hypothetical plane) S passing through the substrate holding surface 6a is in the range of 15° to 45°.

[0060] The fan-shaped jet ejected from the inclined fan-shaped spray nozzle 3 also incident on the surface (upper surface) of the wafer W at substantially the same angle as the fan-shaped spray nozzle 3. The fan-shaped jet forms a flow of a second liquid in a broad second region R2 on the surface of the wafer W. This flow of the second liquid advances toward the outside of the wafer W, washing away microparticles floated by the dual-fluid jet and preventing the wafer W from becoming semi-dry.

[0061] like Figure 2 As shown, the substrate cleaning apparatus further includes a rinsing nozzle 30 for supplying rinsing fluid to the surface (upper surface) of the wafer W held by the holding roller 6. The rinsing nozzle 30 is positioned toward the center of the wafer W's surface, i.e., toward the reference axis O. The rinsing nozzle 30 is connected to a rinsing fluid supply line 31 that supplies rinsing fluid such as pure water. After the wafer W is cleaned by a two-fluid jet and by a fan-shaped jet, rinsing fluid is supplied from the rinsing nozzle 30 to the rotating wafer W to rinse the entire surface of the wafer W.

[0062] Secondly, refer to Figure 6 The flowchart shown illustrates one implementation of the cleaning process for wafer W.

[0063] In step 1, the periphery of the wafer W is held by multiple holding rollers 6. For example... Figure 4B As shown, the periphery of the wafer W is held by the substrate holding surface 6a of each holding roller 6.

[0064] In step 2, make Figure 1 The roller motor 8 shown operates, causing the holding rollers 6 to rotate around their respective axes CP. The wafer W rotates around its axis via the rotating holding rollers 6.

[0065] In step 3, the dual-fluid jet nozzle 2 is moved in the radial direction of the wafer W, and a dual-fluid jet consisting of a mixture of a first liquid and a gas is introduced from the dual-fluid jet nozzle 2 into a first region R1 on the surface (upper surface) of the wafer W. The dual-fluid jet nozzle 2 moves back and forth between the center of the rotating wafer W and the periphery of the wafer W a predetermined number of times.

[0066] In step 4, when the dual-fluid jet is introduced into the first region R1, a fan-shaped jet composed of the second liquid is introduced from the fan-shaped spray nozzle 3 into the surface of the wafer W, and a flow of the second liquid is formed on the second region R2 of the wafer W surface. The ejection of the fan-shaped jet begins at the same time as or after the start of the dual-fluid jet ejection. Therefore, steps 3 and 4 are performed substantially simultaneously.

[0067] In step 5, the ejection of the two-fluid jet is stopped, and the ejection of the fan-shaped jet is stopped at the same time or afterward.

[0068] In step 6, while maintaining the rotation of the wafer W, rinsing fluid is supplied from the rinsing nozzle 30 to the surface (upper surface) of the wafer W, thereby rinsing the surface of the wafer W.

[0069] In step 7, the roller motor 8 is stopped, thereby stopping the rotation of the wafer W.

[0070] Secondly, refer to Figures 7 to 9 Other embodiments of the substrate cleaning apparatus will be described. Unless otherwise specified, the configuration and operation of this embodiment are the same as those described above, and therefore, repeated descriptions are omitted. Figure 7 This is a side view illustrating another embodiment of the substrate cleaning apparatus. Figure 8 Viewed from the axial direction of arm 17 Figure 7 The diagram shows the dual-fluid jet nozzle 2 and the fan-shaped spray nozzle 3. Figure 9 yes Figure 7 A top view of the substrate cleaning apparatus shown. Figures 7 to 9 Some component illustrations have been omitted. Unless otherwise specified, the structure of this embodiment is the same as that of the embodiment described above.

[0071] The nozzle moving device 15 of this embodiment is configured to move the dual-fluid jet nozzle 2 and the fan spray nozzle 3 in parallel as a whole. Both the dual-fluid jet nozzle 2 and the fan spray nozzle 3 are held in the arm 17. The fan spray nozzle 3 is mounted on a bracket 35 fixed to the arm 17. In one embodiment, the fan spray nozzle 3 may also be directly fixed to the arm 17. Therefore, since the fan spray nozzle 3 is connected to the arm 17, the dual-fluid jet nozzle 2 and the fan spray nozzle 3 move together as the arm 17 rotates. The fan spray nozzle 3 is located between the dual-fluid jet nozzle 2 and the support shaft 18. Therefore, the fan spray nozzle 3 moves on a different track than the dual-fluid jet nozzle 2.

[0072] As the arm 17 rotates, the dual-fluid jet nozzle 2 and the fan-shaped spray nozzle 3 guide the dual-fluid jet and fan-shaped jet into the surface (upper surface) of the wafer W. Viewed from above, the fan-shaped spray nozzle 3 faces a direction perpendicular to the extending direction of the arm 17. Therefore, viewed from above, the fan-shaped spray nozzle 3 ejects a fan-shaped jet in its moving direction. The fan-shaped spray nozzle 3 is separated from the dual-fluid jet nozzle 2 at a distance from which the fan-shaped jet will not collide with the dual-fluid jet. That is, the fan-shaped spray nozzle 3 ejects a fan-shaped jet in a direction away from the dual-fluid jet nozzle 2 and the dual-fluid jet, and the fan-shaped jet will not collide with the dual-fluid jet. The tilt angle of the fan-shaped spray nozzle 3 is relative to a reference... Figure 5 The perspectives being described are the same.

[0073] In this embodiment, the fan-shaped spray nozzle 3 is movable and directs a fan-shaped jet of the second liquid onto the surface (upper surface) of the wafer W. Therefore, a flow of the second liquid can be formed over a wide area encompassing the surface (upper surface) of the wafer W. This flow of the second liquid can wash away microparticles suspended by the two-fluid jet and prevent the wafer W from becoming semi-dry.

[0074] Secondly, refer to Figure 10 The flowchart shown illustrates one implementation of the cleaning process for wafer W.

[0075] In step 1, the periphery of the wafer W is held by multiple holding rollers 6. For example... Figure 4B As shown, the periphery of the wafer W is held by the substrate holding surface 6a of each holding roller 6.

[0076] In step 2, make Figure 1 The roller motor 8 shown operates, causing the holding rollers 6 to rotate around their respective axes CP. The wafer W rotates around its axis via the rotating holding rollers 6.

[0077] In step 3, by rotating arm 17 around support shaft 18, the dual-fluid jet nozzle 2 and fan-shaped spray nozzle 3 are moved together. A dual-fluid jet consisting of a mixture of a first liquid and a gas is introduced from the dual-fluid jet nozzle 2 onto the surface (upper surface) of wafer W, and a fan-shaped jet consisting of a second liquid is introduced from the fan-shaped spray nozzle 3 onto the surface (upper surface) of wafer W. The movement direction of the dual-fluid jet nozzle 2 is radial to the wafer W. The fan-shaped jet is ejected either simultaneously with or after the initial ejection of the dual-fluid jet. The dual-fluid jet nozzle 2 moves back and forth between the center and periphery of the rotating wafer W a predetermined number of times.

[0078] In step 4, the ejection of the two-fluid jet is stopped, and the ejection of the fan-shaped jet is stopped at the same time or afterward.

[0079] In step 5, while maintaining the rotation of the wafer W, rinsing fluid is supplied from the rinsing nozzle 30 to the surface (upper surface) of the wafer W, thereby rinsing the surface of the wafer W.

[0080] In step 6, the roller motor 8 is stopped, thereby stopping the rotation of the wafer W.

[0081] The above embodiments are described with the aim of enabling those skilled in the art to implement the present invention. Those skilled in the art can naturally make various modifications to the above embodiments, and the technical concept of the present invention can also be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments and should be interpreted in the broadest sense according to the technical concept defined by the claims.

[0082] (Industry availability)

[0083] The present invention provides a substrate cleaning method and a substrate cleaning apparatus applicable to cleaning substrates such as wafers.

[0084] Symbol Explanation

[0085] 1: Wafer Holding Section (Substrate Holding Section)

[0086] 2: Dual-fluid jet nozzle

[0087] 3: Fan spray nozzle

[0088] 6: Holding roller

[0089] 6a: Substrate holding surface (wafer holding surface)

[0090] 6b: Conical part

[0091] 8: Roller motor

[0092] 10: Torque transmission mechanism

[0093] 15: Nozzle moving device

[0094] 17: Arms

[0095] 18: Support shaft

[0096] 20: Rotary motor

[0097] 24: Gas supply pipeline

[0098] 25: Liquid supply lines

[0099] 27: Liquid supply lines

[0100] 30: Flushing nozzle

[0101] 31: Fluid supply line

[0102] 35: Bracket

Claims

1. A substrate cleaning method, characterized in that, The periphery of the substrate is held by multiple retaining rollers. By rotating the plurality of retaining rollers around their respective axes, the substrate is thus rotated around its own axis. While moving the dual-fluid jet nozzle in the radial direction of the substrate, a dual-fluid jet consisting of a mixture of a first liquid and a gas is introduced from the dual-fluid jet nozzle into a first region within the surface of the substrate. When the dual-fluid jet is introduced into the surface of the substrate, a fan-shaped jet of the second liquid is introduced from the spray nozzle into a second region within the surface of the substrate, forming a flow of the second liquid on the surface of the substrate. The second region is separated from the first region. The spray nozzle is located above the substrate and forms a flow of the second liquid in the second region toward the outside of the substrate. The flow of the second liquid toward the outside of the substrate washes away the microparticles that floated off the substrate by the dual-fluid jet.

2. The substrate cleaning method as described in claim 1, characterized in that, The angle between the spray nozzle and the surface of the substrate is in the range of 15° to 45°.

3. The substrate cleaning method as described in claim 1, characterized in that, The width of the fan-shaped jet is more than three-quarters of the radius of the substrate.

4. The substrate cleaning method as described in claim 1, characterized in that, The fan-shaped jet is directed toward the outside of the substrate.

5. The substrate cleaning method as described in claim 1, characterized in that, The spray nozzle is located above the substrate.

6. The substrate cleaning method as described in claim 1, characterized in that, While moving the spray nozzle, the fan-shaped jet is introduced from the spray nozzle into the surface of the substrate, thereby forming a flow of the second liquid on the surface of the substrate.

7. The substrate cleaning method as described in claim 6, characterized in that, The dual-fluid jet nozzle and the spray nozzle are fixed to a common arm.

8. A substrate cleaning apparatus, characterized in that, have: Multiple holding rollers, each holding roller having multiple substrate holding surfaces for holding the periphery of a substrate, and capable of rotating about its own axis; A dual-fluid jet nozzle configured to form a dual-fluid jet consisting of a mixture of a first liquid and a gas; A fan-shaped spray nozzle configured to form a fan-shaped jet of a second liquid; and A nozzle moving device configured to move the dual-fluid jet nozzle in parallel. The dual-fluid jet nozzle and the fan-shaped spray nozzle are directed toward the area surrounded by the plurality of substrate holding surfaces, and the fan-shaped spray nozzle is directed toward the direction in which the fan-shaped jet will not collide with the dual-fluid jet.

9. The substrate cleaning apparatus as described in claim 8, characterized in that, The angle between the fan spray nozzle and the plane through the plurality of substrate holding surfaces is in the range of 15° to 45°.

10. The substrate cleaning apparatus as described in claim 8, characterized in that, The fan-shaped spray nozzle is configured to form a fan-shaped jet with a width of more than three-quarters of the radius of the substrate.

11. The substrate cleaning apparatus as claimed in claim 8, characterized in that, The nozzle moving device includes an arm that holds the dual-fluid jet nozzle and the fan spray nozzle.

12. A substrate cleaning method, characterized in that, The substrate is rotated about its axis. While moving the dual-fluid jet nozzle in the radial direction of the substrate, a dual-fluid jet consisting of a mixture of a first liquid and a gas is introduced from the dual-fluid jet nozzle into a first region within the surface of the substrate. When the dual-fluid jet is introduced into the surface of the substrate, a fan-shaped jet of the second liquid is introduced from the spray nozzle into a second region within the surface of the substrate, forming a flow of the second liquid on the surface of the substrate. The second region is separated from the first region. The spray nozzle is located above the substrate and forms a flow of the second liquid in the second region toward the outside of the substrate. The flow of the second liquid toward the outside of the substrate washes away the microparticles that floated off the substrate by the dual-fluid jet.

13. A substrate cleaning apparatus, characterized in that, have: A substrate holding portion holds a substrate and has multiple substrate holding surfaces for holding the peripheral portion of the substrate, and rotates the substrate about the axis of the substrate. A dual-fluid jet nozzle configured to form a dual-fluid jet consisting of a mixture of a first liquid and a gas; A fan-shaped spray nozzle configured to form a fan-shaped jet of a second liquid; and A nozzle moving device configured to move the dual-fluid jet nozzle in parallel. The dual-fluid jet nozzle and the fan-shaped spray nozzle are directed toward the area surrounded by the plurality of substrate holding surfaces, and the fan-shaped spray nozzle is directed toward the direction in which the fan-shaped jet will not collide with the dual-fluid jet.

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